TW200716994A - Circuit board inspecting apparatus and circuit board inspecting method - Google Patents

Circuit board inspecting apparatus and circuit board inspecting method

Info

Publication number
TW200716994A
TW200716994A TW095132463A TW95132463A TW200716994A TW 200716994 A TW200716994 A TW 200716994A TW 095132463 A TW095132463 A TW 095132463A TW 95132463 A TW95132463 A TW 95132463A TW 200716994 A TW200716994 A TW 200716994A
Authority
TW
Taiwan
Prior art keywords
circuit board
auxiliary
inspecting
connector
unit
Prior art date
Application number
TW095132463A
Other languages
Chinese (zh)
Inventor
Kiyoshi Kimura
Sugiro Shimoda
Satoshi Suzuki
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200716994A publication Critical patent/TW200716994A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G01R1/07335—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards for double-sided contacting or for testing boards with surface-mounted devices (SMD's)
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

Provided is a circuit board inspecting apparatus, which can perform high reliability electrical inspection even when a circuit board to be inspected has fine pitch electrodes, and smoothly perform inspecting operation even for continuous circuit board inspection. The circuit board inspecting apparatus is provided with an auxiliary connecting circuit unit. The auxiliary connecting circuit unit is provided with a first auxiliary relay pin unit, which has a plurality of conducting pins arranged at a prescribed pitch and a pair of separated insulating plates for supporting the conducting pins between a connector board of a first inspecting jig and a connector board of a second inspecting jig and is arranged on the connector substrate side of the first inspecting jig; a second auxiliary relay pin unit having a plurality of conducting pins arranged at a prescribed pitch and a pair of separated insulating plates for supporting the conducting pins; and an auxiliary anisotropic conducting sheet for electrically connecting the first auxiliary relay pin unit with the second auxiliary relay pin unit. When the electrodes of one tester side connector lack in number, the circuit board inspecting apparatus is permitted to go around through the auxiliary connecting circuit unit and electrically connected with the electrodes of the other tester side connector.
TW095132463A 2005-09-02 2006-09-01 Circuit board inspecting apparatus and circuit board inspecting method TW200716994A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005254967 2005-09-02

Publications (1)

Publication Number Publication Date
TW200716994A true TW200716994A (en) 2007-05-01

Family

ID=37808961

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132463A TW200716994A (en) 2005-09-02 2006-09-01 Circuit board inspecting apparatus and circuit board inspecting method

Country Status (3)

Country Link
JP (1) JPWO2007026877A1 (en)
TW (1) TW200716994A (en)
WO (1) WO2007026877A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI577091B (en) * 2012-07-04 2017-04-01 Nidec-Read Corp Wiring structure and substrate inspection device
CN107532961A (en) * 2015-07-31 2018-01-02 住友理工株式会社 The manufacture method of capacitive type sensor, sensor chip and capacitive type sensor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113325295B (en) * 2021-05-13 2022-07-19 江苏普诺威电子股份有限公司 Reliability test method for planar buried capacitor substrate micro short circuit

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH052867Y2 (en) * 1987-07-17 1993-01-25
JP3038859B2 (en) * 1989-09-29 2000-05-08 ジェイエスアール株式会社 Anisotropic conductive sheet
JP3144325B2 (en) * 1996-12-10 2001-03-12 凸版印刷株式会社 Inspection jig for printed wiring board and inspection apparatus using the same
JPH11344521A (en) * 1998-06-01 1999-12-14 Jsr Corp Stacked connector device, and inspection device of circuit substrate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI577091B (en) * 2012-07-04 2017-04-01 Nidec-Read Corp Wiring structure and substrate inspection device
CN107532961A (en) * 2015-07-31 2018-01-02 住友理工株式会社 The manufacture method of capacitive type sensor, sensor chip and capacitive type sensor
TWI622329B (en) * 2015-07-31 2018-04-21 住友理工股份有限公司 Capacitance type sensor, sensor sheet, and manufacturing method of capacitance type sensor
US10317442B2 (en) 2015-07-31 2019-06-11 Sumitomo Riko Company Limited Capacitive sensor, sensor sheet, and method for manufacturing capacitive sensor
CN107532961B (en) * 2015-07-31 2019-09-03 住友理工株式会社 The manufacturing method of capacitive type sensor, sensor chip and capacitive type sensor

Also Published As

Publication number Publication date
WO2007026877A1 (en) 2007-03-08
JPWO2007026877A1 (en) 2009-03-12

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