CN1677358A - Detest apparatus and detest method - Google Patents
Detest apparatus and detest method Download PDFInfo
- Publication number
- CN1677358A CN1677358A CN 200410032177 CN200410032177A CN1677358A CN 1677358 A CN1677358 A CN 1677358A CN 200410032177 CN200410032177 CN 200410032177 CN 200410032177 A CN200410032177 A CN 200410032177A CN 1677358 A CN1677358 A CN 1677358A
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- electronic component
- test
- electrically connected
- card extender
- circuit
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Abstract
The invention provides a testing device, testing if an electronic component is accurately connected to a circuit board, and comprising a commutation board, at least a connecting wire and at least a circuit testing board, where the commutation board is provided with at least a commutation component, connected with the electronic component, a first end of the connecting wire is connected with the commutation board, the circuit testing board is connected with a second end of the connecting wire, the circuit testing board further comprises at least a testing connection point, connected with the commutation component. In addition, the invention provides a testing method, testing if an electronic component is accurately connected to a circuit board. The testing device and method improves the damage problem of the commutation board and testing unit.
Description
Technical field
The present invention is about a kind of proving installation and method of testing, especially has a circuit test plate, the test contacts of electronic component can be transferred on the circuit test plate and test, to confirm whether correctly electric proving installation and the method for testing that is linked to computer main frame panel of electronic component.
Background technology
Whether general computer main frame panel needs in process of production through a series of test procedure, serve as normal with each function of authenticating computer motherboard.
In the process of test central processing unit CPU socket, known technology is at each time test procedure, after all socket need cpu chip being inserted in before beginning test and finishing test cpu chip is pulled away socket, if Plug Action accidentally, tends to cause stitch on the cpu chip by bending or fracture.
Afterwards, when testing, produced the situation of a large amount of losses, substituted cpu chip with a chip card extender usually, to test in order to reduce cpu chip.Card extender then has electrically conduct a little identical with cpu chip, and then the switching pin of chip card extender is inserted on the CPU socket.Thus, in test procedure, being plugged repeatedly just becomes card extender but not cpu chip in CPU socket.
As shown in Figure 1, CPU socket (socket) 11 welderings are located on the computer main frame panel 12, and CPU socket 11 has a plurality of first jacks 111.In the known technology, whether be electrically connected in computer main frame panel 12 exactly, utilize a card extender 13 to assist to test in order to test CPU socket 11.Have contact on the card extender 13, for example: a side of card extender 13 has switching pin 131, and its first jack 111 with CPU socket 11 is corresponding, and the opposite side of card extender 13 has second jack 132 that is communicated with the switching pin.
And test cell 14 has and second jack, 132 corresponding microprobes 141 (micro-probe), during test, microprobe 141 is inserted and is touched in second jack 132 of card extender 13, comes CPU socket 11 on the detection computations machine host plate 12 with this, and whether conducting is normal for its relevant effect.
But along with cpu chip pin number purpose increases, switching pin 131 on the card extender 13 and second jack, 132 numbers also increase thereupon.On fixing card extender 13 areas, the aperture of second jack 132 is also more and more trickle.This makes when testing; it is excessive to insert the pressure touch in the microprobe 141 of second jack 132; regular meeting causes fracture phenomenon in second jack 132 of the elongated syringe needle of microprobe 141; not only test cell 14 is impaired; even CPU socket 11 and card extender 13 also can come to harm; make the process of test to carry out smoothly, also reduced the serviceable life of card extender 13.
In addition, contact on the known card extender 13, also can make the form of electric contact mat (Pad), the electric contact mat of card extender 13 1 sides contacts with the shell fragment of CPU socket 11, and the electric contact mat of the opposite side of card extender 13, then can be used as the contact that contacts with the microprobe 141 of test cell 14, and the electric contact mat conducting each other of card extender 13 both sides.Yet card extender 13 with electric contact mat, owing to will contact just with shell fragment and can test, therefore when test, still need to apply sizable pressure, electric contact mat is closely contacted with shell fragment, but thus, then cause CPU socket 11 and card extender 13 stressed excessive again easily, and then cause breakage.
Because the problems referred to above, the inventor urgently thinks a kind of stitch number that can solve because of cpu chip to be increased, and makes CPU socket test " proving installation and the method for testing " that is difficult for.
Summary of the invention
Because above-mentioned problem, purpose of the present invention provides a kind of proving installation and method of testing, especially has a circuit test plate, test contacts that can electronic component is transferred on the circuit test plate tests, to confirm whether correctly electric proving installation and the method for testing that is linked to computer main frame panel of electronic component.
For reaching above-mentioned purpose, according to proving installation of the present invention, test an electronic component and whether accurately be linked to a circuit board, comprise a card extender, at least one connecting line and at least one circuit test plate.Wherein, card extender has at least one switching element, and switching element and electronic component are electrically connected; One first end and the card extender of connecting line are electrically connected; One second end of circuit test plate and connecting line is electrically connected, and the circuit test plate more comprises at least one test contacts, and test contacts and switching element are electrically connected.
For reaching above-mentioned purpose, method of testing of the present invention, test an electronic component and whether accurately be linked to a circuit board, comprise a card extender and electronic component are electrically connected, one first end of a connecting line is electrically connected in card extender, connecting line one second end and be electrically connected in a circuit test plate and a test cell and this circuit test plate and be electrically connected.
From the above, proving installation of the present invention and method of testing, has at least one circuit test plate, can be with the electric test contacts that is linked to the card extender of electronic component, utilize the electric binding of connecting line, be transferred on the circuit test plate, directly on the circuit test plate, whether testing electronic element the correctly electric computer main frame panel that is linked in order to test cell.Compared to the prior art, proving installation of the present invention and method of testing, when having improved known electronic components test, can be because the stitch number of chip increases, make when test cell and card extender are tested that pressure is too big and make card extender and the impaired problem of test cell.Because proving installation of the present invention and method of testing with the test contacts on the card extender, are transferred at least one circuit test plate and are tested.Therefore, under the too many situation of the contact that electronic component need be tested, can utilize connecting line to test respectively at the circuit test plate more than two.In addition, the circuit test plate more can be arranged on the support frame, and support frame is striden and is located on the electronic component, and therefore, test cell can directly be tested the circuit test plate in the top, position of original electronic component, can not occupy the space of other electron component.
Description of drawings
The synoptic diagram of the proving installation of the CPU socket that Fig. 1 is known;
The synoptic diagram of Fig. 2 proving installation of the present invention;
The synoptic diagram of Fig. 3 card extender of the present invention, connecting line and circuit test plate;
Another synoptic diagram of Fig. 4 card extender of the present invention, connecting line and circuit test plate;
The synoptic diagram of Fig. 5 electronic component of the present invention and circuit test plate;
Another synoptic diagram of Fig. 6 proving installation of the present invention;
The process flow diagram of Fig. 7 method of testing of the present invention; And
Another process flow diagram of Fig. 8 method of testing of the present invention.
Symbol description among the figure:
11 CPU sockets
111 first jacks
12 computer main frame panels
13 card extenders
131 switching pin
132 second jacks
14 test cells
141 microprobes
2 proving installations
21 electronic components
211 shell fragments
212 lids
213 pedestals
214 handles
Cover gab on 215
22 circuit boards
23 card extenders
231 switching elements
24 connecting lines
241 first ends
242 second ends
25 circuit test plates
251 first surfaces
252 test contacts
253 second surfaces
26 supporting frames
261 openings
27 test cells
28 monitoring means
The electric binding program of a P1 connecting line and a card extender
P2 connecting line and the electric binding program of a circuit test plate
The electric binding program of P3 card extender and electronic component
P4 test cell and circuit test plate are electrically connected program
S30 electronic component and card extender fixing step
S31 circuit test plate positioning step
Embodiment
For making content of the present invention easier to understand,, the preferred embodiment of proving installation of the present invention and method of testing is described hereinafter with reference to relevant drawings.
Please refer to Fig. 2 to Fig. 6, so that a preferred embodiment of proving installation 2 of the present invention to be described.
As shown in Figure 2, proving installation 2 is tested an electronic component 21 and whether accurately is linked to a circuit board 22, and proving installation 2 comprises a card extender 23, at least one connecting line 24 and at least one circuit test plate 25.
Among Fig. 2, electronic component 21 is linked to circuit board 22, and electronic component 21 can be a socket (Socket), and electronic component 21 is an example with the CPU socket in the mobile computer in the present embodiment.In the present embodiment, electronic component 21 has plural shell fragment 211.
As Fig. 3 and shown in Figure 2, card extender 23 has at least one switching element 231, and switching element 231 is electrically connected with electronic component 21.In the present embodiment, card extender 23 comes testing electronic element 21 whether accurately to be linked to circuit board 22 in order to replace chip.So card extender 23 has the firing point identical with chip, can with electronic component 21 electric bindings.
Wherein, at least a portion of switching element 231 is the conductive region that is exposed to card extender 23, and in the present embodiment, the two ends of switching element 231 are all electric contact mat (pad), and the shell fragment 211 of an end and electronic component is in contact with one another, and the other end is connected with connecting line 24.Certainly, an end of switching element 231 also can be switching pin or the probe that protrudes from card extender 23, and this end inserts electronic component 21.In addition, an end of switching element 231 also can be a via, is in contact with one another with the shell fragment 211 with electronic component 21 protrusions.
Please refer to Fig. 4, one first end 241 and the card extender 23 of connecting line 24 are electrically connected, and connecting line 24 be a flexible circuit (Flexible print circuit, FPC) or an electronics line.And is flexible circuit with mylar or poly-? imines is that base material is made a kind ofly has height reliability and a flexual P.e.c..One second end 242 of connecting line 24 is electrically connected with a first surface 251 of circuit test plate 25.
Please refer to Fig. 3 again, circuit test plate 25 has a test contacts 252 at least, and test contacts 252 is one to be exposed to a conductive region of circuit test plate 25.Test contacts 252 is positioned at a second surface 253 of circuit test plate 25, and the first surface 251 of circuit test plate 25 and second surface 253 are relative and establish, and test contacts 252 is electrically connected with switching element 231.
The electronic component 21 of present embodiment as shown in Figure 5, is fixed in circuit board 22, and electronic component 21 has more a lid 212, a pedestal 213, leader 214, reaches cover gab 215 on.
As shown in Figure 6, in the present embodiment, proving installation 2 more comprises a supporting frame 26, and supporting frame 26 is crossed over electronic components 21 and in being arranged at circuit board 22.Supporting frame 26 has an opening 261, and 24 of connecting lines that are linked to card extender 23 are connected with circuit test plate 25 via opening 261, and circuit test plate 25 is positioned on the supporting frame 26.Therefore, supporting frame 26 support circuit test boards 25 make circuit test plate 25 be positioned at the top of electronic component 21, and the second surface 253 that circuit test plate 25 has a test contacts 252 up, in order to the carrying out of testing procedure.
In the present embodiment, more comprise an at least one test cell 27 and a monitoring means 28, test cell 27 is electrically connected with monitoring means 28.When wanting testing electronic element 21 whether accurately to be linked to circuit board 22, test cell 27 is electrically connected with test contacts 252, and with the monitoring means 28 that test cell 27 is electrically connected, promptly can confirm the state that is electrically connected of electronic component 21, whether normal with circuit board 22 conductings.
Then, please refer to Fig. 3 to Fig. 8, so that the preferred embodiment of method of testing of the present invention to be described.
As shown in Figure 7, according to the method for testing of preferred embodiment of the present invention, test an electronic component and whether accurately be linked to a circuit board.Method of testing comprises connecting line and the electric binding program of card extender P1, connecting line and the electric binding program of circuit test plate P2, card extender and electronic component electric binding program P3 and test cell and circuit test plate and is electrically connected program P4.
Electronic component is linked to circuit board, and electronic component can be a socket (Socket), and electronic component is an example with the CPU socket in the mobile computer in the present embodiment.
In as shown in Figure 7 connecting line and the electric binding program of card extender P1, one first end 241 of connecting line 24 is electrically connected in card extender 23 (as shown in Figure 4).Connecting line 24 be a flexible circuit (Flexible print circuit, FPC) or an electronics line.In the present embodiment, connecting line 24 is the electronics line, utilizes the mode of welding that first end 241 of connecting line 24 is connected with test contacts on the card extender 23.
As Fig. 3 and shown in Figure 2, card extender 23 has at least one switching element 231, and switching element 231 is electrically connected with electronic component 21.Wherein, at least a portion of switching element 231 is a conductive region that is exposed to card extender 23, and in the present embodiment, switching element 231 is an electric contact mat (pad) pad, is in contact with one another with the shell fragment 211 with electronic component.Certainly, an end of switching element 231 also can be switching pin or the probe that protrudes from card extender 23, and this end inserts electronic component 21.In addition, an end of switching element 231 also can be a via, is in contact with one another with the shell fragment 211 with electronic component 21 protrusions.
In as shown in Figure 7 connecting line and the electric binding program of circuit test plate P2, one second end 242 of connecting line 24 is electrically connected in a circuit test plate 25.Please refer to Fig. 4, circuit test plate 25 is electrically connected in one second end 242 of a first surface 251 with connecting line 24.
Please refer to Fig. 3, circuit test plate 25 more comprises at least one test contacts 252, and test contacts 252 is one to be exposed to a conductive region of circuit test plate 25.Test contacts 252 is positioned at circuit test plate 25 1 second surfaces 253, and the first surface 251 of circuit test plate 25 and second surface 253 are relative and establish, and test contacts 252 is electrically connected with switching element 231.
Be electrically connected among the program P3 in as shown in Figure 7 card extender and electronic component, as shown in Figure 2, place by card extender 23 on the shell fragment 211 of electronic component 21, card extender 23 and electronic component 21 electric bindings.Simultaneously switching element 231 also with electronic component 21 electric bindings.After having finished card extender and electronic component and being electrically connected program P3, then circuit test plate 25 also is electrically connected with electronic component 21, and test cell and the circuit test plate that then carry out as shown in Figure 7 this moment are electrically connected program P4.
As shown in Figure 8, method of testing of the present invention more can comprise an electronic component and card extender fixing step S30.Please refer to Fig. 5, electronic component 21 is fixed in circuit board 22, and electronic component 21 has a lid 212, a pedestal 213, leader 214, reaches cover gab 215 on.Be connected in the connecting line 24 of card extender 23, pass the last cover gab 215 on the lid 212, just lid 212 is covered, utilize handle 214 to withhold pedestal 213 again, to finish electronic component and card extender fixing step S30.
Method of testing of the present invention more can comprise as shown in Figure 8 a circuit test plate positioning step S31, as shown in Figure 6, will pass cover gab 215, and is connecting the circuit test of connecting line 24 plate 25 is arranged, and is positioned a supporting frame 26.
As shown in Figure 6, supporting frame 26 is crossed over electronic components 21 and in being arranged at circuit board 22.Supporting frame 26 has an opening 261, and 24 of connecting lines that are linked to card extender 23 are connected with circuit test plate 25 via opening 261, and circuit test plate 25 is positioned on the supporting frame 26.Therefore, supporting frame 26 support circuit test boards 25 make circuit test plate 25 be positioned at the top of electronic component 21, the second surface 253 that has a test contacts 252 in order to circuit test plate 25 up, in order to the carrying out of test.
Be electrically connected P4 in the program in a test cell and circuit test plate, test cell 27 is being electrically connected a monitoring means 28.In the time will confirming whether electronic component 21 accurately is linked to circuit board 22, test cell 27 is electrically connected with test contacts 252, and with the monitoring means 28 that test cell 27 is electrically connected, promptly can confirm the state that is electrically connected of electronic component 21, whether normal with circuit board 22 conductings.
In sum, proving installation of the present invention provided by the present invention and method of testing, has at least one circuit test plate, the electric test contacts that is linked to electronic component and card extender of energy, utilize the electric binding of connecting line, electrical signal is transferred on the circuit test plate, in order to the direct testing electronic element correctly electric computer main frame panel that is linked to whether on the circuit test plate of test cell.Compared to the prior art, proving installation of the present invention and method of testing, when having improved known electronic components test, can be because the stitch number of electronic component increases, it for example is chip with high density and high pin number, make when test cell is tested that it is too big that probe is the pressure that is subjected to, and cause test cell or the impaired problem of electronic component.Because proving installation of the present invention and method of testing with test contacts, are transferred at least one circuit test plate.Test cell then carries out electronic components test on the circuit test plate.That is to say, test contacts is derived, and increase the quantity of circuit test plate at the too many next connecting line that can utilize of situation of contact that electronic component need be tested, with reduce test probe the pressure that can run into.Thus, can not make that then test cell or electronic component are impaired, can save the material cost of test cell.In addition, the circuit test plate more can be arranged on the support frame, and support frame is striden and is located on the electronic component, and therefore, test cell can directly be tested the circuit test plate in the top, position of original electronic component, can not occupy the space of other electron component.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the described claim its equivalent modifications of carrying out or change.
Claims (10)
1. a proving installation is tested an electronic component and whether accurately is linked to a circuit board, comprises:
One card extender, it has at least one switching element, and this switching element and this electronic component are electrically connected;
At least one connecting line, its first end and this card extender are electrically connected; And
At least one circuit test plate, one second end of itself and this connecting line is electrically connected, and this circuit test plate has at least one test contacts, and this test contacts and this switching element are electrically connected.
2. proving installation as claimed in claim 1, wherein at least a portion of this switching element is a conductive region that is exposed to this card extender.
3. proving installation as claimed in claim 1, wherein at least a portion of this switching element protrudes from this card extender, and at least a portion of this switching element is inserted this electronic component.
4. proving installation as claimed in claim 1, wherein this test contacts is at least one conductive region that is exposed to this circuit test plate.
5. proving installation as claimed in claim 4, wherein this proving installation more comprises an at least one test cell and a monitoring means, this test cell and this monitoring means are electrically connected, when this test cell and this test contacts were electrically connected, this monitoring means was confirmed the state that is electrically connected of this electronic component.
6. proving installation as claimed in claim 1, wherein this connecting line is a flexible circuit or an electronics line.
7. proving installation as claimed in claim 1 more comprises a supporting frame, and this circuit test plate is arranged at this supporting frame.
8. proving installation as claimed in claim 7, wherein this supporting frame is striden and is located at this electronic component.
9. the described proving installation of claim 1, wherein this electronic component is a socket.
10. a method of testing is tested an electronic component and whether accurately is linked to a circuit board, comprises:
One first end of one connecting line is electrically connected in a card extender;
One second end of this connecting line is electrically connected in a circuit test plate;
This card extender and this electronic component are electrically connected; And
One test cell and this circuit test plate are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100321776A CN100357903C (en) | 2004-04-01 | 2004-04-01 | Detest apparatus and detest method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100321776A CN100357903C (en) | 2004-04-01 | 2004-04-01 | Detest apparatus and detest method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1677358A true CN1677358A (en) | 2005-10-05 |
| CN100357903C CN100357903C (en) | 2007-12-26 |
Family
ID=35049889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100321776A Expired - Fee Related CN100357903C (en) | 2004-04-01 | 2004-04-01 | Detest apparatus and detest method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100357903C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101430354B (en) * | 2007-11-08 | 2011-01-05 | 环旭电子股份有限公司 | Test method and apparatus for pin element |
| CN107942233A (en) * | 2017-12-05 | 2018-04-20 | 徐州大工电子科技有限公司 | A kind of gauge of grouping circuits panel products to its veneer selective enumeration method |
| CN108808285A (en) * | 2017-05-05 | 2018-11-13 | 富顶精密组件（深圳）有限公司 | Electric coupler component |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1219217C (en) * | 1998-11-02 | 2005-09-14 | Atg试验体系两合公司 | Device for testing printed boards |
| CN2480854Y (en) * | 2001-04-28 | 2002-03-06 | 华硕电脑股份有限公司 | Thin type CD driver circuit board tester |
| CN2493943Y (en) * | 2001-07-23 | 2002-05-29 | 吴志成 | Tester structure for printed circuit board |
| CN2524372Y (en) * | 2002-02-01 | 2002-12-04 | 威盛电子股份有限公司 | Chip tester |
-
2004
- 2004-04-01 CN CNB2004100321776A patent/CN100357903C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101430354B (en) * | 2007-11-08 | 2011-01-05 | 环旭电子股份有限公司 | Test method and apparatus for pin element |
| CN108808285A (en) * | 2017-05-05 | 2018-11-13 | 富顶精密组件（深圳）有限公司 | Electric coupler component |
| CN107942233A (en) * | 2017-12-05 | 2018-04-20 | 徐州大工电子科技有限公司 | A kind of gauge of grouping circuits panel products to its veneer selective enumeration method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100357903C (en) | 2007-12-26 |
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Owner name: HESHUO JOINT SCIENCE AND TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: HUASHUO COMPUTER CO LTD Effective date: 20100521 |
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Free format text: CORRECT: ADDRESS; FROM: TAIPEI CITY, TAIWAN PROVINCE, CHINA TO: 5/F, NO.76 LIGONG ROAD, BEITOU DISTRICT, TAIPEI CITY, TAIWAN PROVINCE, CHINA |
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| TR01 | Transfer of patent right |
Effective date of registration: 20100521 Address after: Taiwan Taipei City Beitou District China meritorious Road No. 76 5 floor Patentee after: Pegatron Corporation Address before: Taipei City, Taiwan, China Patentee before: Huashuo Computer Co., Ltd. |
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Granted publication date: 20071226 Termination date: 20120401 |