TWI682475B - Wafer testing assembly - Google Patents

Abstract

The present invention provides a wafer testing assembly and an electrically connecting module. The electrically connecting module is configured to be sandwiched between two boards for electrically coupling the two boards. The electrically connecting module includes a plurality of elastic sheets spaced apart from each other and an insulator. Each of the elastic sheets includes a base portion, an upper elastic arm, and a lower elastic arm, the latter two of which extend from the base portion in two directions away from each other. The insulator connects the base portions of the elastic sheets, and the upper elastic arm and the lower elastic arm of each of the elastic sheets respectively protrude from two opposite sides of the insulator. The upper elastic arms of the elastic sheets are configured to abut against one of the two boards, and the lower elastic arms of the elastic sheets are configured to abut against the other board.

Description

Wafer test components

The invention relates to a test component, in particular to a wafer test component.

The existing wafer test device includes a test circuit board electrically coupled to the test machine and a signal transmission board disposed on the test circuit board, and the signal transmission board is soldered and fixed to the existing test device Test the circuit board. However, in the process of welding and fixing the signal transmission board and the test circuit board, the existing wafer testing device is susceptible to thermal shock and is damaged. Moreover, welding the fixed signal transmission board and the test circuit board is not conducive to its subsequent detection and maintenance.

Therefore, the inventor believes that the above-mentioned defects can be improved, and Naite devotes himself to research and cooperates with the application of scientific principles, and finally proposes a reasonable design and effectively improves the above-mentioned defects of the present invention.

An embodiment of the present invention is to provide a wafer test assembly and its electrical connection module, which can effectively improve the defects that may be generated by the existing wafer test device.

An embodiment of the present invention discloses a wafer testing assembly, including: a signal transmission board, which includes a plurality of connection pads, and the signal transmission board is used to connect to a probe head; a functional board, with a A first board surface and a second board surface, and the functional board includes a plurality of built-in capacitors, a plurality of first contacts on the first board surface, and a plurality of contacts on the second board surface Second contacts; wherein, the plurality of first contacts and the plurality of second contacts are electrically coupled to a plurality of contacts The capacitor; a first electrical connection module sandwiched between the signal transmission board and the functional board; wherein, the first electrical connection module includes: a plurality of first spring pieces, spaced apart from each other And each includes a first base, and a first upper elastic arm and a first lower elastic arm that extend away from the first base toward each other; and a first insulating member that connects a plurality of the first The first base of an elastic piece, and the first upper elastic arm and the first lower elastic arm of each first elastic piece protrude from opposite sides of the first insulating member respectively; wherein, The first upper elastic arms of the plurality of first elastic pieces respectively abut against the plurality of connection pads of the signal transmission board, and the first lower elastic arms of the plurality of first elastic pieces respectively press the A plurality of the first contacts against the function board; a test circuit board including a plurality of metal pads arranged at intervals, and the test circuit board is used to electrically couple to a test machine; and a A second electrical connection module is sandwiched between the functional board and the test circuit board; wherein, the second electrical connection module includes: a plurality of second elastic pieces, which are spaced apart from each other and each It includes a second base, and a second upper elastic arm and a second lower elastic arm that extend away from the second base toward each other; and a second insulating member that connects the plurality of second elastic pieces The second base, and the second upper elastic arm and the second lower elastic arm of each of the second elastic pieces protrude from opposite sides of the second insulating member respectively; The second upper elastic arms of the second elastic piece respectively press against the plurality of second contacts of the functional board, and the second lower elastic arms of the plurality of second elastic pieces respectively press against the A plurality of the metal pads of the circuit board; wherein the signal transmission board, the function board, and the test circuit board pass through the first electrical connection module and the second electrical connection module They can be electrically coupled to each other.

An embodiment of the present invention also discloses a wafer test assembly, including: a signal transmission board, which includes a plurality of connection pads, and the signal transmission board is used to connect to a probe head; and a test circuit board, which includes an interval setting A plurality of metal pads, and the test circuit board is used to electrically couple to a test machine; and an electrical connection module is sandwiched between the signal transmission board and the test circuit board; wherein, The electrical connection module includes: a plurality of shrapnels, which are arranged at intervals and each package Contains a base, and an upper elastic arm and a lower elastic arm extending away from the base toward each other; and an insulating member connecting the base of the plurality of elastic pieces, and the upper portion of each elastic piece The elastic arm and the lower elastic arm respectively protrude from opposite sides of the insulating member; wherein, the upper elastic arms of the plurality of elastic pieces respectively abut against the plurality of connection pads of the signal transmission board , And the lower elastic arms of the plurality of elastic sheets respectively abut against the plurality of metal pads of the test circuit board; wherein, the signal transmission board and the test circuit board pass through the electrical connection mode Group can be electrically coupled to each other.

An embodiment of the present invention also discloses an electrical connection module of a wafer test assembly, which is used to be clamped between two boards so that they can be electrically coupled to each other. The electrical connection module includes: a plurality of The elastic pieces are arranged at a distance from each other and each includes a base, and an upper elastic arm and a lower elastic arm extending away from the base; and an insulating member connecting the bases of the plurality of elastic pieces, and each The upper elastic arm and the lower elastic arm of each elastic piece respectively protrude from opposite sides of the insulating member; wherein, the upper elastic arms of the plurality of elastic pieces are used to press against one of them respectively The plate, and the lower elastic arms of the plurality of elastic pieces are used to respectively abut against the other one of the plates.

An embodiment of the present invention further discloses a wafer test assembly, including: a signal transmission board, which includes a plurality of connection pads, and the signal transmission board is used to connect to a probe head; and a functional board, which has A first board surface and a second board surface, and the functional board includes a plurality of built-in capacitors, a plurality of first contacts on the first board surface, and a second board surface on the second board surface A plurality of second contacts; wherein the plurality of first contacts and the plurality of second contacts are electrically coupled to the plurality of capacitors, and the plurality of connection pads of the signal transmission board A plurality of the first contacts fixed to the functional board by soldering; a test circuit board including a plurality of metal pads arranged at intervals, and the test circuit board is used to be electrically coupled to a test machine; And an electrical connection module sandwiched between the signal transmission board and the test circuit board; wherein, the electrical connection module includes: A plurality of elastic pieces are arranged at intervals from each other and each include a base, and an upper elastic arm and a lower elastic arm extending away from the base toward each other; and an insulating member connecting the bases of the plurality of elastic pieces, And the upper elastic arm and the lower elastic arm of each elastic piece protrude from opposite sides of the insulating member respectively; wherein, the upper elastic arms of the plurality of elastic pieces respectively abut against the A plurality of the second contacts of the function board, and the lower elastic arms of the plurality of spring pieces respectively abut the plurality of metal pads of the test circuit board; wherein, the function board and the The test circuit boards can be electrically coupled to each other through the electrical connection module.

In summary, the wafer test assembly and the electrical connection module disclosed in the embodiments of the present invention electrically connect two boards with elastic arms (such as a first elastic arm and/or a second elastic arm) (For example: signal transmission board and function board, function board and test circuit board, or signal transmission board and test circuit board), but can be composed without using soldering. Further, since the elastic arm 32 is detachably crimped to the two plates, the components of the wafer test assembly can be easily separated from each other, so as to facilitate subsequent inspection and testing of the wafer test assembly service.

In order to understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, not to make any protection to the scope of the present invention. limit.

100‧‧‧ Wafer test module

1‧‧‧Signal transmission board

11‧‧‧Top

12‧‧‧Bottom

13‧‧‧ connection pad

14‧‧‧blind hole

2‧‧‧Function board

21‧‧‧ First board

22‧‧‧Second board

23‧‧‧Capacitance

24‧‧‧ First contact

25‧‧‧second contact

3‧‧‧First electrical connection module (electrical connection module)

31‧‧‧The first shrapnel (shrapnel)

311‧‧‧First base (base)

312‧‧‧First upper elastic arm (upper elastic arm)

313‧‧‧First lower elastic arm (lower elastic arm)

314‧‧‧ opening

32‧‧‧First insulation (insulation)

4‧‧‧Test circuit board

41‧‧‧Metal pad

5‧‧‧Second electrical connection module (electrical connection module)

51‧‧‧Second shrapnel (shrapnel)

511‧‧‧Second base

512‧‧‧Second upper elastic arm

513‧‧‧Second lower elastic arm

514‧‧‧ opening

52‧‧‧Second insulation parts (insulation parts)

6‧‧‧ Probe head

61‧‧‧Positioning seat

62‧‧‧conductive probe

7‧‧‧Screw set

FIG. 1A is a schematic cross-sectional view of a wafer test assembly according to Embodiment 1 of the present invention.

FIG. 1B is a schematic diagram of another variation of FIG. 1A.

FIG. 2 is a partially exploded schematic view of FIG. 1A (the probe head is omitted).

3 is a three-dimensional schematic diagram of an electrical connection module (a first electrical connection module or a second electrical connection module) according to Embodiment 1 of the present invention.

FIG. 4 is a schematic top view of FIG. 3.

FIG. 5 is a schematic diagram of the variation of FIG. 3.

FIG. 6 is a schematic top view of FIG. 5.

7 is a schematic diagram of another variation of FIG. 3.

8 is a schematic cross-sectional view of a wafer test assembly according to Embodiment 2 of the present invention.

FIG. 9 is a partially exploded schematic view of FIG. 8 (the probe head is omitted).

Please refer to FIG. 1A to FIG. 9, which are the embodiments of the present invention. It should be noted that this embodiment corresponds to the relevant quantity and appearance mentioned in the drawings, and is only used to specifically illustrate the implementation of the present invention. In order to facilitate understanding of the content of the present invention, rather than to limit the scope of protection of the present invention.

[Example 1]

As shown in FIGS. 1A to 7, it is Embodiment 1 of the present invention. The dimensions of each element shown in FIG. 1A to FIG. 7 are only schematic representations, which can be adjusted and changed according to design requirements (eg, the length of the element extends outward), and is not limited to the illustrations.

As shown in FIG. 1A and FIG. 2, this embodiment discloses a wafer test assembly 100, which includes a signal transmission board 1 (space transformer), a function board 2, clamped between the signal transmission board 1 and the function board 2 Between a first electrical connection module 3, a test circuit board 4, a second electrical connection module 5 between the functional board 2 and the test circuit board 4, which is provided on the signal transmission board 1 A probe head 6, and a screw set 7. Wherein, the probe head 6, the signal transmission board 1, the first electrical connection module 3, the function board 2, the second electrical connection module 5, and the test circuit board 4 are in FIG. 1A in this embodiment The arrangement is stacked sequentially downward, but the invention is not limited thereto.

It should be noted that the signal transmission board 1, the first electrical connection module 3, the function board 2, the second electrical connection module 5, and the test circuit board 4 of the wafer test assembly 100 are in this embodiment The relative position of each other is maintained by the through fixation of the screw set 7 and the signal transmission board 1. The functional board 2 and the test circuit board 4 can be electrically coupled to each other through the first electrical connection module 3 and the second electrical connection module 5 described above. According to this, the signal transmission board 1, the first electrical connection module 3, the functional board 2, the second electrical connection module 5, and the test circuit board 4 of this embodiment can be fixed to each other without soldering. For example, any electrical transmission path between the test circuit board 4, the function board 2, and the signal transmission board 1 is not achieved with any solder material.

Furthermore, in this embodiment, the first electrical connection module 3 is described in conjunction with the second electrical connection module 5 together with the above-mentioned components, but the invention is not limited thereto. For example, in other embodiments of the present invention, the first electrical connection module 3 can also be applied separately and is called an electrical connection module 3, which is used to clamp between two plates So that they can be electrically coupled to each other.

In addition, in other embodiments not shown in the present invention, the screw set 7 can penetrate and fix the probe head 6, the signal transmission board 1, the first electrical connection module 3, the function board 2, and the second electrical The connection module 5 and the test circuit board 4 are fixed to each other without soldering. Alternatively, the wafer test assembly 100 can replace the screw set 7 in other ways, for example, the various components of the wafer test assembly 100 are fixed by adhesion.

In addition, the wafer test assembly 100 of this embodiment preferably excludes any test device that cannot be applied to the probe head 6, but the present invention is not limited thereto. The structure and connection relationship of each element of the wafer test assembly 100 of this embodiment will be described below.

As shown in FIGS. 1A and 2, the signal transmission board 1 has a top surface 11 and a bottom surface 12 on opposite sides. The bottom surface 12 of the signal transmission board 1 faces the first electrical connection module 3. The signal transmission board 1 is provided with a plurality of connection pads 13 on the bottom surface 12. It should be noted that, in this embodiment, the connection pad 13 is described as a square, but in actual application, the shape of the connection pad 13 can be adjusted and changed according to design requirements (such as: round, rectangular, or irregular shape). The top surface 11 of the signal transmission board 1 is used to connect to the probe head 6 so that the plurality of connection pads 13 can be electrically coupled to the probe head 6.

The functional board 2 has a first board surface 21 and a second board surface 22 on opposite sides, and the first board surface 21 of the functional board 2 faces the first electrical connection module 3. Wherein, the functional board 2 includes a plurality of built-in capacitors 23, a plurality of first contacts 24 located on the first board surface 21, and a plurality of second contacts located on the second board surface 22 25. Further, the plurality of first contacts 24 and the plurality of second contacts 25 are electrically coupled to the plurality of capacitors 23, and the arrangement and arrangement of the plurality of first contacts 24 of the functional board 2 are substantially equivalent The connection pads 13 of the signal transmission board 1 are arranged in an array, but the invention is not limited thereto.

As shown in FIGS. 2 to 4, the first electrical connection module 3 is sandwiched between the signal transmission board 1 and the function board 2, so that the signal transmission board 1 and the function board 2 pass the first electrical property The modules 3 are connected and electrically coupled to each other. Wherein, the first electrical connection module 3 includes a plurality of first elastic pieces 31 spaced apart from each other and a first insulating member 32 connected to the plurality of first elastic pieces 31. It should be noted that since the structures of the plurality of first elastic pieces 31 are substantially the same in this embodiment, for ease of description, only the structure of one of the first elastic pieces 31 will be described below, but the invention is not limited to this . For example, in other embodiments not shown in the present invention, the structures of the plurality of first elastic pieces 31 may also be different.

In this embodiment, the first elastic piece 31 is an integrally formed one-piece component, and the outer surface of the first elastic piece 31 is preferably plated with a nickel-gold layer, but not limited thereto. The first elastic piece 31 includes a first base 311 and a first upper elastic arm 312 and a first lower elastic arm 313 extending away from the first base 311 in a direction away from each other.

In more detail, the first base 311 is ring-shaped and surrounds an opening 314. The first upper elastic arm 312 and the first lower elastic arm 313 are bent from opposite sides of the inner edge of the first base 311 respectively Formed by folding, and the first upper elastic arm 312 and the first lower elastic arm 313 are not on the same side, so that the first upper elastic arm 312 is located above the first base 311, and the first lower elastic arm 313 is located Below the first base 311. Wherein, the included angle between the first upper elastic arm 312 and the first lower elastic arm 313 and the first base 311 is preferably the same angle (eg, the included angle is between 100 degrees~ 150 degrees), but the invention is not limited to this.

To put it another way, the opening 314 of the first elastic piece 31 is S-shaped in a top plan view (eg, FIG. 4), and the first elastic piece 31 is in a side plan view (eg: FIG. 2) The shape is Z-shaped, but the specific structure of the first elastic piece 31 can also be adjusted and changed according to design requirements, and is not limited to those described in this embodiment. For example, the first elastic piece 31 may be formed as shown in FIGS. 5 and 6. The first upper elastic arm 312 and the first lower elastic arm 313 are from the same side of the inner edge of the first base 311 The part is formed by bending and extending, so that the opening 314 of the first elastic piece 31 can be E-shaped in a plan view in a top view; or, the first elastic piece 31 can also be formed as shown in FIG. 7.

As shown in FIGS. 2 to 4, the first insulating member 32 is connected to the first base portions 311 of the plurality of first elastic pieces 31, and the first base portions 311 of the first electrical connection module 3 are in this embodiment In the embodiment, the first insulating member 32 is arranged in a coplanar manner and electrically insulated from each other, but the present invention is not limited thereto. Wherein, the first insulating member 32 is in the shape of a sheet and is connected to the outer edge of each first base 311, and the first upper elastic arm 312 and the first lower elastic arm 313 of each first elastic piece 31 protrude respectively Opposite sides of the first insulating member 32 mentioned above.

In addition, the first upper elastic arms 312 of the plurality of first elastic pieces 31 of the first electrical connection module 3 respectively abut against the plurality of connection pads 13 of the signal transmission board 1, and the plurality of first elastic pieces 31 The first lower elastic arms 313 respectively abut against the plurality of first contacts 24 of the functional board 2, so that any one of the first elastic pieces 31 can constitute a unit electrically coupled to the signal transmission board 1 and the functional board 2 Current transmission path. Further, the first upper elastic arm 312 and the first lower elastic arm 313 of any one of the first elastic pieces 31 can be respectively compressed by the corresponding connection pad 13 and the first contact 24 to store a resilient force, according to Stay connected steadily.

As shown in FIG. 1A and FIG. 2, the test circuit board 4 is electrically coupled to a test machine (not shown), and the test circuit board 4 is on its board surface (such as the test circuit board in FIG. 2) 4 top surface) There are a plurality of metal pads 41 arranged at intervals, and the arrangement of the plurality of connection pads 13 of the signal transmission board 1 is substantially equivalent to the arrangement of the plurality of first contacts 24 of the above-mentioned functional board 2, but the present invention is not limited to this. According to this, the plurality of metal pads 41 are electrically coupled to the testing machine to analyze the signals received by the testing circuit board 4 through the testing machine. It should be noted that the electrical coupling method between the test circuit board 4 and the test machine can be adjusted and changed according to design requirements. For example, in other embodiments not shown in the present invention, the test circuit board 4 may also be directly integrated into the test machine.

As shown in FIGS. 2 to 4, the second electrical connection module 5 is sandwiched between the functional board 2 and the test circuit board 4, so that the functional board 2 and the test circuit board 4 pass the second electrical property The modules 5 are connected and electrically coupled to each other. The structure of the second electrical connection module 5 in this embodiment is substantially the same as that of the first electrical connection module 3 described above, so the following will only roughly describe the structure of the second electrical connection module 5, However, the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the structure of the second electrical connection module 5 may also be different from that of the first electrical connection module 3 described above.

In this embodiment, the second electrical connection module 5 includes a plurality of second elastic pieces 51 spaced apart from each other and a second insulating member 52 connected to the plurality of second elastic pieces 51. It should be noted that since the structures of the plurality of second elastic pieces 51 are substantially the same in this embodiment, for convenience of description, only the structure of one of the second elastic pieces 51 will be described below, but the invention is not limited thereto . For example, in other embodiments not shown in the present invention, the structures of the plurality of second elastic pieces 51 may also be different.

In this embodiment, the second elastic piece 51 is an integrally formed one-piece component, and the outer surface of the second elastic piece 51 is preferably plated with a nickel-gold layer, but not limited to this. The second elastic piece 51 includes a second base 511 and a second upper elastic arm 512 and a second lower elastic arm 513 extending away from the second base 511 in a direction away from each other. The second base portion 511 is ring-shaped and surrounds an opening 514. The second upper elastic arm 512 and the second lower elastic arm 513 are formed by bending and extending from opposite sides of the inner edge of the second base portion 511.

The second insulating member 52 is connected to the second base 511 of the plurality of second elastic pieces 51, and the second bases 511 of the second electrical connection module 5 are connected by the second insulating member 52 in this embodiment It is arranged in a coplanar plane and electrically insulated from each other, but the invention is not limited thereto. Wherein, the second insulating member 52 is in the shape of a sheet and connected to the outer edge of each second base 511, and the second upper elastic arm 512 and the second lower elastic arm 513 of each second elastic piece 51 protrude respectively The opposite sides of the second insulating member 52 mentioned above.

In addition, the second upper elastic arms 512 of the plurality of second elastic pieces 51 of the second electrical connection module 5 abut against the plurality of second contacts 25 of the functional board 2 respectively, and the plurality of second elastic pieces 51 The second lower elastic arms 513 respectively abut against the plurality of metal pads 41 of the test circuit board 4, so that any one of the second elastic pieces 51 can form a one electrically coupled to the functional board 2 and the test circuit board 4 Current transmission path. Further, the second upper elastic arm 512 and the second lower elastic arm 513 of any one of the second elastic pieces 51 can be respectively compressed by the corresponding second contact 25 and the metal pad 41 to store a resilient force, according to Stay connected steadily.

As shown in FIG. 1A, the probe head 6 is disposed on the top surface 11 of the signal transmission board 1, and the probe head 6 can be electrically coupled to the test circuit board 4 through the signal transmission board 1. Wherein, the probe head 6 includes a positioning base 61 and a plurality of conductive probes 62 disposed on the positioning base 61. One end of each conductive probe 62 (such as the conductive probe in FIG. 1A) The bottom end of the needle 62 passes through the positioning base 61 and abuts on the top surface 11 of the signal transmission board 1, and the other end of each conductive probe 62 (such as the top end of the conductive probe 62 in FIG. 1A ) Through the positioning seat 61 for pressing against an object to be tested (such as a semiconductor wafer).

It should be noted that, in this embodiment, the conductive probe 62 has an elongated structure that is conductive and has flexibility, but the conductive probe 62 of the present invention is not limited to rectangular conductive probes and circular conductive Probes, or other structured conductive probes.

In addition, the wafer test assembly 100 can also be replaced in other ways in this embodiment Replace the screw set 7; as shown in FIG. 1B, when the thickness of the signal transmission board 1 is thin, the signal transmission board 1 and the function board 2 can be directly welded and fixed to each other, thereby increasing the rigidity of the signal transmission board 1, also It is beneficial for the subsequent use of the second electrical connection module 5 and the test circuit board 4 for crimping. That is to say, the wafer test assembly 100 omits the above-mentioned first electrical connection module 3, and the second electrical connection module 5 and each component contained therein can omit the word "second" (such as : The second elastic piece 51 and the second insulating member 52 may be referred to as the elastic piece 51 and the insulating member 52), respectively, and the plurality of connection pads 13 of the signal transmission board 1 are respectively soldered and fixed to the plurality of first boards of the functional board 2 Contact 24.

[Example 2]

As shown in FIG. 8 and FIG. 9, it is the second embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, so the similarities of the two embodiments (such as: probe head 6, the first electrical connection mode Group 3 and the test circuit board 4) will not be described in detail, and the difference between this embodiment and the above-mentioned first embodiment is roughly described as follows: Specifically, the first electrical connection module 3 and its first In this embodiment, an elastic piece 31 and a first insulating member 32 are respectively referred to as the electrical connection module 3, the elastic piece 31, and the insulating member 32. In the first embodiment, the first base 311, the first upper elastic arm 312, and the In this embodiment, the first lower elastic arm 313 is referred to as a base 311, an upper elastic arm 312, and a lower elastic arm 313, respectively. Furthermore, the wafer test assembly 100 does not include the functional board 2 and the second electrical connection module 5 in this embodiment, so the electrical connection module 3 of this embodiment is clamped to the signal transmission Between the board 1 and the test circuit board 4, the signal transmission board 1 and the test circuit board 4 can be electrically coupled to each other through the electrical connection module 3.

Accordingly, since the electrical connection module 3 and the test circuit board 4 of this embodiment are similar to the first electrical connection module 3 and the test circuit board 4 of the foregoing embodiment 1, this embodiment will not repeat them here. The following mainly describes the signal transmission board 1 and its corresponding connection relationship.

As shown in FIGS. 8 and 9, the signal transmission board 1 has a top surface 11 and a bottom surface 12 on opposite sides. The bottom surface 12 of the signal transmission board 1 faces the electrical connection module 3. Among them, the letter The signal transmission board 1 includes a plurality of connection pads 13 embedded therein and adjacent to the top surface 11. The top surface 11 of the signal transmission board 1 is used to connect to the probe head 6, and a plurality of connection pads 13 can be electrically coupled to the probe head 6. Further, the signal transmission board 1 is recessed from the bottom surface 12 to form at least one blind hole 14, and the plurality of connection pads 13 are exposed to the at least one blind hole 14.

Furthermore, the upper elastic arms 312 of the plurality of elastic pieces 31 of the electrical connection module 3 pass through the at least one blind hole 14 and respectively abut against the plurality of connection pads 13 of the signal transmission board 1, and the electrical The lower elastic arms 313 of the plurality of elastic pieces 31 of the sexual connection module 3 respectively abut against the plurality of metal pads 41 of the test circuit board 4.

From another perspective, the electrical connection module 3 can be used to be clamped between two boards (such as the signal transmission board 1 and the test circuit board 4) so that they can be electrically coupled to each other, and the above The upper elastic arms 312 of the plurality of elastic pieces 31 are used to respectively abut against one of the plates (eg, the signal transmission board 1), and the lower elastic arms 313 of the plurality of elastic pieces 31 are used to respectively abut the other Describe the board (eg: test circuit board 4).

[Technical Effects of Embodiments of the Invention]

In summary, the wafer test assembly and the electrical connection module disclosed in the embodiments of the present invention electrically connect two boards with elastic arms (such as a first elastic arm and/or a second elastic arm) (For example: signal transmission board and function board, function board and test circuit board, or signal transmission board and test circuit board), without using soldering. Further, since the elastic arm is detachably crimped to two plates, the components of the wafer test assembly can be easily separated from each other, so as to facilitate subsequent inspection and maintenance of the wafer test assembly . However, when the thickness of the signal transmission board is thin, the signal transmission board and the functional board can still be directly welded to each other, thereby enhancing the rigidity of the signal transmission board, and also conducive to the subsequent use of the second electrical connection module (such as: The second lower elastic arm) is crimped with the test circuit board.

In addition, since the signal transmission board of the existing wafer testing device requires an electron supply element (such as: Passive components), but the layout area of the electronic components on the signal transmission board is limited, and when the signal transmission board has its transmission quality requirements, the signal transmission board is affected by the arrangement path of the electronic components and affects its performance. According to this, the wafer test assembly disclosed in the embodiments of the present invention can effectively simplify the structure of the signal transmission board by adopting an independent functional board; and the two sides of the functional board respectively pass through the first electrical connection mode The second and the second electrical connection module are electrically connected to the overall structure of the signal transmission board and the test circuit board, which not only get rid of the structure of the existing wafer testing device, but also effectively shorten the circuit transmission path, which is beneficial to improve the wafer Test the effectiveness of the components.

The content disclosed above is only a preferred and feasible embodiment of the present invention, and therefore does not limit the patent scope of the present invention. Therefore, any equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

1‧‧‧Signal transmission board

11‧‧‧Top

12‧‧‧Bottom

13‧‧‧ connection pad

2‧‧‧Function board

21‧‧‧ First board

22‧‧‧Second board

23‧‧‧Capacitance

24‧‧‧ First contact

25‧‧‧second contact

3‧‧‧The first electrical connection module

31‧‧‧The first shrapnel

311‧‧‧The first base

312‧‧‧First upper elastic arm

313‧‧‧First lower elastic arm

314‧‧‧ opening

32‧‧‧First insulation

4‧‧‧Test circuit board

41‧‧‧Metal pad

5‧‧‧Second electrical connection module

51‧‧‧Second shrapnel

511‧‧‧Second base

512‧‧‧Second upper elastic arm

513‧‧‧Second lower elastic arm

514‧‧‧ opening

52‧‧‧Second insulation

7‧‧‧Screw set

Claims (6)

A wafer test assembly includes: a signal transmission board including a plurality of connection pads, and the signal transmission board is used to connect to a probe head; a functional board has a first on the opposite side A board surface and a second board surface, and the functional board includes a plurality of built-in capacitors, a plurality of first contacts on the first board surface, and a plurality of on the second board surface A second contact; wherein, the plurality of first contacts and the plurality of second contacts are electrically coupled to the plurality of capacitors; a first electrical connection module is clamped to the signal Between the transmission board and the functional board; wherein, the first electrical connection module includes: a plurality of first elastic pieces, which are arranged at intervals from each other, and each includes a first base, and from the first base A first upper elastic arm and a first lower elastic arm extending away from each other; and a first insulating member connecting the first bases of the plurality of first elastic pieces, and each of the first elastic pieces The first upper elastic arm and the first lower elastic arm respectively protrude from opposite sides of the first insulating member; wherein, the first upper elastic arms of the plurality of first elastic pieces abut against each other A plurality of the connection pads on the signal transmission board, and the first lower elastic arms of the plurality of first elastic pieces respectively abut the plurality of first contacts of the functional board; a test The circuit board includes a plurality of metal pads arranged at intervals, and the test circuit board is used to be electrically coupled to a test machine; and a second electrical connection module is sandwiched between the functional board and the Between test circuit boards; wherein, the second electrical connection module includes: a plurality of second elastic pieces, which are arranged at a distance from each other and each includes a second base, and extending away from each other from the second base A second upper elastic arm with A second lower elastic arm; and a second insulating member connecting the second bases of the plurality of second elastic pieces, and the second upper elastic arm and the second of each second elastic piece Lower elastic arms protrude from opposite sides of the second insulating member respectively; wherein the second upper elastic arms of the plurality of second elastic pieces respectively abut against the plurality of second of the functional board Contacts, and the second lower elastic arms of the plurality of second elastic pieces respectively abut against the plurality of metal pads of the circuit board; wherein, the signal transmission board, the function board, and all The test circuit board can be electrically coupled to each other through the first electrical connection module and the second electrical connection module; wherein the signal transmission board includes a top surface and a A bottom surface, a plurality of the connection pads are embedded in the signal transmission board and adjacent to the top surface, the signal transmission board is recessed from the bottom surface to form at least one blind hole, and a plurality of the connection pads Exposed to at least one of the blind holes, and the first upper elastic arms of the plurality of first elastic pieces pass through at least one of the blind holes and respectively abut against the plurality of connection pads; the signal transmission The top surface of the board is used to connect to the probe head, and a plurality of the connection pads can be electrically coupled to the probe head. The wafer test assembly according to claim 1, wherein each of the first elastic pieces is an integrally formed one-piece member, and a plurality of the first bases of the first electrical connection module pass through The connection of the first insulating member is coplanar. The wafer test assembly according to claim 2, wherein the first base portion of each of the first elastic pieces surrounds and forms an opening, and the opening of each of the first elastic pieces presents in a top plan view S-shaped, and each of the first elastic pieces is Z-shaped in a plan view from one side. The wafer test assembly according to claim 1, wherein the wafer test assembly One step includes a screw set, and the signal transmission board, the first electrical connection module, the functional board, the second electrical connection module, and the test circuit board pass through the screw set The relative position of each other is maintained throughout the fixation; any electrical transmission path between the test circuit board, the functional board, and the signal transmission board is not achieved with any solder material. The wafer test assembly according to claim 1, wherein the wafer test assembly further includes a probe head disposed on the signal transmission board, and the probe head includes: a positioning base; and A plurality of conductive probes are arranged in the positioning seat body; wherein, one end of each conductive probe penetrates the positioning seat body and abuts on the signal transmission board, and each of the conductive probes The other end of the needle passes through the positioning base and is used to bear against an object to be measured. A wafer test assembly includes: a signal transmission board including a plurality of connection pads, and the signal transmission board is used to connect to a probe head; a test circuit board includes a plurality of metal pads arranged at intervals, And the test circuit board is used to be electrically coupled to a test machine; and an electrical connection module is sandwiched between the signal transmission board and the test circuit board; wherein, the electrical connection module The set includes: a plurality of elastic pieces, which are spaced apart from each other and each includes a base, and an upper elastic arm and a lower elastic arm extending away from the base; and an insulating member connecting the plurality of elastic pieces The base, and the upper elastic arm and the lower elastic arm of each spring piece protrude from opposite sides of the insulating member respectively; wherein, the upper elastic arms of the plurality of spring pieces respectively The plurality of connection pads against the signal transmission board, and the lower elastic arms of the plurality of elastic pieces A plurality of the metal pads respectively against the test circuit board; wherein the signal transmission board and the test circuit board can be electrically coupled to each other through the electrical connection module; wherein, the The signal transmission board includes a top surface and a bottom surface on opposite sides. A plurality of the connection pads are embedded in the signal transmission board and adjacent to the top surface. The signal transmission board is recessed from the bottom surface At least one blind hole is formed, and a plurality of the connection pads are exposed to at least one of the blind holes, and the upper elastic arms of the plurality of elastic pieces are penetrated through at least one of the blind holes to respectively bear against more than one The connection pad; the top surface of the signal transmission board is used to connect to the probe head, and a plurality of the connection pads can be electrically coupled to the probe head.

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