TW202040711A - Wafer testing assembly - Google Patents

Abstract

The present invention provides a wafer testing assembly and an electrically connecting module. The electrically connecting module is configured to be sandwiched between two boards for electrically coupling the two boards. The electrically connecting module includes a plurality of elastic sheets spaced apart from each other and an insulator. Each of the elastic sheets includes a base portion, an upper elastic arm, and a lower elastic arm, the latter two of which extend from the base portion in two directions away from each other. The insulator connects the base portions of the elastic sheets, and the upper elastic arm and the lower elastic arm of each of the elastic sheets respectively protrude from two opposite sides of the insulator. The upper elastic arms of the elastic sheets are configured to abut against one of the two boards, and the lower elastic arms of the elastic sheets are configured to abut against the other board.

Description

Wafer test assembly and its electrical connection module

The invention relates to a test assembly, in particular to a wafer test assembly and an electrical connection module thereof.

The existing wafer test device includes a test circuit board electrically coupled to the test machine and a signal transmission board disposed on the test circuit board, and the signal transmission board is soldered and fixed in the existing test device Test the circuit board. However, during the process of welding and fixing the signal transmission board and the test circuit board, the existing wafer test device is susceptible to thermal shock and damage. Moreover, welding the fixed signal transmission board and the test circuit board is not conducive to subsequent inspection and maintenance.

Therefore, the inventor believes that the above-mentioned shortcomings can be improved, and with great concentration of research and the application of scientific principles, we finally propose an invention with reasonable design and effective improvement of the above-mentioned shortcomings.

The embodiment of the present invention provides a wafer test assembly and an electrical connection module thereof, which can effectively improve the defects that may be generated by the existing wafer test device.

The embodiment of the present invention discloses a wafer test assembly, which includes: a signal transmission board, including a plurality of connection pads, and the signal transmission board is used to connect to a probe head; a functional board with an opposite side A first board and a second board, and the functional board includes a plurality of built-in capacitors, a plurality of first contacts on the first board, and a plurality of capacitors on the second board. A second contact; wherein a plurality of the first contacts and a plurality of the second contacts are electrically coupled to a plurality of the capacitors; a first electrical connection module is clamped in the Between the signal transmission board and the functional board; wherein, the first electrical connection module includes: a plurality of first elastic pieces, which are spaced apart from each other, and each includes a first base and a second base A first upper elastic arm and a first lower elastic arm extending away from each other; and a first insulating member connected to the first base of a plurality of the first elastic pieces, and each of the first elastic pieces The first upper elastic arm and the first lower elastic arm respectively protrude from opposite sides of the first insulating member; wherein, the first upper elastic arms of the plurality of first elastic pieces respectively top A plurality of the connection pads of the signal transmission board, and the first lower elastic arms of the plurality of first elastic pieces respectively abut the plurality of the first contacts of the function board; The test circuit board includes a plurality of metal pads arranged at intervals, and the test circuit board is used to electrically couple to a testing machine; and a second electrical connection module is clamped between the functional board and the Between the test circuit boards; wherein, the second electrical connection module includes: a plurality of second elastic sheets, which are spaced apart from each other and each includes a second base, and a direction away from each other from the second base Extending a second upper elastic arm and a second lower elastic arm; and a second insulating member connected to the second base of a plurality of the second elastic pieces, and the first elastic piece of each of the second elastic pieces Two upper elastic arms and the second lower elastic arms respectively protrude from opposite sides of the second insulating member; wherein, the second upper elastic arms of the plurality of second elastic pieces respectively abut against the The plurality of second contacts of the functional board, and the second lower elastic arms of the plurality of second elastic pieces respectively abut against the plurality of metal pads of the circuit board; wherein, the signal transmission The board, the function board, and the test circuit board can be electrically coupled to each other through the first electrical connection module and the second electrical connection module.

The embodiment of the present invention also discloses a wafer test assembly, including: a signal transmission board, including a plurality of connection pads, and the signal transmission board is used to connect to a probe head; a test circuit board, including spaced And the test circuit board is used to electrically couple to a test machine; and an electrical connection module is clamped between the signal transmission board and the test circuit board; wherein, The electrical connection module includes: a plurality of elastic pieces, which are spaced apart from each other, and each includes a base, and an upper elastic arm and a lower elastic arm extending away from each other from the base; and an insulating member for connecting The base portion of the plurality of elastic pieces, and the upper elastic arm and the lower elastic arm of each elastic piece respectively protrude from opposite sides of the insulating member; wherein, all the elastic pieces The above elastic arms respectively abut against the plurality of connection pads of the signal transmission board, and the lower elastic arms of the plurality of elastic sheets respectively abut against the plurality of metal pads of the test circuit board; Wherein, the signal transmission board and the test circuit board can be electrically coupled to each other through the electrical connection module.

The embodiment of the present invention further discloses an electrical connection module of a wafer test assembly, which is used to be clamped between two plates so as to be electrically coupled to each other. The electrical connection module includes: a plurality of The elastic pieces are spaced apart from each other and each includes a base, and an upper elastic arm and a lower elastic arm extending away from each other from the base; and an insulating member connecting the bases of a plurality of the elastic pieces, and each The upper elastic arms and the lower elastic arms of the elastic pieces respectively protrude from opposite sides of the insulating member; wherein, the upper elastic arms of the plurality of elastic pieces are used to abut one of the elastic pieces respectively The plate, and the lower elastic arms of the plurality of elastic pieces are used to respectively abut against another of the plates.

The embodiment of the present invention further discloses a wafer test assembly, which includes: a signal transmission board, including a plurality of connection pads, and the signal transmission board is used to connect to a probe head; a functional board with an opposite side A first board and a second board, and the functional board includes a plurality of built-in capacitors, a plurality of first contacts on the first board, and a second board on the A plurality of second contacts; wherein, a plurality of the first contacts and a plurality of the second contacts are electrically coupled to a plurality of the capacitors, and a plurality of the connection pads of the signal transmission board Soldering and fixing the plurality of first contacts on the functional board respectively; a test circuit board including a plurality of metal pads arranged at intervals, and the test circuit board is used to electrically couple to a test machine; And an electrical connection module, clamped between the signal transmission board and the test circuit board; wherein, the electrical connection module includes: a plurality of elastic pieces, which are spaced apart from each other and each includes a base , And an upper elastic arm and a lower elastic arm extending away from each other from the base; and an insulating member connecting the bases of a plurality of the elastic pieces, and the upper elastic arm of each of the elastic pieces and The lower elastic arms respectively protrude from opposite sides of the insulating member; wherein, the upper elastic arms of the plurality of elastic pieces respectively abut against the plurality of second contacts of the functional board, and The lower elastic arms of the plurality of elastic sheets respectively abut against the plurality of metal pads of the test circuit board; wherein, the functional board and the test circuit board are capable of being connected by the electrical connection module Are electrically coupled to each other.

In summary, the wafer test assembly and its electrical connection module disclosed in the embodiments of the present invention are electrically connected to two plates by elastic arms (such as the first elastic arm and/or the second elastic arm) (Such as: signal transmission board and function board, function board and test circuit board, or signal transmission board and test circuit board), and can be composed without welding. Furthermore, since the elastic arm 32 is detachably crimped on the two plates, the components of the wafer test assembly can be easily separated from each other, so as to facilitate the subsequent inspection and testing of the wafer test assembly. service.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, and do not make any claims about the protection scope of the present invention. limit.

Please refer to Figures 1A to 9, which are embodiments of the present invention. It should be noted that the related quantities and appearances mentioned in the corresponding drawings of this embodiment are only used to specifically illustrate the implementation of the present invention. The method is to facilitate understanding of the content of the present invention, rather than to limit the protection scope of the present invention.

[Example 1]

As shown in FIGS. 1A to 7, it is the first embodiment of the present invention. Among them, the size of each element shown in FIG. 1A to FIG. 7 is only a schematic representation, which can be adjusted and changed according to design requirements (for example, the length of the element extends outward), and is not limited to what is contained in the illustration.

As shown in FIGS. 1A and 2, this embodiment discloses a wafer test assembly 100, which includes a signal transmission board 1 (space transformer), a functional board 2, clamped between the signal transmission board 1 and the functional board 2. Between a first electrical connection module 3, a test circuit board 4, a second electrical connection module 5 between the functional board 2 and the test circuit board 4, and a second electrical connection module 5 disposed on the signal transmission board 1. A probe head 6, and a screw set 7. Among them, the probe head 6, the signal transmission board 1, the first electrical connection module 3, the functional board 2, the second electrical connection module 5, and the test circuit board 4 are shown in FIG. 1A in this embodiment. They are stacked sequentially downward, but the present invention is not limited to this.

It should be noted that the signal transmission board 1, the first electrical connection module 3, the functional board 2, the second electrical connection module 5, and the test circuit board 4 of the wafer test assembly 100 are in this embodiment. The relative position of each other is maintained by the penetration and fixing of the screw set 7, and the signal transmission board 1, the function board 2, and the test circuit board 4 are electrically connected to the second electrical connection module 3 through the above-mentioned first electrical connection module 3. The modules 5 can be electrically coupled to each other. Accordingly, the signal transmission board 1, the first electrical connection module 3, the functional board 2, the second electrical connection module 5, and the test circuit board 4 of this embodiment can be fixed to each other without welding. For example, any electrical transmission path between the test circuit board 4, the functional board 2, and the signal transmission board 1 is not achieved by any soldering material.

Furthermore, in this embodiment, the first electrical connection module 3 and the second electrical connection module 5 are used together with the aforementioned components for description, but the present invention is not limited to this. For example, in other embodiments of the present invention, the first electrical connection module 3 can also be applied separately and referred to as the electrical connection module 3, which is used to clamp between two plates. So that they can be electrically coupled to each other.

In addition, in other embodiments not shown in the present invention, the screw set 7 can penetrate and fix the probe head 6, the signal transmission board 1, the first electrical connection module 3, the functional board 2, the second electrical connection. Therefore, the connection module 5 and the test circuit board 4 do not need to be fixed to each other by welding. Alternatively, the wafer test assembly 100 can replace the screw set 7 in other ways, for example, the various components of the wafer test assembly 100 are fixed by bonding.

In addition, the wafer test assembly 100 of this embodiment preferably excludes any test device that cannot be applied to the probe head 6, but the present invention is not limited to this. The structure and connection relationship of each element of the wafer test assembly 100 of this embodiment will be described below.

As shown in FIGS. 1A and 2, the signal transmission board 1 has a top surface 11 and a bottom surface 12 on opposite sides, and the bottom surface 12 of the signal transmission board 1 faces the first electrical connection module 3. Wherein, the signal transmission board 1 is provided with a plurality of connection pads 13 on the bottom surface 12. It should be noted that the connecting pad 13 in this embodiment is illustrated as a square shape, but in practical applications, the shape of the connecting pad 13 can be adjusted and changed according to design requirements (such as round, rectangular, or irregular shape). Wherein, the top surface 11 of the signal transmission board 1 is used to connect to the probe head 6 so that a plurality of connection pads 13 can be electrically coupled to the probe head 6.

The functional board 2 has a first board surface 21 and a second board surface 22 on opposite sides, and the first board surface 21 of the functional board 2 faces the first electrical connection module 3. Wherein, the functional board 2 includes a plurality of built-in capacitors 23, a plurality of first contacts 24 located on the first board surface 21, and a plurality of second contacts located on the second board surface 22 25. Furthermore, the plurality of first contacts 24 and the plurality of second contacts 25 are electrically coupled to the plurality of capacitors 23, and the arrangement of the plurality of first contacts 24 of the functional board 2 is substantially the same The multiple connection pads 13 on the signal transmission board 1 are arranged in a row, but the present invention is not limited to this.

As shown in FIGS. 2 to 4, the first electrical connection module 3 is clamped between the signal transmission board 1 and the functional board 2, so that the signal transmission board 1 and the functional board 2 pass the first electrical connection The modules 3 are connected to each other electrically. The first electrical connection module 3 includes a plurality of first elastic pieces 31 spaced apart from each other and a first insulating member 32 connecting the plurality of first elastic pieces 31. It should be noted that since the structures of the plurality of first elastic pieces 31 are substantially the same in this embodiment, for ease of description, the following only introduces the structure of one of the first elastic pieces 31, but the present invention is not limited to this. . For example, in other embodiments not shown in the present invention, the structure of the plurality of first elastic pieces 31 may also be different.

The first elastic piece 31 is an integrally formed one-piece component in this embodiment, and the outer surface of the first elastic piece 31 is preferably plated with a nickel-gold layer, but it is not limited to this. The first elastic piece 31 includes a first base 311, and a first upper elastic arm 312 and a first lower elastic arm 313 extending from the first base 311 in a direction away from each other.

In more detail, the first base 311 is ring-shaped and surrounds an opening 314. The first upper elastic arm 312 and the first lower elastic arm 313 are respectively bent from opposite sides of the inner edge of the first base 311. The first upper elastic arm 312 and the first lower elastic arm 313 extend on different sides, so that the first upper elastic arm 312 is located above the first base 311, and the first lower elastic arm 313 is located Below the first base 311. The included angle between the first upper elastic arm 312 and the first lower elastic arm 313 and the first base 311 is preferably the same angle (for example, the included angle is between 100 degrees and 150 degrees), but the present invention is not Limited to this.

To put it another way, the opening 314 of the first elastic piece 31 is S-shaped in a top plan view (such as FIG. 4), and the first elastic piece 31 is in a side plan view (such as FIG. 2). It is in a zigzag shape, but the specific structure of the first elastic piece 31 can also be adjusted and changed according to design requirements, and is not limited to what is described in this embodiment. For example, the first elastic piece 31 may be formed in a modified configuration as shown in FIGS. 5 and 6, the first upper elastic arm 312 and the first lower elastic arm 313 are from the same side of the inner edge of the first base 311 The part is formed by bending and extending, so that the opening 314 of the first elastic piece 31 can be in an E shape in a top plan view; or, the first elastic piece 31 may also be formed in a modified form as shown in FIG. 7.

As shown in FIGS. 2 to 4, the first insulating member 32 is connected to the first base portions 311 of the plurality of first elastic pieces 31, and the plurality of first base portions 311 of the first electrical connection module 3 are in this embodiment. The connection of the first insulating member 32 is coplanar and electrically insulated from each other, but the present invention is not limited to this. Wherein, the first insulating member 32 is sheet-shaped and connected to the outer edge of each first base portion 311, and the first upper elastic arm 312 and the first lower elastic arm 313 of each first elastic piece 31 respectively protrude The opposite sides of the first insulating member 32 are shown.

In addition, the first upper elastic arms 312 of the plurality of first elastic pieces 31 of the first electrical connection module 3 respectively abut against the plurality of connection pads 13 of the signal transmission board 1, and the plurality of first elastic pieces 31 The first lower elastic arms 313 abut against the multiple first contacts 24 of the functional board 2 respectively, so that any one of the first elastic pieces 31 can form an electrical coupling between the signal transmission board 1 and the functional board 2. Current transmission path. Furthermore, the first upper elastic arm 312 and the first lower elastic arm 313 of any of the above-mentioned first elastic pieces 31 can be compressed by the corresponding connection pad 13 and the first contact 24 respectively to accumulate a resilient force, according to Stay connected steadily.

As shown in FIG. 1A and FIG. 2, the test circuit board 4 is used to electrically couple to a test machine (not shown), and the test circuit board 4 is on its surface (such as the test circuit board in FIG. 2). The top surface of 4) contains a plurality of metal pads 41 arranged at intervals, and the arrangement of the plurality of connection pads 13 of the signal transmission board 1 is roughly equivalent to the arrangement of the plurality of first contacts 24 of the functional board 2 mentioned above. The invention is not limited to this. Accordingly, the plurality of metal pads 41 are electrically coupled to the testing machine, so as to analyze the signals received by the test circuit board 4 through the testing machine. It should be noted that the electrical coupling method between the test circuit board 4 and the test machine can be adjusted and changed according to design requirements. For example, in other embodiments not shown in the present invention, the test circuit board 4 may also be directly integrated in the test machine.

As shown in FIGS. 2 to 4, the second electrical connection module 5 is clamped between the functional board 2 and the test circuit board 4, so that the functional board 2 and the test circuit board 4 pass the second electrical connection. The modules 5 are connected to each other electrically. Wherein, the structure of the second electrical connection module 5 in this embodiment is substantially the same as the above-mentioned first electrical connection module 3, so the following only roughly describes the structure of the second electrical connection module 5. However, the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the structure of the second electrical connection module 5 may also be different from the above-mentioned first electrical connection module 3.

In this embodiment, the second electrical connection module 5 includes a plurality of second elastic pieces 51 spaced apart from each other and a second insulating member 52 connected to the plurality of second elastic pieces 51. It should be noted that since the structures of the plurality of second elastic pieces 51 are substantially the same in this embodiment, for ease of description, the following only introduces the structure of one of the second elastic pieces 51, but the present invention is not limited to this. . For example, in other embodiments not shown in the present invention, the structure of the plurality of second elastic pieces 51 may also be different.

In this embodiment, the second elastic piece 51 is an integrally formed one-piece component, and the outer surface of the second elastic piece 51 is preferably plated with a nickel-gold layer, but not limited to this. The second elastic piece 51 includes a second base 511, and a second upper elastic arm 512 and a second lower elastic arm 513 extending from the second base 511 in a direction away from each other. The second base 511 is ring-shaped and surrounds an opening 514. The second upper elastic arm 512 and the second lower elastic arm 513 are formed by bending and extending from opposite sides of the inner edge of the second base 511.

The second insulating member 52 is connected to the second base portions 511 of the plurality of second elastic pieces 51, and the plurality of second base portions 511 of the second electrical connection module 5 are connected by the second insulating member 52 in this embodiment However, they are coplanar and electrically insulated from each other, but the present invention is not limited to this. Wherein, the second insulating member 52 is sheet-shaped and connected to the outer edge of each second base 511, and the second upper elastic arm 512 and the second lower elastic arm 513 of each second elastic piece 51 respectively protrude The opposite sides of the second insulating member 52 are shown.

In addition, the second upper elastic arms 512 of the plurality of second elastic pieces 51 of the second electrical connection module 5 respectively abut against the plurality of second contacts 25 of the function board 2, and the plurality of second elastic pieces 51 The second lower elastic arms 513 respectively abut against the multiple metal pads 41 of the test circuit board 4, so that any one of the second elastic pieces 51 can form an electrical coupling between the functional board 2 and the test circuit board 4. Current transmission path. Furthermore, the second upper elastic arm 512 and the second lower elastic arm 513 of any one of the second elastic pieces 51 can be compressed by the corresponding second contact 25 and the metal pad 41 to accumulate a resilient force, according to Stay connected steadily.

As shown in FIG. 1A, the probe head 6 is disposed on the top surface 11 of the signal transmission board 1, and the probe head 6 can be electrically coupled to the test circuit board 4 through the signal transmission board 1. Wherein, the probe head 6 includes a positioning base 61 and a plurality of conductive probes 62 that are set to be located on the positioning base 61. One end of each of the conductive probes 62 (such as the conductive probe in FIG. 1A) The bottom end of the needle 62 passes through the positioning base 61 to abut on the top surface 11 of the signal transmission board 1, and the other end of each conductive probe 62 (such as the top end of the conductive probe 62 in FIG. 1A) ) Passing through the positioning base body 61 to be used against an object to be tested (such as a semiconductor wafer).

It should be noted that the conductive probe 62 in this embodiment is a long strip structure that is conductive and flexible, but the conductive probe 62 of the present invention is not limited to rectangular conductive probes and circular conductive probes. Probes, or other conductive probes.

In addition, the wafer test assembly 100 can also replace the screw set 7 in other ways in this embodiment; as shown in FIG. 1B, when the thickness of the signal transmission board 1 is thin, the signal transmission board 1 can be connected with The functional boards 2 are directly welded and fixed to each other, so as to increase the rigidity of the signal transmission board 1 and also facilitate the subsequent use of the second electrical connection module 5 and the test circuit board 4 for crimping. In other words, the wafer test assembly 100 omits the above-mentioned first electrical connection module 3, and the second electrical connection module 5 and its various components can omit the word "second" (such as : The second elastic piece 51 and the second insulating member 52 can be respectively called the elastic piece 51 and the insulating member 52), and the plurality of connection pads 13 of the signal transmission board 1 are welded and fixed to the first plurality of the functional board 2 respectively. Contact 24.

[Example 2]

As shown in Figures 8 and 9, it is the second embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, so the two embodiments are similar (for example: the probe head 6, the first electrical connection module). Group 3 and test circuit board 4) will not be repeated, and the difference between this embodiment and the above-mentioned embodiment 1 is roughly explained as follows:

Specifically, the first electrical connection module 3 and its first elastic piece 31 and first insulating member 32 in the first embodiment are respectively referred to as the electrical connection module 3, elastic piece 31, and insulating member 32 in this embodiment. , And the first base 311, the first upper elastic arm 312, and the first lower elastic arm 313 in the first embodiment are respectively called the base 311, the upper elastic arm 312, and the lower elastic arm 313 in this embodiment. Furthermore, the wafer test assembly 100 does not include the functional board 2 and the second electrical connection module 5 in this embodiment, so the electrical connection module 3 of this embodiment is clamped on the signal transmission Between the board 1 and the test circuit board 4, the signal transmission board 1 and the test circuit board 4 can be electrically coupled to each other through the electrical connection module 3.

Accordingly, since the electrical connection module 3 and the test circuit board 4 of this embodiment are similar to the first electrical connection module 3 and the test circuit board 4 of the first embodiment described above, they will not be repeated in this embodiment. The following mainly describes the signal transmission board 1 and its corresponding connection relationship.

As shown in FIGS. 8 and 9, the signal transmission board 1 has a top surface 11 and a bottom surface 12 on opposite sides, and the bottom surface 12 of the signal transmission board 1 faces the electrical connection module 3. Wherein, the signal transmission board 1 includes a plurality of connection pads 13 embedded inside and adjacent to the top surface 11. The top surface 11 of the signal transmission board 1 is used to connect to the probe head 6, and a plurality of connection pads 13 can be electrically coupled to the probe head 6. Furthermore, the signal transmission board 1 has at least one blind hole 14 recessed from the bottom surface 12, and a plurality of connection pads 13 are exposed in the at least one blind hole 14.

Furthermore, the upper elastic arms 312 of the plurality of elastic pieces 31 of the electrical connection module 3 penetrate through the at least one blind hole 14 and respectively abut against the plurality of connection pads 13 of the signal transmission board 1, and the electrical connection module 3 The lower elastic arms 313 of the elastic sheets 31 of the sexual connection module 3 respectively abut against the metal pads 41 of the test circuit board 4.

From another perspective, the electrical connection module 3 can be used to clamp between two boards (such as the signal transmission board 1 and the test circuit board 4) so that they can be electrically coupled to each other. The upper elastic arms 312 of the plurality of elastic pieces 31 are used to respectively press against one of the plates (for example: the signal transmission plate 1), and the lower elastic arms 313 of the plurality of elastic pieces 31 are used to respectively bear against the other one. Describe the board (eg: test circuit board 4).

[Technical Effects of Embodiments of the Invention]

In summary, the wafer test assembly and its electrical connection module disclosed in the embodiments of the present invention are electrically connected to two plates by elastic arms (such as the first elastic arm and/or the second elastic arm) (Such as: signal transmission board and function board, function board and test circuit board, or signal transmission board and test circuit board), without welding. Furthermore, since the elastic arm is detachably crimped to the two plates, the components of the wafer test assembly can be easily separated from each other, so as to facilitate subsequent inspection and maintenance of the wafer test assembly . However, when the thickness of the signal transmission board is thin, the signal transmission board and the functional board can still be directly welded to each other, so as to improve the rigidity of the signal transmission board, which is also beneficial to the subsequent use of the second electrical connection module (such as: The second elastic arm) is crimped with the test circuit board.

Furthermore, since the signal transmission board of the existing wafer test device needs to be equipped with electronic components (such as passive components), the arrangement area of the above-mentioned electronic components on the signal transmission board is limited, and when the signal transmission board has its transmission quality requirements At this time, the signal transmission board is affected by the arrangement of the above-mentioned electronic components, which affects its performance. Accordingly, the wafer test assembly disclosed in the embodiment of the present invention can effectively simplify the structure of the signal transmission board by adopting an independent functional board; and both sides of the functional board pass through the first electrical connection module. The group and the second electrical connection module are electrically connected to the overall structure of the signal transmission board and the test circuit board, which not only gets rid of the structure of the existing wafer test device, but also effectively shortens the circuit transmission path to facilitate the improvement of the wafer Test the effectiveness of components.

The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

100: Wafer test component 1: Signal transmission board 11: Top surface 12: Bottom surface 13: Connection pad 14: Blind hole 2: Function board 21: First board surface 22: Second board surface 23: Capacitor 24: First connection Point 25: second contact 3: first electrical connection module (electrical connection module) 31: first elastic piece (shrapnel) 311: first base (base) 312: first upper elastic arm (upper elastic arm) 313: first lower elastic arm (lower elastic arm) 314: opening 32: first insulating member (insulating member) 4: test circuit board 41: metal pad 5: second electrical connection module (electrical connection module) ) 51: second elastic piece (shrapnel) 511: second base 512: second upper elastic arm 513: second lower elastic arm 514: opening 52: second insulating member (insulating member) 6: probe head 61: positioning seat Body 62: Conductive probe 7: Screw set

FIG. 1A is a schematic cross-sectional view of a wafer test assembly according to the first embodiment of the present invention.

FIG. 1B is a schematic diagram of another variation of FIG. 1A.

Figure 2 is a partial exploded schematic view of Figure 1A (probe head omitted).

3 is a three-dimensional schematic diagram of an electrical connection module (a first electrical connection module or a second electrical connection module) according to Embodiment 1 of the present invention.

Fig. 4 is a schematic top view of Fig. 3.

FIG. 5 is a schematic diagram of the change state of FIG. 3.

Fig. 6 is a schematic top view of Fig. 5.

FIG. 7 is a schematic diagram of another modified aspect of FIG. 3.

FIG. 8 is a schematic cross-sectional view of a wafer test assembly according to the second embodiment of the present invention.

Figure 9 is a partial exploded schematic view of Figure 8 (probe head omitted).

1: Signal transmission board

11: top surface

12: Bottom

13: Connection pad

2: Function board

21: The first board

22: second board

23: Capacitance

24: first contact

25: second contact

3: The first electrical connection module

31: The first shrapnel

311: first base

312: First upper elastic arm

313: First lower elastic arm

314: open

32: The first insulating part

4: Test the circuit board

41: Metal pad

5: The second electrical connection module

51: second shrapnel

511: second base

512: second upper elastic arm

513: second lower elastic arm

514: open

52: second insulation

7: Screw set

Claims (10)

A wafer test assembly includes: a signal transmission board including a plurality of connection pads, and the signal transmission board is used to connect to a probe head; a functional board with a first on the opposite side A board surface and a second board surface, and the functional board includes a plurality of built-in capacitors, a plurality of first contacts on the first board surface, and a plurality of on the second board surface A second contact; wherein a plurality of the first contacts and a plurality of the second contacts are electrically coupled to a plurality of the capacitors; a first electrical connection module is clamped in the signal Between the transmission board and the functional board; wherein, the first electrical connection module includes: a plurality of first elastic pieces, which are spaced apart from each other, and each includes a first base, and A first upper elastic arm and a first lower elastic arm extending away from each other; and a first insulating member connected to the first base of a plurality of the first elastic pieces, and each of the first elastic pieces The first upper elastic arm and the first lower elastic arm respectively protrude from opposite sides of the first insulating member; wherein, the first upper elastic arms of the plurality of first elastic pieces respectively abut against On the plurality of connection pads of the signal transmission board, and the first lower elastic arms of the plurality of first elastic pieces respectively abut against the plurality of first contacts of the functional board; a test The circuit board includes a plurality of metal pads arranged at intervals, and the test circuit board is used to electrically couple to a test machine; and a second electrical connection module clamped between the functional board and the Between test circuit boards; wherein, the second electrical connection module includes: a plurality of second elastic pieces, which are spaced apart from each other, and each includes a second base and extends away from each other from the second base A second upper elastic arm and a second lower elastic arm; and a second insulator connected to the second base of a plurality of the second elastic pieces, and the second of each of the second elastic pieces The upper elastic arm and the second lower elastic arm respectively protrude from opposite sides of the second insulating member; wherein, the second upper elastic arms of the plurality of second elastic pieces respectively abut against the function The plurality of second contacts of the board, and the second lower elastic arms of the plurality of second elastic pieces respectively abut against the plurality of metal pads of the circuit board; wherein, the signal transmission board , The function board and the test circuit board can be electrically coupled to each other through the first electrical connection module and the second electrical connection module. The wafer test assembly according to claim 1, wherein the signal transmission board includes a top surface and a bottom surface on opposite sides, and a plurality of the connection pads are located on the bottom surface of the signal transmission board; The top surface of the signal transmission board is used to connect to the probe head, and a plurality of the connection pads can be electrically coupled to the probe head. The wafer test assembly according to claim 1, wherein each of the first elastic pieces is an integrally formed one-piece component, and the plurality of first bases of the first electrical connection module pass through The connection of the first insulating member is coplanar. The wafer test assembly according to claim 3, wherein an opening is formed around the first base portion of each first elastic piece, and the opening of each first elastic piece is in a top plan view S-shaped, and each of the first elastic pieces is Z-shaped in a side plan view. The wafer test assembly according to claim 1, wherein the wafer test assembly further includes a screw set, and the signal transmission board, the first electrical connection module, the function board, and the The second electrical connection module and the test circuit board maintain their relative positions by the penetration and fixing of the screw set; any between the test circuit board, the functional board, and the signal transmission board The electrical transmission path is not achieved with any welding materials. The wafer test assembly according to claim 1, wherein the wafer test assembly further includes a probe head disposed on the signal transmission board, and the probe head includes: a positioning base; and A plurality of conductive probes are set to be located in the positioning base; wherein one end of each conductive probe penetrates the positioning base to abut on the signal transmission board, and each conductive probe The other end of the needle penetrates the positioning base body to press against an object to be tested. A wafer test assembly includes: a signal transmission board including a plurality of connection pads, and the signal transmission board is used to connect to a probe head; a test circuit board including a plurality of metal pads arranged at intervals, And the test circuit board is used to electrically couple to a test machine; and an electrical connection module is clamped between the signal transmission board and the test circuit board; wherein, the electrical connection module The set includes: a plurality of elastic pieces, which are spaced apart from each other, and each includes a base, and an upper elastic arm and a lower elastic arm extending away from each other from the base; and an insulating member connecting the plurality of elastic pieces The base, and the upper elastic arm and the lower elastic arm of each elastic piece respectively protrude from opposite sides of the insulating member; wherein, the upper elastic arms of the plurality of elastic pieces respectively top Abut against the plurality of connection pads of the signal transmission board, and the lower elastic arms of the plurality of elastic sheets respectively abut against the plurality of metal pads of the test circuit board; wherein, the signal transmission The board and the test circuit board can be electrically coupled to each other through the electrical connection module. The wafer test assembly according to claim 7, wherein the signal transmission board includes a top surface and a bottom surface on opposite sides, and a plurality of the connection pads are embedded in the signal transmission board and adjacent to On the top surface, the signal transmission board is concavely formed with at least one blind hole from the bottom surface, and a plurality of the connection pads are exposed at the at least one blind hole, and the upper elasticity of the plurality of elastic pieces The arm penetrates through at least one of the blind holes and respectively abuts against a plurality of the connection pads; the top surface of the signal transmission board is used to connect to the probe head, and the plurality of connection pads can It is electrically coupled to the probe head. An electrical connection module of a wafer test assembly, which is used to clamp between two plates so that they can be electrically coupled to each other. The electrical connection module includes: a plurality of elastic sheets, which are arranged at intervals And each includes a base, and an upper elastic arm and a lower elastic arm extending away from each other from the base; and an insulator connecting the bases of a plurality of the elastic pieces, and all of the elastic pieces The upper elastic arm and the lower elastic arm respectively protrude from opposite sides of the insulating member; wherein the upper elastic arms of the plurality of elastic pieces are used to abut one of the plates respectively, and The lower elastic arms of the plurality of elastic pieces are used to respectively abut against another of the plates. A wafer test assembly includes: a signal transmission board including a plurality of connection pads, and the signal transmission board is used to connect to a probe head; a functional board having a first board surface on the opposite side and A second board, and the functional board includes a plurality of built-in capacitors, a plurality of first contacts on the first board, and a plurality of second contacts on the second board Wherein, a plurality of the first contacts and a plurality of the second contacts are electrically coupled to a plurality of the capacitors, and the plurality of the connection pads of the signal transmission board are respectively welded and fixed to the A plurality of the first contacts of the functional board; a test circuit board including a plurality of metal pads arranged at intervals, and the test circuit board is used to electrically couple to a test machine; and an electrical connection module Group, clamped between the signal transmission board and the test circuit board; wherein, the electrical connection module includes: a plurality of elastic sheets, which are spaced apart from each other, and each includes a base and a base An upper elastic arm and a lower elastic arm extending in directions away from each other; and an insulator connecting the bases of a plurality of the elastic pieces, and the upper elastic arm and the lower elastic arm of each elastic piece are respectively Protruding from opposite sides of the insulating member; wherein the upper elastic arms of the plurality of elastic pieces abut against the plurality of second contacts of the functional board, and the plurality of elastic pieces The lower elastic arms respectively abut against the plurality of metal pads of the test circuit board; wherein, the functional board and the test circuit board can be electrically coupled to each other through the electrical connection module.

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