CN106597263A - Test system of semiconductor laser chip - Google Patents
Test system of semiconductor laser chip Download PDFInfo
- Publication number
- CN106597263A CN106597263A CN201710044814.9A CN201710044814A CN106597263A CN 106597263 A CN106597263 A CN 106597263A CN 201710044814 A CN201710044814 A CN 201710044814A CN 106597263 A CN106597263 A CN 106597263A
- Authority
- CN
- China
- Prior art keywords
- test
- subsystem
- computer disposal
- loading platform
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 180
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000011068 loading method Methods 0.000 claims abstract description 66
- 239000000110 cooling liquid Substances 0.000 claims abstract description 61
- 238000001816 cooling Methods 0.000 claims abstract description 58
- 238000012544 monitoring process Methods 0.000 claims abstract description 45
- 238000012545 processing Methods 0.000 claims abstract description 11
- 239000007788 liquid Substances 0.000 claims description 17
- 239000002826 coolant Substances 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 13
- 239000000523 sample Substances 0.000 claims description 13
- 230000000712 assembly Effects 0.000 claims description 9
- 238000000429 assembly Methods 0.000 claims description 9
- 238000005259 measurement Methods 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 4
- 230000003749 cleanliness Effects 0.000 claims description 2
- 230000002159 abnormal effect Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a test system of a semiconductor laser chip. The system comprises a test cabinet, a test power supply, a cooling subsystem, a temperature monitoring subsystem and a computer processing subsystem. The test cabinet comprises a loading platform. A plurality of chip components to be tested are placed on the loading platform. The test power supply is used for providing a test current for the plurality of chip components to be tested. The cooling subsystem is used for providing a circulated cooling liquid for the loading platform so as to provide a stable and reliable temperature for chip component tests. The temperature monitoring subsystem is used for monitoring temperatures of the loading platform and the circulated cooling liquid. The computer processing subsystem is used for making the cooling subsystem provide the circulated cooling liquid possessing the stable and reliable temperature and emitting a corresponding control instruction to the test power supply according to a result monitored by the temperature monitoring subsystem. Through the above mode, test safety can be increased and losses brought by accidental failure of the semiconductor laser chip components are avoided.
Description
Technical field
The present invention relates to semiconductor laser chip technical field of measurement and test, more particularly to a kind of semiconductor laser chip
Test system.
Background technology
With developing rapidly for the emerging fields such as laser display, laser lighting, 3D printing, air-ground integrated network, Gao Gong
Rate semiconductor laser market progressively expands, and surging the bringing of high-power semiconductor laser market demand is partly led to upstream
The great demand of body laser chip, noise spectra of semiconductor lasers chip output, reliability requirement it is also increasing.
In order to effectively be tested, need for semiconductor laser chip paster to be encapsulated in high heat sink of heat conductivity
On, abbreviation semiconductor laser chip component facilitates follow-up Two-level ensemble to encapsulate design, such as fiber coupling, common paster
Packing forms are COS (Chip On Submount) encapsulation.
Specific electric current, power, at a temperature of the burn-in test fixed time and long-time life test, to test system
Requirement is very high, for burn-in test, if the unexpected death that semiconductor laser chip is caused because of test system will
Cause substantial amounts of loss, and if for long-term Lifetest procedure uses up surprisingly can work(before whole life test because occurring
Abandon, loss cannot be estimated.Therefore it is extremely important for the system design of semiconductor laser chip module testing security protection.
The content of the invention
The invention mainly solves the technical problem of providing a kind of test system of semiconductor laser chip, it is possible to increase
The safety of test, it is to avoid because semiconductor laser chip component surprisingly fails the loss for bringing.
To solve above-mentioned technical problem, one aspect of the present invention is：A kind of semiconductor laser core is provided
The test system of piece, including：
Test cabinet, it includes loading platform, and multiple chip assemblies to be tested are placed on the loading platform；
Test power supply, to the plurality of chip assembly to be tested test electric current is provided；
Cooling subsystem, for providing circulating cooling liquid to the loading platform, thinks the test of the chip assembly
Reliable and stable temperature is provided；
Monitoring temperature subsystem, for monitoring the temperature of the loading platform and circulating cooling liquid；
Computer disposal subsystem, is connected respectively with the test power supply, cooling subsystem and monitoring temperature subsystem,
The circulating cooling liquid with reliable and stable temperature is provided to control the cooling subsystem, and according to monitoring temperature
The result that system is monitored, to the test power supply corresponding control instruction is sent.
Wherein, the result that the computer disposal subsystem is monitored according to the monitoring temperature subsystem, to the survey
Examination power supply sends corresponding control instruction, including：
When the monitoring temperature subsystem monitors are to temperature anomaly, the computer disposal subsystem is to the test electricity
Source sends cut-out instruction, so that the test power supply stops providing test electric current to the chip assembly.
Wherein, the monitoring temperature subsystem includes the temperature probe being arranged on the loading platform, for detecting
State the temperature of loading platform.
Wherein, the temperature probe is three, is arranged on described loading along the direction of chip assembly distribution respectively and puts down
Diverse location on platform.
Wherein, the cooling subsystem includes：
Cooling liquid supplies machine, for providing and reclaiming circulating cooling liquid, and with the computer disposal subsystem
Connection；
Cooling circuit, its two ends connect respectively the cooling liquid supply machine, and the loading platform is arranged on the cooling
On loop；
Main valve, be arranged between the liquid outlet of cooling liquid supply machine and the loading platform described cools back
Lu Shang, and being connected with the computer disposal subsystem, opened with carrying out under the control of the computer disposal subsystem and
Close.
Wherein, the cooling subsystem is further included：
Effusion meter, be arranged between the liquid inlet of cooling liquid supply machine and the loading platform described cools back
Lu Shang, and be connected with the computer disposal subsystem, the data on flows of measurement is sent to the computer disposal subsystem
System.
Wherein, the cooling subsystem is further included：
Coolant quality detector, is arranged between the liquid inlet of the cooling liquid supply machine and the loading platform
On the cooling circuit, and it is connected with the computer disposal subsystem, the coolant qualitative data of measurement is sent to institute
State computer disposal subsystem.
Wherein, the coolant qualitative data includes pH value and electrical conductivity.
Wherein, the cooling subsystem is further included：
Filter, the cooling circuit being arranged between the liquid outlet of the main valve and cooling liquid supply machine
On.
Wherein, what monitoring temperature subsystem included being arranged between the main valve and the loading platform described cools back
Temperature probe on road, for measuring the temperature of circulating cooling liquid.
Wherein, the test cabinet includes multiple loading platforms, and the cooling subsystem further includes flow divider, institute
State flow divider to be arranged between the main valve and the plurality of loading platform, the temperature probe is arranged on the flow divider
It is interior.
Wherein, the test system is further included：
Airborne particle counter, in being arranged on the test cabinet, and is connected, for supervising with the computer disposal subsystem
The air purity in the test cabinet is controlled, and air purity result is sent to the computer disposal subsystem, it is described
Computer disposal subsystem sends corresponding control instruction according to the air purity result to the test power supply.
Wherein, the computer disposal subsystem sends phase according to the air purity result to the test power supply
The control instruction answered, including：
When the air purity results abnormity, the computer disposal subsystem to the test power supply sends cut-out
Instruction, so that the test power supply stops providing test electric current to the chip assembly.
Wherein, the test system is further included：
Alert sub-system, is connected with the computer disposal subsystem, when computer disposal subsystem is to the test electricity
When source sends cut-out instruction, alert sub-system described in the computer disposal subsystem controls sends alarm.
Wherein, when computer disposal subsystem sends cut-out instruction to the test power supply, computer disposal
System sends failure code to corresponding personnel by mail.
Wherein, the test system is further included：
Air filter, to provide clean air to the test cabinet.
Wherein, the air filter is arranged on the test cabinet top, and clean air is provided downwards；The air grain
Sub-count device is arranged on the test cabinet bottom.
Wherein, the airborne particle counter is two, is separately positioned on the both sides of the test cabinet bottom.
The invention has the beneficial effects as follows：It is different from the situation of prior art, the survey of the semiconductor laser chip of the present invention
Test system includes monitoring temperature subsystem and computer disposal subsystem, using monitoring temperature subsystem monitors loading platform and follows
The temperature of ring cooling liquid, cooling subsystem described in computer disposal subsystem controls provides following with reliable and stable temperature
Ring coolant, and the result monitored according to the monitoring temperature subsystem, send corresponding control and refer to the test power supply
Order；When the temperature of monitoring temperature subsystem monitors to loading platform or circulating cooling liquid occurs abnormal, computer disposal
System can to test power supply send cut-out instruction, to avoid test process in cause semiconductor laser chip component surprisingly to lose
Effect, and then reduce loss.
Description of the drawings
Fig. 1 is a kind of test system schematic diagram of semiconductor laser chip of an embodiment of the present invention；
Fig. 2 is a kind of test system schematic diagram of semiconductor laser chip of another embodiment of the invention；
Fig. 3 is a kind of test system schematic diagram of semiconductor laser chip of a further embodiment of this invention；
Fig. 4 is a kind of test system schematic diagram of semiconductor laser chip of a further embodiment of this invention；
Fig. 5 is a kind of test system schematic diagram of semiconductor laser chip of another embodiment.
Specific embodiment
Below in conjunction with the accompanying drawings the present invention is described in detail with embodiment.
Such as Fig. 1, a kind of test system of semiconductor laser chip of embodiment of the present invention, test system can be used for right
Chip carries out burn-in test and life test, it can also be used to other tests of chip；Test system includes test cabinet 100, test
Power supply 200, cooling subsystem 300, monitoring temperature subsystem 400 and computer disposal subsystem 500.
Test cabinet 100 can provide relatively closed test environment, to reduce test process in extraneous interference factor shadow
Ring；Test cabinet 100 includes loading platform 110, and multiple chip assemblies to be tested are placed on loading platform 110；By arranging
Loading platform 110, multiple chip assemblies to be tested are placed on loading platform 110, are capable of achieving simultaneously to multiple chipsets
Part is tested, and improves testing efficiency；Wherein, the chip assembly of embodiment of the present invention is by semiconductor laser chip paster
It is encapsulated in high heat sink the going up of heat conductivity and is formed, packing forms can be other conventional shapes of COS, or this area
Formula.Multiple chip assemblies to be tested can be placed on loading platform 110 by way of being serially connected, it is possible to understand that,
In other embodiment, multiple chip assemblies to be tested are not limited to the form connected, and other connected modes may also be employed.It is many
Individual chip assembly to be tested can neatly form a line or multiple row on loading platform 110, in one embodiment, Ke Yishe
The spacing put between each component to be tested on loading platform 110 is equal, and is evenly distributed on loading platform 110, this
Sample can ensure that in test process, the homogeneity of temperature everywhere on loading platform 110, beneficial to monitoring temperature subsystem 400 pairs
Loading platform 110 carries out monitoring temperature.Such as Fig. 2, it is possible to understand that, in other embodiments, may also set up multiple loading and put down
Platform 110.
Test power supply 200 is connected with multiple chip assemblies to be tested, to provide to multiple chip assemblies to be tested
Test electric current, so that multiple chip assembly work to be tested.
Cooling subsystem 300 is used to provide circulating cooling liquid to loading platform 110, is provided with the test as chip assembly
Reliable and stable temperature；Cooling liquid can adopt water, and the higher liquid of other specific heat capacities may also be employed.Chip assembly was being tested
Cheng Zhonghui produces substantial amounts of heat, and this partial heat can pass through the circulating cooling liquid of cooling subsystem 300 from loading platform 110
Take away, so as to ensure test process in loading platform 110 and chip assembly temperature stablize.Monitoring temperature subsystem 400 is used for
The temperature of monitoring loading platform 110 and circulating cooling liquid.
Computer disposal subsystem 500 respectively with test power supply 200, cooling subsystem 300 and monitoring temperature subsystem
400 connections, to control cooling subsystem 300 circulating cooling liquid with reliable and stable temperature is provided, and is supervised according to temperature
The result that control subsystem 400 is monitored, to test power supply 200 corresponding control instruction is sent.
The test system of the semiconductor laser chip of embodiment of the present invention includes monitoring temperature subsystem 400 and calculates
Machine processing subsystem 500, using monitoring temperature subsystem 400 temperature of loading platform 110 and circulating cooling liquid is monitored, and is calculated
The control cooling subsystem 300 of machine processing subsystem 500 provides the circulating cooling liquid with reliable and stable temperature, and according to temperature
The result that Monitor And Control Subsystem 400 is monitored, to test power supply 200 corresponding control instruction is sent；When monitoring temperature subsystem 400
When the temperature for monitoring loading platform 110 or circulating cooling liquid occurs abnormal, computer disposal subsystem 500 can be to test electricity
Source 200 sends corresponding control instruction, to avoid test process in cause semiconductor laser chip component surprisingly to fail, and then
Reduce loss.
Wherein, the result that computer disposal subsystem 500 is monitored according to monitoring temperature subsystem 400, to test power supply
200 send corresponding control instruction, including：
When monitoring temperature subsystem 400 monitors temperature anomaly, computer disposal subsystem 500 is to test power supply 200
Cut-out instruction is sent, so that test power supply 200 stops providing test electric current to chip assembly.
When there are abnormal conditions in chip testing process, the heating of chip assembly becomes unstable so that loading platform 110
Temperature become unstable, at this moment the signal of temperature anomaly is fed back to computer disposal subsystem by monitoring temperature subsystem 400
500, computer disposal subsystem 500 carries out cutting off electric current output by control test power supply 200, stops being provided to chip assembly
Test electric current, makes chip assembly quit work.Monitoring temperature subsystem 400 also monitors the temperature of circulating cooling liquid, works as cooling
When the temperature of liquid occurs unusual fluctuations, the abnormal signal of chilled liquid temperature is fed back to calculating by monitoring temperature subsystem 400
Machine processing subsystem 500, computer disposal subsystem 500 by control test power supply 200 carry out cut off electric current output, stop to
Chip assembly provides test electric current, makes chip assembly quit work.
The test power supply 200 of embodiment of the present invention can be programmable power supply, and test power supply 200 can in real time at computer
The electric current and voltage of the reason feedback output of subsystem 500.In test process, computer disposal subsystem 500 can monitor in real time core
The running voltage of the operating current of piece component and all chip assemblies, when abnormal conditions occur in operating current or running voltage, meter
The control test cut-out electric current output of power supply 200 of calculation machine processing subsystem 500, prevents because electric current output abnormality causes chip assembly
Unexpected failure.Wherein, when having multiple loading platforms 110 in test cabinet 100, it is right with it that multiple test power supplys 200 can be set
Should, each loading platform 110 provides test electric current by a test power supply 200, and each test power supply 200 is connected respectively to calculating
Machine processing subsystem 500.
Wherein, monitoring temperature subsystem 400 includes the temperature probe 410 being arranged on loading platform 110, for detecting dress
The temperature of carrying platform 110.
Wherein, such as Fig. 2, temperature probe 410 is three, and respectively the direction along chip assembly distribution is arranged on loading platform
Diverse location on 110.The temperature that computer disposal subsystem 500 can be detected according to three temperature probes 410 it is average
Value conduct reference, to judge whether the temperature on loading platform 110 is abnormal.
Monitoring temperature subsystem 400 also includes that the temperature for detecting circulating cooling coolant-temperature gage is visited in embodiment of the present invention
361.
Wherein, cooling subsystem 300 includes cooling liquid supply machine 310, cooling circuit 370 and main valve 320.
Cooling liquid supply machine 310 is used to providing and reclaiming circulating cooling liquid, and with computer disposal subsystem 500
Connection；Control panel can be set on cooling liquid supply machine 310, for adjusting the temperature of the circulating cooling liquid of supply and opening
Open and close the circulation of cooling liquid；Also the circulating cooling that computer disposal subsystem 500 directly controls to adjust supply can be passed through
The temperature of liquid and the circulation of opening and closing cooling liquid.
The two ends of cooling circuit 370 connect respectively cooling liquid supply machine 310, and loading platform 110 is arranged on cooling circuit 370
On；Cooling circuit 370 is the passage of circulating cooling liquid circulation, and cooling liquid is flowed out through dress from cooling liquid supply machine 310
Cooling liquid supply machine 310 is flowed back to after carrying platform 110.In embodiment of the present invention, coolant can be set in loading platform 110
Body groove, the cooling liquid in cooling circuit 370 flows through from cooling liquid groove, to take away the heat on loading platform 110；Wherein
Cooling liquid groove can be the unidirectional groove of the scope for covering whole loading platform 110, or along chip assembly distribution side
To the groove for arranging, or arrange in a zigzag.
Main valve 320 is arranged on the cooling circuit between the liquid outlet of cooling liquid supply machine 310 and loading platform 110
On 370, and it is connected with computer disposal subsystem 500, to be opened and be closed under the control of computer disposal subsystem 500
Close.Can suspend or open the circulation of cooling liquid by main valve 320；In embodiment of the present invention, main valve 320 can be adopted
Electromagnetic valve.
Wherein, cooling subsystem 300 also includes effusion meter 330, and effusion meter 330 is arranged on cooling liquid supply machine 310
On cooling circuit 370 between liquid inlet and loading platform 110, and it is connected with computer disposal subsystem 500, by measurement
Data on flows is sent to computer disposal subsystem 500.The excessive adapter that can be caused on cooling circuit 370 of cooling liquid flow
Part bears incessantly larger pressure, if cooling liquid flow is less, in time can not take away chip assembly heat again.It is of the invention real
Apply mode by effusion meter 330 can monitor in real time cooling circuit 370 fluid flow, when the fluid flow of cooling circuit 370 it is different
Often, can be closed by the control bound door 320 of computer disposal subsystem 500, while controlling the electric current output of test failure of current.Stream
Gauge 330 can be turbine or propeller flowmeter 330.Turbine flowmeter 330 feeds back with voltage signal, a certain voltage signal correspondence
Determine the flow of numerical value, computer disposal subsystem 500 can accurately be read simply by data collecting card.
Wherein, cooling subsystem 300 also includes coolant quality detector 340, and coolant quality detector 340 is arranged on
Cooling liquid supply machine 310 liquid inlet and loading platform 110 between cooling circuit 370 on, and with computer disposal subsystem
System 500 connects, and the coolant qualitative data of measurement is sent to computer disposal subsystem 500.When the quality of coolant surpasses
Specification is crossed, as extremely, impurity excess in cooling liquid is can determine whether, possible fouling simultaneously blocks cooling circuit 370；The present invention is implemented
Mode can as needed, when the quality of coolant exceedes predetermined value, using the control bound door of computer disposal subsystem 500
320 close, while controlling the electric current output of test failure of current.
Wherein, coolant qualitative data includes pH value and electrical conductivity；I.e. coolant quality detector 340 can be that pH value is surveyed
Amount instrument or conductance instrument.
Wherein, cooling subsystem 300 also includes filter 350, and filter 350 is arranged on main valve 320 and cooling liquid
On cooling circuit 370 between the liquid outlet of supply machine 310.By the filtration of filter 350 so that cooling liquid is relatively dry
Only, the risk that long-term work causes pipeline blockage is reduced.Embodiment of the present invention is by filter 350 and coolant Quality Detection
Instrument 340 is used cooperatively, and can substantially reduce the risk of pipeline blockage.
Wherein, such as Fig. 3, when multiple loading platforms 110 are provided with test cabinet 100, can also main valve 320 with it is multiple
Flow divider 360 is set between loading platform 110, and cooling liquid flows to respectively multiple loading platforms 110 by flow divider 360；Its
In, the temperature probe 410 for measuring chilled liquid temperature is arranged in flow divider 360.
Wherein, such as Fig. 4, the test system of embodiment of the present invention also includes airborne particle counter 700, is arranged on test
In cabinet 100, and it is connected with computer disposal subsystem 500, for monitoring the air purity in test cabinet 100, and by air
Cleanliness factor result is sent to computer disposal subsystem 500, computer disposal subsystem 500 according to air purity result, to
Test power supply 200 sends corresponding control instruction.
When granule is too many in air, the chip assembly light emitting end surface pollution for working is easily caused, the present invention is implemented
Mode measures the amounts of particles in air in test cabinet 100 by arranging airborne particle counter 700 in test cabinet 100, with
Judge air purity in test cabinet 100, when air purity is abnormal in test cabinet 100, computer disposal subsystem 500 can
To test power supply 200 send corresponding control instruction, to avoid test process in cause semiconductor laser chip component accident
Failure, and then reduce loss.
Wherein, computer disposal subsystem 500 sends corresponding control according to air purity result to test power supply 200
System instruction, including：
When air purity results abnormity, computer disposal subsystem 500 to test power supply 200 sends cut-out instruction,
So that test power supply 200 stops providing test electric current to chip assembly.
Wherein, the test system of embodiment of the present invention also includes air filter 800, to provide to test cabinet 100
Clean air.By arranging air filter 800, it is ensured that the internal medium with high air purity in test cabinet 100,
The air purity in test cabinet 100 can be made up to hundred grades.
Wherein, air filter 800 is arranged on the top of test cabinet 100, and clean air is provided downwards；Air particles are counted
Device 700 is arranged on the bottom of test cabinet 100.Air flow in test cabinet 100 is basipetal, relative to test cabinet 100 outside
The air in face, the air of the inside of test cabinet 100 is malleation, and bottom has air outlet outward, to ensure test cabinet 100 in have
The internal medium of high air purity.
Wherein, such as Fig. 5, airborne particle counter 700 is two, is separately positioned on the both sides of the bottom of test cabinet 100.When it
In airborne particle counter 700 monitor air purity it is abnormal when, that is, judge that the air purity in test cabinet 100 is different
Often.It should be understood that in other embodiment of the present invention, more than three can be arranged in test cabinet 100 as needed
Airborne particle counter 700.
Wherein, the test system of embodiment of the present invention also includes alert sub-system 600, alert sub-system 600, with calculating
Machine processing subsystem 500 connects, when computer disposal subsystem 500 sends cut-out instruction to test power supply 200, at computer
The reason control alert sub-system 600 of subsystem 500 sends alarm.
Embodiment of the present invention arranges alert sub-system 600, when test environment or test system occur abnormal, by meter
The control alert sub-system 600 of calculation machine processing subsystem 500 sends alarm, to remind operator.
The alert sub-system 600 of embodiment of the present invention may include warning light 610 and buzzer, and warning light 610 may include
Tri coloured lantern group with three kinds of different colours light, the different aspects of tri coloured lantern group represent respectively the different shape of test system
State, buzzer primarily serves alarm function.Tri coloured lantern group includes blue lamp, amber light and red colored lamp；Wherein, in tri coloured lantern if
There is exception in the bright expression system of red colored lamp, if the bright system that represents of blue lamp is in good condition, in holding state, if amber light
The bright system that represents is in good condition, in normal test operation state.Buzzer can be fixedly installed in tri coloured lantern group.
Wherein, in embodiment of the present invention, when computer disposal subsystem 500 sends cut-out instruction to test power supply 200
When, that is, when monitoring abnormal, computer disposal subsystem 500 sends failure code to corresponding personnel by mail, with convenient
Operator carry out malfunction elimination to equipment in time.
The computer disposal subsystem 500 of embodiment of the present invention includes industrial computer, data collecting card, multifunctional control board
Card, computer disposal subsystem 500 is by coordinating control test power supply 200, cooling subsystem 300, monitoring temperature subsystem
400th, airborne particle counter 700 etc., the data for collecting are processed, analyzed, calculated, finally by data drawing list side
Formula shows, once monitoring is abnormal, it will and accordingly protected, and triggered warning, while event can be sent automatically by mail
Barrier information, reminds in time relevant staff to be processed.
Embodiments of the present invention are the foregoing is only, the scope of the claims of the present invention is not thereby limited, it is every using this
Equivalent structure or equivalent flow conversion that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other correlations
Technical field, is included within the scope of the present invention.
Claims (18)
1. a kind of test system of semiconductor laser chip, it is characterised in that include：
Test cabinet, it includes loading platform, and multiple chip assemblies to be tested are placed on the loading platform；
Test power supply, to the plurality of chip assembly to be tested test electric current is provided；
Cooling subsystem, for providing circulating cooling liquid to the loading platform, is provided with the test as the chip assembly
Reliable and stable temperature；
Monitoring temperature subsystem, for monitoring the temperature of the loading platform and circulating cooling liquid；
Computer disposal subsystem, is connected respectively with the test power supply, cooling subsystem and monitoring temperature subsystem, to
Control the cooling subsystem and the circulating cooling liquid with reliable and stable temperature is provided, and according to the monitoring temperature subsystem
The result for being monitored, to the test power supply corresponding control instruction is sent.
2. test system according to claim 1, it is characterised in that the computer disposal subsystem is according to the temperature
The result that Monitor And Control Subsystem is monitored, to the test power supply corresponding control instruction is sent, including：
When the monitoring temperature subsystem monitors are to temperature anomaly, the computer disposal subsystem to the test power supply is sent out
Go out cut-out instruction, so that the test power supply stops providing test electric current to the chip assembly.
3. test system according to claim 1, it is characterised in that the monitoring temperature subsystem includes being arranged on described
Temperature probe on loading platform, for detecting the temperature of the loading platform.
4. test system according to claim 3, it is characterised in that the temperature probe is three, respectively along the core
The direction of piece components distribution is arranged on the diverse location on the loading platform.
5. test system according to claim 1, it is characterised in that the cooling subsystem includes：
Cooling liquid supplies machine, for providing and reclaiming circulating cooling liquid, and is connected with the computer disposal subsystem；
Cooling circuit, its two ends connect respectively the cooling liquid supply machine, and the loading platform is arranged on the cooling circuit
On；
Main valve, the cooling circuit being arranged between the liquid outlet of the cooling liquid supply machine and the loading platform
On, and be connected with the computer disposal subsystem, to be opened and be closed under the control of the computer disposal subsystem
Close.
6. test system according to claim 5, it is characterised in that the cooling subsystem is further included：
Effusion meter, the cooling circuit being arranged between the liquid inlet of the cooling liquid supply machine and the loading platform
On, and be connected with the computer disposal subsystem, the data on flows of measurement is sent to the computer disposal subsystem.
7. test system according to claim 5, it is characterised in that the cooling subsystem is further included：
Coolant quality detector, is arranged on described between the liquid inlet of the cooling liquid supply machine and the loading platform
On cooling circuit, and it is connected with the computer disposal subsystem, is sent in terms of described by the coolant qualitative data by measurement
Calculation machine processing subsystem.
8. test system according to claim 7, it is characterised in that the coolant qualitative data includes pH value and conductance
Rate.
9. test system according to claim 7, it is characterised in that the cooling subsystem is further included：
Filter, is arranged on the cooling circuit between the liquid outlet of the main valve and cooling liquid supply machine.
10. test system according to claim 5, it is characterised in that monitoring temperature subsystem includes being arranged on the master
The temperature probe on the cooling circuit between valve and the loading platform, for measuring the temperature of circulating cooling liquid.
11. test systems according to claim 10, it is characterised in that the test cabinet includes that multiple described loadings are put down
Platform, the cooling subsystem further includes flow divider, and the flow divider is arranged on the main valve and loads flat with the plurality of
Between platform, the temperature probe is arranged in the flow divider.
12. test systems according to any one of claim 1 to 11, it is characterised in that further include：
Airborne particle counter, in being arranged on the test cabinet, and is connected, for monitoring with the computer disposal subsystem
The air purity in test cabinet is stated, and air purity result is sent to the computer disposal subsystem, the calculating
Machine processing subsystem sends corresponding control instruction according to the air purity result to the test power supply.
13. test systems according to claim 12, it is characterised in that the computer disposal subsystem is according to the sky
Gas cleanliness factor result, to the test power supply corresponding control instruction is sent, including：
When the air purity results abnormity, the computer disposal subsystem sends cut-out and refers to the test power supply
Order, so that the test power supply stops providing test electric current to the chip assembly.
14. test systems according to right wants 13, it is characterised in that further include：
Alert sub-system, is connected with the computer disposal subsystem, when computer disposal subsystem is sent out to the test power supply
When going out cut-out instruction, alert sub-system described in the computer disposal subsystem controls sends alarm.
15. test systems according to claim 13, it is characterised in that when computer disposal subsystem is to the test electricity
When source sends cut-out instruction, the computer disposal subsystem sends failure code to corresponding personnel by mail.
16. test systems according to claim 12, it is characterised in that further include：
Air filter, to provide clean air to the test cabinet.
17. test systems according to claim 16, it is characterised in that the air filter is arranged on the test cabinet
Top, provides downwards clean air；The airborne particle counter is arranged on the test cabinet bottom.
18. test systems according to claim 17, it is characterised in that the airborne particle counter is two, respectively
It is arranged on the both sides of the test cabinet bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710044814.9A CN106597263A (en) | 2017-01-20 | 2017-01-20 | Test system of semiconductor laser chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710044814.9A CN106597263A (en) | 2017-01-20 | 2017-01-20 | Test system of semiconductor laser chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106597263A true CN106597263A (en) | 2017-04-26 |
Family
ID=58585839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710044814.9A Pending CN106597263A (en) | 2017-01-20 | 2017-01-20 | Test system of semiconductor laser chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106597263A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107102253A (en) * | 2017-05-10 | 2017-08-29 | 深圳瑞波光电子有限公司 | Test equipment and its to electric tool |
| CN108168844A (en) * | 2017-12-26 | 2018-06-15 | 大族激光科技产业集团股份有限公司 | Laser ageing device and aging method |
| CN108663549A (en) * | 2018-05-28 | 2018-10-16 | 深圳瑞波光电子有限公司 | A kind of positioning device and test system |
| CN109870644A (en) * | 2019-04-03 | 2019-06-11 | 苏州联讯仪器有限公司 | Reliability test equipment for high-power laser chip |
| CN111766494A (en) * | 2020-06-18 | 2020-10-13 | 清华大学 | Semiconductor device testing device with protection function and method |
| CN111948513A (en) * | 2020-07-24 | 2020-11-17 | 武汉锐科光纤激光技术股份有限公司 | Chip temperature control equipment |
| CN112798930A (en) * | 2020-12-29 | 2021-05-14 | 深圳市利拓光电有限公司 | Temperature and humidity compensation system for semiconductor laser chip detection |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001317883A (en) * | 2000-05-08 | 2001-11-16 | Aquas Corp | Method for treating open circulating cooling water system |
| CN102062675A (en) * | 2010-12-16 | 2011-05-18 | 西安炬光科技有限公司 | Device for testing life of semiconductor laser |
| CN102072870A (en) * | 2009-11-20 | 2011-05-25 | 苏州华达仪器设备有限公司 | Dust granule counter |
| CN102520336A (en) * | 2011-12-20 | 2012-06-27 | 西安炬光科技有限公司 | Protection system for aging and life test of semiconductor laser |
| CN103926052A (en) * | 2014-04-30 | 2014-07-16 | 工业和信息化部电子第五研究所 | Laser service life testing system |
| CN203950220U (en) * | 2014-06-17 | 2014-11-19 | 广州赛宝仪器设备有限公司 | Semiconductor laser test system environment temperature control equipment |
| CN104880298A (en) * | 2015-05-15 | 2015-09-02 | 北京光电技术研究所 | Semiconductor laser testing system |
| CN105047061A (en) * | 2015-08-03 | 2015-11-11 | 中国南方电网有限责任公司超高压输电公司贵阳局 | Simulation research device of in-valve cooling system of high voltage current power transmission system |
| CN206546413U (en) * | 2017-01-20 | 2017-10-10 | 深圳清华大学研究院 | A kind of test system of semiconductor laser chip |
-
2017
- 2017-01-20 CN CN201710044814.9A patent/CN106597263A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001317883A (en) * | 2000-05-08 | 2001-11-16 | Aquas Corp | Method for treating open circulating cooling water system |
| CN102072870A (en) * | 2009-11-20 | 2011-05-25 | 苏州华达仪器设备有限公司 | Dust granule counter |
| CN102062675A (en) * | 2010-12-16 | 2011-05-18 | 西安炬光科技有限公司 | Device for testing life of semiconductor laser |
| CN102520336A (en) * | 2011-12-20 | 2012-06-27 | 西安炬光科技有限公司 | Protection system for aging and life test of semiconductor laser |
| CN103926052A (en) * | 2014-04-30 | 2014-07-16 | 工业和信息化部电子第五研究所 | Laser service life testing system |
| CN203950220U (en) * | 2014-06-17 | 2014-11-19 | 广州赛宝仪器设备有限公司 | Semiconductor laser test system environment temperature control equipment |
| CN104880298A (en) * | 2015-05-15 | 2015-09-02 | 北京光电技术研究所 | Semiconductor laser testing system |
| CN105047061A (en) * | 2015-08-03 | 2015-11-11 | 中国南方电网有限责任公司超高压输电公司贵阳局 | Simulation research device of in-valve cooling system of high voltage current power transmission system |
| CN206546413U (en) * | 2017-01-20 | 2017-10-10 | 深圳清华大学研究院 | A kind of test system of semiconductor laser chip |
Non-Patent Citations (1)
| Title |
|---|
| 艾明泽 等: "《化学计量培训教程》", 30 September 2016 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107102253A (en) * | 2017-05-10 | 2017-08-29 | 深圳瑞波光电子有限公司 | Test equipment and its to electric tool |
| CN108168844A (en) * | 2017-12-26 | 2018-06-15 | 大族激光科技产业集团股份有限公司 | Laser ageing device and aging method |
| CN108663549A (en) * | 2018-05-28 | 2018-10-16 | 深圳瑞波光电子有限公司 | A kind of positioning device and test system |
| CN108663549B (en) * | 2018-05-28 | 2024-03-26 | 深圳瑞波光电子有限公司 | Positioning device and testing system |
| CN109870644A (en) * | 2019-04-03 | 2019-06-11 | 苏州联讯仪器有限公司 | Reliability test equipment for high-power laser chip |
| CN111766494A (en) * | 2020-06-18 | 2020-10-13 | 清华大学 | Semiconductor device testing device with protection function and method |
| CN111766494B (en) * | 2020-06-18 | 2022-06-28 | 清华大学 | Semiconductor device testing device with protection function and method |
| CN111948513A (en) * | 2020-07-24 | 2020-11-17 | 武汉锐科光纤激光技术股份有限公司 | Chip temperature control equipment |
| CN112798930A (en) * | 2020-12-29 | 2021-05-14 | 深圳市利拓光电有限公司 | Temperature and humidity compensation system for semiconductor laser chip detection |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106597263A (en) | Test system of semiconductor laser chip | |
| CN206546413U (en) | A kind of test system of semiconductor laser chip | |
| CN107942283A (en) | A kind of automatic calibration of electric energy meter assembly line condition monitoring system and method | |
| KR20140130545A (en) | Method and system for real time dry low nitrogen oxide (dln) and diffusion combustion monitoring | |
| US6959585B2 (en) | Skids, modules, and modular system for monitoring hydrogen-cooled generators | |
| CA3009773A1 (en) | Prognostic and health monitoring systems for light fixtures | |
| CN106597264A (en) | Testing system for semiconductor laser chip | |
| CN207336353U (en) | A kind of Gases Dissolved in Transformer Oil on-Line Monitor Device | |
| CN206546412U (en) | A kind of test system of semiconductor laser chip | |
| CN108918768A (en) | Cable macromolecular gas detecting system | |
| CN103926052A (en) | Laser service life testing system | |
| CN104121216B (en) | A kind of intelligent type energy saving impulse fan system and operation method thereof | |
| CN106768018B (en) | Site installs the on-line monitoring and diagnostic system and method for second power equipment | |
| CN202693564U (en) | Comprehensive sulfur hexafluoride gas detection device | |
| CN110488125A (en) | Amount of state information based on breaker realizes the method and its system of active forewarning processing | |
| CN206161046U (en) | Electric power oil -filled equipment stores up respirator on -line monitoring device for oil tank | |
| CN207649765U (en) | A kind of laser power meter protective device and Laser Power Measuring System | |
| CN208297505U (en) | A kind of online monitoring system for oil quality of lubricant in steam turbine | |
| CN215421397U (en) | Air supply pipeline air volume monitoring and alarming device of MT4400 type mining dump truck | |
| CN205383902U (en) | Fritting furnace and cooling system thereof | |
| CN207703486U (en) | A kind of monitoring system of engine rig test room auxiliary equipment | |
| CN205720633U (en) | A kind of electric energy meter calibration streamline current source malfunction monitoring prior-warning device | |
| CN206559701U (en) | A kind of navaid loop fault register control and voyage aid of the airport lamp control system | |
| CN106774067B (en) | A kind of short circuit monitoring system and method for link of powering | |
| CN217385207U (en) | Gas detector overhauls device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170426 |