CN112362919A - KGS test fixture structure of multi-chip TSV silicon-based component - Google Patents
KGS test fixture structure of multi-chip TSV silicon-based component Download PDFInfo
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- CN112362919A CN112362919A CN202011250606.2A CN202011250606A CN112362919A CN 112362919 A CN112362919 A CN 112362919A CN 202011250606 A CN202011250606 A CN 202011250606A CN 112362919 A CN112362919 A CN 112362919A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
Abstract
The invention provides a KGS test fixture structure of a multi-chip TSV silicon-based component, which comprises a test cover plate and a test socket, wherein the test cover plate is used for clamping the TSV silicon-based component; a silicon-based fixed elastic pressing block unit is arranged in the test cover plate and used for fixing bare chips with different heights; a floating substrate is arranged in the test socket, the TSV silicon-based assembly is clamped between the silicon-based fixed elastic pressing block unit and the floating substrate, and fixing of bare chips with different heights in the TSV silicon-based assembly in the KGS test fixture structure is achieved; this simple structure can match not the chip of co-altitude, avoids silicon substrate assembly to go up the uneven phenomenon of chip pressure, eliminates silicon substrate edge unilateral atress simultaneously and leads to the broken risk of pressurized.
Description
Technical Field
The invention relates to the field of KGS testing of multi-chip TSV silicon-based components in a micro system, in particular to a KGS testing clamp structure of a multi-chip TSV silicon-based component.
Background
In recent years, high-density integration methods such as MCM, SOC, and SIP have been widely used in response to the demand for miniaturization, high performance, and high reliability of electronic equipment. Since these packaging forms integrate a large number of chips in a small space and various stacking, reversing and other processes are adopted in the assembly process, these tests bring a serious test to the yield of the product. Most of the chips are bare chips which are not packaged and separated, the chips have different sizes, various functions, various types and various layout structures, and a uniform clamp cannot be adopted for testing and experiments, so the testing and aging screening of the bare chips are a technical problem. It is Known that a Good chip (KGD) mainly aims at the problem, tests such as function test, parameter test, aging screening and the like are carried out on a bare chip, the chip with the early failure defect is screened out, the quality and the reliability of the finally selected chip are ensured to meet the requirements of the quality and the reliability of a packaged finished product, and therefore the quality and the reliability of the bare chip in MCM, SOC and SIP are solved.
The microsystem is a software and hardware integrated system-level product which utilizes a high-function density integration technology, has typical characteristics of microminiaturization, intellectualization and the like, integrates various disciplines of electricity, machinery, thermal, materials science, optics, Micro Electro Mechanical Systems (MEMS) and the like, and has functions of sensing, communication, processing, execution, energy management and the like. With the development of microelectronics entering the age of nano-electronics/integrated microsystems, the MCM, SOC and SIP technologies of the traditional stacking and reversing process cannot meet the requirement of higher integration level, and the fourth generation packaging technology of ultrahigh density three-dimensional stacking, namely TSV technology, can be applied to microsystems more and more widely. Microsystem integration technology based on TSV three-dimensional stacking is widely considered as an effective way to break through Moore's law.
Besides the common packaging forms of stacking, reversing and the like, the chips in the microsystem are welded through the TSV silicon transfer substrate. The traditional KGD technology can only solve the test screening of bare chips, and how to carry out screening test on TSV silicon-based components containing the bare chips in a microsystem product is of great importance in improving the assembly yield of the microsystem product. KGS (Known as Good stacking) is an effective means for solving this problem, and it is assembled on a substrate for further 2.5D/3D integration, which can greatly improve the yield of a microsystem. In KGS test procedure, because silicon substrate material is brittle material, it is a difficult problem how to ensure that the silicon substrate is not pressed the breakage, especially to the TSV silicon substrate subassembly that has a plurality of bare chips of welding, still there is the problem that the multichip highly differs can't match the test apron and lead to the uneven chip damage probability that increases of chip atress.
Disclosure of Invention
The KGS test fixture structure of the multi-chip TSV silicon substrate assembly is simple in structure, can be matched with chips with different heights, avoids the phenomenon that the chips on the silicon substrate assembly are uneven in pressure, and meanwhile eliminates the risk of pressure crushing caused by single-side stress of the edge of the silicon substrate.
The invention is realized by the following technical scheme:
a KGS test fixture structure of a multi-chip TSV silicon-based assembly comprises a test cover plate and a test socket, wherein the test cover plate is used for clamping the TSV silicon-based assembly; a silicon-based fixed elastic pressing block unit is arranged in the test cover plate and used for fixing bare chips with different heights; the floating substrate is arranged in the test socket, the TSV silicon-based assembly is clamped between the silicon-based fixed elastic pressing block unit and the floating substrate, and accordingly fixing of bare chips with different heights in the TSV silicon-based assembly in the KGS test fixture structure is achieved.
Preferably, the silicon-based fixed elastic pressing block unit comprises a plurality of springs and a floating pressing block; a plurality of spring grooves are arranged in the floating pressing block; a plurality of springs are correspondingly placed in the spring grooves, the top of the floating pressing block is connected with the testing cover plate through the springs, and the bottom of the floating pressing block is pressed on the bare chip of the TSV silicon-based assembly.
Furthermore, a plurality of floating pressing blocks are arranged on the same plane.
Further, the number and shape of the floating compacts are arranged corresponding to the number and shape of the bare chips.
Furthermore, a plurality of protection units are arranged at the bottom ends of the floating pressing blocks and used for protecting bare chips on the TSV silicon-based component.
Furthermore, the number and the shape of the protection units correspond to those of the floating pressing blocks.
Furthermore, the material of the protection unit is Teflon material.
Furthermore, the silicon-based fixed elastic pressing block unit further comprises a silicon-based fixed pressing block, a fixed hole is formed in the silicon-based fixed pressing block, and the plurality of floating pressing blocks are fixedly placed in the fixed hole.
Furthermore, a silicon-based fixed pressing block protection unit is arranged at the bottom end of the silicon-based fixed pressing block, a protection hole corresponding to the bare chip on the TSV silicon-based component is formed in the silicon-based fixed pressing block protection unit, and the silicon-based fixed pressing block protection unit is made of Teflon materials.
Preferably, the floating substrate is provided with a groove, and the TSV silicon-based component is placed in the groove.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention provides a KGS test fixture structure of a multi-chip TSV silicon-based assembly, which is characterized in that a silicon-based fixed elastic pressing block unit is arranged in a test cover plate, the TSV silicon-based assembly is clamped on a floating substrate arranged in a test socket, meanwhile, due to the fact that the silicon-based fixed elastic pressing block unit is provided with an elastic piece, chips with different heights can be fixed, meanwhile, even pressure can be applied to the chips, meanwhile, the risk that the edges of the silicon-based plate are pressed to be broken due to the fact that the edges of the silicon-based plate are pressed to be single-sided is avoided, and the KGS test.
Furthermore, the silicon-based fixed elastic pressing block unit comprises a plurality of springs and a floating pressing block; a plurality of springs are arranged in the floating pressing block, and the number and the rigidity of the springs are designed according to the number and the pressure of the probes covered by each bare chip; when the test cover plate is locked, the height of the floating press block can be adjusted, the chip is buffered, and the matching performance of the bare chip in the TSV silicon-based assembly is effectively improved.
Furthermore, the floating press blocks are arranged on the same plane, so that the bare chip in the TSV silicon-based component is uniformly pressed, and the breakage of the bare chip due to nonuniform pressing is avoided.
Furthermore, the number and the shape of the floating pressing blocks are correspondingly arranged with the number and the shape of the bare chips, so that the bare chips with different heights in the TSV silicon-based assembly are correspondingly clamped by the floating pressing blocks.
Furthermore, a plurality of protection units are arranged at the bottom ends of the floating press blocks and used for protecting the bare chips on the TSV silicon-based component and preventing the floating press blocks from pressing the bare chips to break.
Preferably, the number and the shape of the protection units correspond to those of the floating pressing blocks, so that the protection performance of the bare chip on the TSV silicon-based component is improved, and the bare chip is prevented from being crushed.
Preferably, the protection unit is made of a teflon material, the teflon material is elastic and durable, the protection performance of the bare chip is effectively improved, and the TSV silicon-based component is prevented from being scratched and damaged in the test process.
Furthermore, the silicon-based fixed elastic pressing block unit further comprises a silicon-based fixed pressing block, the silicon-based fixed pressing block is fixedly arranged on the floating pressing blocks, the floating pressing blocks are prevented from falling off, and meanwhile, the silicon substrate on the edge of the chip is pressed in the pressing mode, and unilateral stress is avoided.
Preferably, a silicon-based fixed pressing block protection unit is arranged at the bottom end of the silicon-based fixed pressing block, so that the risk of crushing due to stress on one side of the edge of the silicon-based plate is effectively eliminated.
Furthermore, the position of the TSV silicon-based component is effectively fixed in the floating substrate, the TSV silicon-based component is effectively clamped, and the reliability of KGS testing of the multi-chip TSV silicon-based component is greatly improved.
Drawings
FIG. 1 is a schematic structural diagram of a KGS test fixture for a multi-chip TSV silicon-based module according to the present invention;
FIG. 2 is a cross-sectional view of a KGS test fixture for a multi-chip TSV silicon-based module in accordance with the present invention;
FIG. 3 is a bottom view of the structure of the test cover of the present invention;
FIG. 4 is an exploded view of the test lid in an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a test socket according to an embodiment of the present invention;
FIG. 6 is a front view of the structure of the multi-chip TSV silicon-based assembly in an embodiment of the present invention;
FIG. 7 is a side view of the structure of the multi-chip TSV silicon-based assembly in an embodiment of the invention.
In the figure: 1-testing the cover plate; 2-test socket; 3-a spring; 4-a first floating briquette; 5-a second floating briquette; 6-a third floating briquette; 7-silicon-based fixed pressing block; 8-TSV silicon-based components; 9-a floating substrate; 10-a first protection unit; 11-a second protection unit; 12-a third protection unit; 13-silicon-based fixed pressing block protection unit; 81-a first die; 82-a second die; 83-a third die; 84-silicon substrate.
Detailed Description
The present invention will now be described in further detail with reference to specific examples, which are intended to be illustrative, but not limiting, of the invention.
The invention provides a KGS test fixture structure of a multi-chip TSV silicon-based component, which comprises a test cover plate 1 and a test socket 2, wherein the test cover plate 1 is used for clamping a TSV silicon-based component 8; a silicon-based fixed elastic pressing block unit is arranged in the test cover plate 1 and used for fixing bare chips with different heights; the floating substrate 9 is arranged in the test socket 2, the TSV silicon-based component 8 is clamped between the silicon-based fixed elastic pressing block unit and the floating substrate 9, and the fixing of bare chips with different heights in the TSV silicon-based component 8 in the KGS test fixture structure is achieved.
As shown in fig. 2 and 3, the silicon-based fixed elastic pressing block unit includes a plurality of springs 3 and a floating pressing block; a plurality of spring grooves are arranged in the floating pressing block; a plurality of spring 3 corresponds places in the spring inslot, and the briquetting top that floats is passed through spring 3 and is connected the setting with test apron 1, and the bottom is pressed and is set up on TSV silicon-based subassembly 8's bare chip, and wherein a plurality of briquetting that floats all sets up on the coplanar for bare chip receives even pressure in TSV silicon-based subassembly 8, avoids because of the crushing of bare chip pressurized inhomogeneous.
The bottom ends of the floating press blocks are provided with a plurality of protection units for protecting bare chips on the TSV silicon-based component 8 and preventing the floating press blocks from pressing the bare chips to break.
In the invention, the number and the shape of the floating press blocks are arranged corresponding to the number and the shape of the bare chips, so that the bare chips with different heights in the TSV silicon-based component 8 are clamped by the floating press blocks correspondingly; the number and the shape of the protection units correspond to those of the floating pressing blocks, so that the protection performance of the bare chips on the TSV silicon-based component 8 is improved, and the bare chips are prevented from being crushed.
The silicon-based fixed elastic pressing block unit further comprises a silicon-based fixed pressing block 7, a fixed hole is formed in the silicon-based fixed pressing block 7, and the plurality of floating pressing blocks are fixedly placed in the fixed hole. The bottom end of the silicon-based fixed pressing block 7 is provided with a silicon-based fixed pressing block protection unit 13, and a protection hole corresponding to the bare chip on the TSV silicon-based component 8 is formed in the silicon-based fixed pressing block protection unit 13; the risk that the edge of the silicon substrate is stressed on one side to cause pressure fracture is effectively eliminated.
According to the invention, the silicon-based fixed pressing block protection unit 13 and the protection unit are made of Teflon materials, the Teflon materials have elasticity and are durable, the protection performance of a bare chip is effectively improved, and the TSV silicon-based component is prevented from being scratched and damaged in the test process. .
Examples
The invention provides a KGS test fixture structure of a multi-chip TSV silicon-based assembly, wherein the TSV silicon-based assembly 8 is clamped between a silicon-based fixed elastic pressing block unit and a floating substrate 9, and the silicon-based fixed elastic pressing block unit is arranged in a test cover plate 1 and used for fixing bare chips with different heights; a floating substrate 9 is arranged in the test socket 2, the floating substrate 9 is provided with a groove, and the TSV silicon-based components 8 are placed in the groove, as shown in FIG. 5;
TSV silicon-based assembly 8 includes a silicon substrate 84 and three chips of different heights disposed on silicon substrate 84, respectively, a first die 81, a second die 82, and a third die 83, as shown in fig. 6 and 7; the silicon substrate 84 is a thin silicon wafer material with the thickness of 0.22mm, has the characteristics of brittleness and difficult extension, the edge position belongs to the single-side stress of a test needle during testing, the edge of the silicon substrate is easy to break under the single-side stress, and the silicon substrate fixed pressing block 7 is pressed on the silicon substrate 84 and is used for pressing the silicon substrate at the edge of a chip to avoid the single-side stress;
the number and shape of the floating press blocks in the silicon-based fixed elastic press block unit are arranged corresponding to the number and shape of the bare chips, as shown in fig. 4, the plurality of floating press blocks comprise a first floating press block 4, a second floating press block 5 and a third floating press block 6, and the first floating press block 4, the second floating press block 5 and the third floating press block 6 are connected with the test cover plate 1 through a plurality of springs 3; the number and rigidity of the springs 3 are designed according to the number and pressure of the probes covered by each bare chip; the first floating pressing block 4, the second floating pressing block 5 and the third floating pressing block 6 are arranged on the same plane; the bottom of the first floating pressing block 4, the second floating pressing block 5 and the third floating pressing block 6 are connected with a plurality of protection units through screws, wherein the number and the shape of the protection units correspond to those of the floating pressing blocks, so that the protection units comprise a first protection unit 10, a second protection unit 11 and a third protection unit 12, the protection performance of the first bare chip 81, the second bare chip 82 and the third bare chip 83 is improved, and the bare chips are prevented from being crushed due to pressure.
The silicon-based fixed pressing block 7 is fixedly arranged on the first floating pressing block 4, the second floating pressing block 5 and the third floating pressing block 6, and is prevented from falling off, the silicon-based fixed pressing block protection unit 13 is arranged at the bottom end of the silicon-based fixed pressing block 7, and meanwhile, the silicon substrate 84 at the edges of the first bare chip 81, the second bare chip 82 and the third bare chip 83 is pressed in to avoid single-side stress, so that the chips are damaged.
In this embodiment, the first floating pressing block 4, the second floating pressing block 5 and the third floating pressing block 6 are pressed onto the first bare chip 81, the second bare chip 82 and the third bare chip 83 with different heights, the height and the pressure are adjusted through the spring 3, the chips with different heights can be matched to avoid the phenomenon of uneven chip pressure on the silicon-based module, meanwhile, the risk that the stress on the edge of the silicon substrate 84 is broken due to unilateral stress can be eliminated, and the reliability of KGS test of the multi-chip TSV silicon-based module is greatly improved.
Claims (10)
1. A KGS test fixture structure of a multi-chip TSV silicon-based assembly is characterized by comprising a test cover plate (1) and a test socket (2), wherein the test cover plate is used for clamping the TSV silicon-based assembly (8); a silicon-based fixed elastic pressing block unit is arranged in the test cover plate (1) and is used for fixing bare chips with different heights; the testing socket (2) is internally provided with a floating substrate (9), the TSV silicon-based component (8) is clamped between the silicon-based fixed elastic pressing block unit and the floating substrate (9), and the fixation of bare chips with different heights in the TSV silicon-based component (8) in the KGS testing clamp structure is realized.
2. The KGS test fixture structure of a multi-chip TSV silicon-based assembly as claimed in claim 1, wherein said silicon-based fixed elastic pressing block unit comprises a plurality of springs (3) and a floating pressing block; a plurality of spring grooves are formed in the floating pressing block; the springs (3) are correspondingly placed in the spring grooves, the top of the floating pressing block is connected with the test cover plate (1) through the springs (3), and the bottom of the floating pressing block is pressed on the bare chip of the TSV silicon-based assembly (8).
3. The KGS test fixture structure of multi-chip TSV silicon-based components of claim 2, wherein the floating compacts are all disposed on a same plane.
4. The KGS test fixture structure of a multi-chip TSV silicon-based assembly of claim 2, wherein the number and shape of the floating compacts are arranged corresponding to the number and shape of the bare chips.
5. The KGS test fixture structure of multi-chip TSV silicon-based components as claimed in claim 2, wherein a plurality of protection units are disposed at bottom ends of a plurality of floating compacts for protecting bare chips on the TSV silicon-based components (8).
6. The KGS test fixture structure of multi-chip TSV silicon-based components of claim 5, wherein the number and shape of the protection units are arranged corresponding to the number and shape of the floating compacts.
7. The KGS test fixture structure of multi-chip TSV silicon-based components of claim 5, wherein the protection unit is made of Teflon.
8. The KGS test fixture structure of multi-chip TSV silicon-based assembly as claimed in claim 2, wherein said silicon-based fixed elastic pressing block unit further comprises a silicon-based fixed pressing block (7), said silicon-based fixed pressing block (7) is provided with a fixed hole therein, and a plurality of floating pressing blocks are fixedly disposed in the fixed hole.
9. The KGS test fixture structure of the multi-chip TSV silicon-based component as claimed in claim 8, wherein a silicon-based fixed pressing block protection unit (13) is disposed at a bottom end of the silicon-based fixed pressing block (7), a protection hole corresponding to a bare chip on the TSV silicon-based component (8) is disposed in the silicon-based fixed pressing block protection unit (13), and the silicon-based fixed pressing block protection unit (13) is made of Teflon material.
10. The KGS test fixture structure of multi-chip TSV silicon-based components as claimed in claim 1, characterized in that said floating substrate (9) is provided with a recess in which the TSV silicon-based components (8) are placed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011250606.2A CN112362919A (en) | 2020-11-10 | 2020-11-10 | KGS test fixture structure of multi-chip TSV silicon-based component |
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| CN202011250606.2A CN112362919A (en) | 2020-11-10 | 2020-11-10 | KGS test fixture structure of multi-chip TSV silicon-based component |
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| CN112362919A true CN112362919A (en) | 2021-02-12 |
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| CN202011250606.2A Pending CN112362919A (en) | 2020-11-10 | 2020-11-10 | KGS test fixture structure of multi-chip TSV silicon-based component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115128312A (en) * | 2022-07-14 | 2022-09-30 | 法特迪精密科技（苏州）有限公司 | Distributed high-power test socket suitable for radio frequency module |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203241443U (en) * | 2013-05-09 | 2013-10-16 | 金英杰 | Clamp of unpacked chip testing tool |
| CN105044402A (en) * | 2015-08-25 | 2015-11-11 | 贵州航天计量测试技术研究所 | Encapsulated micro-wave voltage-controlled oscillator test device |
| CN205539059U (en) * | 2016-01-27 | 2016-08-31 | 苏州韬盛电子科技有限公司 | Applicable chip piles up socket of assembly test |
| CN107449945A (en) * | 2017-09-05 | 2017-12-08 | 珠海市运泰利自动化设备有限公司 | Vertical depression socket devices |
| CN207133392U (en) * | 2017-08-31 | 2018-03-23 | 山东华光光电子股份有限公司 | A kind of semiconductor laser ageing test device |
| CN207488443U (en) * | 2017-10-10 | 2018-06-12 | 西安微电子技术研究所 | A kind of direct press type RF IC measurement jig |
| CN109920755A (en) * | 2019-02-25 | 2019-06-21 | 天津大学 | A kind of nano mattisolda low pressure assisted sintering fixture and method |
| CN209028178U (en) * | 2018-10-30 | 2019-06-25 | 武汉震奎科技有限公司 | A kind of chip detection jig |
| CN209266357U (en) * | 2019-02-27 | 2019-08-16 | 华芯智造微电子(重庆)股份有限公司 | A kind of solar battery chip detection device |
| CN211263690U (en) * | 2019-11-11 | 2020-08-14 | 欧拓飞科技(珠海)有限公司 | Novel flat cable FPC pressing buckle structure |
-
2020
- 2020-11-10 CN CN202011250606.2A patent/CN112362919A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203241443U (en) * | 2013-05-09 | 2013-10-16 | 金英杰 | Clamp of unpacked chip testing tool |
| CN105044402A (en) * | 2015-08-25 | 2015-11-11 | 贵州航天计量测试技术研究所 | Encapsulated micro-wave voltage-controlled oscillator test device |
| CN205539059U (en) * | 2016-01-27 | 2016-08-31 | 苏州韬盛电子科技有限公司 | Applicable chip piles up socket of assembly test |
| CN207133392U (en) * | 2017-08-31 | 2018-03-23 | 山东华光光电子股份有限公司 | A kind of semiconductor laser ageing test device |
| CN107449945A (en) * | 2017-09-05 | 2017-12-08 | 珠海市运泰利自动化设备有限公司 | Vertical depression socket devices |
| CN207488443U (en) * | 2017-10-10 | 2018-06-12 | 西安微电子技术研究所 | A kind of direct press type RF IC measurement jig |
| CN209028178U (en) * | 2018-10-30 | 2019-06-25 | 武汉震奎科技有限公司 | A kind of chip detection jig |
| CN109920755A (en) * | 2019-02-25 | 2019-06-21 | 天津大学 | A kind of nano mattisolda low pressure assisted sintering fixture and method |
| CN209266357U (en) * | 2019-02-27 | 2019-08-16 | 华芯智造微电子(重庆)股份有限公司 | A kind of solar battery chip detection device |
| CN211263690U (en) * | 2019-11-11 | 2020-08-14 | 欧拓飞科技(珠海)有限公司 | Novel flat cable FPC pressing buckle structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115128312A (en) * | 2022-07-14 | 2022-09-30 | 法特迪精密科技（苏州）有限公司 | Distributed high-power test socket suitable for radio frequency module |
| CN115128312B (en) * | 2022-07-14 | 2024-04-02 | 法特迪精密科技（苏州）有限公司 | Distributed high-power test socket applicable to radio frequency module |
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