CN209028178U - A kind of chip detection jig - Google Patents

A kind of chip detection jig Download PDF

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Publication number
CN209028178U
CN209028178U CN201821790546.1U CN201821790546U CN209028178U CN 209028178 U CN209028178 U CN 209028178U CN 201821790546 U CN201821790546 U CN 201821790546U CN 209028178 U CN209028178 U CN 209028178U
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CN
China
Prior art keywords
plate
chip
supporting plate
jig
spring
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Expired - Fee Related
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CN201821790546.1U
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Chinese (zh)
Inventor
向剑
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Wuhan Zhenkui Technology Co Ltd
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Wuhan Zhenkui Technology Co Ltd
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Priority to CN201821790546.1U priority Critical patent/CN209028178U/en
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Abstract

The utility model belongs to electron detection device technical field, disclose a kind of chip detection jig, including jig bottom plate and it is hinged on the flip lid pressing plate of jig bottom plate one end, the top surface of the jig bottom plate is equipped with the elastic supporting plate for chip placement, the surrounding of elastic supporting plate is provided with several and matched detection probe of chip pin, and the corresponding elastic supporting plate in the bottom surface of the flip lid pressing plate is provided with the spring bearer plate for compressing chip.The utility model is during renovating pressing plate closure, elastic supporting plate and spring bearer plate can automatic compression adjustment its thickness, so that after flip lid pressing plate closure, the case where pin will not be subject to large compressive and be damaged, it is damaged in the detection process so as to avoid chip, the chip for being adapted to different-thickness and different pin lengths is detected, and does not also need to be detected by the way of welding, easy to use and adaptable.

Description

A kind of chip detection jig
Technical field
The utility model belongs to electron detection device technical field more particularly to chip detecting equipment field, and in particular to A kind of chip detection jig.
Background technique
The nineties is with the progress of integrated technology, the use of the improvement of equipment and deep sub-micron technique, LSI, VLSI, ULSI Occurring in succession, electronic chip integrated level is continuously improved, and stringenter to integrated antenna package requirement, I/O number of pins sharply increases, Power consumption also increases with it.For the needs for meeting development, on the basis of original encapsulation kind, electronic chip adds new product again Kind --- BGA Package, abbreviation BGA.Current various electronic chips meet the tendency of the every profession and trade of electronic field: computer, hand extensively Mechanical, electrical brain north and south bridge, MP3, MP4, DVD, DVB, printer, communicating terminal, industrial control mainboard, video card, digital camera, set-top box Deng.
Electronic chip is usually selected in situations such as quality inspection of dispatching from the factory, recovery article inspection, service performance detection and is all needed to electronic chip It is detected, it is generally the case that detection jig includes the jig bottom plate that detection circuit is arranged, fixed test bottom on jig bottom plate , connection detection circuit is set on jig bottom plate and matches the detection probe of setting with electronic chip;When detection, by electronic chip Be placed on detection pedestal, the corresponding test point for touching corresponding electronic chip of detection probe, under normal circumstances, electronic chip it is upper It holds simple briquetting to push down chip or sometimes chip is welded on detection pedestal, allows chip to be adjacent to detection probe and examined It surveys, however for the electronic chip of different vendor or specification, the length of thickness and pin is often different, and existing same The pressure folder thickness of one detection jig be it is identical, when causing to easily occur in detection and compressing, the pressing plate for detecting jig cannot be pressed By closure, and easily cause the damage of chip and pin;Electronic chip is easy dislocation on detection pedestal simultaneously, in electronics The stress deficiency of chip upper end be easy to cause certain parts that cannot contact with detection probe, causes testing result inaccurate, in addition The mode complex process being welded and fixed is easy to cause electronic chip and detects the damage of pedestal.
In existing patent document, Chinese utility model patent, application number: CN201210277679.X, the applying date: 2012- 08-03, synopsis: the present invention relates to electron detection device technical fields, refer in particular to a kind of turnover type electronic chip detection Jig;Turnover type electronic chip detection jig of the invention, the chip accommodating cavity of setting detection electronic chip on jig bottom plate, Setting flip lid pressing plate above accommodating cavity, the bottom end connection for renovating the spinning apparatus on pressing plate press to the chip briquetting of electronic chip; Jig is detected in use, electronic chip is placed in chip accommodating cavity, chip accommodating cavity plays the work of pipe position to electronic chip With not will lead to the generation of inconsistent phenomenon;The flip lid platen cover for being hinged on jig bottom plate is detained to electronic chip, and by pulling button Connect on jig bottom plate, then turn spinning apparatus by chip briquetting it is smooth press to electronic chip, electronic chip upper end is uniform Stress, electronic chip detection part come into full contact with detection probe, and testing result is accurate and reliable, this detection jig also has operation Simply, easy to use, the advantages of long service life.
Although above-mentioned patent can make electronic chip detection part, the contact with probe is abundant, and there is no be directed to draw Foot length difference be easy to cause chip or pin to damage and makes improvement, and problem is not solved effectively still.
Utility model content
The utility model provides a kind of chip detection jig, for solving to detect jig in the prior art for different vendor Or the electronic chip of specification, when easily occurring in detection compression, the pressing plate for detecting jig cannot be pressed against closure, and be easy to Cause the technical issues of damage of chip and pin;Meanwhile the utility model also can solve electronic chip and be easy mistake on pedestal The problem of position.
The technology employed by the present utility model is
A kind of chip detection jig is to solve existing detection jig for the electronic chip of different vendor or specification, holds When easily appearing in detection compression, the pressing plate for detecting jig cannot be pressed against closure, and easily cause the damage of chip and pin The problem of, including jig bottom plate and it is hinged on the flip lid pressing plate of jig bottom plate one end, the top surface of the jig bottom plate, which is equipped with, to be used In the elastic supporting plate of chip placement, the surrounding of elastic supporting plate is provided with several and matched detection probe of chip pin, described to turn over The corresponding elastic supporting plate in the bottom surface of lid pressing plate is provided with the spring bearer plate for compressing chip.
The operation principle and process of this detection jig:
Flip lid pressing plate is raised from jig bottom plate first, then downward by chip pin to be detected, is placed into elasticity On supporting plate, so that the pin of chip is directed at detection probe, then downwardly turn over flip lid pressing plate, chip is compressed, is allowed to keep and examine The state of probing needle relative securement, while the detection to chip is carried out, when compressing chip, because of the pin length of chip Although can be because manufacturer is different and different, overall length difference when pin length is longer, not be turned over renovating pressing plate away from little When turning closure, pin has just been contradicted in detection probe, and during renovating pressing plate closure, elastic supporting plate and elasticity Pressing plate can automatic compression adjustment its thickness so that after flip lid pressing plate closure, pin will not be subject to large compressive and damage Bad situation, is damaged in the detection process so as to avoid chip, is adapted to the core of different-thickness and different pin lengths Piece is detected, and does not also need to be detected by the way of welding, easy to use and adaptable.
Further, in order to guarantee that elastic supporting plate can include upper branch according to its thickness of pressure automatic synchronization, elastic supporting plate Plate and lower carrier plate pass through at least two groups of springs elastic connections between the upper supporting plate and lower carrier plate.By spring as upper branch Hinge support between plate and lower carrier plate, during renovating pressing plate closure, upper supporting plate and lower carrier plate be subject to from chip Pressure can groups of springs be compressed automatically, to adapt to the chip of different pin lengths, and chip can be clamped, be avoided The case where chip misplaces, it is notable that groups of springs is preferably uniformly arranged between upper supporting plate and lower carrier plate, avoids branch The case where plate and lower carrier plate tilt in compaction process.
Further, in order to guarantee that spring bearer plate can include upper pressure according to its thickness of pressure automatic synchronization, spring bearer plate Plate and lower platen pass through three groups of springs elastic connections between the top board and lower platen.By spring as top board and Hinge support between lower platen, during renovating pressing plate closure, the pressure from chip that top board and lower platen are subject to Power can make groups of springs compress automatically, to adapt to the chip of different pin lengths, and can clamp chip, avoid chip The case where dislocation, it is notable that groups of springs is preferably uniformly arranged between top board and lower platen, avoid top board and The case where lower platen tilts in compaction process.
Further, each groups of springs being arranged on elastic supporting plate and spring bearer plate includes being uniformly arranged on the same line Three springs, the coefficient of elasticity of the spring is identical, and the spring number that is arranged on elastic supporting plate, which is less than on spring bearer plate, to be arranged Spring number.Herein it should be noted that being under pressure in identical situation in elastic supporting plate and spring bearer plate, preferential selection elasticity branch Plate first compresses, and after pin is contacted with detection probe, by the support force of pin, then spring bearer plate deformation is compressed, therefore The spring number being arranged on elastic supporting plate is less, it is possible to deformation first, and the spring number being arranged on spring bearer plate is more, so Deformation afterwards.
Further, the top surface of jig bottom plate is removably connected with backing plate by bolt, and the centre of the backing plate, which is equipped with, opens Mouthful, the elasticity supporting plate and detection probe are arranged in opening.The backing plate and opening of setting, can enable chip to exist It after renovating pressing plate closure, is detected in the environment in an opposing seal, protects chip, and backing plate can be dismantled, After depositing excessive dust in opening, the detection of chip can be impacted, so that the poor contact of pin and detection probe, and pad After plate disassembly, it can be more convenient thoroughly to clear up dust.
Further, the thickness of elastic supporting plate and spring bearer plate and the depth less than opening.
Further, top board and upper supporting plate are contacted with the upper bottom surface of chip respectively, the surface of top board and upper supporting plate It is equipped with several rubber antiskid salient points.The case where rubber antiskid salient point of setting can prevent in compaction process, and chip misplaces.
Further, the material of backing plate is any one in rubber or plastics.
The utility model has the following beneficial effects:
(1) for the utility model during renovating pressing plate closure, elastic supporting plate and spring bearer plate can automatic compression adjustments Its thickness so that after flip lid pressing plate closure, pin will not be subject to large compressive and the case where damage, so as to avoid Chip is damaged in the detection process, and the chip for being adapted to different-thickness and different pin lengths is detected, and is not also needed It is detected by the way of welding, it is easy to use and adaptable.
(2) backing plate and opening of the utility model setting can enable chip after flip lid pressing plate closure, be in It is detected in the environment of one opposing seal, protects chip, and backing plate can be dismantled, and deposit excessive dust in the opening Afterwards, the detection of chip can be impacted, so that the poor contact of pin and detection probe, and after backing plate disassembly, it can be more square Just the case where thoroughly cleaning dust, the rubber antiskid salient point of setting can prevent in compaction process, and chip misplaces.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model;
Structural schematic diagram when Fig. 2 is the utility model backing plate and the fractionation of jig bottom plate;
Fig. 3 is the structural schematic diagram of the utility model elasticity supporting plate;
Fig. 4 is the structural schematic diagram of the utility model spring bearer plate.
In figure: 1- jig bottom plate, 2- renovate pressing plate, 3- chip, 4- elasticity supporting plate, 5- detection probe, 6- spring bearer plate, 7- Spring, 8- backing plate, 9- opening, 10- rubber antiskid salient point, 41- upper supporting plate, 42- lower carrier plate, 61- top board, 62- lower platen.
Specific embodiment
With reference to the accompanying drawing and specific embodiment is further elaborated the utility model.
Embodiment 1:
As shown in Figure 1 and Figure 2, a kind of chip detects jig, including jig bottom plate 1 and is hinged on 1 one end of jig bottom plate Pressing plate 2 is renovated, the top surface of the jig bottom plate 1 is equipped with the elastic supporting plate 4 for chip placement 3, the surrounding setting of elastic supporting plate 4 There is several and matched detection probe 5 of 3 pin of chip, the corresponding elastic supporting plate 4 in the bottom surface of the flip lid pressing plate 2 is provided with for pressing The spring bearer plate 6 of tight chip 3.Flip lid pressing plate 2 is raised from jig bottom plate 1 first, then by 3 pin court of chip to be detected Under, it is placed on elastic supporting plate 4, the pin of chip 3 is made to be directed at detection probe 5, flip lid pressing plate 2 is then downwardly turned over, by chip 3 Compress, be allowed to keep with the state of 5 relative securement of detection probe, while carrying out the detection to chip 3, compress chip 3 when It waits, although the length difference of totality is long in pin away from little because the pin length of chip 3 can be because manufacturer be different and different When spending longer, when flip lid pressing plate 2 does not overturn closure, pin has just been contradicted in detection probe 5, and in flip lid pressing plate 2 During closure, elastic supporting plate 4 and automatic its thickness of compression adjustment of the meeting of spring bearer plate 6, so that after flip lid pressing plate 2 is closed, The case where pin will not be subject to large compressive and be damaged, is damaged, Ke Yishi in the detection process so as to avoid chip 3 It answers different-thickness and the chip 3 of different pin lengths to be detected, does not also need to be detected by the way of welding, use It is convenient and adaptable.
Embodiment 2:
On the basis of the above embodiments, scheme as a further preference, as shown in Figs 1-4, elastic supporting plate 4 include upper Supporting plate 41 and lower carrier plate 42 pass through at least two springs, 7 groups of elastic connections between the upper supporting plate 41 and lower carrier plate 42.Pass through bullet Spring 7 is as the hinge support between upper supporting plate 41 and lower carrier plate 42, and during renovating the closure of pressing plate 2, upper supporting plate 41 is under The pressure from chip 3 that supporting plate 42 is subject to can make 7 groups of spring to compress automatically, so that the chip 3 of different pin lengths is adapted to, And the case where chip 3 capable of being clamped, chip 3 is avoided to misplace, it is notable that 7 groups of spring are preferably uniformly arranged on Between upper supporting plate 41 and lower carrier plate 42, the case where avoiding upper supporting plate 41 and lower carrier plate 42 from tilting in compaction process;Spring bearer plate 6 Including top board 61 and lower platen 62, pass through three springs, 7 groups of elastic connections between the top board 61 and lower platen 62.Pass through Spring 7 is as the hinge support between top board 61 and lower platen 62, during renovating the closure of pressing plate 2,61 He of top board The pressure from chip 3 that lower platen 62 is subject to can make 7 groups of spring to compress automatically, to adapt to the chip of different pin lengths 3, and chip 3 can be clamped, the case where avoiding chip 3 from misplacing, it is notable that 7 groups of spring are preferably uniformly arranged Between top board 61 and lower platen 62, the case where avoiding top board 61 and lower platen 62 from tilting in compaction process.
Embodiment 3:
On the basis of the above embodiments, scheme as a further preference is arranged on elastic supporting plate 4 and spring bearer plate 6 7 groups of each spring include three springs 7 being uniformly arranged on the same line, the coefficient of elasticity of the spring 7 is identical, elasticity The number of spring 7 being arranged on supporting plate 4 is less than the number of spring 7 being arranged on spring bearer plate 6.Herein it should be noted that in elastic 4 He of supporting plate Spring bearer plate 6 is under pressure in identical situation, preferential that elastic supporting plate 4 is selected first to compress, and contacts in pin with detection probe 5 Afterwards, by the support force of pin, then 6 deformation of spring bearer plate is compressed, therefore the number of spring 7 being arranged on elastic supporting plate 4 is less, So can deformation first, and the number of spring 7 being arranged on spring bearer plate 6 is more, deformation after institute.
Embodiment 4:
On the basis of the above embodiments, scheme, the top surface of jig bottom plate 1 are removable by bolt as a further preference It unloads and is connected with backing plate 8, the centre of the backing plate 8 is equipped with opening 9, and the elasticity supporting plate 4 and detection probe 5 are arranged at opening 9 It is interior.The backing plate 8 of setting and opening 9 can enable chip 3 after flip lid pressing plate 2 is closed, in opposing seal It is detected in environment, protects chip 3, and backing plate 8 can be dismantled, it, can be to chip 3 after depositing excessive dust in opening 9 Detection impact so that the poor contact of pin and detection probe 5, and after backing plate 8 is dismantled, can be more convenient thoroughly clear Manage dust.
Embodiment 5:
On the basis of the above embodiments, scheme as a further preference, the thickness of elastic supporting plate 4 and spring bearer plate 6 With the depth for being less than opening 9;Top board 61 and upper supporting plate 41 are contacted with the upper bottom surface of chip 3 respectively, top board 61 and upper branch The surface of plate 41 is equipped with several rubber antiskid salient points 10.The rubber antiskid salient point 10 of setting can prevent in compaction process, The case where chip 3 misplaces.
The utility model is not limited to above-mentioned optional embodiment, anyone can obtain under the enlightenment of the utility model Other various forms of products, however, making any variation in its shape or structure, all the utility model rights that falls into are wanted The technical solution in confining spectrum is sought, is all fallen within the protection scope of the utility model.

Claims (8)

1. a kind of chip detects jig, including jig bottom plate (1) and it is hinged on the flip lid pressing plate (2) of jig bottom plate (1) one end, It is characterized by: the top surface of the jig bottom plate (1) is equipped with the elastic supporting plate (4) for chip placement (3), elastic supporting plate (4) Surrounding be provided with several with the matched detection probe of chip (3) pin (5), the corresponding elasticity in the bottom surface of flip lid pressing plate (2) Supporting plate (4) is provided with the spring bearer plate (6) for compressing chip (3).
2. a kind of chip according to claim 1 detects jig, it is characterised in that: the elasticity supporting plate (4) includes upper branch Plate (41) and lower carrier plate (42) pass through at least two groups of springs elastic connections between the upper supporting plate (41) and lower carrier plate (42).
3. a kind of chip according to claim 2 detects jig, it is characterised in that: the spring bearer plate (6) includes upper pressure Plate (61) and lower platen (62) pass through three groups of springs elastic connections between the top board (61) and lower platen (62).
4. a kind of chip according to claim 3 detects jig, it is characterised in that: the elasticity supporting plate (4) and elasticity pressure The each groups of springs being arranged on plate (6) includes three springs (7) being uniformly arranged on the same line, the bullet of the spring (7) Property coefficient is identical, and spring (7) number being arranged on elastic supporting plate (4) is less than spring (7) number being arranged on spring bearer plate (6).
5. a kind of chip according to claim 3 detects jig, it is characterised in that: the top surface of the jig bottom plate (1) is logical It crosses bolt to be removably connected with backing plate (8), the centre of the backing plate (8) is equipped with opening (9), the elasticity supporting plate (4) and detection Probe (5) is arranged in opening (9).
6. a kind of chip according to claim 5 detects jig, it is characterised in that: the elasticity supporting plate (4) and elasticity are pressed The thickness of plate (6) and the depth for being less than opening (9).
7. a kind of chip according to claim 3 detects jig, it is characterised in that: the top board (61) and upper supporting plate (41) contacted respectively with the upper bottom surface of chip (3), top board (61) and upper supporting plate (41) if to be equipped with dry rubber substance anti-on surface Sliding salient point (10).
8. a kind of chip according to claim 5 detects jig, it is characterised in that: the material of the backing plate (8) is rubber Or any one in plastics.
CN201821790546.1U 2018-10-30 2018-10-30 A kind of chip detection jig Expired - Fee Related CN209028178U (en)

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CN201821790546.1U CN209028178U (en) 2018-10-30 2018-10-30 A kind of chip detection jig

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Application Number Priority Date Filing Date Title
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CN209028178U true CN209028178U (en) 2019-06-25

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112261819A (en) * 2020-10-20 2021-01-22 吉林工程技术师范学院 Fixing device for vehicle detection chip
CN112362919A (en) * 2020-11-10 2021-02-12 西安微电子技术研究所 KGS test fixture structure of multi-chip TSV silicon-based component
CN114419973A (en) * 2022-02-25 2022-04-29 岭南师范学院 Detachable biological teaching plant cell mould
CN116008777A (en) * 2022-12-22 2023-04-25 深圳市佳芯智造科技有限公司 Chip burning test fixture
WO2024000417A1 (en) * 2022-06-30 2024-01-04 京东方科技集团股份有限公司 Microfluidic chip, and test system, test method, and preparation method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112261819A (en) * 2020-10-20 2021-01-22 吉林工程技术师范学院 Fixing device for vehicle detection chip
CN112362919A (en) * 2020-11-10 2021-02-12 西安微电子技术研究所 KGS test fixture structure of multi-chip TSV silicon-based component
CN114419973A (en) * 2022-02-25 2022-04-29 岭南师范学院 Detachable biological teaching plant cell mould
CN114419973B (en) * 2022-02-25 2023-11-03 岭南师范学院 Detachable biological teaching plant cell mould
WO2024000417A1 (en) * 2022-06-30 2024-01-04 京东方科技集团股份有限公司 Microfluidic chip, and test system, test method, and preparation method thereof
CN116008777A (en) * 2022-12-22 2023-04-25 深圳市佳芯智造科技有限公司 Chip burning test fixture

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Granted publication date: 20190625