TW201643402A - Pressure testing device of semiconductor and testing apparatus thereof - Google Patents

Abstract

The present invention relates to a pressure testing device of semiconductor and testing apparatus thereof. The pressure testing device of semiconductor includes a plurality of pressure testing units and a spinning disk unit, every pressure testing unit comprising a support stand, an upper testing base and a lower testing base. The spinning disk unit comprises a rotary shaft, a spinning disk and a plurality of floating holders, every floating holder being connected with the spinning disk by a plurality of elastic members. Every floating holder corresponds to the position between the upper testing base and the lower testing base by spinning the spinning disk, and every pressure testing unit comprises a heater and a conducting plate secured on the lower testing base, so that every pressure testing unit can provide different testing pressure and temperature helping user to test semiconductors continuously throughout a variety of pressure and temperature conditions. As such, the present invention provides a testing device for semiconductors to test continuously throughout a variety of pressure and temperature conditions, which enhances the testing productivity.

Description

Semiconductor component pressure test device and test equipment thereof

The present invention relates to a semiconductor component pressure testing device and a testing device thereof, and more particularly to a testing device and a testing device thereof suitable for testing pressure sensing characteristics of a semiconductor component.

A semiconductor device pressure testing device disclosed in U.S. Patent Publication No. 2009/0015277 A1, which is incorporated herein by reference, is a side view of a conventional semiconductor component pressure testing device. As shown, the pressure testing device described herein includes a first half cavity 91 and a second half cavity 92, wherein the first half cavity 91 is a fixed end and the second half cavity 92 is A lifting device 90 is moved up and down vertically to close or separate the pressure testing device. The first half cavity 91 has a lower recess 95 for carrying the carrier 97 on which the semiconductor component 96 is mounted. The second half cavity 92 has an upper recess 98 and has a plurality of protruding test probes 913 for correspondingly contacting the semiconductor component 96 described above. In addition, the nip structure used in the present invention includes two jaws 93 pivoted to the second half cavity 92, which are rotatable along the rotation shaft 94.

When the pressure test starts, one of the upper surfaces 99 of the first half cavity 91 will abut against a lower surface 910 of the second half cavity 92, and the jaws 93 are used to offset the outer edge of the first half cavity 91 while borrowing The gas pressure is sealed by an O-ring 912 disposed in a tank 911. When the test is completed, the jaws 93 are separated from the first half cavity 91 and the first half cavity 91 is transferred to the discharge through the lifting device 90. However, this design can only test a single pressure chamber at a time during the pressure test. In addition, the case uses a quick take-over and a clip-on method, resulting in high gas leakage rate and low production capacity.

Inventors for this reason, in the spirit of active invention, consider a semiconductor component pressure testing device and its testing equipment that can solve the above problems, and finally completed the present invention after several research experiments.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide a semiconductor component pressure testing device that enables continuous transmission and testing of semiconductor components to be tested between a plurality of pressure testing units through the arrangement of the turntable, thereby greatly increasing test throughput. In addition, each pressure test unit is separated from the carrier of the semiconductor component to avoid pulling the air supply line and the signal cable.

Another object of the present invention is to provide a semiconductor component pressure testing device, which combines the above-mentioned semiconductor component pressure testing device with a sorting machine, and can effectively integrate pressure testing and sorting and picking, thereby achieving fast and convenient feeding and discharging efficiency. .

To achieve the above object, a semiconductor component pressure testing device of the present invention includes a plurality of pressure testing units and a turntable unit. Each pressure testing unit comprises a support frame, an upper test seat and a lower test seat. The support frame is fixed on a work table, and is equipped with a first power device having a first lower pressing bar, and an upper test seat. The first lower pressing rod is connected to the first pressing rod, and comprises an upper jig, a circuit adapter plate and at least one needle measuring seat. The lower test seat is fixed on a work table, including a lower jig and at least one air supply pipe. Therefore, in the process of the pressure test, the circuit adapter plate provided with at least one needle measuring block is disposed in the upper test seat, and the rotary disk unit can perform the continuous rotation test, so as to avoid the arrangement of the row on one end of the conventional needle measuring seat. The transmission of the wire to the circuit board will cause the cable to be entangled and torn off as the turntable unit rotates, so that the test signal can immediately transmit test data and improve test stability.

In addition, the turntable unit includes a pivot shaft, a turntable and a plurality of floating test seats. The pivot shaft is fixed on the work table, and the turntable is pivotally mounted on the pivot shaft. Each floating test seat is connected to the turntable by a plurality of elastic members, including There is a floating fixture and a carrier for carrying at least one semiconductor component. The rotation of the turntable causes each floating test socket to be located between each of the upper test seats and the lower test socket, and each pressure test unit supplies different test pressures to continuously test each semiconductor component under different pressure environments.

With the above design, the present invention not only enables the semiconductor component to be tested to be continuously transported and tested between a plurality of pressure test units, but also greatly improves the test productivity, and further has a floating test seat on the turntable. During the pressing of the test seat, the adhesion of the overall test environment is improved, the pressure leak rate is improved, and the test accuracy is increased.

Each of the pressure testing units may further include a heating device fixed to the lower test socket and a heat conducting plate. Thereby, in the process of the stress test, the influence on the semiconductor component in different temperature environments can be simultaneously detected, thereby continuously testing each semiconductor component under different pressure and temperature environments, and the semiconductor component pressure testing device of the invention is added. Multi-function and improve test efficiency.

The above-mentioned semiconductor component pressure testing device may further include a plurality of preheating stations, wherein each preheating station includes a preheating support frame, a preheating upper test seat and a preheating lower test seat, and the preheating support frame is fixed. a second power unit having a second lower pressing rod is mounted on a work table, and the preheating upper test seat is connected to the second lower pressing rod, and the preheating lower test seat is fixed on the A work desk. Thereby, when each pressure test unit is performing the test pressure, the preheating heating device can be simultaneously turned on and the heating operation of the preheating heat conducting plate can be performed, so that the floating test socket on the turntable can first contact the preheating heat conducting plate first, thereby avoiding Waste of heating time.

The plurality of preheating stations and the plurality of pressure testing units may be arranged in an annular interval. Thereby, when each pressure test unit is performing the test pressure, the adjacent floating test sockets can simultaneously perform the heating operation of the preheating heat conducting plate, so that each pressure test unit can continue the pressure test of the specified temperature without interruption. , to improve the rotation efficiency of the turntable to the maximum.

The at least one needle measuring base can be a two-needle measuring seat, comprising a first needle measuring seat and a second needle measuring seat, the first needle measuring seat is in contact with the bearing seat, and the second needle measuring seat is in contact with a circuit substrate . Thereby, when the first lower pressing rod pushes the upper test seat to bring the first needle measuring seat into contact with the carrier, the obtained test information is immediately transmitted to the circuit substrate by the second needle measuring device, and then is transferred to the computer or Other analytical instruments, by which the turntable unit can perform continuous rotation test, the needle test stand does not need to be transmitted to the circuit substrate through the cable, and the wire is eliminated, and the wire is entangled and broken as the turntable unit rotates.

Each of the floating test sockets may further include at least one O-ring that may be disposed on a surface of the carrier. Thereby, the adhesion between the floating test seat and the upper test seat can be improved, and the gas can be easily leaked to establish a good pressure environment.

The plurality of elastic members may be a plurality of springs, and provide an extended length of the press-down tightness, so that the floating test seat and the lower test seat can be closely engaged, so that the gas is not easily leaked, and a good pressure environment is established.

In another aspect, the semiconductor component pressure testing apparatus of the present invention includes a sorting machine and a semiconductor component pressure testing device, the sorting machine including a turret disposed at a work table and a feed chute disposed around the turret, a viewing device, a tray and a moving mechanism, the turret comprising a plurality of suction heads arranged at an angular interval, the movement mechanism comprising a pick and place device, the feeding trough, the inspection device and the tray system respectively corresponding to the plurality of suction heads Below.

The semiconductor component pressure testing device includes a plurality of pressure testing units and a turntable unit. Each of the pressure testing units includes a support frame, an upper test seat and a lower test seat. The support frame is fixed on the work table and is provided with a a first power device of the first lower pressing rod, the upper test seat is connected with the first lower pressing rod, and includes an upper jig, a circuit adapter plate and at least one needle measuring seat, and the lower test seat includes a lower jig And at least one gas supply line. The turntable unit comprises a pivot shaft, a turntable and a plurality of floating test seats. The pivot shaft is fixed on the work table, and the turntable is pivoted on the pivot shaft. Each floating test seat is connected with the turntable by a plurality of elastic members, including a floating treatment. And a carrier, the carrier is configured to carry at least one semiconductor component, the rotation of the turntable causes each floating test socket to be correspondingly located between each of the upper test socket and the lower test socket, and the lower test socket includes one of the lower test sockets The heating device and a heat conducting plate, whereby each pressure testing unit supplies different test pressures and temperatures, thereby continuously testing each semiconductor component under different pressure and temperature environments.

Through the above design, not only the multiple functions of feeding, inspection and testing are integrated, but also the pressure test and the sorting and picking operation can be effectively integrated through the simple connection of the above two sets of devices, thereby achieving fast and convenient feeding and discharging efficiency.

The above summary and the following detailed description are exemplary in order to further illustrate the scope of the invention. Other objects and advantages of the present invention will be described in the following description and drawings.

1 and 2 are a perspective view and an exploded view of a semiconductor component pressure testing device according to a preferred embodiment of the present invention. The figure shows a semiconductor component pressure testing device 1 comprising a plurality of pressure testing units 2, a plurality of preheating stations 20 and a turntable unit 3, each preheating station 20 and each pressure testing unit 2 being annularly spaced apart, In this embodiment, there are a total of five pressure test units 2 and five adjacent preheat stations 20, but not limited to this number. A set of pressure test units 2 are specifically removed in FIG. 1 to facilitate the disclosure of some of the features on the turntable unit 3.

As shown, each pressure test unit 2 includes a support frame 21, an upper test seat 22, and a lower test seat 23. The support frame 21 is fixed on a work table 30, and is provided with a first power device 212 having a first lower press bar 211. The first power device 212 can be a motor or a cylinder or the like for providing a Top thrust. The upper test seat 22 is connected to the first lower pressing rod 211, and includes an upper jig 221, a circuit adapter plate 222, a first needle measuring seat 223 and a second needle measuring seat 224. The lower test 23 is fixed on the work table 30, including a jig 231, a heating device 5, a heat conducting plate 50 and two gas supply lines 232. The present invention differs from the prior art in that the circuit adapter plate 222 and the two-needle probes 223, 224 are disposed on the upper test socket 22. According to the spirit of the present invention, the rotary unit can perform continuous rotation test through the circuit adapter plate and the two-needle test socket of the upper test socket, thereby avoiding the conventional use of the cable, which is easy to generate entanglement and tearing, so that the test signal can immediately transmit the test data. And improve test stability efficiency. .

Furthermore, the turntable unit 3 includes a pivot shaft 31, a turntable 32 and a plurality of floating test seats 33, and the pivot shaft 31 is fixed on the work table 30 as the center of rotation of the entire turntable unit 3. The rotating plate 32 is pivotally connected to the pivoting shaft 31. Each of the floating test seats 33 is connected to the rotating plate 32 by four elastic members 330. The elastic member 330 used in this embodiment is a tension spring, but this is not As a limitation, any member having an elastic and stretch cushioning function can be used as the elastic member 330 of the present invention. The floating test stand 33 includes a floating jig 331 and a carrier 332. The carrier 332 is disposed on the floating jig 331 for carrying the plurality of semiconductor components 4. As shown in FIG. 1, the rotation of the turntable 32 causes the each floating test seat 33 to be correspondingly located between each of the upper test seat 22 and the lower test seat 23, and each pressure test unit 2 supplies different test pressures, thereby being in different pressure environments. Each of the semiconductor elements 4 is continuously tested. In addition to effectively enabling the semiconductor component 4 to be tested to be continuously transported and tested between a plurality of pressure test units, and greatly improving the test productivity, the floating test stand 33 is further provided on the turntable 32, thereby being used in the test stand. During the 22-down process, the adhesion of the overall test environment is improved, the pressure leak rate is improved, and the test accuracy is increased.

3A and 3B are perspective views of a pressure testing unit and a preheating station according to a preferred embodiment of the present invention, and perspective views of another viewing angle. A pair of adjacent pressure test units 2 and a preheating station 20 are shown in the figure. It can be seen from the perspective of FIG. 3B that the support frame 21 is provided with a receiving plate 213 for carrying a circuit board 225, which can be seen in FIG. 4 together. A perspective view of a circuit adapter board and a circuit board in accordance with a preferred embodiment of the present invention. The circuit board 225 has a transition socket 226 and a plurality of output ports 227. When the upper test socket 22 is pressed to contact the first needle mount 223 to the carrier 332, the second probe mount 224 and the circuit substrate 225. The adapter slots 226 are in contact such that the test information obtained from each of the semiconductor components 4 by each of the pressure test units 2 is immediately transmitted from the second needle mount 224 to the circuit substrate 255 and is connected to the complex output port 227. The signal cable (not shown) merges the above test information into a computer or other analytical instrument, whereby the turntable unit can be joined and separated from the circuit substrate through the circuit adapter plate, and the turntable unit can perform continuous rotation test to solve The limitation of signal transmission.

Referring back to FIG. 3A and FIG. 3B, the preheating station 20 of the semiconductor component pressure testing device 1 of the present invention includes a preheating support frame 201, a preheating upper test socket 202 and a preheating lower test socket 203, and a preheating support. The frame 201 is fixed on the work table 30, and is equipped with a second power device 2012 having a second pressing lever 2011. The second power device 2012 can be a motor or a cylinder to provide a thrust. The press-fit test stand 33 is in contact with a heat-conducting plate of the test stand 203 under preheating. The pre-heat test stand 203 has only one heating device and one heat conducting plate, and no air supply line is required. The preheating upper test seat 202 is connected to the second lower pressing rod 2011, and the test seat 203 is fixed on the work table 30 under preheating. Thereby, when each pressure test unit 2 is performing the test pressure, the adjacent floating test seats 33 can simultaneously perform the heating operation through the preheating station 20, so that each pressure test unit 2 can continue the pressure test at the specified temperature. Without interruption, the turntable efficiency is maximized.

5 and FIG. 6 are a cross-sectional view taken along line A-A of the test piece of the semiconductor component pressure testing device according to a preferred embodiment of the present invention, and a cross-sectional view of the upper test seat after being pressed down. As shown in FIG. 5, before the upper test seat 22 is pressed down, it can be clearly seen from the cross-sectional view that the upper test seat 22, the turntable 32 and the lower test seat 23 are three separate members, wherein the turntable 32 is connected. The floating test seat 33 has a gap D from the surface of the lower test seat 23, so that the turntable 32 is less susceptible to interference during the rotation. More preferably, in the embodiment, in order to avoid the change of the pressure value caused by the leakage of the filling gas, the carrier 332 corresponds to the first needle measuring seat 223, the bearing base 332 corresponds to the circuit adapter plate 222, and the floating fixture 331 The surface of the corresponding bearing block 332 and the lower test seat 23 corresponding to the floating jig 331 is respectively provided with an annular groove for accommodating an O-ring 333, which is a ring-shaped elastic gasket, and serves as a sealing interface for the compression of the two components. It can improve the airtightness of the joints of various components. In addition, each of the wafer receiving slots 3321 of the carrier 332 has a connecting hole 3322 communicating with each of the through holes 3311 of the floating jig 331, and forming a gas pressure path with the two gas supply lines 232. The semiconductor element 4 of one of the accommodating grooves 3321 can sense the change of the air pressure to achieve the purpose of the pressure test.

As shown in FIG. 6, when the upper test seat 22 is pressed down by the first power unit 212, the first needle mount 223 is fitted to the carrier 332, and the floating test seat 33 is forced to move downward until the top is reached. Up to the test seat 23, at this time, the floating test seat 33 is only vertically displaced by the stretching action of the plurality of elastic members 330, and the turntable 32 is left unaffected in the original position, so that the floating test seat 33 and the lower test seat 23 are There is no longer a gap D between the surfaces to achieve a close joint between the components, so that the gas is not easily leaked and a good pressure environment is established. In addition, each of the pressure testing units 2 is separated from the carrier 332 of the semiconductor component 4 to avoid pulling the gas supply line 232 and the signal wiring, and at the same time, facilitating the rotation of the semiconductor component 4 to the next pressure testing unit 2, thereby improving Test efficiency.

Please refer to FIG. 7, which is a perspective view of a semiconductor component pressure testing apparatus according to a preferred embodiment of the present invention. The semiconductor component pressure testing device 7 includes a sorting machine 6 and the above-mentioned semiconductor component pressure testing device 1. For details of the semiconductor component pressure testing device 1, please refer to the foregoing embodiments, and no further description is provided herein. . As shown, the sorting machine 6 includes a turret 61 disposed on the work table 30 and a feed chute 62 disposed around the turret 61, an inspection device 63, a tray 64, and a transfer mechanism 65. The turret 61 includes a plurality of suction heads 611 arranged at an angular interval, and can perform an autorotation motion to cause angular displacement of each of the suction heads 611. The movement mechanism 65 includes a pick-and-placer 651, a feed slot 62, an inspection device 63, and a material. The discs 64 are respectively disposed under the plurality of suction heads 611.

The feeding trough 62 of the embodiment extends to the lower side of the suction head 611, and the other end is connected to a vibrating plate 66, which is a centrally protruding disc-shaped structure, so that the semiconductor element vibrates from the feeding area and falls behind. Go to the circumference of the vibrating plate 66. The vibrating plate 66 causes the semiconductor element to climb up with the spiral guide of the circumferential side wall by the vibration of the vibrating mechanism. Once the semiconductor component is judged to be in the correct orientation, the component continues to be fed into the feed slot 62. The semiconductor component in the feed slot 62 is pushed forward, and the pick-up head 611 is attracted to the platform of the visual inspection area by the rotation of the turret 61 after the semiconductor element is sucked at the end of the feed slot 62, that is, the foregoing Viewing device 63.

The portion of the viewing device 63 that receives the semiconductor component is also located below the pick-up head 611. It primarily uses a photographic module such as a charge-coupled component (CCD) to verify the correctness of the appearance of the semiconductor component, such as whether the printed text is correct or flawed. Once judged to be erroneous or defective, the pick-up head 611 can deliver the semiconductor component to a recovery zone. The semiconductor component that has been inspected by the inspection device 63 is again transferred by the suction head 611 to a tray 64.

The shifting mechanism 65 has a pick-and-place mechanism 651 for picking up and carrying the semiconductor component between the sorting machine table 6 and the semiconductor component pressure testing device 1, that is, the pick-and-placer 651 can be spatially moved. In detail, the picker 651 can be moved to the tray 64 located below the pick-up head 611 to take the tray 64, wherein the tray 64 is responsible for storing a plurality of semiconductor components dropped from the pick-up head 611; thereafter, the pick-and-placer The 651 can further transport the tray 64 together with the semiconductor component thereon to the semiconductor component pressure testing device 1, and load each semiconductor component to the wafer receiving slot 3321 of the carrier 332 by a suction head (not shown). In order to carry out component testing. Finally, the test procedure of the above-mentioned semiconductor component pressure testing device 1 is started, and different test pressures and temperatures of each pressure testing unit 2 are given for different test items or different customer requirements, and are driven by the turntable unit 3, for Each semiconductor component 4 can achieve continuity testing, effectively solving the problems of conventional pressure testing devices requiring continuous replacement of pressure and temperature conditions, and improving test efficiency.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

1‧‧‧Semiconductor component pressure tester
2‧‧‧Pressure test unit
20‧‧‧Preheating station
201‧‧‧Preheating support frame
2011‧‧‧Second lower pressure bar
2012‧‧‧Second power plant
202‧‧‧Preheating test stand
203‧‧‧Preheat test stand
21‧‧‧Support frame
211‧‧‧First down bar
212‧‧‧First power unit
213‧‧‧ receiving board
22‧‧‧Upper test stand
221‧‧‧Upper fixture
222‧‧‧Circuit Adapter Board
223‧‧‧first needle tester
224‧‧‧Second needle tester
225‧‧‧ circuit board
226‧‧‧Transfer slot
227‧‧‧ Output埠
23‧‧‧Lower test stand
231‧‧‧The lower fixture
232‧‧‧ gas supply line
3‧‧‧ Turntable unit
30‧‧‧Working table
31‧‧‧ pivot shaft
32‧‧‧ Turntable
33‧‧‧Floating test stand
330‧‧‧Flexible parts
331‧‧‧Floating fixture
3311‧‧‧through hole
332‧‧‧ bearing seat
3321‧‧‧ wafer receiving slot
3322‧‧‧Connection hole
333‧‧‧O-ring
4‧‧‧Semiconductor components
5‧‧‧ heating device
50‧‧‧heat conducting plate
6‧‧‧Classification machine
61‧‧‧Tower
611‧‧‧ suction head
62‧‧‧feed trough
63‧‧‧Viewing device
64‧‧‧Tray
65‧‧‧Transition agencies
651‧‧‧ picker
66‧‧‧Vibration plate
7‧‧‧Semiconductor component pressure test equipment
90‧‧‧ lifting device
91‧‧‧First half cavity
910‧‧‧ lower surface
911‧‧‧
912‧‧‧O-ring
913‧‧‧Test probe
92‧‧‧second half cavity
93‧‧‧claw
94‧‧‧ shaft
95‧‧‧ Lower groove
96‧‧‧Semiconductor components
97‧‧‧Package
98‧‧‧Upper groove
99‧‧‧ upper surface

1 is a perspective view of a semiconductor component pressure testing device in accordance with a preferred embodiment of the present invention. 2 is an exploded view of a semiconductor component pressure testing device in accordance with a preferred embodiment of the present invention. 3A is a perspective view of a pressure testing unit and a preheating station in accordance with a preferred embodiment of the present invention. 3B is a perspective view of another perspective view of a pressure testing unit and a preheating station in accordance with a preferred embodiment of the present invention. 4 is a perspective view showing the connection between a circuit adapter board and a circuit board in accordance with a preferred embodiment of the present invention. Fig. 5 is a cross-sectional view, taken along the line A-A, before the test seat is pressed down on the semiconductor component pressure test apparatus according to a preferred embodiment of the present invention. 6 is a cross-sectional view of the semiconductor component pressure testing device according to a preferred embodiment of the present invention after the test seat is pressed down. Figure 7 is a perspective view of a semiconductor component pressure testing apparatus in accordance with a preferred embodiment of the present invention. Figure 8 is a side view of a conventional semiconductor component pressure test apparatus.

1‧‧‧Semiconductor component pressure tester

2‧‧‧Pressure test unit

20‧‧‧Preheating station

3‧‧‧ Turntable unit

30‧‧‧Working table

31‧‧‧ pivot shaft

32‧‧‧ Turntable

33‧‧‧Floating test stand

Claims (18)

A semiconductor component pressure testing device includes: a plurality of pressure testing units, each of the pressure testing units including a support frame, an upper test seat and a lower test seat, the support frame is fixed on a work table, and is mounted a first power unit having a first lower pressing rod, the upper test seat being connected to the first lower pressing rod, comprising an upper jig, a circuit adapter plate and at least one needle measuring seat, the lower test The seat is fixed on the work table, including a jig and at least one air supply pipe; and a turntable unit including a pivot shaft, a turntable and a plurality of floating test seats, the pivot shaft is fixed on the work table, The rotating shaft is pivotally disposed on the pivoting shaft, and each of the floating test seats is connected to the rotating plate by a plurality of elastic members, and includes a floating fixture and a carrier for carrying at least one semiconductor component, and the rotating wheel is rotated Each of the floating test sockets is correspondingly located between each of the upper test seats and the lower test sockets, and each of the pressure test units supplies different test pressures, thereby continuously testing each of the pressure test environments under different pressure conditions. Conductor element. The semiconductor component pressure testing device of claim 1, wherein each of the pressure testing units further comprises a heating device fixed to the lower test socket and a heat conducting plate. The semiconductor component pressure testing device of claim 2, wherein the semiconductor component pressure testing device further comprises a plurality of preheating stations. The semiconductor component pressure testing device of claim 3, wherein each preheating station comprises a preheating support frame, a preheating upper test seat and a preheating lower test seat, and the preheating support frame is fixed. And a second power device having a second lower pressing rod, the preheating upper test seat is connected to the second lower pressing rod, and the preheating lower test seat is fixed on the working table The work table includes a preheating heating device and a preheating heat conducting plate. The semiconductor component pressure testing device of claim 3, wherein the plurality of preheating stations and the plurality of pressure testing units are annularly spaced. The semiconductor component pressure testing device of claim 1, wherein the at least one needle measuring device is a two-needle measuring seat, comprising a first needle measuring seat and a second needle measuring seat, the first needle measuring seat It is in contact with the carrier while the second needle probe is in contact with a circuit substrate. The semiconductor component pressure testing device of claim 1, wherein each of the floating test sockets further comprises at least one O-ring. The semiconductor component pressure testing device of claim 7, wherein the at least one O-ring is disposed on a surface of the carrier. The semiconductor component pressure testing device of claim 1, wherein the plurality of elastic members are plural springs. A semiconductor component pressure testing device includes: a sorting machine comprising: a turret disposed on a work table; and a feeding trough, an inspection device, a tray and a moving mechanism disposed around the turret; The turret includes a plurality of suction heads arranged at an angular interval, the movement mechanism includes a pick-and-place device, the feeding slot, the inspection device and the tray are respectively disposed under the plurality of suction heads; and a semiconductor component The pressure testing device includes a plurality of pressure testing units and a turntable unit. Each of the pressure testing units includes a support frame, an upper test seat and a lower test seat. The support frame is fixed on the work table and is mounted a first power unit having a first lower pressing rod, the upper test seat being connected to the first lower pressing rod, comprising an upper jig, a circuit adapter plate and at least one needle measuring seat, the lower test The base includes a jig and at least one air supply pipe; the turntable unit includes a pivot shaft, a turntable and a plurality of floating test seats, the pivot shaft is fixed on the work table, and the turntable is pivoted on the pivot a shaft, each of the floating test sockets is connected to the turntable by a plurality of elastic members, and includes a floating fixture and a carrier for carrying at least one semiconductor component, the turntable rotating to cause each floating test seat Correspondingly located between each of the upper test sockets and the lower test sockets, and each of the pressure test units supplies different test pressures, thereby continuously testing the each semiconductor component under different pressure environments. The semiconductor component pressure testing device of claim 10, wherein each of the pressure testing units further comprises a heating device fixed to the lower test socket and a heat conducting plate. The semiconductor component pressure testing device of claim 11, wherein the semiconductor component pressure testing device further comprises a plurality of preheating stations. The semiconductor component pressure testing device of claim 12, wherein each preheating station comprises a preheating support frame, a preheating upper test seat and a preheating lower test seat, and the preheating support frame is fixed. And a second power device having a second lower pressing rod, the preheating upper test seat is connected to the second lower pressing rod, and the preheating lower test seat is fixed on the working table The work table includes a preheating heating device and a preheating heat conducting plate. The semiconductor component pressure testing device of claim 12, wherein the plurality of preheating stations and the plurality of pressure testing units are annularly spaced. The semiconductor component pressure testing device of claim 10, wherein the at least one needle measuring device is a two-needle measuring seat, comprising a first needle measuring seat and a second needle measuring seat, the first needle measuring seat It is in contact with the carrier while the second needle probe is in contact with a circuit substrate. The semiconductor component pressure testing device of claim 10, wherein each of the floating test sockets further comprises at least one O-ring. The semiconductor component pressure testing device of claim 16, wherein the at least one O-ring is disposed on a surface of the carrier. The semiconductor component pressure testing device of claim 10, wherein the plurality of elastic members are plural springs.