TWI676033B - Semiconductor testing carrier with buffering container and testing apparatus thereof - Google Patents

Abstract

The invention relates to a semiconductor component test carrier with a floating receiving seat and a testing device thereof. The semiconductor element test carrier includes a base and a receiving seat. The accommodating seat is provided with a plurality of accommodating grooves accommodating semiconductor elements and a plurality of spring grooves accommodating a compression spring. The accommodating seat is fixedly provided with a plurality of support posts, each of which is passed through the base In the seat, two buckle pieces are respectively correspondingly fastened on the bottom of the base and each support post on the top of the receiving seat. In this way, through the improved fastening method, in addition to effectively avoiding deformation of the supporting edge of the base, it can be more easily disassembled and replaced in use, and the convenience in use of different production lines is improved.

Description

Semiconductor component test carrier with floating receptacle and test equipment

The invention relates to a semiconductor component test carrier with a floating receiving seat and a testing device thereof, and more particularly to a semiconductor element test carrier with a floating receiving seat and a testing device suitable for detecting a wafer to be tested.

In the conventional technology, when a stylus seat presses a semiconductor element, a spring-type connector (Pogo Pin) located on the stylus seat first contacts the semiconductor element to generate a down force, and the semiconductor element is carried on the receiving seat. In this case, if the thin base used to support the receiving base at this time cannot withstand the pressure channel from the probe base, it will cause the thin base and the receiving base to deform synchronously, destroying the probe and the semiconductor component. Contact adhesion and overall accuracy affect test yield.

In addition, in the past, when the accommodating seat was installed, because the accommodating seat was engaged with the base on the base, the thin base must first be extended outward, and the mortise of the accommodating base was entered into the thin base to be opened. After the gap, the thin base is finally clamped inward to complete the assembly process. However, in the process of spreading the thin base outward, it is easy to deform the supporting edge of the thin base. After repeated use for a long time, it will greatly reduce the clamping force, resulting in poor engagement and component damage. Problems, resulting in reduced service life.

Because of this, the inventor is in the spirit of active invention and urgently thinks about a semiconductor component test carrier with a floating receiving seat and a testing device that can solve the above problems. After several research experiments, the present invention has been completed.

The main object of the present invention is to provide a semiconductor component test carrier with a floating receiving seat. With the arrangement of the floating receiving seat, the base can be effectively prevented from being deformed and the test yield can be affected when the pin measuring seat is pressed down. At the same time, the present invention changes the conventional tenon structure that needs to support the base type to a simple snap type fastener. In addition to effectively avoiding the deformation of the supporting edge of the base, it can be more easily disassembled. Installation and replacement, to improve the convenience of different production lines.

To achieve the above object, the semiconductor component test carrier with a floating receiving seat of the present invention includes a base and a receiving seat. The accommodating seat is provided with a plurality of accommodating grooves and a plurality of spring grooves. Each of the accommodating grooves respectively contains a semiconductor element, and each of the spring grooves respectively accommodates a compression spring. The end is connected with the spring groove and the base, so that the receiving seat can have a cushioning effect when it is pressed by force.

Wherein, the accommodating seat is fixed with a plurality of supporting posts, each of which is respectively inserted in the base, and is respectively fastened to the bottom of the pedestal and the top of the accommodating seat by two buckle pieces. The support post is used to define the displacement distance of the receiving seat when the compression spring is compressed by force. With the above design, through the improved fastening method, in addition to effectively avoiding the deformation of the supporting edge of the base, it can be more easily disassembled and replaced in use, which improves the convenience in the use of different production lines.

A snap ring may be provided on the top of each of the spring grooves, for stacking a plurality of semiconductor component test carriers. With this, the retaining ring provides a proper distance, which can stack and position the semiconductor component test carriers on each other, avoiding the damage of multiple stacked test carriers by contact pressure, and maintaining the flatness of the thin sheet base, which is convenient for stacking. The test carrier is used for recovery and storage after the subsequent tests.

A snap ring may be provided on the top of each of the support pillars, for stacking a plurality of semiconductor component test carriers. In this way, the retaining ring can provide an appropriate distance to stack and position the semiconductor component test carriers on each other, avoid the contact pressure damage of multiple stacked test carriers, and maintain the flatness of the thin sheet base, which is beneficial to The stacked test carriers are used for recovery and storage after the subsequent tests.

The two buckle pieces can be detachable components, and different types of receptacles can be replaced according to different production lines. Accordingly, the buckle is a convenient component for disassembly and replacement, instead of the traditional tenon mechanism, to improve convenience in use.

The two buckle pieces can define the rebound position when the compression spring rebounds. Therefore, the buckle can be used as a stopping point when the compression spring of the accommodating seat rebounds, thereby avoiding the problem of different heights of the accommodating seat when rebounding.

The floating stroke from the rebound position to the base may be 0.6 mm. Therefore, by defining the placement point of the buckle, the floating stroke of the accommodating seat is 0.6 mm, so that the deformation of the base can be avoided.

Another object of the present invention is to provide a semiconductor component testing device with a floating receiving seat, which can effectively solve the problem of deformation of the semiconductor component test carrier, so that the contact heat of each semiconductor component with the stylus base and the base The resistance can be made uniform, improving the uniformity of the test temperature.

In order to achieve the above object, the semiconductor component testing device with a floating receiving seat of the present invention includes an inner cavity, a semiconductor component test carrier, an outer cavity, a heat exchange unit, and a control unit. The inner cavity has at least one intake channel and at least one exhaust channel; the semiconductor component test carrier includes a base and a receiving seat, and the base is disposed in the inner cavity for connecting the receiving seat in series; The seat is provided with a plurality of accommodating grooves and a plurality of spring grooves. Each of the accommodating grooves respectively houses a semiconductor element. Each of the spring grooves respectively accommodates a compression spring, and two ends of the compression spring are connected. The spring groove and the base can buffer the receiving seat when it is pressed by force.

Wherein, the accommodating seat is fixed with a plurality of supporting posts, each of which is respectively inserted in the base, and is respectively fastened to the bottom of the pedestal and the top of the accommodating seat by two buckle pieces. The support post is used to define the displacement distance of the receiving seat when the compression spring is compressed by force. In addition, the outer cavity covers the upper, lower, and side edges of the inner cavity, and has at least one air inlet passage and at least one air exhaust passage for heating or cooling the inner cavity; the heat exchange unit is respectively connected with the inner cavity and At least one air inlet passage of the outer cavity is connected; the control unit is electrically connected to the heat exchange unit.

With the above design, the device can quickly adjust and maintain the test temperature of the inner cavity, and can provide a stable and difficult to drift test environment temperature and pressure in the inner cavity, which can greatly shorten the high and low temperature test time of semiconductor components and increase production. effectiveness. At the same time, the present invention combines the design of the aforementioned semiconductor component test carrier, which effectively solves the problem of deformation of the semiconductor component test carrier, so that the contact thermal resistance of each semiconductor element with the stylus base and the base can be made uniform, which improves the test temperature. Uniformity.

The above summary and the following detailed description are exemplary in order to further illustrate the scope of patent application of the present invention. Other objects and advantages of the present invention will be described in the following description and drawings.

Please refer to FIG. 1 to FIG. 3, which are an exploded view, a perspective view, and a cross-sectional view of a semiconductor component test carrier with a floating receiving seat according to a first embodiment of the present invention, respectively. The figure shows a semiconductor component test carrier 1 with a floating receptacle, which includes a base 2 and four receptacles 3 for carrying a plurality of semiconductor elements 4 for various inspection operations.

As shown in the figure, in this embodiment, the base 2 is a thin flat plate, which is mainly used to support the four receptacles 3, wherein the number of the receptacles 3 is not limited to four, and may be based on The type or number of the semiconductor elements 4 is increased or decreased by the total number of the capacity mounts 3. Each accommodating seat 3 is provided with a plurality of accommodating grooves 31 and a plurality of spring grooves 32. Each of the accommodating grooves 31 respectively contains a semiconductor element 4 for quantitatively inspecting a plurality of semiconductor elements 4 in batches to provide sufficient Carrying space. The spring grooves 32 respectively contain a compression spring 33. Both ends of the compression spring 33 are connected to the spring groove 32 and the base 2. Therefore, when the receiving seat 3 is pressed by force, it can have a cushioning effect.

Another feature of the present invention is that the accommodating seat 3 is fixed with a plurality of support columns 35, each of which is respectively inserted in the base 2 and is respectively correspondingly fastened to the base by two buckle members 34 The bottom of 2 and each support post 35 on the top of the receiving seat 3 are used to define the displacement distance of the receiving seat 3 when the compression spring 33 is compressed by force; further, the buckle member 34 can be C-shaped buckle, E Buckle and S-shaped buckle and other equivalent components. With the design, through the improved fastening method, in addition to effectively avoiding deformation of the supporting edge of the base 2, it can be more easily disassembled and replaced in use, and the convenience in use in different production lines is improved.

Next, please refer to FIG. 4A and FIG. 4B, which are respectively a cross-sectional view of an initial state and a pressed state of a semiconductor device test carrier with a floating receiving seat according to the first embodiment of the present invention. As shown in FIG. 4A, in the initial state, when the stylus base 11 is not pressed down by force, since a spring force of a compression spring 33 remains between the accommodation base 3 and the base 2, the accommodation base 3 and The base 2 is separated by a distance D, which is used as a buffer zone during depression. In this embodiment, the distance D is the floating stroke of the overall accommodation seat 3, which is 0.6 mm. By defining the above-mentioned buckle 34 Place the point and adjust the distance D after the compression spring 33 rebounds to avoid the deformation of the base 2. As shown in FIG. 4B, in the pressed state, the stylus base 11 is pressed down by a driving force at this time, so that the stylus base 11 can closely fit the accommodation base 3, so the accommodation base 3 and the base 2 are forced. The distance D is reduced or eliminated, and the relative positions of the accommodation seat 3, the base 2 and the stylus 11 are effectively fine-tuned, so as to avoid deformation of the base 2 during compression and affect the test result. Finally, after the pressure measurement is completed, the stylus base 11 returns to the initial position upward, and the receiving base 3 defines the rebound height of the compression spring 33 when it rebounds according to the buckling position of the two buckle pieces 34, and This rebound position is equivalent to the initial position of FIG. 4A.

Moreover, please refer to FIG. 5, which is a cross-sectional view of a semiconductor device test carrier with a floating receiving seat according to a second embodiment of the present invention. As shown in the figure, the biggest feature of the semiconductor component test carrier 1 ′ of this embodiment is that a snap ring 321 is provided on the top of each spring groove 32, and a snap ring is also provided on the top of each support post 35. 211, wherein the snap rings 321, 211 are used to engage the support pillar 35 and the flange of the compression spring 33 of another semiconductor component test carrier 1 '. Therefore, through the above design, the present invention can also provide a proper spacing to stack and position the semiconductor component test carriers 1 'on each other, avoid the multiple stacked test carriers 1' from being touched and damaged, and maintain a thin sheet shape. The flatness of the base 2 is conducive to the recovery and storage of the stacked test carriers 1 'after the subsequent tests.

Finally, please refer to FIG. 6 and FIG. 7, which are respectively a schematic diagram and a cross-sectional view of a semiconductor device testing device with a floating receiving seat according to a preferred embodiment of the present invention. The figure shows a semiconductor device testing device 10 with a floating receiving seat, which is used to improve the problem of uneven heating and temperature contact of the semiconductor device 4. It mainly includes a semiconductor device test carrier 1, an inner cavity 5, and an outer cavity. The body 6, a heat exchange unit 7, and a control unit 8. The part about the semiconductor component test carrier 1 has been explained in detail in the foregoing description, so it will not be repeated here, please refer to the illustration in the previous paragraph. The central accommodating space of the semiconductor device testing equipment 10 is an inner cavity 5 for accommodating a semiconductor component test carrier 1. The inner cavity 5 has at least one air inlet channel 51 and at least one air outlet channel. 52; and the outer cavity 6 covers the upper, lower, and side edges of the inner cavity 5, and is composed of an upper cavity 63 and a lower cavity 64, and has at least one intake passage 61 and at least one exhaust passage 62, It is used for heating or cooling the inner cavity 5.

In this embodiment, the inner cavity 5 has two intake passages 51 and four exhaust passages 52. The two intake passages 51 of the inner cavity 5 are close to the middle of a test carrier 101, and the four exhaust passages 52 are respectively located at Test the two end sides of the carrier board 101. In addition, the upper cavity 63 has an intake passage 631 and two exhaust passages 632. As shown in FIG. 6, the intake passage 631 of the upper cavity 63 is located at the center of the test carrier 101, and the two exhaust passages 632 are respectively located at Test the two end sides of the carrier board 101. In addition, the lower cavity 64 has an intake passage 61 and two exhaust passages 62. As shown in FIG. 7, the intake passage 61 of the lower cavity 64 is located at the center of the test carrier 101, and the two exhaust passages 62 are respectively located at Test the two end sides of the carrier board 101.

As shown in FIG. 6, the heat exchange unit 7 is respectively connected to the air inlet passage 51 of the inner cavity 5, the air inlet passage 631 of the upper cavity 63 and the air inlet passage 61 of the lower cavity 64; the control unit 8 is electrically connected Heat exchange unit 7. When a specific temperature and pressure gas is poured into the inner cavity 5 and the outer cavity 6 composed of the upper cavity 63 and the lower cavity 64 respectively through the heat exchange unit 7, the outer cavity 6 covers the inner cavity 5 Upper, lower and side, so the temperature of the inner cavity 5 can be quickly exchanged through the outer cavity 6, which can ensure that the inner cavity 5 reaches and maintains the temperature set by the control unit 8. In this embodiment, the temperature conversion of the inner cavity 5 and the outer cavity 6 can be completed in a short time. Therefore, when the semiconductor element 4 is switched between high and low temperature, the time for transient temperature conversion can be greatly shortened, and the test efficiency is increased.

In summary, the semiconductor device testing device 10 formed by combining the semiconductor device test carrier 1 with the high and low temperature test module in the present invention can quickly adjust and maintain the test temperature of the inner cavity 5 and can provide internal The test environment temperature and pressure of the cavity 5 that are stable and difficult to drift can greatly shorten the high and low temperature test time of the semiconductor element and increase production efficiency. At the same time, the present invention combines the aforementioned design of the semiconductor component test carrier 1 to effectively solve the problem of easy deformation of the semiconductor component test carrier 1 under long-term use, so that the contact thermal resistance of each semiconductor component 4 with the stylus base and the base can be reduced. For consistency, improve the uniformity of the test temperature.

The above embodiments are merely examples for the convenience of description. The scope of the claimed rights of the present invention should be based on the scope of the patent application, rather than being limited to the above embodiments.

1,1’‧‧‧Semiconductor component test carrier

10‧‧‧Semiconductor component test equipment

101‧‧‧test carrier

11‧‧‧ Stylus

2‧‧‧ base

211‧‧‧Snap ring

3‧‧‧ accommodation seat

31‧‧‧Receiving slot

32‧‧‧ spring groove

321‧‧‧Snap ring

33‧‧‧Compression spring

34‧‧‧ buckle

35‧‧‧ support post

4‧‧‧Semiconductor

5‧‧‧ inner cavity

51,61,631‧‧‧Air intake channel

52,62,632‧‧‧Exhaust passage

6‧‧‧ Outer cavity

63‧‧‧ Upper cavity

64‧‧‧ lower cavity

7‧‧‧ heat exchange unit

8‧‧‧Control unit

D‧‧‧Pitch

FIG. 1 is an exploded view of a semiconductor component test carrier with a floating receiving seat according to a first embodiment of the present invention. FIG. 2 is a perspective view of a semiconductor device test carrier with a floating receiving seat according to the first embodiment of the present invention. 3 is a cross-sectional view of a semiconductor device test carrier with a floating receiving seat according to a first embodiment of the present invention. 4A is a cross-sectional view of an initial state of a semiconductor device test carrier with a floating receiving seat according to the first embodiment of the present invention. FIG. 4B is a cross-sectional view of a pressed state of a semiconductor component test carrier with a floating receiving seat according to the first embodiment of the present invention. 5 is a cross-sectional view of a semiconductor component test carrier with a floating receiving seat according to a second embodiment of the present invention. FIG. 6 is a schematic diagram of a semiconductor device testing device with a floating receiving seat according to a preferred embodiment of the present invention. FIG. 7 is a cross-sectional view of a semiconductor device testing device with a floating receiving seat according to a preferred embodiment of the present invention.

Claims (14)

A semiconductor component test carrier with a floating receiving seat includes: a base; and a receiving seat provided with a plurality of receiving grooves and a plurality of spring grooves, and each of the receiving grooves respectively contains a semiconductor Element, each of the spring grooves respectively accommodates a compression spring, and two ends of the compression spring are connected to the spring groove and the base, wherein the receiving seat is fixed with a plurality of support columns, and each of the support columns They are respectively inserted in the base, and are respectively fastened to the support pillars at the bottom of the base and the top of the receiving seat by two buckle pieces respectively, which are used to define when the compression spring is compressed by force, The displacement distance of the receiving seat. For example, the semiconductor component test carrier of the floating receiving seat in the first scope of the application for a patent, wherein a top ring of each spring groove is provided with a snap ring for stacking a plurality of semiconductor element test carriers. For example, the semiconductor component test carrier of the floating receiving seat in the first scope of the application for a patent, wherein a retaining ring is provided on the top of each support post for stacking a plurality of semiconductor element test carriers. For example, the semiconductor component test carrier of the floating receiving seat in the first scope of the patent application, wherein the two buckle pieces are detachable components, and different types of receiving seats can be replaced according to different production lines. For example, the semiconductor component test carrier of the floating receiving seat in the first scope of the patent application, wherein the two buckle members define the rebound position when the compression spring rebounds. For example, the semiconductor component test carrier of the floating receiving seat in the fifth scope of the application for a patent, wherein the floating stroke from the rebound position to the base is 0.6 mm. For example, the semiconductor component test carrier of the floating receiving seat in the first scope of the patent application, wherein the two buckles are C-shaped buckles, E-shaped buckles, or S-shaped buckles, which are respectively buckled on the bottom of the base. And on each support post on the top of the receiving seat. A semiconductor device testing device with a floating receiving seat, which is used to improve the problem of uneven heating temperature of semiconductor components during contact, including: an inner cavity having at least one air inlet channel and at least one exhaust channel; a semiconductor device test The carrier plate includes a base and a receiving seat, the base is disposed in the inner cavity; the receiving seat is provided with a plurality of receiving grooves and a plurality of spring grooves, and each of the receiving grooves is respectively provided with one For a semiconductor element, each of the spring grooves respectively contains a compression spring, and two ends of the compression spring are connected to the spring groove and the base, wherein the receiving seat is fixed with a plurality of supporting columns, each Support pillars are respectively penetrated in the base, and two buckle pieces are respectively correspondingly fastened to each of the support pillars at the bottom of the base and at the top of the receiving seat to define when the compression spring is compressed by the force The displacement distance of the receiving seat; an outer cavity covering the upper, lower and side of the inner cavity, and having at least one air inlet channel and at least one air outlet channel for heating the inner cavity Or cooling; a heat exchange unit Respectively connected to the at least one air inlet passage of the inner cavity and the outer cavity; and a control unit electrically connected to the heat exchange unit. For example, the semiconductor device testing equipment of the floating receiving seat in the patent application No. 8 wherein a top ring of each spring groove is provided with a snap ring for stacking a plurality of semiconductor device test carriers. For example, the semiconductor device testing equipment of the floating receiving seat in the eighth patent application scope, wherein a top ring of each support post is provided with a snap ring for stacking a plurality of semiconductor device test carriers. For example, the semiconductor component testing equipment for a floating accommodation seat in the scope of patent application No. 8 in which the two buckle parts are detachable components, and different types of accommodation seats can be replaced according to different production lines. For example, the semiconductor device testing equipment of the floating receiving seat in the eighth patent application scope, wherein the two buckle members define a rebound position when the compression spring rebounds. For example, the semiconductor device testing equipment of the floating receiving seat in the scope of application for patent No. 12, wherein the floating stroke from the rebound position to the base is 0.6 mm. For example, the semiconductor device testing equipment of the floating receiving seat in the scope of patent application No. 8 wherein the two buckles are C-shaped buckles, E-shaped buckles or S-shaped buckles, which are respectively buckled on the bottom of the base and On each of the supporting posts on the top of the receiving seat.