CN111190087B - Semiconductor element test carrying disc with floating containing seat and test equipment thereof - Google Patents
Semiconductor element test carrying disc with floating containing seat and test equipment thereof Download PDFInfo
- Publication number
- CN111190087B CN111190087B CN201811357767.4A CN201811357767A CN111190087B CN 111190087 B CN111190087 B CN 111190087B CN 201811357767 A CN201811357767 A CN 201811357767A CN 111190087 B CN111190087 B CN 111190087B
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- semiconductor device
- base
- seat
- spring
- inner cavity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
Abstract
The invention relates to a semiconductor element test carrying disc with a floating containing seat and test equipment thereof. The containing seat is provided with a plurality of containing grooves for containing the semiconductor elements and a plurality of spring grooves for containing the compression springs, the containing seat is fixedly provided with a plurality of supporting columns, each supporting column respectively penetrates through the base, and two buckling pieces are respectively buckled on each supporting column at the bottom of the base and at the top of the containing seat correspondingly. Therefore, through the improved buckling mode, the deformation of the supporting edge of the base is effectively avoided, the disassembly and the replacement in use can be facilitated, and the convenience in use of different production lines is improved.
Description
Technical Field
The present invention relates to a semiconductor device test tray with a floating receptacle and a test apparatus thereof, and more particularly, to a semiconductor device test tray with a floating receptacle and a test apparatus thereof suitable for testing a wafer to be tested.
Background
In the prior art, when a probing seat is used to test a semiconductor device, a spring connector (Pogo Pin) on the probing seat first contacts the semiconductor device to generate a downward pressure, the semiconductor device is loaded in a containing seat, and if a thin base for supporting the containing seat cannot bear the downward pressure from the probing seat, the thin base and the containing seat are deformed synchronously, so that the contact adhesion and the overall accuracy of a probe and the semiconductor device are damaged, and the test yield is further affected.
In addition, when the containing base is installed in the past, the containing base is clamped on the base through the clamping tenon, so that the thin base needs to be expanded outwards firstly, the clamping tenon of the containing base enters the expanded gap of the thin base, and finally the thin base is clamped inwards, and the assembling procedure is completed. However, in the process of expanding the thin base outward, the supporting edge of the thin base is easily deformed, and after repeated use for a long time, the clamping force is greatly weakened, and the problems of poor clamping performance and element damage occur, resulting in reduction of the service life.
Therefore, a semiconductor device test tray with a floating receptacle and a test apparatus thereof are provided to solve the above problems.
Disclosure of Invention
The present invention is directed to a semiconductor device test tray with a floating receptacle, which effectively prevents the deformation of the base caused by the pressing down of the probe card receptacle, thereby reducing the testing yield. The invention changes the existing tenon structure of the base form which needs to be expanded outwards into the buckling piece of the simple buckling form, thereby not only effectively avoiding the deformation of the supporting edge of the base, but also being more convenient for disassembly and replacement in use and improving the convenience in use of different production lines.
In order to achieve the above object, the present invention provides a semiconductor device testing tray with a floating holder, which comprises a base and a holder. The containing seat is provided with a plurality of containing grooves and a plurality of spring grooves, each containing groove is respectively provided with a semiconductor element, each spring groove is respectively provided with a compression spring, and two ends of each compression spring are connected with the spring grooves and the base, so that the containing seat can have a buffering effect when being pressed by stress.
The containing seat is fixedly provided with a plurality of supporting columns, each supporting column penetrates through the base, and two buckling pieces are buckled on each supporting column at the bottom of the base and the top of the containing seat correspondingly and respectively so as to define the displacement distance of the containing seat when the compression spring is stressed and compressed. Through the design, through the improved buckling mode, the deformation of the supporting edge of the base is effectively avoided, the disassembly and assembly replacement in the use is more convenient, and the convenience in use of different production lines is improved.
The top of each spring groove can be provided with a clamping ring for stacking a plurality of semiconductor element test carrying discs. Therefore, the clamping ring provides a proper distance, the semiconductor element test carrying discs can be stacked and positioned, the damage caused by the touch pressure of a plurality of stacked test carrying discs is avoided, the flatness of the thin sheet-shaped base is maintained, and the stacked test carrying discs are favorable for recycling and storing after the subsequent test is finished.
A retainer ring may be disposed on the top of each support pillar for stacking a plurality of semiconductor device test trays. Therefore, the clamping ring can provide a proper distance to stack and position the semiconductor element test carrying discs mutually, prevent the stacked test carrying discs from being damaged due to touch pressure, maintain the flatness of the thin sheet-shaped base and be beneficial to recycling and storing the stacked test carrying discs after the subsequent test is finished.
The two buckle pieces can be detachable elements, and different types of containing seats can be replaced according to different production lines. Therefore, the buckling piece is an element which is convenient to disassemble and assemble, replaces a traditional tenon clamping mechanism, and improves the convenience in use.
The two catches define a rebound position at which the compression spring rebounds. Therefore, the buckling piece can be used as a stopping point when the containing seat compression spring rebounds, and the problem of different heights when the containing seat rebounds is avoided.
The floating stroke from the rebound position to the base can be 0.6 mm. Therefore, the floating stroke of the accommodating seat is 0.6mm by defining the placing point of the buckling piece, and the situation of deformation of the base can be avoided.
Another objective of the present invention is to provide a semiconductor device testing apparatus with a floating holder, which can effectively solve the problem of deformation of the semiconductor device testing tray, so that the thermal contact resistances between each semiconductor device and the probe holder and the base can be consistent, and the uniformity of the testing temperature can be improved.
In order to achieve the above object, the semiconductor device testing apparatus with a floating receptacle of the present invention comprises an inner chamber, a semiconductor device testing tray, an outer chamber, a heat exchange unit and a control unit. The inner cavity is provided with at least one air inlet channel and at least one air outlet channel; the semiconductor element test carrying disc comprises a base and a containing seat, wherein the base is arranged in the inner cavity and is used for being connected with the containing seat in series; the containing seat is provided with a plurality of containing grooves and a plurality of spring grooves, each containing groove is respectively provided with a semiconductor element, each spring groove is respectively provided with a compression spring, and two ends of each compression spring are connected with the spring grooves and the base, so that the containing seat can have a buffering effect when being pressed by stress.
The containing seat is fixedly provided with a plurality of supporting columns, each supporting column penetrates through the base, and two buckling pieces are buckled on each supporting column at the bottom of the base and the top of the containing seat correspondingly and respectively so as to define the displacement distance of the containing seat when the compression spring is stressed and compressed. In addition, the outer cavity body covers the upper part, the lower part and the side edge of the inner cavity body and is provided with at least one air inlet channel and at least one air outlet channel for heating or cooling the inner cavity body; the heat exchange unit is respectively connected with at least one air inlet channel of the inner cavity and the outer cavity; the control unit is electrically connected with the heat exchange unit.
Through the design, the equipment can quickly adjust and maintain the testing temperature of the inner cavity, can provide stable and difficult-to-drift testing environment temperature and pressure for the inner cavity, can greatly shorten the high-low temperature testing time of the semiconductor element and increase the production efficiency. Meanwhile, the invention combines the design of the semiconductor element test carrying disc, effectively solves the problem of deformation of the semiconductor element test carrying disc, leads the thermal contact resistance of each semiconductor element, the probe seat and the base to tend to be consistent, and improves the uniformity of test temperature.
Both the foregoing general description and the following detailed description are exemplary and explanatory in nature to further illustrate the scope of the invention. Other objects and advantages of the present invention will become apparent from the following description and drawings.
Drawings
FIG. 1 is an exploded view of a semiconductor device test tray with a floating receptacle according to a first embodiment of the present invention.
FIG. 2 is a perspective view of a semiconductor device test tray with a floating receptacle according to a first embodiment of the present invention.
FIG. 3 is a cross-sectional view of a semiconductor device test tray with a floating receptacle according to a first embodiment of the present invention.
FIG. 4A is a cross-sectional view of the semiconductor device test tray with floating receptacles according to the first embodiment of the present invention in an initial state.
FIG. 4B is a cross-sectional view of the semiconductor device test tray with a floating receptacle according to the first embodiment of the present invention in a pressed state.
FIG. 5 is a cross-sectional view of a semiconductor device test tray with a floating receptacle according to a second embodiment of the present invention.
FIG. 6 is a schematic diagram of a semiconductor device testing apparatus with a floating holder according to a preferred embodiment of the present invention.
FIG. 7 is a cross-sectional view of a semiconductor device testing apparatus with a floating holder according to a preferred embodiment of the present invention.
[ notation ] to show
1, 1' -semiconductor element test tray; 10-semiconductor element test equipment;
101-testing a carrier plate; 11-a needle measuring seat;
2-a base; 211-a snap ring;
3-a containing seat; 31-a receiving groove;
32-spring groove; 321-a snap ring;
33-a compression spring; 34-fastener;
35-a support column; 4-a semiconductor element;
5-inner cavity; 51, 61, 631-intake passages;
52, 62, 632-exhaust channel; 6-outer cavity;
63-upper chamber; 64-a lower cavity;
7-a heat exchange unit; 8-a control unit;
d-spacing.
Detailed Description
Fig. 1 to fig. 3 are an exploded view, a perspective view and a cross-sectional view of a semiconductor device test tray with a floating receptacle according to a first embodiment of the present invention. There is shown a semiconductor device test tray 1 with floating receptacles, which includes a base 2 and four receptacles 3 for carrying a plurality of semiconductor devices 4 for various testing operations.
As shown in the figure, in the present embodiment, the base 2 is a thin flat plate, and is mainly used for supporting four accommodating seats 3, wherein the number of the accommodating seats 3 is not limited to four, and the total number of the accommodating seats 3 can be increased or decreased according to the type or the number of the semiconductor elements 4. Each accommodation seat 3 is provided with a plurality of accommodation grooves 31 and a plurality of spring grooves 32, each accommodation groove 31 is respectively provided with a semiconductor element 4, and a sufficient bearing space is provided by batch-quantitative detection of the plurality of semiconductor elements 4. The spring grooves 32 are respectively accommodated with a compression spring 33, and two ends of the compression spring 33 are connected with the spring grooves 32 and the base 2, so that the accommodating seat 3 can have a buffering effect when being pressed by force.
The present invention is further characterized in that the accommodating base 3 is fixedly provided with a plurality of support pillars 35, each support pillar 35 is respectively inserted into the base 2, and two fastener members 34 are respectively and correspondingly fastened on each support pillar 35 at the bottom of the base 2 and at the top of the accommodating base 3, so as to define the displacement distance of the accommodating base 3 when the compression spring 33 is compressed under force; furthermore, the buckle element 34 can be a C-shaped buckle, an E-shaped buckle, an S-shaped buckle, or other equivalent elements. Through the design, through the lock mode of improvement formula, except effectively avoiding the support limit deformation of base 2, the dismouting replacement that more can facilitate the use promotes the convenience on the different production lines use.
Next, please refer to fig. 4A and 4B, which are a cross-sectional view of an initial state and a pressed state of the semiconductor device test tray with a floating seat according to the first embodiment of the present invention. As shown in fig. 4A, in the initial state, when the needle measuring seat 11 is not pressed down by a force, a spring force action of the compression spring 33 is still maintained between the accommodating seat 3 and the base 2, so that the accommodating seat 3 and the base 2 are separated by a distance D as a buffer interval when pressed down, in this embodiment, the distance D is a floating stroke of the entire accommodating seat 3, which is 0.6mm, and the size of the distance D after the compression spring 33 rebounds is adjusted by defining the placing point of the latch 34, so as to avoid the occurrence of the deformation of the base 2. As shown in fig. 4B, in the pressed state, the needle measuring base 11 is pressed by the driving force, which is to make the needle measuring base 11 closely fit the accommodating base 3, so that the distance D between the accommodating base 3 and the base 2 is reduced or eliminated, the relative positions of the accommodating base 3, the base 2 and the needle measuring base 11 are effectively fine-tuned, and the deformation of the base 2 during pressing is avoided from affecting the test result. Finally, after the pressure measurement is finished, the needle measuring seat 11 returns upwards to the initial position, and the housing seat 3 defines the rebound height of the compression spring 33 according to the buckling position of the two buckling pieces 34, and the rebound position is equal to the initial position of fig. 4A.
Referring to fig. 5, a cross-sectional view of a semiconductor device test tray with a floating receptacle according to a second embodiment of the present invention is shown. As shown in the drawings, the semiconductor device test tray 1' of the present embodiment is characterized in that: a snap ring 321 is disposed on the top of each spring groove 32, and a snap ring 211 is also disposed on the top of each support pillar 35, wherein the snap rings 321, 211 are used to engage with the support pillar 35 of another semiconductor device test carrier 1' and the flange of the compression spring 33. Therefore, through the above design, the present invention can also provide a proper distance to stack and position the semiconductor device test trays 1 ', so as to prevent the stacked test trays 1 ' from being damaged by contact pressure, and maintain the flatness of the thin sheet-like base 2, thereby facilitating the recycling and storage of the stacked test trays 1 ' after the subsequent test.
Finally, please refer to fig. 6 and fig. 7, which are a schematic diagram and a cross-sectional view of a semiconductor device testing apparatus with a floating holder according to a preferred embodiment of the present invention. The semiconductor device testing apparatus 10 with floating holder is shown for improving the uneven contact heating temperature of the semiconductor device 4, and mainly comprises a semiconductor device testing carrier 1, an inner cavity 5, an outer cavity 6, a heat exchange unit 7 and a control unit 8. Since the parts of the semiconductor device test tray 1 have been explained in detail in the foregoing description, it is not repeated herein, and reference is made to the illustration of the foregoing paragraphs. The central accommodating space of the semiconductor device testing apparatus 10 is an inner cavity 5 for accommodating a semiconductor device testing carrier disc 1, and the inner cavity 5 has at least one air inlet channel 51 and at least one air outlet channel 52; the outer cavity 6 covers the upper, lower and side of the inner cavity 5, and is composed of an upper cavity 63 and a lower cavity 64, and has at least one air inlet channel 61 and at least one air outlet channel 62 for heating or cooling the inner cavity 5.
In the present embodiment, the inner cavity 5 has two air inlet channels 51 and four air outlet channels 52, the two air inlet channels 51 of the inner cavity 5 are near the middle of a test carrier board 101, and the four air outlet channels 52 are respectively located at two end sides of the test carrier board 101. In addition, the upper chamber 63 has an air inlet channel 631 and two air outlet channels 632, as shown in fig. 6, the air inlet channel 631 of the upper chamber 63 is located at the center of the test carrier board 101, and the two air outlet channels 632 are located at two end sides of the test carrier board 101. In addition, the lower chamber 64 has an air inlet channel 61 and two air outlet channels 62, as shown in fig. 7, the air inlet channel 61 of the lower chamber 64 is located at the center of the test carrier board 101, and the two air outlet channels 62 are located at two end sides of the test carrier board 101.
As shown in fig. 6, the heat exchange unit 7 is connected to the two intake passages 51 of the inner chamber 5, the intake passage 631 of the upper chamber 63, and the intake passage 61 of the lower chamber 64, respectively; the control unit 8 is electrically connected to the heat exchange unit 7. When the gas with specific temperature and pressure is respectively injected into the inner cavity 5 and the outer cavity 6 composed of the upper cavity 63 and the lower cavity 64 through the heat exchange unit 7, the outer cavity 6 covers the upper part, the lower part and the side edge of the inner cavity 5, so that the temperature change of the inner cavity 5 can be quickly exchanged by the outer cavity 6, and the inner cavity 5 can be ensured to reach and maintain the temperature set by the control unit 8. In this embodiment, the temperature of the inner cavity 5 and the outer cavity 6 can be changed in a short time, so that the transient temperature conversion time can be greatly shortened when the semiconductor device 4 is switched between high and low temperatures, and the testing efficiency can be increased.
In summary, the semiconductor device testing apparatus 10 formed by combining the semiconductor device testing tray 1 with the high/low temperature testing module can rapidly adjust and maintain the testing temperature of the inner cavity 5, and can provide a stable and non-drifting testing environment temperature and pressure for the inner cavity 5, thereby greatly shortening the high/low temperature testing time of the semiconductor device and increasing the production efficiency. Meanwhile, the invention combines the design of the semiconductor element test carrying disc 1, effectively solves the problem that the semiconductor element test carrying disc 1 is easy to deform after being used for a long time, leads the contact thermal resistance of each semiconductor element 4, the probe seat and the base to tend to be consistent, and improves the uniformity of the test temperature.
The above-described embodiments are merely exemplary for convenience in explanation, and the scope of the claims of the present invention should be determined by the claims and not limited to the above-described embodiments.
Claims (14)
1. A semiconductor device test carrier with floating receptacles, comprising:
a base; and
the accommodating seat is provided with a plurality of accommodating grooves and a plurality of spring grooves, each accommodating groove is respectively provided with a semiconductor element, each spring groove is respectively provided with a compression spring, two ends of each compression spring are connected with the spring grooves and the base, the accommodating seat is fixedly provided with a plurality of supporting columns, each supporting column respectively penetrates through the base, and two buckling pieces are correspondingly buckled on each supporting column at the bottom of the base and the top of the accommodating seat respectively to define the displacement distance of the accommodating seat when the compression springs are stressed and compressed.
2. The semiconductor device test tray of claim 1, wherein a snap ring is disposed at the top of each spring groove for stacking a plurality of semiconductor device test trays.
3. The semiconductor device test tray of claim 1, wherein a snap ring is disposed on the top of each support post for stacking a plurality of semiconductor device test trays.
4. The semiconductor device testing tray according to claim 1, wherein the two latches are removable components for replacing different types of receptacles according to different production lines.
5. The semiconductor device test tray of claim 1, wherein the two catches define a rebound position at which the compression spring rebounds.
6. The semiconductor device test tray of claim 5, wherein the floating stroke of the resilient position to the base is 0.6 mm.
7. The semiconductor device testing tray according to claim 1, wherein the two latching members are C-shaped, E-shaped or S-shaped latches, which are respectively and correspondingly latched to the bottom of the base and each of the supporting posts at the top of the receptacle.
8. A semiconductor device testing apparatus with floating holder for improving the uneven contact heating temperature of semiconductor device, comprising:
an inner cavity with at least one air inlet channel and at least one air outlet channel;
a semiconductor element test carrying disc, which comprises a base and a holding seat, wherein the base is arranged in the inner cavity; the containing seat is provided with a plurality of containing grooves and a plurality of spring grooves, each containing groove is respectively provided with a semiconductor element, each spring groove is respectively provided with a compression spring, two ends of each compression spring are connected with the spring grooves and the base, wherein the containing seat is fixedly provided with a plurality of supporting columns, each supporting column is respectively penetrated in the base, and two buckling pieces are respectively buckled on each supporting column at the bottom of the base and the top of the containing seat correspondingly so as to define the displacement distance of the containing seat when the compression springs are stressed and compressed;
the outer cavity body coats the upper part, the lower part and the side edge of the inner cavity body, and is provided with at least one air inlet channel and at least one air outlet channel for heating or cooling the inner cavity body;
the heat exchange unit is respectively connected with the at least one air inlet channel of the inner cavity and the at least one air inlet channel of the outer cavity; and
and the control unit is electrically connected with the heat exchange unit.
9. The semiconductor device testing apparatus of claim 8, wherein a snap ring is disposed at a top of each spring recess for stacking a plurality of semiconductor device test trays.
10. The semiconductor device testing apparatus of claim 8, wherein a snap ring is provided on a top of each supporting post for stacking a plurality of semiconductor device test trays.
11. The semiconductor device testing apparatus of claim 8, wherein the two latching members are removable components, so that different types of the receptacles can be replaced according to different production lines.
12. The semiconductor device testing apparatus of claim 8, wherein the two catches define a rebound position at which the compression spring rebounds.
13. The semiconductor device testing apparatus of claim 12, wherein the floating stroke of the resilient position to the base is 0.6 mm.
14. The apparatus for testing semiconductor devices according to claim 8, wherein the two latching members are C-shaped, E-shaped or S-shaped latches, which are respectively and correspondingly latched to the bottom of the base and each of the supporting posts at the top of the receptacle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811357767.4A CN111190087B (en) | 2018-11-15 | 2018-11-15 | Semiconductor element test carrying disc with floating containing seat and test equipment thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811357767.4A CN111190087B (en) | 2018-11-15 | 2018-11-15 | Semiconductor element test carrying disc with floating containing seat and test equipment thereof |
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| Publication Number | Publication Date |
|---|---|
| CN111190087A CN111190087A (en) | 2020-05-22 |
| CN111190087B true CN111190087B (en) | 2022-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811357767.4A Active CN111190087B (en) | 2018-11-15 | 2018-11-15 | Semiconductor element test carrying disc with floating containing seat and test equipment thereof |
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| TWI612316B (en) * | 2017-05-22 | 2018-01-21 | 京元電子股份有限公司 | High-Lower Temperature Switch Test Module |
| CN107664740A (en) * | 2016-07-27 | 2018-02-06 | 三星电子株式会社 | Test board and test system for semiconductor packages |
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| US6744268B2 (en) * | 1998-08-27 | 2004-06-01 | The Micromanipulator Company, Inc. | High resolution analytical probe station |
| DE102007032557B4 (en) * | 2007-07-12 | 2010-09-16 | Multitest Elektronische Systeme Gmbh | Device for testing electronic components, in particular ICs, with a sealing board arranged inside a pressure test chamber |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2006506629A (en) * | 2002-11-18 | 2006-02-23 | アプライド マテリアルズ ゲーエムベーハー | Apparatus and method for contact of a specimen |
| CN102084260A (en) * | 2008-07-08 | 2011-06-01 | 株式会社爱德万测试 | Electronic component testing method, insert, tray, and electronic component testing apparatus |
| CN201594532U (en) * | 2009-08-20 | 2010-09-29 | 吉林华微电子股份有限公司 | Full packing die of semiconductor device with retractable locating needles by extruding plastic package material |
| CN106291301A (en) * | 2015-06-08 | 2017-01-04 | 京元电子股份有限公司 | Semiconductor subassembly pressure test device and test equipment thereof |
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| CN111190087A (en) | 2020-05-22 |
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