CN102084260A - Electronic component testing method, insert, tray, and electronic component testing apparatus - Google Patents
Electronic component testing method, insert, tray, and electronic component testing apparatus Download PDFInfo
- Publication number
- CN102084260A CN102084260A CN2009801267784A CN200980126778A CN102084260A CN 102084260 A CN102084260 A CN 102084260A CN 2009801267784 A CN2009801267784 A CN 2009801267784A CN 200980126778 A CN200980126778 A CN 200980126778A CN 102084260 A CN102084260 A CN 102084260A
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- Prior art keywords
- electronic component
- insert
- test
- socket
- tested electronic
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
Abstract
A bottom plate (760a) of a device carrier (760) of an insert (710) has a thickness (B), which is substantially equal to the total of a height (A) of a solder ball (HB) extracted from an IC device main body (901) and a first protruding quantity (Cop) of a contact pin (51) from a housing (52) of a socket (50) while testing is performed. In a state where a bottom plate (760a) is sandwiched between a main body (901) and a housing (52), an IC device is tested by pressing the IC device to the socket (50) and bringing the solder ball (HB) of the IC device into electrical contact with the contact pin (51) of the socket (50).
Description
Technical field
The present invention relates to method for testing electronic components that semiconductor integrated circuit component various electronic components such as (the following IC devices that also is called typically) are tested, and can hold the insert of IC device, the pallet that comprises this insert and electronic component testing apparatus.
Background technology
In the manufacture process of IC device, electronic component testing apparatus is used to the performance and the effect of test I C device.In such electronic component testing apparatus, the IC device is pressed on the socket of measuring head by processor (Handler), contacting under the pin state of contact of the terminal that makes the IC device and socket, test machine carries out the test of IC device by measuring head.
The contact pin of socket is set with the suitableeest path increment that conducts when being used to guarantee to test.Always be known that because the thickness of IC device is different because of kind, push the thickness of the pusher etc. of IC device by variation, the optimization of stroke when seeking to push.
Summary of the invention
The problem that invention solves
Yet, have to change pusher etc. during the variation in thickness of IC device, there is the low problem of electronic component testing apparatus operation ratio.
The technical problem to be solved in the present invention is, method for testing electronic components, insert, pallet and the electronic component testing apparatus of the lifting that can seek operation ratio is provided.
The technological means of dealing with problems
(1) for reaching above-mentioned purpose, according to the present invention, a kind of method for testing electronic components is provided, by being pressed into, tested electronic component make described tested terminals of electronic components electrically contact the test of carrying out described tested electronic component on the socket with the pin that contacts of described socket, the height with as many as described terminal of drawing from the main body of described tested electronic component and when test described contact pin be clipped in from the pad of the thickness of the 1st outstanding overhang sum of the housing of described socket under the state between described main body and the described housing, described tested electronic component is pressed into (with reference to claim 1) on the described socket.
Foregoing invention is not particularly limited, but preferably, described the 1st overhang is shorter from the 2nd outstanding overhang of described housing than described contact pin under the no load condition, and the 3rd overhang long (with reference to claim 2) that described contact pin is given prominence to from described housing under the maximum collapse state than described contact pin.
Foregoing invention is not particularly limited, but preferably, described pad is the base plate (with reference to claim 3) that holds the insert of described tested electronic component.
(2) for reaching above-mentioned purpose, according to the present invention, a kind of insert is provided, be to be provided with by tested electronic component being pressed on the pallet that contacts conveyance in the electronic component testing apparatus that pin electrically contacts the test of carrying out described tested electronic component that makes described tested terminals of electronic components and described socket on the socket, the insert that can hold described tested electronic component, comprise the maintaining part that keeps described tested electronic component, the height that described maintaining part has an as many as described terminal of drawing from the main body of described tested electronic component of thickness described base plate (with reference to claim 4) that contacts pin from the 1st outstanding overhang sum of the housing of described socket during with test.
Foregoing invention is not particularly limited, but preferably, when described tested electronic component was pressed into described socket, described base plate inserted between the described housing of the described main body of described tested electronic component and described socket (with reference to claim 5).
Foregoing invention is not particularly limited, but preferably, described the 1st overhang is shorter from the 2nd outstanding overhang of described housing than described contact pin under the no load condition, and the 3rd overhang long (with reference to claim 6) that described contact pin is given prominence to from described housing under the maximum collapse state than described contact pin.
Foregoing invention is not particularly limited, but preferably, described base plate has the through hole (with reference to claim 7) that the described terminal of described tested electronic component can be chimeric.
Foregoing invention is not particularly limited, but preferably, described insert comprises the insert main body with the accommodation hole that holds described tested electronic component, and described maintaining part keeps being contained in the described tested electronic component (with reference to claim 8) in the described accommodation hole.
Foregoing invention is not particularly limited, but preferably, comprises that also described relatively insert releasably keeps the loading and unloading unit (with reference to claim 9) of described maintaining part.
For reaching above-mentioned purpose, according to the present invention, provide a kind of pallet, but comprise that above-mentioned insert and fine motion ground keep the frame parts (with reference to claim 10) of described insert.
For reaching above-mentioned purpose, according to the present invention, a kind of electronic component testing apparatus is provided, it is the electronic component testing apparatus that pin electrically contacts the test of carrying out described tested electronic component that contacts that makes described tested terminals of electronic components and described socket on the socket by tested electronic component is pressed into, comprise described tested electronic component is being contained in the test department that is pressed into described socket under the state of above-mentioned pallet, to hold described pallet that the described pallet of described tested electronic component before the test moves into the loading part of described test department and will hold the described tested electronic component that test finishes from the unloading portion that described test department is taken out of, described pallet is recycled conveyance in described loading part, described test department and described unloading portion (with reference to claim 11).
The effect of invention
Among the present invention, when tested electronic component is pressed into socket, make pad between the housing of the main body of described tested electronic component and socket, make the height and the 1st overhang sum that contacts pin of the as many as terminal in interval between main body and the housing.Thus, do not change pusher etc., and only tested electronic component is pressed on the socket, can automatically guarantee to contact the suitableeest path increment of pin, and can promote the operation ratio of electronic component testing apparatus.
Description of drawings
Fig. 1 is the summary sectional view that the electronic component testing apparatus of embodiment of the present invention is shown;
Fig. 2 is the oblique view that the electronic component testing apparatus of embodiment of the present invention is shown;
Fig. 3 is the synoptic diagram of processing that the pallet of embodiment of the present invention is shown;
Fig. 4 is the exploded perspective view that the IC reservoir that uses in the electronic component testing apparatus of embodiment of the present invention is shown;
Fig. 5 is the oblique view that the client's pallet that uses in the electronic component testing apparatus of embodiment of the present invention is shown;
Fig. 6 is the exploded perspective view that the test pallet that uses in the electronic component testing apparatus of embodiment of the present invention is shown;
Fig. 7 is the exploded perspective view that the insert that uses in the test pallet shown in Figure 6 is shown;
Fig. 8 A be embodiment of the present invention insert planimetric map and card be shown fasten the figure that parts are positioned at the state that closes the position with a bolt or latch;
Fig. 8 B be embodiment of the present invention insert plane rotary disc and card be shown fasten the figure that parts are positioned at the state of open position with a bolt or latch;
Fig. 9 A is the sectional view along the IXA-IXA line of Fig. 8 A;
Fig. 9 B is the sectional view along the IXB-IXB line of Fig. 8 B;
Figure 10 A is the sectional view along the XA-XA line of Fig. 8 A;
Figure 10 B is the sectional view along the XB-XB line of Fig. 8 B;
Figure 11 is the oblique view of the hook part that uses in the insert of embodiment of the present invention;
Figure 12 illustrates the sectional view that component carrier in the embodiment of the present invention is contained in the state on the insert;
Figure 13 illustrates when pushing in the embodiment of the present invention component carrier with the sectional view of IC device fine motion;
Figure 14 A is the sectional view and the figure that the state on the socket that thin IC device is pressed into by substrate is shown that the component carrier substrate of embodiment of the present invention is shown;
Figure 14 B is the sectional view and the figure that the state on the socket that thick IC device is pressed into by substrate is shown that the component carrier substrate of embodiment of the present invention is shown;
Figure 15 illustrates the outboard profile that is used for the anchor clamps of loading and unloading component carrier on the insert main body in the embodiment of the present invention;
Figure 16 is the sectional view that the state that component carrier is unloaded from the insert main body with anchor clamps is shown in the embodiment of the present invention;
Figure 17 is the sectional view of pusher, insert, socket guiding piece and socket that embodiment of the present invention is shown;
Figure 18 is the sectional view that the socket of embodiment of the present invention is shown.
Embodiment
Below in conjunction with accompanying drawing embodiments of the present invention are described.
Fig. 1 is the summary sectional view that the electronic component testing apparatus of embodiment of the present invention is shown, and Fig. 2 is the oblique view that the electronic component testing apparatus of embodiment of the present invention is shown, and Fig. 3 is the synoptic diagram of processing that the pallet of embodiment of the present invention is shown.
In addition, Fig. 3 is the figure that is used for understanding the disposal route of electronic component testing apparatus pallet, part is also arranged with the in fact parts of alignment arrangements on above-below direction shown in the planar fashion.Therefore, with reference to Fig. 2 its machinery (three-dimensional) structure is described.
The electronic component testing apparatus of present embodiment is, utilizes whether operate as normal of measuring head 5 and test machine 6 test (inspection) IC devices under the state that the IC device is applied high temperature or low temperature thermal stress, and the device of the IC device being classified based on this test result.Based on the test of the IC device of this electronic component testing apparatus, with the IC device from being mounted with client's pallet KST (with reference to Fig. 5) of many IC devices as tested object, the test pallet TST (with reference to Fig. 6) of the circulation conveyance to the processor 1 that changes the outfit and implementing.In addition, represent the IC device with symbol IC among the figure.
As shown in Figure 1, be provided with space 8 in processor 1 bottom, measuring head 5 is configured in this space 8 replaceably.Socket 50 is arranged on the measuring head 5, and is connected with test machine 6 by cable 7.And, by the peristome that forms on the processor 1 socket 50 on IC device and the measuring head 5 is electrically contacted, the electric signal of the test-run a machine 6 that can be used to test oneself carries out the test of IC device.In addition, when the classification of IC device is changed, socket is replaced with the socket of the shape that adapts to such other IC device, number of pins etc.
As shown in Figures 2 and 3, the processor 1 of present embodiment is by constituting as the lower part: deposit before the test and test finish the IC device storage part 200, will send into the loading part 300 of test department 100 from the IC device that storage part 200 is sent, at the relative test department 100 of the socket 50 of inner and measuring head 5, and the unloading portion 400 that the complete IC device of test that test department 100 was tested is classified.
Each several part to processor 1 describes below.
＜storage part 200 〉
Fig. 4 is the exploded perspective view that the IC reservoir that uses in the electronic component testing apparatus of embodiment of the present invention is shown, and Fig. 5 is the oblique view that the client's pallet that uses in the electronic component testing apparatus of embodiment of the present invention is shown.
As shown in Figure 4, these reservoirs 201,202 comprise: the tray support frame 203 of frame shape and enter from the bottom of this tray support frame 203 and to the lifter 204 of top lifting.Be stacked with a plurality of client's pallet KST on tray support frame 203, only these stacked client's pallet KST can move up and down under the effect of lifter 204.In addition, as shown in Figure 5, among client's pallet KST of present embodiment, the concavity accommodation section that holds the IC device is arranged in for example 14 row, 13 row.
Because the preceding reservoir 201 of test is finished reservoir 202 with test and had identical construction, can the preceding reservoir 201 of test be finished reservoir 202 quantity separately with test set suitable quantity for as required.
As shown in Figures 2 and 3, in the present embodiment, reservoir 201 is provided with 2 reservoir STK-B before the test, is provided with 2 empty pallet reservoir STK-E in the place that is adjacent.Be stacked with the Air Passenger family pallet KST that is transported to unloading portion 400 on each empty pallet reservoir STK-E.
With the adjacent place of empty pallet reservoir STK-E, 8 reservoir STK-1, STK-2 ..., STK-8 is arranged on test and finishes on the reservoir 202, formation can be divided into maximum 8 structures that store classifiedly according to test result.That is, except that certified products and non-certified products, also can be distinguished into the high, medium and low product of operating rate in the certified products, or need product of testing again etc. in the non-certified products.
＜loading part 300 〉
Above-mentioned client's pallet KST is transported into 2 window portions 370 of loading part 300 by being arranged on the tray conveying arm 205 between storage part 200 and the device base station 101 from the downside of device base station 101.And on this loading part 300, will pack into the IC device of client's pallet KST of device transferring device 310 is transplanted on precise localizer (preciser) 360 for the time being, and revises mutual alignment relation of IC device at this.Then, device transferring device 310 moves the IC device that is transplanted on this precise localizer 360 once more and changes the outfit and is parked on the test pallet TST on the loading part 300.
As mentioned above, loading part 300 comprises the IC device from the change the outfit device transferring device 310 of test pallet TST of client's pallet KST.As shown in Figure 2, this device transferring device 310 comprises: is erected at 2 tracks 311 on the device base station 101, can between test pallet TST and client's pallet KST, moves back and forth the moveable arm 312 of (establishing this direction is the Y direction) along described track 311, and the moving head 320 that supports and can on directions X, move by this moveable arm 312.
Sucker (scheming not shown) down is installed on the moving head 320 of this device transferring device 310, moves while attracting by this sucker, keeps the IC device from client's pallet KST, and this IC device is changed the outfit on the test pallet TST.Sucker such about 8 for example can be set on moving head 320, thereby on the test pallet TST that can once 8 IC devices be changed the outfit.
＜test department 100 〉
Above-mentioned test pallet TST packs into by loading part 300 and sends into test department 100 behind the IC device, under the state on the test pallet TST, carries out the test of each IC device at the IC component mounting.
As shown in Figures 2 and 3, test department 100 is by constituting as the lower part: to the IC device that is loaded into test pallet TST apply the high temperature of expectation or low temperature thermal stress soaking case 110, will be in and be applied IC device under the state of thermal stress by soaking case 110 and be pressed into test cabinet 120 on the measuring head 5, and the heat extraction case 130 removed of the thermal stress of the IC device that will test at test cabinet 120.
In soaking case 110, the IC device is applied under the situation of high temperature, in heat extraction case 130, room temperature is got back in the cooling of IC device by air-supply.On the other hand, in soaking case 110, the IC device is applied under the situation of low temperature, in heat extraction case 130,, the IC device heats is got back to the temperature that dewfall can not take place by warm braw or well heater etc.
As shown in Figure 2, compare with test cabinet 120, the soaking case 110 and the heat extraction case 130 of test department 100 are more outstanding up.In addition, illustrate as Fig. 3 summary, soaking case 110 is provided with vertical carrying device, and during test cabinet 120 became unprecedentedly, polylith test pallet TST carried out standby when being supported in this vertical carrying device.Mainly be in this standby process, the IC device to be applied high temperature or low temperature thermal stress.
Measuring head 5 is configured in the centre of test cabinet 120, by test pallet TST being transported to measuring head 5 tops, solder ball (terminal) HB (with reference to Figure 14 A) of IC device is electrically contacted to test with the pin 51 (with reference to Figure 14 A) that contacts of the socket 50 of measuring head 5.On the other hand, the test pallet TST of end of test (EOT) carries out heat extraction in heat extraction case 130, after the temperature of IC device is got back to room temperature, it is taken out of unloading portion 400.
On the top of soaking case 110, be formed with and be used for test pallet TST from the inlet moved into of device base station 101.Similarly, on the top of heat extraction case 130, be formed with the outlet that is used for test pallet TST is taken out of auto levelizer base station 101.And, as shown in Figure 2, on device base station 101, be provided with and test pallet TST moved into the tray conveying device 102 of taking out of test department 100 by these entrance and exits.This tray conveying device 102 constitutes by for example rotating roller etc.
The test pallet TST that takes out of from heat extraction case 130, thereon all IC devices of Da Zaiing by device transferring device 410 (aftermentioned) change the outfit load after, by means of unloading portion 400 and loading part 300, be returned to soaking case 110 by described tray conveying device 102.
Fig. 6 is the exploded perspective view that the test pallet that uses in the electronic component testing apparatus of embodiment of the present invention is shown.
As shown in Figure 6, test pallet TST has: square frame parts 701, parallel and equally spaced be arranged on the frame parts 701 horizontal stripe 702 and from the equally spaced outstanding a plurality of installation sheets 703 of the limit 701a of horizontal stripe 702 or frame parts 701.And insert accommodation section 704 is made of horizontal stripe 702, limit 701a and installation sheet 703.
Each insert accommodation section 704 accommodates 1 insert 710 respectively.At the two ends of insert 710, be formed with respectively and be used for this insert 710 is installed to mounting hole 706 on the installation sheet 703, insert 710 utilizes securing member 705 to be installed on 2 installation sheets 703 with quick condition (but state of three-dimensional fine motion).As shown in Figure 6, such insert 710 is equipped with 64 with the array of 4 row 16 row on 1 test pallet TST, by the IC device is contained in insert 710, with the IC device test pallet TST that packs into.
Fig. 7 is the exploded perspective view that the insert that uses in the test pallet shown in Figure 6 is shown, Fig. 8 A and 8B are the planimetric maps of the insert of embodiment of the present invention, Fig. 9 A～10B is the sectional view of Fig. 8 A and 8B, Figure 11 is the oblique view of the hook part that uses in the insert of embodiment of the present invention, Figure 12 illustrates the sectional view that component carrier in the embodiment of the present invention is contained in the state on the insert, Figure 13 illustrates when pushing in the embodiment of the present invention component carrier with the sectional view of IC device fine motion, Figure 14 A and 14B are the sectional views that the component carrier substrate of embodiment of the present invention is shown, Figure 15 is the outboard profile that the anchor clamps that are used on the insert main body loading and unloading component carrier in the embodiment of the present invention are shown, and Figure 16 is the sectional view that the state that component carrier is unloaded from the insert main body with anchor clamps is shown in the embodiment of the present invention.
As shown in Figure 7, the insert 710 of present embodiment comprises insert main body 720, executor plate 750 and component carrier (maintaining part) 760.
As shown in Figure 7, at the substantial middle place of insert main body 720, be provided with the device accommodation hole 721 that is used to hold the IC device.Shown in Fig. 9 A～Figure 10 B, device accommodation hole 721 has the inlet port 721a that enters for the IC device on top, and has the installing port 721b of installing device carrier 760 in the bottom.Inlet port 721a is communicated with installing port 721b, and will guide the component carrier 760 that is installed in installing port 721b into from the IC device that inlet port 721a enters in the device accommodation hole 721.
In addition, the two ends of insert main body 720 also are formed with the bullport 726 that the guide bushing 56 of the directing pin 122b of aftermentioned pusher 121 and socket guiding piece 55 inserts from above-below direction respectively.
In addition, hold the situation of 1 IC device although an insert 710 has been described in the present embodiment, the present invention is not subject to this especially.An insert main body 720 also can form a plurality of device accommodation holes 721, and same insert 710 also can hold a plurality of IC devices.
As shown in Figure 7, insert main body 720 has the card door bolt structure that is made of card door bolt parts 731, wind spring 732, axle 733, executor 734 and volute spring 735.
Shown in Fig. 9 A and Fig. 9 B, card door bolt parts 731 have the IC device upper surface that is contained in device accommodation hole 721 relatively near or away from front end 731a and the rear end 731c that is pushed by executor 734.In addition, between the front end 731a and rear end 731c of these card door bolt parts 731, be formed with the through hole as rotation center 731b, by axle 733 is inserted this through hole, card door bolt parts 731 rotatably are supported on the insert main body 720.
Is the center rotation by making card door bolt parts 731 with axle 733, the front end 731a of card door bolt parts 731 can near the IC device upper surface that is contained in device accommodation section 721, prevent the position (state shown in Fig. 8 A, Fig. 9 A and Figure 10 A that the IC device flies out, below be called simply and close the position) and keep out of the way, make between the position that the IC device can pass in and out (state shown in Fig. 8 B, Fig. 9 B and Figure 10 B, below be called open position simply) from the upper surface of the IC device that is contained in device accommodation hole 721 and move.
In the plan view of the insert 710 shown in Fig. 8 A and Fig. 8 B, present embodiment can be guaranteed the big amount of movement of front end 731a by making the front end 731a spinning movement of card door bolt parts 731.Especially, in the insert 710 of present embodiment, because the front end 731a of card door bolt parts 731 can move near the central authorities of device accommodation hole 721, not only can hold the smaller IC device of representing with symbol IC among Fig. 8 A, Fig. 9 A and Figure 10 A, and can hold, thereby improved versatility to the IC device size with the bigger IC device of the size of representing with symbol ICB among the figure.
Shown in Fig. 7, Figure 10 A and Figure 10 B, wind spring 732 is a rotation center with axle 733, fastens with a bolt or latch between parts 731 and the insert main body 720 between card, and to closing the position card is fastened with a bolt or latch parts 731 application of forces by its elastic force.Therefore, push in the elastic force of opposing wind spring 732 under the situation of rear end 731c of card door bolt parts 731, the front end 731a that card is fastened parts 731 with a bolt or latch moves to open position.Relative therewith, if remove the pushing of the rear end 731c of card door bolt parts 731, because the elastic force of wind spring 732, the front end 731a of card door bolt parts 731 gets back to and closes the position.
In addition, shown in Figure 10 A and Figure 10 B, in the present embodiment, the direction (being generally vertical direction) of holding the IC device at axle 733 with respect to insert 710 is inserted insert main body 720 with axle 733 under the state of IC device-side tilt alpha degree (for example about 45 °).Therefore, the front end 731a of card door bolt parts 731 favouring on main the imaginary plane PL of insert main body 720, is the center spinning movement with axle 733.For this reason, because along with the spinning movement of card door bolt parts 731, the alterable height of the front end 731a of card door bolt parts 731 is so can adapt to variation in thickness because of the IC device of classification due to changing.
Shown in Fig. 9 A～Figure 10 B, in the internal face of the device accommodation hole 721 of insert main body 720, along on the face of the length direction of this insert main body 720, be formed be used to hold card door bolt parts 731 hold recess 722.Shown in Fig. 8 B, Fig. 9 B and Figure 10 B, open position in the present embodiment, card door bolt parts 731 are contained in fully and hold in the recess 722, can effectively utilize the opening size of device accommodation hole 721 according to the IC size of devices to greatest extent.In addition, in the present embodiment, because card door bolt parts 731 at the length direction of open position along insert main body 720, so the card that can extend is fastened the distance from rotation center 731b to front end 731a on the parts 731 with a bolt or latch, and strengthen the rotation amount of movement of front end 731a.
As shown in Figure 7, executor 734 is inserted into the executor patchhole 723 that forms on the insert main body 720, makes volute spring 735 between between the two.Shown in Fig. 7, Fig. 9 A and Fig. 9 B, be formed with stage portion 734a in the bottom of executor 734, and executor patchhole 723 with hold recess 722 and be communicated with, stage portion 734a can with the rear end 731c butt of card door bolt parts 731.
Under the state of not pushing executor 734, the front end 731a of card door bolt parts 731 is positioned at and closes the position.If push executor 734, push the rear end 731c that card is fastened parts 731 with a bolt or latch by executor 734, then the front end 731a of card door bolt parts 731 moves to the open position rotation.In addition, as shown in Figure 7, in order in the rear end 731c that depresses card door bolt parts 731 its inboard to insert main body 720 to be released, the surface of contact of the stage portion 734a of executor 734 is not smooth but tilts.
Shown in Fig. 7, Fig. 9 A and Fig. 9 B, be formed with slotted hole 734b in the bottom of executor 734, pin 736 inserts this slotted hole 734b from the outside of insert main body 720.Thus, executor 734 mobile being restricted upward.
And as shown in Figure 7, insert main body 720 has by hook part 741, volute spring 742 and axle 743 clamp structures that constitute (mounting structure).
As shown in figure 11, hook part 741 has the hook 741a that engages with the connecting hole 761 of component carrier 760 at front end.As shown in Figure 7, this hook part 741 is contained in the clamping accommodation section 724 of insert main body 720, and is rotatably supported by the axle 743 that inserts from the outside of insert main body 720.In the present embodiment, as shown in figure 11, on hook part 741, be formed with the slotted hole 741b that inserts axle 743.Under the state (state of Figure 12) of 742 pairs of hook part 741 application of forces of volute spring, what this slotted hole 741b had that major axis place direction and test the time push the IC device pushes the consistent section configuration of direction.By this slotted hole 741b, allow the minute movement of hook part 741 on above-below direction that is supported in axle 743.In addition, it is consistent basically with vertical direction to push direction in the present embodiment.
As Fig. 7 and shown in Figure 12, volute spring 742 is contained in clamping accommodation section 724 with hook part 741, and the jut 741c of hook part 741 inserts the endoporus of volute spring 742.This volute spring 742 is the center with axle 743, to a sense of rotation (being rotated counterclockwise among Figure 12) to hook part 741 application of forces.In addition, as shown in figure 12, this volute spring 742 is upwards pushed hook part 731 all the time when no-load (not pushing), and axle 743 relatively moves downwards in the slotted hole 741b of hook part 741.
On the other hand, as shown in figure 13, if during test the IC device is pressed to measuring head 5, this pressing force is resisted the elastic force of volute spring 742 so, axle 743 relatively is moved upward in the slotted hole 741b of hook part 741, and hook part 741 can descend with respect to insert main body 720 with the IC device.
Since in the present embodiment same volute spring 742 simultaneously as to a sense of rotation to the structure of hook part 741 application of forces with upward to the structure of hook part 741 application of forces, so reduced the quantity of formation insert 710 parts.In addition, among the present invention, also can be by 2 above-mentioned structures of formation such as different springs.In addition, as substituting of volute spring 742, also can use other elastic bodys such as rubber, sponge.
Insert main body 720 is provided with 2 such clamp structures, thereby can releasably keep component carrier 760.In addition, among the present invention,, just be not particularly limited, for example 4 clamp structures can be set on an insert main body 720 as long as the quantity of clamp structure is a plurality of.
As shown in Figure 7, executor plate 750 is installed in the upside of insert main body 720 by volute spring 754.This volute spring 754 upward (away from the direction of insert main body 720) to executor plate 750 application of forces.Therefore, if be subjected to the pressing force of (near the direction of insert main body 720) downwards, the elastic force of executor plate 750 opposing volute springs 754 moves downwards so, pushes if remove this, owing to the elastic force of volute spring 754, executor plate 750 returns the top so.In addition, shown in Fig. 7, Figure 10 A and Figure 10 B, because the long limit 751 of executor plate 750 engages with the groove 725 of the side that is formed at insert main body 720, so executor plate 750 mobile being restricted upward.
As shown in Figure 7, be provided with opening 752, make the device accommodation hole 721 of insert main body 720 expose at the substantial middle place of executor plate 750.This opening 752 forms more slightly larger than inlet port 721a, thereby does not hinder the IC device via inlet port 721a turnover device accommodation hole 721.
In addition, as shown in Figure 7, the position corresponding with the clamping accommodation section 724 of insert main body 720 on executor plate 750 is provided with through hole 753.This through hole 753 uses from insert main body 720 loading and unloading component carrier 760 time.
As shown in Figure 7, component carrier 760 is installed, is provided with many pilot holes 762 of the base plate 760a that runs through component carrier 760 at the downside of insert main body 720.In the present embodiment, chimeric by solder ball HB (with reference to Fig. 9 A～Figure 10 B and Figure 14 A) and these pilot holes 762 of making the IC device, position with respect to 760 pairs of IC devices of component carrier.Therefore, even changing because of the classification of IC device under the situation that the profile that makes the IC device changes, if the size of terminal HB, spacing are identical, that does not just need to change component carrier 760, has improved the versatility of component carrier 760.In addition, though pilot hole 762 corresponding solder ball HB in the present embodiment, the present invention is not subject to this especially, and a pilot hole 762 also can corresponding a plurality of solder ball HB.
Shown in Figure 14 A, the base plate 760a of this component carrier 760 has thickness B, and the height A of the as many as solder ball HB that draws downwards from IC device main body 901 of this thickness B contact the 1st the suitableeest overhang C that pin 51 is given prominence to from the housing 52 of socket 50 during with test
OpAnd (=A+C).Therefore, only by the IC device is pressed into socket 50, just can automatically guarantee to contact the suitableeest path increment of pin 51.
Usually, owing to need to increase inner lamination number under the situation of the capacity that increases the IC device, shown in Figure 14 A and Figure 14 B, the thickness of IC device main body 901 is by T
1Become thicker T
2Relative therewith, even under the situation of the capacity that increases the IC device, in most cases also there is no need to change the height A of solder ball HB.Therefore, in the present embodiment, by same component carrier 760, two kinds of IC devices shown in corresponding diagram 14A and Figure 14 B simultaneously.
As shown in Figure 7, in the component carrier 760,2 angles that encase on the same diagonal line of flange 760b of base plate 760a are provided with connecting hole 761.Each connecting hole 761 forms linearity, to engage with the hook 741a of the hook part 741 of clamping device.For example, change under the situation that the size that makes solder ball HB and spacing change, change component carrier 760 because of the kind of IC device.
Under the situation of loading and unloading component carrier 760 on the insert main body 720, utilize unit clamp 800 as shown in figure 15.
For example, unloading from insert main body 720 under the situation of component carrier 760, at first, the through hole 753 via executor plate 750 inserts clamping accommodation sections 724 from the top with the pin 801 of anchor clamps 800.As shown in figure 16, because the insertion of this pin 801, the elastic force of hook part 741 opposing volute springs 742 is upright, and hook 741a is (clockwise among Figure 16) rotation to the inside.Thus, owing to hook 741a is disengaged with engaging of connecting hole 761, so can unload component carrier 760 from insert main body 720.
On the other hand, under situation about component carrier 760 being installed on the insert main body 720, the pin 801 insertion clamping accommodation sections 724 with anchor clamps 800 make hook part 741 upright.Under this state, component carrier 760 is set in the below of insert main body 720, extract the pin 801 of anchor clamps 800 from clamping accommodation section 724, component carrier 760 is remained on the insert main body 720.
Figure 17 is the sectional view of pusher, insert, socket guiding piece and socket that embodiment of the present invention is shown, and Figure 18 is the sectional view that the socket of embodiment of the present invention is shown.
As shown in figure 17, pusher 121 is arranged on the top of measuring head 5 in the test cabinet 120.This pusher 121 by substrate 122, pushing block 123,124 and volute spring 125 constitute.
The substantial middle place of substrate 122 is formed with the opening 122a that inserts pushing block 123.In addition, the lower surface two ends of substrate 122 are extruded with the directing pin 122b in the guide bushing 56 of the pilot hole 726 that inserts insert 710 and socket guiding piece 55.
Pushing block 123 has the minor diameter part 123a of the band external diameter littler than the opening 122a of substrate 122 and is with the large-diameter portion 123b of the external diameter bigger than this opening 122a.The minor diameter part 123a of pushing block 123 inserts the opening 122a from the top of substrate 122.On the other hand, the large-diameter portion 123b of pusher 123 is limited to the upper surface of substrate 122.
124 are fixed in the top of substrate 122 by bolt etc.This 124 and the large-diameter portion 123b of pushing block 123 between, be situated between volute spring 125 to pushing block 123 application of forces be housed downwards.In addition, replace volute spring 125, also can use elastic bodys such as mechanical type spring, rubber or macromolecular elastomer such as laminated spring.The IC device that pusher 121 correspondences are tested simultaneously, for example the mode with 4 row, 16 row remains on the match plate (scheming not shown), and this match plate can be arranged on the top of measuring head 5 up or down with Z axial brake device 128.
The top of this pusher 121 is provided with the Z axial brake device 128 that for example has the fluid air cylinder, and this Z axial brake device 128 can make pressing plate 129 move up and down on Z-direction (pushing direction).Pusher 121 is pushed downwards by this pressing plate 129.
On the other hand, as shown in figure 18, the socket 50 that is provided with on the measuring head 5 comprises: a plurality ofly contact pin 51 and maintenance this contacts the housing 52 of pin 51 with the solder ball HB of IC device electrically contacts.Each contacts pin 51 by so-called pogo pin (Port go ピ Application) formation, and its front end can move up and down by the volute spring (scheming not shown) that inside holds.
As shown in figure 18, in the present embodiment, do not bear at volute spring under the situation (situation of promptly not pushing) of load, the front end of contact pin 51 is from only outstanding the 2nd overhang C of the upper surface 52a of housing 52
MaxOn the other hand, when volute spring at utmost shrank, the front end of contact pin 51 was from only outstanding the 3rd overhang C of the upper surface 52a of housing 52
Min
The 1st above-mentioned overhang C
OpBe contact pin 51 in order to ensure when test solder ball HB and contact pin 51 between the suitableeest path increment that conducts, it is than the 2nd overhang C
MaxShort, and than the 3rd overhang C
MinLong (C
Min＜C
Op＜C
Max).
As shown in figure 17, this socket 50 around be fixed with socket guiding piece 55.The two ends of this socket guiding piece 55 are provided with the guide bushing 56 of the directing pin 122b that inserts pusher 121.
When the test of IC device, Z axial brake device 128 descends pressing plate 129, the directing pin 122b of pusher 121 inserts the bullport 726 of insert 710 from the top, then, when the guide bushing 56 of socket guiding piece 55 inserts the bullport 726 of insert 710 from the below, the directing pin 122b of pusher 121 inserts in the guide bushing 56, thereby pusher 121, insert 710 and socket 50 are located mutually.
In the present embodiment, when utilizing Z axial brake device 128 that the IC device is pressed into socket 50, shown in Figure 14 A and 14B, between the main body 901 of the base plate 760a of the component carrier 760 of insert 710 insertion IC device and the housing 52 of socket 50.Therefore, the distance between main body 901 and the housing 52 is subjected to the qualification of base plate 760a, has automatically guaranteed the suitableeest path increment of contact pin 51.
The test of IC device is the contacting under the situation that pin 51 electrically contacts of the solder ball HB of IC device and socket 50, and is carried out by test machine 6.This IC test results of devices for example stores in the address that numbering determined by the IC device that distributes in the identiflication number of test pallet TST and the test pallet TST.
In addition, when test, Z axial brake device 128 utilization is pushed the load of pushing of pushing the maximum kind time-like of load in all categories of IC device of this electronic component testing apparatus correspondence, and pushes the IC device of all categories, and the load that exceeds is attracted by the volute spring 125 of pusher 121.Therefore, in the present embodiment,, also can automatically guarantee to contact the suitableeest path increment of pin 51 even the quantity of the solder ball HB of each IC device increases and decreases.Mention along band, Z axial brake device 128 requires pushes load, and the quantity of pushing the IC device that in load, IC device contact the number of pin 51 and simultaneously push required according to each contact pin calculates.
In addition, because the thickness difference of the main body 901 of IC device also absorbs by volute spring 125, in the present embodiment, even the variation in thickness of the main body of IC device also can automatically guarantee to contact the suitableeest path increment of pin 51.In addition, the position that is provided with of other absorptive unit of thickness difference that absorbs the main body 901 of the unnecessary load that produced by Z axial brake device 128 and IC device is not limited to pusher 121.For example, absorptive unit also can be arranged at pressing plate 129 or Z axial brake device 128 self.
＜unloading portion 400 〉
Get back to Fig. 2, also be provided with in the unloading portion 400 be arranged on loading part 300 on 2 identical device transferring devices 410 of device transferring device 310 structures, by these device transferring devices 410, will finish the IC device from the test of the test pallet TST that transports unloading portion 400 and change the outfit and test result corresponding client pallet KST.
As shown in Figure 2, on the device base station 101 of unloading portion 400, be formed with two groups so that be transported into the window portion 470 (every group a pair of) that the mode of upper surface of client's pallet KST facing device base station 101 of unloading portion 400 disposes from storage part 200.
In addition, though omitted diagram, the downside in each window portion 370,470 is provided with the lifting table that is used to make client's pallet KST lifting.In unloading portion 400, client's pallet KST that lifting table makes full load test finish the IC device descends, and transfers this loaded pallets to tray conveying arm 205.
For example, under the situation that the IC device that utilizes device transferring device 410 will be contained in test pallet TST takes out, under the state shown in Fig. 8 A, Fig. 9 A and Figure 10 A (the front end 731a of card door bolt member 731 is in the state that closes the position), the suction nozzle of device transferring device 410 is pressed executor plate 750 near each insert 710 by the part of this suction nozzle.Accompany therewith, executor 734 is pressed the rear end 731c of card door bolt member 731, and card door bolt member 731 is the center rotation with axle 733, and the front end 731a of card door bolt member 731 is to the status transition of open position.
Fig. 8 B, Fig. 9 B and Figure 10 B have shown this state, and card door bolt member 731 is kept out of the way from the upper surface of IC device, and are contained in the holding in the recess 722 of insert main body 720 fully, and suction nozzle can keep the IC device.
As mentioned above, in the present embodiment, when the IC device pressed on socket 50, the base plate 760a of component carrier 760 makes the height A and the 1st overhang C that contacts pin 51 of the as many as solder ball HB of interval B between main body 901 and the housing 52 between the housing 52 of the main body 901 of IC device and socket 50
OpSum.Thus,, only the IC device is pressed into socket 50, promptly can automatically guarantees to contact the suitableeest path increment of pin 51, can improve the operation ratio of electronic component testing apparatus because do not change pusher 121 etc.
In addition, more than Shuo Ming embodiment is described for ease of understanding the present invention, is not to be used for the present invention is constituted qualification.Therefore, whole design alterations and equivalent under disclosed each key element is intended to comprise in the technology of the present invention scope in the above-mentioned embodiment.
The hook mechanism of pushing the IC device in the insert is not limited to the structure in the above-mentioned embodiment.For example, also can adopt with relative IC device is the hook mechanism of center rotation to the vertical axle of the direction of insertion of insert.
Symbol description
1 ... processor
100 ... test department
200 ... the accommodation section
300 ... loading part
400 ... unloading section
5 ... measuring head
50 ... socket
51 ... the contact pin
52 ... housing
6 ... test machine
TST ... test pallet
701 ... frame parts
710 ... insert
720 ... the insert main body
760 ... component carrier
760a ... the bottom surface
762 ... bullport
IC ... the IC device
901 ... the main body of IC device
HB ... solder ball
Claims (11)
1. a method for testing electronic components makes described tested terminals of electronic components electrically contact the test of carrying out described tested electronic component with the pin that contacts of described socket by tested electronic component is pressed on the socket, it is characterized in that,
The height with as many as described terminal of drawing from the main body of described tested electronic component and when test described contact pin be clipped in from the pad of the thickness of the 1st outstanding overhang sum of the housing of described socket under the state between described main body and the described housing, described tested electronic component is pressed on the described socket.
2. method for testing electronic components according to claim 1, it is characterized in that, described the 1st overhang is shorter from the 2nd outstanding overhang of described housing than described contact pin under the no load condition, and described contact pin is long from the 3rd outstanding overhang of described housing under the maximum collapse state than described contact pin.
3. method for testing electronic components according to claim 1 and 2 is characterized in that, described pad is the base plate that holds the insert of described tested electronic component.
4. insert, be by tested electronic component being pressed into insert that be provided with, that can hold described tested electronic component on the pallet that contacts conveyance in the electronic component testing apparatus that pin electrically contacts the test of carrying out described tested electronic component that makes described tested terminals of electronic components and described socket on the socket, it is characterized in that
Comprise the maintaining part that keeps described tested electronic component,
The height that described maintaining part has an as many as described terminal of drawing from the main body of described tested electronic component of thickness described base plate that contacts pin from the 1st outstanding overhang sum of the housing of described socket during with test.
5. insert according to claim 4 is characterized in that, when described tested electronic component was pressed into described socket, described base plate inserted between the described housing of the described main body of described tested electronic component and described socket.
6. according to claim 4 or 5 described inserts, it is characterized in that, described the 1st overhang is shorter from the 2nd outstanding overhang of described housing than described contact pin under the no load condition, and described contact pin is long from the 3rd outstanding overhang of described housing under the maximum collapse state than described contact pin.
7. according to each described insert in the claim 4～6, it is characterized in that described base plate has the through hole that the described terminal of described tested electronic component can be chimeric.
8. according to each described insert in the claim 4～7, it is characterized in that, described insert comprises the insert main body with the accommodation hole that holds described tested electronic component, and described maintaining part keeps being contained in the described tested electronic component in the described accommodation hole.
9. according to each described insert in the claim 4～8, it is characterized in that, comprise that also described relatively insert releasably keeps the loading and unloading unit of described maintaining part.
10. a pallet is characterized in that, but comprises that each described insert and fine motion ground in the claim 4～9 keeps the frame parts of described insert.
11. electronic component testing apparatus, it is the electronic component testing apparatus that pin electrically contacts the test of carrying out described tested electronic component that contacts that makes described tested terminals of electronic components and described socket on the socket by tested electronic component is pressed into, it is characterized in that, comprising:
With described tested electronic component under the state that is contained in the described pallet of claim 10, be pressed into described socket test department,
To hold the described pallet of described tested electronic component before the test move into described test department loading part and
The described pallet that will hold the described tested electronic component that test finishes is from the unloading portion that described test department is taken out of,
Described pallet is recycled conveyance in described loading part, described test department and described unloading portion.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-178274 | 2008-07-08 | ||
| JP2008178274 | 2008-07-08 | ||
| PCT/JP2009/061100 WO2010004844A1 (en) | 2008-07-08 | 2009-06-18 | Electronic component testing method, insert, tray, and electronic component testing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102084260A true CN102084260A (en) | 2011-06-01 |
Family
ID=41506964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801267784A Pending CN102084260A (en) | 2008-07-08 | 2009-06-18 | Electronic component testing method, insert, tray, and electronic component testing apparatus |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5282093B2 (en) |
| KR (1) | KR101156962B1 (en) |
| CN (1) | CN102084260A (en) |
| TW (1) | TWI394960B (en) |
| WO (1) | WO2010004844A1 (en) |
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| TWI505051B (en) * | 2014-01-28 | 2015-10-21 | Hon Tech Inc | A plurality of electronic components can be positioned at the same time positioning device and its application of the operating equipment |
| CN106291301A (en) * | 2015-06-08 | 2017-01-04 | 京元电子股份有限公司 | Semiconductor subassembly pressure test device and test equipment thereof |
| CN106334680A (en) * | 2015-07-07 | 2017-01-18 | 泰克元有限公司 | Pusher assembly and match plate for test handler |
| CN107797044A (en) * | 2016-08-31 | 2018-03-13 | 细美事有限公司 | For testing the device of semiconductor devices |
| CN108267618A (en) * | 2017-01-03 | 2018-07-10 | 东捷科技股份有限公司 | Fixture with extensible probe |
| CN109990988A (en) * | 2017-12-29 | 2019-07-09 | 上海共联通信信息发展有限公司 | A kind of 4G wireless base station device board performance testing device |
| TWI676033B (en) * | 2018-11-09 | 2019-11-01 | 京元電子股份有限公司 | Semiconductor testing carrier with buffering container and testing apparatus thereof |
| CN111190087A (en) * | 2018-11-15 | 2020-05-22 | 京元电子股份有限公司 | Semiconductor element test carrying disc with floating containing seat and test equipment thereof |
| CN114046975A (en) * | 2021-11-10 | 2022-02-15 | 日月光半导体制造股份有限公司 | Test fixture and test method suitable for IC bearing disc |
| CN115932342A (en) * | 2023-02-20 | 2023-04-07 | 天津伍嘉联创科技发展股份有限公司 | Adjustable testboard for detecting electronic components |
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| US8829939B2 (en) * | 2011-06-03 | 2014-09-09 | Texas Instruments Incorporated | Shuttle plate having pockets for accomodating multiple semiconductor package sizes |
| WO2013168196A1 (en) * | 2012-05-10 | 2013-11-14 | ユニテクノ株式会社 | Semiconductor transport test jig |
| JP2015105834A (en) * | 2013-11-28 | 2015-06-08 | 東京エレクトロン株式会社 | Electronic component inspection device, electronic component inspection method, and program for inspection method |
| CN104375075A (en) * | 2014-11-05 | 2015-02-25 | 中山市智牛电子有限公司 | Tester |
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| KR102287237B1 (en) * | 2016-04-19 | 2021-08-09 | 주식회사 아이에스시 | Insert assembly for receiving semiconductor device and test tray including the same |
| KR102287239B1 (en) * | 2016-11-11 | 2021-08-09 | 주식회사 아이에스시 | Apparatus for testing semiconductor devices |
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| KR102236103B1 (en) * | 2019-04-15 | 2021-04-05 | 주식회사 아테코 | Electronic device test handler with test tray vision inspection |
| TWI752760B (en) * | 2020-12-18 | 2022-01-11 | 致茂電子股份有限公司 | Chip fixing device for socket |
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- 2009-06-18 WO PCT/JP2009/061100 patent/WO2010004844A1/en active Application Filing
- 2009-06-18 JP JP2010519708A patent/JP5282093B2/en not_active Expired - Fee Related
- 2009-06-30 TW TW098121955A patent/TWI394960B/en not_active IP Right Cessation
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| US6636060B1 (en) * | 1999-07-16 | 2003-10-21 | Advantest Corporation | Insert for electric devices testing apparatus |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI505051B (en) * | 2014-01-28 | 2015-10-21 | Hon Tech Inc | A plurality of electronic components can be positioned at the same time positioning device and its application of the operating equipment |
| CN106291301A (en) * | 2015-06-08 | 2017-01-04 | 京元电子股份有限公司 | Semiconductor subassembly pressure test device and test equipment thereof |
| CN106291301B (en) * | 2015-06-08 | 2019-01-29 | 京元电子股份有限公司 | Semiconductor subassembly pressure test device and its test equipment |
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| CN108267618A (en) * | 2017-01-03 | 2018-07-10 | 东捷科技股份有限公司 | Fixture with extensible probe |
| CN109990988A (en) * | 2017-12-29 | 2019-07-09 | 上海共联通信信息发展有限公司 | A kind of 4G wireless base station device board performance testing device |
| CN109990988B (en) * | 2017-12-29 | 2023-11-07 | 上海共联通信信息发展有限公司 | Board card performance testing device for 4G wireless base station equipment |
| TWI676033B (en) * | 2018-11-09 | 2019-11-01 | 京元電子股份有限公司 | Semiconductor testing carrier with buffering container and testing apparatus thereof |
| CN111190087A (en) * | 2018-11-15 | 2020-05-22 | 京元电子股份有限公司 | Semiconductor element test carrying disc with floating containing seat and test equipment thereof |
| CN111190087B (en) * | 2018-11-15 | 2022-03-15 | 京元电子股份有限公司 | Semiconductor element test carrying disc with floating containing seat and test equipment thereof |
| CN114046975A (en) * | 2021-11-10 | 2022-02-15 | 日月光半导体制造股份有限公司 | Test fixture and test method suitable for IC bearing disc |
| CN115932342A (en) * | 2023-02-20 | 2023-04-07 | 天津伍嘉联创科技发展股份有限公司 | Adjustable testboard for detecting electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101156962B1 (en) | 2012-06-20 |
| JP5282093B2 (en) | 2013-09-04 |
| TWI394960B (en) | 2013-05-01 |
| TW201013197A (en) | 2010-04-01 |
| KR20110018426A (en) | 2011-02-23 |
| JPWO2010004844A1 (en) | 2011-12-22 |
| WO2010004844A1 (en) | 2010-01-14 |
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Application publication date: 20110601 |