CN106291301B - Semiconductor subassembly pressure test device and its test equipment - Google Patents
Semiconductor subassembly pressure test device and its test equipment Download PDFInfo
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- CN106291301B CN106291301B CN201510308857.4A CN201510308857A CN106291301B CN 106291301 B CN106291301 B CN 106291301B CN 201510308857 A CN201510308857 A CN 201510308857A CN 106291301 B CN106291301 B CN 106291301B
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Abstract
A kind of semiconductor subassembly pressure test device and its test equipment, the semiconductor subassembly pressure test device include plural pressure test unit and a turntable unit.Each pressure test unit test bench including test bench on a support frame, one and once, turntable unit include that a pivotal axis, a turntable and plural floating test bench, each floating test bench system are connected with complex elastic part with turntable.Turntable rotation promotes each floating test bench corresponding between each upper test bench and lower test bench, and lower test bench includes the heating device and a heat-conducting plate for being fixedly arranged on the lower test bench, each pressure test unit supplies different test pressure and temperature, with benefit under different temperatures and pressure environment each semiconductor subassembly of follow-on test.The present invention is continuously conveyed and is tested between multiple pressure test units for semiconductor subassembly to be tested as a result, greatly improves tested productivity.
Description
Technical field
The present invention relates to a kind of semiconductor subassembly pressure test device and its test equipments, especially a kind of to be suitable for surveying
Try the test device and its test equipment of semiconductor subassembly pressure-sensing characteristic.
Background technique
Well-known technique semiconductor subassembly pressure test as disclosed in U.S. Patent Publication No. the 2009/0015277th A1
Device, referring to Fig. 8, being the side view of conventional semiconductor device pressure test device.As shown, pressure described in the text is surveyed
Trial assembly is set including one first semi-cavity 91 and one second semi-cavity 92, wherein the first semi-cavity 91 is a fixing end, the second half chambers
Body 92 is vertically moved by a lifting device 90 with closely sealed or separate the pressure test device.First semi-cavity 91 has
Groove 95, to carry the load plate 97 that semiconductor subassembly 96 is housed.Second semi-cavity 92 is with a upper groove 98 and has protrusion
Plural number test probe 913, contact above-mentioned semiconductor subassembly 96 to corresponding.In addition, pressing structure packet used by the case
Two clamping jaws 93 for being hubbed at the second semi-cavity 92 are included, can be rotated along shaft 94.
When pressure test starts, a upper surface 99 of the first semi-cavity 91 is by a lower surface of the second semi-cavity of contact 92
910, and using the outer rim of the first semi-cavity 91 of deduction of clamping jaw 93, while the o-ring 912 by being set to a groove body 911 seals up
Gas pressure.After the completion of test, clamping jaw 93 leaves the first semi-cavity 91, and the first semi-cavity 91 is transferred load to by lifting device 90
Discharging.However, this design is once only capable of testing single pressure cavity during carrying out pressure test, in addition the case uses
Rapid pipe connecting and clip mode, thus cause released gas rate high, production capacity is also more low.
Summary of the invention
A kind of semiconductor subassembly pressure test device is provided in the purpose of the present invention, by the setting of turntable, so as to be measured
The semiconductor subassembly of examination can be continuously conveyed and be tested between multiple pressure test units, and tested productivity is greatly improved.
In addition, the bearing seat of each pressure test unit and semiconductor subassembly adopts separation design, can avoid pullling supply air line and news
Number flat cable.
It is a further object of the present invention to provide a kind of semiconductor subassembly pressure test equipments, by above-mentioned semiconductor subassembly pressure
Test device combines a classification board, effectively integrates pressure test and classification is picked, reach quick and convenient charging and discharging
Efficiency.
To achieve the above object, semiconductor subassembly pressure test device provided by the invention includes plural pressure test
Unit and a turntable unit.Each pressure test unit is including test bench on a support frame, one and once test bench, support frame are solid
It is located on a Working table, and is installed with one first power device of one first down-pressed pole of tool, upper test bench and the first down-pressed pole phase
Connection, includes jig on one, an adapter plate for circuit and an at least pin measuring seat, and lower test bench is installed on a Working table, including
Once jig and at least a supply air line.As a result, during pressure test, the circuit switch of an at least pin measuring seat will be equipped with
Plate is configured at the characteristics of test bench and is that turntable unit can carry out continuous rotary test, and known pin measuring seat one end is avoided to be equipped with
Flat cable is transmitted to circuit substrate, can rotate with turntable unit, and flat cable is caused to tangle and pull apart, to test news
Test data number can be transmitted immediately and promotes measuring stability.
In addition, turntable unit includes that a pivotal axis, a turntable and plural floating test bench, pivotal axis are installed in Working table
On, which is hubbed at pivotal axis, and each floating test bench system is connected with complex elastic part with turntable, includes that a floating is controlled
Tool and a bearing seat, bearing seat is to carry at least semiconductor component.Turntable rotation promotes each floating test bench to correspond to position
Between each upper test bench and lower test bench, and each pressure test unary system supplies different test pressure, in different pressures
The each semiconductor subassembly of follow-on test under environment.
By above-mentioned design, the present invention in addition to effectively enable semiconductor subassembly to be tested multiple pressure test units it
Between be continuously conveyed and tested, greatly improve except tested productivity, also on turntable be equipped with floating test bench, in upper test
During seat pushes, the adaptation of integrated testability environment is promoted, improve pressure leakage rate and increases accurate testing degree.
Above-mentioned each pressure test unit can further include the heating device and a heat-conducting plate for being fixedly arranged on lower test bench.By
This can be detected in the environment of different temperatures during pressure test for influence caused by semiconductor subassembly simultaneously,
With each semiconductor subassembly of follow-on test under different pressures and temperature environment, increase semiconductor subassembly pressure test dress of the present invention
The more function and raising testing efficiency set.
Above-mentioned semiconductor subassembly pressure test device can further include plural preheating station, wherein each preheating station includes
One preheating support frame, one preheat upper test bench and the lower test bench of a preheating, which is installed on a Working table, and fills
Equipped with one second power device for having one second down-pressed pole, test bench system is connected with second down-pressed pole in the preheating, this is pre-
The lower test bench of heat is installed on a Working table.As a result, when each pressure test unit is carrying out test pressure, it can open simultaneously
Open preheating heating device and carry out the heating operation of preheating heat-conducting plate, enable floating test bench on turntable first with pre- thermal conductivity
Hot plate contacts in advance, avoids the waste of heating time.
Above-mentioned plural number preheating station and plural pressure test unit can be arranged for ring-like spacer.As a result, when each pressure test
When unit is carrying out test pressure, adjacent floating test bench can all carry out the heating operation of preheating heat-conducting plate simultaneously, so that
Each pressure test unit can connect the pressure test for carrying out assigned temperature without interrupting, extremely by the rotation improved efficiency of turntable
It is maximum.
An above-mentioned at least pin measuring seat can be two pin measuring seats, including one first pin measuring seat and one second pin measuring seat, and the first needle is surveyed
Seat is contacted with bearing seat, while the second pin measuring seat is in contact with a circuit substrate.As a result, when the first down-pressed pole pushes upper test bench
Make that the first pin measuring seat contacts with bearing seat when, test information obtained will be transmitted to circuit base by the second pin measuring seat immediately
Plate, and then import to computer or other analysis instruments, thus turntable unit can carry out continuous rotary test, and pin measuring seat is without logical
Cross flat cable and be transmitted to circuit substrate, exempting flat cable can rotate with turntable unit, and cause flat cable tangle with
It pulls apart.
Above-mentioned each floating test bench can further include an at least o-ring, may be disposed at the surface of bearing seat.As a result, may be used
The adaptation for promoting floating test bench and upper test bench, makes gas be not easy to leak outside, establishes good pressure environment.
Above-mentioned complex elastic part can be plural spring, provide and push closely sealed development length, therefore floating test bench is under
Test bench can be tightly engaged into, and gas is made to be not easy to leak outside, and establish good pressure environment.
On the other hand, semiconductor subassembly pressure test equipment of the invention includes a classification board and semiconductor group
Part pressure test device, classification board includes the charging for being set to a capstan head of a Working table and being arranged around capstan head
Slot, a checking device, a charging tray and a travelling mechanism, capstan head include angled spaced plural absorption heads, line-shifting machine
Structure includes a fetching device, and feed well, checking device and charging tray, which respectively correspond, to be set to below plural absorption heads.
Semiconductor subassembly pressure test device includes plural pressure test unit and a turntable unit, and each pressure is surveyed
Trying unit includes a support frame, test bench and once test bench, support frame are installed on Working table on one, and is installed with tool 1 the
One first power device of one down-pressed pole, upper test bench are connected with the first down-pressed pole, include jig on one, a circuit switch
Plate and at least a pin measuring seat, lower test bench include jig and at least a supply air line.Turntable unit includes a pivotal axis, one
Turntable and plural floating test bench, pivotal axis are installed on Working table, and turntable is hubbed at pivotal axis, each floating test bench system with
Complex elastic part is connected with turntable, includes a floating jig and a bearing seat, bearing seat is to carry at least semiconductor
Component, turntable rotation promotes each floating test bench corresponding between each upper test bench and lower test bench, and lower test bench packet
The heating device and a heat-conducting plate for being fixedly arranged on the lower test bench are included, thus each pressure test unary system supplies different test pressures
Power and temperature, with each semiconductor subassembly of follow-on test under different pressures and temperature environment.
By above-mentioned design, pan feeding is not only incorporated, inspects, test multiple function, but also only by simply connecting above-mentioned two
Group device, just can effectively integrate pressure test and operation is picked in classification, reach quick and convenient charging and discharging efficiency.
Outlined above be all exemplary in nature with next detailed description is that application in order to further illustrate the present invention is special
Sharp range.And other objects and advantages for the present invention, it will be illustrated in subsequent explanation with attached drawing.
Detailed description of the invention
Fig. 1 is the perspective view of the semiconductor subassembly pressure test device of a preferred embodiment of the present invention.
Fig. 2 is the exploded view of the semiconductor subassembly pressure test device of a preferred embodiment of the present invention.
Fig. 3 A is the pressure test unit of a preferred embodiment of the present invention and the perspective view of preheating station.
Fig. 3 B is the perspective view of the pressure test unit of a preferred embodiment of the present invention and another visual angle of preheating station.
Fig. 4 is the adapter plate for circuit of a preferred embodiment of the present invention and the joint stereo figure of circuit substrate.
Fig. 5 is the A-A before the upper test bench of the semiconductor subassembly pressure test device of a preferred embodiment of the present invention pushes
Cross-sectional view.
Fig. 6 is the A-A after the upper test bench of the semiconductor subassembly pressure test device of a preferred embodiment of the present invention pushes
Cross-sectional view.
Fig. 7 is the perspective view of the semiconductor subassembly pressure test equipment of a preferred embodiment of the present invention.
Fig. 8 is the side view of conventional semiconductor device pressure test device.
Symbol description in attached drawing
1 semiconductor subassembly pressure test device, 2 pressure test units, 20 preheating stations, 201 preheating support frames, 2,011 second
Down-pressed pole, 2,012 second power devices, 202 preheat upper test bench, and 203 preheat lower test bench, and 21 support frames, 211 first push
Bar, 212 first power devices, 213 bearing plates, test bench on 22, jig on 221,222 adapter plate for circuit, 223 first needles are surveyed
Seat, 224 second pin measuring seats, 225 circuit substrates, 226 switching slots, 227 output ports, 23 lower test benches, 231 lower jigs, 232 supply
Air pipe, 3 turntable units, 30 Working tables, 31 pivotal axis, 32 turntables, 33 floating test benches, 330 elastic components, 331 floating jigs,
3311 through-holes, 332 bearing seats, 3321 chip containing grooves, 3322 connecting holes, 333O type ring, 4 semiconductor subassemblies, 5 heating devices,
50 heat-conducting plates, 6 classification boards, 61 capstan heads, 611 absorption heads, 62 feed wells, 63 checking devices, 64 charging trays, 65 travelling mechanisms, 651
Fetching device, 66 vibrating discs, 7 semiconductor subassembly pressure test equipments, 90 lifting devices, 91 first semi-cavities, 910 lower surfaces, 911
Groove body, 912O type ring, 913 test probes, 92 second semi-cavities, 93 clamping jaws, 94 shafts, 95 lower grooves, 96 semiconductor subassemblies, 97
Load plate, 98 upper grooves, 99 upper surfaces.
Specific embodiment
Please refer to Fig. 1 and Fig. 2, be the semiconductor subassembly pressure test device of a preferred embodiment of the present invention perspective view and
Exploded view.Show a kind of semiconductor subassembly pressure test device 1 in figure, includes plural pressure test unit 2, plural preheating station
20 and a turntable unit 3, each preheating station 20 and each pressure test unit 2 are ring-like spacer settings, always in the present embodiment
There are five pressure test unit 2 and five adjacent preheating stations 20 altogether, but are not limited with the number.Specially one group is removed in Fig. 1
Pressure test unit 2, to facilitate the Partial Feature in description turntable unit 3.
As shown, each pressure test unit 2 includes test bench 22 and once test bench 23 on a support frame 21, one.
Support frame 21 is installed on a Working table 30, and is installed with one first power device 212 of one first down-pressed pole 211 of tool, this
One power device 212 can be the devices such as motor or cylinder, to provide a jacking force.Upper test bench 22 is and the first down-pressed pole
211 are connected, and include jig 221 on one, an adapter plate for circuit 222, the first pin measuring seat 223 and one second pin measuring seat 224.Under
Test 23 is installed on Working table 30, including jig 231, a heating device 5, a heat-conducting plate 50 and two supply air lines once
232.Wherein, the present invention is different from well-known technique and adapter plate for circuit 222 and two pin measuring seats 223,224 is set to test bench
22.Spirit according to the present invention, turntable unit can carry out continuous rotary by two pin measuring seats of adapter plate for circuit and upper test bench
Test, avoids being known to use flat cable, is also easy to produce and tangles and pull apart, can transmit test data and increasing immediately to test signal
Into measuring stability efficiency.
Furthermore turntable unit 3 includes a pivotal axis 31, a turntable 32 and plural floating test bench 33, and pivotal axis 31 is fixed
Rotation center on the Working table 30, as entire turntable unit 3.Turntable 32 is hubbed at the pivotal axis 31, and each floating is surveyed
Trying seat 33 is to be connected with four elastic components 330 with turntable 32, wherein elastic component 330 used by the present embodiment is extension spring,
But not limited to this, and there is elasticity and the component of flexible pooling feature all can be used as elastic component 330 of the invention such as.It floats and surveys
Trying seat 33 includes a floating jig 331 and a bearing seat 332, and bearing seat 332 is mounted on the floating jig 331, to hold
Carry plural semiconductor subassembly 4.As shown in Figure 1, the rotation of turntable 32 promotes each floating test bench 33 is corresponding to be located at each upper survey
It tries between seat 22 and lower test bench 23, and each 2 system of pressure test unit supplies different test pressure, under different pressures environment
The each semiconductor subassembly 4 of follow-on test.The present invention is in addition to effectively enabling semiconductor subassembly 4 to be tested in multiple pressure tests
It is continuously conveyed and is tested between unit, greatly improved except tested productivity, floating test bench 33 is equipped with also on turntable 32,
During upper test bench 22 pushes, promoting the adaptation of integrated testability environment, improving pressure leakage rate and increasing test
Precision.
Then, Fig. 3 A and Fig. 3 B is please referred to, is the pressure test unit of a preferred embodiment of the present invention and standing for preheating station
Body figure and the perspective view at another visual angle.Show one group of adjacent pressure test unit 2 and preheating station 20 in figure, by the visual angle of Fig. 3 B
It can be seen that 21 groups of support frame are equipped with a bearing plate 213, can be the present invention together refering to Fig. 4 to carry a circuit substrate 225
The adapter plate for circuit of one preferred embodiment and the joint stereo figure of circuit substrate.Foregoing circuit substrate 225 has a switching slot
226 and plural output port 227, when upper test bench 22 pushes so that when the first pin measuring seat 223 contact to bearing seat 332, the second needle
Surveying seat 224 can then be in contact with the switching slot 226 of circuit substrate 225, so that each pressure test unit 2 is from each semiconductor
The test information obtained of component 4 will be transmitted to circuit substrate 255 by the second pin measuring seat 224 immediately, and defeated by being connected to plural number
The signal flat cable (not shown) of exit port 227 imports above-mentioned test information to computer or other analysis instruments, thus
Turntable unit can be bonded to each other and separated with circuit substrate by adapter plate for circuit, and turntable unit can carry out continuous rotary test,
To solve the limitation of signal transmitting.
Fig. 3 A and Fig. 3 B is returned to, includes one pre- about the preheating station 20 of semiconductor subassembly pressure test device 1 of the present invention
Hot support frame 201, one preheats upper test bench 202 and one and preheats lower test bench 203, and preheating support frame 201 is installed in Working table 30
On, and it is installed with one second power device 2012 of one second down-pressed pole 2011 of tool, which can be motor
Or the devices such as cylinder, to provide a jacking force, with the heat-conducting plate phase for pressing floating test bench 33 with preheating lower test bench 203
Contact, wherein preheating lower test bench 203 only has a heating device and a heat-conducting plate, and is not necessary to be equipped with supply air line.In preheating
Test bench 202 is connected with the second down-pressed pole 2011, is preheated lower test bench 203 and is installed on Working table 30.As a result, when each
When pressure test unit 2 is carrying out test pressure, adjacent floating test bench 33 can all be added simultaneously by preheating station 20
Hot work enables each pressure test unit 2 to connect the pressure test for carrying out assigned temperature without interrupting, by the wheel of turntable
Transfer efficient is promoted to maximum.
Then, Fig. 5 and Fig. 6 is please referred to, is the upper of the semiconductor subassembly pressure test device of a preferred embodiment of the present invention
The A-A cross-sectional view after A-A cross-sectional view and the pushing of upper test bench before test bench pushing.As shown in figure 5, being pushed in upper test bench 22
Before, it will be apparent that it can be seen that upper test bench 22, turntable 32 and lower test bench 23 are three separating members by cross-sectional view, wherein with
Surface one clearance D of the floating test bench 33 that turntable 32 is connected apart from the lower test bench 23, so that mistake of the turntable 32 in rotation
It is not easily susceptible to interfere in journey.More preferably, in the present embodiment, in order to avoid causing stress value change because filling gas leaks,
Therefore in corresponding first pin measuring seat 223 of bearing seat 332,332 corresponding circuits pinboard 222 of bearing seat, floating jig 331 to agreeing
The surface for carrying the corresponding floating jig 331 of seat 332 and lower test bench 23 is respectively equipped with annular groove to accommodate an o-ring 333,
For a kind of elastomeric pad of annulus shape, sealed interface when as the compression of two components can promote the airtight of each component seam crossing
Property.In addition, each chip containing groove 3321 of bearing seat 332 has each through-hole of a connecting hole 3322 and floating jig 331
3311 are connected, and constitute an air pressure path with two supply air lines 232, make the semiconductor positioned at each chip containing groove 3321
Component 4 can all experience air pressure change, achieve the purpose that pressure test.
As shown in fig. 6, the first pin measuring seat 223 is embedding when upper test bench 22 is pressed downwards by 212 actuation of the first power device
Bearing seat 332 is closed, 33 stress of floating test bench moves down, until contact to lower test bench 23, at this point, floating test bench
33 are only generated vertical displacement by the stretching action of complex elastic part 330, and turntable 32 is then unaffected is maintained at original position,
So that no longer having a clearance D between floating test bench 33 and the surface of lower test bench 23, reach being tightly engaged into for each inter-module, energy
Make gas be not easy to leak outside, establishes good pressure environment.In addition, each pressure test unit 2 is the carrying with semiconductor subassembly 4
Seat 332 adopts separation design, can avoid pullling supply air line 232 and signal flat cable, while being convenient for turntable carrying semiconductor
Component 4 improves testing efficiency to next pressure test unit 2.
Referring to Fig. 7, being the perspective view of the semiconductor subassembly pressure test equipment of a preferred embodiment of the present invention.Go out in figure
Show that a kind of semiconductor subassembly pressure test equipment 7 includes a classification board 6 and above-mentioned semiconductor subassembly pressure test device 1,
Wherein, the details about semiconductor subassembly pressure test device 1 please refer to embodiment above-mentioned, just no longer superfluous herein
It states.As shown, classification board 6 include be set to Working table 30 a capstan head 61 and around the capstan head 61 and be arranged one into
Hopper 62, a checking device 63, a charging tray 64 and a travelling mechanism 65, capstan head 61 include that angled spaced plural number is inhaled
First 611 are taken, and can carry out spinning motion makes each absorption heads 611 generate angle displacement, travelling mechanism 65 includes a fetching device
651, feed well 62, checking device 63 and charging tray 64, which respectively correspond, to be set under plural absorption heads 611.
62 one end of feed well of the present embodiment extends to 611 lower section of absorption heads, and the other end is connected to a vibrating disc 66, is
One center disk-like structure outstanding, therefore semiconductor subassembly is shaken from feed zone after falling, and falls on the ring week of vibrating disc 66 immediately.
Vibrating disc 66 is made semiconductor subassembly take advantage of a situation with the helical guideway of surrounding place side wall and is swashed by the vibration of percussion mechanism.Once judgement
When semiconductor subassembly is in correct orientation, then component is continued to be sent into feed well 62 forward.Partly leading in feed well 62
Body component, which is taken advantage of a situation, to be pushed, and absorption heads 611 62 tail end of feed well draw semiconductor subassembly after, by the rotation of capstan head 61
It is moved on the platform in appearance test area, that is, checking device above-mentioned 63.
The position that checking device 63 accepts semiconductor subassembly is similarly positioned in 611 lower section of absorption heads, mainly utilizes photography mould
Block such as Charged Coupled Device (CCD) examines the apparent correctness of semiconductor subassembly, such as whether appearance printing word correct
Or have indefectible.Once being judged as that mistake or flaw, absorption heads 611 can send semiconductor subassembly to a recovery area.Inspected dress
It sets the errorless semiconductor subassembly of 63 inspections and is just drawn first 611 again and be transferred to a charging tray 64.
Travelling mechanism 65 has a fetching device 651 to pick and place, carry semiconductor subassembly in classification board 6 and semiconductor group
Between part pressure test device 1, that is, fetching device 651 can carry out movement spatially.Specifically, fetching device 651 is removable
With charging tray 64 of taking to the charging tray 64 for being located at 611 lower section of absorption heads, wherein charging tray 64 is responsible for storing multiple from absorption heads 611
The semiconductor subassembly put down；Later, charging tray 64 can be transported to again together with semiconductor subassembly thereon and partly lead by fetching device 651
Body component pressure test device 1, and loaded each semiconductor subassembly to bearing seat 332 respectively using an absorption heads (not shown)
Chip containing groove 3321 in carry out module testing.Finally, start the test journey of above-mentioned semiconductor subassembly pressure test device 1
Sequence gives each pressure test unit 2 different test pressure and temperature for different test items or different customer demands
Degree, and via under the drive of turntable unit 3, successional test can reach for each semiconductor subassembly 4, effectively known in solution
Pressure test device need to continue the problems such as replacement pressure and state of temperature, improve testing efficiency.
Above-described embodiment is illustrated only for facilitating explanation, and the interest field that the present invention is advocated certainly should be with application
Subject to described in scope of the claims, not just the above examples.
Claims (18)
1. a kind of semiconductor subassembly pressure test device, includes:
Plural pressure test unit, each pressure test unit test bench including test bench on a support frame, one and once, should
Support frame is installed on a Working table, and is installed with one first power device, which is equipped with one first and pushes
Bar, to provide power output, test bench is connected with first down-pressed pole on this, includes jig on one, a circuit switch
Plate and at least a pin measuring seat, jig connects first down-pressed pole on this, which is mounted on this on jig, and should
At least a pin measuring seat is mounted on the adapter plate for circuit, which is installed on the Working table, including jig and extremely once
A few supply air line, an at least supply air line are arranged in the lower jig；And
One turntable unit, including a pivotal axis, a turntable and plural floating test bench, the pivotal axis are installed on the Working table,
The turntable is mounted on the pivotal axis, which is to be connected with complex elastic part with the turntable, includes one floating
Dynamic jig and a bearing seat, the bearing seat are mounted in the floating jig, the bearing seat to carry at least semiconductor component,
Turntable rotation promotes each floating test bench corresponding between each upper test bench and the lower test bench, and each pressure
Power test cell system supplies different test pressure, with follow-on test each semiconductor subassembly under different pressures environment.
2. semiconductor subassembly pressure test device according to claim 1, wherein each pressure test unit includes solid
Set on the heating device and a heat-conducting plate of the lower test bench.
3. semiconductor subassembly pressure test device according to claim 2, wherein the semiconductor subassembly pressure test device
Including plural preheating station.
4. semiconductor subassembly pressure test device according to claim 3, wherein each preheating station includes a preheating
Support frame, one preheat upper test bench and the lower test bench of a preheating, which is installed on the Working table, and is installed with one
Second power device, second power unit group are equipped with one second down-pressed pole, to provide power output, test bench in the preheating
It is connected with second down-pressed pole, test bench is installed on the Working table under the preheating, including a preheating heating device and one is in advance
Thermal conductivity hot plate, the preheating heating device and the preheating heat-conducting plate are fixedly arranged under the preheating on test bench.
5. semiconductor subassembly pressure test device according to claim 3, wherein the plural number preheating station and the plural number pressure
Test cell is ring-like spacer setting.
6. semiconductor subassembly pressure test device according to claim 1, wherein an at least pin measuring seat is the survey of two needles
Seat, including one first pin measuring seat and one second pin measuring seat, first pin measuring seat are contacted with the bearing seat, while second pin measuring seat
It is in contact with a circuit substrate.
7. semiconductor subassembly pressure test device according to claim 1, wherein each floating test bench includes at least
One o-ring.
8. semiconductor subassembly pressure test device according to claim 7, wherein an at least o-ring is set to this and holds
Carry the surface of seat.
9. semiconductor subassembly pressure test device according to claim 1, wherein the complex elastic part is plural spring.
10. a kind of semiconductor subassembly pressure test equipment, includes:
One classification board, including be set to a capstan head of a Working table and be arranged around the capstan head a feed well, one inspection
View apparatus, a charging tray and a travelling mechanism, the capstan head include angled spaced plural absorption heads, the travelling mechanism packet
A fetching device is included, the feed well, the checking device and the charging tray, which respectively correspond, to be set to below the plural number absorption heads；And
Semiconductor component pressure test device includes plural pressure test unit and a turntable unit, each pressure
Test cell test bench including test bench on a support frame, one and once, which is installed on the Working table, and is installed with
One first power device, first power unit group be equipped with one first down-pressed pole, to provide power output, on this test bench with
First down-pressed pole is connected, and includes jig on one, an adapter plate for circuit and an at least pin measuring seat, on this jig connect this
One down-pressed pole, the adapter plate for circuit are mounted on this on jig, and at least a pin measuring seat is mounted on the adapter plate for circuit by this,
The lower test bench includes jig and at least a supply air line, which is arranged in the lower jig；This turn
Disk unit includes that a pivotal axis, a turntable and plural floating test bench, the pivotal axis are installed on the Working table, which sets
In the pivotal axis, which is to be connected with complex elastic part with the turntable, includes a floating jig and one
Bearing seat, the bearing seat promote each floating test bench to correspond to position to carry at least semiconductor component, turntable rotation
Between each upper test bench and lower test bench, and each pressure test unit supplies different test pressure, in different pressures
Follow-on test each semiconductor subassembly under force environment.
11. semiconductor subassembly pressure test equipment according to claim 10, wherein each pressure test unit includes
It is fixedly arranged on the heating device and a heat-conducting plate of the lower test bench.
12. semiconductor subassembly pressure test equipment according to claim 11, wherein semiconductor subassembly pressure test dress
It sets including plural preheating station.
13. semiconductor subassembly pressure test equipment according to claim 12, wherein each preheating station includes one pre-
Hot support frame, one preheat upper test bench and the lower test bench of a preheating, which is installed on the Working table, and is installed with
One second power device, second power unit group are equipped with one second down-pressed pole and test in the preheating to provide power output
Seat is connected with second down-pressed pole, and test bench is installed on the Working table under the preheating, including a preheating heating device and one
Heat-conducting plate is preheated, the preheating heating device and the preheating heat-conducting plate are fixedly arranged under the preheating on test bench.
14. semiconductor subassembly pressure test equipment according to claim 12, wherein the plural number preheating station and plural number pressure
Power test cell is ring-like spacer setting.
15. semiconductor subassembly pressure test equipment according to claim 10, wherein an at least pin measuring seat is the survey of two needles
Seat, including one first pin measuring seat and one second pin measuring seat, first pin measuring seat are contacted with the bearing seat, while second pin measuring seat
It is in contact with a circuit substrate.
16. semiconductor subassembly pressure test equipment according to claim 10, wherein each floating test bench includes extremely
A few o-ring.
17. semiconductor subassembly pressure test equipment according to claim 16, wherein at least an o-ring is set to this for this
The surface of bearing seat.
18. semiconductor subassembly pressure test equipment according to claim 10, wherein the complex elastic part is plural bullet
Spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510308857.4A CN106291301B (en) | 2015-06-08 | 2015-06-08 | Semiconductor subassembly pressure test device and its test equipment |
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| CN201510308857.4A CN106291301B (en) | 2015-06-08 | 2015-06-08 | Semiconductor subassembly pressure test device and its test equipment |
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| CN106291301A CN106291301A (en) | 2017-01-04 |
| CN106291301B true CN106291301B (en) | 2019-01-29 |
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