CN113064057B - Integrated circuit chip detection equipment and test method - Google Patents
Integrated circuit chip detection equipment and test method Download PDFInfo
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- CN113064057B CN113064057B CN202110383702.2A CN202110383702A CN113064057B CN 113064057 B CN113064057 B CN 113064057B CN 202110383702 A CN202110383702 A CN 202110383702A CN 113064057 B CN113064057 B CN 113064057B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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Abstract
The invention belongs to the technical field of chip detection equipment, in particular to integrated circuit chip detection equipment and a test method, which comprise a base and a bracket; a placing seat is fixedly connected to the top end of the base; the end surface of the bracket, which is positioned right above the placing seat, is fixedly connected with an air cylinder; a fixed plate is fixedly connected to a telescopic rod of the air cylinder, and a camera is fixedly connected to the center of the bottom end of the fixed plate; a pair of symmetrically distributed compression bars is fixedly connected to the bottom end of the fixed plate; a probe is arranged in the placing seat; the invention provides an integrated circuit chip detection device and a test method, which aim to solve the problems that when the integrated circuit chip is detected, a probe is generally manually aligned to a pin of the chip to be tested, the test efficiency is low, and the test range is single.
Description
Technical Field
The invention belongs to the technical field of chip detection equipment, and particularly relates to integrated circuit chip detection equipment and a test method.
Background
An Integrated Circuit (IC) chip is a micro electronic device or component, and elements such as transistors, diodes, resistors, capacitors, inductors, and the like and wiring required in a circuit are interconnected together by a certain process, fabricated on one or more small semiconductor wafers or dielectric substrates, and then packaged in a package to form a micro structure with the required circuit function.
Some technical solutions related to chip detection equipment also appear in the prior art, for example, a chinese patent with application number 2020205882860 discloses an fpga-based ic chip tester, which includes a feeding conveyor belt, a driving mechanism, a detection mechanism, a first discharging conveyor belt, a second discharging conveyor belt, and a jig loaded with ic chips, where the detection mechanism includes a detection bracket, an fpga board connected with the detection equipment is disposed on the detection bracket, an elastic probe is connected to the fpga board, the driving mechanism can move the jig from the feeding conveyor belt to the detection bracket, so that the elastic probe is electrically connected with the ic chip through a probe motherboard on the jig, and further detect the ic chip, and when the detection is qualified, the driving mechanism moves the jig to the first discharging conveyor belt, and when the detection result is unqualified, the jig is moved to the second blanking conveying belt, so that automatic feeding and discharging are realized.
Some technical solutions related to chip detection devices also appear in the prior art, for example, a chinese patent with application number 2015205975402 discloses a detection device and a detection device for an integrated circuit, wherein the detection device for an integrated circuit includes a bearing seat, a clamping and positioning mechanism and a cover plate, the bearing seat is provided with a probe station; the clamping and positioning mechanism comprises a lower base, an elastic body, an upper base and an elastic clamping arm, wherein the lower base is configured corresponding to the probe station, the elastic body is elastically clamped between the probe station and the lower base, the upper base is spliced on the lower base and forms a chip containing groove, and the elastic clamping arm is movably configured in the chip containing groove; the cover plate is fixed on the bearing seat and is provided with an opening at the position corresponding to the chip containing groove, and a sliding structure which enables the elastic clamping arm to clamp and fix the integrated circuit is arranged between the elastic clamping arm and the cover plate. Therefore, the effects of quick positioning and accurate holding can be achieved.
In the prior art, when an integrated circuit chip is detected, a probe is generally manually aligned to a pin of the chip for testing, so that the testing efficiency is low, and the testing range is single.
Disclosure of Invention
The invention provides an integrated circuit chip detection device and a test method, which aims to make up for the defects of the prior art and solve the problems that when an integrated circuit chip is detected, a probe is generally manually aligned to a pin of the chip to be tested, the test efficiency is low, and the test range is single.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to an integrated circuit chip detection device, which comprises a base and a bracket, wherein the base is provided with a plurality of through holes; a placing seat is fixedly connected to the top end of the base; the end surface of the bracket, which is positioned right above the placing seat, is fixedly connected with an air cylinder; a fixed plate is fixedly connected to a telescopic rod of the air cylinder, and a camera is fixedly connected to the center of the bottom end of the fixed plate; a pair of symmetrically distributed compression bars is fixedly connected to the bottom end of the fixed plate; a probe is arranged in the placing seat; during working, in the prior art, when an integrated circuit chip is detected, a probe is generally manually aligned to a pin of the chip for testing, the testing efficiency is low, and the testing range is single.
Preferably, a first groove is formed in the placing seat; the bottom of the first groove is fixedly connected with a mother board through a spring, and a group of probes is fixedly connected on the mother board; the bottom of the first groove is fixedly connected with a moving block through a spring, and the moving block is connected to the side wall of the first groove in a sliding manner; the top end of the moving block is provided with a placing groove, and the bottom of the placing groove is provided with a group of guide holes corresponding to the probe; the during operation, when the depression bar pushes down on the chip, can promote the movable block and move down, the movable block moves down and can let the probe pass through the guiding hole and the pin of chip and contact each other, and after the contact, the depression bar continues to push down, pushes down and can drive the mother board on the probe and move down, waits to reach behind the measured resistance to compression value, and the probe also can tightly contact with pin on the chip under the effect of the spring on the mother board this moment, avoids appearing probe and pin bad contact's the condition in the testing process.
Preferably, the side walls of the two sides of the moving block are both provided with a first sliding chute; a guide plate is fixedly connected to the position, corresponding to the first sliding groove, of the first groove, and the guide plate is a right-angle trapezoidal plate; the side walls of the two sides of the placing groove are fixedly connected with a positioning plate through springs, and the positioning plate is fixedly connected with a first push rod; one end of the first push rod penetrates through the side wall of the placing groove and extends into the first sliding groove, and the end part of the first push rod is an arc end which is in mutual contact with the inclined plane of the guide plate; the side walls of two sides of the mother board are both provided with second sliding chutes, and the second sliding chutes are connected to the guide plates in a sliding manner; the during operation, promote the movable block at the depression bar and move down the in-process, first push rod moves on the inclined plane of deflector this moment, when first push rod moves on the inclined plane, can promote the positioning plate towards the standing groove direction, the positioning plate can drive the chip of placing at the standing groove and move the regulation, let the pin of chip can move the department directly over the guiding hole, make things convenient for the quick location contact of pin and probe, avoid placing the chip and need adjust the chip position many times, further practice thrift the time of detection, and after the location technique, the movable block pushes down the tip that can drive first push rod and slides on the plane of deflector, can not influence the detection of resistance to compression value.
Preferably, a switch piece is arranged on the side wall of the guide hole; the switch piece comprises a second groove; the second groove is formed at the bottom of the first groove and is formed right above the guide hole; the second groove is communicated with the side wall of the guide hole through a through cavity; a first rotating shaft is rotatably connected in the through cavity, and a first rotating wheel is fixedly connected to the first rotating shaft and is an arc-shaped wheel; a second rotating shaft is rotatably connected to the side wall of the second groove, and a second rotating wheel is fixedly connected to the second rotating shaft; the radius of the second rotating shaft is equal to that of the first rotating shaft; the second rotating wheel is fixedly connected with a baffle; the first rotating shaft and the second rotating shaft are driven by a belt; when the probe moving block moves, the probe can move in the guide hole, the probe can drive the first rotating wheel to rotate after entering, the first rotating wheel rotates through transmission of a belt of the first rotating shaft and the second rotating shaft to drive the second rotating wheel to rotate, the second rotating wheel rotates to drive the baffle to rotate, the baffle rotates to open the guide hole, the contact between the probe and a chip pin is facilitated, the end part of the arc wheel can slip with the probe after the probe drives the arc wheel to rotate for 90 degrees, and the baffle can be driven to rotate for 90 degrees due to the fact that the radiuses of the first rotating shaft and the second rotating shaft are the same; after the detection, the cylinder moves up and can drive the depression bar on the fixed plate and remove the holding down force, the probe can break away from the guiding hole this moment, then can drive first pivot wheel reversal at the probe, when the probe breaks away from, the baffle can earlier contact with the probe this moment, the phenomenon of skidding can be carried out between first pivot wheel and the probe this moment, until the probe when no longer contacting with the baffle, the probe can drive first pivot wheel reversal this moment, then the guiding hole can be sealed again to the baffle, prevent after the detection, the dust can follow on the guiding hole falls into the probe, the dust can lead to probe work the condition of contact failure to appear.
Preferably, the baffle is provided with a through groove; a semicircular rod is fixedly connected to the bottom of the second groove, and surrounds the second rotating wheel; the baffle plate slides on the semi-circular rod through the through groove; the semicircular rod is provided with a corrugated groove, and the top end of the semicircular rod is provided with a convex groove of the corrugated groove; an arc-shaped block is fixedly connected to the side wall of the through groove, which is far away from the second rotating wheel, through a spring, and the arc-shaped block is connected to the semi-circular rod in a sliding manner; a third groove is formed in the end face, far away from the second rotating wheel, of the baffle, a pushing block is connected to the side wall of the third groove in a sliding mode, and a group of soft brushes are arranged on the side wall of the pushing block; the arc-shaped block and the push block are connected with each other through a connecting rod; the during operation, at the probe removal in-process, the baffle can rotate 90, it is located the tongue of semicircle pole ripple groove to lead to the arc piece on the groove this moment, the arc piece drives the ejector pad through the connecting rod and outwards releases, outside releasing the third recess with the pappus brush, be in the vertical state this moment because of the baffle, the pappus brush can contact with chip bottom at this moment, when chip position is adjusted to the positioning plate, the chip can remove, the chip removes and can drive the pappus brush and clean the chip bottom, can clean the pin of chip bottom, guarantee the clean and tidy nature on pin surface, prevent that dust on the pin from influencing and probe contact, cause the appearance of contact failure problem.
Preferably, a fourth groove is formed in the side wall of the push block, a first elastic curved membrane is fixedly connected to the side wall of an opening of the fourth groove, the first elastic curved membrane is internally concave, and the first elastic curved membrane and the fourth groove form a sealed cavity; the soft brush is fixedly connected to the outer side wall of the first elastic curved membrane; a group of first air bags are fixedly connected to the inclined plane of the guide plate; the first air bag is communicated with a sealed cavity formed by the first elastic curved membrane and the fourth groove; the during operation, when the rotatory vertical state who finishes of baffle, first push rod moves on the inclined plane of deflector this moment, can extrude the first gasbag on deflector inclined plane, the gas of first gasbag can get into the sealed intracavity in the fourth recess of the curved membrane of first elasticity, can drive the curved membrane evagination of first elasticity, drive the pappus brush and expand, after the first gasbag of extrusion, the pappus brush can be withdrawed, drive the expansion of pappus brush and the cyclic action of shrink through extruding first gasbag, can further increase the effect of cleaning of chip bottom pin department.
Preferably, the side wall of the third groove is hinged with a roller, the hinged point is provided with a torsion spring, one side of the roller is positioned in the third groove, and the other side of the roller is positioned outside the baffle; a third push rod is fixedly connected to the side wall of the roller wheel, which is positioned in the third groove, and a fourth push rod is fixedly connected to the side wall of the roller wheel, which is positioned outside the baffle; the fourth push rod is fixedly connected with a vibration ball; the third push rod is positioned on one side of the push block close to the bottom of the third groove; during operation, when the baffle is rotatory, when the arc piece removed the recess of the ripple groove of semicircle pole, the arc piece can drive the ejector pad adduction this moment, and the ejector pad adduction can promote the third push rod and drive the gyro wheel rotatory, and the gyro wheel rotation can drive the fourth push rod rotatory, drives the vibrations ball and strikes the baffle, causes the vibrations of baffle, and the baffle vibrations can drive the pappus brush and shake, can make things convenient for the automatically cleaning of pappus brush.
Preferably, the first rotating wheel is an arc-shaped wheel, a group of arc-shaped grooves are formed in the outer side wall of the arc-shaped wheel, the bottoms of the arc-shaped grooves are fixedly connected with second elastic curved membranes through elastic sheets, and the second elastic curved membranes are fixedly connected to the inner walls of the arc-shaped grooves; the second elastic curved film protrudes outwards; the outer side wall of the second elastic curved membrane is fixedly connected with a friction ball through a connecting column; when the probe cleaning device works, the probe enters the guide hole to drive the first rotating wheel to rotate, after the first rotating wheel is pushed to rotate for 90 degrees, the outer surface of the probe and the end part of the first rotating wheel slip, when the probe is separated from the guide hole, the baffle can contact with the probe firstly, at the moment, the outer surface of the probe and the outer surface of the first rotating wheel slip, the slip can eliminate and grind a part of friction layer on the outer surface of the first rotating wheel, the phenomenon that the probe and the probe slip can cause the baffle to be incapable of rotating for 90 degrees when the probe enters the guide hole to drive the first rotating wheel to rotate can be caused, the cleaning effect of the baffle on a chip can be influenced, therefore, an arc-shaped groove is formed in the surface of the first rotating wheel, a friction ball arranged in the groove protrudes outwards under the action of the second elastic curved film and the elastic sheet, the friction ball and the outer surface of the probe can be driven to rub, and the rotating effect of the probe on the first rotating wheel when the probe enters the guide hole can not be kept, and the consumption of the friction layer of the arc wheel can be reduced when the probe slips when being separated from the guide hole, and the durability of the first rotating wheel is further improved.
Preferably, a first cavity is arranged in the friction ball, and a group of inclined holes are formed in the inner wall of the first cavity; the second elastic curved membrane and the bottom of the arc-shaped groove form a sealing cavity; the first cavity is communicated with a sealing cavity formed by the second elastic curved membrane and the arc-shaped groove; during operation, when the probe got into the guiding hole, the sealed chamber between flexible curved membrane of extrusion second and the arc wall in the friction ball can be compressed, and in gas can carry out first cavity, from the inclined hole blowout, the surface of a clean probe can be advanced to spun gas, keeps the clean and tidy nature of probe.
A method of testing an integrated circuit chip, the method being adapted for use with an integrated circuit chip test apparatus as claimed in any one of the preceding claims, the method comprising the steps of:
s1: putting an integrated circuit chip to be detected into the placing seat, starting the air cylinder, driving the fixing plate to press the upper surface of the integrated circuit chip through the pressure rod by the air cylinder, and driving the pins and the probes of the integrated circuit chip to be contacted with each other through the positioning plate;
s2: the integrity of the surface of the integrated circuit is detected through the camera, the performance of the integrated circuit chip is detected through the probe, and the pressure resistance of the integrated circuit chip is detected through the pressure lever;
s3: after the detection is finished, the air cylinder moves upwards to drive the pressure rod to relieve the downward pressure on the integrated circuit chip, and the integrated circuit chip after the detection is finished is taken out.
The invention has the following beneficial effects:
1. according to the integrated circuit chip detection equipment and the integrated circuit chip detection method, the appearance of the chip is observed through the camera of the fixing plate, the performance of the integrated circuit is detected through the contact of the probe and the pin, the pressure resistance value of the integrated circuit is detected through the pressure value given by the pressure lever, the integrity of the outer surface of the chip is clamped through the camera imaging, the detection range is enlarged, and the detection time can be saved.
2. According to the integrated circuit chip detection equipment and the integrated circuit chip detection method, the switch of the switch piece on the guide hole is controlled through the probe leading-in guide hole and the probe leading-out guide hole, and dust can be prevented from falling on the probe from the guide hole after detection is finished, so that the contact effect of the probe and a pin of a chip is prevented from being influenced.
3. According to the integrated circuit chip detection device and the integrated circuit chip detection method, the pins at the bottom end of the chip are cleaned by the cleaning soft brush in the baffle plate driven by the rotation of the baffle plate, so that the neatness of the pins of the chip is kept, and the condition of poor contact is avoided.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a schematic perspective view of the present invention;
fig. 2 is a partial sectional view of the standing seat;
FIG. 3 is a schematic view of a switch member;
FIG. 4 is a partial cross-sectional view of a baffle plate;
FIG. 5 is a partial cross-sectional view of the first rotatable wheel;
FIG. 6 is an enlarged view of area A of FIG. 5;
FIG. 7 is a schematic diagram of a method of testing an integrated circuit chip;
in the figure: 1. a base; 11. a placing seat; 12. a support; 13. a cylinder; 14. a fixing plate; 15. a camera; 16. a pressure lever; 2. a first groove; 21. a moving block; 22. a placement groove; 23. a probe; 24. a motherboard; 25. a guide hole; 26. a first chute; 27. a guide plate; 28. a first push rod; 29. a positioning plate; 3. a switch member; 31. a second groove; 32. a cavity is communicated; 33. a first rotating shaft; 34. a first rotating wheel; 35. a second rotating wheel; 36. a baffle plate; 4. a through groove; 41. a semi-circular rod; 42. a corrugated groove; 43. an arc-shaped block; 44. a connecting rod; 45. a third groove; 46. a push block; 47. a soft brush; 5. a fourth groove; 51. a first elastic curved film; 52. a first air bag; 53. a roller; 54. a third push rod; 55. a fourth push rod; 56. a vibration ball; 6. an arc-shaped slot; 61. a second elastic curved film; 62. connecting columns; 63. a friction ball; 64. a first cavity; 65. and (4) inclined holes.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Example 1:
as shown in fig. 1 to 4, the integrated circuit chip testing apparatus according to the present invention includes a base 1 and a support 12; a placing seat 11 is fixedly connected to the top end of the base 1; an air cylinder 13 is fixedly connected to the end face of the support 12, which is positioned right above the placing seat 11; a fixing plate 14 is fixedly connected to a telescopic rod of the cylinder 13, and a camera 15 is fixedly connected to the center of the bottom end of the fixing plate 14; a pair of symmetrically distributed compression bars 16 is fixedly connected to the bottom end of the fixing plate 14; a probe 23 is arranged in the placing seat 11; during operation, in the prior art, when an integrated circuit chip is detected, the probe 23 is generally manually aligned to the pin of the chip for testing, the testing efficiency is low, and the testing range is single.
As an embodiment of the present invention, a first groove 2 is formed in the placing seat 11; a mother board 24 is fixedly connected to the bottom of the first groove 2 through a spring, and a group of probes 23 is fixedly connected to the mother board 24; a moving block 21 is fixedly connected to the bottom of the first groove 2 through a spring, and the moving block 21 is slidably connected to the side wall of the first groove 2; a placing groove 22 is formed at the top end of the moving block 21, and a group of guide holes 25 are formed at the position, corresponding to the probe 23, of the bottom of the placing groove 22; during operation, when the depression bar 16 pushes down on the chip, can promote the movable block 21 and move down, the movable block 21 moves down and can let the probe 23 contact with the pin of chip through guiding hole 25, after the contact, depression bar 16 continues to push down, push down and can drive motherboard 24 on the probe 23 and move down, wait to reach the compression resistance value that measures, probe 23 also can tightly contact with pin on the chip under the effect of the spring on motherboard 24 this moment, avoid appearing probe 23 and pin and appear the condition of contact failure in the testing process.
As an embodiment of the present invention, the side walls of the moving block 21 are both provided with a first sliding chute 26; a guide plate 27 is fixedly connected to the position of the first groove 2 corresponding to the first sliding chute 26, and the guide plate 27 is a right-angled trapezoidal plate; the side walls of the two sides of the placing groove 22 are fixedly connected with a positioning plate 29 through springs, and the positioning plate 29 is fixedly connected with a first push rod 28; one end of the first push rod 28 penetrates through the side wall of the placing groove 22 and extends into the first sliding groove 26, and the end part of the first push rod 28 is an arc-shaped end and is contacted with the inclined surface of the guide plate 27; the side walls of the two sides of the mother board 24 are both provided with second sliding chutes, and the second sliding chutes are connected to the guide plates 27 in a sliding manner; in operation, in the depression bar 16 promotion movable block 21 moves down the in-process, first push rod 28 moves on the inclined plane of deflector 27 this moment, when first push rod 28 moves on the inclined plane, can promote positioning plate 29 towards standing groove 22 direction, positioning plate 29 can drive the chip of placing at standing groove 22 and move the regulation, let the pin of chip can move the department directly over guiding hole 25, make things convenient for the quick location contact of pin and probe 23, avoid needing to adjust the chip position many times placing the chip, further practice thrift the time of detecting, and after the location technique, movable block 21 pushes down and can drive the tip of first push rod 28 and slide on the plane of deflector 27, can not influence the detection of resistance to compression value.
As an embodiment of the present invention, a switch piece 3 is disposed on a side wall of the guide hole 25; the switch member 3 comprises a second recess 31; the second groove 31 is formed at the bottom of the first groove 2 and is formed right above the guide hole 25; the second groove 31 is communicated with the side wall of the guide hole 25 through a through cavity 32; a first rotating shaft 33 is rotatably connected in the through cavity 32, a first rotating wheel 34 is fixedly connected to the first rotating shaft 33, and the first rotating wheel 34 is an arc-shaped wheel; a second rotating shaft is rotatably connected to the side wall of the second groove 31, and a second rotating wheel 35 is fixedly connected to the second rotating shaft; the radius of the second rotating shaft is equal to the radius of the first rotating shaft 33; a baffle plate 36 is fixedly connected to the second rotating wheel 35; the first rotating shaft 33 and the second rotating shaft are driven by a belt; when the probe moving mechanism works, when the moving block 21 moves, the probe 23 can move in the guide hole 25, after the probe 23 enters, the probe 23 can drive the first rotating wheel 34 to rotate, the first rotating wheel 34 rotates through transmission of a belt of the first rotating shaft 33 and the second rotating shaft, the second rotating wheel 35 is driven to rotate, the second rotating wheel 35 rotates to drive the baffle 36 to rotate, the baffle 36 rotates to open the seal of the guide hole 25, so that the probe 23 is convenient to contact with a chip pin, the first rotating wheel 34 is an arc-shaped wheel, after the probe 23 drives the arc-shaped wheel to rotate for 90 degrees, the end part of the arc-shaped wheel can slip with the probe 23, and the baffle 36 can be driven to rotate for 90 degrees due to the fact that the radiuses of the first rotating shaft 33 and the second rotating shaft are the same; after the detection is finished, the air cylinder 13 moves upwards to drive the pressure rod 16 on the fixing plate 14 to release the downward pressure, the probe 23 is separated from the guide hole 25 at the moment, then the probe 23 drives the first rotating wheel 34 to rotate reversely, when the probe 23 is separated, the baffle 36 is firstly contacted with the probe 23 at the moment, a slip phenomenon can be performed between the first rotating wheel 34 and the probe 23, until the probe 23 is not contacted with the baffle 36, at the moment, the probe 23 drives the first rotating wheel 34 to rotate reversely, then the baffle 36 closes the guide hole 25 again, and the situation that dust falls into the probe 23 from the guide hole 25 after the detection is finished is prevented, and the dust can cause the probe 23 to work and cause poor contact.
As an embodiment of the present invention, the baffle 36 is provided with a through slot 4; a semi-circular rod 41 is fixedly connected to the bottom of the second groove 31, and the semi-circular rod 41 surrounds the second rotating wheel 35; the baffle plate 36 slides on the semi-circular rod 41 through the through groove 4; the semicircular rod 41 is provided with a corrugated groove 42, and the top end of the semicircular rod 41 is provided with a convex groove of the corrugated groove 42; the side wall of the through groove 4 far away from the second rotating wheel 35 is fixedly connected with an arc-shaped block 43 through a spring, and the arc-shaped block 43 is connected to the semi-circular rod 41 in a sliding manner; a third groove 45 is formed in the end face, away from the second rotating wheel 35, of the baffle 36, a pushing block 46 is connected to the side wall of the third groove 45 in a sliding mode, and a group of soft brushes 47 are arranged on the side wall of the pushing block 46; the arc-shaped block 43 and the push block 46 are connected with each other through a connecting rod 44; the during operation, at probe 23 removal in-process, baffle 36 can rotate 90, it is located the tongue of semicircle pole 41 ripple groove 42 to lead to the arc piece 43 on the groove 4 this moment, arc piece 43 drives ejector pad 46 through connecting rod 44 and outwards releases, release third recess 45 with pappus brush 47 outside, be in the vertical state this moment because of baffle 36, pappus brush 47 can contact with chip bottom this moment, when adjusting the chip position at positioning plate 29, the chip can remove, the chip removes and can drive pappus brush 47 and clean the chip bottom, can clean the pin of chip bottom, guarantee the clean and tidy nature on pin surface, prevent dust influence and probe 23 contact on the pin, cause the appearance of contact failure's problem.
As an embodiment of the present invention, a fourth groove 5 is formed on a side wall of the push block 46, and a first elastic curved film 51 is fixedly connected to the side wall of the opening of the fourth groove 5, the first elastic curved film 51 is concave, and the first elastic curved film 51 and the fourth groove 5 form a sealed cavity; the soft brush 47 is fixedly connected on the outer side wall of the first elastic curved membrane 51; a group of first air bags 52 are fixedly connected to the inclined surface of the guide plate 27; the first air bag 52 is communicated with a sealed cavity formed by the first elastic curved membrane 51 and the fourth groove 5; in operation, when the baffle 36 is in a vertical state after rotation, at this time, the first push rod 28 moves on the inclined plane of the guide plate 27, the first air bag 52 on the inclined plane of the guide plate 27 is extruded, the gas of the first air bag 52 enters the sealing cavity in the fourth groove 5 of the first elastic curved film 51, the first elastic curved film 51 is driven to protrude outwards, the soft brush 47 is driven to expand, after the first air bag 52 is extruded, the soft brush 47 is retracted, the first air bag 52 is extruded to drive the expansion and contraction of the soft brush 47 to perform a circulating action, and the cleaning effect on the pin at the bottom end of the chip is further improved.
As an embodiment of the present invention, a roller 53 is hinged to the side wall of the third groove 45, the hinged point has a torsion spring, and one side of the roller 53 is located in the third groove 45, and the other side is located outside the baffle 36; a third push rod 54 is fixedly connected to the side wall of the roller 53 positioned in the third groove 45, and a fourth push rod 55 is fixedly connected to the side wall of the roller positioned outside the baffle 36; a vibration ball 56 is fixedly connected to the fourth push rod 55; the third push rod 54 is positioned on one side of the push block 46 close to the bottom of the third groove 45; during operation, when the baffle 36 is rotatory, when the arc piece 43 moved the recess of the ripple groove 42 of semicircle pole 41, the arc piece 43 can drive the adduction of ejector pad 46 this moment, the adduction of ejector pad 46 can promote third push rod 54 to drive gyro wheel 53 rotatory, gyro wheel 53 is rotatory to drive fourth push rod 55 rotatory, drive vibrations ball 56 and strike baffle 36, cause the vibrations of baffle 36, baffle 36 vibrations can drive pappus brush 47 and shake, can make things convenient for the automatically cleaning of pappus brush 47.
Example 2:
as shown in fig. 5 to 6, in the ic chip detecting apparatus according to the present invention, the first rotating wheel 34 is an arc-shaped wheel, a set of arc-shaped grooves 6 is formed on an outer side wall of the arc-shaped wheel, a second elastic curved film 61 is fixedly connected to a bottom of each arc-shaped groove 6 through an elastic sheet, and the second elastic curved film 61 is fixedly connected to an inner wall of each arc-shaped groove 6; the second elastic curved film 61 protrudes outwards; the outer side wall of the second elastic curved membrane 61 is fixedly connected with a friction ball 63 through a connecting column 62; when the probe 23 enters the guide hole 25 to drive the first rotating wheel 34 to rotate, after the first rotating wheel 34 is pushed to rotate by 90 degrees, the outer surface of the probe 23 and the end part of the first rotating wheel 34 slip, when the probe 23 is separated from the guide hole 25, because the baffle plate 36 contacts with the probe 23 first, the outer surface of the probe 23 and the outer surface of the first rotating wheel 34 slip at the moment, the slip can eliminate a part of the friction layer on the outer surface of the first rotating wheel 34, the phenomenon that the probe 23 enters the guide hole 25 to drive the first rotating wheel 34 to rotate and the two slip can occur, the baffle plate cannot rotate by 90 degrees, the cleaning effect of the baffle plate 36 on the chip can be influenced, therefore, the arc-shaped groove 6 is formed in the surface of the first rotating wheel 34, the friction ball 63 is arranged in the groove, and the friction ball 63 and the outer surface of the probe 23 can be driven to rub under the action of the second elastic curved film 61 and the elastic sheet, the effect of the probe 23 on the rotation of the first rotating wheel 34 when entering the guide hole 25 cannot be maintained, and the wear of the friction layer of the arcuate wheel when the probe 23 slips when leaving the guide hole 25 can be reduced, thereby further improving the durability of the first rotating wheel 34.
As an embodiment of the present invention, a first cavity 64 is provided in the friction ball 63, and a set of inclined holes 65 is provided on an inner wall of the first cavity 64; the second elastic curved membrane 61 and the bottom of the arc-shaped groove 6 form a sealed cavity; the first cavity 64 is communicated with a sealed cavity formed by the second elastic curved membrane 61 and the arc-shaped groove 6; during operation, when probe 23 gets into guiding hole 25, friction ball 63 can be compressed inwards and extrude the sealed chamber between second elasticity curved membrane 61 and arc wall 6, and gas can be in first cavity 64, spouts from inclined hole 65, and the surface of probe 23 can be gone into in a clean portion to the gas of spouting, keeps the clean and tidy nature of probe 23.
The working principle is as follows: putting an integrated circuit chip to be detected into a placing seat 11, making a probe 23 and the chip correspond to each other, pressing a fixed plate 14 down by starting an air cylinder 13, pressing a pressing rod 16 on the fixed plate 14 on the upper surface of the chip, moving a moving block 21 downwards by the pressing rod 16, moving a first push rod 28 on the inclined surface of a guide plate 27 at the moment, pushing a positioning plate 29 towards a placing groove 22 when the first push rod 28 moves on the inclined surface, driving the chip placed in the placing groove 22 to move and adjust by the positioning plate 29, enabling the pin of the chip to move to the position right above a guide hole 25, enabling the probe 23 to contact with the pin of the chip through the guide hole 25, after the contact, continuously pressing the pressing rod 16, driving a motherboard 24 on the probe 23 downwards by the pressing, and after the measured compression resistance value is reached, enabling the probe 23 to tightly contact with the pin on the chip under the action of a spring on the motherboard 24 at the moment, the condition that the contact between the probe 23 and the pin is poor in the detection process is avoided; when the moving block 21 moves, the probe 23 moves in the guide hole 25, after the probe 23 enters, the probe 23 moves to drive the first rotating wheel 34 to rotate, the first rotating wheel 34 rotates through the transmission of the belt of the first rotating shaft 33 and the second rotating shaft to drive the second rotating wheel 35 to rotate, the second rotating wheel 35 rotates to drive the baffle 36 to rotate, the baffle 36 rotates to open the seal of the guide hole 25, because the baffle 36 rotates 90 degrees in the moving process of the probe 23, the arc-shaped block 43 on the through groove 4 is positioned on the convex groove of the corrugated groove 42 of the semi-circular rod 41, the arc-shaped block 43 drives the push block 46 to push out through the connecting rod 44, the soft brush 47 is pushed out of the third groove 45, because the baffle 36 is in a vertical state at the moment, the soft brush 47 can contact with the bottom end of the chip, when the position of the chip is adjusted by the positioning plate 29, the chip moves to drive the soft brush 47 to clean the bottom end of the chip, the pins at the bottom end of the chip can be cleaned, the surface tidiness of the pins is ensured, and the problem of poor contact caused by the contact between dust on the pins and the probes 23 is prevented; the probe 23 enters the guide hole 25 to drive the first rotating wheel 34 to rotate, after the first rotating wheel 34 is pushed to rotate by 90 degrees, the outer surface of the probe 23 and the end part of the first rotating wheel 34 slip, when the probe 23 is separated from the guide hole 25, the baffle plate 36 contacts with the probe 23 first, at this time, the outer surfaces of the probe 23 and the first rotating wheel 34 slip, the slip can eliminate a part of friction layer on the outer surface of the first rotating wheel 34, the phenomenon that the probe 23 enters the guide hole 25 to drive the first rotating wheel 34 to rotate can be caused, the baffle plate can not rotate by 90 degrees, the cleaning effect of the baffle plate 36 on the chip can be influenced, therefore, the arc-shaped groove 6 is formed on the surface of the first rotating wheel 34, the friction ball 63 arranged in the groove protrudes outwards under the action of the second elastic curved film 61 and the elastic sheet, and the friction ball 63 and the outer surface of the probe 23 can be driven to rub, the effect of the probe 23 on the rotation of the first rotating wheel 34 when entering the guide hole 25 cannot be maintained, and the wear of the friction layer of the arcuate wheel when the probe 23 slips when leaving the guide hole 25 can be reduced, thereby further improving the durability of the first rotating wheel 34.
A method of testing an integrated circuit chip, the method being adapted for use with an integrated circuit chip test apparatus as claimed in any one of the preceding claims, the method comprising the steps of:
s1: putting an integrated circuit chip to be detected into the placing seat, starting the air cylinder, driving the fixing plate to press the upper surface of the integrated circuit chip through the pressure rod by the air cylinder, and driving the pins and the probes of the integrated circuit chip to be contacted with each other through the positioning plate;
s2: the integrity of the surface of the integrated circuit is detected through the camera, the performance of the integrated circuit chip is detected through the probe, and the pressure resistance of the integrated circuit chip is detected through the pressure lever;
s3: after the detection is finished, the air cylinder moves upwards to drive the pressure rod to relieve the downward pressure on the integrated circuit chip, and the integrated circuit chip after the detection is finished is taken out.
The front, the back, the left, the right, the upper and the lower are all based on figure 1 in the attached drawings of the specification, according to the standard of the observation angle of a person, the side of the device facing an observer is defined as the front, the left side of the observer is defined as the left, and the like.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience in describing the present invention and for simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the scope of the present invention.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. The integrated circuit chip detection equipment is characterized by comprising a base (1) and a support (12); a placing seat (11) is fixedly connected to the top end of the base (1); an air cylinder (13) is fixedly connected to the end face of the support (12) which is positioned right above the placing seat (11); a fixed plate (14) is fixedly connected to a telescopic rod of the air cylinder (13), and a camera (15) is fixedly connected to the center of the bottom end of the fixed plate (14); a pair of symmetrically distributed compression bars (16) is fixedly connected to the bottom end of the fixed plate (14); a probe (23) is arranged in the placing seat (11); a first groove (2) is formed in the placing seat (11); a mother board (24) is fixedly connected to the bottom of the first groove (2) through a spring, and a group of probes (23) is fixedly connected to the mother board (24); a moving block (21) is fixedly connected to the bottom of the first groove (2) through a spring, and the moving block (21) is connected to the side wall of the first groove (2) in a sliding manner; a placing groove (22) is formed in the top end of the moving block (21), and a group of guide holes (25) are formed in the position, corresponding to the probe (23), of the bottom of the placing groove (22); the side walls of the two sides of the moving block (21) are respectively provided with a first sliding chute (26); a guide plate (27) is fixedly connected to the position, opposite to the first sliding chute (26), of the first groove (2), and the guide plate (27) is a right-angle trapezoidal plate; the side walls of the two sides of the placing groove (22) are fixedly connected with a positioning plate (29) through springs, and the positioning plate (29) is fixedly connected with a first push rod (28); one end of the first push rod (28) penetrates through the side wall of the placing groove (22) and extends into the first sliding groove (26), and the end part of the first push rod (28) is an arc-shaped end and is in mutual contact with the inclined plane of the guide plate (27); the second sliding grooves are formed in the side walls of the two sides of the mother board (24), and the second sliding grooves are connected to the guide plates (27) in a sliding mode.
2. The integrated circuit chip detection device according to claim 1, wherein the side wall of the guide hole (25) is provided with a switch member (3); the switch member (3) comprises a second recess (31); the second groove (31) is formed at the bottom of the first groove (2) and is formed right above the guide hole (25); the second groove (31) is communicated with the side wall of the guide hole (25) through a through cavity (32); a first rotating shaft (33) is rotatably connected in the through cavity (32), a first rotating wheel (34) is fixedly connected to the first rotating shaft (33), and the first rotating wheel (34) is an arc-shaped wheel; a second rotating shaft is rotatably connected to the side wall of the second groove (31), and a second rotating wheel (35) is fixedly connected to the second rotating shaft; the radius of the second rotating shaft is equal to the radius of the first rotating shaft (33); a baffle plate (36) is fixedly connected to the second rotating wheel (35); the first rotating shaft (33) and the second rotating shaft are driven by a belt.
3. The integrated circuit chip detection device according to claim 2, wherein the baffle (36) is provided with a through slot (4); a semicircular rod (41) is fixedly connected to the bottom of the second groove (31), and the semicircular rod (41) surrounds the second rotating wheel (35); the baffle (36) slides on the semi-circular rod (41) through the through groove (4); the semicircular rod (41) is provided with a corrugated groove (42), and the top end of the semicircular rod (41) is provided with a convex groove of the corrugated groove (42); an arc-shaped block (43) is fixedly connected to the side wall, far away from the second rotating wheel (35), of the through groove (4) through a spring, and the arc-shaped block (43) is connected to the semi-circular rod (41) in a sliding mode; a third groove (45) is formed in the end face, away from the second rotating wheel (35), of the baffle plate (36), a pushing block (46) is connected to the side wall of the third groove (45) in a sliding mode, and a group of soft brushes (47) is arranged on the side wall of the pushing block (46); the arc-shaped block (43) and the push block (46) are connected with each other through a connecting rod (44).
4. The integrated circuit chip detection device according to claim 3, wherein a fourth groove (5) is formed on the side wall of the push block (46), a first elastic curved film (51) is fixedly connected to the side wall of the opening of the fourth groove (5), the first elastic curved film (51) is concave, and the first elastic curved film (51) and the fourth groove (5) form a sealed cavity; the soft brush (47) is fixedly connected to the outer side wall of the first elastic curved membrane (51); a group of first air bags (52) are fixedly connected to the inclined plane of the guide plate (27); the first air bag (52) is communicated with a sealed cavity formed by the first elastic curved membrane (51) and the fourth groove (5).
5. The IC chip detection device according to claim 4, wherein the side wall of the third groove (45) is hinged with a roller (53), the hinge point is provided with a torsion spring, and one side of the roller (53) is positioned in the third groove (45) and the other side is positioned outside the baffle plate (36); a third push rod (54) is fixedly connected to the side wall of the roller (53) positioned in the third groove (45), and a fourth push rod (55) is fixedly connected to the side wall of the roller positioned outside the baffle (36); a vibration ball (56) is fixedly connected to the fourth push rod (55); the third push rod (54) is positioned on one side of the push block (46) close to the bottom of the third groove (45).
6. The IC chip detection device according to claim 5, wherein the first rotating wheel (34) is an arc wheel, a set of arc grooves (6) are formed on the outer side wall of the arc wheel, a second elastic curved film (61) is fixedly connected to the bottom of each arc groove (6) through an elastic sheet, and the second elastic curved film (61) is fixedly connected to the inner wall of each arc groove (6); the second elastic curved film (61) protrudes outwards; and the outer side wall of the second elastic curved membrane (61) is fixedly connected with a friction ball (63) through a connecting column (62).
7. The IC chip testing apparatus according to claim 6, wherein the friction ball (63) has a first cavity (64) therein, and a set of inclined holes (65) are formed on an inner wall of the first cavity (64); the second elastic curved membrane (61) and the bottom of the arc-shaped groove (6) form a sealed cavity; the first cavity (64) is communicated with a sealed cavity formed by the second elastic curved membrane (61) and the arc-shaped groove (6).
8. A method of testing an integrated circuit chip, the method being adapted for use with an integrated circuit chip test apparatus as claimed in any one of claims 1 to 7, the method comprising the steps of:
s1: putting an integrated circuit chip to be detected into the placing seat, starting the air cylinder, driving the fixing plate to press the upper surface of the integrated circuit chip through the pressure rod by the air cylinder, and driving the pins and the probes of the integrated circuit chip to be contacted with each other through the positioning plate;
s2: the integrity of the surface of the integrated circuit is detected through the camera, the performance of the integrated circuit chip is detected through the probe, and the pressure resistance of the integrated circuit chip is detected through the pressure lever;
s3: after the detection is finished, the air cylinder moves upwards to drive the pressure rod to relieve the downward pressure on the integrated circuit chip, and the integrated circuit chip after the detection is finished is taken out.
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| CN113645796B (en) * | 2021-08-04 | 2022-11-11 | 宁波群芯微电子股份有限公司 | High-safety integrated circuit packaging device and using method thereof |
| CN114034582B (en) * | 2021-11-10 | 2023-09-15 | 宜宾卓邦科技有限公司 | Local intensity testing device for chip test |
| CN116148578B (en) * | 2023-02-28 | 2023-07-21 | 浙江科瑞信电子科技有限公司 | Probe contact device with carrier plate buffer |
| CN117427916B (en) * | 2023-12-06 | 2024-04-12 | 容泰半导体(江苏)有限公司 | Testing device with quick fixing function for integrated circuit sealing and testing |
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