CN117427916B - Testing device with quick fixing function for integrated circuit sealing and testing - Google Patents
Testing device with quick fixing function for integrated circuit sealing and testing Download PDFInfo
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- CN117427916B CN117427916B CN202311658088.1A CN202311658088A CN117427916B CN 117427916 B CN117427916 B CN 117427916B CN 202311658088 A CN202311658088 A CN 202311658088A CN 117427916 B CN117427916 B CN 117427916B
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- 238000012360 testing method Methods 0.000 title claims abstract description 95
- 238000007789 sealing Methods 0.000 title abstract description 5
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 230000008878 coupling Effects 0.000 claims description 28
- 238000010168 coupling process Methods 0.000 claims description 28
- 238000005859 coupling reaction Methods 0.000 claims description 28
- 230000007246 mechanism Effects 0.000 claims description 26
- 230000005540 biological transmission Effects 0.000 claims description 19
- 239000002390 adhesive tape Substances 0.000 claims description 15
- 238000004804 winding Methods 0.000 claims description 12
- 238000009826 distribution Methods 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims 4
- 238000011990 functional testing Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 230000002159 abnormal effect Effects 0.000 description 6
- 238000003491 array Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/38—Collecting or arranging articles in groups
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2501/00—Sorting according to a characteristic or feature of the articles or material to be sorted
- B07C2501/0063—Using robots
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to the technical field of semiconductor manufacturing, and discloses a testing device with a rapid fixing function for integrated circuit sealing and testing. The chip tray is characterized by comprising a support, the support is provided with a conveying belt through a rotating shaft, the conveying belt is fixedly connected with a chip tray which is uniformly distributed, the support is provided with a test box, a flexible pressing plate is connected in the test box in a sliding mode, the flexible pressing plate is provided with an input circuit line, a chip base which is distributed in a rectangular array is fixedly connected in the chip tray, a second elastic telescopic rod is fixedly connected in the chip base, and a chip supporting seat is fixedly connected at the telescopic end of the second elastic telescopic rod. According to the invention, the chip is identified through the second elastic telescopic rod and the chip supporting seat, so that the normal chip can be fixed when the chip is fixed, and the chip with the bent pins can be removed because the thickness of the chip with the bent pins can be changed, so that the chip with the bent pins is not subjected to functional test.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, and discloses a testing device with a rapid fixing function for integrated circuit sealing and testing.
Background
The integrated circuit package belongs to the back end manufacturing link of the semiconductor industry chain, and is characterized in that the process of packaging and testing the manufactured chip is performed, the main function of packaging is to protect the chip and facilitate the use of the chip, and a series of tests are required to be performed on the packaged chip, wherein the tests comprise a functional test, an electrical performance test, a time sequence test, a temperature test and a reliability test.
The functional test mainly verifies whether the chip realizes the expected functions, for example, whether a logic circuit and input and output are correct or not, in the production and transportation process, since the packaged chip pins are exposed outside, the chip pins are easy to bend, in the test process, if the chip pins are bent, the problem of poor contact can be generated, and then electrical short circuit is caused, and even the test device generates adverse effects such as short circuit and high temperature, the chip with the bent pins needs to be screened out.
Disclosure of Invention
Aiming at the problems existing in the prior art, the invention provides a testing device with a rapid fixing function for integrated circuit encapsulation.
The technical scheme of the invention is as follows: the utility model provides a testing arrangement with quick fixed function is sealed to integrated circuit, includes the support, the support is provided with vacuum chuck manipulator, the conveyer belt is installed through the pivot to the support, the conveyer belt rigid coupling has evenly distributed's chip tray, the support is provided with the test box, control panel is installed to the test box, sliding connection has flexible clamp plate in the test box, flexible clamp plate is provided with the input circuit line, the rigid coupling has supporting baseplate in the test box, supporting baseplate is provided with the output circuit line, the rigid coupling has the chip base that rectangular array distributes in the chip tray, the downside rigid coupling of chip base has the test seat ground plate, the rigid coupling has the second elastic telescopic link in the chip base, the flexible end rigid coupling of second elastic telescopic link has the chip supporting seat, the chip base rigid coupling has the lead pad of symmetric distribution, the lead pad pass through the test seat ground plate with the inside rigid coupling of output circuit line, the chip test needle with the input circuit line is connected, the support is provided with the chip base of drive assembly, the support is kept away from one side of drive assembly and is provided with the fixed subassembly.
Preferably, a limiting pin is fixedly connected in the non-telescopic part of the second elastic telescopic rod, a heart-shaped sliding groove is formed in the telescopic part of the second elastic telescopic rod, and the limiting pin is in limiting sliding fit with the adjacent heart-shaped sliding groove.
Preferably, the driving assembly comprises a second electric control motor fixedly connected to one side, away from the first collecting box, of the support, the second electric control motor is electrically connected with the control panel, a first gear lack is fixedly connected to the output end of the second electric control motor, a first gear matched with the first gear lack is rotatably connected to the support, the first gear is fixedly connected to a rotating shaft of the conveyor belt, which is close to one side of the second electric control motor, a first electric control telescopic rod is fixedly connected to the inside of the test box, and a telescopic end of the first electric control telescopic rod is fixedly connected to the flexible pressing plate.
Preferably, the fixed subassembly is including the first elasticity telescopic link of symmetric distribution, first elasticity telescopic link rigid coupling in the chip base, the flexible end rigid coupling of first elasticity telescopic link has the stopper, flexible clamp plate is close to one side rigid coupling of conveyer belt has the first elasticity trigger lever of rectangular array distribution, the stopper with adjacent first elasticity trigger lever spacing cooperation, one side of chip base is provided with symmetric distribution and with adjacent stopper sliding fit's spout, the equal rigid coupling of diagonal angle department of chip base has the automatically controlled telescopic link of second, the automatically controlled telescopic link of second with output circuit line with control panel is all electrically connected, the flexible end rigid coupling of the automatically controlled telescopic link of second has the baffle.
Preferably, the chip stripping device further comprises a chip stripping mechanism, the chip stripping mechanism is used for stripping chips with damaged collecting functions, the chip stripping mechanism is arranged on the lower side of the conveyor belt, the chip stripping mechanism comprises a second collecting box, the second collecting box is fixedly connected to one side of the support, which is close to the first collecting box, a first chip supporting pad is slidably connected to the inside of the second collecting box, a second elastic triggering rod distributed in a rectangular array is fixedly connected to one side of the first chip supporting pad, the triggering rod is in sliding fit with an adjacent limiting block, a first chute frame is fixedly connected between the test box and the support, a first electric control sucker is slidably connected to the first chute frame, and the elastic resistance of the first elastic triggering rod and the second elastic triggering rod is greater than that of the first elastic telescopic rod.
Preferably, the chip pulling device further comprises a chip pulling component, the chip pulling component is used for taking down a normal chip, the chip pulling component is arranged on the lower side of the conveyor belt, the chip pulling component comprises a third collecting box, the third collecting box is fixedly connected to the inside of the test box, a second chip supporting pad is slidably connected to the inside of the third collecting box, a third elastic triggering rod distributed in a rectangular array is fixedly connected to one side, close to the conveyor belt, of the second chip supporting pad, the third elastic triggering rod is in limiting fit with an adjacent limiting block, and the third elastic triggering rod is in limiting fit with the baffle.
Preferably, the chip testing device further comprises a transmission assembly, the transmission assembly is used for transmitting power, the transmission assembly is arranged on one side of the support, the transmission assembly comprises a second gear, the second gear is rotationally connected to one side, close to the second electric control motor, of the support, the first gear lack is matched with the second gear, one side of the support is rotationally connected with a sixth belt wheel, the second gear is coaxially connected with the sixth belt wheel, a seventh belt wheel and a third gear are rotationally connected inside the testing box, a belt is wound between the sixth belt wheel and the seventh belt wheel, the seventh belt wheel is coaxially connected with the third gear, one side of the third collecting box is rotationally connected with a fourth gear and a second gear lack, the fourth gear is coaxially connected with the second gear lack, the third gear is meshed with the fourth gear, one side of the third collecting box is slidingly connected with a sixth belt wheel, the second gear lack is matched with the sixth belt wheel, one side of the rack is fixedly connected with a second chip pad, the seventh belt wheel is fixedly connected with a rack, and the chip pad is fixedly connected with the connecting rod.
Preferably, the second gear lack is fixedly connected with a friction plate, and the friction plate is in contact fit with the rack.
Preferably, the chip mounting device further comprises a blanking mechanism, the blanking mechanism is used for collecting the removed chips, the blanking mechanism is arranged on one side of the support, the blanking mechanism comprises a first belt wheel, the first belt wheel is rotationally connected to a rotating shaft of the support, the first belt wheel is coaxially connected with the rotating shaft of the conveying belt, the support is rotationally connected with a second belt wheel, a first driving belt is wound between the first belt wheel and the second belt wheel, a third belt wheel is rotationally connected to one side, close to the first belt wheel, of the support, the third belt wheel is in friction fit with the second belt wheel, a second chute frame which is symmetrically distributed is fixedly connected with the test box, an electromagnetic slide is slidingly connected with the second chute frame, a torsion spring is fixedly connected between the second chip sucker and the electromagnetic slide, the second chip sucker is in transmission connection with the third belt wheel through a power assembly, the electromagnetic slide and the second chip sucker are respectively and electrically connected with the control panel, and the support is used for adhering and mounting the chip mounting device.
Preferably, the adhesion assembly comprises fourth pulleys which are symmetrically distributed, the fourth pulleys which are symmetrically distributed are connected to the support through shaft rotation, winding rollers are fixedly connected between the fourth pulleys which are symmetrically distributed, the third pulleys are in friction fit with the fourth pulleys, the support is rotationally connected with fifth pulleys which are symmetrically distributed through a rotating shaft, winding rollers are fixedly connected between the fifth pulleys which are symmetrically distributed, a second driving belt is wound between the fourth pulleys and the adjacent fifth pulleys, the support is rotationally connected with a tape reel, a first rotating shaft and a second rotating shaft, the tape wound by the tape reel sequentially bypasses the winding rollers of the fifth pulleys, the tape reel, the first rotating shaft and the second rotating shaft, a first electric control motor is fixedly connected to the support, the first electric control motor is electrically connected with the control panel, and an output shaft of the first electric control motor is fixedly connected with the second rotating shaft.
The invention has the following advantages: according to the invention, the second elastic telescopic rod and the chip supporting seat are used for identifying the chip, so that the normal chip can be fixed when the chip is fixed, and the chip with the bent pins can be removed because the thickness of the chip with the bent pins can be changed, so that the chip with the bent pins is not subjected to functional test, and the influence of the chip with the bent pins on the testing device in the testing process is avoided; the limiting block is driven by the first elastic telescopic rod to clamp the chip, and in the clamping process, when the limiting pin slides up and down along the heart-shaped sliding groove, the telescopic part of the second elastic telescopic rod is driven to rotate, so that the chip placed with skew is clamped after being twisted; the baffle is driven by the expansion of the second electric control expansion link to separate the tested normal chips so as to facilitate further screening and distinguishing; the second elastic trigger rod of the chip stripping mechanism is matched with the limiting block to strip the chips with abnormal input and output, so that the chips are conveniently collected by operators; the rest normal chips are sucked through the cooperation of the third elastic trigger rod of the chip pulling assembly and the limiting block, so that the chips can be further collected; and the sucked chips are adhered and transferred through the blanking mechanism, so that an operator can collect the chips in a concentrated manner.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a cross-sectional view of a three-dimensional structure of the present invention;
FIG. 3 is a cross-sectional view of the internal portion of the test chamber of the present invention;
FIG. 4 is a perspective view of a fixing assembly according to the present invention;
FIG. 5 is an exploded view of the internal components of the chip tray of the present invention in a three-dimensional configuration;
FIG. 6 is a cross-sectional exploded view of a three-dimensional structure of the stop pin and the heart-shaped chute of the present invention;
FIG. 7 is a left side view of the three-dimensional structure of the present invention;
FIG. 8 is a schematic perspective view of a transmission assembly according to the present invention;
FIG. 9 is a schematic view of a portion of a drive assembly of the present invention;
fig. 10 is a schematic perspective view of a component part at a second electric control motor according to the present invention;
FIG. 11 is a schematic perspective view of a blanking mechanism of the present invention;
fig. 12 is a schematic view of a part of a three-dimensional structure of the blanking mechanism of the present invention.
The marks in the drawings are: 101-support, 102-conveyor belt, 103-chip tray, 104-test box, 1041-first electrically controlled telescopic rod, 1042-flexible platen, 1043-input circuit line, 1044-support base, 1045-output circuit line, 1046-first elastic trigger rod, 105-first collection box, 1-drive assembly, 106-second electrically controlled motor, 107-first gear without gear, 108-first gear, 201-chip base, 202-test seat grounding plate, 2-fixed assembly, 203-first elastic telescopic rod, 204-stopper, 205-second elastic telescopic rod, 2051-stop pin, 2052-heart-shaped chute, 206-chip support seat, 207-foot pad, 208-chip test needle, 209-second electrically controlled telescopic rod, 210-baffle, 3-chip peeling mechanism, 301-second collecting box, 302-first chip supporting pad, 303-second elastic trigger rod, 304-first chute frame, 305-first electric control sucker, 4-chip pulling component, 401-third collecting box, 402-second chip supporting pad, 403-third elastic trigger rod, 5-blanking mechanism, 501-first pulley, 502-first driving belt, 503-second pulley, 504-third pulley, 505-second chute frame, 506-electromagnetic slide block, 507-second chip sucker, 7-adhesion component, 508-fourth pulley, 509-second driving belt, 510-fifth pulley, 511-adhesive tape reel, 512-first rotating shaft, 513-second rotating shaft, 514-a first electric control motor, 6-a transmission assembly, 601-a second gear, 602-a sixth belt pulley, 603-a seventh belt pulley, 604-a third gear, 605-a fourth gear, 606-a second gear lack, 607-a friction plate, 608-a rack, 609-a connecting rod.
Detailed Description
The invention will be further described in detail with reference to the drawings and the detailed description of the embodiments, so that the features and technical means of the invention, as well as the specific objects and functions achieved, can be further understood.
Example 1: 1-10, a testing device with quick fixing function for integrated circuit sealing and testing comprises a bracket 101, a vacuum chuck manipulator for grabbing and transferring chips is arranged on the left side of the bracket 101, a conveyor belt 102 is arranged on the front side and the rear side of the bracket 101 through a rotating shaft, a plurality of rectangular chip trays 103 which are uniformly distributed are fixedly connected with the conveyor belt 102, a plurality of rectangular grooves for positioning chips are formed on each chip tray 103, a testing box 104 for testing the chips is arranged on the bracket 101, the conveyor belt 102 penetrates through the front side and the rear side of the testing box 104, the chip trays 103 are matched with the testing box 104, the chips are tested for functions after the chips carried by the chip trays 103 into the testing box 104, a control panel is arranged on the testing box 104, the vacuum chuck manipulator is electrically connected with the control panel, a rectangular flexible pressing plate 1042 for pressing and fixing the chips is slidingly connected inside the testing box 104, the flexible pressure plate 1042 is composed of a rectangular plate and a plurality of rectangular blocks uniformly distributed in array and used for powering on, an input circuit line 1043 used for powering on the chip during functional test is arranged in the flexible pressure plate 1042, a rectangular supporting bottom plate 1044 used for supporting the chip tray 103 is fixedly connected in the test box 104, an output circuit line 1045 communicated with the negative electrode of the circuit is arranged in the supporting bottom plate 1044, the input circuit line 1043 and the output circuit line 1045 are respectively and electrically connected with the control panel, the input circuit line 1043 and the output circuit line 1045 cooperate to provide complete input and output circuits for the chip test, a plurality of chip bases 201 distributed in rectangular array are fixedly connected in the chip tray 103, each chip base 201 is positioned in the rectangular groove of the corresponding chip tray 103, the chip bases 201 are used for placing and limiting the chip, the lower side of the chip base 201 is fixedly connected with a test seat grounding plate 202 matched with an output circuit line 1045, chip output pins are communicated with the output circuit line 1045 through the test seat grounding plate 202 and used for outputting circuit signals to a control panel when the chip is tested, the inside of the chip base 201 is fixedly connected with a second elastic telescopic rod 205, the telescopic end of the second elastic telescopic rod 205 is fixedly connected with a rectangular chip supporting seat 206 with a chamfer angle, the chip supporting seat 206 and the chip are approximately used for placing and supporting the chip, the stress is more uniform when the chip is fixed, the inside of a non-telescopic part of the second elastic telescopic rod 205 is fixedly connected with a limiting pin 2051 used for positioning, the telescopic part of the second elastic telescopic rod 205 is provided with a heart-shaped sliding groove 2052 used for sliding the limiting pin 2051, the shape of the bottom of the heart-shaped sliding groove 2052 is sharper, the shape of the upper part is rounder, the limiting pin 2051 is in sliding limiting fit with the adjacent heart-shaped sliding groove 2052 for changing the telescopic locking state of the second elastic telescopic rod 205, when the limiting pin 2051 is positioned at the bottom of the heart-shaped sliding groove 2052, the second elastic telescopic rod 205 stretches out, when the limiting pin 2051 is positioned at the center of the top of the heart-shaped sliding groove 2052, the second elastic telescopic rod 205 retracts and locks, the limiting pin 2051 drives the telescopic part of the second elastic telescopic rod 205 to rotate when sliding up and down along the heart-shaped sliding groove 2052, a plurality of rectangular pin pads 207 which are symmetrically distributed and are used for communicating with the positive pins and the negative pins of the chip are fixedly connected around the chip base 201, one side of each rectangular pin pad 207, close to the chip, is provided with a hemispherical end, the hemispherical end of each pin pad 207 is matched with the positive pins and the negative pins of the chip for circuit circulation, the lead pad 207 is electrically connected with an output circuit line 1045 through the test base grounding plate 202 for feeding back the output lead number of the negative pins of the chip to the control panel, the inside rigid coupling of chip base 201 has cylindrical chip test needle 208, chip test needle 208 and input circuit line 1043 electricity are connected, the one end and the chip test needle 208 intercommunication of chip are kept away from to pin pad 207 for with the signal transmission of input circuit to the positive pin of chip, the support is provided with the drive assembly 1 that is used for providing power for conveyer belt 102, the inside of chip base 201 is provided with and is used for pressing from both sides tight fixed subassembly 2 to the chip, the front side rigid coupling of support 101 has the first collecting box 105 that is used for collecting the chip that the pin buckled, when chip tray 103 is located first collecting box 105 upside, the chip that the pin buckled falls into the inside of first collecting box 105.
As shown in fig. 2, 7, 9 and 10, the driving assembly 1 includes a second electric control motor 106, the second electric control motor 106 is fixedly connected to the left side of the rear portion of the support 101, the second electric control motor 106 is electrically connected to the control panel, the output end of the second electric control motor 106 is fixedly connected with a first gear-lack 107, the first gear-lack 107 is provided with a half circle of teeth, the left side of the rear portion of the support 101 is rotatably connected with a first gear 108 matched with the first gear-lack 107, the first gear-lack 107 is matched with the first gear 108, the first gear 108 is fixedly connected with a rotating shaft of the conveyor belt 102 near one side of the second electric control motor 106, and is used for driving the conveyor belt 102 to rotate, a first electric control telescopic rod 1041 is fixedly connected inside the test box 104, and the telescopic end of the first electric control telescopic rod 1041 is fixedly connected with the flexible pressing plate 1042 and is used for driving the flexible pressing plate 1042 to move up and down, so as to compress and fix the chip.
As shown in fig. 4-6, the fixing assembly 2 includes four symmetrically distributed first elastic telescopic rods 203, the first elastic telescopic rods 203 are fixedly connected to the inside of the chip base 201, the four first elastic telescopic rods 203 are fixedly connected to four corners of the chip base 201, the telescopic ends of the first elastic telescopic rods 203 are fixedly connected with upper wedge-shaped and lower rectangular limiting blocks 204, the upper sides of the limiting blocks 204 are wedge-shaped inclined planes, the first elastic telescopic rods 203 and the limiting blocks 204 are matched to clamp the chip, when the chip is located between the surrounding limiting blocks 204, the first elastic telescopic rods 203 drive the limiting blocks 204 to clamp the chip, and during the clamping process, as the limiting pins 2051 slide up and down along the heart-shaped sliding grooves 2052, the telescopic parts of the second elastic telescopic rods 205 are driven to rotate, the chip placed askew is clamped after being twisted, the four first elastic trigger rods 1046 are fixedly connected to a plurality of rectangular blocks on the lower side of the flexible pressing plate 1042, the first elastic triggering rod 1046 is cylindrical, the lower end is provided with an inclined plane matched with the wedge-shaped inclined plane of the limiting block 204, the wedge-shaped inclined plane of the limiting block 204 is in contact fit with the inclined plane of the adjacent first elastic triggering rod 1046, when the first elastic triggering rod 1046 moves downwards, the wedge-shaped inclined plane of the limiting block 204 is extruded, so that the limiting block 204 drives the first elastic telescopic rod 203 to open the limiting block 204 all around, when the first elastic triggering rod 1046 moves upwards, the contact with the limiting block 204 is gradually lost, so that the limiting block 204 clamps a chip, symmetrically distributed sliding grooves with shoulders 204 are arranged at the upper side of the chip base 201, the sliding grooves are in sliding fit with the limiting block 204 and are used for clamping and loosening the chip, two second electric control telescopic rods 209 are fixedly connected at the diagonal corners of the chip base 201, the second electric control telescopic rods 209 are electrically connected with the output circuit line 1045 and the control panel, the second electric control telescopic rod 209 is started when the chip is detected to be normal, and a baffle 210 is fixedly connected to the telescopic end of the second electric control telescopic rod 209 and is used for driving the baffle 210 to move to separate the chip with normal circuit when the second electric control telescopic rod 209 is started.
When the chip is packaged, the operator needs to use the device to perform functional test on the chip, firstly, the operator controls the vacuum chuck manipulator to suck the chip through the control panel, after the vacuum chuck manipulator places the sucked chip in the chip tray 103, the operator starts the second electric control motor 106 through the control panel, the second electric control motor 106 drives the first gear-lack 107 to rotate clockwise (the rotation direction of the first gear-lack 107 is based on the right view direction of the figure one, and all the rotation directions are based on the right view direction of the figure one), the first gear-lack 107 firstly drives the first gear 108 to rotate, the first gear 108 drives the conveyor belt 102 to rotate anticlockwise through the rotating shaft, the conveyor belt 102 drives the chip tray 103 on the upper part of the chip tray to move forwards, the chip tray 103 drives the chip base 201 to move synchronously, when the chip base 201 drives the chip to move into the test box 104, the first gear lack 107 rotates 180 degrees, the conveyor belt 102 drives the next group of chip trays 103 to move into the test box 104, at this time, the first gear 108 and the first gear lack 107 lose meshing, the conveyor belt 102 stops rotating, at this time, the control panel sends out instructions, the vacuum chuck manipulator places the next group of chips into the next group of chip trays 103, when the conveyor belt 102 stops rotating, the control panel controls the first electric control telescopic rod 1041 to shrink, the first electric control telescopic rod 1041 drives the flexible pressing plate 1042 to move downwards, the flexible pressing plate 1042 drives the first elastic triggering rod 1046 to move downwards, the first elastic triggering rod 1046 contacts with the limiting block 204, and as the elastic resistance of the first elastic triggering rod 1046 is greater than that of the first elastic telescopic rod 203, the first elastic triggering rod 1046 moves downwards, the first elastic telescopic rod 203 will retract gradually, then the flexible pressing plate 1042 pushes the chip downwards, so that the chip is located between the first elastic telescopic rods 203 around, the chip drives the chip supporting seat 206 to move downwards, so that the second elastic telescopic rod 205 contracts, for a chip with an intact pin, the telescopic part of the second elastic telescopic rod 205 drives the heart-shaped sliding groove 2052 to move downwards, at this time, after the limiting pin 2051 moves upwards to the top of the heart-shaped sliding groove along the heart-shaped sliding groove 2052, the heart-shaped sliding groove 2052 and the limiting pin 2051 are limited and locked, for a chip with a bent pin, the distance between the flexible pressing plate 1042 and the chip is increased due to the bending of the pin, the limiting pin 2051 cannot move to the top of the heart-shaped sliding groove 2052, and the second elastic telescopic rod 205 cannot lock the chip.
When the second elastic telescopic rod 205 descends to the limit position, the input circuit line 1043 is electrically connected with the chip test pin 208, the output circuit line 1045 is electrically connected with the test seat grounding plate 202, the lead pad 207 is electrically connected with the test seat grounding plate 202, the input end of the chip is communicated with the output short circuit and the test circuit, the function test is performed on the chip, when the test is finished, the first electric control telescopic rod 1041 moves upwards and resets, the chip is positioned on the upper side of the chip supporting seat 206, the chip with the bent pins is ejected by the elastic rebound of the second elastic telescopic rod 205, the chip which is not bent is gradually reset along with the gradual expansion and contraction of the first elastic telescopic rod 203, the first elastic trigger rod 1046 gradually loses contact with the limiting block 204 along with the upward movement of the first electric control telescopic rod 1041, the first elastic telescopic rod 203 drives the limiting block 204 to retract gradually and clamp and fix the chip, and after the test is finished, the chip with normal input and output feeds back instructions to the control panel, the control panel controls the extension end of the second electric control telescopic rod 209 where the normal chip is located to extend, the second electric control telescopic rod 209 drives the baffle 210 to move, the second electric control telescopic rod 209 where the chip with abnormal input and output is located does not move, the conveyor belt 102 continues to rotate, so that the chip base 201 moves to the lower part of the conveyor belt 102, when the chip base 201 is positioned at the front side of the conveyor belt 102, the chip with bent pins falls into the first collecting box 105 and is finally collected by an operator, the rest chips are collected by the operator after rotating to the subsequent corresponding positions, all the processes are circulated, uninterrupted function test is carried out on the chips, the tested chips are classified, after the function test on the chips is stopped, the operator resets and closes the device through the control panel, and clean the device to facilitate the next use.
Example 2: on the basis of embodiment 1, as shown in fig. 1, fig. 2 and fig. 8, the device further comprises a chip stripping mechanism 3, the chip stripping mechanism 3 is used for stripping and collecting chips with damaged functions, the chip stripping mechanism 3 is arranged on the lower side of the conveyor belt 102, the chip stripping mechanism 3 comprises a second collecting box 301 for temporarily storing chips, the second collecting box 301 is fixedly connected to the front side of the bracket 101, a rectangular first chip supporting pad 302 is slidingly connected to the inside of the second collecting box 301, the first chip supporting pad 302 is composed of a plurality of flexible rectangular blocks and square plates distributed in rectangular arrays, four cylindrical second elastic triggering rods 303 distributed in rectangular arrays are fixedly connected to the upper side of the flexible rectangular blocks of the first chip supporting pad 302, the second elastic triggering rods 303 are slidingly matched with adjacent limiting blocks 204, the upper ends of the second elastic triggering rods 303 are provided with inclined planes matched with the wedge inclined planes of the limiting blocks 204, the second elastic triggering rods move upwards and squeeze the wedge inclined planes of the limiting blocks 204, the adjacent first elastic telescopic rods 203 are compressed, the first elastic triggering rods 1046 are used for taking down the chips, the test boxes 104, the first elastic triggering rods 104 are fixedly connected with the first electric control rods 203, and the first electric control rods 203 are fixedly connected with the first elastic triggering rods 203, and the first elastic triggering rods 203 are connected with the first elastic supporting rods 203, and the first elastic triggering rods 203 are fixedly connected with the first elastic supporting rods, and the elastic triggering rods 203 are connected with the first elastic supporting rods.
As shown in fig. 7-9 and 11, the chip pulling device further includes a chip pulling device 4, the chip pulling device 4 is used for removing a normal chip, the chip pulling device 4 is disposed at the lower side of the conveyor belt 102, the chip pulling device 4 includes a third collecting box 401 for temporarily storing the normal chip, the third collecting box 401 is fixedly connected to the lower side of the inside of the test box 104, a rectangular second chip supporting pad 402 is slidingly connected to the inside of the third collecting box 401, the upper side of the second chip supporting pad 402 is formed by a rectangular array distributed flexible rectangular block and square plate, a rectangular array distributed cylindrical third elastic triggering rod 403 is fixedly connected to one side of the second chip supporting pad 402 close to the conveyor belt 102, an inclined plane is disposed at the upper end of the cylindrical third elastic triggering rod 403, the inclined plane of the third elastic triggering rod 403 is in limit fit with the wedge-shaped inclined plane of the adjacent limiting block 204, the inclined plane of the third elastic triggering rod 403 is matched with the baffle 210, and when the third elastic triggering rod 403 contacts the baffle 210, the control panel controls the second electric control telescopic rod 209 to drive the baffle 210 to retract.
As shown in fig. 8-10, the device further comprises a transmission assembly 6, the transmission assembly 6 is used for transmitting power, the transmission assembly 6 is arranged at the left side of the bracket 101, the transmission assembly 6 comprises a second gear 601 used for transmission, the second gear 601 is rotationally connected at the left side of the bracket 101, the first gear lack 107 is matched with the second gear 601, when the transmission belt 102 stops rotating, the first gear lack 107 drives the second gear 601 to rotate, the left side of the bracket 101 is rotationally connected with a sixth belt wheel 602 positioned at the right side of the second gear 601, the second gear 601 is coaxially connected with the sixth belt wheel 602, a seventh belt wheel 603 is rotationally connected with a third gear 604 inside the test box 104, a belt is wound between the sixth belt wheel 602 and the seventh belt wheel 603, the seventh belt wheel 603 is coaxially connected with the third gear 604, the left side of the third collection box 401 is rotationally connected with a fourth belt wheel 605 and a second gear lack 606, the fourth gear 605 is coaxially connected with the second missing gear 606, the third gear 604 is meshed with the fourth gear 605, the third gear 604 drives the fourth gear 605 to rotate, the fourth gear 605 drives the second missing gear 606 to rotate, the left side of the third collecting box 401 is laterally connected with a rack 608, the second missing gear 606 is matched with the rack 608 and is used for driving the rack 608 to move upwards, the right side of the rack 608 is fixedly connected with the second chip supporting pad 402, the front side of the rack 608 is fixedly connected with a connecting rod 609, the connecting rod 609 is fixedly connected with the first chip supporting pad 302, the connecting rod 609 moves to further drive the first chip supporting pad 302 to move upwards and downwards, after the rotation of the conveying belt 102 is stopped, the connecting rod 609 simultaneously drives the first chip supporting pad 302 and the second chip supporting pad 402 to move upwards, the chip with abnormal input and output and the normal chip are simultaneously sucked, the second missing gear 606 is fixedly connected with a semicircular friction plate 607, friction plate 607 is in contact engagement with rack 608 for increasing the resistance to the lowering of rack 608.
When an operator needs to perform a functional test on the chip, the operator starts the second electric control motor 106 through the control panel, the second electric control motor 106 drives the first gear lack 107 to rotate clockwise, the first gear lack 107 firstly drives the first gear 108 to rotate, the first gear 108 drives the conveyor belt 102 to rotate, after the first gear lack 107 rotates 180 degrees, the conveyor belt 102 drives the next group of chip trays 103 to move into the test box 104, at this time, the first gear lack 108 is out of engagement with the first gear lack 107, the conveyor belt 102 stops rotating, when the first gear lack 108 is out of engagement with the first gear lack 107, the first gear lack 107 meshes with the second gear 601, the first gear lack 107 drives the second gear 601 to rotate anticlockwise, the second gear 601 drives the sixth gear 602 to rotate anticlockwise, the sixth gear 602 drives the seventh gear 603 to rotate anticlockwise, the seventh gear 603 drives the third gear 604 to rotate anticlockwise, the third gear 604 drives the fourth gear 605 to rotate clockwise, the fourth gear 605 drives the second gear lack 606 to rotate clockwise, the second gear lack 606 drives the second gear lack 606 to move clockwise, and the second gear lack 606 drives the rack 608 to move upwards, and the rack 608 drives the rack 608 to move upwards.
When the connecting rod 609 moves upwards, the connecting rod 609 drives the first chip supporting pad 302 to move upwards, the first chip supporting pad 302 drives the second elastic triggering rod 303 to move upwards, the second elastic triggering rod 303 is not contacted with the limiting block 204 of the normal chip because the conveyor belt 102 stops rotating and the normal chip is blocked by the baffle 210, the chip with abnormal input and output is not blocked by the baffle 210 at the moment, the chip with abnormal input and output is taken out, the second elastic triggering rod 303 extrudes the limiting block 204, the telescopic end of the second elastic telescopic rod 205 drives the limiting block 204 to retract, the chip falls to the upper side of the first chip supporting pad 302, the friction plate 607 is contacted with the rack 608 after the second gear lack 606 rotates 180 degrees at the moment, the first chip supporting pad 302 drives the connecting rod 609 to slowly fall downwards under the action of gravity, the connecting rod 609 drives the rack 608 to slowly fall downwards, in the falling process of the rack 608, the friction plate 607 continuously rubs with the rack 608 to generate resistance, the falling speed of the first chip supporting pad 302 is reduced, the chips placed on the upper side of the first chip supporting pad 302 are prevented from shaking, the telescopic end of the second elastic telescopic rod 205 drives the limiting block 204 to rebound and reset gradually, the chips are separated from the clamping of the limiting block 204, at the moment, the chips are positioned on the upper side of the first chip supporting pad 302, at the moment, the control panel sends out an instruction to enable the first electric control sucker 305 to slide rightwards to the upper side of the chips, and the chips with abnormal input and output are sucked and collected.
When the second gear lack 606 drives the rack 608 to move upwards, the rack 608 drives the connecting rod 609 to move upwards with the second chip supporting pad 402, the connecting rod 609 drives the first chip supporting pad 302 to move upwards, the second chip supporting pad 402 moves upwards to drive the third elastic triggering rod 403 to move upwards, the third elastic triggering rod 403 is firstly contacted with the baffle 210 rotating to the moment, the control panel controls the second electric control telescopic rod 209 to retract and reset, the third elastic triggering rod 403 moves upwards to squeeze the limiting block 204, the telescopic end of the second elastic telescopic rod 205 drives the limiting block 204 to retract, the chip falls to the upper side of the second chip supporting pad 402, at the moment, after the second gear lack 609 rotates 180 degrees, the friction plate 607 is contacted with the rack 608, the rack 608 drives the second chip supporting pad 402 to slowly and downwards fall by means of gravity, the second chip supporting pad 402 drives the third elastic triggering rod 403 to move downwards, the second chip supporting pad 402 firstly drives the chip to rebound and reset, the telescopic end of the second elastic rod 205 drives the limiting block 204 to rebound and reset gradually, the chip is enabled to rebound and the chip is reset gradually, the chip is located on the upper side of the second elastic triggering rod 403 to rebound and the chip is not to be separated from the first time, the chip is repeatedly collected by the device, the device is repeatedly used for collecting chips, and the device is repeatedly used for collecting the chips, and the device is convenient to collect the chips, and the device is repeatedly used for collecting and the chips are cleaned.
Example 3: on the basis of embodiment 2, as shown in fig. 7, 9, 11 and 12, the device further comprises a blanking mechanism 5, the blanking mechanism 5 is used for collecting the removed chips, the blanking mechanism 5 is arranged at the lower side of the bracket 101, the blanking mechanism 5 comprises a first belt wheel 501, the first belt wheel 501 is rotationally connected to a rotating shaft at the rear side of the bracket 101, the first belt wheel 501 is coaxially connected with the rotating shaft of the conveying belt 102, the conveying belt 102 drives the first belt wheel 501 to synchronously rotate when rotating, a second belt wheel 503 is rotationally connected to the bracket 101, a first driving belt 502 used for driving the second belt wheel 503 to synchronously rotate is arranged between the first belt wheel 501 and the second belt wheel 503 in a winding manner, a third belt wheel 504 is rotationally connected to the right side of the bracket 101, the third belt wheel 504 is in friction fit with the second belt wheel 503, rubber rings are respectively arranged at the outer sides of the third belt wheel 504 and the second belt wheel 503 and are used for increasing friction force of the third belt wheel 504 and the second belt wheel 503, the test box 104 is fixedly connected with two second chute frames 505 which are symmetrically distributed, electromagnetic slide blocks 506 are respectively and slidably connected in the chutes on the left side and the right side of the second chute frames 505, the electromagnetic slide blocks 506 are rotationally connected with second chip sucking discs 507, the electromagnetic slide blocks 506 are used for driving the second chip sucking discs 507 to slide, torsion springs are fixedly connected between the second chip sucking discs 507 and the electromagnetic slide blocks 506, the second chip sucking discs 507 are connected with a third belt pulley 504 through a power assembly in a transmission way, one side of the third belt pulley 504 far away from the bracket 101 is coaxially connected with a gear lack, the left end and the right end of a rotating shaft of the second chip sucking discs 507 respectively penetrate through the electromagnetic slide blocks 506 on the left side and the right side to be fixedly connected with gears, the gears of the third belt pulley 504 are matched with the adjacent gear lack of the second chip sucking discs 507, after the second chip sucking discs 507 are reset, the second chip sucking discs 507 are driven to rotate through the power assembly and the chips on the second chip sucking discs are attached with adhesive tapes, and then collect the chip adhesion, the rear side axis of rotation internally mounted of second chip sucking disc 507 has the torsional spring, and the torsional spring is used for second chip sucking disc 507 to rotate and resets, and electromagnetic slide block 506 and second chip sucking disc 507 are connected with the control panel electricity respectively, and support 101 installs the adhesion subassembly 7 that is used for adhesion chip.
As shown in fig. 11 and 12, the adhesion component 7 includes two symmetrically distributed fourth pulleys 508, the two symmetrically distributed fourth pulleys 508 are connected to the support 101 through shaft rotation, a winding roller is fixedly connected between the two symmetrically distributed fourth pulleys 508, the third pulley 504 is in friction fit with the fourth pulleys 508, the support 101 is rotationally connected with two symmetrically distributed fifth pulleys 510 through the shaft rotation, a winding roller is fixedly connected between the two symmetrically distributed fifth pulleys 510, a second driving belt 509 is wound between the fourth pulleys 508 and the adjacent fifth pulleys 510, the fifth pulleys 510 drive the winding roller fixedly connected between the fifth pulleys to rotate, the support 101 is rotationally connected with a tape reel 511, a first rotating shaft 512 and a second rotating shaft 513, the tape wound by the tape reel 511 sequentially bypasses the winding roller of the fifth pulleys 510, the tape reel 511, the first rotating shaft 512 and the second rotating shaft 513, for adhesion collection of the removed chips, the support 101 is fixedly connected with a first electric control motor 514, the output end of the first electric control motor 514 is electrically connected with the left end of the second rotating shaft 513, the tape reel 510 drives the rotating shaft 512 to rotate, and the fifth rotating shaft 512 is rotationally moves to the fifth rotating shaft 512, and the tape reel is rotationally connected with the fifth rotating shaft 512, and the tape reel is rotationally moves the fifth rotating shaft 512, and the tape reel rotates 510 rotates, and the tape reel rotates 512 rotates, and the tape rotates to collect the tape reel 510.
After the normal chips are collected, the first gear 108 is meshed with the first gear lack 107, the conveyor belt 102 starts to rotate, the second chip supporting pad 402 temporarily stops moving, the control panel gives out an instruction to enable the electromagnetic sliding block 506 to drive the second chip sucker 507 to move forward to the upper side of the second chip supporting pad 402, after the second chip sucker 507 absorbs chips on the upper side of the second chip supporting pad 402, the electromagnetic sliding block 506 drives the second chip sucker 507 to move backward and reset, and at the moment, the conveyor belt 102 rotates anticlockwise to enable the first belt pulley 501 to rotate anticlockwise, the first belt pulley 501 rotates to enable the second belt pulley 503 to rotate anticlockwise, the second belt pulley 503 drives the third belt pulley 504 to rotate clockwise, the third belt pulley 504 drives the fourth belt pulley 508 to rotate anticlockwise, the fourth belt pulley 508 drives the fifth belt pulley 510 to rotate anticlockwise through the second transmission belt 509, the control panel gives out an instruction to enable the first electric control motor 514 to drive the second rotation shaft 513 to rotate anticlockwise, because the adhesive tape of the adhesive tape reel 511 sequentially bypasses the winding roller of the fifth belt wheel 510, the adhesive tape reel 511, the first rotating shaft 512 and the second rotating shaft 513, the movement of the adhesive tape drives the adhesive tape reel 511 to rotate anticlockwise, the first rotating shaft 512 rotates anticlockwise, the travelling distance of the adhesive tape is consistent with the front-back length of the chip tray 103 after the conveyor belt 102 stops moving, the notch gear of the third belt wheel 504 is matched with the gear of the second chip sucker 507 in the rotating process of the conveyor belt 102 after the second chip sucker 507 moves backwards, the notch gear drives the gear of the third belt wheel 504 to rotate, the notch gear drives the gear of the second chip sucker 507 to rotate so that the second chip sucker 507 turns downwards, the second chip sucker 507 is adhered with the adhesive tape to collect chips, the chips are gradually conveyed to the rear side of the bracket 101 along with the movement of the adhesive tape after the chips are adhered with the adhesive tape, and then collected by operating personnel, when stopping using this device, operating personnel resets this device through control panel after, closes the power of this device, cleans this device to use next time.
The foregoing examples merely illustrate one or more embodiments of the invention, which are described in greater detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (8)
1. A testing device with a quick fixing function for integrated circuit encapsulation is characterized in that: including support (101), support (101) are provided with vacuum chuck manipulator, conveyer belt (102) are installed through the pivot to support (101), conveyer belt (102) rigid coupling has evenly distributed's chip tray (103), support (101) are provided with test box (104), control panel is installed to test box (104), sliding connection has flexible clamp plate (1042) in test box (104), flexible clamp plate (1042) are provided with input circuit line (1043), rigid coupling has supporting baseplate (1044) in test box (104), supporting baseplate (1044) are provided with output circuit line (1045), rigid coupling has chip base (201) that the rectangular array distributes in chip tray (103), the downside rigid coupling of chip base (201) has test seat grounding plate (202), rigid coupling has second elastic expansion link (205) in chip base (201), the flexible end rigid coupling of second elastic expansion link (205) has chip supporting seat (206), chip base (201) rigid coupling has symmetrical lead pad (207), chip base (201) are connected with test pin (207) through test pin(s) (1045), the chip testing needle (208) is electrically connected with the input circuit line (1043), the support is provided with a driving component (1), one side, far away from the driving component, of the support (101) is fixedly connected with a first collecting box (105), a fixing component (2) is arranged in the chip base (201), a first electric control telescopic rod (1041) is fixedly connected in the testing box (104), and a telescopic end of the first electric control telescopic rod (1041) is fixedly connected with the flexible pressing plate (1042);
The fixing assembly (2) comprises first elastic telescopic rods (203) which are symmetrically distributed, the first elastic telescopic rods (203) are fixedly connected in the chip base (201), limiting blocks (204) are fixedly connected at the telescopic ends of the first elastic telescopic rods (203), first elastic trigger rods (1046) which are distributed in a rectangular array are fixedly connected at one sides of the flexible pressing plates (1042) which are close to the conveying belt (102), limiting blocks (204) are in limit fit with the adjacent first elastic trigger rods (1046), sliding grooves which are symmetrically distributed and are in sliding fit with the adjacent limiting blocks (204) are formed in one side of the chip base (201), second electric control telescopic rods (209) are fixedly connected at diagonal corners of the chip base (201), the second electric control telescopic rods (209) are electrically connected with the output circuit lines (1045) and the control panel, and baffle plates (210) are fixedly connected at the telescopic ends of the second electric control telescopic rods (209).
Still including chip peeling means (3), chip peeling means (3) are used for peeling off with collect the chip that the function damaged, chip peeling means (3) set up in the downside of conveyer belt (102), chip peeling means (3) are including second collecting box (301), second collecting box (301) rigid coupling in support (101) are close to one side of first collecting box (105), the inside sliding connection of second collecting box (301) has first chip to hold pad (302), the second elasticity triggering lever (303) that one side rigid coupling of first chip held pad (302) had rectangular array to distribute, triggering lever (303) with adjacent stopper (204) sliding fit, test box (104) with rigid coupling has first spout frame (304) between support (101), first automatically controlled sucking disc (305) with control panel electricity is connected, first elasticity triggering lever (1046) and second elasticity triggering lever (203) are big elasticity resistance to stretch out and draw back.
2. The test device with quick-attach function for integrated circuit package of claim 1, wherein: the inside rigid coupling of the non-flexible portion of second elasticity telescopic link (205) has locating pin (2051), heart-shaped spout (2052) have been seted up to the flexible portion of second elasticity telescopic link (205), locating pin (2051) with adjacent heart-shaped spout (2052) spacing sliding fit.
3. The test device with quick-attach function for integrated circuit package of claim 1, wherein: the driving assembly (1) comprises a second electric control motor (106), the second electric control motor (106) is fixedly connected to one side, away from the first collecting box (105), of the support (101), the second electric control motor (106) is electrically connected with the control panel, a first gear-lack (107) is fixedly connected to the output end of the second electric control motor (106), the support (101) is rotatably connected with a first gear (108) matched with the first gear-lack (107), and the first gear (108) is fixedly connected to a rotating shaft of the conveyor belt (102) close to one side of the second electric control motor (106).
4. A test apparatus with a quick fix function for integrated circuit package as defined in claim 3, wherein: the chip pulling device is characterized by further comprising a chip pulling component (4), the chip pulling component (4) is used for taking down a normal chip, the chip pulling component (4) is arranged on the lower side of the conveyor belt (102), the chip pulling component (4) comprises a third collecting box (401), the third collecting box (401) is fixedly connected to the inside of the test box (104), a second chip supporting pad (402) is connected to the inside of the third collecting box (401) in a sliding manner, a third elastic triggering rod (403) distributed in a rectangular array is fixedly connected to one side, close to the conveyor belt (102), of the second chip supporting pad (402), the third elastic triggering rod (403) is in limiting fit with an adjacent limiting block (204), and the third elastic triggering rod (403) is in limiting fit with the baffle (210).
5. The testing device with quick-attach function for integrated circuit packaging as defined in claim 4, wherein: the automatic test device is characterized by further comprising a transmission assembly (6), wherein the transmission assembly (6) is used for transmitting power, the transmission assembly (6) is arranged on one side of the support (101), the transmission assembly (6) comprises a second gear (601), the second gear (601) is rotatably connected to one side of the support (101) close to the second electric control motor (106), the first gear lack (107) is matched with the second gear (601), a sixth belt wheel (602) is rotatably connected to one side of the support (101), the second gear (601) is coaxially connected with the sixth belt wheel (602), a seventh belt wheel (603) and a third gear (604) are rotatably connected to the inside of the test box (104), a belt is wound between the sixth belt wheel (602) and the seventh belt wheel (603), a fourth gear (605) and a second gear lack (606) are rotatably connected to one side of the third collection box (401), the fourth gear lack (605) and the second gear lack (606) are coaxially connected to the fourth belt wheel (605), the fourth belt wheel (605) and the third belt wheel (606) are coaxially connected to the fourth belt wheel (605) and the fourth belt wheel (603), one side of the rack (608) is fixedly connected with the second chip supporting pad (402), a connecting rod (609) is fixedly connected with the other side of the rack (608), and the connecting rod (609) is fixedly connected with the first chip supporting pad (302).
6. The testing device with quick-attach function for integrated circuit packages of claim 5, wherein: the second gear lack (606) is fixedly connected with a friction plate (607), and the friction plate (607) is in contact fit with the rack (608).
7. The testing device with quick-attach function for integrated circuit packages of claim 5, wherein: the chip taking-off device is characterized by further comprising a discharging mechanism (5), wherein the discharging mechanism (5) is used for collecting the removed chips, the discharging mechanism (5) is arranged on one side of the support (101), the discharging mechanism (5) comprises a first belt wheel (501), the first belt wheel (501) is rotationally connected to a rotating shaft of the support (101), the first belt wheel (501) is coaxially connected with a rotating shaft of the conveyor belt (102), the support (101) is rotationally connected with a second belt wheel (503), a first driving belt (502) is wound between the first belt wheel (501) and the second belt wheel (503), a third belt wheel (504) is rotationally connected to one side of the support (101) close to the first belt wheel (501), the third belt wheel (504) is in friction fit with the second belt wheel (503), a second belt groove frame (505) which is symmetrically distributed is fixedly connected with the test box (104), the second belt groove frame (505) is slidingly connected with an electromagnetic slider (506), the second belt wheel (506) is rotationally connected with a second electromagnetic chuck (507) and a chip driving assembly (507) through a torsional spring, the second belt wheel (507) is rotationally connected with the chip, the electromagnetic slide block (506) and the second chip sucker (507) are respectively and electrically connected with the control panel, and the bracket (101) is provided with an adhesion component (7) for adhering chips.
8. The testing device with quick-attach function for integrated circuit packages of claim 7, wherein: the adhesion subassembly (7) including symmetric distribution's fourth band pulley (508), symmetric distribution fourth band pulley (508) all through the axle rotation connect in support (101), symmetric distribution fourth band pulley (508) between the rigid coupling have the winding roller, third band pulley (504) with fourth band pulley (508) friction fit, support (101) are connected with symmetric distribution's fifth band pulley (510) through the pivot rotation, symmetric distribution have the winding roller between fifth band pulley (510), fourth band pulley (508) and adjacent around being equipped with second drive belt (509) between fifth band pulley (510), support (101) rotate and are connected with adhesive tape spool (511), first pivot (512) and second pivot (513), adhesive tape that adhesive tape spool (511) coiled is walked around in proper order winding roller of fifth band pulley (510) adhesive tape spool (511) first pivot (512) with second pivot (513), support (101) rigid coupling has first motor (514), first automatically controlled panel (514) is connected with automatically controlled (513) automatically controlled panel (514).
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| CN202311658088.1A CN117427916B (en) | 2023-12-06 | 2023-12-06 | Testing device with quick fixing function for integrated circuit sealing and testing |
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Denomination of invention: A testing device with fast fixing function for integrated circuit packaging and testing Granted publication date: 20240412 Pledgee: Jiangsu Jurong Rural Commercial Bank Co.,Ltd. Pledgor: Rongtai semiconductor (Jiangsu) Co.,Ltd. Registration number: Y2024980024964 |
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