CN117080136A - Semiconductor package testing device - Google Patents
Semiconductor package testing device Download PDFInfo
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- CN117080136A CN117080136A CN202311104915.2A CN202311104915A CN117080136A CN 117080136 A CN117080136 A CN 117080136A CN 202311104915 A CN202311104915 A CN 202311104915A CN 117080136 A CN117080136 A CN 117080136A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 238000012360 testing method Methods 0.000 title claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 45
- 238000013016 damping Methods 0.000 claims description 15
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 50
- 238000001514 detection method Methods 0.000 abstract description 25
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- -1 gold tin copper aluminum Chemical compound 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Automation & Control Theory (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a semiconductor packaging testing device which comprises a base component and a distance component, wherein a material supporting component is arranged at the upper end of the base component, an upper cover component is arranged at the upper end of the material supporting component, the distance component is positioned at one side of the upper cover component, the distance component comprises an electric sliding rail and a distance plate, the lower end of the electric sliding rail is provided with the distance plate, the upper cover component comprises an upper cover body, a detection head, a side plate, a multi-section hydraulic cylinder, a transmission belt and a second electromagnet, the detection head is arranged at the upper end of the interior of the upper cover body, and the side plate is arranged at the periphery of the lower end of the upper cover body. The beneficial effects of the invention are as follows: this semiconductor package testing arrangement just can the material loading through the mode of accurate place package and carry accurate position, carries out accurate location to the material loading of package, increases the degree of accuracy that equipment detected, and this equipment can make the distance between package and the detection head keep invariable through the distance structure, the accurate detection of equipment of being convenient for.
Description
Technical Field
The invention relates to the technical field of semiconductor package detection, in particular to a semiconductor package testing device.
Background
Semiconductor packaging refers to the process of processing a wafer that passes testing to obtain individual chips according to product model and functional requirements. The packaging process is as follows: the wafer from the wafer front process is cut into small chips (Die) through the dicing process, then the cut chips are attached to the corresponding islands of the substrate (Lead frame) frame by glue, and then the bonding pads (Bond pads) of the chips are connected to the corresponding pins (Lead) of the substrate by using ultra-fine metal (gold tin copper aluminum) wires or conductive resin, and the required circuit is formed; and then the independent wafer is packaged and protected by a plastic shell, a series of operations are performed after the plastic packaging, the finished product Test is performed after the packaging is completed, and the packaging is performed after the packaging is completed, and finally the packaging is carried out after the packaging is completed through the semiconductor packaging Test device, so that the packaging body is detected, and the problem of the packaging of the semiconductor is prevented, and the qualification rate of the product is influenced.
The existing semiconductor packaging testing device moves down the detection head caused by vibration or partial structure looseness after long-time working, so that the distance between the detection head and the packaging body changes, the detection effect of the detection head is affected, and the equipment cannot normally detect.
It is desirable to design a semiconductor package testing apparatus that addresses the above-described problems.
Disclosure of Invention
The present invention is directed to a semiconductor package testing apparatus, which solves the above-mentioned problems.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a semiconductor encapsulation testing arrangement, includes base subassembly and distance subassembly, the upper end of base subassembly is installed and is held in the palm the material subassembly, and holds in the palm the upper end of material subassembly and be provided with upper cover subassembly, the distance subassembly is located one side of upper cover subassembly, and the distance subassembly includes electronic slide rail and distance board, the distance board is installed to electronic slide rail's lower extreme, upper cover subassembly includes the upper cover body, detects head, curb plate, multisection pneumatic cylinder, conveyer belt and second electro-magnet, and the inside upper end of the upper cover body is installed and is detected the head, the curb plate is installed all around to the lower extreme of the upper cover body, and the multisection pneumatic cylinder is installed to the lower extreme of curb plate, the conveyer belt is installed to the upper end of curb plate, the second electro-magnet is installed to the left and right sides of the upper cover body.
Further, reset components are installed on the right side of the base component, and positioning components are arranged on the left side of the base component.
Further, the power component is installed at the rear end of the positioning component, and the packaging piece is placed at the upper end of the positioning component.
Further, the base assembly comprises a base body, a first rack and a limiting clamping plate, the first rack is arranged at the lower end of the inside of the base body, and the limiting clamping plate is arranged on the left wall of the inside of the base body.
Further, the base assembly further comprises a first sliding wheel, a sliding block and a first spring, the first sliding wheel is embedded in the lower wall of the base body, the sliding block is connected to the upper end of the first sliding wheel, and the first spring is connected to the left side of the sliding block.
Further, reset assembly includes first box, piston plate, second spring, ejector pin and second rack, and the internally mounted of first box has the piston plate, the second spring is installed at both ends about the piston plate is close to one side of first box axis, and the ejector pin is installed to one side mid-mounting front end that the piston plate is close to first box axis, one side rear end that the piston plate is close to first box axis is connected with the second rack.
Further, the locating component comprises a locating frame, a connecting rod, a connecting plate, a first electromagnet, a damping rod and a second sliding wheel, wherein the connecting rod is installed on the lower wall of the locating frame in a penetrating mode, the connecting plate is connected to the lower end of the connecting rod, the first electromagnet is installed in the middle of the lower end of the connecting plate, the damping rod is installed around the lower end of the connecting plate, and the second sliding wheel is connected to the lower end of the damping rod.
Further, the power component comprises a second box body, a first motor, a first gear and a second gear, the first motor is installed in the second box body, and the rotating end of the first motor is sequentially connected with the first gear and the second gear from front to back.
Further, hold in palm material subassembly and hold in the palm the material piece including collection case, L board, telescopic link, third spring, and the left and right sides of collection case installs the L board, the inboard of L board is close to one side mid-mounting of collection case and has the third spring, and the telescopic link is installed to the inboard one side upper and lower both sides that is close to the collection case of L board, the one end that the telescopic link kept away from the L board is connected with holds in the palm the material piece.
Further, both sides are provided with the unloading subassembly around the upper cover subassembly, and the unloading subassembly includes second motor, axis of rotation, rotation board and card stub bar, the rotation end of second motor is connected with the axis of rotation, and the external connection of axis of rotation has the rotation board, the card stub bar is installed to one side that the rotation board is close to the upper cover subassembly axis.
Compared with the prior art, the invention has the beneficial effects that: this equipment carries out accurate location through the mode that accurate place package and carry the accurate position just can the material loading to the material loading of package, increases the degree of accuracy that equipment detected, and this equipment can make the distance between package and the detection head keep invariable through the distance structure, the accurate detection of equipment of being convenient for.
1. The initial state limiting clamping plate can clamp the thorn head on the connecting plate, so that the power assembly can not drive the positioning frame to move no matter whether the power assembly works or not, damage to the packaging piece or workers is prevented, when the packaging piece is accurately placed in the positioning frame, the connecting rod is pressed down, the connecting rod drives the connecting plate to move, the first electromagnet is adsorbed on the sliding block, the limiting clamping plate is separated from the connecting plate, the power assembly can work normally, the packaging piece can be accurately positioned by the equipment, the packaging piece which is processed later is in a positioning completion state, and accurate feeding detection of the equipment is facilitated.
2. After equipment removes material loading department, the second gear can be pulled the second rack to make the ejector pin jack-up separation of sliding block and first electro-magnet, reset the connecting rod through the elastic structure of damping pole, thereby jack up the encapsulation piece to the material supporting subassembly on accomplish the material loading, above-mentioned structure only can provide power for the second rack when the encapsulation piece removes the back second gear of assigned position, the length of ejector pin simultaneously also can only jack-up the separation of sliding block and first electro-magnet when being in assigned position, thereby can make equipment have accurate positioning effect, make equipment can carry out accurate material loading.
3. According to the invention, the upper cover body is pushed up to a certain height by the multi-section hydraulic cylinder, then the distance plate is driven by the electric sliding rail to extend into the upper cover body, at the moment, the multi-section hydraulic cylinder slowly loses the pushing force, so that the upper cover body falls down, the distance plate is pressed on the stacked packaging parts, the distance between each packaging part and the detection head is kept constant, the same height detection can be kept no matter how many packaging parts are in the device, and the accuracy of the detection data of the device is increased.
4. According to the invention, the clamping head is inserted into the lower end of the first packaging piece to be detected by means of the inclination of the clamping head in the distance process, the rotating plate is made of elastic soft materials such as soft plastics, conditions are provided for inserting the clamping head, after the packaging piece is detected by the equipment, the detected packaging piece is carried up by the clamping head when the position of the detecting head is regulated next time, and then the rotating shaft is driven to rotate by the second motor, so that the detected packaging piece falls onto the conveying belt to be classified and conveyed, the distance step and the blanking step of the equipment are synchronously performed, the working time of the equipment is saved, and the working efficiency of the equipment is increased.
Drawings
FIG. 1 is a schematic diagram showing a front view of a semiconductor package testing apparatus according to the present invention;
FIG. 2 is an enlarged cross-sectional view of a base assembly of a semiconductor package testing apparatus according to the present invention;
FIG. 3 is a schematic diagram showing a cross-sectional enlarged structure of a reset component of a semiconductor package testing apparatus according to the present invention;
FIG. 4 is a schematic perspective view of a reset assembly of a semiconductor package testing apparatus according to the present invention;
FIG. 5 is an enlarged schematic side sectional view of a positioning assembly of a semiconductor package testing apparatus according to the present invention;
FIG. 6 is an enlarged cross-sectional view of a semiconductor package testing apparatus according to the present invention;
FIG. 7 is an enlarged schematic cross-sectional view of a blanking assembly of a semiconductor package testing apparatus according to the present invention;
fig. 8 is a schematic diagram of a three-dimensional enlarged structure of an upper cover of a semiconductor package testing apparatus according to the present invention.
In the figure: 1. a base assembly; 101. a base; 102. a first rack; 103. a first sliding wheel; 104. a sliding block; 105. a first spring; 106. a limiting clamping plate; 2. a reset assembly; 201. a first case; 202. a piston plate; 203. a second spring; 204. a push rod; 205. a second rack; 3. a positioning assembly; 301. a positioning frame; 302. a connecting rod; 303. a connecting plate; 304. a first electromagnet; 305. a damping rod; 306. a second sliding wheel; 4. a power assembly; 401. a second case; 402. a first motor; 403. a first gear; 404. a second gear; 5. a package; 6. a material supporting component; 601. a material collecting box; 602. an L plate; 603. a telescopic rod; 604. a third spring; 605. a supporting block; 7. an upper cover assembly; 701. an upper cover body; 702. a detection head; 703. a side plate; 704. a multi-section hydraulic cylinder; 705. a transmission belt; 706. a second electromagnet; 8. a distance assembly; 801. an electric slide rail; 802. a distance plate; 9. a blanking assembly; 901. a second motor; 902. a rotating shaft; 903. a rotating plate; 904. and (5) clamping the material head.
Detailed Description
As shown in fig. 6, the present invention provides a technical solution: the semiconductor packaging testing device comprises a base component 1 and a distance component 8, wherein a material supporting component 6 is arranged at the upper end of the base component 1, an upper cover component 7 is arranged at the upper end of the material supporting component 6, the distance component 8 is positioned at one side of the upper cover component 7, the distance component 8 comprises an electric sliding rail 801 and a distance plate 802, the distance plate 802 is arranged at the lower end of the electric sliding rail 801, the upper cover component 7 comprises an upper cover body 701, a detection head 702, a side plate 703, a multi-section hydraulic cylinder 704, a transmission belt 705 and a second electromagnet 706, the detection head 702 is arranged at the upper end of the upper cover body 701, the side plate 703 is arranged at the periphery of the lower end of the upper cover body 701, the multi-section hydraulic cylinder 704 is arranged at the upper end of the side plate 703, the transmission belt 705 is arranged at the upper end of the side plate 703, and the second electromagnets 706 are arranged at the left side and the right sides of the upper cover body 701;
the device specifically comprises the following steps that an upper cover 701 is pushed up to a certain height by a multi-section hydraulic cylinder 704, then a distance plate 802 is driven by an electric sliding rail 801 to extend into the upper cover 701, at the moment, the multi-section hydraulic cylinder 704 slowly loses the pushing force to enable the upper cover 701 to fall down, the distance plate 802 is pressed on the stacked packages 5, so that the distance between each package 5 and a detection head 702 is kept constant, the packages 5 in the device can be detected at the same height no matter how many times, the accuracy of detection data of the device is improved, a second electromagnet 706 works, the upper cover 701 is adsorbed with a collection box 601, the upper cover 701 is prevented from continuously falling down, then the distance plate 802 is retracted, distance is completed, the side plate 703 is convenient for pushing the upper cover 701 by the multi-section hydraulic cylinder 704, meanwhile, the installation of a conveying belt 705 is convenient, and the detected packages 5 are conveyed.
As shown in fig. 1-5, a reset component 2 is mounted on the right side of the interior of the base component 1, a positioning component 3 is arranged on the left side of the interior of the base component 1, a power component 4 is mounted at the rear end of the positioning component 3, and a packaging piece 5 is placed at the upper end of the positioning component 3;
the reset component 2 can enable the equipment to move to the appointed position and then pop up the packaging part 5 for feeding, the positioning component 3 can accurately position the packaging part 5, the equipment can be conveniently and accurately fed, and the power component 4 can convey the packaging part 5 to the feeding position.
As shown in fig. 2, the base assembly 1 comprises a base 101, a first rack 102 and a limiting clamping plate 106, wherein the first rack 102 is installed at the lower end of the inside of the base 101, the limiting clamping plate 106 is installed at the left wall of the inside of the base 101, the base assembly 1 further comprises a first sliding wheel 103, a sliding block 104 and a first spring 105, the first sliding wheel 103 is embedded in the inner part of the lower wall of the base 101, the upper end of the first sliding wheel 103 is connected with the sliding block 104, and the left side of the sliding block 104 is connected with the first spring 105;
the first electromagnet 304 is adsorbed to the sliding block 104, so that the spacing clamping plate 106 and the connecting plate 303 are separated, the positioning assembly 3 is driven to move rightwards to feed by virtue of the meshing relationship between the first gear 403 and the first rack 102, the sliding block 104 can be subjected to the traction force of the first spring 105, and the sliding block 104 moves to the initial position by virtue of the sliding structure formed between the first sliding wheel 103 and the seat body 101.
As shown in fig. 3 and 4, the reset assembly 2 comprises a first box 201, a piston plate 202, a second spring 203, a push rod 204 and a second rack 205, wherein the piston plate 202 is installed in the first box 201, the second spring 203 is installed at the upper end and the lower end of one side of the piston plate 202, which is close to the central axis of the first box 201, the push rod 204 is installed at the front end of one side of the piston plate 202, which is close to the central axis of the first box 201, and the second rack 205 is connected to the rear end of one side of the piston plate 202, which is close to the central axis of the first box 201;
when the device moves to the feeding position, the second gear 404 pulls the second rack 205, so that the ejector rod 204 pushes the sliding block 104 away from the first electromagnet 304, the connecting rod 302 is reset through the elastic structure of the damping rod 305, and the packaging part 5 is pushed onto the material supporting component 6 to finish feeding, the second gear 404 can provide power for the second rack 205 only after the packaging part 5 moves to the designated position, and meanwhile, the sliding block 104 can be pushed away from the first electromagnet 304 only when the length of the ejector rod 204 is at the designated position, so that the device has an accurate positioning effect, the device can perform accurate feeding, the piston plate 202 is reset by virtue of the elastic telescopic structure formed between the second spring 203 and the first box 201, and the second rack 205 and the ejector rod 204 are retracted again.
As shown in fig. 5, the positioning assembly 3 comprises a positioning frame 301, a connecting rod 302, a connecting plate 303, a first electromagnet 304, a damping rod 305 and a second sliding wheel 306, wherein the connecting rod 302 is installed on the lower wall of the positioning frame 301 in a penetrating manner, the connecting plate 303 is connected to the lower end of the connecting rod 302, the first electromagnet 304 is installed in the middle of the lower end of the connecting plate 303, the damping rod 305 is installed around the lower end of the connecting plate 303, and the second sliding wheel 306 is connected to the lower end of the damping rod 305;
the spacing cardboard 106 of initial condition can block the thorn head on the link plate 303 to lead to power component 4 whether work can't drive positioning frame 301 and remove, prevent that encapsulation piece 5 from not having placed equipment and appear working, cause the injury to encapsulation piece 5 or workman, can push down connecting rod 302 when encapsulation piece 5 is accurate to place in positioning frame 301, thereby make connecting rod 302 drive link plate 303 remove, make first electro-magnet 304 adsorb on sliding block 104, thereby spacing cardboard 106 and link plate 303 realize breaking away from, make power component 4 can normally work, thereby realize that equipment carries out accurate location to encapsulation piece 5, make the encapsulation piece 5 of follow-up processing all be in the location completion state, be convenient for the accurate material loading detection of equipment, reset connecting rod 302 through damping rod 305's elastic structure, thereby upwards push up encapsulation piece 5, second movable pulley 306 is convenient for damping rod 305 to remove.
As shown in fig. 5, the power assembly 4 includes a second housing 401, a first motor 402, a first gear 403 and a second gear 404, wherein the first motor 402 is installed in the second housing 401, and the first gear 403 and the second gear 404 are sequentially connected from front to back at the rotating end of the first motor 402;
the first motor 402 is turned on to drive the first gear 403 to rotate, the positioning assembly 3 is driven to move rightwards to feed by virtue of the meshing relationship between the first gear 403 and the first rack 102, and when the packaging piece 5 is conveyed to a specified position, the second gear 404 pulls the second rack 205 through the meshing relationship with the second rack 205, so that the ejector rod 204 pushes the sliding block 104 away from the first electromagnet 304.
As shown in fig. 1, the material supporting component 6 comprises a material collecting box 601, an L plate 602, a telescopic rod 603, a third spring 604 and a material supporting block 605, wherein the L plate 602 is installed on the left side and the right side of the material collecting box 601, the third spring 604 is installed in the middle of the inner side of the L plate 602, which is close to the material collecting box 601, the telescopic rod 603 is installed on the upper side and the lower side of the inner side of the L plate 602, which is close to the material collecting box 601, and one end of the telescopic rod 603, which is far away from the L plate 602, is connected with the material supporting block 605;
when the packaging piece 5 pushes upwards, the supporting material blocks 605 are extruded, so that the packaging piece 5 moves to the supporting material blocks 605 to be placed on the supporting material blocks 605 for storage, the supporting material blocks 605 can be automatically reset by means of the elastic structure formed by the supporting material blocks 605 through the third springs 604 and the telescopic rods 603 and the L plates 602, the packaging piece 5 after loading is shielded, the packaging piece 5 after loading is prevented from falling, and the packaging piece 5 is collected through the material collecting box 601.
As shown in fig. 7 and 8, the front and rear sides of the upper cover assembly 7 are provided with blanking assemblies 9, the blanking assemblies 9 comprise a second motor 901, a rotating shaft 902, a rotating plate 903 and a clamping head 904, the rotating end of the second motor 901 is connected with the rotating shaft 902, the rotating plate 903 is connected to the outside of the rotating shaft 902, and the clamping head 904 is installed on one side of the rotating plate 903 close to the central axis of the upper cover assembly 7;
the clamping head 904 can be inserted into the lower end of the first packaging piece 5 to be detected by means of the inclination of the clamping head 904 in the distance fixing process, the rotating plate 903 is made of elastic soft materials, such as soft plastics, conditions are provided for the insertion of the clamping head 904, after the packaging piece 5 is detected by equipment, the detected packaging piece 5 can be carried up by the clamping head 904 when the position of the detecting head 702 is adjusted next time, and then the rotating shaft 902 is driven to rotate by the second motor 901, so that the detected packaging piece 5 falls onto the conveying belt 705 to be classified and conveyed, the distance fixing step and the blanking step of the equipment are synchronously performed, the working time of the equipment is saved, and the working efficiency of the equipment is increased.
Working principle: firstly, the packaging piece 5 is aligned and placed in the positioning frame 301, the connecting rod 302 is pressed downwards by the gravity of the packaging piece 5 and the pressing force during placement, the connecting rod 302 drives the connecting plate 303 to move downwards, the first electromagnet 304 is adsorbed on the sliding block 104, the separation of the limiting clamping plate 106 and the connecting plate 303 is realized, the first motor 402 is opened to drive the first gear 403 to rotate, the positioning assembly 3 is driven to move rightwards by virtue of the meshing relationship between the first gear 403 and the first rack 102 to feed materials, when the packaging piece 5 is conveyed to a specified position, the second gear 404 pulls the second rack 205 by virtue of the meshing relationship with the second rack 205, the ejector rod 204 pushes the sliding block 104 and the first electromagnet 304 apart, the sliding block 104 is subjected to the traction force of the first spring 105, and moves to an initial position by virtue of the sliding structure formed between the sliding block 104 and the seat body 101 through the first sliding wheel 103, when the sliding block 104 is separated from the first electromagnet 304, the connecting rod 302 is reset through the elastic structure of the damping rod 305, so that the packaging piece 5 is pushed upwards, the supporting block 605 is extruded when the packaging piece 5 is pushed upwards, so that the packaging piece 5 moves to the supporting block 605 to be placed on the supporting block 605 for storage, the supporting block 605 can be automatically reset by virtue of the elastic structure formed by the third spring 604, the telescopic rod 603 and the L plate 602, the packaging piece 5 after loading is blocked, the packaging piece 5 after loading is prevented from falling, at the moment, the first motor 402 is reversed to drive the positioning assembly 3 to reset, meanwhile, the piston plate 202 is reset by virtue of the elastic telescopic structure formed by the piston plate 202 through the second spring 203 and the first box 201, so that the second rack 205 and the ejector rod 204 are retracted again, after loading is finished, the upper cover 701 is pushed up to a certain height by the multi-section hydraulic cylinder 704, then the distance plate 802 is driven by the electric slide rail 801 to extend into the upper cover body 701, at this time, the multi-section hydraulic cylinder 704 slowly loses thrust, so that the upper cover body 701 falls down, the distance plate 802 is pressed on the stacked packages 5, meanwhile, the second electromagnet 706 works, so that the upper cover body 701 and the collection box 601 are adsorbed together, the upper cover body 701 is prevented from continuously falling down, then the distance plate 802 is retracted, distance is completed, the clamping head 904 is inserted into the lower end of the first package 5 to be detected by means of the inclination of the clamping head 904 in the distance process, the package of the package 5 is detected by the detection head 702, the multi-section hydraulic cylinder 704 lifts the upper cover body 701 again after the detection is finished, at this time, the detected package 5 is also lifted up by the clamping head 904, then the second motor 901 drives the rotation shaft 902 to rotate, the second motor 901 is controlled to rotate positively and negatively according to the detection result of the detection head 702, and the detected packages 5 fall onto the conveying belt 705 for classification conveying.
Claims (10)
1. The utility model provides a semiconductor package testing arrangement, its characterized in that, including base subassembly (1) and distance subassembly (8), hold in the palm material subassembly (6) are installed to the upper end of base subassembly (1), and hold in the palm the upper end of material subassembly (6) and be provided with upper cover subassembly (7), distance subassembly (8) are located one side of upper cover subassembly (7), and distance subassembly (8) include electronic slide rail (801) and distance board (802), distance board (802) are installed to the lower extreme of electronic slide rail (801), upper cover subassembly (7) include upper cover body (701), detect head (702), curb plate (703), pneumatic cylinder (704), conveyer belt (705) and second electro-magnet (706), and detect head (702) are installed to the inside upper end of upper cover body (701), install curb plate (703) all around to the lower extreme of curb plate (703), conveyer belt (705) are installed to the upper end of curb plate (703), the second multisection electro-magnet (706) are installed on the left and right sides of upper cover body (701).
2. A semiconductor package testing apparatus according to claim 1, wherein the reset assembly (2) is mounted on the inner right side of the base assembly (1), and the positioning assembly (3) is provided on the inner left side of the base assembly (1).
3. A semiconductor package testing apparatus according to claim 2, wherein the rear end of the positioning member (3) is provided with a power member (4), and the upper end of the positioning member (3) is provided with a package (5).
4. The semiconductor package testing device according to claim 2, wherein the base assembly (1) comprises a base body (101), a first rack (102) and a limiting clamping plate (106), the first rack (102) is mounted at the inner lower end of the base body (101), and the limiting clamping plate (106) is mounted at the inner left wall of the base body (101).
5. The semiconductor package testing apparatus according to claim 4, wherein the base assembly (1) further comprises a first slider (103), a slider (104) and a first spring (105), the first slider (103) is embedded in the lower wall of the base body (101), the slider (104) is connected to the upper end of the first slider (103), and the first spring (105) is connected to the left side of the slider (104).
6. The semiconductor package testing apparatus according to claim 2, wherein the reset assembly (2) comprises a first case (201), a piston plate (202), a second spring (203), a jack rod (204) and a second rack (205), wherein the piston plate (202) is mounted in the first case (201), the second spring (203) is mounted at the upper and lower ends of one side of the piston plate (202) close to the central axis of the first case (201), the jack rod (204) is mounted at the front end of one side of the piston plate (202) close to the central axis of the first case (201), and the second rack (205) is connected at the rear end of one side of the piston plate (202) close to the central axis of the first case (201).
7. The semiconductor package testing device according to claim 2, wherein the positioning assembly (3) comprises a positioning frame (301), a connecting rod (302), a connecting plate (303), a first electromagnet (304), a damping rod (305) and a second sliding wheel (306), the connecting rod (302) is installed on the lower wall of the positioning frame (301) in a penetrating manner, the connecting plate (303) is connected to the lower end of the connecting rod (302), the first electromagnet (304) is installed in the middle of the lower end of the connecting plate (303), the damping rod (305) is installed around the lower end of the connecting plate (303), and the second sliding wheel (306) is connected to the lower end of the damping rod (305).
8. The semiconductor package testing device according to claim 2, wherein the power assembly (4) comprises a second box body (401), a first motor (402), a first gear (403) and a second gear (404), the first motor (402) is installed in the second box body (401), and a first gear (403) and a second gear (404) are sequentially connected to a rotating end of the first motor (402) from front to back.
9. The semiconductor package testing device according to claim 1, wherein the material supporting component (6) comprises a material collecting box (601), an L plate (602), a telescopic rod (603), a third spring (604) and a material supporting block (605), the L plate (602) is installed on the left side and the right side of the material collecting box (601), the third spring (604) is installed on the middle portion of the inner side of the L plate (602) close to the side of the material collecting box (601), the telescopic rod (603) is installed on the upper side and the lower side of the inner side of the L plate (602) close to the side of the material collecting box (601), and one end, far away from the L plate (602), of the telescopic rod (603) is connected with the material supporting block (605).
10. The semiconductor package testing device according to claim 1, wherein the front and rear sides of the upper cover assembly (7) are provided with blanking assemblies (9), the blanking assemblies (9) comprise a second motor (901), a rotating shaft (902), a rotating plate (903) and a clamping head (904), the rotating end of the second motor (901) is connected with the rotating shaft (902), the rotating plate (903) is connected to the outer portion of the rotating shaft (902), and the clamping head (904) is mounted on one side, close to the central axis of the upper cover assembly (7), of the rotating plate (903).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311104915.2A CN117080136A (en) | 2023-08-30 | 2023-08-30 | Semiconductor package testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311104915.2A CN117080136A (en) | 2023-08-30 | 2023-08-30 | Semiconductor package testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117080136A true CN117080136A (en) | 2023-11-17 |
Family
ID=88707894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311104915.2A Withdrawn CN117080136A (en) | 2023-08-30 | 2023-08-30 | Semiconductor package testing device |
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| Country | Link |
|---|---|
| CN (1) | CN117080136A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118588644A (en) * | 2024-07-31 | 2024-09-03 | 深圳市中易腾达科技股份有限公司 | Semiconductor chip packaging module with pop-up structure |
-
2023
- 2023-08-30 CN CN202311104915.2A patent/CN117080136A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118588644A (en) * | 2024-07-31 | 2024-09-03 | 深圳市中易腾达科技股份有限公司 | Semiconductor chip packaging module with pop-up structure |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20231117 |
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| WW01 | Invention patent application withdrawn after publication |