CN214058036U

CN214058036U - Full-automatic feeding and charging equipment for semiconductor packaging process

Info

Publication number: CN214058036U
Application number: CN202022352594.6U
Authority: CN
Inventors: 何建军; 蒋美安
Original assignee: Shenzhen Xingzhi Robot Technology Co ltd; Shenzhen Shengyuan Semiconductors Co ltd
Current assignee: Shenzhen Xingzhi Robot Technology Co ltd; Shenzhen Shengyuan Semiconductors Co ltd
Priority date: 2020-10-21
Filing date: 2020-10-21
Publication date: 2021-08-27
Anticipated expiration: 2030-10-21

Abstract

The utility model relates to a full autoloading of semiconductor packaging technology and charging equipment belongs to semiconductor processing equipment technical field. The automatic feeding and discharging mechanism comprises a semiconductor frame material sheet automatic feeding and discharging mechanism, a preheating treatment mechanism, a circulating feeding mechanism, a plastic package material film pressing mechanism and an automatic waste material cutting and automatic material loading box mechanism of a semiconductor plastic package product; the automatic feeding and discharging mechanism for the semiconductor frame material sheet is provided with a circulating feeding mechanism at the discharging end, and a preheating mechanism, a circulating feeding mechanism, an automatic waste cutting and automatic material loading box mechanism are sequentially arranged along the circulating feeding mechanism. The utility model discloses can encapsulate the processing to semiconductor frame tablet, whole independently is accomplished by machinery, and artifical the participation is less, and the action is reliable, has reduced the cost of labor, improves semiconductor encapsulation efficiency, and frame tablet encapsulation back uniformity is better, has effectively improved semiconductor encapsulation processingquality.

Description

Full-automatic feeding and charging equipment for semiconductor packaging process

Technical Field

The utility model belongs to the technical field of the semiconductor processing equipment, specific theory relates to a full autoloading of semiconductor packaging technology and charging equipment.

Background

The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: a wafer from a wafer previous process is cut into small chips (Die) through a scribing process, then the cut chips are pasted on small islands of corresponding substrate (Lead frame) frames through glue, and bonding pads (Bond pads) of the chips are connected to corresponding pins (Lead) of the substrate through superfine metal (gold tin copper aluminum) wires or conductive resin to form a required circuit; packaging and protecting the independent wafer by using a plastic shell, carrying out a series of operations after plastic packaging, carrying out finished product testing after packaging, generally carrying out procedures such as Incoming inspection, Test, packaging and the like, and finally warehousing and shipping

When the wafer is subjected to plastic package, a plastic packaging machine is adopted for plastic package at present, the existing plastic packaging machine supplies materials for manual feeding, workers need to monitor the materials in real time, the labor intensity of the workers is high, errors often occur when a frame material sheet is placed, equipment is stopped, and the working efficiency of the plastic packaging machine is reduced.

Disclosure of Invention

In order to solve the problem, the utility model provides a full autoloading of semiconductor packaging technology and charging equipment. The utility model discloses can encapsulate the processing to semiconductor frame tablet, whole independently is accomplished by machinery, and artifical the participation is less, and the action is reliable, has reduced the cost of labor, improves semiconductor encapsulation efficiency, and frame tablet encapsulation back uniformity is better, has effectively improved semiconductor encapsulation processingquality.

In order to achieve the above purpose, the utility model is implemented according to the following technical scheme:

the full-automatic feeding and charging equipment for the semiconductor packaging process comprises an automatic feeding and discharging mechanism for a semiconductor frame material sheet, a preheating treatment mechanism, a circulating feeding mechanism, a plastic packaging material film pressing mechanism, an automatic waste cutting and automatic material loading box mechanism for semiconductor plastic packaging products; semiconductor frame tablet automatic feeding and row discharge end of material mechanism be equipped with circulation feeding mechanism, circulation feeding mechanism initiating terminal is equipped with and is used for carrying out the processing mechanism that preheats to the frame tablet, circulation feeding mechanism middle part is equipped with and is used for the plastic packaging material press mold mechanism with frame tablet and plastic packaging material pressurize solidification shaping, circulation feeding mechanism end is equipped with the automatic excision waste material and the automatic charging box mechanism that are used for getting rid of the semiconductor plastic packaging product of the unnecessary waste material of frame tablet encapsulation back.

Preferably, the automatic feeding and discharging mechanism for the semiconductor frame material sheets comprises a plastic packaging material feeding assembly for pushing out the frame material sheets stacked in the material box one by one and a feeding module for conveying the frame material sheets to the preheating mechanism; the feeding module is arranged at the discharge end of the feeding module.

Preferably, the plastic package material feeding assembly comprises a bearing frame, a material pushing frame, a screw rod lifter I and a material pushing motor; the material box loading device is characterized in that a clamping groove for mounting a material box is formed in the bearing frame, and a screw rod lifter I for driving the bearing frame to move up and down is arranged at the bottom of the bearing frame; the left side of the bearing frame is provided with a material pushing frame capable of moving left and right, a material pushing motor is arranged below the material pushing frame, and the material pushing motor is connected with the material pushing frame through a belt.

Preferably, the feeding module comprises a linear module I, a fixed mounting plate, a movable mounting plate, an air cylinder I and a connecting bolt; fixed mounting panel install on linear module I, remove about it is driven by linear module I, the last movable mounting panel that can reciprocate that is equipped with of fixed mounting panel, movable mounting panel reciprocates through installing cylinder I drive on fixed mounting panel, the movable mounting panel bottom is equipped with and is used for the connecting bolt be connected with the frame tablet.

Preferably, the circulating feeding mechanism comprises a carrier for containing the frame material sheets, a lifting feeding frame mechanism, an up-down parallel double-layer circulating feeding mechanism and an overturning discharging mechanism; the side of the starting end and the tail end of the upper and lower parallel double-layer circulating feeding mechanism is respectively provided with a lifting feeding frame mechanism; the overturning unloading mechanism is arranged at the tail end of the upper and lower parallel double-layer circulating feeding mechanism.

Preferably, the lifting feeding frame mechanism comprises a mounting plate I, a vacuum chuck I, an air cylinder II and a linear module II; II vertical settings of linear module, mounting panel I sets up on linear module II, drives it by linear module II and reciprocates, is equipped with vacuum chuck I that can reciprocate on the mounting panel I, vacuum chuck I drives it through setting up cylinder II on mounting panel I and reciprocates.

Preferably, mounting panel I on be equipped with the through-hole, be equipped with in the through-hole and be used for impressing the bolt of carrier with the frame tablet, the top of bolt has connect the nut that is located I top of mounting panel soon, is equipped with the spring that is located I below of mounting panel on the bolt.

Preferably, the upper and lower parallel double-layer circulating feeding mechanism comprises two linear modules III and two bearing plates, wherein the two linear modules III are distributed vertically, and the bearing plates are arranged on the linear modules III and are driven to move left and right by the linear modules III.

Preferably, the overturning and discharging mechanism comprises a mounting seat, an overturning motor, an overturning frame, a finished product receiving platform, an air cylinder IV, a secondary positioning platform and a vacuum chuck II; the mounting seat is rotatably provided with a turnover frame, the turnover frame is provided with a vacuum chuck II, and the turnover frame is driven to rotate by a turnover motor; and a cylinder IV for driving the mounting seat to move is arranged at the bottom of the mounting seat, and a finished product receiving platform and a secondary positioning platform are respectively arranged on the left side and the right side of the mounting seat.

Preferably, the preheating mechanism comprises a heating plate, a heating jig and an ejection cylinder; the heating jig is arranged on the heating plate, and the bottoms of the two ends of the heating jig are respectively provided with an ejection cylinder for ejecting the heating jig.

Preferably, the plastic package material film pressing mechanism comprises a film pressing machine, a glue column and frame material sheet carrying assembly and a glue column arrangement assembly, wherein the glue column and frame material sheet carrying assembly is used for inputting the frame material sheet and the glue column into the film pressing machine; the film pressing machine and the glue column arrangement assembly are respectively positioned on the front side and the rear side of the circulating feeding mechanism, and a glue column and a frame material piece carrying assembly are arranged between the film pressing machine and the glue column arrangement assembly.

Preferably, the rubber column arrangement component comprises a rubber column arrangement plate, a linear module IV, a linear module V, a vibration disc and a vortex magnetic pump; positioning holes for placing the rubber columns are uniformly arranged on the rubber column arrangement plate at intervals, a linear module IV is arranged on the side of the rubber column arrangement plate, a linear module V which is perpendicular to the linear module IV is arranged on the linear module IV, an installation plate II is arranged on the linear module V, four guide columns are arranged on the installation plate II, a vertical conveying channel is defined by the four guide columns, a rubber column separation air cylinder is arranged at the bottom of the conveying channel, and a rubber column separation air cylinder is arranged below the rubber column separation air cylinder; the discharge end of the vibration disc is connected with the feed end of the vortex magnetic pump through a pipeline, and the discharge end of the vortex magnetic pump is connected with the feed end of the conveying channel through a pipeline.

Preferably, the rubber column and frame material sheet carrying assembly comprises a linear module VII, a mounting plate IV, a movable plate, a vacuum chuck III and an electromagnet; the mounting plate IV is arranged on the linear module VII and driven to move by the linear module VII, the air cylinder IV is arranged at the bottom of the mounting plate IV, a movable plate is arranged on a piston rod of the air cylinder IV, and a vacuum chuck III for sucking the rubber column and an electromagnet for sucking the carrier are arranged on the movable plate.

Preferably, the automatic waste material cutting and automatic material loading box mechanism for the semiconductor plastic package products comprises a punch press, a finished product carrying assembly and an automatic material loading assembly; finished product transport subassembly have two, set up respectively in the both sides of punch press, one is used for transporting frame tablet to the punch press, and another is used for transporting the frame tablet that the processing is good to the automatic charging assembly who sets up in the punch press side.

Preferably, the finished product carrying assembly comprises a linear module VI, a vacuum chuck IV, a connecting plate, a cylinder III and a mounting plate III; the mounting plate III install on linear module VI, drive by linear module VI and play the back-and-forth movement, the connecting plate free end is equipped with cylinder III, is equipped with mounting plate III on cylinder III's the piston rod, is equipped with vacuum chuck IV on the mounting plate III.

Preferably, the automatic charging assembly comprises a finished product material box bearing frame, a screw rod lifter II and a bottom bearing frame; the finished product magazine bears and is equipped with the recess with magazine assorted on the frame, the recess bottom is equipped with the bottom of can the oscilaltion and bears the frame, the bottom bears the frame and orders about through lead screw lift II and reciprocates.

The utility model has the advantages that:

the utility model discloses can encapsulate the processing to semiconductor frame tablet, whole independently is accomplished by machinery, and artifical the participation is less, and the action is reliable, has reduced the cost of labor, improves semiconductor encapsulation efficiency, and frame tablet encapsulation back uniformity is better, has effectively improved semiconductor encapsulation processingquality.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the three-dimensional structure of the automatic loading and unloading mechanism for semiconductor frame material sheets of the present invention;

FIG. 3 is a schematic structural view of the feeding assembly of the plastic package material of the present invention;

FIG. 4 is a schematic structural view of the feeding module of the present invention;

FIG. 5 is a schematic view of a partial structure of the present invention;

fig. 6 is a schematic view of the carrier structure of the present invention;

FIG. 7 is a schematic structural view of the lifting feeding frame mechanism of the present invention;

FIG. 8 is a schematic structural view of an up-down parallel double-layer circulating feeding mechanism of the present invention;

fig. 9 is a schematic structural view of the turnover discharging mechanism of the present invention;

FIG. 10 is a schematic view of the installation of the roll-over stand of the present invention;

FIG. 11 is a schematic view of the structure of the preheating treatment mechanism of the present invention;

fig. 12 is a schematic structural view of the film pressing mechanism for plastic package material of the present invention;

fig. 13 is a schematic structural view of the plastic package material film pressing mechanism removing film pressing machine of the present invention;

fig. 14 is a schematic view of a partial structure of the film pressing mechanism for plastic package material of the present invention;

fig. 15 is a schematic structural view of the glue column and frame material sheet carrying assembly of the present invention;

fig. 16 is a schematic view of a partial three-dimensional structure of the glue column and frame material sheet carrying assembly of the present invention;

fig. 17 is a schematic structural view of the automatic scrap removal and automatic loading box mechanism of the semiconductor plastic package product of the present invention;

FIG. 18 is a schematic view of the finished product handling assembly of the present invention;

FIG. 19 is a schematic view of the punch press of the present invention;

fig. 20 is a schematic structural view of the automatic charging assembly of the present invention;

in the picture 1-20, 1-semiconductor frame material sheet automatic feeding and discharging mechanism, 1-1 plastic package material feeding assembly, 1-11 bearing frame, 1-12 material pushing frame, 1-121 connecting rod, 1-122 push rod, 1-123 guide rod, 1-13 screw rod lifter I, 1-14 material pushing motor, 1-2 feeding module, 1-21 linear module I, 1-22 fixed mounting plate, 1-23 movable mounting plate, 1-24 cylinder I, 1-24 connecting pin, 2-pre-heating processing mechanism, 2-1 heating plate, 2-2 heating jig, 2-3 ejection cylinder, 3-circulating feeding mechanism, 3-1 carrier, 3-2 lifting feeding frame mechanism, 3-21 mounting plate I, 3-22 vacuum chuck I, 3-23 air cylinder II, 3-24 linear module II, 3-25 through holes, 3-26 bolts, 3-27 nuts, 3-28 springs, 3-3 up-down parallel double-layer circulating feeding mechanism, 3-31 linear module III, 3-32 bearing plate, 3-4 overturning unloading mechanism, 3-41 mounting seat, 3-42 overturning motor, 3-43 overturning frame, 3-44 finished product receiving table, 3-45 air cylinder IV, 3-46 secondary positioning table, 3-47 vacuum suction cup II, 4-plastic package material film pressing mechanism, 4-1 film pressing machine, 4-2-1 glue column arrangement plate, 4-2-2 linear module IV, 4-2-3 linear module V, 4-2-4 vibrating disc, 4-2-5 vortex magnetic pump, 4-2-6 positioning holes, 4-2-7 mounting plates II, 4-2-8 guide columns, 4-2-9 conveying channels, 4-2-10 glue column separating cylinders, 4-2-11 glue column separating cylinders, 4-3-glue column and frame material sheet conveying assemblies, 4-3-1 linear modules VII, 4-3-2 mounting plates IV, 4-3-3 movable plates, 4-3-4 vacuum suction cups III, 4-3-5 electromagnets, 4-3-6 cylinders VI, automatic waste cutting and automatic charging box mechanisms of 5-semiconductor plastic package products, 5-1 punch press, 5-2 finished product conveying assemblies, 5-21 linear modules VI, 5-22 vacuum suction cups IV, 5-23 connecting plates, 5-24 air cylinders III, 5-25 mounting plates III, 5-3 automatic charging assemblies, 5-31 finished product material box bearing frames, 5-32 screw rod lifters II, 5-33 grooves, 5-34 bottom bearing frames, 6-PLC, 6-1 height synchronizing rods and 6-2 position sensors.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the following will explain in detail a preferred embodiment of the present invention with reference to the accompanying drawings to facilitate understanding of the skilled person.

As shown in fig. 1-20, the full-automatic feeding and loading device for the semiconductor packaging process comprises an automatic feeding and discharging mechanism 1 for a semiconductor frame material sheet, a preheating processing mechanism 2, a circular feeding mechanism 3, a plastic package material film pressing mechanism 4, and an automatic waste cutting and loading mechanism 5 for semiconductor plastic package products; semiconductor frame tablet automatic feeding and 1 discharge end of row material mechanism be equipped with

circulation feeding mechanism

3, 3 initiating terminals of circulation feeding mechanism are equipped with and are used for carrying out the processing mechanism 2 that preheats to the frame tablet, 3 middle parts of circulation feeding mechanism are equipped with and are used for the plastic packaging material press mold mechanism 4 with frame tablet and plastic packaging material pressurize solidification shaping, 3 ends of circulation feeding mechanism are equipped with the automatic excision waste material and the automatic charging box mechanism 5 that are used for getting rid of the semiconductor plastic packaging product of the unnecessary waste material of frame tablet encapsulation back. Unprocessed frame tablet is placed in the magazine, and the magazine comprises two vertical plates that are parallel to each other, and its upper end interconnect is as an organic whole, and the lower extreme is open state, matches on two plates to be provided with the recess that is used for installing the frame tablet, and the even interval distribution of vertical direction is followed to the recess, places a semiconductor frame tablet in each recess. When a semiconductor frame material sheet is processed, the frame material sheet is manually placed on the automatic semiconductor frame material sheet feeding and discharging mechanism 1, the automatic semiconductor frame material sheet feeding and discharging mechanism 1 conveys the frame material sheet to the circulating feeding mechanism 3 one by one, the circulating feeding mechanism 3 sequentially conveys the frame material sheet to the pre-heating mechanism 2 for pre-heating treatment, then conveys the frame material sheet to the plastic package material film pressing mechanism 4 for thermoplastic package processing, and finally conveys the frame material sheet to the automatic semiconductor plastic package product for automatically cutting waste materials and the automatic charging box mechanism 5 for removing redundant material handles on the processed frame material sheet. The whole process of semiconductor packaging is automatically completed by machinery, the action is reliable, the manual work is less, the labor cost is reduced, the labor intensity of workers is reduced, the semiconductor packaging efficiency is improved, the consistency is better after the frame material sheet is packaged, and the semiconductor packaging processing quality is effectively improved.

The automatic semiconductor frame material sheet feeding and discharging mechanism 1 comprises a plastic package material feeding assembly 1-1 for pushing out the frame material sheets stacked in a material box one by one and a feeding module 1-2 for feeding the frame material sheets; the feeding module 1-2 is arranged at the discharging end of the feeding module 1-2. The plastic package material feeding assembly 1-1 comprises a bearing frame 1-11, a material pushing frame 1-12, a screw rod lifter I1-13 and a material pushing motor 1-14; the material box loading device is characterized in that a clamping groove for mounting a material box is formed in the bearing frame 1-11, and a screw rod lifter I1-13 for driving the bearing frame 1-11 to move up and down is arranged at the bottom of the bearing frame 1-11; the left side of the bearing frame 1-11 is provided with a material pushing frame 1-12 capable of moving left and right, a material pushing motor 1-14 is arranged below the material pushing frame 1-12, the material pushing motor 1-14 is connected with the material pushing frame 1-12 through a belt, the screw rod lifter I1-13 and the material pushing motor 1-14 are obtained through commercial purchase and provided with required energy by an external power supply, and the material pushing motor 1-14 adopts a servo motor or a stepping motor; eight rows of clamping grooves are formed in the bearing frame 1-11, a material box is placed in each clamping groove, the size of each clamping groove is matched with that of each material box, and after the material boxes are placed in the clamping grooves, the clamping grooves can be effectively positioned. The material pushing frame 1-12 comprises connecting rods 1-121, push rods 1-122 and guide rods 1-123, the push rods 1-122 are welded on the connecting rods 1-121, 8 push rods 1-122 are arranged according to the number of material boxes which can be placed on the bearing frame 1-11, the push rods 1-122 correspond to the material boxes one by one, and the connecting rods 1-121 are arranged on the guide rods 1-123 and can move left and right along the guide rods 1-123; the material pushing motors 1 to 14 adopt servo motors or stepping motors, energy is provided by an external power supply, the material pushing motors 1 to 14, the belt and the additional change wheels form a belt mechanism, and when the material pushing motors 1 to 14 rotate, the belt is driven to rotate, so that the material pushing frames 1 to 12 are driven to move. When the pushing mechanism works, the pushing motors 1-14 rotate forwards, the pushing frames 1-12 are driven to move rightwards through the belt, the frame material sheet at the bottom layer is pushed out, then the pushing motors 1-14 rotate backwards to drive the pushing frames 1-12 to return to the original position, then the lead screw lifting device moves to drive the bearing frames 1-11 to move downwards, the frame material sheet at the upper layer is moved downwards to be at the same level with the pushing frames 1-12, the step of the previous operation is repeated continuously until the frame material sheets in the material boxes are all pushed out, and then the lead screw lifting device lifts and resets the bearing frames 1-11. Simple structure can effectively push out the frame tablet from the magazine one by one, convenient to use.

The feeding module 1-2 comprises a linear module I1-21, a fixed mounting plate 1-22, a movable mounting plate 1-23, an air cylinder 11-24 and a connecting bolt 1-25; the fixed mounting plates 1-22 are arranged on the linear modules I1-21 and driven by the linear modules I1-21 to move left and right, the fixed mounting plates 1-22 are provided with movable mounting plates 1-23 capable of moving up and down, the movable mounting plates 1-23 are driven by cylinders 11-24 arranged on the fixed mounting plates 1-22 to move up and down, the bottoms of the movable mounting plates 1-23 are provided with connecting bolts 1-25 used for being connected with frame material sheets, the movable mounting plates 1-23 are positioned above the fixed mounting plates 1-22, the cylinders 11-24 are arranged above the movable mounting plates 1-23 through a frame, the movable mounting plates 1-23 are driven to move up and down when the cylinders 11-24 do telescopic motion, through holes 3-25 matched with the positions of the bolts are arranged on the fixed mounting plates 1-22, allowing the latch to move downwardly. The linear modules I1-21 and the air cylinders 11-24 are commercially available, the air cylinders 11-24 are supplied with air pressure by an external air compressor, the linear modules I1-21 are supplied with power by an external power supply, and the linear modules I1-21 are mounted on the frame. When the fixed mounting plate 1-22 is positioned at the left end of the linear module I1-21, the connecting pin 1-25 is positioned right above the frame material piece pushed out by the plastic package material feeding assembly 1-1, the air cylinder 11-24 drives the movable mounting plate 1-23 to move downwards, the connecting pin 1-25 is inserted into the frame material piece, so that the connecting pin 1-25 and the frame material piece are connected into a whole, then the linear modules I1-21 move rightwards, drag the frame material slice to move rightwards, convey the frame material slice to the circulating feeding mechanism 3, then the air cylinders 11-24 move upwards through the movable mounting plates 1-23 to separate the connecting pins 1-25 from the frame material sheets, then the linear modules I1-21 move leftwards to reset, the steps are repeated continuously, the frame material sheets are conveyed to the next structure, and the frame material sheets are fed one by one.

The circulating feeding mechanism 3 comprises a carrier 3-1 for containing frame material sheets, a lifting feeding frame mechanism 3-2, an upper and lower parallel double-layer circulating feeding mechanism 3-3 and a turnover discharging mechanism 3-4; the side of the starting end and the tail end of the upper and lower parallel double-layer circulating feeding mechanism 3-3 is respectively provided with a lifting feeding frame mechanism 3-2; the overturning unloading mechanism 3-4 is arranged at the tail end of the upper and lower parallel double-layer circulating feeding mechanism 3-3. The preheating processing mechanism 2 is positioned at the starting end of the upper and lower parallel double-layer circulating feeding mechanism 3-3 and is positioned between the upper and lower parallel double-layer circulating feeding mechanism 3-3 and the lifting feeding frame mechanism 3-2, the plastic package material film pressing mechanism 4 is positioned at the middle side of the upper and lower parallel double-layer circulating feeding mechanism 3-3, the carrier 3-1 plays a role of bearing frame material sheets and is an intermediate component, a groove matched with the frame material sheets is arranged on the carrier 3-1 to effectively position the frame material sheets, the frame material sheets conveyed by the feeding module 1-2 are placed on the carrier 3-1, then the lifting feeding frame mechanism 3-2 and the upper and lower parallel double-layer circulating feeding mechanism 3-3 are respectively used for conveying the carrier 3-1, thereby achieving the purpose of conveying the frame material sheets, and the size of the carrier 3-1 can be set, the frame material sheets can be conveyed at one time, the carrier 3-1 is used for bearing the frame material sheets, the positions of the frame material sheets can be effectively fixed, accuracy in conveying is improved, the frame material sheets are protected by the carrier 3-1, damage to the frame material sheets in the machining process is effectively prevented, and machining safety is improved. The carrier 3-1 is positioned on the preheating mechanism 2 at the initial position, the preheating mechanism 2 is used for preheating the frame material sheet, after the heating is finished, the lifting feeding frame mechanism 3-2 carries the carrier 3-1 with the frame material sheet upwards, then the carrier 3-1 is placed on the upper and lower parallel double-layer circulating feeding mechanisms 3-3 positioned at the lower layer, the upper and lower parallel double-layer circulating feeding mechanisms 3-3 positioned at the lower layer are used for transporting rightwards, when the carrier is transported to the middle part of the upper and lower parallel double-layer circulating feeding mechanisms 3-3, the carrier stops, the plastic package material film pressing mechanism 4 is used for carrying out thermoplastic package processing on the frame material sheet to obtain the frame material sheet with a plastic handle, then the upper and lower parallel double-layer circulating feeding mechanisms 3-3 continue transporting the carrier 3-1 rightwards, when the carrier is transported to the rightmost end, the overturning and unloading mechanism 3-4 overturns and unloads the carrier 3-1, the frame material sheet on the carrier 3-1 is taken down, the empty carrier 3-1 is transported to an upper and lower parallel double-layer circulating feeding mechanism 3-3 positioned above through a lifting feeding frame mechanism 3-2 arranged at the rightmost end, the empty carrier 3-1 is transported to the leftmost end through the upper and lower parallel double-layer circulating feeding mechanism 3-3 positioned above, the empty carrier 3-1 is placed at the initial position through the lifting feeding frame mechanism 3-2, the carrying circulation of the carrier 3-1 is formed, and meanwhile, the frame material sheet is transported to each mechanism for processing.

The lifting feeding frame mechanism 3-2 comprises a mounting plate I3-21, a vacuum chuck I3-22, an air cylinder II 3-23 and a linear module II 3-24; the linear module II 3-24 is vertically arranged, the mounting plate I3-21 is arranged on the linear module II 3-24 and driven by the linear module II 3-24 to move up and down, the mounting plate I3-21 is provided with a vacuum sucker I3-22 capable of moving up and down, the vacuum sucker I3-22 is driven by an air cylinder II 3-23 arranged on the mounting plate I3-21 to move up and down, and the vacuum sucker I3-22, the air cylinder II 3-23 and the linear module II 3-24 are all obtained by commercial purchase. During transportation, the mounting plate I3-21 is driven to be above the carrier 3-1 by the linear module II 3-24 and is kept at a certain gap with the carrier 3-1 to prevent crushing of a frame material sheet, then the air cylinder II 3-23 drives the vacuum chuck I3-22 to move downwards to enable the vacuum chuck I3-22 to suck the carrier 3-1, then the air cylinder II 3-23 drives the vacuum chuck I3-22 to move upwards to reset, the linear module II 3-24 drives the vacuum chuck I3-22 with the carrier 3-1 to move to the next designated position, then the vacuum chuck I3-22 breaks vacuum to put down the carrier 3-1, and the up-and-down transportation action of the carrier 3-1 is completed. The frame material sheet pressing device is characterized in that through holes 3-25 are formed in the mounting plate I3-21, bolts 3-26 used for pressing the frame material sheet into the carrier 3-1 are arranged in the through holes 3-25, nuts 3-27 located above the mounting plate I3-21 are connected to the tops of the bolts 3-26 in a screwing mode, springs 3-28 located below the mounting plate I3-21 are arranged on the bolts 3-26, when the carrier 3-1 is taken out of the preheating processing mechanism 2 through the lifting feeding frame mechanism 3-2, the frame material sheet is pressed into the carrier 3-1 through the bolts 3-26 in the downward moving process of the mounting plate I3-21, the frame material sheet is connected with the carrier 3-1 more tightly, the frame material sheet is stressed flexibly in the pressing process, and the frame material sheet is effectively prevented from being damaged by pressing.

The upper and lower parallel double-layer circulating feeding mechanism 3-3 comprises linear modules III 3-31 and bearing plates 3-32, the linear modules III 3-31 are horizontally arranged, the bearing plates 3-32 are installed on the linear modules III 3-31 and are driven to move left and right by the linear modules III 3-31, the carrier 3-1 is placed on the bearing plates 3-32 by the lifting feeding frame mechanism 3-2, and the bearing plates 3-32 are driven to move left and right by the left and right movement of the linear modules III 3-31, so that the carrier 3-1 is conveyed leftwards or rightwards.

The overturning and discharging mechanism 3-4 comprises a mounting seat 3-41, an overturning motor 3-42, an overturning frame 3-43, a finished product receiving table 3-44, a cylinder IV 3-45, a secondary positioning table 3-46 and a vacuum sucker II 3-47; the overturning frame 3-43 is rotatably arranged on the mounting seat 3-41, the empty sucking disc II 3-47 is arranged on the overturning frame 3-43, and the overturning frame 3-43 is driven to rotate by the overturning motor 3-42; the bottom of the mounting seat 3-41 is provided with an air cylinder IV 3-45 for driving the mounting seat to move upwards, two sides of the mounting seat 3-41 are respectively provided with a secondary positioning table 3-46 and a finished product receiving table 3-44, the air cylinder IV 3-45 is mounted on a rack and connected with an external air compressor through a pipeline, and the mounting seat 3-41 is driven to move upwards and downwards by controlling the extension or shortening of the air cylinder IV 3-45; the turnover motors 3-42 adopt servo motors or stepping motors and are powered by an external power supply; the secondary positioning table 3-46 is positioned on the left side, the finished product receiving table 3-44 is positioned on the right side, when the finished product receiving table is turned over and unloaded, the turning motor 3-42 drives the turning frame 3-43 to rotate towards the left side to a horizontal position, then the air cylinder IV 3-45 is shortened, so that the vacuum chuck II 3-47 absorbs the frame material sheet on the secondary positioning table 3-46, the air cylinder IV 3-45 extends, the turning motor 3-42 drives the turning frame 3-43 to rotate from the side to the horizontal position, the air cylinder IV 3-45 is shortened, and the frame material sheet is placed on the finished product receiving table 3-44.

The plastic package material film pressing mechanism 4 comprises a film pressing machine 4-1, a glue column and frame material sheet conveying assembly 4-3 and a glue column arrangement assembly 4-2, wherein the glue column and frame material sheet and glue column are used for inputting frame material sheets and glue columns into the film pressing machine 4-1; the film pressing machine 4-1 and the glue column arrangement component 4-2 are respectively positioned on the front side and the rear side of the circulating feeding mechanism 3, the glue column and frame material sheet carrying component 4-3 is arranged between the film pressing machine 4-1 and the glue column arrangement component 4-2, the carrier 3-1 is embedded at the bottom of the heating jig 2-2 during heating, the heating plate 2-1 is connected with an external power supply, the heating plate 2-1 starts to generate heat when being electrified, the frame material sheet is heated through the heat conduction of the heating jig 2-2, the frame material sheet is uniformly heated, after the heating is finished, the ejection cylinder 2-3 extends, and the material box is ejected from two ends, so that the material box is separated from the heating jig 2-2, and the carrying of the vertical material box carrying mechanism is convenient.

The plastic package material film pressing mechanism 4 comprises a film pressing machine 4-1, a glue column and frame material sheet conveying assembly 4-3 and a glue column arrangement assembly 4-2, wherein the glue column and frame material sheet and glue column are used for inputting frame material sheets and glue columns into the film pressing machine 4-1; the film pressing machine 4-1 and the glue column arrangement component 4-2 are respectively positioned at the front side and the rear side of the circulating feeding mechanism 3, a glue column and frame material sheet carrying component 4-3 is arranged between the film pressing machine 4-1 and the glue column arrangement component 4-2, when in work, the glue columns required by one-time film pressing of the film pressing machine 4-1 are arranged and arranged by the glue column arrangement component 4-2, then the glue columns are transported into the film pressing machine 4-1 by the glue column and frame material sheet carrying component 4-3 for film pressing, the frame material sheet is transported to a position crossed with the glue column and the frame material sheet carrying component 4-3 by the circulating feeding mechanism 3, then the film pressing is stopped, then the frame material sheet is transported into the film pressing machine 4-1 by the glue column and frame material sheet carrying component 4-3 for film pressing, the film pressing is completed, and then the product is transported back to the circulating feeding mechanism 3 by the glue column and frame material sheet carrying component 4-3, transported to the next working procedure by the circulating feeding mechanism 3 for processing.

The glue column arrangement component 4-2 comprises a glue column arrangement plate 4-2-1, a linear module IV 4-2-2, a linear module V4-2-3, a vibration disc 4-2-4 and a vortex magnetic pump 4-2-5; the glue column arrangement plate 4-2-1 is evenly provided with positioning holes 4-2-6 for placing glue columns at intervals, the side of the glue column arrangement plate 4-2-1 is provided with a linear module IV 4-2-2, the linear module IV 4-2-2 is provided with a linear module V4-2-3 which is perpendicular to the linear module IV 4-2-2, the linear module V4-2-3 is provided with a mounting plate II 4-2-7, the mounting plate II 4-2-7 is provided with four guide columns 4-2-8, four guide columns 4-2-8 enclose a vertical conveying channel 4-2-9, a glue column separating cylinder 4-2-10 is arranged at the bottom of the conveying channel 4-2-9, and a glue column separating cylinder 4-2-11 is arranged below the glue column separating cylinder 4-2-10; the discharge end of the vibrating disc 4-2-4 is connected with the feed end of the vortex magnetic pump 4-2-5 through a pipeline, the discharge end of the vortex magnetic pump 4-2-5 is connected with the feed end of the conveying channel 4-2-9 through a pipeline, the film pressing machine 4-1 is obtained by commercial purchase, when the film pressing machine works, the rubber columns are placed in the vibrating disc 4-2-4 in an unordered manner and are conveyed to the vortex magnetic pump 4-2-5 after being sequenced by the vibrating disc 4-2-4, the vortex magnetic pump 4-2-5 conveys the rubber columns into the conveying channel 4-2-9 one by one, in the conveying channel 4-2-9, the rubber columns freely fall due to gravity, when the rubber column blocks the cylinder 4-2-11 to extend, the piston rod of the rubber column blocking cylinder 4-2-11 blocks the conveying channel 4-2-9, when the rubber column separating cylinder 4-2-11 is shortened, the conveying channel 4-2-9 is opened, the rubber columns freely fall into corresponding positions on the rubber column arrangement plate 4-2-1, and when the rubber column separating cylinder 4-2-10 extends, the piston rods of the rubber column separating cylinder 4-2-10 separate the rubber columns on the upper side and the lower side of the rubber column separating cylinder, so that the purpose of placing one rubber column at a time is achieved. When placing the glue column, the glue column separation cylinder 4-2-11 is shortened, the glue column is put down, then the glue column separation cylinder 4-2-11 is shortened, extended and reset, the glue column separation cylinder 4-2-10 is shortened, so that the glue column above falls, the glue column separation cylinder 4-2-10 is extended, and the upper glue column and the lower glue column are separated. The conveying channel 4-2-9 is moved to different positions on the glue column arrangement plate 4-2-1 through the linear module IV 4-2-2 and the linear module V4-2-3, and the glue columns are placed in positioning holes 4-2-6 at different positions. The rubber column and frame material sheet carrying assembly 4-3 comprises a linear module VII 4-3-1, a mounting plate IV 4-3-2, a movable plate 4-3-3, a vacuum chuck III 4-3-4 and an electromagnet 4-3-5; the mounting plate IV 4-3-2 is arranged on the linear module VII 4-3-1 and driven to move by the linear module VII 4-3-1, the bottom of the mounting plate IV 4-3-2 is provided with an air cylinder VI 4-3-6, a piston rod of the air cylinder VI 4-3-6 is provided with a movable plate 4-3-3, and the movable plate 4-3-3 is provided with a vacuum chuck III 4-3-4 for sucking the rubber column and an electromagnet 4-3-5 for sucking the carrier 3-1. When the frame material sheet is conveyed, the linear module VII 4-3-1 conveys the electromagnet 4-3-5 to a corresponding position, then the air cylinder VI 4-3-6 extends to enable the electromagnet 4-3-5 to adsorb the carrier 3-1, the air cylinder VI 4-3-6 shortens, the carrier 3-1 is separated from the bearing plate 3-32, the linear module VII 4-3-1 continues to move, the frame material sheet is conveyed into the film pressing machine 4-1 to be subjected to film pressing treatment, and after the film pressing is finished, the frame material sheet is conveyed back to the bearing plate 3-32. When the glue column is conveyed, the linear module VII 4-3-1 drives the vacuum chuck III 4-3-4 to move to the arranged glue column, the air cylinder VI 4-3-6 extends to enable the vacuum chuck III 4-3-4 to adsorb the glue column, then the air cylinder VI 4-3-6 is shortened to enable the glue column to be separated from the glue column arrangement plate 4-2-1, and finally the glue column is conveyed to the film pressing machine 4-1 for use.

The automatic waste material cutting and automatic loading box mechanism 5 for the semiconductor plastic package products comprises a punch press 5-1, a finished product carrying assembly 5-2 and an automatic loading assembly 5-3; the two finished product carrying assemblies 5-2 are respectively arranged on two sides of the punch press 5-1, one of the two finished product carrying assemblies is used for conveying the frame material piece to the punch press 5-1, the other one of the two finished product carrying assemblies is used for conveying the processed frame material piece to the automatic loading assembly 5-3 arranged on the side of the punch press 5-1, and the finished product carrying assembly 5-2 comprises a linear module VI 5-21, a vacuum chuck IV, a connecting plate 5-23, an air cylinder III 5-24 and a mounting plate III 5-25; the mounting plates III 5-25 are mounted on the linear module VI 5-21 and driven by the linear module VI 5-21 to move back and forth, the free end of the connecting plate 5-23 is provided with an air cylinder III 5-24, a piston rod of the air cylinder III 5-24 is provided with the mounting plate III 5-25, the mounting plate III 5-25 is provided with a vacuum chuck IV, when in transportation, the linear module VI 5-21 transports the vacuum chuck IV to the upper part of the frame material piece through the connecting plate 5-23 and the mounting plate III 5-25, then the air cylinder III 5-24 extends to enable the vacuum chuck IV to suck the frame material piece at the corresponding position, then the air cylinder III 5-24 shortens to lift the frame material piece, the linear module VI 5-21 moves the punch press to transport the frame material piece to 5-1, after redundant material handles on the frame material piece are removed by the 5-1, the linear die set VI 5-21 is used to transport the frame web to the auto-loader assembly 5-3.

The automatic charging assembly 5-3 comprises a finished product material box bearing frame 5-31, a screw rod lifter II 5-32 and a bottom bearing frame 5-34; the finished product magazine bearing frame 5-31 is provided with a groove 5-33 matched with the magazine, the bottom of the groove 5-33 is provided with a bottom bearing frame 5-34 capable of ascending and descending up and down, and the bottom bearing frame 5-34 is driven to move up and down by a screw rod lifter II 5-32. The material box is placed in the groove 5-33 and fixed, when the frame material sheet is placed, the bottom bearing frame 5-34 extends into the material box, the frame material sheet is conveyed into the material box by the finished product conveying assembly 5-2, the screw rod lifter II 5-32 drives the bottom bearing frame 5-34 to gradually lower, so that the frame material sheet falls into the material box, the frame material sheet is gradually placed into the material box, and the damage caused by the fact that the frame material sheet directly falls into the material box is effectively avoided.

The automatic feeding and discharging mechanism 1 for the semiconductor frame material sheet, the preheating processing mechanism 2, the circulating feeding mechanism 3, the automatic waste cutting and automatic material loading box mechanism 5 for the semiconductor plastic package product and the plastic package material film pressing mechanism 4 are respectively and electrically connected with the PLC6, namely, the signal output end of the PLC6 is respectively and electrically connected with a screw rod lifter I1-13, a 1-14 material pushing motor 1-14, an air cylinder 11-24, a heating and ejecting air cylinder 2-3, a vacuum sucker I3-22, an air cylinder II 3-23, a linear module III 3-31, a turnover motor 3-42, a film pressing machine 4-1, a linear module IV 4-2-2, a linear module V4-2-3, a vibrating disk 4-2-4, a vortex magnetic pump 4-2-5 and a glue column separating air cylinder 4-2-10, 4-2-11 parts of a rubber column blocking cylinder, 5-1 parts of a punch press, 5-21 parts of a linear module VI, 5-22 parts of a vacuum chuck IV, 5-24 parts of a cylinder III, 5-32 parts of a screw rod lifter and a PLC6 which controls each mechanism to act step by step according to a built-in program.

The bearing frame 1-11 is provided with a height synchronous rod 6-1 with a toothed edge, the side edge of the height synchronous rod 6-1 is provided with a position sensor 6-2, the position sensor 6-2 adopts a photoelectric sensor and is obtained commercially, the position sensor 6-2 detects a toothed structure on the height synchronous rod 6-1, when the bearing frame 1-11 moves downwards, the height synchronous rod 6-1 moves downwards synchronously, and the detection position of the position sensor 6-2 is switched from one tooth to the next tooth, so that the vertical movement distance of the bearing frame 1-11 is monitored, and the bearing frame 1-11 is prevented from moving too much. The output end of the plastic packaging material feeding assembly 1-1 is provided with a photoelectric sensor for detecting the frame material sheet, when the frame material sheet is pushed out, the photoelectric sensor detects the frame material sheet, the photoelectric sensor transmits a detection signal to the PLC6, so that the frame material sheet is judged to be normally pushed out, when the PLC6 does not receive the detection signal of the photoelectric sensor, the frame material sheet is not normally pushed out, the equipment is abnormal, and the equipment stops running.

Finally, it is noted that the above preferred embodiments illustrate rather than limit the invention, and that, although the invention has been described in detail with reference to the above preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention as defined by the appended claims; the size of the attached figure is irrelevant to the specific real object, and the size of the real object can be changed at will.

Claims

1. A full autoloading of semiconductor packaging technology and charging devices which characterized in that: the full-automatic feeding and charging equipment for the semiconductor packaging process comprises a semiconductor frame material sheet automatic feeding and discharging mechanism (1), a preheating treatment mechanism (2), a circulating feeding mechanism (3), a plastic packaging material film pressing mechanism (4), and an automatic waste cutting and automatic loading box mechanism (5) for semiconductor plastic packaging products; the automatic semiconductor frame material sheet feeding and discharging mechanism (1) is provided with a circulating feeding mechanism (3) at the discharging end, a preheating treatment mechanism (2) for preheating the frame material sheet is arranged at the starting end of the circulating feeding mechanism (3), a plastic package material film pressing mechanism (4) for maintaining pressure and curing and forming the frame material sheet and the plastic package material is arranged in the middle of the circulating feeding mechanism (3), and an automatic waste cutting and automatic material loading box mechanism (5) for removing the semiconductor plastic package products with redundant waste after the frame material sheet is packaged is arranged at the tail end of the circulating feeding mechanism (3);

the automatic feeding and discharging mechanism (1) for the semiconductor frame material sheets comprises a plastic packaging material feeding assembly (1-1) and a feeding module (1-2), wherein the plastic packaging material feeding assembly is used for pushing out the frame material sheets stacked in a material box one by one, and the feeding module is used for conveying the frame material sheets to the preheating processing mechanism (2); the feeding module (1-2) is arranged at the discharging end of the feeding module (1-2);

the circulating feeding mechanism (3) comprises a carrier (3-1) for containing frame material sheets, a lifting feeding frame mechanism (3-2), an upper and lower parallel double-layer circulating feeding mechanism (3-3) and an overturning discharging mechanism (3-4); the side of the starting end and the tail end of the upper and lower parallel double-layer circulating feeding mechanism (3-3) is respectively provided with a lifting feeding frame mechanism (3-2); the overturning unloading mechanism (3-4) is arranged at the tail end of the upper and lower parallel double-layer circulating feeding mechanism (3-3);

the plastic package material film pressing mechanism (4) comprises a film pressing machine (4-1), a glue column and frame material sheet conveying assembly (4-3) and a glue column arrangement assembly (4-2), wherein the glue column and frame material sheet conveying assembly is used for conveying frame material sheets and glue columns into the film pressing machine (4-1); the film pressing machine (4-1) and the glue column arrangement component (4-2) are respectively positioned at the front side and the rear side of the circulating feeding mechanism (3), and a glue column and frame material piece conveying component (4-3) is arranged between the film pressing machine (4-1) and the glue column arrangement component (4-2);

the automatic waste material cutting and automatic material loading box mechanism (5) for the semiconductor plastic package products comprises a punch press (5-1), a finished product carrying assembly (5-2) and an automatic material loading assembly (5-3); the two finished product carrying assemblies (5-2) are respectively arranged at two sides of the punch press (5-1), one is used for conveying the frame material sheets to the punch press (5-1), and the other is used for conveying the processed frame material sheets to an automatic loading assembly (5-3) arranged at the side of the punch press (5-1);

the plastic package material feeding assembly (1-1) comprises a bearing frame (1-11), a material pushing frame (1-12), a screw rod lifter I (1-13) and a material pushing motor (1-14); a clamping groove for mounting the material box is formed in the bearing frame (1-11), and a screw rod lifter I (1-13) for driving the bearing frame (1-11) to move up and down is arranged at the bottom of the bearing frame (1-11); a material pushing frame (1-12) capable of moving left and right is arranged on the left side of the bearing frame (1-11), a material pushing motor (1-14) is arranged below the material pushing frame (1-12), and the material pushing motor (1-14) is connected with the material pushing frame (1-12) through a belt;

the feeding module (1-2) comprises a linear module I (1-21), a fixed mounting plate (1-22), a movable mounting plate (1-23), a cylinder I (1-24) and a connecting bolt (1-25); the fixed mounting plates (1-22) are mounted on the linear modules I (1-21) and driven by the linear modules I (1-21) to move left and right, the fixed mounting plates (1-22) are provided with movable mounting plates (1-23) capable of moving up and down, the movable mounting plates (1-23) are driven by cylinders I (1-24) mounted on the fixed mounting plates (1-22) to move up and down, and the bottoms of the movable mounting plates (1-23) are provided with connecting bolts (1-25) used for being connected with frame material sheets.

2. The full-automatic feeding and loading device for the semiconductor packaging process as claimed in claim 1, wherein: the lifting feeding frame mechanism (3-2) comprises a mounting plate I (3-21), a vacuum sucker I (3-22), an air cylinder II (3-23) and a linear module II (3-24); the linear module II (3-24) is vertically arranged, the mounting plate I (3-21) is arranged on the linear module II (3-24) and driven by the linear module II (3-24) to move up and down, the mounting plate I (3-21) is provided with a vacuum sucker I (3-22) capable of moving up and down, and the vacuum sucker I (3-22) is driven by an air cylinder II (3-23) arranged on the mounting plate I (3-21) to move up and down;

the upper and lower parallel double-layer circulating feeding mechanism (3-3) comprises two linear modules III (3-31) and two bearing plates (3-32), wherein the two linear modules III (3-31) are distributed up and down, and the bearing plates (3-32) are arranged on the linear modules III (3-31) and are driven to move left and right by the linear modules III (3-31);

the overturning and discharging mechanism (3-4) comprises a mounting seat (3-41), an overturning motor (3-42), an overturning frame (3-43), a finished product receiving platform (3-44), a cylinder IV (3-45), a secondary positioning platform (3-46) and a vacuum sucker II (3-47); the mounting seat (3-41) is rotatably provided with a turnover frame (3-43), the turnover frame (3-43) is provided with a vacuum chuck II (3-47), and the turnover frame (3-43) is driven to rotate by a turnover motor (3-42); and the bottom of the mounting seat (3-41) is provided with a cylinder IV (3-45) for driving the mounting seat to move, and the left side and the right side of the mounting seat (3-41) are respectively provided with a finished product receiving platform (3-44) and a secondary positioning platform (3-46).

3. The full-automatic feeding and loading device for the semiconductor packaging process as claimed in claim 2, wherein: the mounting plate I (3-21) is provided with through holes (3-25), bolts (3-26) used for pressing the frame material sheet into the carrier (3-1) are arranged in the through holes (3-25), nuts (3-27) located above the mounting plate I (3-21) are screwed to the tops of the bolts (3-26), and springs (3-28) located below the mounting plate I (3-21) are arranged on the bolts (3-26);

the preheating treatment mechanism (2) comprises a heating plate (2-1), a heating jig (2-2) and an ejection cylinder (2-3); the heating jig (2-2) is arranged on the heating plate (2-1), and the bottoms of the two ends of the heating jig (2-2) are respectively provided with an ejection cylinder (2-3) for ejecting the carrier (3-1) on the heating jig (2-2).

4. The full-automatic feeding and loading device for the semiconductor packaging process as claimed in claim 1, 2 or 3, wherein: the glue column arrangement component (4-2) comprises a glue column arrangement plate (4-2-1), a linear module IV (4-2-2), a linear module V (4-2-3), a vibration disc (4-2-4) and a vortex magnetic pump (4-2-5); the glue column arrangement plate (4-2-1) is uniformly provided with positioning holes (4-2-6) for placing glue columns at intervals, the side of the glue column arrangement plate (4-2-1) is provided with a linear module IV (4-2-2), the linear module IV (4-2-2) is provided with a linear module V (4-2-3) which is perpendicular to the linear module IV, the linear module V (4-2-3) is provided with a mounting plate II (4-2-7), the mounting plate II (4-2-7) is provided with four guide columns (4-2-8), the four guide columns (4-2-8) enclose a vertical conveying channel (4-2-9), the bottom of the conveying channel (4-2-9) is provided with a glue column separation cylinder (4-2-10), a glue column separation cylinder (4-2-11) is arranged below the glue column separation cylinder (4-2-10); the discharge end of the vibration disc (4-2-4) is connected with the feed end of the vortex magnetic pump (4-2-5) through a pipeline, and the discharge end of the vortex magnetic pump (4-2-5) is connected with the feed end of the conveying channel (4-2-9) through a pipeline;

the rubber column and frame material sheet carrying assembly (4-3) comprises a linear module VII (4-3-1), a mounting plate IV (4-3-2), a movable plate (4-3-3), a vacuum chuck III (4-3-4) and an electromagnet (4-3-5); the mounting plate IV (4-3-2) is arranged on the linear module VII (4-3-1) and driven to move by the linear module VII (4-3-1), the bottom of the mounting plate IV (4-3-2) is provided with an air cylinder VI (4-3-6), a piston rod of the air cylinder VI (4-3-6) is provided with a movable plate (4-3-3), and the movable plate (4-3-3) is provided with a vacuum chuck III (4-3-4) for sucking the rubber column and an electromagnet (4-3-5) for sucking the carrier (3-1).

5. The full-automatic feeding and loading device for the semiconductor packaging process as claimed in claim 4, wherein: the finished product carrying assembly (5-2) comprises a linear module VI (5-21), a vacuum chuck IV (5-22), a connecting plate (5-23), a cylinder III (5-24) and a mounting plate III (5-25); the mounting plate III (5-25) is mounted on the linear module VI (5-21) and driven by the linear module VI (5-21) to move back and forth, the free end of the connecting plate (5-23) is provided with an air cylinder III (5-24), a piston rod of the air cylinder III (5-24) is provided with the mounting plate III (5-25), and the mounting plate III (5-25) is provided with a vacuum chuck IV (5-22).

6. The full-automatic feeding and loading device for the semiconductor packaging process as claimed in claim 5, wherein: the automatic charging assembly (5-3) comprises a finished product material box bearing frame (5-31), a screw rod lifter II (5-32) and a bottom bearing frame (5-34); grooves (5-33) matched with the magazine are formed in the finished product magazine bearing frame (5-31), a bottom bearing frame (5-34) capable of ascending and descending is arranged at the bottom of each groove (5-33), and the bottom bearing frame (5-34) is driven to move up and down through a screw rod lifter II (5-32).