CN113573568B - Patch device for maintaining camera chip - Google Patents

Patch device for maintaining camera chip Download PDF

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Publication number
CN113573568B
CN113573568B CN202111132300.1A CN202111132300A CN113573568B CN 113573568 B CN113573568 B CN 113573568B CN 202111132300 A CN202111132300 A CN 202111132300A CN 113573568 B CN113573568 B CN 113573568B
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China
Prior art keywords
chip
base
guide
gear
displacement mechanism
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CN202111132300.1A
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Chinese (zh)
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CN113573568A (en
Inventor
王育青
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Shenzhen Weijia Chip Repair Technology Co ltd
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Shenzhen Weijia Chip Repair Technology Co ltd
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Priority to CN202111132300.1A priority Critical patent/CN113573568B/en
Publication of CN113573568A publication Critical patent/CN113573568A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/043Feeding one by one by other means than belts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/176Removing, replacing or disconnecting component; Easily removable component

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

The invention discloses a chip mounting device for maintaining a camera chip, which comprises a base and a feed inlet, wherein a base is arranged on one side of the top of the base, a fixed table is arranged on one side of one end of the back of the top of the base, a positioning table is arranged on the top of one side of the base, and a material receiving and conveying assembly is arranged in the middle of the top of the base; the invention can lead the chip into the surface of the annular groove from the feed port by the mutual communication and correspondence of the feed port and the annular groove, and utilize the mutual cooperation of the guide detection components, the chip which is oppositely arranged in the annular groove is pushed to move circularly under the rotation of the rotating shaft and the spoon-shaped push plate, the chip is automatically led into the inclined guide groove to feed under the intermittent pushing of the spoon-shaped push plate, and the pushed chip is forced to be static by the induction of the induction area, at the moment, the extrusion and the cooperation of the defect detection press plate can be utilized to carry out defect detection while clamping and positioning the chip, thereby observing whether the surface of the chip is damaged or not.

Description

Patch device for maintaining camera chip
Technical Field
The invention relates to the technical field of chip mounting, in particular to a mounting device for maintaining a camera chip.
Background
The camera generally has basic functions of video shooting, transmission, static image capture and the like, and after images are collected by the aid of the lens, the images are processed by a photosensitive component circuit and a control component in the camera and converted into digital signals which can be identified by a computer;
when the current chip mounting device is in actual use, feeding and feeding work of chips often needs manual taking, which is very inconvenient, so that the adsorption and attachment efficiency of the chips is reduced, the surfaces of the chips are fragile, the chips are easy to collide in conveying and processing environments, flaws and defects are generated on the surfaces of the chips, subsequent normal use and qualification rate are influenced, rapid detection work of operators is difficult, the working flow of chip conveying is increased, the working difficulty of chip mounting is improved, when the chips are subjected to chip mounting work, the operators are difficult to pick up and collect unqualified chips needing to be maintained, so that the use limitation of the chip mounting device is increased, and when the chips are maintained and removed, pins welded between the chips and a circuit board are often required to be heated, the operation often adopts manual work, and the labor force of the operators for continuous chip maintenance work is increased, reducing the automation functions of the device.
Disclosure of Invention
The present invention is directed to a camera chip mounting device for repairing a camera chip, so as to solve the above-mentioned problems.
In order to achieve the purpose, the invention provides the following technical scheme: the automatic feeding device comprises a base and a feeding hole, wherein a base is arranged on one side of the top of the base, a fixing table is arranged on one side of one end of the back face of the top of the base, a positioning table is arranged on the top of one side of the base, a material receiving and conveying assembly is arranged in the middle of the top of the base, a material guiding and detecting assembly is arranged on one side of the top of the base, a control table is arranged on one side of one end of the front face of the base, and an inclined material guiding groove is arranged on one side of the top inside the base;
the top of the fixed table is provided with a longitudinal displacement mechanism, two ends of the inner side of the fixed table are provided with guide grooves, the inner sides of two groups of the guide grooves are provided with guide blocks which are matched with each other, one end of the two groups of the guide blocks which are close to each other is provided with a transverse displacement mechanism, a rotary table is arranged on the outer side of the transverse displacement mechanism, a positioning screw hole and a positioning bolt which are matched with each other in a threaded manner are respectively arranged on one side inside the rotary table, the top of the inside of the turntable is provided with a second driving motor, the top of the turntable is provided with an annular chute, the inner sides of the annular sliding chutes are symmetrically provided with mutually matched sliding blocks, one sides of the two groups of sliding blocks close to each other are provided with connecting plates, the output end of the second driving motor is connected with the connecting plate, the top of one group of the sliding blocks is provided with a hot air gun, the bottom of carousel is equipped with second electric cylinder, second electric cylinder's output is equipped with paster adsorption apparatus and constructs.
Preferably, the intermediate position department at material receiving and conveying subassembly top is equipped with the mounting bracket, the both sides at mounting bracket top are overlapped respectively and are equipped with transmission gear and return gear, transmission gear is equipped with intermeshing's ring gear with return gear's the outside, the outside of ring gear is equipped with interconnect's conveyer belt, one side at base top is equipped with the chip storage tank, the top of the positive one end one side of frame is equipped with the motor, the output and the transmission gear interconnect of motor.
Preferably, one side at guide determine module top is equipped with the ring channel, the intermediate position department of the inside one side of ring channel is equipped with the induction zone, one side of ring channel bottom is equipped with a driving motor, a driving motor's output is equipped with the driving gear, the intermediate position department cover of the inside bottom of ring channel is equipped with the pivot, the bottom in the pivot outside is equipped with the driven gear with driving gear intermeshing, one side at pivot outside top is equipped with spoon type push pedal, one side of ring channel back one end is equipped with the erection column, the top of erection column is equipped with first electric cylinder, first electric cylinder's output is equipped with the defect detection clamp plate that corresponds with the induction zone position.
Preferably, one side of the inside of the base is provided with a through opening, the through opening is communicated with the conveying belt, guide wheels are uniformly arranged at the bottom of the inside of the inclined guide chute, and the inclined guide chute is matched with one side of the top of the conveying belt in a corresponding mode.
Preferably, the location platform is formed by guide arm and two sets of guide pin bushings and the combination of L type grip slipper, and the L type grip slipper that the combination formed corresponds the cooperation each other, one side of location platform is equipped with electric putter, and electric putter and a set of L type grip slipper interconnect.
Preferably, longitudinal displacement mechanism and transverse displacement mechanism are formed by servo motor and lead screw and the combination of internal thread pipe respectively, the location screw has been seted up to the both sides that the internal thread pipe was installed to the transverse displacement mechanism, and just the location screw is the mutual adaptation of thread tightening structure with positioning bolt and carousel, the one end that the internal thread pipe top was installed to the transverse displacement mechanism is equipped with the connecting seat, and the top of connecting seat be equipped with the linking arm that the internal thread pipe interconnect was installed to the longitudinal displacement mechanism.
Preferably, the top of the feeding hole is provided with a receiving hopper, the bottom of the feeding hole is provided with a discharging hole, and the discharging hole corresponds to the middle position of one end of the bottom inside the annular groove.
Preferably, the intermediate position department at mounting bracket top is equipped with driven transmission gear, and driven transmission gear and ring gear intermeshing, the bottom at the inboard both ends of mounting bracket is equipped with the spacing groove, and spacing groove and ring gear mutual adaptation, the top of chip storage tank one side is equipped with and connects the material mouth, and connects the top of material mouth and conveyer belt one side to correspond the cooperation each other.
Preferably, a material guide hole is formed in the middle position of one side of the bottom inside the annular groove, the material guide hole is communicated with the inside of the inclined material guide groove, and the defect detection pressing plate is formed by combining an extrusion plate and an infrared detector.
Compared with the prior art, the invention provides a chip mounting device for maintaining a camera chip, which has the following beneficial effects:
1. the invention leads the chip to be led into the surface of the annular groove from the feed port through the mutual communication and correspondence of the feed port and the annular groove, and the matching of the material guiding detection components is utilized, so that the chip which can be oppositely arranged in the annular groove is pushed to move around under the rotation of the rotating shaft and the spoon-shaped push plate, the chip is automatically guided into the inclined material guiding groove to feed under the intermittent pushing of the spoon-shaped push plate, and the chip pushed by the induction of the induction area is forced to be static, at the moment, the extrusion fit of the defect detection pressing plate can be utilized, the chip is clamped and positioned, and simultaneously the defect detection is carried out, thereby observing whether the surface of the chip is damaged or not, this structure is integrated and is taken the cooperation with paster device each other with automatic guide function and defect detection work inter combination, and orderly improvement the automatic conveying efficiency of chip and the quality and the qualification rate of chip paster, strengthened the work efficiency of device serialization paster.
2. The invention can be rotated and adjusted by 180 degrees by utilizing the fixed matching of the rotary disc between the positioning bolt and the positioning screw hole, thereby the position of the installed second electric cylinder, the paster adsorption mechanism and the hot air gun is changed up and down, the device can be adjusted according to different requirements of chip paster or maintenance work, the device can be conveniently corresponding to the chip positioned by the positioning table through the displacement adjustment of the longitudinal displacement mechanism and the transverse displacement mechanism, the flexibility and the functionality of the device are increased, and the hot air gun can be driven by the annular sliding groove and the annular moving structure of the sliding block to uniformly heat and remove the pins welded between the chip and the circuit board.
3. According to the invention, through the mutual matching of the material receiving and conveying assemblies, chips discharged from the inclined guide chute can be received, and according to the defect detection of the chip by the material guiding and detecting assembly, two stations can be continuously conveyed through the intelligent control of the conveying belt, unqualified chips are moved out of the adsorption range of the patch adsorption mechanism, and then the unqualified chips can be guided into the chip accommodating groove for receiving, so that the subsequent maintenance work is facilitated, and by utilizing the external conveying structure of the conveying belt, an operator can conveniently observe the chip adsorption and patch working procedures in a straight direction, so that the operability and convenience of the manual chip detection work and the manual picking and collecting work are improved.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a front cross-sectional view of the present invention;
FIG. 3 is an enlarged view taken at A of FIG. 2 according to the present invention;
FIG. 4 is an enlarged view of FIG. 2 at B of the present invention;
FIG. 5 is a side view of the lateral displacement mechanism of the present invention;
FIG. 6 is a top view of the annular groove of the present invention;
fig. 7 is a perspective view of the annular chute of the present invention.
In the figure: 1. a base; 2. a machine base; 3. an electric motor; 4. a mounting frame; 401. a transmission gear; 402. an inner gear ring; 403. a conveyor belt; 404. a return gear; 405. a chip accommodating groove; 5. a positioning table; 6. a fixed table; 7. a feed inlet; 8. an annular groove; 801. a sensing region; 802. a first drive motor; 803. a driving gear; 804. a driven gear; 805. a rotating shaft; 806. a spoon-shaped push plate; 807. a first electric cylinder; 808. mounting a column; 809. a defect detection pressing plate; 9. a console; 10. an inclined guide chute; 11. a longitudinal displacement mechanism; 12. a guide groove; 13. a guide block; 14. a patch adsorption mechanism; 15. a second electric cylinder; 16. a lateral displacement mechanism; 17. positioning the bolt; 18. a turntable; 19. positioning the screw hole; 20. a second drive motor; 21. a connecting plate; 22. a hot air gun; 23. an annular chute; 24. a slide block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, the present invention provides a technical solution: the chip mounting device for maintaining the camera chip comprises a base 1 and a feed inlet 7, wherein a base 2 is arranged on one side of the top of the base 1, a fixed table 6 is arranged on one side of one end of the back of the top of the base 2, a positioning table 5 is arranged on the top of one side of the base 2, a material receiving and conveying assembly is arranged in the middle of the top of the base 1, a material guiding and detecting assembly is arranged on one side of the top of the base 2, a control table 9 is arranged on one side of one end of the front of the base 2, and an inclined material guiding groove 10 is arranged on one side of the top inside the base 2;
the top of fixed station 6 is equipped with vertical displacement mechanism 11, the both ends of fixed station 6 inboard all are equipped with guide slot 12, the inboard of two sets of guide slot 12 is equipped with guide block 13 of mutually supporting, the one end that two sets of guide block 13 are close to each other is equipped with horizontal displacement mechanism 16, the outside of horizontal displacement mechanism 16 is equipped with carousel 18, one side in carousel 18 inside is equipped with screw thread adaptation's location screw 19 and positioning bolt 17 respectively, the top in carousel 18 is equipped with second driving motor 20, the top of carousel 18 is equipped with annular spout 23, the inboard symmetry of annular spout 23 is equipped with mutually supporting slider 24, the one side that two sets of slider 24 are close to each other is equipped with connecting plate 21, the output and the connecting plate 21 interconnect of second driving motor 20, the top of a set of slider 24 is equipped with hot-air gun 22, the bottom of carousel 18 is equipped with second electric cylinder 15, the output of second electric cylinder 15 is equipped with paster adsorption apparatus 14.
As a preferable embodiment of the present embodiment: the middle position of the top of the material receiving and conveying assembly is provided with a mounting frame 4, two sides of the top of the mounting frame 4 are respectively sleeved with a conveying gear 401 and a return gear 404, inner gear rings 402 which are meshed with each other are arranged on the outer sides of the conveying gear 401 and the return gear 404, a conveying belt 403 which is connected with each other is arranged on the outer sides of the inner gear rings 402, a chip accommodating groove 405 is arranged on one side of the top of the base 1, a motor 3 is arranged on the top of one side of the front end of the base 2, and the output end of the motor 3 is connected with the conveying gear 401.
As a preferable embodiment of the present embodiment: one side at guide detection subassembly top is equipped with ring channel 8, the intermediate position department of the inside one side of ring channel 8 is equipped with induction zone 801, one side of ring channel 8 bottom is equipped with first driving motor 802, the output of first driving motor 802 is equipped with driving gear 803, the intermediate position department cover of the inside bottom of ring channel 8 is equipped with pivot 805, the bottom in the pivot 805 outside is equipped with driven gear 804 with driving gear 803 intermeshing, one side at pivot 805 outside top is equipped with spoon type push pedal 806, one side of the 8 back one end of ring channel is equipped with erection column 808, the top of erection column 808 is equipped with first electric cylinder 807, the output of first electric cylinder 807 is equipped with the defect detection clamp plate 809 that corresponds with induction zone position.
As a preferable embodiment of the present embodiment: one side of the inside of frame 2 is equipped with the through-hole, and the through-hole communicates with conveyer belt 403 each other, and the inside bottom of oblique type baffle box 10 is evenly arranged and is equipped with the leading wheel, and one side at oblique type baffle box 10 and conveyer belt 403 top corresponds the cooperation each other, is convenient for carry the leading-in conveyer belt 403 top of chip through oblique type baffle box 10, increases paster adsorption element 14 to the absorbent convenience of chip.
As a preferable embodiment of the present embodiment: the locating table 5 is formed by the combination of a guide rod, two sets of guide sleeves and an L-shaped clamping seat, the L-shaped clamping seats formed by the combination are matched with each other correspondingly, one side of the locating table 5 is provided with an electric push rod, the electric push rod is connected with the L-shaped clamping seats in a group, the two sets of L-shaped clamping seats of the locating table can be used for locating a circuit board needing a paster, and the accuracy of paster work is improved.
As a preferable embodiment of the present embodiment: longitudinal displacement mechanism 11 and transverse displacement mechanism 16 are formed by servo motor and lead screw and the combination of internal thread pipe respectively, positioning screw 19 has been seted up to the both sides that transverse displacement mechanism 16 installed the internal thread pipe, and positioning screw 19 is threaded fixing structure mutual adaptation with positioning bolt 17 and carousel 18, the one end that transverse displacement mechanism 16 installed internal thread pipe top is equipped with the connecting seat, and the top of connecting seat is equipped with the linking arm of installing internal thread pipe interconnect with longitudinal displacement mechanism 11, increase the linkage nature between longitudinal displacement mechanism 11 and the transverse displacement mechanism 16, be convenient for adjust the position of paster adsorption element 14 and hot-air gun 22 through longitudinal displacement mechanism 11 and transverse displacement mechanism 16.
As a preferable embodiment of the present embodiment: the top of feed inlet 7 is equipped with and connects the hopper, and the bottom of feed inlet 7 is equipped with the discharge gate, and the discharge gate is corresponding to each other with the intermediate position department of the inside bottom one end of ring channel 8, is convenient for will fall into the ring channel 8 from the leading-in chip of feed inlet 7 and leads to the transport.
As a preferable embodiment of the present embodiment: the middle position department at mounting bracket 4 top is equipped with driven transmission gear, and driven transmission gear and ring gear 402 intermeshing, the bottom at the inboard both ends of mounting bracket 4 is equipped with the spacing groove, and spacing groove and ring gear 402 mutual adaptation, the rotatory stability of effectual improvement ring gear 402 prevents that ring gear 402 from carrying and producing the skew, the top of chip storage tank 405 one side is equipped with connects the material mouth, and connect the top of material mouth and conveyer belt 403 one side to correspond the cooperation each other, be convenient for collect and follow-up maintenance processing defective chip.
As a preferable embodiment of the present embodiment: the guide hole has been seted up to the intermediate position department of the inside bottom one side of ring channel 8, and the guide hole communicates with each other with the inside of oblique baffle box 10, and defect detection clamp plate 809 is formed by stripper plate and infrared ray detection instrument combination, is convenient for carry the chip of ring channel 8 in leading-in oblique baffle box 10 from the guide hole to the cooperation of accessible infrared ray detection instrument and stripper plate carries out defect detection to the chip of induction zone 801 top, increases the functionality of device.
Example 1, as shown in fig. 1-3, when a chip drops into the annular groove 8, the chip can be pushed above the sensing region 801 by the scoop-shaped push plate 806, the position of the sensing region 801 is sensed to force the first driving motor 802 to stop starting, then, the console 9 can drive the first electric cylinder 807, the starting of the first electric cylinder 807 is used to drive the defect detection pressure plate 809 to descend, then the chip above the sensing area 801 can be clamped and positioned under the extrusion of the defect detection pressing plate 809, and the infrared detector of the defect detection pressing plate 809 is used to perform defect detection, if the detection is not qualified, the surface of the conveying belt 403 can be guided into the inclined guide chute 10, and the conveying belt 403 can be used for directly conveying the unqualified chips to the chip accommodating groove 405 for collection, so that the subsequent maintenance work is facilitated, and the functionality of the device and the working efficiency of continuous detection and maintenance are improved.
Embodiment 2, as shown in fig. 4, when the chip needs to be repaired and removed, the positioning bolt 17 can be removed from the fixing of the rotary table 18 and the positioning screw holes 19, then the rotary table 18 can be rotated to 180 degrees, so as to cause the patch adsorbing mechanism 14 and the hot air gun 22 to be adjusted upside down, then the positioning bolt 17 and the rotary table 18 are used again to fix and lock the other set of positioning screw holes 19, at this time, the second driving motor 20 can be started through the console 9, the second driving motor 20 is used to drive the connecting plate 21 and the two sets of sliders 24 to rotate around under the matching of the annular sliding groove 23, and then the pins at the edge of the chip are uniformly heated by matching with the starting of the hot air gun 22, so that the convenience of the chip removing work and the intelligence of the device are increased.
The working principle is as follows: when the device is used, firstly, the motor 3, the first driving motor 802, the longitudinal displacement mechanism 11, the second electric cylinder 15 and the transverse displacement mechanism 16 are respectively started through the console 9, a chip to be attached is thrown in through the feed inlet 7, the chip falls into the annular groove 8 through the feed inlet 7 at the moment, then the driving gear 803 is driven to be meshed with the driven gear 804 to rotate under the starting of the first driving motor 802, the driven gear 804 drives the rotating shaft 805 and the spoon-shaped push plate 806 to rotate around the inner side of the annular groove 8, the falling chip can be contacted with the rotation of the spoon-shaped push plate 806 at the moment, the chip is driven to rotate for one circle to enter the inclined guide chute 10 from the guide hole, the chip is guided to slide off the surface of the conveyor belt 403 through the inclined guide chute 10, at the moment, the driving gear 401 is driven to rotate under the starting of the motor 3, the annular gear 402 drives the conveyor belt to convey around under the mutual meshing of the conveying gear 401, the return gear 404 and the annular gear 403, then, the chips falling from the inclined guide chute 10 are conveyed, then the chip adsorption mechanism 14 is forced to longitudinally and transversely displace through the matching of the longitudinal displacement mechanism 11 and the transverse displacement mechanism 16, the position adjusting conveyor belt 403 of the chip adsorption mechanism 14 is promoted to convey the chips, then the chip adsorption mechanism 14 is driven to ascend and descend by the starting of the second electric cylinder 15, the chips needing to be pasted are adsorbed by the chip adsorption mechanism 14, and then the circuit board positioned by the positioning table 5 is displaced again, so that the chips are pasted.
Finally, it should be noted that the above-mentioned contents are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, and that the simple modifications or equivalent substitutions of the technical solutions of the present invention by those of ordinary skill in the art can be made without departing from the spirit and scope of the technical solutions of the present invention.

Claims (9)

1. Paster device is used in camera chip maintenance, including base (1) and feed inlet (7), its characterized in that: a base (2) is arranged on one side of the top of the base (1), a fixing table (6) is arranged on one side of one end of the back of the top of the base (2), a positioning table (5) is arranged on the top of one side of the base (2), a material receiving and conveying assembly is arranged in the middle of the top of the base (1), a material guiding and detecting assembly is arranged on one side of the top of the base (2), a control table (9) is arranged on one side of one end of the front of the base (2), and an inclined material guiding groove (10) is arranged on one side of the top inside the base (2);
the top of fixed station (6) is equipped with vertical displacement mechanism (11), the both ends of fixed station (6) inboard all are equipped with guide slot (12), and two sets of the inboard of guide slot (12) is equipped with guide block (13) of mutually supporting, and two sets of the one end that guide block (13) are close to each other is equipped with horizontal displacement mechanism (16), the outside of horizontal displacement mechanism (16) is equipped with carousel (18), one side inside carousel (18) is equipped with location screw (19) and positioning bolt (17) of screw adaptation respectively, the top inside carousel (18) is equipped with second driving motor (20), the top of carousel (18) is equipped with annular spout (23), the inboard symmetry of annular spout (23) is equipped with slider (24) of mutually supporting, and two sets of one side that slider (24) are close to each other is equipped with connecting plate (21), the output and connecting plate (21) interconnect of second driving motor (20), the top of the group of sliding blocks (24) is provided with a hot air gun (22), the bottom of the rotary table (18) is provided with a second electric cylinder (15), and the output end of the second electric cylinder (15) is provided with a patch adsorption mechanism (14).
2. The chip mounter for repairing camera chip according to claim 1, wherein: connect material conveying component top intermediate position department to be equipped with mounting bracket (4), the both sides at mounting bracket (4) top are overlapped respectively and are equipped with transmission gear (401) and return gear (404), the outside of transmission gear (401) and return gear (404) is equipped with intermeshing's ring gear (402), the outside of ring gear (402) is equipped with interconnect's conveyer belt (403), one side at base (1) top is equipped with chip storage tank (405), the top of the positive one end one side of frame (2) is equipped with motor (3), the output and the transmission gear (401) interconnect of motor (3).
3. The chip mounter for repairing camera chip according to claim 1, wherein: an annular groove (8) is arranged on one side of the top of the material guide detection component, an induction area (801) is arranged in the middle of one side inside the annular groove (8), a first driving motor (802) is arranged on one side of the bottom of the annular groove (8), a driving gear (803) is arranged at the output end of the first driving motor (802), a rotating shaft (805) is sleeved at the middle position of the bottom inside the annular groove (8), a driven gear (804) which is meshed with the driving gear (803) is arranged at the bottom of the outer side of the rotating shaft (805), a spoon-shaped push plate (806) is arranged on one side of the top of the outer side of the rotating shaft (805), a mounting column (808) is arranged on one side of one end of the back of the annular groove (8), the top of erection column (808) is equipped with first electric cylinder (807), the output of first electric cylinder (807) is equipped with defect detection clamp plate (809) that correspond with induction zone (801) position.
4. A chip mounting apparatus for repairing a camera chip according to claim 2, wherein: the automatic feeding device is characterized in that a through opening is formed in one side of the interior of the machine base (2) and is communicated with the conveying belt (403), guide wheels are evenly arranged at the bottom of the interior of the inclined guide chute (10), and the inclined guide chute (10) is matched with one side of the top of the conveying belt (403) in a corresponding mode.
5. The chip mounter for repairing camera chip according to claim 1, wherein: the utility model discloses a location platform, including location platform (5), guide arm, two sets of guide pin bushings and L type grip slipper, the combination of location platform (5) is formed by guide arm and two sets of guide pin bushings and L type grip slipper combination, and the L type grip slipper that the combination formed corresponds the cooperation each other, one side of location platform (5) is equipped with electric putter, and electric putter and a set of L type grip slipper interconnect.
6. The chip mounter for repairing camera chip according to claim 1, wherein: longitudinal displacement mechanism (11) and transverse displacement mechanism (16) are formed by servo motor and lead screw and internal thread pipe combination respectively, location screw (19) have been seted up to the both sides that internal thread pipe was installed in transverse displacement mechanism (16), and location screw (19) are threaded fastening structure mutual adaptation with positioning bolt (17) and carousel (18), the one end that internal thread nose portion was installed in transverse displacement mechanism (16) is equipped with the connecting seat, and the top of connecting seat is equipped with the linking arm of installing internal thread pipe interconnect with longitudinal displacement mechanism (11).
7. A chip mounting apparatus for repairing a camera chip according to claim 3, wherein: the top of feed inlet (7) is equipped with and connects the hopper, the bottom of feed inlet (7) is equipped with the discharge gate, and the discharge gate corresponds each other with the intermediate position department of the inside bottom one end of ring channel (8).
8. A chip mounting apparatus for repairing a camera chip according to claim 2, wherein: the utility model discloses a chip packaging structure, including mounting bracket (4), mounting bracket (4) top, spacing groove and ring gear (402), the intermediate position department at mounting bracket (4) top is equipped with driven transmission gear, and driven transmission gear and ring gear (402) intermeshing, the bottom at mounting bracket (4) inboard both ends is equipped with the spacing groove, and spacing groove and ring gear (402) mutual adaptation, the top of chip storage tank (405) one side is equipped with connects the material mouth, and connects the top of material mouth and conveyer belt (403) one side to correspond the cooperation each other.
9. A chip mounting apparatus for repairing a camera chip according to claim 3, wherein: the middle position of one side of the bottom inside the annular groove (8) is provided with a material guide hole, the material guide hole is communicated with the inside of the inclined material guide groove (10), and the defect detection pressing plate (809) is formed by combining an extrusion plate and an infrared detector.
CN202111132300.1A 2021-09-27 2021-09-27 Patch device for maintaining camera chip Active CN113573568B (en)

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