CN113189471B - Test equipment and test method for mobile phone circuit chip - Google Patents
Test equipment and test method for mobile phone circuit chip Download PDFInfo
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- CN113189471B CN113189471B CN202110379678.5A CN202110379678A CN113189471B CN 113189471 B CN113189471 B CN 113189471B CN 202110379678 A CN202110379678 A CN 202110379678A CN 113189471 B CN113189471 B CN 113189471B
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- 238000012360 testing method Methods 0.000 title claims abstract description 50
- 238000010998 test method Methods 0.000 title description 9
- 238000001514 detection method Methods 0.000 claims abstract description 85
- 239000000523 sample Substances 0.000 claims abstract description 43
- 230000005540 biological transmission Effects 0.000 claims description 30
- 238000003825 pressing Methods 0.000 claims description 19
- 239000012528 membrane Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 14
- 230000009471 action Effects 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 24
- 238000004140 cleaning Methods 0.000 description 19
- 230000033001 locomotion Effects 0.000 description 12
- 241000904014 Pappus Species 0.000 description 11
- 239000012535 impurity Substances 0.000 description 8
- 238000001125 extrusion Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 3
- 241000883990 Flabellum Species 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 244000145845 chattering Species 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000017105 transposition Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
The invention belongs to the technical field of chip detection, in particular to a test device of a mobile phone circuit chip, which comprises a fixing plate; a first air cylinder is fixedly connected to the center of the bottom end of the support; the output end of the first cylinder is fixedly connected with an upper detection seat; a lower detection seat is fixedly connected to the position of the fixed plate relative to the upper detection seat; the top end of the lower detection seat is provided with a placing groove; a first cavity is formed in the lower detection seat; a testing method of a mobile phone circuit chip comprises the steps of placing a chip in a testing placing groove for testing, adjusting the testing position of the mobile phone circuit chip through a positioning plate when the mobile phone circuit chip is tested through the testing method, ensuring the accuracy of measurement, and ensuring that the mobile phone circuit chip is in a dust-free detection state through the folding of an upper detection seat and a lower detection seat so as to solve the problem that the chip is placed in a detection machine, the contact between the chip and a probe is not tight enough, and the condition that the detection result is wrong due to poor contact is easy to occur.
Description
Technical Field
The invention belongs to the technical field of chip detection, and particularly relates to a test device and a test method for a circuit chip of a mobile phone.
Background
The mobile phone chip generally refers to a chip applied to a communication function of a mobile phone, and includes a baseband, a processor, a co-processor, an RF, a touch screen controller chip, a Memory, a wireless IC, a power management IC, and the like. Before the chip is packaged before leaving factory, whether the performance problem of the mobile phone chip reaches the use requirement needs to be detected, and the detection of the mobile phone chip is an important step.
Some technical scheme about chip detection have also appeared among the prior art, chinese patent for application number 202010816916X discloses a chip test seat, including the test seat body, the upper end of test seat body is provided with the backup pad, the surface of backup pad is provided with vertical connector, one side of backup pad is provided with fixed knot constructs, fixed knot constructs including fixed axle, rotating tube, upper junction plate, spring, lower connecting plate, drawing board and stopper, one side of backup pad is provided with dust cover, one side surface of dust cover is provided with vertical connecting strip, dust cover's lower extreme is provided with transverse connection strip. This chip test seat possesses comparatively nimble convenient completion and compresses tightly fixedly to the chip on the test seat, can satisfy the demand of testing the chip of certain extent size or different shapes simultaneously, has solved the test seat and has exposed the problem that is infected with the dust in the air for a long time when not using to bring better use prospect in chip test field.
In the prior art, when a chip is tested, a probe and a pin of the chip are generally used for contact measurement, but when the chip is placed in a detector, the chip and the probe are not in tight contact, and the situation that the detection result is wrong due to poor contact is easy to occur.
Disclosure of Invention
The invention provides a test device and a test method of a mobile phone circuit chip, which aim to make up the defects of the prior art and solve the problems that when a chip is tested, a probe and a pin of the chip are generally adopted for contact measurement, but when the chip is placed in a detector, the contact between the chip and the probe is not tight enough, and the detection result is wrong easily caused by poor contact.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to a test device of a mobile phone circuit chip, which comprises a fixing plate; a group of supporting legs is fixedly connected to the bottom end of the fixing plate; a bracket is fixedly connected to the fixed plate; the bracket is an inverted U-shaped bracket; a first air cylinder is fixedly connected to the center of the bottom end of the support; the output end of the first cylinder is fixedly connected with an upper detection seat; a lower detection seat is fixedly connected to the position of the fixed plate relative to the upper detection seat; the top end of the lower detection seat is provided with a placing groove; a first cavity is formed in the lower detection seat; the first cavity is positioned below the placing groove; a motherboard is connected to the inner wall of the first cavity in a sliding manner; the top end of the mother board is fixedly connected with a probe; the bottom end of the fixed plate is fixedly connected with a second air cylinder, and the output end of the second air cylinder extends into the first cavity and is fixedly connected to the bottom end of the mother plate; the position of the placing groove relative to the probe is provided with a guide hole; in the prior art, when a chip is tested, a probe and a pin of the chip are generally adopted for contact measurement, but when the chip is placed in a detection machine, the chip and the probe are not in tight contact, and the condition that the detection result is wrong due to poor contact is easy to occur.
Preferably, the top end of the lower detection seat is provided with a pair of lower pressing grooves which are symmetrical relative to the placing groove; the lower pressure groove is fixedly connected with a lower pressure plate through a spring; the bottom end of the lower pressing plate is fixedly connected with a trapezoidal plate, and the inclined end of the trapezoidal plate extends into the first cavity; the side walls of the two sides of the placing groove are fixedly connected with a positioning plate through springs, and the side walls of the positioning plate are fixedly connected with pushing columns; the end part of the push column, which is far away from the positioning plate, extends into the first cavity, and the end part of the push column is contacted with the inclined surface of the trapezoidal plate; when the device works, the size of the placing groove is generally the same as the size of the chip, so that the probes and the chip can be conveniently aligned and detected, but a taking-out assembly is required to be arranged for taking out, the cost is increased, or the situation that the probes and the chip are not aligned can occur when the size of the placing groove is larger than the size of the chip, and the detection time is wasted, therefore, when the device works, the device sets the transverse length of the placing groove to be larger than the transverse length of the chip, the first air cylinder is started after the chip is placed in the placing groove, the first air cylinder drives the upper detection seat to press downwards, the lower pressing plate is squeezed, the lower pressing plate drives the trapezoidal plate to move downwards, the positioning plate is driven to move towards the placing groove through the inclined plane in the downward moving process of the trapezoidal plate, the positioning plates on the two sides of the chip move simultaneously, the chip can be fixed to the central test position of the placing groove, and the position of the chip can be positioned and fixed through the pushing of the positioning plates, make things convenient for the accurate contact of probe and chip pin, can also be at the chip and detect the back of accomplishing, conveniently take out the cost to the chip.
Preferably, the bottom of the placing groove is provided with a corrugated groove; the guide hole is positioned at the groove bottom of the corrugated groove; the top end of the convex groove of the corrugated groove is provided with a first groove; a first transmission shaft is rotatably connected to the side wall of the first groove, and a first roller is fixedly connected to the first transmission shaft; the during operation sets up the standing groove bottom and is provided with the ripple groove, can conveniently carry out the chip heat dissipation in the testing process, is provided with first gyro wheel moreover on ripple groove convex groove top, makes things convenient for the removal that the positioning plate promoted the chip, transforms sliding friction into rolling friction, not only can make things convenient for the removal of chip, can also reduce the wearing and tearing to the chip outward appearance.
Preferably, the corrugated groove is positioned on the inclined side walls at two sides of the convex groove, and both the inclined side walls are hinged with vertical plates, the hinged parts are provided with torsional springs, and the vertical plates are in a vertical state under the action of the torsional springs; a group of soft hair brushes are arranged at the top end of the vertical plate; the during operation is placed when the standing groove at the chip, and the chip bottom can contact with the pappus brush on the vertical board this moment, and when the board of transposing promoted the chip and carry out the transposition motion, the chip can remove on the pappus brush, makes things convenient for the pappus brush to clean chip bottom department, guarantees the clean and tidy nature of chip bottom pin, further improves the accuracy that detects.
Preferably, a second transmission shaft is rotatably connected to the side wall of the first groove; the second transmission shaft and the first transmission shaft are in transmission through a belt; a second roller is fixedly connected to the second transmission shaft; a group of concave-convex grooves are uniformly formed in the outer side wall of the second roller; a through cavity is formed in the side wall of the first groove; a push rod is connected in the through cavity in a sliding manner; one end of the push rod is contacted with the second roller, and the other end of the push rod is contacted with the vertical plate; the during operation, when the positioning plate promoted the chip motion, first gyro wheel drove the second gyro wheel through the transmission of first transmission shaft and second transmission shaft and rotates this moment, and second gyro wheel lateral wall is even tongue and groove, and the back and forth movement of the effect of the torsional spring force that the push rod can be on the roll of second gyro wheel and vertical board, and push rod back and forth movement can promote vertical board swing back and forth, further improves the effect of cleaning that cleans the pappus brush.
Preferably, a group of first air bags is fixedly connected to the side wall, close to the push rod, of the vertical plate, and a group of second air bags is fixedly connected to the side wall, far away from the push rod, of the vertical plate; the first air bag and the second air bag are communicated with each other, and the first air bag is in a bulging state which is larger than that of the second air bag; a second cavity is formed in the vertical plate, and a vibrating piece is fixedly connected in the second cavity; the inner side walls of the first air bag and the second air bag are fixedly connected with connecting rods, and the connecting rods extend into the second cavity and are fixedly connected with a vibration ball; the vibration ball and the vibration sheet which are fixedly connected with each other through the connecting rod on the first air bag are in a separated state, and the vibration ball and the vibration sheet which are fixedly connected with each other through the connecting rod on the second air bag are in a contact state; when the device works, when the push rod pushes the vertical plate to swing back and forth, the end part of the push rod can slide on the side wall of the vertical plate, the first air bag can be extruded in the sliding process, the first air bag can be extruded to drive the vibration ball to knock the vibration sheet through the connecting rod, the vibration sheet is vibrated to drive the soft brush to vibrate, the cleaning effect of the soft brush can be increased, the top end self-cleaning of the soft brush can be realized, in addition, when the first air bag is pressed, the gas of the first air bag can enter the second air bag through the hose, the second air bag is bulged to drive the vibration ball on the second air bag to be separated from the vibration sheet, after the extrusion rod extrudes the first air bag, the first air bag rebounds to drive the second air bag to shrink, the vibration ball on the second air bag can impact the vibration sheet again, so in the process that the push rod pushes the vertical plate to swing, the vibration sheet can always be in the knocking state of the vibration ball, the chattering state of the fur brush is maintained.
Preferably, a third air bag is fixedly connected to the bottom of the first groove, and when the second roller rotates, the boss on the second roller and the third air bag are extruded mutually; a second groove is formed in the top end of the vertical plate, and an elastic curved membrane is fixedly connected to the opening of the second groove; the elastic curved membrane is in an inwards concave state, and the elastic curved membrane and the second groove form a sealed cavity; the soft brush is fixedly connected to the outer side wall of the elastic curved membrane; the third air bag and the sealing cavity formed by the elastic curved membrane and the second groove are communicated with each other; the during operation, when the second gyro wheel rotated, the boss of second gyro wheel can extrude the third gasbag, and the gas of third gasbag can drive the crooked membrane evagination of elasticity in can getting into the second recess, and the extrusion of being interrupted of third gasbag can drive the crooked membrane of elasticity and make a round trip to contract and evagination, not only can increase the dynamics of cleaning of pappus brush, can also strengthen and clean the effect.
Preferably, through grooves are formed in the two side walls of the corrugated groove boss, and the through grooves are communicated with the through cavities; a fixed rod is fixedly connected in the through groove, and a first rotating shaft is rotatably connected at the center of the fixed rod; the top end of the first rotating shaft is fixedly connected with a fan blade, and the bottom end of the first rotating shaft extends into the through cavity and is fixedly connected with a first gear; a rack layer is fixedly connected to the side wall of the push rod close to the first gear; the first gear and the rack layer are meshed with each other; during operation, when the push rod gets down the return motion in the effect of second gyro wheel and vertical board, the mutual meshing that the push rod passed through rack layer and first gear this moment can drive first axis of rotation rotatory, and first axis of rotation is rotatory can drive the flabellum and rotate, can not only drive the fast flow of air current for the radiating effect of chip can also blow the chip bottom, has the cleaning effect.
Preferably, the side walls of the grooves of the corrugated grooves, which are close to the guide holes, are hinged with baffle plates, the hinged points are provided with torsional spring force, and the baffle plates seal the guide holes; the during operation, when the second cylinder does not start, the plate washer is in the state of sheltering from the guiding hole this moment, not only can prevent that external impurity from passing through the guiding hole and adhering to on the probe surface, influences the detection effect, can also avoid the pappus brush to clean impurity on the chip and fall through the guiding hole and drop on the probe, when the motion of second gasbag, can drive the mother board and move upwards, the baffle can be backed down to the probe this moment, after the detection, the baffle can be at the sealed guiding hole of resealing under the effect of torsional spring force.
A test method for testing equipment of a mobile phone circuit chip is suitable for testing any one of the test equipment of the mobile phone circuit chip, and comprises the following steps:
s1: firstly, blowing air to clean a lower detection seat to ensure that the placing seat is in an impurity-free state, and then placing a chip to be detected into a placing groove;
s2: starting the first cylinder to drive the upper detection seat to move downwards to extrude the lower pressing plate, adjusting the position of the chip through the positioning plate in the downward moving process of the lower pressing plate, covering the lower detection seat by the upper detection seat, and starting the second cylinder to drive the probe to be in contact with the pin of the chip through the guide hole;
s3: and after the detection is finished, starting the first air cylinder to drive the upper detection seat to move upwards, releasing the positioning of the chip by the positioning plate, taking out the chip, and finishing the detection.
The invention has the following beneficial effects:
1. the invention relates to a test device and a test method of a mobile phone circuit chip, which are characterized in that a first air cylinder is started, the first air cylinder drives an upper test seat to cover a lower test seat, the position of a chip to be tested is fixed, then a second air cylinder is started, the second air cylinder drives a probe on a motherboard to extend into a placing groove through a guide hole, the probe and the pin of the chip to be tested are in close contact with each other to measure the performance of the chip, the test accuracy can be improved, the test environment is in a closed state, the influence of external factors is avoided, and the error rate is further reduced.
2. According to the test equipment and the test method for the mobile phone circuit chip, the position of the chip can be positioned and fixed through the pushing of the positioning plate, so that the probe and the chip pin can be conveniently and accurately contacted, the chip can be conveniently taken out after the chip detection is finished, and the cost is saved.
3. According to the test equipment and the test method for the mobile phone circuit chip, the baffle is positioned in the shielding guide hole, so that external impurities can be prevented from being attached to the surface of the probe through the guide hole to influence the detection effect, and impurities on the chip cleaned by the soft brush can be prevented from falling onto the probe through the guide hole.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a circuit chip placement diagram;
FIG. 3 is a front view of the present invention;
FIG. 4 is an enlarged view of area A of FIG. 3;
FIG. 5 is an enlarged view of area B of FIG. 4;
FIG. 6 is an enlarged view of area C of FIG. 5;
FIG. 7 is an enlarged view of area D of FIG. 5;
FIG. 8 is an enlarged view of area E of FIG. 4;
FIG. 9 is a flow chart of a testing method of a testing device of a circuit chip of a mobile phone;
in the figure: 1. a fixing plate; 11. a support leg; 12. a support; 13. a first cylinder; 14. an upper detection seat; 15. a lower detection seat; 16. a placement groove; 17. a second cylinder; 18. a guide hole; 19. a first cavity; 191. a motherboard; 192. a probe; 2. a lower pressing plate; 21. a trapezoidal plate; 22. a positioning plate; 23. pushing the column; 3. a corrugated groove; 31. a first groove; 32. a first drive shaft; 33. a first roller; 34. a vertical plate; 35. a soft brush; 36. a second transmission shaft; 37. a second roller; 38. a cavity is communicated; 39. a push rod; 4. a first air bag; 41. a second air bag; 42. a connecting rod; 43. a vibration ball; 44. a second cavity; 45. a vibration sheet; 46. a third air cell; 47. an elastic curved film; 48. a second groove; 5. a through groove; 51. fixing the rod; 52. a first rotating shaft; 53. a first gear; 54. a fan blade; 6. and a baffle plate.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Example 1:
as shown in fig. 1 to 6, the testing apparatus for a circuit chip of a mobile phone according to the present invention includes a fixing plate 1; a group of supporting legs 11 are fixedly connected to the bottom end of the fixing plate 1; a bracket 12 is fixedly connected to the fixed plate 1; the bracket 12 is an inverted U-shaped bracket 12; a first cylinder 13 is fixedly connected to the center of the bottom end of the support 12; the output end of the first cylinder 13 is fixedly connected with an upper detection seat 14; a lower detection seat 15 is fixedly connected to the position of the fixed plate 1 relative to the upper detection seat 14; the top end of the lower detection seat 15 is provided with a placing groove 16; a first cavity 19 is formed in the lower detection seat 15; the first cavity 19 is located below the placement groove 16; a motherboard 191 is connected to the inner wall of the first cavity 19 in a sliding manner; the top end of the motherboard 191 is fixedly connected with a probe 192; a second cylinder 17 is fixedly connected to the bottom end of the fixing plate 1, and the output end of the second cylinder 17 extends into the first cavity 19 and is fixedly connected to the bottom end of the motherboard 191; the position of the placing groove 16 relative to the probe 192 is provided with a guide hole 18; in the prior art, when testing a chip, the probe 192 and the pin of the chip are generally used to perform contact measurement, however, when the chip is placed in the detecting machine, the contact between the chip and the probe 192 is not tight enough, so that the detection result is easy to be wrong due to poor contact, when the invention works, a chip to be detected is firstly placed in the placing groove 16 of the lower detection seat 15, the first air cylinder 13 is started, the first air cylinder 13 drives the upper detection seat 14 to cover the lower detection seat 15, the position of the chip to be detected is fixed, then, the second cylinder 17 is started, the second cylinder 17 drives the probes 192 on the motherboard 191 to extend into the placing groove 16 through the guide holes 18, the probes 192 and the pins of the chip to be tested are in close contact with each other to measure the performance of the chip, the detection accuracy can be improved, and the detection environment is in a closed state, so that the influence of external factors is avoided, and the error rate is further reduced.
As an embodiment of the present invention, the top end of the lower detection seat 15 is provided with a pair of pressing grooves symmetrical with respect to the placing groove 16; the lower pressure groove is fixedly connected with a lower pressure plate 2 through a spring; the bottom end of the lower pressing plate 2 is fixedly connected with a trapezoidal plate 21, and the inclined end of the trapezoidal plate 21 extends into the first cavity 19; the side walls of the two sides of the placing groove 16 are fixedly connected with a positioning plate 22 through springs, and the side wall of the positioning plate 22 is fixedly connected with a pushing column 23; the end part of the push column 23 far away from the positioning plate 22 extends into the first cavity 19, and the end part of the push column 23 is contacted with the inclined surface of the trapezoidal plate 21; when the chip alignment detection device works, the size of the placing groove 16 is generally the same as the size of a chip, so that the alignment detection of the probes 192 and the chip is convenient, but a taking-out component is required to be arranged for taking out, the cost is increased, or the situation that the probes 192 and the chip are misaligned due to the fact that the size of the placing groove 16 is larger than that of the chip is caused, and the detection time is wasted, therefore, when the chip alignment detection device works, the transverse length of the placing groove 16 is larger than that of the chip, the chip is placed in the placing groove 16, the first air cylinder 13 is started, the first air cylinder 13 drives the upper detection seat 14 to press downwards, the lower pressing plate 2 is extruded, the lower pressing plate 2 drives the trapezoidal plate 21 to move downwards, the positioning plate 22 is driven by the push column 23 to move towards the placing groove 16 through an inclined plane in the downwards moving process of the trapezoidal plate 21, the positioning plates 22 on the two sides of the chip move simultaneously, the chip is fixed to the central test position of the placing groove 16, and is pushed by the positioning plate 22, not only can fix a position the position of chip fixedly, make things convenient for the accurate contact of probe 192 and chip pin, can also detect the completion back at the chip, conveniently take out the cost is practiced thrift to the chip.
As an embodiment of the invention, the bottom of the placing groove 16 is provided with a corrugated groove 3; the guide hole 18 is positioned at the groove bottom of the corrugated groove 3; the top end of the convex groove of the corrugated groove 3 is provided with a first groove 31; a first transmission shaft 32 is rotatably connected to the side wall of the first groove 31, and a first roller 33 is fixedly connected to the first transmission shaft 32; during operation, set up the standing groove 16 bottom and be provided with corrugated groove 3, can conveniently carry out the chip heat dissipation in the testing process, be provided with first gyro wheel 33 on corrugated groove 3 tongue top moreover, make things convenient for the removal that positioning plate 22 promoted the chip, transform sliding friction into rolling friction, not only can make things convenient for the removal of chip, can also reduce the wearing and tearing to the chip outward appearance.
As an embodiment of the invention, the corrugated groove 3 is hinged with vertical plates 34 on the inclined side walls at two sides of the convex groove, a torsional spring is arranged at the hinged position, and the vertical plates 34 are in a vertical state under the action of the torsional spring; the top end of the vertical plate 34 is provided with a group of soft brushes 35; the during operation is placed when standing groove 16 at the chip, and the chip bottom can contact with the pappus brush 35 on the vertical board 34 this moment, and when positioning board 22 promoted the chip and carried out the positioning motion, the chip can move on pappus brush 35, makes things convenient for pappus brush 35 to clean chip bottom department, guarantees the clean and tidy nature of chip bottom pin, further improves the accuracy that detects.
As an embodiment of the present invention, a second transmission shaft 36 is rotatably connected to a side wall of the first groove 31; the second transmission shaft 36 and the first transmission shaft 32 are driven by a belt; a second roller 37 is fixedly connected to the second transmission shaft 36; a group of concave-convex grooves are uniformly formed in the outer side wall of the second roller 37; a through cavity 38 is formed in the side wall of the first groove 31; a push rod 39 is connected in the through cavity 38 in a sliding manner; one end of the push rod 39 and the second roller 37 contact each other, and the other end and the vertical plate 34 contact each other; during operation, when positioning plate 22 promoted the chip motion, first gyro wheel 33 drove second gyro wheel 37 through the transmission of first transmission shaft 32 and second transmission shaft 36 this moment and rotates, and second gyro wheel 37 lateral wall is even tongue and groove, and push rod 39 can be at the round trip movement of the roll of second gyro wheel 37 and the effect of the torsional spring force on the vertical board 34, and push rod 39 round trip movement can promote vertical board 34 swing back and forth, further improves the effect of cleaning the pappus brush 35.
As an embodiment of the present invention, a group of first air bags 4 is fixedly connected to the side wall of the vertical plate 34 close to the push rod 39, and a group of second air bags 41 is fixedly connected to the side wall far from the push rod 39; the first air bag 4 and the second air bag 41 are communicated with each other, and the first air bag 4 is in a swelling state which is larger than that of the second air bag 41; a second cavity 44 is formed in the vertical plate 34, and a vibrating piece 45 is fixedly connected in the second cavity 44; the inner side walls of the first air bag 4 and the second air bag 41 are fixedly connected with a connecting rod 42, and the connecting rod 42 extends into a second cavity 44 and is fixedly connected with a vibration ball 43; the vibration ball 43 and the vibration sheet 45 fixedly connected with the first air bag 4 through the connecting rod 42 are in a separated state, and the vibration ball 43 and the vibration sheet 45 fixedly connected with the second air bag 41 through the connecting rod 42 are in a contact state; when the device works, when the push rod 39 pushes the vertical plate 34 to swing back and forth, the end part of the push rod 39 can slide on the side wall of the vertical plate 34, the first air bag 4 can be extruded in the sliding process, the first air bag 4 can be extruded to drive the vibration ball 43 to knock the vibration sheet 45 through the connecting rod 42, the vibration sheet 45 is vibrated to drive the soft brush 35 to vibrate, the cleaning effect of the soft brush 35 can be increased, the top end self-cleaning of the soft brush 35 can be realized, when the first air bag 4 is pressed, the gas of the first air bag 4 can enter the second air bag 41 through the hose, the second air bag 41 is expanded to drive the vibration ball 43 on the second air bag 41 to separate from the vibration sheet 45, after the extrusion rod extrudes the first air bag 4, the first air bag 4 rebounds to drive the second air bag 41 to contract, the vibration ball 43 on the second air bag 41 can impact the vibration sheet 45 again, so that the push rod 39 pushes the vertical plate 34 to swing, at this time, the vibration piece 45 is always struck by the vibration ball 43, and keeps the vibration state of the fur brush 35.
As an embodiment of the present invention, a third air bag 46 is fixedly connected to the bottom of the first groove 31, and when the second roller 37 rotates, the boss on the second roller 37 and the third air bag 46 are pressed against each other; a second groove 48 is formed at the top end of the vertical plate 34, and an elastic curved membrane 47 is fixedly connected at the opening of the second groove 48; the elastic curved membrane 47 is in a concave state, and the elastic curved membrane 47 and the second groove 48 form a sealed cavity; the soft brush 35 is fixedly connected on the outer side wall of the elastic curved membrane 47; the third air bag 46 and the elastic curved membrane 47 are communicated with a sealed cavity formed by the second groove 48; during operation, when the second roller 37 rotates, the third air bag 46 can be extruded by the boss of the second roller 37, the gas of the third air bag 46 can enter the second groove 48, the elastic curved film 47 can be driven to protrude outwards, the discontinuous extrusion of the third air bag 46 can drive the elastic curved film 47 to contract back and forth and protrude outwards, the cleaning force of the soft brush 35 can be increased, and the cleaning effect can be enhanced.
Example 2:
as shown in fig. 7 to 8, in the testing equipment for a mobile phone circuit chip according to the present invention, through grooves 5 are formed on both side walls of the boss of the corrugated groove 3, and the through grooves 5 and the through cavities 38 are communicated with each other; a fixed rod 51 is fixedly connected in the through groove 5, and a first rotating shaft 52 is rotatably connected at the center of the fixed rod 51; the top end of the first rotating shaft 52 is fixedly connected with a fan blade 54, and the bottom end of the first rotating shaft extends into the through cavity 38 and is fixedly connected with a first gear 53; a rack layer is fixedly connected to the side wall of the push rod 39 close to the first gear 53; the first gear 53 and the rack layer are meshed with each other; during operation, when the push rod 39 moves back and forth under the action of the second roller 37 and the vertical plate 34, the push rod 39 can drive the first rotating shaft 52 to rotate through the mutual engagement of the rack layer and the first gear 53, the first rotating shaft 52 can drive the fan blades 54 to rotate, and therefore the quick flowing of air flow can be driven, the heat dissipation effect of the chip is accelerated, the bottom end of the chip can be blown, and the cleaning effect is achieved.
As an embodiment of the invention, the side walls of the grooves of the corrugated groove 3, which are close to the guide holes 18, are hinged with the baffle plates 6, the hinged points are provided with torsional spring force, and the baffle plates 6 close the guide holes 18; during operation, when second cylinder 17 did not start, the plate washer was in the state of sheltering from guiding hole 18 this moment, not only can prevent that external impurity from passing through guiding hole 18 and attaching to the probe 192 surface, influence the detection effect, can also avoid the pappus brush 35 to clean the impurity on the chip and fall through guiding hole 18 and drop on probe 192, when second gasbag 41 moved, can drive mother board 191 upward movement, probe 192 can push away baffle 6 this moment, after the detection, baffle 6 can be at resealing guiding hole 18 under the effect of torsional spring force.
The working principle is as follows: firstly, a chip to be detected is placed in a placing groove 16 of a lower detection seat 15, a first air cylinder 13 is started, the first air cylinder 13 drives an upper detection seat 14 to press downwards, a lower pressing plate 2 can be extruded, the lower pressing plate 2 can drive a trapezoidal plate 21 to move downwards, the trapezoidal plate 21 can drive a positioning plate 22 to move towards the placing groove 16 through a push column 23 in the downwards moving process, the positioning plates 22 on two sides of the chip move simultaneously to fix the chip to a central testing position of the placing groove 16, then a second air cylinder 17 is started, the second air cylinder 17 drives a probe 192 on a mother plate 191 to extend into the placing groove 16 through a guide hole 18, the probe 192 and a pin of the chip to be detected are in close contact with each other to measure the performance of the chip, the detection accuracy can be improved, the detection environment is in a closed state, the influence of external factors is avoided, and the error rate is further reduced; the bottom end of the placing groove 16 is provided with the corrugated groove 3, so that heat dissipation of a chip can be conveniently carried out in the detection process, and the top end of the convex groove of the corrugated groove 3 is provided with the first roller 33, so that the positioning plate 22 can conveniently push the chip to move, sliding friction is converted into rolling friction, so that the movement of the chip can be facilitated, and the abrasion to the appearance of the chip can be reduced; when the chip is pushed to move by the positioning plate 22, at the moment, the first roller 33 drives the second roller 37 to rotate through the transmission of the first transmission shaft 32 and the second transmission shaft 36, the outer side wall of the second roller 37 is provided with uniform concave-convex grooves, the push rod 39 can roll on the second roller 37 and can move back and forth under the action of the torsional force on the vertical plate 34, the push rod 39 can move back and forth to push the vertical plate 34 to swing back and forth, and the cleaning effect of the cleaning soft brush 35 is further improved; when the push rod 39 pushes the vertical plate 34 to swing back and forth, the end of the push rod 39 can slide on the side wall of the vertical plate 34, the first air bag 4 can be extruded in the sliding process, the first air bag 4 can be extruded to drive the vibration ball 43 to knock the vibration sheet 45 through the connecting rod 42, the vibration sheet 45 is vibrated to drive the soft brush 35 to vibrate, the cleaning effect of the soft brush 35 can be increased, the top end of the soft brush 35 can be self-cleaned, when the first air bag 4 is pressed, the gas of the first air bag 4 can enter the second air bag 41 through the hose, the second air bag 41 is bulged to drive the vibration ball 43 on the second air bag 41 to be separated from the vibration sheet 45, after the first air bag 4 is extruded by the extrusion rod, the second air bag 41 is driven to shrink, the vibration ball 43 on the second air bag 41 can impact the vibration sheet 45 again, so that in the process of pushing the push rod 39 pushes the vertical plate 34 to swing, at this time, the vibration sheet 45 is always in the knocking state of the vibration ball 43, and the vibration state of the soft brush 35 is kept; when the chip cleaning device works, when the push rod 39 moves back and forth under the action of the second roller 37 and the vertical plate 34, the push rod 39 can drive the first rotating shaft 52 to rotate through the mutual meshing of the rack layer and the first gear 53, the first rotating shaft 52 can drive the fan blades 54 to rotate, airflow can be driven to flow rapidly, the heat dissipation effect of a chip is accelerated, the bottom end of the chip can be blown, and the chip cleaning device has a cleaning effect; when the second cylinder 17 is not started, the baffle is in the state of shielding the guide hole 18 at this moment, which not only can prevent external impurities from attaching to the surface of the probe 192 through the guide hole 18, and influence the detection effect, but also can prevent the soft brush 35 from cleaning impurities on the chip and dropping on the probe 192 through the guide hole 18, when the second air bag 41 moves, the mother board 191 is driven to move upwards, the probe 192 can push the baffle 6 open at this moment, and after the detection is finished, the baffle 6 can reseal the guide hole 18 under the action of the torsional spring force.
A test method for testing equipment of a mobile phone circuit chip is suitable for testing any one of the test equipment of the mobile phone circuit chip, and comprises the following steps:
s1: firstly, blowing and cleaning a lower detection seat to ensure that the placing seat is in an impurity-free state, and then placing a chip to be detected into a placing groove;
s2: starting the first cylinder to drive the upper detection seat to move downwards to extrude the lower pressing plate, adjusting the position of the chip through the positioning plate in the downward moving process of the lower pressing plate, covering the lower detection seat by the upper detection seat, and starting the second cylinder to drive the probe to be in contact with the pin of the chip through the guide hole;
s3: after the detection is finished, the first air cylinder is started to drive the upper detection seat to move upwards, the positioning plate releases the positioning of the chip, the chip is taken out, and the detection is finished.
The front, the back, the left, the right, the upper and the lower are all based on figure 1 in the attached drawings of the specification, according to the standard of the observation angle of a person, the side of the device facing an observer is defined as the front, the left side of the observer is defined as the left, and the like.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are merely intended to facilitate the description of the present invention and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the scope of the present invention.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. The test equipment of the mobile phone circuit chip is characterized by comprising a fixing plate (1); a group of supporting legs (11) are fixedly connected to the bottom end of the fixing plate (1); a bracket (12) is fixedly connected to the fixed plate (1); the bracket (12) is an inverted U-shaped bracket (12); a first cylinder (13) is fixedly connected to the center of the bottom end of the support (12); the output end of the first cylinder (13) is fixedly connected with an upper detection seat (14); a lower detection seat (15) is fixedly connected to the position of the fixed plate (1) corresponding to the upper detection seat (14); a placing groove (16) is formed in the top end of the lower detection seat (15); a first cavity (19) is formed in the lower detection seat (15); the first cavity (19) is located below the placement slot (16); a motherboard (191) is connected on the inner wall of the first cavity (19) in a sliding way; the top end of the motherboard (191) is fixedly connected with a probe (192); the bottom end of the fixed plate (1) is fixedly connected with a second air cylinder (17), and the output end of the second air cylinder (17) extends into the first cavity (19) and is fixedly connected to the bottom end of the mother plate (191); the position of the placing groove (16) relative to the probe (192) is provided with a guide hole (18);
the top end of the lower detection seat (15) is provided with a pair of lower pressing grooves which are symmetrical relative to the placing groove (16); a lower pressure plate (2) is fixedly connected to the lower pressure groove through a spring; the bottom end of the lower pressing plate (2) is fixedly connected with a trapezoidal plate (21), and the inclined end of the trapezoidal plate (21) extends into the first cavity (19); the side walls of the two sides of the placing groove (16) are fixedly connected with a positioning plate (22) through springs, and the side wall of the positioning plate (22) is fixedly connected with a push column (23); the end part of the push column (23) far away from the positioning plate (22) extends into the first cavity (19), and the end part of the push column (23) is contacted with the inclined surface of the trapezoidal plate (21);
the bottom of the placing groove (16) is provided with a corrugated groove (3); the guide hole (18) is positioned at the groove bottom of the corrugated groove (3); the top end of the convex groove of the corrugated groove (3) is provided with a first groove (31); a first transmission shaft (32) is rotatably connected to the side wall of the first groove (31), and a first roller (33) is fixedly connected to the first transmission shaft (32);
the inclined side walls of the corrugated groove (3) at the two sides of the convex groove are hinged with vertical plates (34), torsion springs are arranged at the hinged parts, and the vertical plates (34) are in a vertical state under the action of the torsion springs; the top end of the vertical plate (34) is provided with a group of soft hair brushes (35).
2. The testing equipment of the mobile phone circuit chip is characterized in that a second transmission shaft (36) is rotatably connected to the side wall of the first groove (31); the second transmission shaft (36) and the first transmission shaft (32) are in transmission through a belt; a second roller (37) is fixedly connected to the second transmission shaft (36); a group of concave-convex grooves are uniformly formed in the outer side wall of the second roller (37); a through cavity (38) is formed in the side wall of the first groove (31); a push rod (39) is connected in the through cavity (38) in a sliding manner; one end of the push rod (39) and the second roller (37) are in contact with each other, and the other end and the vertical plate (34) are in contact with each other.
3. The testing equipment of the mobile phone circuit chip is characterized in that a group of first air bags (4) is fixedly connected to the side wall, close to the push rod (39), of the vertical plate (34), and a group of second air bags (41) is fixedly connected to the side wall, far away from the push rod (39); the first air bag (4) and the second air bag (41) are communicated with each other, and the bulging state of the first air bag (4) is larger than that of the second air bag (41); a second cavity (44) is formed in the vertical plate (34), and a vibration sheet (45) is fixedly connected in the second cavity (44); the inner side walls of the first air bag (4) and the second air bag (41) are fixedly connected with a connecting rod (42), and the connecting rod (42) extends into the second cavity (44) and is fixedly connected with a vibration ball (43); the vibration ball (43) and the vibration sheet (45) which are fixedly connected with each other through the connecting rod (42) on the first air bag (4) are in a separated state, and the vibration ball (43) and the vibration sheet (45) which are fixedly connected with each other through the connecting rod (42) on the second air bag (41) are in a contact state.
4. The testing equipment of the mobile phone circuit chip according to claim 3, wherein a third air bag (46) is fixedly connected to the bottom of the first groove (31), and when the second roller (37) rotates, a boss on the second roller (37) and the third air bag (46) are pressed against each other; a second groove (48) is formed in the top end of the vertical plate (34), and an elastic curved membrane (47) is fixedly connected to an opening of the second groove (48); the elastic curved membrane (47) is in a concave state, and the elastic curved membrane (47) and the second groove (48) form a sealed cavity; the soft brush (35) is fixedly connected to the outer side wall of the elastic curved membrane (47); the third air bag (46) and the elastic curved membrane (47) are communicated with a sealed cavity formed by the second groove (48).
5. The testing equipment of the mobile phone circuit chip is characterized in that through grooves (5) are formed in two side walls of a boss of the corrugated groove (3), and the through grooves (5) are communicated with the through cavities (38); a fixed rod (51) is fixedly connected in the through groove (5), and a first rotating shaft (52) is rotatably connected at the center of the fixed rod (51); the top end of the first rotating shaft (52) is fixedly connected with a fan blade (54), and the bottom end of the first rotating shaft extends into the through cavity (38) and is fixedly connected with a first gear (53); a rack layer is fixedly connected to the side wall of the push rod (39) close to the first gear (53); the first gear (53) and the rack layer are meshed with each other.
6. The testing equipment of the circuit chip of the mobile phone according to claim 5, wherein the side walls of the grooves of the corrugated groove (3) close to the guide hole (18) are hinged with baffle plates (6), the hinged points are provided with torsional spring force, and the baffle plates (6) close the guide hole (18).
7. A method for testing a circuit chip of a mobile phone, the method using the testing apparatus of a circuit chip of a mobile phone of any one of claims 1 to 6, the method comprising the steps of:
s1: firstly, blowing air to clean a lower detection seat to ensure that the placing seat is in an impurity-free state, and then placing a chip to be detected into a placing groove;
s2: starting the first cylinder to drive the upper detection seat to move downwards to extrude the lower pressing plate, adjusting the position of the chip through the positioning plate in the downward moving process of the lower pressing plate, covering the lower detection seat by the upper detection seat, and starting the second cylinder to drive the probe to be in contact with the pin of the chip through the guide hole;
s3: and after the detection is finished, starting the first air cylinder to drive the upper detection seat to move upwards, releasing the positioning of the chip by the positioning plate, taking out the chip, and finishing the detection.
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| CN113588004A (en) * | 2021-08-17 | 2021-11-02 | 陈三妹 | Semiconductor chip detection equipment |
| CN113823578B (en) * | 2021-09-26 | 2024-06-14 | 西安欣业科技发展有限公司 | Detection method for tin connection of pins of double-row chip |
| CN113933686B (en) * | 2021-10-13 | 2023-10-03 | 深圳台达创新半导体有限公司 | Detection equipment for integrated circuit packaging finished product |
| CN114047429A (en) * | 2021-11-02 | 2022-02-15 | 湖南优美科技发展有限公司 | Integrated circuit chip protection method and production device |
| CN114236350B (en) * | 2021-12-06 | 2022-09-13 | 深圳市昂捷电子有限公司 | Chip automatic detection equipment |
| CN117269629A (en) * | 2022-03-01 | 2023-12-22 | 深圳绿灯侠新能源有限公司 | Overload-prevention capacitor detection device for photovoltaic power generation |
| CN114791398B (en) * | 2022-03-15 | 2023-06-30 | 江苏九设机器人科技有限公司 | Hardness testing device convenient for mechanical parts |
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| US20060077579A1 (en) * | 2004-10-12 | 2006-04-13 | Margeson Christopher S | Force actuator with clamp |
| CN204289401U (en) * | 2014-12-16 | 2015-04-22 | 深圳市慧为智能科技有限公司 | A kind of bga chip manual detection device |
| CN110335832A (en) * | 2019-04-22 | 2019-10-15 | 广州市沙唯士电子科技有限公司 | A kind of good chip detecting equipment of contact with regulatory function |
| TWI705253B (en) * | 2019-05-06 | 2020-09-21 | 美商第一檢測有限公司 | Detection device, socket device and a socket |
| CN210982539U (en) * | 2019-10-28 | 2020-07-10 | 苏州芯海半导体科技有限公司 | Chip supporting device for chip detection |
| CN211206708U (en) * | 2019-11-06 | 2020-08-07 | 嘉兴理科昇电子科技有限公司 | Integrated circuit chip circuit testing device |
| CN211741340U (en) * | 2019-11-21 | 2020-10-23 | 苏州好博医疗器械有限公司 | Circuit board detection tool with self-checking device |
| CN211653066U (en) * | 2020-01-06 | 2020-10-09 | 福建锐翰光电科技有限公司 | Pressure measuring groove type FCT detection device |
| CN212636410U (en) * | 2020-01-17 | 2021-03-02 | 博格华纳汽车零部件（武汉）有限公司 | Built-in permanent magnet motor rotor injection mold |
| CN212648206U (en) * | 2020-07-14 | 2021-03-02 | 江苏微邦电子有限公司 | Conveying device for integrated circuit board detection |
| CN112014717A (en) * | 2020-08-14 | 2020-12-01 | 成芯半导体(江苏)有限公司 | Chip testing seat |
| CN112034326B (en) * | 2020-08-19 | 2023-09-08 | 宜宾卓邦科技有限公司 | Chip detection device |
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