CN113823578B - Detection method for tin connection of pins of double-row chip - Google Patents
Detection method for tin connection of pins of double-row chip Download PDFInfo
- Publication number
- CN113823578B CN113823578B CN202111125227.5A CN202111125227A CN113823578B CN 113823578 B CN113823578 B CN 113823578B CN 202111125227 A CN202111125227 A CN 202111125227A CN 113823578 B CN113823578 B CN 113823578B
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 81
- 238000001514 detection method Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 claims abstract description 23
- 230000007246 mechanism Effects 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 13
- 238000009423 ventilation Methods 0.000 claims description 13
- 230000006835 compression Effects 0.000 claims description 11
- 238000007906 compression Methods 0.000 claims description 11
- 239000002893 slag Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 4
- 230000008263 repair mechanism Effects 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000003860 storage Methods 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to the field of electronic elements, and particularly relates to a detection method for double-row chip pin tin connection, which particularly relates to a detection device for double-row chip pin tin connection in the detection process of double-row chip pin tin connection.
Description
Technical Field
The invention belongs to the field of electronic elements, and particularly relates to a detection method of double-row chip pin tin connection.
Background
The double-row chip is a common name of semiconductor elements, also called a miniature integrated circuit, is ubiquitous in the present life, is a modern computing, communication, manufacturing and transportation system, including the Internet, all depends on the existence of the integrated circuit, and the integrated circuit is commonly called to tin the pins of the double-row chip in the manufacturing process, and the present tin plating method is to spray tin water, so that the pins of the double-row chip scratch the sprayed water absorption, and the gaps among the pins are very small, so that the pins of the double-row chip are very easy to connect tin in the tin plating process of the pins of the double-row chip, thereby influencing the normal use of the double-row chip.
Disclosure of Invention
The invention aims at solving the problems in the prior art and provides a double-row chip pin tin connection detection method capable of automatically monitoring whether tin connection is carried out after tin plating of double-row chip pins is finished.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
The utility model provides a detection method that double chip pin even tin, its double chip pin even tin's detection method still concretely relates to double chip pin even tin's detection device in the detection process that tin was even to double chip pin, this double chip pin even tin's detection device includes the shell, one side of shell is equipped with four supporting legs, be equipped with the workspace in the shell, evenly be equipped with a plurality of feed inlet that runs through on the inner wall of one side of workspace, the workspace keep away from on the inner wall of feed inlet side with the feed inlet corresponds and is equipped with equal discharge gate, every feed inlet and discharge gate all are equipped with detection mechanism in the workspace between, every detection mechanism is interior all be equipped with and be used for dissolving even tin repair mechanism, every detection mechanism is interior still all be equipped with be used for clear up the edulcoration mechanism of tin sediment, be close to on the workspace inner wall the feed inlet department all is equipped with a pair of support frame, every is equipped with the conveyer belt on the support frame, one side of shell is equipped with the total controller that is used for controlling whole device.
Preferably, the detection mechanism comprises a detection table fixedly arranged on the inner wall of the working space, which is close to the four supporting feet, a plurality of movable grooves are formed in the detection table along the directions of the feed inlet and the limiting rod, each movable groove is provided with a movable block in a sliding manner, the movable blocks are connected to the inner wall of the movable groove through movable springs, and two protection grooves with openings deviating from the supporting feet and used for facilitating sliding of the pins are symmetrically arranged on the detection table.
Preferably, the detection mechanism further comprises a cylinder wall, the working space is far away from the inner wall of the detection table, the cylinder wall is provided with a first air cavity, the opening of the first air cavity faces the detection table, a piston is slidably arranged in the first air cavity, a pressing plate for slowly extruding the chip is arranged on the piston, the detection table is close to the discharge hole, the side of the detection table is provided with a limit groove, the opening of the limit groove faces the cylinder wall, and a limit rod for limiting is slidably arranged in the limit groove.
Preferably, the repairing mechanism comprises a compression groove with an opening facing the movable groove and arranged on the inner wall of each movable groove, each movable block is slidably arranged in the compression groove, a fixed electrode is fixedly arranged on the inner wall of the compression groove, a conductive spring for stable power-on is arranged on the fixed electrode, and a movable electrode is embedded on each movable block close to the end of the fixed electrode.
Preferably, the repairing mechanism further comprises a heating block which is used for heating and is fixedly arranged in each movable block, two storage grooves with openings facing the protective grooves are symmetrically arranged at the positions, close to the protective grooves, of each heating block, tin soldering blocks which are used for melting and connecting tin are slidably arranged in each storage groove, each tin soldering block is connected onto the inner wall of each storage groove through a tin soldering spring, each heating block slightly extends out of the movable block and is far away from the end of each movable groove, a through hole is formed in each movable block, and a conductive wire which is used for communicating the heating block with the movable electrode is arranged in each through hole.
Preferably, the impurity removing mechanism comprises an air passage with an opening arranged on the inner wall of the limiting groove facing the limiting groove, an air guide groove connected with the air passage is further arranged on the side, away from the cylinder wall, of the detecting table, a second air cavity is connected with the end, close to the air guide groove, of the air passage, a one-way air valve used for preventing air in the air guide groove from flowing back into the limiting groove is arranged on the side, close to the air guide groove, of the air passage, two ventilation pipes are symmetrically arranged on the detecting table, the second air cavity is simultaneously communicated with the two ventilation pipes, an air cavity with an opening facing the movable block is arranged on the side wall, close to each movable block, of the protecting groove, each movable block is communicated with the corresponding ventilation pipe, and a filter screen used for preventing tin slag from entering the ventilation pipes is fixedly arranged in each air cavity.
Preferably, the detection method for connecting tin by adopting the pins of the double-row chip comprises the following steps:
S1: positioning, namely conveying the tin-plated chip to a detection table through a conveying belt and positioning through a limiting rod;
s2: detecting whether tin connection exists or not through the pressing plate and the movable block;
S3: dissolving the continuous tin, and dissolving the continuous tin by electrifying and heating the heating block;
S4: cleaning tin slag, and cleaning the tin slag on the pins through wind blown out from the wind cavity;
s5, performing S5; discharging, namely carrying out the next working procedure on the detected or repaired chip through the limiting rod and the discharge hole.
The beneficial effects are that: through the extrusion of clamp plate and movable block, can detect whether the chip pin has even tin, can also repair even tin simultaneously, improve the yields.
And the gas in the second air cavity blows the molten tin on the chip pins from the chip pins through the air cavity and the filter screen, so that the molten tin connecting block is prevented from being blocked on the chip pins, and the defect of tin connecting is avoided.
By the separate movement of the movable blocks, the chip pins can be repaired separately when the chip pins are repaired, and the good chip pins are not heated.
Drawings
FIG. 1 is a schematic view of the present invention;
FIG. 2 is a schematic diagram of a structural implementation of the present invention;
FIG. 3 is a schematic view of the direction A-A in FIG. 2;
FIG. 4 is a schematic view of the B-B direction of FIG. 2;
FIG. 5 is an enlarged schematic view of FIG. 2 at C;
FIG. 6 is an enlarged schematic view of FIG. 2 at D;
fig. 7 is an enlarged schematic view of fig. 3 at E.
In the figures, a housing 10; a working space 11; a support frame 12; a conveyor belt 13; a detection stage 14; a guard groove 15; a feed inlet 16; a pressing plate 17; a piston 18; a cylinder wall 19; a first air chamber 20; a discharge port 21; a stopper rod 22; a limit groove 23; an airway 24; an air guide groove 25; a movable groove 26; a master controller 27; a heating block 28; a movable spring 29; a movable block 30; a second air chamber 31; a one-way gas valve 32; a ventilation pipe 33; an air duct 34; a fixed electrode 35; a conductive spring 36; a compression groove 37; a moving electrode 38; a wind chamber 39; a filter screen 40; a conductive wire 41; a storage groove 42; a solder spring 43; solder bumps 44; a detection mechanism 90; a impurity removing mechanism 91; repair mechanism 92.
Detailed Description
The following are specific embodiments of the present invention and the technical solutions of the present invention will be further described with reference to the accompanying drawings, but the present invention is not limited to these embodiments.
In the description of the present invention, it should be noted that, the azimuth or positional relationship indicated by the terms "inner", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that the inventive product is conventionally put in use, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Referring to fig. 2 and 3, a method for detecting tin connection of a double-row chip pin, in which a detecting device for tin connection of a double-row chip pin is specifically involved in the process of detecting tin connection of a double-row chip pin, the detecting device for tin connection of a double-row chip pin comprises a housing 10, four supporting feet are arranged on one side of the housing 10, a working space 11 is arranged in the housing 10, a plurality of through feed inlets 16 are uniformly arranged on one side inner wall of the working space 11, equal discharge outlets 21 are arranged on the inner wall of the working space 11 far from the feed inlets 16 and corresponding to the feed inlets 16, a detecting mechanism 90 is arranged between each feed inlet 16 and each discharge outlet 21 in the working space 11, a repairing mechanism 92 for dissolving tin connection is arranged in each detecting mechanism 90, a pair of supporting frames 12 are fixedly arranged on the inner wall of the working space 11 near the feed inlets 16, a conveying belt 13 is arranged on each pair of supporting frames 12, and a controller 27 for controlling the whole device is arranged on one side of the housing 10.
Further, referring to fig. 3, the detecting mechanism 90 includes a detecting table 14 fixedly disposed on an inner wall of the working space 11 near the four supporting legs, a plurality of movable slots 26 are disposed in the detecting table 14 along the direction of the feed inlet 16 and the limit rod 22, a movable block 30 is slidably disposed in each movable slot 26, the movable block 30 is connected to the inner wall of the movable slot 26 through a movable spring 29, and two protection slots 15 with openings deviating from the supporting legs and being used for facilitating sliding of the pins are symmetrically disposed on the detecting table 14 with respect to the movable block 30.
Further, referring to fig. 2, the detecting mechanism 90 further includes a cylinder wall 19 disposed on an inner wall of the working space 11 far from the detecting table 14 and corresponding to the detecting table 14, a first air cavity 20 with an opening facing the detecting table 14 is disposed in the cylinder wall 19, a piston 18 is slidably disposed in the first air cavity 20, a pressing plate 17 for slowly pressing the chip is disposed on the piston 18, a limit groove 23 with an opening facing the cylinder wall 19 is disposed on a side of the detecting table 14 near the discharge hole 21, and a limit rod 22 for limiting is slidably disposed in the limit groove 23.
Further, referring to fig. 5, the repairing mechanism 92 includes a compression groove 37 provided on an inner wall of each movable groove 26 with an opening facing the movable groove 26, each movable block 30 is slidably provided in the compression groove 37, a fixed electrode 35 is fixedly provided on an inner wall of the compression groove 37, a conductive spring 36 for stable energization is provided on the fixed electrode 35, and a movable electrode 38 is embedded on each movable block 30 near an end of the fixed electrode 35.
Further, referring to fig. 3 and 5, the repairing mechanism 92 further includes a heating block 28 fixedly disposed in each movable block 30 for heating, two storage slots 42 with openings facing the protective slots 15 are symmetrically disposed at positions of each heating block 28 close to the protective slots 15 with respect to the movable slots 26, soldering blocks 44 for melting and connecting tin are slidably disposed in each storage slot 42, each soldering block 44 is connected to an inner wall of the storage slot 42 through a soldering spring 43, each heating block 28 slightly extends out of an end of the movable block 30 far away from the movable slot 26, a through hole is disposed in each movable block 30, and a conductive wire 41 for communicating the heating block 28 with the movable electrode 38 is disposed in the through hole.
Further, referring to fig. 4, 6 and 7, the impurity removing mechanism 91 includes an air passage 24 with an opening facing the limiting groove 23 and disposed on an inner wall of the limiting groove 23, an air guide groove 25 connected to the air passage 24 is further disposed on a side, far away from the cylinder wall 19, of the detecting platform 14, a second air cavity 31 is connected to an end, far away from the limiting rod 22, of the air passage 24, a unidirectional air valve 32 for preventing air in the air guide groove 25 from flowing back into the limiting groove 23 is disposed on a side, close to the air guide groove 25, of the air passage 24, two ventilation pipes 33 are symmetrically disposed on the detecting platform 14 with respect to the limiting rod 22, the second air cavity 31 is simultaneously communicated with the two ventilation pipes 33, air cavities 39 with openings facing the movable blocks 30 are disposed on a side wall of the protecting groove 15, each movable block 30 is communicated with the corresponding ventilation pipe 33, and a filter screen 40 for preventing tin slag from entering the ventilation pipes 33 is fixedly disposed in each air cavity 39.
Further, the detection method for the tin connection by adopting the double-row chip pins comprises the following steps:
s1: positioning, namely conveying the tin-plated chip to a detection table 14 through a conveying belt 13 and positioning through a limiting rod 22;
s2: detecting whether tin is connected or not through the pressing plate 17 and the movable block 30;
S3: dissolving the continuous tin, and heating the heating block 28 by electrifying to dissolve the continuous tin;
S4: cleaning tin slag, and cleaning the tin slag on the pins through wind blown out from the wind cavity 39;
S5, performing S5; discharging, and carrying out the next working procedure on the detected or repaired chip and the discharge hole 21 through the limiting rod 22.
Initial state: the movable spring 29 is in a normal state, the piston 18 is in a contracted state, and the movable electrode 38 is in a power-off state.
Working principle: the tinned chip is conveyed to the detection table 14 through the conveying belt 13, the limit rod 22 limits the chip, after the chip contacts the limit rod 22, the master controller 27 gives a signal to the soldering block 44, the soldering block 44 slides out of the storage groove 42, the soldering block 44 is inserted into a gap between chip pins, the gas in the first gas cavity 20 is increased, the piston 18 is pushed out, the pressing plate 17 presses the chip, if the chip pins are connected with tin, the pressing plate 17 presses the corresponding movable block 30 while pressing the chip, the movable block 30 slides towards the fixed electrode 35, the movable electrode 38 contacts the conductive spring 36, the conductive spring 36 is compressed, the movable electrode 38 is electrified with the fixed electrode 35, the heating block 28 is electrified and heated through the conductive wire 41, the heating block 28 heats the soldering block 44 to melt the connected tin on the chip pins, if the chip pins are not connected with tin, the heating block 28 is not triggered to heat, whether the chip pins are connected with tin or not can be effectively detected by extruding the pressing plate 17 and the movable block 30, the connected tin can be repaired, the yield is improved, the movable block 30 compresses the air in the compression groove 37 into the second air cavity 31 through the air duct 34 and the air duct 25 when the movable block 30 slides, the limit rod 22 contracts after detection, the air in the limit groove 23 is compressed into the second air cavity 31 through the air duct 24 and the one-way air valve 32, the melted connected tin on the chip pins is blown off from the chip pins through the air cavity 39 and the filter screen 40 by the air in the second air cavity 31, the melted connected tin blocks are prevented from being blocked on the chip pins, the connected tin is prevented from being bad, the chips on the conveying belt 13 are ejected out through the discharge hole 21 after the pressing plate 17 and the tin block 44 are reset, the next chip is tested.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the invention.
Claims (7)
1. A detection method of double-row chip pin tin connection is characterized in that: the detection method of double chip pins and tin comprises the steps that in the detection process of double chip pins and tin, the detection device of double chip pins and tin further specifically relates to a detection device of double chip pins and tin, the detection device of double chip pins and tin comprises a shell (10), four supporting feet are arranged on one side of the shell (10), a working space (11) is arranged in the shell (10), a plurality of penetrating feed inlets (16) are uniformly arranged on one side inner wall of the working space (11), the working space (11) is far away from the inner wall of the side of the feed inlets (16), equal discharge outlets (21) are correspondingly arranged on the inner wall of the side of the feed inlets (16) and correspond to the feed inlets (16), a detection mechanism (90) is arranged between each feed inlet (16) and each discharge outlet (21), a repairing mechanism (92) for dissolving and connecting tin is arranged in each detection mechanism (90), a impurity removing mechanism (91) for cleaning tin residues is further arranged in each detection mechanism (90), a pair of support frames (12) are arranged on the inner wall of the working space (11), a pair of support frames (12) are fixedly arranged on the inner wall of the side of the shell (12), and the whole transmission device is provided with a controller (13).
2. The method for detecting the tin connection of the pins of the double-row chip as claimed in claim 1, wherein the method comprises the following steps: detection mechanism (90) are including fixed detection platform (14) that set up on the inner wall that workspace (11) is close to four supporting legs, be equipped with a plurality of movable groove (26) along feed inlet (16) and gag lever post (22) direction in detection platform (14), every all slide in movable groove (26) and be equipped with a movable block (30), movable block (30) are in through movable spring (29) connection on the inner wall of movable groove (26), detection platform (14) are related to movable block (30) symmetry is equipped with two openings and deviates from supporting legs and be used for being convenient for pin gliding guard slot (15).
3. The method for detecting the tin connection of the pins of the double-row chip as claimed in claim 2, wherein the method comprises the following steps: the detection mechanism (90) further comprises a cylinder wall (19) which is arranged on the inner wall of the working space (11) away from the detection table (14) and corresponds to the detection table (14), a first air cavity (20) which is arranged in the cylinder wall (19) and is opened towards the detection table (14) is arranged in the cylinder wall (19), a piston (18) is arranged in the first air cavity (20) in a sliding mode, a pressing plate (17) for slowly squeezing a chip is arranged on the piston (18), a limit groove (23) which is opened towards the cylinder wall (19) is arranged on the side of the detection table (14) close to the discharge hole (21), and a limit rod (22) for limiting is arranged in the limit groove (23) in a sliding mode.
4. The method for detecting the tin connection of the pins of the double-row chip as claimed in claim 3, wherein the method comprises the following steps: repair mechanism (92) include every the opening that is equipped with on the inner wall of movable groove (26) is towards compression groove (37) of movable groove (26), every movable block (30) are all slided and are established in compression groove (37), fixed electrode (35) are equipped with on the inner wall of compression groove (37), be equipped with on fixed electrode (35) and be used for stable circular telegram conductive spring (36), every be close to on movable block (30) fixed electrode (35) end all is inlayed and is equipped with movable electrode (38).
5. The method for detecting the tin connection of the pins of the double-row chip as claimed in claim 4, wherein the method comprises the following steps: repair mechanism (92) still include every fixed setting is used for the heating piece (28) in movable block (30), every heating piece (28) are close to movable groove (15) department all is equipped with two openings towards holding tank (42) of protection groove (15) with movable groove (26) symmetry, every in holding tank (42) all slide and be equipped with in being used for melting tin soldering piece (44) that links, every soldering piece (44) all are connected on the inner wall of holding tank (42) through soldering spring (43), every heating piece (28) all stretch out slightly movable block (30) keep away from movable groove (26) end, every be equipped with the through-hole in movable block (30), be equipped with in the through-hole be used for the intercommunication heating piece (28) with conductor wire (41) of moving electrode (38).
6. The method for detecting the tin connection of the pins of the double-row chip as claimed in claim 5, wherein the method comprises the following steps: the utility model provides an air vent system, including limit groove (23), air guide groove (25) on air flue (24), air flue (24) keep away from air cylinder wall (19) side are still equipped with and connect in detection bench (14) air guide groove (25) set up on the inner wall of limit groove (23), air flue (24) keep away from limit lever (22) end connection is equipped with second air cavity (31), be close to in air flue (24) air guide groove (25) side is equipped with one-way pneumatic valve (32) that are used for preventing in air guide groove (25) gaseous back flow to limit groove (23), detection bench (14) are about limit lever (22) symmetry is equipped with two ventilation pipes (33), second air cavity (31) are simultaneously linked together two ventilation pipe (33), be close to every on the side wall of protection groove (15) air cavity (39) of movable block (30) department all is equipped with opening orientation movable block (30), every movable block (30) all linked together ventilation pipe (33), every ventilation pipe (39) all are equipped with fixed filter screen (40) of tin entering.
7. The method for detecting tin connection of pins of double-row chips according to any one of claims 1 to 6, wherein the method comprises the following steps: the detection method for the tin connection of the pins of the double-row chip comprises the following steps:
S1: positioning, namely conveying the tin-plated chip to a detection table (14) through a conveying belt (13) and positioning through a limiting rod (22);
s2: detecting whether tin connection exists or not through the pressing plate (17) and the movable block (30);
s3: dissolving the continuous tin, and heating the heating block (28) by electrifying to dissolve the continuous tin;
S4: cleaning tin slag, and cleaning the tin slag on the pins through wind blown out from the wind cavity (39);
S5, performing S5; discharging, namely, carrying out the next working procedure on the detected or repaired chip and the discharge hole (21) through the limiting rod (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111125227.5A CN113823578B (en) | 2021-09-26 | 2021-09-26 | Detection method for tin connection of pins of double-row chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111125227.5A CN113823578B (en) | 2021-09-26 | 2021-09-26 | Detection method for tin connection of pins of double-row chip |
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| CN113823578A CN113823578A (en) | 2021-12-21 |
| CN113823578B true CN113823578B (en) | 2024-06-14 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015090956A (en) * | 2013-11-07 | 2015-05-11 | 東レエンジニアリング株式会社 | Bonding device |
| CN113189471A (en) * | 2021-04-08 | 2021-07-30 | 深圳市磐锋精密技术有限公司 | Test equipment and test method for mobile phone circuit chip |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0966361A (en) * | 1995-08-31 | 1997-03-11 | Nippon Seiki Co Ltd | Soldering device |
| JP6358423B2 (en) * | 2014-03-24 | 2018-07-18 | 日産自動車株式会社 | Semiconductor mounting method and semiconductor component manufacturing apparatus |
| JP6645990B2 (en) * | 2017-01-13 | 2020-02-14 | コーセル株式会社 | Soldering apparatus and soldering method |
| CN209335040U (en) * | 2018-11-09 | 2019-09-03 | 吉林省铭奥科技有限公司 | A kind of automatic cleaning welding slag device of welding machine |
| CN110335832A (en) * | 2019-04-22 | 2019-10-15 | 广州市沙唯士电子科技有限公司 | A kind of good chip detecting equipment of contact with regulatory function |
| JP7338258B2 (en) * | 2019-06-19 | 2023-09-05 | 株式会社レゾナック | Bonding material evaluation method and evaluation test device |
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2021
- 2021-09-26 CN CN202111125227.5A patent/CN113823578B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015090956A (en) * | 2013-11-07 | 2015-05-11 | 東レエンジニアリング株式会社 | Bonding device |
| CN113189471A (en) * | 2021-04-08 | 2021-07-30 | 深圳市磐锋精密技术有限公司 | Test equipment and test method for mobile phone circuit chip |
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