CN103281144A - Method for testing wireless performance of wireless product - Google Patents
Method for testing wireless performance of wireless product Download PDFInfo
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- CN103281144A CN103281144A CN2013102235492A CN201310223549A CN103281144A CN 103281144 A CN103281144 A CN 103281144A CN 2013102235492 A CN2013102235492 A CN 2013102235492A CN 201310223549 A CN201310223549 A CN 201310223549A CN 103281144 A CN103281144 A CN 103281144A
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Abstract
The invention discloses a method for testing wireless performance of a wireless product. A circuit board of the wireless product comprises a wireless chip, a RF link and an antenna. The method comprises the following steps that (1), a bonding pad between the RF link and the antenna is disconnected when the circuit board is produced, tin paste is brushed on the bonding pad which is connected between the RF link and a wireless testing point; (2), automatic tin connection can be conducted on the bonding pad between the RF link and the wireless testing point by controlling furnace temperature after the circuit board passes through a furnace through an SMT; (3), soldering iron is used for disconnecting the tin connection between the RF link and the wireless testing point after a test is finished, and the soldering iron supplement tin is used for connecting the bonding pad between the RF link and the antenna. The method for testing wireless performance of the wireless product has the advantages of being low in testing cost and reliable in testing results.
Description
Technical field
The present invention relates to moving communicating field, relate in particular to a kind of wireless performance method of testing of wireless product.
Background technology
A lot of wireless products of producing on the current market have all adopted the built-in aerial scheme, the wireless network card of being familiar with as everybody, wireless router etc., and when the wireless product to built-in aerial carries out the production test of wireless performance, mainly be divided into three kinds of method of testings at present:
Method one: as depicted in figs. 1 and 2, make in this way its RF link of wireless product and antenna between need to connect by a wireless test seat, also need just can test by buckling the cable line that is complementary with the wireless test seat during wireless performance in test.The operation principle of the employed wireless test seat of this method of testing is, the inside of test bench under normal circumstances is communicated with, and namely RF link and antenna are normal the connections, wait to buckle the cable line that is complementary with it after, will disconnect and being connected of antenna.Though it is very convenient to use this method of testing to carry out production test, for a such wireless test seat, generally will sell for 1 to 2 yuan on the market and not wait, and the cable line that is complementary with it is also expensive a lot of than normal p-wire.
Method two: because the testing cost of method one is higher, in order to reduce the production test cost, as shown in Figure 3 and Figure 4, be that product is when design, at first design one electronic component carries out bridge joint between RF link and antenna, as 0 common Ohmic resistance, play via hole carries out wireless performance to the back side of pcb board test at the front end of electronic component simultaneously.This method requires to disconnect the electronic component that RF link and antenna carry out bridge joint earlier before the test, RF link and antenna is coupled together after to be tested the finishing again.Because this method of testing need be beaten via hole, and wireless signal is not waiting through having 1 decay of arriving 2db behind the via hole, causes final test result not accurate enough.
Method three: in order to improve wireless test result's accuracy, other a kind of method of testing so on the basis of method two, derived again, as shown in Figure 5 and Figure 6, namely same RF link needs to disconnect earlier and being connected and making the RF link be connected to wireless test point and hold and test of antenna before the test, antenna and RF link is coupled together behind the wireless performance of intact veneer to be tested again.The wireless product of the built-in aerial of Sheng Chaning in the market, all be by disconnecting being connected and passing through an electronic component of RF link and antenna earlier before the test at the common practice of this method of testing, jump between RF link and the wireless test point as 0 ohm resistance, again electronic component is welded behind the intact wireless performance to be tested and get off to jump to the RF link and antenna end couples together it.For this method of testing, though improved precision of test result, test gets up production efficiency is had very big influence, and resistance also is easy to damage in the process of repeated disassembled and assembled welding, has improved the production test cost greatly.In addition, under this method, because electronic device needs multiple welding in test process, also can influence device property, cause the radio-frequency (RF) index inconsequent.
Summary of the invention
In order to solve the problems referred to above of prior art, be necessary to provide the wireless performance method of testing of the wireless product of the low and reliable test result of a kind of testing cost.
The technical scheme that technical solution problem of the present invention provides is:
A kind of wireless performance method of testing of wireless product, the circuit board of described wireless product comprises wireless chip, RF link and antenna, this method comprises,
Step S1 keeps the pad between RF link and the antenna to disconnect when board production, and at the pad brush tin cream that connects between RF link and the wireless test point;
Step S2, circuit board through SMT cross stove after the time by control furnace temperature make the pad between RF link and the wireless test point connect tin automatically;
Step S3, test is finished the back and is disconnected company's tin between RF link and the wireless test point with flatiron, and with flatiron benefit tin the pad between RF link and the antenna is coupled together.
Wherein, adopt Radio Test Equipment to be connected with wireless test point, carry out wireless test.
Compared with prior art, method of testing cost of the present invention is low and do not need dozen via hole to influence precision of test result, do not need SMT welding resistance before the test yet, do not need dismounting resistance after the test yet, can not cause resistance in the repeated disassembled and assembled process, to damage risk, do not exist device to influence the device property risk because of multiple welding yet, can not cause the radio-frequency (RF) index inconsequent, improved the accuracy of test, also improved production efficiency, reduced production costs simultaneously.
Description of drawings
Fig. 1 is the preceding view of wireless performance method of testing test of the wireless product of prior art one.
Fig. 2 is the view after the wireless performance method of testing of the wireless product of prior art one is tested.
Fig. 3 is the preceding view of wireless performance method of testing test of the wireless product of prior art two.
Fig. 4 is the view after the wireless performance method of testing of the wireless product of prior art two is tested.
Fig. 5 is the preceding view of wireless performance method of testing test of the wireless product of prior art three.
Fig. 6 is the view after the wireless performance method of testing of the wireless product of prior art three is tested.
Fig. 7 is the preceding view of wireless performance method of testing test of wireless product of the present invention.
Fig. 8 is the view in the wireless performance method of testing test process of wireless product of the present invention.
Fig. 9 is the view after the wireless performance method of testing of wireless product of the present invention is tested.
Embodiment
Among the present invention, the circuit board of wireless product is by comprising wireless chip, RF link, antenna.Wireless test point is arranged on the radio-circuit plate usually, and Radio Test Equipment comes wireless performance is tested by being connected to the wireless test point.During test, need to keep the RF link to be connected with wireless test point, and RF link and antenna disconnect.After test is finished, need to keep RF link and wireless test point to disconnect, and the RF link is connected with antenna.Comprise the steps: in method of testing of the present invention
Step S1 keeps the pad between RF link and the antenna to disconnect when the wireless product board production, and at the pad brush tin cream that connects between RF link and the wireless test point, as shown in Figure 7.In order to guarantee that the pad between RF link and the wireless test point connects tin easily, the distance of pad is smaller between RF link and the wireless test point, about suggestion 5mil.
Step S2 makes the pad between RF link and the wireless test point connect tin automatically by the control furnace temperature in the time of after crossing stove through SMT (Surface Mount Technology, surface mounting technology), as shown in Figure 8.In this step, saved the action of welding resistance between RF link and wireless test point, also enhanced productivity simultaneously.
Step S3, test is finished the back and is disconnected company's tin between RF link and the wireless test point with flatiron, and with flatiron benefit tin RF link and antenna is coupled together, as shown in Figure 9.
In above-mentioned steps, step S1 and step S2 are finished automatically by machine, and step S3 is for manually finishing.
Compared with prior art, method of testing cost of the present invention is low and do not need dozen via hole to influence precision of test result, do not need SMT welding resistance before the test yet, do not need dismounting resistance after the test yet, can not cause resistance in the repeated disassembled and assembled process, to damage risk, do not exist device to influence the device property risk because of multiple welding yet, can not cause the radio-frequency (RF) index inconsequent, improved the accuracy of test, also improved production efficiency, reduced production costs simultaneously.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention does, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (2)
1. the wireless performance method of testing of a wireless product, the circuit board of described wireless product comprises wireless chip, RF link and antenna, it is characterized in that comprising,
Step S1 keeps the pad between RF link and the antenna to disconnect when board production, and at the pad brush tin cream that connects between RF link and the wireless test point;
Step S2, circuit board through SMT cross stove after the time by control furnace temperature make the pad between RF link and the wireless test point connect tin automatically;
Step S3, test is finished the back and is disconnected company's tin between RF link and the wireless test point with flatiron, and with flatiron benefit tin the pad between RF link and the antenna is coupled together.
2. the wireless performance method of testing of wireless product according to claim 1 is characterized in that, adopts Radio Test Equipment to be connected with wireless test point, carries out wireless test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2013102235492A CN103281144A (en) | 2013-06-03 | 2013-06-03 | Method for testing wireless performance of wireless product |
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| CN2013102235492A CN103281144A (en) | 2013-06-03 | 2013-06-03 | Method for testing wireless performance of wireless product |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104767572A (en) * | 2014-01-08 | 2015-07-08 | 海华科技股份有限公司 | Interstage tester of wireless communication device |
| CN108449108A (en) * | 2017-02-16 | 2018-08-24 | 索尼互动娱乐股份有限公司 | Communication device |
| CN111510170A (en) * | 2020-04-08 | 2020-08-07 | 惠州Tcl移动通信有限公司 | Radio frequency circuit testing device and testing method thereof |
| CN112595920A (en) * | 2021-02-26 | 2021-04-02 | 荣耀终端有限公司 | Radio frequency conduction test method and related device |
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| CN201323702Y (en) * | 2008-11-21 | 2009-10-07 | 青岛海信移动通信技术股份有限公司 | Zero-resistance replacement circuit and mobile terminal utilizing same |
| CN201839519U (en) * | 2010-09-24 | 2011-05-18 | 比亚迪股份有限公司 | Radio-frequency circuit board and terminal equipment |
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| KR20060016711A (en) * | 2004-08-18 | 2006-02-22 | 주식회사 팬택 | Method for function test of wireless communication terminal |
| US20080290885A1 (en) * | 2007-05-23 | 2008-11-27 | Texas Instruments Incorporated | Probe test system and method for testing a semiconductor package |
| CN101232695A (en) * | 2008-02-28 | 2008-07-30 | 深圳华为通信技术有限公司 | Radio frequency circuit board and manufacturing method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104767572A (en) * | 2014-01-08 | 2015-07-08 | 海华科技股份有限公司 | Interstage tester of wireless communication device |
| CN104767572B (en) * | 2014-01-08 | 2017-04-12 | 海华科技股份有限公司 | Interstage tester of wireless communication device |
| CN108449108A (en) * | 2017-02-16 | 2018-08-24 | 索尼互动娱乐股份有限公司 | Communication device |
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| CN111510170A (en) * | 2020-04-08 | 2020-08-07 | 惠州Tcl移动通信有限公司 | Radio frequency circuit testing device and testing method thereof |
| CN112595920A (en) * | 2021-02-26 | 2021-04-02 | 荣耀终端有限公司 | Radio frequency conduction test method and related device |
| EP4163648A4 (en) * | 2021-02-26 | 2024-02-14 | Honor Device Co Ltd | Radio frequency conduction test method and related apparatus |
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Application publication date: 20130904 |