CN104767572B - Interstage tester of wireless communication device - Google Patents
Interstage tester of wireless communication device Download PDFInfo
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- CN104767572B CN104767572B CN201410009133.5A CN201410009133A CN104767572B CN 104767572 B CN104767572 B CN 104767572B CN 201410009133 A CN201410009133 A CN 201410009133A CN 104767572 B CN104767572 B CN 104767572B
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Abstract
The invention provides an interstage tester of a wireless communication device. The wireless communication device includes a component to be tested and an inferior component, wherein the component to be tested is electrically connected with the inferior component via a signal line. The interstage tester is arranged on the signal line, electrically connected with the component to be tested and the inferior component, and provided with an upper plate, a lower plate and an intermediate layer. The intermediate layer is arranged between the upper plate and the lower plate, and comprises a first block and a second block, the first block generates an air impedance, and the second block generates a regulation impedance. Thus, the interstage tester can be used to test the state of the component to be tested in the wireless communication device according to the air impedance and the regulation impedance.
Description
Technical field
The present invention is provided
Put, for test device between the level of the situation of element in test wireless communication device.
Background technology
Radio communication (wireless communication) has become a kind of mobile for current technology and has produced
The designer trends of product.Wireless communication unit is generally arranged in System on Chip/SoC (System on Chip, abbreviation SoC) so that
The circuit of wireless communication unit can be miniaturized and modularity by System on Chip/SoC, and required function element is integrated in list
In chips, and radio communication device is formed, to meet the demand of mobile product now.
However, due to the function element in radio communication device it is numerous, if there is certain function element in radio communication device
There is flaw, general detecting instrument is not easy to detect which function element has flaw.In order to ensure the function of radio communication device
Normally, it is known that if find that radio communication device efficiency is not good or certain function element has flaw, that is, whole system chip is abandoned,
Real category is wasted.
The content of the invention
In view of this, the present invention provides test device between a kind of level of radio communication device.Between the level, test device can
Detect the situation of element in radio communication device, and make more when test device detects the element of flaw or damage between level
Change.Thereby, user has the element of flaw or damage without abandoning whole channel radio in only needing to change radio communication device
T unit, can be such that manufacturing cost significantly reduces.
The embodiment of the present invention provides test device between a kind of level of radio communication device.Radio communication device is provided with one and treats
Survey element, earth lead, once a holding wire, earth lead and subordinate's element on one.Element under test passes through upper ground connection respectively
Line, holding wire, lower earth lead electrical connection subordinate element.Between level, test device includes upper plate, lower plate and intermediary layer.Lower plate
First earthing pole electrically connects the 3rd earth terminal of first earth terminal and subordinate's element of element under test by upper earth lead.Lower plate
Lower plate pickup electrode electrically connects the measured signal end of element under test and subordinate's signal end of subordinate's element by holding wire.And lower plate
The second earthing pole by lower earth lead electrically connect element under test the second earth terminal and subordinate's element the 4th earth terminal.Intermediary
Layer is arranged between upper plate and lower plate.Intermediary layer includes the first block and the second block, and the first block is adjacent second zone
Block.First block has air chamber, and air chamber contact lower plate, to produce fixed air impedance.And the second block then has
Impedance adjusts chamber, and impedance adjusts chamber contact lower plate.Wherein, impedance adjust chamber in have conducting resinl, earth plate, substrate layer, with
And metallic plate.Conducting resinl is located in lower plate, earth plate is electrically connected the first earthing pole and the second earthing pole.On conducting resinl
Sequentially fold and be provided with earth plate, substrate layer and metallic plate.Substrate layer has a predetermined thickness, to produce tune according to predetermined thickness
Section impedance.
It is comprehensive the above, between the level of the radio communication device provided by the embodiment of the present invention, test device can be according to air
Impedance and impedance ratio between impedance is adjusted detecting the situation of element under test in radio communication device.
To enable the feature and technology contents that are further understood that the present invention, refer to below in connection with the present invention specifically
Bright and accompanying drawing, but these explanations are intended merely to the explanation present invention with institute's accompanying drawings, rather than to scope of the presently claimed invention
Make any restriction.
Description of the drawings
Figure 1A is the schematic diagram of the radio communication device of one embodiment of the invention.
Figure 1B be one embodiment of the invention level between element under test in test device test wireless communication device signal
Figure.
Fig. 2A be one embodiment of the invention level between test device exploded view.
Fig. 2 B are the exploded views of the intermediary layer of one embodiment of the invention.
Fig. 3 A be another embodiment of the present invention level between test device exploded view.
Fig. 3 B be another embodiment of the present invention level between test device side view.
Fig. 4 A be another embodiment of the present invention detecting element level not in electrical contact between test device equivalent circuit diagram.
Fig. 4 B be another embodiment of the present invention detecting element level in electrical contact between test device equivalent circuit diagram.
【Symbol description】
10：Radio communication device
20：Element under test
30：Subordinate's element
38：Upper earth lead
40：Holding wire
42：Lower earth lead
50：Measurement apparatus
55：Detecting element
55a：Upper grounded probe
55b：Signal probe
55c：Lower grounded probe
100、200：Test device between level
110、210：Upper plate
120、220：Intermediary layer
122、222：Conducting resinl
123：Convex portion
124、224：Earth plate
126、226：Substrate layer
128、228：Metallic plate
130、230：Lower plate
ACT：Air chamber
CL：Lower connecting pole
CS：Signal connecting pole
CU：Upper connecting pole
PG1：First earthing pole
PG2：Second earthing pole
PG3：3rd earthing pole
PG4：4th earthing pole
PLS：Lower plate pickup electrode
PUS：Upper plate pickup electrode
R1、R11：First block
R2、R22：Second block
TG1：First earth terminal
TG2：Second earth terminal
TG3：3rd earth terminal
TG4：4th earth terminal
TNS：Subordinate's signal end
TTS：Measured signal end
HL：Lower perforation
HS：Signal perforation
HU：Upper perforation
Z1：Air impedance
Z2：Adjust impedance
ZCT：Impedance adjusts chamber
Zt：Impedance measurement
Specific embodiment
Hereinafter, various example embodiments of the invention will be illustrated to describe the present invention in detail by schema.But, this
Inventive concept may embody in many different forms, and should not be construed as limited by exemplary embodiment set forth herein.
In addition, in schema, same reference numbers may be used to represent similar element.
First, refer to Figure 1A and Figure 1B, Figure 1A be one embodiment of the invention radio communication device schematic diagram.Figure 1B
Be one embodiment of the invention level between element under test in test device test wireless communication device schematic diagram.
As illustrated in figures ia and ib, radio communication device 10 have element under test 20, subordinate's element 30, upper earth lead 38,
Holding wire 40, and lower earth lead 42.Element under test 20 respectively by upper earth lead 38, holding wire 40, and lower earth lead 42 it is electric
It is connected to subordinate's element 30.In the present embodiment, element under test 20 is certain element in radio communication device, and is electrically connected with
Previous stage element (is not plotted in schema).And the next stage element then for element under test 20 of subordinate's element 30.If user is intended to examine
The situation of element under test 20 is surveyed, test device 100 between the level of the present embodiment can be arranged on element under test 20 and subordinate by user
Between element 30 (will between level test device 100 be arranged on earth lead 38, holding wire 40, and lower earth lead 42 on), such as scheme
Shown in 1B.Certainly, if the situation of user subordinate's element to be detected 30, user can be by test device between the level of the present embodiment
100 are arranged between subordinate's element 30 and its next stage element.For convenience of explanation, next will be with test device between level
100 are arranged between element under test 20 and subordinate's element 30, and detect the situation of element under test 20 to explain.
Then, please also refer to Fig. 2A, Fig. 2A be one embodiment of the invention level between test device exploded view.Such as Fig. 2A
It is shown, element under test 20 respectively by upper earth lead 38, holding wire 40, and lower earth lead 42 electrically connect subordinate element 30.Between level
Test device 100 includes upper plate 110, middle-class 120 and lower plate 130.First earthing pole PG1 of lower plate 130 is by above connecing
The 3rd earth terminal TG3 of the first earth terminal TG1 and subordinate's element 30 of the electrical connection element under test 20 of ground wire 38.Under lower plate 130
Partitioned signal pole PLS electrically connects subordinate's signal of the measured signal end TTS and subordinate's element 30 of element under test 20 by holding wire 40
End TNS.And the second earthing pole PG2 of lower plate 130 then electrically connects the second earth terminal TG2 of element under test 20 by lower earth lead 42
And the 4th earth terminal TG4 of subordinate's element 30.And intermediary layer 120 is then located between upper plate 110 and lower plate 130.So that surveying between level
Test knot between the level of 100 formation dual-port ground-signal-grounds (Ground-Signal-Ground, abbreviation GSG) is put in trial assembly
Structure.In the present embodiment, the first earthing pole PG1, lower plate pickup electrode PLS and the second earthing pole PG2 are may be provided in lower plate 130,
With respectively with upper earth lead 38, holding wire 40, and lower earth lead 42 electrically connect, as shown in Figure 2 A.Or first earthing pole
PG1, lower plate pickup electrode PLS and the second earthing pole PG2 can arrange and be exposed to the bottom of lower plate 130, to facilitate and upper earth lead
38th, holding wire 40, and lower earth lead 42 (not being plotted in Fig. 2A) in electrical contact.And the first earthing pole PG1, lower plate pickup electrode PLS,
Two earthing pole PG2 and upper earth lead 38, holding wire 40, and the setting relation of lower earth lead 42 also can set according to actual situation
Meter, the present invention are not restricted to this.
Therefore, user can measure element under test 20 using test device 100 between external test device electrical connection level
Current situation.For example, external test arrangements be electrically connected to lower plate 130 the first earthing pole PG1, lower plate pickup electrode PLS and
Second earthing pole PG2 come measure element under test 20 whether have flaw or damage (not being plotted in Fig. 2A).Again for example, upper plate 110 has
There are three contact poles, and three contact poles are respectively electrically connected to the first earthing pole PG1, lower plate pickup electrode PLS and the second ground connection
Pole PG2 so that whether three contacts of the accessible upper plate 110 of external test arrangements extremely have flaw or ruin measuring element under test 20
Damage (not being plotted in Fig. 2A), the present invention is not restricted to this.Additionally, in the present embodiment, upper plate 110 and lower plate 130 are
Printed circuit board (PCB) (printed circuit board, abbreviation PCB).Intermediary layer 120 is isolation material, and preferably plastics material
Matter, the present invention are not restricted to this.
Come again, please also refer to Fig. 2 B, intermediary layer 120 includes the first block R1 and the second block R2, and the first block
R1 adjacent second zones block R2.In the present embodiment, the area equation of the first block R1 and the second block R2, unnecessary to avoid
Stray capacitance produce and affect level between test device 100 testing result.And if stray capacitance is too small to ignoring, no
The impact of stray capacitance need to be considered so that the area of the first block R1 and the second block R2 need not be equal, the present invention is not
This is restricted.
First block R1 has air chamber ACT, and air chamber ACT contact lower plates 130 to produce air impedance.In this enforcement
In example, air impedance is set as 50 ohm so that the signal between level in test device 100 is less susceptible to interact.Certainly, air
Impedance also may be set to other fixed values, and this is not restricted for the present invention.There is second block R2 impedance to adjust chamber ZCT, and
Impedance adjusts chamber ZCT contact lower plates 130.Impedance adjust chamber ZCT in have conducting resinl 122, earth plate 124, substrate layer 126, and
Metallic plate 128.Conducting resinl 122 is connect earth plate 124 is electrically connected the first earthing pole PG1 and second in lower plate 130
Earth polar PG2.And then sequentially fold on conducting resinl 122 and be provided with earth plate 124, substrate layer 126, and metallic plate 128.Substrate layer 126 is
Substrate with a predetermined thickness, adjusts impedance to produce according to predetermined thickness.Therefore, between level, test device 100 can basis
Fixed air impedance and regulation impedance form an equiva lent impedance.
In the present embodiment, conducting resinl 122 is arranged on around the second block R2, and is not provided with neighbouring first block R1
Part, " ㄈ " font as shown in Figure 2 B.And earth plate 124 it is identical with the shape of conducting resinl 122 (i.e. earth plate 124 with it is conductive
The shape of glue 122 is " ㄈ " font), and earth plate 124 is electrically connected to the first earthing pole PG1 and second by conducting resinl 222
Earthing pole PG2, but earth plate 124 will not be electrically connected to lower plate pickup electrode PLS, to reduce earth plate 124 and conducting resinl 122
Impact is connected electrically in the holding wire 40 of lower plate pickup electrode PLS.Certainly, the shape of earth plate 124 and conducting resinl 122 is alternatively which
He plants pattern, and the present invention is not restricted to this.
Here, the first earthing pole PG1 and the second earthing pole PG2 are may be designed as with lower plate pickup electrode PLS in lower plate 130
Different Plane so that when earth plate 124 may be electrically connected to the first earthing pole PG1 and the second earthing pole PG2, but will not electrically connect
To lower plate pickup electrode PLS.Or the shape of conducting resinl 122 may be configured as not reaching lower plate pickup electrode PLS (e.g., conducting resinls
The convex portion 123 of 122 " ㄈ " font is designed as the scope arranged beyond the lower plate pickup electrode PLS of lower plate 130), the present invention is not
This is restricted.Lower plate 130, conducting resinl 122, earth plate 124, substrate layer 126, metallic plate 128, intermediary layer 120, and upper plate
Then utilized chip adhesive agent engagement between 210, and person of an ordinary skill in the technical field should know the material of chip adhesive agent
Matter and operational mode, therefore will not be described here.
Additionally, in the present embodiment, earth plate 124 is to be arranged in parallel with metallic plate 128 so that earth plate 124, substrate layer
126th, and between metallic plate 128 capacitance is formed, and produces regulation impedance accordingly.As capacitance is inversely proportional to impedance.Cause
This, if the predetermined thickness of substrate layer 126 is thicker, adjusting impedance will be bigger.Similarly, if the predetermined thickness of substrate layer 126 is thinner,
Adjusting impedance will be less.Certainly, adjust impedance also to adjust using the material of change substrate layer 126.In the present embodiment,
Substrate layer 126 is glass fibre material (abbreviation FR4), and alternatively other materials, the present invention are not restricted to this.
Therefore, user can design the predetermined thickness of substrate layer 126 to produce tune according to the working band of element under test 20
Section impedance so that test device 100 is formed according to the regulation impedance after fixed air impedance and design and meets to be measured between level
The equiva lent impedance of the working band of element 20.And then test dress between test device electrical connection level of the user using outside can be provided
Put 100 situations current to measure element under test 20.
Next, please also refer to Fig. 3 A and Fig. 3 B.Fig. 3 A be another embodiment of the present invention level between test device point
Xie Tu.Fig. 3 B be another embodiment of the present invention level between test device side view.As shown in Fig. 3 A and Fig. 3 B, test dress between level
200 are put comprising upper plate 210, intermediary layer 220, lower plate 230, upper connecting pole CU, signal connecting pole CS and lower connecting pole CL.And
Level between test device 200 about upper plate 210, intermediary layer 220, and the structure and annexation and level of lower plate 230 between test dress
Put 100 about upper plate 110, intermediary layer 120, and the structure of lower plate 130 it is roughly the same with annexation.
It is that upper plate 210 has the 3rd earthing pole PG3, upper plate pickup electrode PUS and the 4th earthing pole where difference
PG4.Lower plate 230 has the first earthing pole PG1, lower plate pickup electrode PLS and the second earthing pole PG2.And intermediary layer 220 is also
With upper perforation HU, signal perforation HS and lower perforation HL, to extend through intermediary layer 220.3rd earthing pole PG3 is by above passing through
Hole HU is correspondingly arranged with the first earthing pole PG1, and in upper connecting pole CU insertions perforation HU with electrically connect the 3rd earthing pole PG3 and
First earthing pole PG1.Upper plate pickup electrode PUS is correspondingly arranged with lower plate pickup electrode PLS by signal perforation HS, and signal connecting pole
CS inserts signal perforation HS to electrically connect upper plate pickup electrode PUS and lower plate pickup electrode PLS.4th earthing pole PG4 is passed through under passing through
Hole HL is correspondingly arranged with the second earthing pole PG2, and the lower perforation HL of lower connecting pole CL insertions with electrically connect the 4th earthing pole PG4 and
Second earthing pole PG2.
In the present embodiment, upper perforation HU, the signal perforation HS and lower perforation HL of intermediary layer 220 is to be arranged on the firstth area
In block R11.Second block R22 of intermediary layer 220 is provided with conducting resinl 222, earth plate 224, substrate layer 226, and metallic plate
228.And about the corresponding relation between the first block R11 and the second block R22 generally with the first block R1 and the second block
Corresponding relation between R2 is identical.In addition, conducting resinl 222, earth plate 224, substrate layer 226, and metallic plate 228 structure with
Annexation also generally with conducting resinl 122, earth plate 124, substrate layer 126, and metallic plate 128 structure and annexation
It is identical.Therefore here does not remake and repeats.
Next, user can utilize 55 level in electrical contact of detecting element between test device 200 the 3rd earthing pole PG3,
Upper plate pickup electrode PUS and the 4th earthing pole PG4, and detecting element 55 is electrically connected to into measurement apparatus 50, treated with further measuring
The current situation of element 20 is surveyed, as shown in Figure 3 B.In the present embodiment, detecting element 55 can be a probe, and detecting element 55
With upper grounded probe 55a, signal probe 55b and lower grounded probe 55c (i.e. one probe corresponds to three probes).On
Grounded probe 55a the 3rd earthing pole PG3 in electrical contact.Signal probe 55b upper plate pickup electrode PUS in electrical contact.Lower grounded probe
55c the 4th earthing pole PG4 in electrical contact.User is allowd to be electrically connected to level using the detecting element 55 in measurement apparatus 50
Between test device 200, and with test structure between the level of GSG measuring the situation of element under test 20.And detecting element 55 can also be according to
Change according to the project for being actually needed measurement element under test 20, the present invention is not restricted to this.
If in addition, test device 200 does not go up connecting pole CU, signal connecting pole CS and lower connecting pole CL between level.So that
3rd earthing pole PG3 is correspondingly arranged with the first earthing pole PG1 by upper perforation HU, but the 3rd earthing pole PG3 is not electrically connected
One earthing pole PG1.Upper plate pickup electrode PUS is correspondingly arranged with lower plate pickup electrode PLS by signal perforation HS, but upper plate pickup electrode
PUS is not electrically connected lower plate pickup electrode PLS.And the 4th earthing pole PG4 set by lower perforation HL is corresponding with the second earthing pole PG2
Put, but the 4th earthing pole PG4 is not electrically connected the second earthing pole PG2 (not being plotted in Fig. 3 A- Fig. 3 B).
User is also using upper grounded probe 55a by the earthing poles of perforation HU to first in the 3rd earthing pole PG3 insertions
PG1 so that the 3rd earthing pole PG3 electrically connects the first earthing pole PG1.Signal probe 55b is passed through by upper plate pickup electrode PUS insertion signals
Hole HS to lower plate pickup electrode PLS so that upper plate pickup electrode PUS electrically connect lower plate pickup electrode PLS, and lower grounded probe 55c by
The lower earthing pole PG2 of perforation HL to second of 4th earthing pole PG4 insertions so that the 4th earthing pole PG4 electrically connects the second earthing pole
PG2.Thereby, user can utilize the detecting element 55 in measurement apparatus 50 to be electrically connected to test device 200 between level then, and with
Between the level of GSG, test structure is measuring the situation (not being plotted in Fig. 3 A-3B) of element under test 20.
User is how using test device between level 200 measuring the situation of element under test 20 for convenience of explanation, below
With the air resistance between the detecting element 55 of measurement apparatus 50 level not in electrical contact during test device 200, between level in test device 200
Anti- and regulation impedance design is 50 ohm；And test device 200 between 55 level in electrical contact of detecting element of measurement apparatus 50
When, the air impedance between level in test device 200 is designed as 50 ohm and adjusts impedance design for 24 ohm to explain.Cause
This, measurement apparatus 50 can will further measure the situation of the element under test 20 for being operated in 2.4Ghz/5Ghz ISM bands.
As shown in fig. 4 a and fig. 4b, Fig. 4 A be another embodiment of the present invention detecting element level not in electrical contact between test dress
The equivalent circuit diagram put.Fig. 4 B be another embodiment of the present invention detecting element level in electrical contact between test device equivalent circuit
Figure.When detecting element 55 is not had electrical contact to test device 200 between level by user, the equivalent electric of test device 200 between level
One end electrical connection of air impedance Z1 is adjusted road figure one end of impedance Z 2, and the other end of air impedance Z1 electrically connects letter to be measured
Number end TTS (being electrically connected to element under test 20), and the other end for adjusting impedance Z 2 is then electrically connected to subordinate signal end TNS (i.e.
It is electrically connected to subordinate's element 30).Air impedance Z1 and adjust impedance Z 2 and be 50 ohm of (test devices 200 between i.e. whole level
Equiva lent impedance be 50 ohm), as shown in Figure 4 A.
And work as user and detecting element 55 is had electrical contact to into test device 200 between level, and Impedance measurement Zt is provided for 50
During ohm (i.e. identical with air impedance Z1), upper grounded probe 55a electrically connects the first earthing pole PG1 by the 3rd earthing pole PG3,
Signal probe 55b electrically connects lower plate pickup electrode PLS, and lower grounded probe 55c by the 4th ground connection by upper plate pickup electrode PUS
Pole PG4 electrically connects the second earthing pole PG2 (not being plotted in Fig. 4 B).
Now, between level, the equivalent circuit diagram of test device 200 adjusts impedance Z 2 for one end electrical connection of air impedance Z1
One end.Other end electrical connection measured signal end TTS (being electrically connected to element under test 20) of air impedance Z1 and Impedance measurement
One end of Zt.The other end of Impedance measurement Zt is electrically connected to upper plate pickup electrode PUS, to be electrically connected to outside by detecting element 55
Measurement apparatus 50.And the other end for adjusting impedance Z 2 is then grounded and (adjusts and be equivalent to out between impedance Z 2 and subordinate's element 30
Road).Now, air impedance is still 50 ohm, but regulation impedance will be changed into 24 ohm by 50 ohm and (test dress between i.e. whole level
The equiva lent impedance for putting 200 is 24/50 ohm), as shown in Figure 4 B.
Then, the current situation of the then signal exported by measurable element under test 20 of measurement apparatus 50.For example, just
In the case of often, element under test 20 should export the signal of 15dBm.If measurement apparatus 50 measure the signal of 15dBm, unit to be measured is represented
Element of the part 20 for normal operation.And if measurement apparatus 50 measure the signal of 10dBm, represent element under test 20 for flaw or
The element of damage.Now, user then can by problematic element under test 20 be replaced by can normal operation element under test 20.
In sum, between the level provided by the embodiment of the present invention, test device can detect that element in radio communication device
Situation, and change when between level, test device detects the element of flaw or damage.Thereby, user only needs to change wireless
There is the element of flaw or damage in communicator without abandoning whole radio communication device, manufacturing cost can be made significantly
Reduce.
Embodiments of the invention are the foregoing is only, which simultaneously is not used to limit to the scope of the claims of the present invention.
Claims (10)
1. test device between a kind of level of radio communication device, the radio communication device have an element under test, are grounded on one
Line, once a holding wire, earth lead and subordinate's element, the element under test pass through the upper earth lead, the letter respectively
Number line and the lower earth lead electrically connect subordinate's element, it is characterised in that between the level, test device is included：
One upper plate；
One lower plate, one first earthing pole of the lower plate electrically connect the one first of the element under test by the upper earth lead and connect
One the 3rd earth terminal of ground terminal and subordinate's element, the pole of partitioned signal once of the lower plate electrically connect institute by the holding wire
State a measured signal end of element under test and subordinate's signal end of subordinate's element, and one second earthing pole of the lower plate
One the 4th earth terminal of one second earth terminal and subordinate's element of the element under test is electrically connected by the lower earth lead；
And
One intermediary layer, is arranged between the upper plate and the lower plate, and the intermediary layer includes one first block and one second
Block, adjacent to second block, first block has an air chamber to first block, and the air chamber with it is described
To produce an air impedance, there is second block impedance to adjust chamber for lower plate contact, and the impedance adjust chamber with it is described
Lower plate is contacted；
Wherein, the impedance has a conducting resinl, an earth plate, a substrate layer and a metallic plate, the conducting resinl in adjusting chamber
It is arranged in the lower plate, the earth plate is electrically connected first earthing pole and second earthing pole, and institute
State sequentially to fold on conducting resinl and be provided with the earth plate, the substrate layer and the metallic plate, the substrate layer is with a predetermined thickness
Degree, adjusts impedance to produce one according to the predetermined thickness.
2. test device between the level of radio communication device according to claim 1, it is characterised in that the upper plate has
3rd earthing pole, a upper plate pickup electrode and one the 4th earthing pole, the intermediary layer also with perforation on, a signal perforation and
Once perforation, the 3rd earthing pole are arranged in correspondence with first earthing pole by the upper perforation, the upper partitioned signal
Pole is arranged in correspondence with the lower plate pickup electrode by the signal perforation, and the 4th earthing pole passes through the lower perforation and institute
State the second earthing pole to be arranged in correspondence with.
3. test device between the level of radio communication device according to claim 1, it is characterised in that the conducting resinl is located at
Around second block, and the conducting resinl is not disposed at the position of neighbouring first block.
4. test device between the level of radio communication device according to claim 3, it is characterised in that the shape of the earth plate
Shape is identical with the shape of the conducting resinl.
5. test device between the level of radio communication device according to claim 2, it is characterised in that test dress between the level
Put, the upper connecting pole inserts the upper perforation to electrically connect
3rd earthing pole and first earthing pole, the signal connecting pole insert the signal perforation to electrically connect on described
Partitioned signal pole and the lower plate pickup electrode, the lower connecting pole insert the lower perforation with electrically connect the 4th earthing pole with
And second earthing pole.
6. test device between the level of radio communication device according to claim 5, it is characterised in that test dress between the level
Put also comprising a detecting element, the detecting element is with grounded probe on, a signal probe and once grounded probe, institute
State grounded probe the 3rd earthing pole in electrical contact, the signal probe upper plate pickup electrode in electrical contact, it is described under
Grounded probe the 4th earthing pole in electrical contact.
7. test device between the level of radio communication device according to claim 1, it is characterised in that the intermediary layer be by
First block and second block composition, and the area phase of the area of first block and second block
Deng.
8. test device between the level of radio communication device according to claim 1, it is characterised in that test dress between the level
The equiva lent impedance put is formed according to the air impedance and the regulation impedance.
9. test device between the level of radio communication device according to claim 1, it is characterised in that the intermediary layer is
Isolation material.
10. test device between the level of radio communication device according to claim 1, it is characterised in that the substrate layer is
One glass fibre material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410009133.5A CN104767572B (en) | 2014-01-08 | 2014-01-08 | Interstage tester of wireless communication device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410009133.5A CN104767572B (en) | 2014-01-08 | 2014-01-08 | Interstage tester of wireless communication device |
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| CN104767572A CN104767572A (en) | 2015-07-08 |
| CN104767572B true CN104767572B (en) | 2017-04-12 |
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| JP2008227286A (en) * | 2007-03-14 | 2008-09-25 | Sanyo Electric Co Ltd | Semiconductor device and method of manufacturing the same |
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| CN101581744A (en) * | 2008-05-15 | 2009-11-18 | 京元电子股份有限公司 | Device and method for detecting testing environment of circuit |
| CN101839961A (en) * | 2009-03-19 | 2010-09-22 | 广达电脑股份有限公司 | Test system and method |
| CN103281144A (en) * | 2013-06-03 | 2013-09-04 | 深圳市双赢伟业科技股份有限公司 | Method for testing wireless performance of wireless product |
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