CN105319476B - Printed base plate check device and inspection method - Google Patents
Printed base plate check device and inspection method Download PDFInfo
- Publication number
- CN105319476B CN105319476B CN201510445458.2A CN201510445458A CN105319476B CN 105319476 B CN105319476 B CN 105319476B CN 201510445458 A CN201510445458 A CN 201510445458A CN 105319476 B CN105319476 B CN 105319476B
- Authority
- CN
- China
- Prior art keywords
- probe
- base plate
- printed base
- conductive pattern
- constant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
Abstract
The present invention provides a kind of printed base plate check device, it is the electric checkup apparatus of printed base plate, applies electric signal to the conductive pattern for being formed at printed base plate, checks whether conductive pattern is good, wherein, which has：1st probe, its end thereof contacts with conductive pattern；2nd probe, it configures the other end in conductive pattern via insulator；Constant-current source；1st attachment device, it is used to the 1st probe being connected with constant-current source；2nd attachment device, it is used to make the 2nd probe relative to the status of electrically connecting of the reference potential of constant-current source change；And measuring circuit, it is used to measure current potential of the 1st probe relative to the reference potential of constant-current source.
Description
Technical field
The device and inspection method checked the present invention relates to the electric state of the conductive pattern to printed base plate.
The application based on July 29th, 2014 Japanese publication Patent 2014-153493 CLAIM OF PRIORITYs, and
This quotes its content.
Background technology
In the case where checking electric states such as the broken strings of the conductive pattern of printed base plate, usually inspection is set to pop one's head in
Checking is carried out with two end in contact of conductive pattern, still, an end occasionally there are conductive pattern is covered by dielectric film
The situation of lid or situation formed with touch panel etc. etc., can not will check that probe directly be contacted with conductive pattern.As above
In the case of described, as described in 2 disclosure of patent document 1 and patent document, make inspection probe non-with conductive pattern
Checked in the state of contact.
Patent Document 1 discloses following technologies, i.e. in the inspecting substrate used for flexible printed board etc.,
Probe is contacted respectively with the check object electrode group of the side of conductive pattern, non-contact sensor is closely configured and is led at this
At the check object electrode group of the opposite side of body pattern, by the non-contact sensor, caught for check object electrode faint
Electromagnetic field (or electromagnetic wave), judge whether each conductive pattern good, for example whether occurring breaking.
Patent Document 2 discloses following technologies, i.e. makes probe electric with multiple conductive patterns on printed base plate respectively
Connection, implements capacitive coupling with multiple conductive patterns in a non-contact manner by the sensor being detected to inspection signal, according to
It is secondary that there is electric signal jumpy to probe input, by the maximum of the transient current of flows through sensor, judge conductor figure
The conducting state of case.
Patent document 1：No. 2994259 publications of Japanese Patent Publication No.
Patent document 2：No. 3361311 publications of Japanese Patent Publication No.
But in the method described in any of the above-described a patent document, detect the probe of electric signal all with conductor figure
The non-contacting mode of case configures, and is not contacted with conductive pattern directly, accordingly, it is possible to which signal can not be detected reliably.
The content of the invention
The present invention in view of as described above situation and propose, its purpose is to provide make the spy of detection electric signal
In the state of head is directly contacted with conductive pattern, signal, the printed base plate that can be accurately checked can be reliably detected
Check device and inspection method.
The printed base plate check device of the present invention is the electric checkup apparatus of printed base plate, is led to being formed at printed base plate
Body pattern applies electric signal, checks whether conductive pattern is good, which has：1st probe, its with it is described
The end thereof contacts of conductive pattern；2nd probe, it configures the other end in the conductive pattern via insulator；Constant-current source；The
1 attachment device, it is used to the described 1st probe being connected with the constant-current source；2nd attachment device, it is used to make the 2nd probe
Status of electrically connecting relative to the reference potential of the constant-current source changes；And measuring circuit, it is used to measure the 1st probe
Relative to the current potential of the reference potential of the constant-current source.
Moreover, the printed base plate inspection method of the present invention makes end thereof contacts of the 1st probe directly with conductive pattern, described
The other end of conductive pattern configures the 2nd probe via insulator, in moment T1, starts from constant-current source to the described 1st probe stream
Overcurrent, T2 at the time of have passed through from moment T1 after defined time t12, makes the 2nd probe relative to the constant-current source
Reference potential status of electrically connecting change, the 1st probe during according to the change relative to the constant-current source benchmark electricity
The measurement result of the current potential of position, judges whether the conductive pattern is good.
In the printed base plate inspection method, in the described 2nd probe being electrically connected relative to the reference potential of the constant-current source
State is connect there occurs during change, can be occurred in the potential change amount of one end of the conductive pattern of every regulation unit interval tu
In the case of change, to be determined as conductive pattern be certified products.
In the present invention, the end thereof contacts of the 1st probe and conductive pattern are made, the 2nd probe is configured via insulator is leading
The other end of body pattern, makes the status of electrically connecting change of the 2nd probe side and the current potential of the 1st probe is measured.That is, due to
The electric signal of 1st probe of the detection in the state of being contacted with conductive pattern, therefore, it is possible to reliably detect the electric signal,
It can implement accurate inspecting substrate.
In this case, for configuring the insulator at the other end of the conductive pattern of printed base plate, in conductive pattern
The other end expose to the surface of printed base plate in the case of, can will suitably the configuration of ready insulator in conductive pattern
The other end on, still, in the case where the other end of conductive pattern is covered by dielectric film, can using the dielectric film as insulation
Body, the 2nd probe is configured at the dielectric film.
In addition, the 2nd attachment device can be connected or disconnected relative to the reference potential of constant-current source by making the 2nd to pop one's head in,
The connection status of the 2nd probe is set to change.
In addition, the 1st probe and the 2nd probe are configured in a surface side of printed base plate sometimes, configure sometimes in printed base plate
Reciprocal face.
The present invention printed base plate check device in, can the described 2nd probe the 2nd attachment device between or
Certain one between 2nd probe and the reference potential of the constant-current source or both be connected with defined
The capacitor of capacitance.
The potential change amount of the 1st probe side by the presence of capacitor, can be made to become larger, can implement more accurately to examine
Look into.
In the printed base plate check device of the present invention, it is configured to that there is the 3rd attachment device, the 3rd attachment device
For the described 1st probe to be connected via the 1st attachment device with the reference potential of the constant-current source.
In the printed base plate inspection method of the present invention, the described 1st can also be popped one's head in and the constant-current source in moment T3
Reference potential connection, moment T4 make it is described 1st probe and the reference potential become off-state, moment T3 is than institute
State moment T1 in advance as defined in time t31 at the time of, moment T4 is by defined time t14 and in institute from the moment T1
At the time of stating before moment T2.
It can make to be carried in wiring part etc. by being connected the 1st probe with reference potential before the measurement of current potential
Charge discharge, eliminate powered influence, it is promptly real further, it is possible to make the electric current from constant-current source stablize in a short time
Apply accurate inspection.
Can also be configured in the printed base plate check device of the present invention, make via insulation board and with the printed base plate
The conductor plate of conductive pattern contact be connected to the reference potential of the constant-current source.
It can also check whether the 1st probe is good relative to the contact condition of conductive pattern, the 1st probe can be made with leading
In the state of body pattern reliably contacts, implement accurately to check.
In this case, for insulation board, the ready insulation board independently of printed base plate can be used, still, such as
Fruit is the part covered on the surface of printed base plate by dielectric film, then can using the dielectric film as insulation board, make its upper part with
Conductor plate contacts.
The effect of invention
According to the present invention, checked in the state of the probe of detection electric signal is directly contacted with conductive pattern, therefore,
Signal can be reliably detected, can accurately be checked.
Brief description of the drawings
Fig. 1 is the block diagram of the general configuration for the 1st embodiment for representing printed base plate check device according to the present invention.
Fig. 2 is represented in the printed base plate check device of Fig. 1, for the side view of the distribution state of printed base plate.
Fig. 3 is the flow chart for representing the printed base plate inspection method in the 1st embodiment.
Fig. 4 is represented in the 1st embodiment, in the case where conductive pattern is certified products the 1st probe current potential with
The electric characteristic figure of the change of time.
Fig. 5 is represented in the 1st embodiment, the current potential of the 1st probe in the case where conductive pattern is defective work
The electric characteristic figure to change with time.
Fig. 6 is other electric characteristic figures in the case where conductive pattern is certified products in the 1st embodiment.
Fig. 7 is other electric characteristic figures in the case where conductive pattern is defective work in the 1st embodiment.
Fig. 8 is the block diagram of the general configuration for the 2nd embodiment for representing printed base plate check device according to the present invention.
Fig. 9 is represented in the printed base plate check device of Fig. 8, for the side view of the distribution state of printed base plate.
Figure 10 is the frame of the general configuration for the 3rd embodiment for representing printed base plate check device according to the present invention
Figure.
Figure 11 is represented in the printed base plate check device of Figure 10, for the side view of the distribution state of printed base plate.
Figure 12 is the frame of the general configuration for the 4th embodiment for representing printed base plate check device according to the present invention
Figure.
Figure 13 is represented in the printed base plate check device of Figure 12, for the side view of the distribution state of printed base plate.
Figure 14 is the flow chart for representing the printed base plate inspection method in the 4th embodiment.
Figure 15 is represented in the 4th embodiment, in the case where conductive pattern is certified products the 1st probe current potential with
The electric characteristic figure of the change of time.
Figure 16 is represented in the 4th embodiment, the current potential of the 1st probe in the case where conductive pattern is defective work
The electric characteristic figure to change with time.
Figure 17 is represented in the 4th embodiment, other electrical characteristics in the case where conductive pattern is certified products
Figure.
Figure 18 is represented in the 4th embodiment, and the others in the case where conductive pattern is defective work are electrically special
Property figure.
Figure 19 is the frame of the general configuration for the 5th embodiment for representing printed base plate check device according to the present invention
Figure.
Figure 20 is represented in the printed base plate check device of Figure 19, for the side view of the distribution state of printed base plate.
Figure 21 is the flow chart for representing the printed base plate inspection method in the 5th embodiment.
Figure 22 is represented in the 5th embodiment, in the case where conductive pattern is certified products the 1st probe current potential with
The electric characteristic figure of the change of time.
Figure 23 is represented in the 5th embodiment, the current potential of the 1st probe in the case where conductive pattern is defective work
The electric characteristic figure to change with time.
Figure 24 is represented in the 5th embodiment, other electrical characteristics in the case where conductive pattern is certified products
Figure.
Figure 25 is represented in the 5th embodiment, and the others in the case where conductive pattern is defective work are electrically special
Property figure.
Figure 26 is represented in the 5th embodiment, in the 1st probe relative to the electricity in the case of conductive pattern loose contact
Gas performance plot.
Figure 27 is represented in the 5th embodiment, in the 1st probe relative to its in the case of conductive pattern loose contact
His electric characteristic figure.
Figure 28 is the block diagram of the structure for the 6th embodiment for representing printed base plate check device according to the present invention.
Figure 29 is represented in the printed base plate check device of Figure 28, for the side view of the distribution state of printed base plate.
Figure 30 is the block diagram of the structure for the 7th embodiment for representing printed base plate check device according to the present invention.
Figure 31 is represented in the printed base plate check device of Figure 30, for the side view of the distribution state of printed base plate.
The explanation of label
1 ... printed base plate, 2 ... insulating layers, E1~E4 ... conductive patterns, 11 ... printed base plate check devices, 12 ... constant currents
Source, 13 ... insulators, 14 ... the 1st attachment devices, 15 ... the 2nd attachment devices, 16 ... measuring circuits, 17 ... constant-current source control units,
18 ... attachment device control units, 19 ... A/D transformation components, 20 ... potential measurement portions, 21 ... main control units, 22 ... display devices,
23 ... the 3rd attachment devices, 25 ... conductor plates, P1~P4 ... the 1st pop one's head in, and P5~P8 ... the 2nd pops one's head in, A1~A4 ... switching switches,
B1~B4 ... switching switches, C1~C4 ... capacitors, C5~C8 ... capacitors, S ... switching switches, 31,41,51 ... printed base plates
Check device.
Embodiment
In the following, referring to the drawings, illustrate embodiments of the present invention.
[on printed base plate]
In following embodiment, for the printed base plate 1 as check object, in the table of flat insulating layer 2
Face has been internally formed various conductive pattern E1~E4.Insulating layer 2 is sometimes individual layer, is made of sometimes multilayer.In insulating layer 2
In the case of being made of multilayer, conductive pattern E1~E4 also has multi-ply construction, by via hole or through hole levels it
Between connect.Moreover, the both ends (electrode portion) of each conductive pattern E1~E4 are arranged on the surface of insulating layer 2.In this case, sometimes
The both ends of conductive pattern E1~E4 be arranged at printed base plate 1 one side or another side in one party, be provided separately sometimes
On two sides.In addition, at least one end of conductive pattern E1~E4 is exposed to the surface of printed base plate 1.Another end is sometimes
Expose the state for the surface of printed base plate 1, being formed and being covered by dielectric film sometimes.
In following embodiment shown in the drawings of printed base plate 1 for such as lower structure, i.e. in the top surface of insulating layer 2
The both ends for forming conductive pattern E1~E4, each conductive pattern E1~E4 are exposed independent to the surface of the insulating layer 2 of printed base plate 1.
[the 1st embodiment]
As shown in Figure 1 and Figure 2, the printed base plate check device 11 in the 1st embodiment leads the multiple of printed base plate 1
Body pattern E1~E4 is checked that the printed base plate check device 11 has：Constant-current source 12, electric current as defined in its generation；It is multiple
1st probe P1~P4, an end of their each conductive pattern E1~E4 with exposing to printed base plate 1 respectively directly connects
Touch；Multiple 2nd probe P5~P8, they are contacted via insulator 13 with another end of conductive pattern E1~E4 respectively；
1st attachment device 14, its have be used for by each 1st probe P1~P4 be connected respectively with constant-current source 12 multiple switching switch A1~
A4；2nd attachment device 15, it has reference potential (the typically grounded electricity being used for the 2nd probe P5~P8 and constant-current source 12
Position) multiple switching switch B1~B4 for connecting respectively；Measuring circuit 16, it is used to measure the 1st probe P1~P4 relative to constant current
The current potential of the reference potential in source 12；Constant-current source control unit 17, it is used to control constant-current source 12；Attachment device control unit 18, it is used
In each attachment device of control；A/D transformation components 19, it is connected with measuring circuit 16；Potential measurement portion 20；Main control unit 21, its
For controlling these control units and potential measurement portion；And display device 22.In main control unit set CPU, memory,
Check condition configuration par, check determination unit and the data communication section with each portion.
For the printed base plate check device 11, make what the slave insulating layer 2 of the 1st probe P1~P4 and printed base plate 1 exposed
One end of conductive pattern E1~E4 directly contacts, also, the 2nd probe P5~P8 is configured in conductive pattern via insulator 13
The other end of E1~E4.
As described above, another end of conductive pattern E1~E4 is exposed to the surface of printed base plate 1 sometimes, sometimes in
The state covered by dielectric film, in the case where exposing to the surface of printed base plate 1, the configuration the via appropriate insulator 13
2 probe P5~P8, in the case of the state that another end in conductive pattern E1~E4 is covered by dielectric film, pass through by
The dielectric film contacts the 2nd probe P5~P8 with the dielectric film, so as to be formed via insulator 13 as described insulator 13
And the state configured.In the example in the figures, the 2nd probe P5~P8 is configured in conductive pattern E1~E4 via insulator 13
End.
1st probe P1~P4 arranged as described above and the 2nd probe P5~P8, passes through cutting the 1st attachment device 14
Change switch A1~A4 in certain 1 be arranged to connection status so that, formed from constant-current source 12 to the 1st probe P1~P4 in certain 1
A state for flowing through electric current.Thus, to including the institute such as wiring part of the device of certain 1 conductive pattern in conductive pattern E1~E4
The capacitance electric power storage having, as a result, by being the measurement of measuring circuit 16 of connection status with some in the 1st probe P1~P4
Current potential (the 1st probe P1~P4 in some relative to constant-current source 12 reference potential current potential) rise.
Then, certain 1 conductor in switching switch B1~B4 of the 2nd attachment device 15, with being connected to constant-current source 12 is made
Certain 1 switching switch B1, B2, B3 or B4 action of pattern (selected conductive pattern) connection.If the conductor figure of selection
Case E1~E4 is normal, then due to the action of the 2nd attachment device 15, the current potential measured by measuring circuit 16 changes.Selecting
In the case that the conductive pattern E1~E4 selected breaks, even if acting the 2nd attachment device 15, measured by measuring circuit 16
Current potential will not change.The presence or absence of change that can be by detecting the current potential, so that selection is made in order in the above described manner
For certain 1 in conductive pattern E1~E4 of check object, identify whether selected conductive pattern E1~E4 is good.
By the flow chart of Fig. 3, which is described in detail.In the following description, by each of flow chart
The label of step mark, illustrates the content of each step.
Step S1：First, by end thereof contacts of the 1st probe P1~P4 directly with conductive pattern E1~E4.In addition, also by
2 probe P5~P8 configure the other end in conductive pattern E1~E4 via insulator 13.
Step S2：After two groups of probe P1~P4, P5~P8 are configured, at moment T1 (with reference to Fig. 4 etc.), the 1st is connected
Certain 1 in switching switch A1~A4 of device 14 is set to conducting state, from constant-current source 12 to the 1st probe P1~P4 in certain 1
It is a to flow through electric current.Thus, start pair with certain 1 in the conductive pattern E1~E4 for the 1st probe connection for being fed with electric current and
Capacitance charging possessed by some wiring part waited being fed with the 1st probe P1~P4 of electric current, measuring circuit 16 are surveyed
The current potential of amount rises.
Step S3：T2 at the time of have passed through from moment T1 after defined time t12, makes the switching of the 2nd attachment device 15
Switch in B1~B4, acted with conductive pattern E1, E2, E3 switching switch B1, B2, B3 or B4 that either E4 is connected of selection,
Make the connection status change of certain 1 reference potential relative to constant-current source 12 in the 2nd probe P5~P8.Become the connection status
Change refers to, when switching switch B1~B4 of the 2nd attachment device 15 is in OFF state, 1 in them is set to ON states,
Or when switching switch B1~B4 is in ON states, 1 in them is set to OFF state.
Step S4：According to the measurement result of measuring circuit 16, selected conductive pattern E1, E2, E3 or E4 are judged
Whether the potential change amount of the time per unit tu of one end is changed, and is being judged as the potential change amount of time per unit tu
In the case of there occurs change (situation of YES), into S5, in the potential change amount for not having to be judged as time per unit tu
In the case of change (situation of NO), into S8.
If illustrated by the electric characteristic figure of Fig. 4 and Fig. 5, as shown in figure 4, in the conductive pattern of selection
The T2 at the time of midway that the current potential of one end of E1, E2, E3 or E4 rises, potential change amount (electrical characteristic curve map it is oblique
Rate) there occurs change in the case of (potential change amount diminishes in Fig. 4), S5 is entered step, as shown in figure 5, in potential change
In the case that amount does not change, S8 is entered step.Potential change amount, which changes, to be referred to, the base with conductive pattern E1~E4
The opposite capacitance of quasi- current potential changes, and Fig. 4 illustrates the increased example of capacitance.
On the other hand, Fig. 5 represents, in moment T2, potential change also not to be confirmed even if the 2nd attachment device 15 is acted
Changed situation is measured, in situations as mentioned above, enters step S8.
In addition, the action for the 2nd attachment device 15, can select to switch according to the characteristic of check object substrate 1
Certain 1 in switch B1~B4 is switched to ON from OFF, or is switched to OFF from ON, as long as using the change for making potential change amount
The operating method to become larger.
Step S5：Judge will make the 2nd attachment device 15 act before, selected conductive pattern E1, E2, E3 or
Whether the current potential of one end of E4 reaches the open-circuit voltage V of constant-current source 120, it is being judged as reaching open-circuit voltage V0In the case of (YES
Situation), enter step S6, be not judged as reaching open-circuit voltage V0In the case of (situation of NO), enter step S7.
In the example shown in Fig. 4 and Fig. 5, at the time point of moment T2, current potential is not reaching to open-circuit voltage V0, but
It is that in the example shown in Fig. 6 and Fig. 7, before moment T2, current potential has just reached open circuit potential V0, as described above
In the case of, enter step S6.
Step S6：Judge the current potential of one end of selected conductive pattern E1, E2, E3 or E4 whether on descent direction
Changed, in the case where being judged as on descent direction there occurs variation (situation of YES), enter step S7, do not having
Have (situation of NO) in the case of being judged as changing on descent direction, enter step S8.
In figure 6, before moment T2, current potential has reached the open-circuit voltage V of constant-current source 120, due to the 2nd attachment device 15
Action, current potential instantaneously declines (that is, potential change amount is " 0 ", but current potential is along the direction change declined).As shown in Figure 6, such as
Fruit current potential declines, then enters step S7.If the capacitance variations opposite with the reference potential of conductive pattern E1~E4, current potential becomes
Change.Fig. 6 represents the increased example of capacitance.
On the other hand, even if as shown in fig. 7, being acted in the 2nd attachment device 15, current potential is not also from open-circuit voltage V0Place's hair
In the case of changing, S8 is entered step.
Step S7：Conductive pattern E1, E2, E3 or E4 of selection are determined as certified products.
Step S8：Conductive pattern E1, E2, E3 or E4 of selection are determined as defective work.
That is, if the potential change amount of the one end for conductive pattern E1~E4 that the 1st probe P1~P4 is directly contacted is due to warp
The action of the 2nd attachment device 15 of the 2nd probe P5~P8 sides of conductive pattern E1~E4 other ends is configured at by insulator 13
And change, then conductive pattern E1~E4 is certified products, in the case where potential change amount does not change, is judged as
The defective work formed due to broken string etc..
As noted previously, as potential measurement is being carried out with the 1st probe P1~P4 sides that conductive pattern E1~E4 is directly contacted,
Therefore, it is possible to reliably detect potential change amount, can implement accurately to check.
In addition, following examples is shown in the above-described first embodiment, i.e. by order by the 1st attachment device
Certain 1 closure in 14 switching switch A1~A4, selects certain 1 in conductive pattern E1~E4, makes the conductive pattern with selection
Case E1, E2, E3 either E4 connections switching switch B1, B2, B3 or B4 action so that, check selected conductive pattern one by one
The conducting state of case E1, E2, E3 or E4.It may also be following situations, i.e. by all switching switches of the 1st attachment device
A1~A4 is closed at, and then, is in order acted switching switch B1~B4 of the 2nd attachment device 15, is passed through measuring circuit 16
The change of detection current potential at this time, so that, the conducting state of conductive pattern E1, E2, E3 or E4 is checked one by one.In addition, also may be used
To be following situations, i.e. by order selecting certain 1 closure in switching switch A1~A4 of the 1st attachment device 14
Certain 1 in conductive pattern E1~E4, all switching switch B1~B4 of the 2nd attachment device 15 is acted at the same time every time, pass through
Measuring circuit 16 detects the change of current potential at this time, so that, the conducting state of conductive pattern E1, E2, E3 or E4 is checked one by one.
Alternatively, it is also possible to being following situations, i.e. checking whether conductive pattern E1~E4 of printed base plate 1 is entirely to close
In the case of lattice product, all switching switch A1~A4 of the 1st attachment device are closed at, then, make the 2nd attachment device 15
All switching switch B1~B4 are acted at the same time, and the change of current potential at this time is detected by measuring circuit 16.What described above
It is also identical for the 2nd~the 5th embodiment described below.
[the 2nd embodiment]
Fig. 8 and Fig. 9 represents the printed base plate check device 31 of the 2nd embodiment, in the printed base plate check device 31
In, it is respectively arranged between the 2nd probe P5~P8 and each switching switch B1~B4 of the 2nd attachment device 15 with defined electricity
Capacitor C1~C4 of appearance.
In the 2nd embodiment, other structures in addition are identical with the 1st embodiment, therefore, mark identical
Label simultaneously omits the description.In addition, the printed base plate inspection method that the printed base plate check device 31 of the 2nd embodiment is realized
It is identical with the situation of the 1st embodiment shown in Fig. 3, change with time state for the current potential of the 1st probe P1~P4, although
The differences such as its absolute value, still, identical with the situation of the 1st embodiment shown in Fig. 4~Fig. 7, therefore, the description thereof will be omitted.Afterwards
Similarly pair part identical with embodiment above marks identical label in each embodiment in face, simplifies explanation.
In the 1st embodiment, by comprising the possessed capacitance of the wiring part including stray capacitance in itself, producing the 2nd
The potential change during action of attachment device 15, still, can be by the 2nd probe P5~P8 and the in the 2nd embodiment
Capacitor C1~C4 with defined capacitance is set between 2 attachment devices 15, so that, increase acts the 2nd attachment device 15
When capacitance change, potential change amount can be made to become larger correspondingly, implement more accurately check.
[the 3rd embodiment]
Figure 10 and Figure 11 represents the printed base plate check device 41 of the 3rd embodiment, in the 2nd foregoing embodiment
In, the 2nd probe P5~P8 and the 2nd attachment device 15 each switching switch B1~B4 between be respectively arranged with capacitor C1~
C4, in contrast, in the printed base plate check device 41, in each switching switch B1~B4 of the 2nd attachment device 15 and constant current
Capacitor C5~C8 with defined capacitance is set respectively between the reference potential in source 12.These capacitors C5~C8 is only set
Position it is different from the 2nd embodiment, other structures are identical with the 2nd embodiment.
Thus, can be by being arranged on the 2nd attachment device 15 and the benchmark electricity of constant-current source 12 in the 3rd embodiment
Capacitor C5~C8 between position, so as to increase the change of capacitance when making the action of the 2nd attachment device 15, potential change quantitative change
Greatly, implement more accurately to check.
In addition it is also possible to it is following structures, i.e. combine the 2nd foregoing embodiment with the 3rd embodiment, the 2nd
Between each switching switch B1~B4 for P5~P8 and the 2nd attachment device 15 of popping one's head in and the 2nd attachment device 15 each switching switch
This two side sets capacitor C1~C4, C5~C8 respectively between the reference potential of B1~B4 and constant-current source 12.
[the 4th embodiment]
Figure 12 and Figure 13 represents the printed base plate check device 51 of the 4th embodiment.The printed base plate check device 51
It is such as lower structure, i.e. relative to the printed base plate check device 11 of the 1st embodiment, in the 1st attachment device 14 and constant-current source 12
Reference potential between set with switching switch S the 3rd attachment device 23.Other structures in addition and the 1st embodiment party
The situation of formula is identical.
The printed base plate inspection method that Figure 14 represents the printed base plate check device 51 using the 4th embodiment and realizes
Flow chart.In the flow chart, pair step identical with the flow chart of Fig. 3 marks identical label and simplifies explanation, with difference
The step of based on illustrate.
In addition, the change of the current potential of the 1st probe (one end of conductive pattern) is shown in Figure 15~Figure 18, these Figure 15~
Figure 18 is corresponding with Fig. 4~Fig. 7 of the 1st embodiment.
S11：T3 at the time of t31 is shifted to an earlier date than moment T1, conducting state is set to by the 3rd attachment device 23.Thus, the 3rd connects
The switching switch S of connection device 23 is in ON states, in the case where the wiring part of 14 grade of the 1st attachment device carries electric charge, by this
Electric charge discharges.
S12：In moment T4, the 3rd attachment device 23 is set to off-state (switching switch S is set to OFF), moment T4
It is that from moment T1 have passed through defined time t14 and at the time of before moment T2.By the 1st connection in the S2 earlier than the S12
Device 14 is set to conducting state, therefore, in the S12, by the way that the 3rd attachment device 23 is set to off-state so that start to
1st probe P1~P4 sides charging, as described in Figure 15~Figure 18, the current potential of the 1st probe P1~P4 sides rises.
Figure 15 and Figure 16 is when making the action of the 2nd attachment device 15, and the current potential of the 1st probe P1~P4 rises the state of midway
Situation, in the case of shown in Figure 15, change in moment T2 potential change amount, therefore enter S5, for shown in Figure 16
Situation, do not change in moment T2 potential change amount, therefore enter S8.
Figure 17 and Figure 18 is the electricity of one end of conductive pattern E1~E4 before it will act the 2nd attachment device 15
Position reaches the open-circuit voltage V of constant-current source 120Situation, in the situation for the decline for confirming current potential in moment T2 as shown in figure 17
Under, into S7, in the case where moment T2 current potential does not change, marching to S8 as shown in figure 18.
In the 4th embodiment, the 3rd attachment device 23 is provided with, thus in the capacitive part of wiring part etc.
In the case of powered, also inspection can be proceeded by, after it is discharged by the 3rd attachment device 23 therefore, it is possible to more accurate
Really measure the current potential of the 1st probe P1~P4.In addition, by the 3rd attachment device 23 that the 1st probe P1~P4 and benchmark is electric
In the state of the connection of position, the 1st attachment device 14 is connected, hereafter, the 3rd attachment device 23 is disconnected, therefore, it is possible to make from constant-current source
The value of the electric current of 12 conductor 801 pattern E1~E4 is stablized in a short time, can implement more rapidly to check.
[mode of texturing of the 4th embodiment]
Can using the printed base plate check device 51 of the 4th embodiment shown in Figure 12 and Figure 13 as basic structure,
On this basis, in a manner of the 2nd embodiment shown in Fig. 8 and Fig. 9, in the 2nd probe P5~P8 and the 2nd attachment device 15
Each switching switch B1~B4 between capacitor C1~C4 is set respectively.
Alternatively, it is also possible in a manner of the 3rd embodiment shown in Figure 10 and Figure 11, in each of the 2nd attachment device 15
Capacitor C5~C8 is respectively configured between the reference potential of switching switch B1~B4 and constant-current source 12.
Alternatively, it is also possible to configure both capacitor C1~C4, C5~C8.
No matter which kind of situation, potential change amount can be made to become larger by setting capacitor C1~C4 or C5~C8, it is real
Apply more accurate inspection.
[the 5th embodiment]
Figure 19 and Figure 20 represents the printed base plate check device 61 of the 5th embodiment.In the printed base plate check device
In 61, the 1st probe P1~P4 and via insulation for directly being contacted except one end of conductive pattern E1~E4 with printed base plate 1
Body 13 and configure beyond the 2nd probe P5~P8 of the other end of conductive pattern E1~E4, also there is benchmark with constant-current source 12
The conductor plate 25 of current potential connection.Moreover, in the example shown in the Figure 19 and Figure 20, the 1st probe P1~P4 and the 2nd probe
P5~P8 is configured to be contacted in a surface side of printed base plate 1, conductor plate 25 with the insulating layer 2 of the another side of printed base plate 1, and with
The reference potential connection of constant-current source 12.In this case, conductor plate 25 is formed to whole with the insulating layer of printed base plate 12
The size of a face contact, but be at least formed to via insulating layer 2 and with conductive pattern E1~E4's as check object
A part of opposite size.
As " on printed base plate ", column is illustrated as the aforementioned, it is disposed at the both ends of conductive pattern E1~E4
In the case of the two sides of printed base plate 1, the 2nd probe P5~P8 is configured at via insulating layer in the side identical with conductor plate 25
At the position for avoiding conductor plate 25.
Flow chart in the case of carrying out inspecting substrate by the printed base plate check device 61 is as shown in figure 21, in inspection
In initial preparation, passed through by end thereof contacts of the 1st probe P1~P4 directly with conductive pattern E1~E4, the 2nd probe P5~P8
By insulator 13, configuration configures conductor in the other end of conductive pattern E1~E4 on the face of the insulating layer 2 of printed base plate 1
Plate 25 (S15) is in addition, identical with the S2 of the flow chart of Fig. 3 and its later step.
By configuring the conductor plate 25, thus, if the 1st attachment device 14 is set to conducting state in moment T1, from perseverance
Electric current (S2) is flowed through in stream source 12 to the 1st probe P1~P4, then to being present in the electricity between conductive pattern E1~E4 and conductor plate 25
Capacity charge, the current potential that measuring circuit 16 is detected rise.Then, the 2nd attachment device 15 is acted in moment T2, makes the 2nd probe
P5~P8 changes relative to the connection status of the reference potential of constant-current source 12.
Figure 22 represents that compared with the capacitance between conductive pattern E1~E4 and conductive plate 25 capacitance of wiring part is minimum
In the case of, make the 2nd attachment device 15 act when the 1st probe P1~P4 current potential change, for conductive pattern E1~E4 with
Capacitance between conductor plate 25, if conductive pattern E1~E4 is certified products, due to including matching somebody with somebody for conductive pattern E1~E4
The connection status of the capacitance in line portion changes, so that with the change of the capacitance on apparent, the current potential of time per unit tu becomes
Change amount is reduced.If the capacitance opposite with the reference potential of conductive pattern E1~E4 changes, potential change amount becomes
Change.Figure 22 represents the increased example of capacitance.
In the case where conductive pattern E1~E4 is defective work, as shown in figure 23, even if making the 2nd attachment device 15 dynamic
Make, potential change amount does not also change, and maintains to make the state before the action of the 2nd attachment device 15.
In this regard, in the larger situation of the capacitance of the wiring part compared with the capacitance between conductive pattern E1~E4 and conductive plate 25
Under, or capacitance between conductive pattern E1~E4 and conductive plate 25 compared to wiring part capacitance almost without difference feelings
Under condition, as shown in figure 24, if conductive pattern E1~E4 is certified products, by acting the 2nd attachment device 15, visited the 1st
After the current potential of head P1~P4 declines on a small quantity, current potential is risen with the potential change amount smaller than the potential change amount before connection.Such as
The fruit capacitance opposite with the reference potential of conductive pattern E1~E4 changes, then current potential changes.Figure 24 represents that capacitance increases
The example added.
In the case where conductive pattern E1~E4 is defective work, as shown in figure 25, even if making the 2nd attachment device 15 dynamic
Make, potential change amount does not also change, and maintains to make the state before the action of the 2nd attachment device 15.
In the case where the capacitance of the wiring part compared with the capacitance between conductive pattern E1~E4 and conductive plate 25 is larger,
Or the capacitance between conductive pattern E1~E4 and conductive plate 25 compared to wiring part capacitance almost without difference situation
Under, make the 2nd attachment device 15 act before per time tu potential change amount it is smaller, thus, the 1st pop one's head in P1~P4 current potential
Reach open-circuit voltage V0Need to spend the time, therefore, the prepotential for not being illustrated in moment T2 reaches the open circuit electricity of constant-current source 12
Press V0Situation, still, the open-circuit voltage V of constant-current source 12 is reached in the prepotential of moment T20In the case of, with the 1st embodiment
Situations such as it is identical, in the case where conductive pattern E1~E4 is certified products, current potential is with from open-circuit voltage V0The mode of decline changes,
Not relative to open-circuit voltage V0In the case of changing, conductive pattern E1~E4 is defective work.
[mode of texturing of the 5th embodiment]
In the case of 5 embodiment shown in Figure 19 and Figure 20, the printed base plate that can also illustrate them is examined
Look into device 61 and be used as basic structure, on this basis, in a manner of the 2nd embodiment shown in Fig. 8 and Fig. 9, in the 2nd probe
Capacitor C1~C4 is respectively configured between P5~P8 and each switching switch B1~B4 of the 2nd attachment device 15.
Alternatively, it is also possible in a manner of the 3rd embodiment shown in Figure 10 and Figure 11, in each of the 2nd attachment device 15
Capacitor C5~C8 is respectively configured between the reference potential of switching switch B1~B4 and constant-current source 12.
Alternatively, it is also possible to configure both capacitor C1~C4, C5~C8.
No matter which kind of situation, potential change amount can be made to become larger by setting capacitor C1~C4 or C5~C8, it is real
Apply more accurate inspection.
And it is possible in a manner of the 4th embodiment shown in Figure 12 and Figure 13, in the 1st attachment device 14 and constant current
The 3rd attachment device 23 with switching switch S is set between the reference potential in source 12.
By setting the 3rd attachment device 23, so that in the case of powered in the capacitive parts such as conductive pattern E1~E4,
Inspection can be proceeded by, therefore, it is possible to more accurately measure current potential, separately after it is discharged by the 3rd attachment device 23
Outside, the value of the electric current from 12 conductor 801 pattern E1~E4 of constant-current source can be made to stablize in a short time, can be implemented rapider
Inspection, further, it is possible to implement more accurately to check.
In addition, in the 5th embodiment and its mode of texturing, can detect the 1st probe P1~P4 whether reliably with
Conductive pattern E1~E4 is contacted.
Figure 26 is represented in the 5th embodiment shown in Figure 19 and Figure 20, is connected in the 2nd probe P5~P8 with the 2nd
The situation of capacitor C1~C4 is each configured between each switching switch B1~B4 of device 15 or in the 2nd attachment device 15
Each switching switch B1~B4 and constant-current source 12 reference potential between be each configured with certain in the case of capacitor C5~C8
A kind of device of situation, in the case where the 1st probe P1~P4 is with conductive pattern E1~E4 loose contacts, due to the 1st probe P1
Capacitance between~P4 and conductive pattern E1~E4, it is apparent on integral capacitor diminish, therefore, in moment T1, current potential drastically on
Rise, moment reaches open-circuit voltage V0.Can be by detecting the propradation of the current potential, the contact shape of the probe of detection the 1st P1~P4
State.
Figure 27 represents to be mounted with the situation of device that the 3rd attachment device 23 forms to the 5th embodiment, if the 3rd connected
Connection device 23 disconnects and flows through electric current (moment T4) to the 1st probe P1~P4, then in the situation of the 1st probe P1~P4 loose contacts
Under, identically with Figure 26, current potential steeply rises, therefore, it is possible to which by detecting the propradation, detection the 1st pops one's head in P1~P4's
Contact condition.
Detecting that the loose contact of the 1st probe P1~P4 and then secondary adjustment the 1st are visited according to the propradation of the current potential
The head contact position of P1~P4, posture etc..
[the 6th embodiment]
In the following, with reference to Figure 28 and Figure 29, the printed base plate check device 71 of the 6th embodiment is illustrated.
The printed base plate check device 71 of 6th embodiment has the 1st attachment device 14 ', and the 1st attachment device 14 ' will
Switching switch A1~A4 of the 1st attachment device 14 in the printed base plate check device 11 of 1st embodiment is grouped as single
Switching switch A1.That is, multiple 1st probe P1~P4 are connected with switching switch A1 in parallel.By closing switching switch A1, from
And multiple 1st probe P1~P4 become connection status at the same time, from constant-current source 12 at the same time to multiple 1 probe P1~P4 supply electricity
Stream.
Thus, to capacitance electric power storage possessed by wiring part of device for including conductive pattern E1~E4 etc., as a result, place
(the 1st probe P1~P4 is relative to constant-current source for current potential measured by measuring circuit 16 in the state being connected with the 1st probe P1~P4
The current potential of 12 reference potential) rise.
Then, act in order switching switch B1~B4 of the 2nd attachment device 15.If conductive pattern E1~E4 is just
Often, then by the action of the 2nd attachment device 15, the current potential measured by measuring circuit 16 changes.Conductive pattern E1~
In the case of breaking at E4, even if acting the 2nd attachment device 15, the current potential measured by measuring circuit 16 does not also become
Change.The presence or absence of change that can be by detecting the current potential, so as to identify whether conductive pattern E1~E4 is good.
In the above-described 6th embodiment, there is the 1st attachment device 14 ', the 1st attachment device 14 ' is by the 1st embodiment party
Switching switch A1~A4 of the 1st attachment device 14 in the printed base plate check device 11 of formula is grouped as single switching switch
A1.The structure can also apply to the 2nd foregoing embodiment (Fig. 8), the 3rd embodiment (Figure 10), the 4th embodiment (figure
12) the 1st attachment device 14 of the printed base plate check device and in the 5th embodiment (Figure 19).
[the 7th embodiment]
In the following, with reference to Figure 30 and Figure 31, the printed base plate check device 81 of the 7th embodiment is illustrated.
The printed base plate check device 81 of 7th embodiment has the 2nd attachment device 15 ', and the 2nd attachment device 15 ' will
Switching switch B1~B4 of the 2nd attachment device 15 in the printed base plate check device 11 of 1st embodiment is grouped as single
Switching switch B1.That is, multiple 2nd probe P5~P8 are connected with switching switch B1 in parallel.It is more by closing switching switch B1
A 2nd probe P5~P8 is grounded at the same time.
According to the structure, certain 1 in switching switch A1~A4 by closing the 1st attachment device 14 in order, thus
Certain 1 in conductive pattern E1~E4 is selected, every time acts the switching switch B1 of the 2nd attachment device 15 ', measurement can be passed through
Circuit 16 detects the change of current potential at this time, so that, the conducting state of inspection conductive pattern E1, E2, E3 or E4.
In the above-described 7th embodiment, there is the 2nd attachment device 15 ', the 2nd attachment device 15 ' is by the 1st embodiment party
Switching switch B1~B4 of the 2nd attachment device 15 in the printed base plate check device 11 of formula is grouped as single switching switch
B1.The structure can also be applied to the 2nd foregoing embodiment (Fig. 8), the 3rd embodiment (Figure 10), the 4th embodiment (figure
12) the 2nd attachment device 15 of the printed base plate check device and in the 5th embodiment (Figure 19).
Also, the with single switching switch B1 the 2nd is used to connect in the printed base plate check device of the 2nd embodiment
In the case of connection device 15 ', can be configured using multiple capacitor C1~C4 as 1 capacitor the 2nd probe P5~P8 with
Between 2nd attachment device 15 '.Equally, opened in the printed base plate check device of the 3rd embodiment using with single switching
In the case of the 2nd attachment device 15 ' for closing B1, it can configure using multiple capacitor C5~C8 as 1 capacitor and connect the 2nd
Between connection device 15 ' and ground wire.
Above, the embodiments of the present invention are illustrated, still, the present invention is not limited to these embodiments, and energy
It is enough to apply various changes without departing from the scope of spirit of the present invention.
For defined time t12, t31, t14, tu, can set match with the electrical characteristic of printed base plate it is optimal
Time, can be by being adjusted to them, so that the current potential of one end that is more rapid, reliably detecting conductive pattern E1~E4
The change of variable quantity, can promptly implement accurate inspecting substrate.
In addition, for the capacitance of capacitor C1~C4, C5~C8, can be by setting the electrical characteristic phase with printed base plate
Matched optimum value, so that the change of the potential change amount of one end that is more rapid, reliably detecting conductive pattern E1~E4, energy
It is enough promptly to implement accurate inspecting substrate.
Claims (8)
1. a kind of printed base plate check device, it is the electric checkup apparatus of printed base plate, the conductor to being formed at printed base plate
Pattern applies electric signal, checks whether conductive pattern is good,
The printed base plate check device is characterized in that having：
1st probe, its end thereof contacts with the conductive pattern；
2nd probe, it configures the other end in the conductive pattern via insulator；
Constant-current source；
1st attachment device, it is used to the described 1st probe being connected with the constant-current source；
2nd attachment device, it is used to make the 2nd probe relative to the status of electrically connecting of the reference potential of the constant-current source become
Change；And
Measuring circuit, it is used to measure current potential of the 1st probe relative to the reference potential of the constant-current source.
2. printed base plate check device according to claim 1, it is characterised in that
Between the described 2nd probe and the 2nd attachment device or between the 2nd probe and the reference potential of the constant-current source
In certain one or both be connected with the capacitor with defined capacitance.
3. printed base plate check device according to claim 1 or 2, it is characterised in that
With the 3rd attachment device, the 3rd attachment device be used for will the described 1st pop one's head in via the 1st attachment device and with it is described
The reference potential connection of constant-current source.
4. printed base plate check device according to claim 1 or 2, it is characterised in that
The benchmark electricity of the conductor plate contacted via insulator with the conductive pattern of the printed base plate and the constant-current source
Position connection.
5. printed base plate check device according to claim 3, it is characterised in that
The benchmark electricity of the conductor plate contacted via insulator with the conductive pattern of the printed base plate and the constant-current source
Position connection.
A kind of 6. printed base plate inspection method, it is characterised in that
Make end thereof contacts of the 1st probe directly with conductive pattern, configured in the other end of the conductive pattern via insulator
2nd probe, in moment T1, starts to flow through electric current from constant-current source to the described 1st probe, the defined time is being have passed through from moment T1
T2 at the time of after t12, makes the 2nd probe change relative to the status of electrically connecting of the reference potential of the constant-current source, according to this
The 1st probe during change judges the conductor figure relative to the measurement result of the current potential of the reference potential of the constant-current source
Whether case is good.
7. printed base plate inspection method according to claim 6, it is characterised in that
When the described 2nd pops one's head in relative to the status of electrically connecting of the reference potential of the constant-current source there occurs changing, in every regulation
In the case that the potential change amount of one end of the conductive pattern of unit interval tu is there occurs change, it is determined as that conductive pattern is
Certified products.
8. the printed base plate inspection method according to claim 6 or 7, it is characterised in that
The described 1st probe is connected with the reference potential of the constant-current source in moment T3, makes the 1st probe and institute in moment T4
Stating reference potential becomes off-state, and moment T3 is moment T4 at the time of shifting to an earlier date defined time t31 than the moment T1
Be from the moment T1 by the time t14 shorter than the time t12 and before the moment T2 at the time of.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-153493 | 2014-07-29 | ||
| JP2014153493 | 2014-07-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105319476A CN105319476A (en) | 2016-02-10 |
| CN105319476B true CN105319476B (en) | 2018-05-08 |
Family
ID=55247299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510445458.2A Active CN105319476B (en) | 2014-07-29 | 2015-07-27 | Printed base plate check device and inspection method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6095735B2 (en) |
| KR (1) | KR101706465B1 (en) |
| CN (1) | CN105319476B (en) |
| TW (1) | TWI598604B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6474362B2 (en) * | 2016-04-04 | 2019-02-27 | ファナック株式会社 | Printed circuit board deterioration detection device |
| CN106824832B (en) * | 2017-02-15 | 2019-05-17 | 友达光电（苏州）有限公司 | A kind of detection device and its application method |
| JP7009814B2 (en) * | 2017-07-27 | 2022-02-10 | 日本電産リード株式会社 | Insulation inspection equipment and insulation inspection method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0862061A2 (en) * | 1997-02-28 | 1998-09-02 | Nidec-Read Corporation | Circuit board inspection apparatus and method |
| CN1238727C (en) * | 2000-11-17 | 2006-01-25 | Oht株式会社 | Inspecting apparatus and inspecting method for circuit board |
| CN201014993Y (en) * | 2006-12-04 | 2008-01-30 | 杨世光 | Testing circuit improvement for PCB tester |
| CN101135714A (en) * | 2006-08-28 | 2008-03-05 | 株式会社阿迪泰克工程 | Portrayal circuit substrate checking device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2670655B2 (en) * | 1992-11-04 | 1997-10-29 | 株式会社アドテックエンジニアリング | Circuit pattern inspection device and inspection method |
| JPH07244107A (en) * | 1994-03-03 | 1995-09-19 | Hioki Ee Corp | Inverted side detecting method by x-y type in-circuit tester of ic |
| JP2994259B2 (en) | 1996-03-28 | 1999-12-27 | オー・エイチ・ティー株式会社 | Substrate inspection method and substrate inspection device |
| JP3361311B2 (en) | 1997-02-28 | 2003-01-07 | 日本電産リード株式会社 | Substrate inspection device and substrate inspection method |
| JP2002014134A (en) * | 2000-06-30 | 2002-01-18 | Hioki Ee Corp | Device for inspecting circuit board |
| JP2002014135A (en) * | 2000-06-30 | 2002-01-18 | Hioki Ee Corp | Method and device for inspecting circuit board |
| US7250781B2 (en) * | 2002-12-19 | 2007-07-31 | Fuji Xerox Co., Ltd. | Circuit board inspection device |
| JP2008232963A (en) * | 2007-03-23 | 2008-10-02 | Hioki Ee Corp | Probe, probe device, and inspection apparatus |
| JP6229877B2 (en) * | 2013-08-27 | 2017-11-15 | 日本電産リード株式会社 | Inspection device |
| JP6229876B2 (en) * | 2013-08-27 | 2017-11-15 | 日本電産リード株式会社 | Inspection device |
-
2015
- 2015-07-21 JP JP2015143817A patent/JP6095735B2/en active Active
- 2015-07-24 TW TW104124154A patent/TWI598604B/en active
- 2015-07-27 KR KR1020150105732A patent/KR101706465B1/en active IP Right Grant
- 2015-07-27 CN CN201510445458.2A patent/CN105319476B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0862061A2 (en) * | 1997-02-28 | 1998-09-02 | Nidec-Read Corporation | Circuit board inspection apparatus and method |
| CN1238727C (en) * | 2000-11-17 | 2006-01-25 | Oht株式会社 | Inspecting apparatus and inspecting method for circuit board |
| CN101135714A (en) * | 2006-08-28 | 2008-03-05 | 株式会社阿迪泰克工程 | Portrayal circuit substrate checking device |
| CN201014993Y (en) * | 2006-12-04 | 2008-01-30 | 杨世光 | Testing circuit improvement for PCB tester |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101706465B1 (en) | 2017-02-13 |
| JP2016033511A (en) | 2016-03-10 |
| TW201604564A (en) | 2016-02-01 |
| JP6095735B2 (en) | 2017-03-15 |
| CN105319476A (en) | 2016-02-10 |
| KR20160014540A (en) | 2016-02-11 |
| TWI598604B (en) | 2017-09-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7714590B2 (en) | Method for testing component built in circuit board | |
| US8823395B2 (en) | Electronic textile and method for determining a functional area of an electronic textile | |
| EP0492806B1 (en) | Identification of pin-open faults by capacitive coupling through the integrated circuit package | |
| US20060012384A1 (en) | Semiconductor substrate and test pattern for the same | |
| CN105319476B (en) | Printed base plate check device and inspection method | |
| CN105467259B (en) | Detection circuit for detecting capacitance sensing line, capacitive touch screen and detection method | |
| TWI237122B (en) | Method and apparatus for circuit board continuity test, tool for continuity test, and recording medium | |
| US8878559B2 (en) | IC current measuring apparatus and IC current measuring adapter | |
| TW201439561A (en) | Inspecting method and inspecting apparatus | |
| KR101555141B1 (en) | Apparatus and method for inspecting a printed circuit board | |
| US20120032700A1 (en) | Multilayer wiring board and method for evaluating multilayer wiring board | |
| CN108717140A (en) | High frequency electric source equipment output power test device and test method | |
| CN103245905A (en) | Built-in substrate inspection method | |
| WO2015133212A1 (en) | Voltage measuring apparatus and voltage measuring method | |
| TWI393200B (en) | Testing unit and test system | |
| CN208847791U (en) | High frequency electric source equipment output power test device | |
| CN109669059B (en) | Circuit structure for adjusting power signal impedance and semiconductor test interface system thereof | |
| TWI375045B (en) | Testing circuit and method for manufacturing and using the same | |
| WO2009101801A1 (en) | Capacitor inspection apparatus and inspection method using the same | |
| JP2002131365A (en) | Method and device for inspection | |
| US11191152B2 (en) | Printed circuit board signal layer testing | |
| TW200421707A (en) | Circuit check device, circuit check method, resistance measurement device, and resistance measurement method | |
| KR20110015210A (en) | Method for testing electric element embedded in printed circuit board | |
| KR20110015209A (en) | Printed circuit board being enable to test embedded electric element | |
| TW201418717A (en) | Probe card structure 2 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |