200421707 玖、發明說明： 【發明所屬之技術領域】 本發明有關於例如用以識別電路基板之導電圖案是否良 好之電路檢查裝置，電路檢查方法，電阻測定裝置及電阻 測定方法。 【先前技術】 近年來隨著裝置之變小和變輕，形成在被内藏於該裝置 内部之電路基板等之導電圖案，會有越發細線化和複雜化 之傾向。同時，在電路基板等之製造時，檢查在導電圖案 是否發生有斷線或短路成為維持裝置之可靠度上之重要而 且必需之項目。 先前技術所進行之導電圖案之檢查方法是使檢查銷接 觸在所欲檢查之導電圖案之兩端，從其一端之檢查銷對導 電圖案發送電信號，利用另外一端之檢查銷接受該電信 號，用來進行該導電圖案之導通測試等，一般使用此種接 觸式之檢查方法（檢查銷接觸方式）（例如，專利文獻1)。 此種檢查銷接觸方式是在全部端子設立金屬性之銷探 針，經由該探針將電信號送入到導電圖案。亦即，在檢查 銷接觸方式，因為使銷探針直接接觸在檢查對象，所以對 於檢查信號可以獲得良好之 S / N比（信號雜訊比）為其優 點。 [專利文獻1 ] 日本專利特開昭6 2 - 2 6 9 0 7 5號公報 但是，上述之先前技術之檢查方法，當在基板之圖案互 5 312/發明說明書(補件)/93-05/93103667 200421707 距細密化之情況 檢查對象之電路基 能確保具有實體上 互相接觸等之問題 的檢查。 檢查對象之導電圖 度進行銷探針之定 外，先前技術之方 象之方式，所以會 直接測定檢查對象 羅從低電阻到高電 行高精確之測定時 型化為其問題。 之問題，其目的是 觸狀態，進行檢查 方法，電阻測定裝 目的是提供可以以 是否良好之電路檢 及電阻測定方法。 的之作為解決上述 所述之構成。亦即 ，其特徵是具備有 相接近，或配線間 題。亦即，在成為 配置之情況時，不 針，會產生探針間 檢查，或只能部份 另外，為著對準 具，用來以高精確 用變高之問題。另 直接接觸在檢查對 受傷之問題。 另外一方面，在 中，不能線性的網 要利用此種方法進 格，而且裝置會大 【發明内容】 本發明針對上述 查裝置維持在非接 查裝置，電路檢查 另外，本發明之 基板等之導電圖案 法，電阻測定裝置 用以達成此種目 明例如具備有下面 用來檢查電路基板 ，會有使用困難之問 板之導電圖案被密集 之區域用來設立銷探 ，對於基板成為不能 案，需要製作檢查夾 位，因此會有檢查費 法因為是使檢查夾具 有使製品本身或圖案 之電壓，電流之方法 阻，會產生測定誤差， ，測定裝置變成高價 提供使檢查對象和檢 該檢查對象之電路檢 置及電阻測定方法。 簡單之構造判定電路 查裝置，電路檢查方 問題之一手段之本發 ，一種電路檢查裝置， :第1電極，用來對上 312/發明說明書(補件)/93-05/93103667 6 200421707 述電路基板之檢查對象之一方供給高頻信號，被定 上述檢查對象離開指定距離之位置；第2電極，被 上述電路基板之檢查對象之另外一方成為與上述檢 離開指定之距離；檢查裝置，用來檢測經由上述第 和第2電極施加在連接於阻抗電橋之第1分支之上 對象之第1高頻信號；檢測裝置，用來檢測施加在 於鄰接上述第1分支之第2分支之電路元件之第2 號；獲得裝置，根據上述檢測到之第1高頻信號和 頻信號之電壓和電流之位準差和相位差，用來獲得 查對象之電阻成分和電抗成分；和識別裝置，根據 獲得之電阻成分和電抗成分，用來識別上述檢查對 良好。 例如，其特徵是更具備有調整裝置，調整上述電 之電路常數直至上述位準差和相位差成為零，用來 阻抗電橋成為平衡狀態，根據上述調整後之量，用 上述檢查對象之電阻值。 另外，例如其特徵是使上述檢查對象經由高介電 離開上述指定之距離，上述第1高頻信號通過由上 電極，上述第2電極，上述檢查對象，和上述高介 膜構成之信號路徑。 用以解決上述問題之另一手段之本發明例如具備 所述之構成。亦即，一種電路檢查方法，用來檢查 板，其特徵是所具備之步驟包含有：連接步驟，經 電極和第2電極使檢查對象連接在阻抗電橋之第1 312/發明說明書(補件)/93-05/93103667 位在與 定位在 查對象 1電極 述檢查 被配置 高頻信 第2高 上述檢 上述所 象是否 路元件 使上述 來求得 質薄膜 述第1 電質薄 有下面 電路基 由第1 分支， 7 200421707 上述第1電極用來對上述電路基板之檢查對象之一方供給 高頻信號，被定位在與上述檢查對象離開指定距離之位 置，上述第2電極被定位在上述電路基板之檢查對象之另 外一方成為與上述檢查對象離開指定之距離；第1檢測步 驟，用來檢測施加在上述檢查對象之第1高頻信號；第2 檢測步驟，用來檢測施加在被配置於鄰接上述第1分支之 第2分支之電路元件之第2高頻信號；獲得步驟，根據上 述檢測到之第1高頻信號和第2高頻信號之電壓和電流之 位準差和相位差，用來獲得上述檢查對象之電阻成分和電 抗成分；和識別步驟，根據上述電阻成分和電抗成分之值， 用來識別上述檢查對象是否良好。 例如，其特徵是更具備有：調整步驟，用來調整上述電路 元件之電路常數直至上述位準差和相位差成為零，藉以使 上述電橋成為平衡狀態；和求得步驟，根據上述調整後之 量，用來求得上述檢查對象之電阻值。 例如，其特徵是使上述檢查對象經由高介電質體薄膜離 開上述指定之距離，第1檢測步驟用來檢測通過由上述第 1電極，上述第2電極，上述檢查對象，和上述高介電質 薄膜構成之信號路徑之上述第1高頻信號。 另外，用以解決上述問題之另一手段之本發明例如具備 有下面所述之構成。亦即，一種電阻測定裝置，用來測定 電路基板之導電圖案之電阻，其特徵是具備有：阻抗電橋， 構成為在第1分支連接檢查對象，在與上述第1分支鄰接 之第2分支配置由電阻成分和電抗成分構成之電路元件， 8 312/發明說明書(補件)/93-05/93103667 200421707 在分別與上述第1和第2分支面對之第3和第4分支之各 個配置純電阻；高頻信號源，用來對上述阻抗電橋供給高 頻信號；檢測裝置，用來檢查上述高頻信號中之施加在上 述檢查對象之第1高頻信號和施加在上述電路元件之第2 高頻信號之電壓和電流之位準差和相位差；和獲得裝置， 根據上述檢測到之位準差和相位差，用來獲得上述檢查對 象之電阻成分和電抗成分；根據上述檢查對象之電阻成分 和電抗成分之值，可以識別上述導電圖案是否良好。 例如，其特徵是更具備有調整裝置，根據上述位準差和 相位差用來調整上述電路元件之電阻成分和電抗成分，以 利用上述調整使上述阻抗電橋成為平衡狀態時之上述電阻 成分作為上述導電圖案之電阻值。 例如，其特徵是更具備有：多個電極，被配置成與上述 檢查對象之導電圖案對應；第1感測器，經由覆蓋該等電 極之高介電質薄膜，用來將上述高頻信號供給到上述導電 圖案之一方；和第2感測器，經由高介電質薄膜使上述導 電圖案之另外一端維持在接地位準；上述檢查對象被包夾 在上述第1感測器和第2感測器之間，和連接在上述第1 分支，上述第1高頻信號通過由上述檢查對象和上述高介 電質薄膜構成之信號路徑。 另外，用以解決上述問題之另一手段之本發明例如具備 有下面所述之構成。亦即，一種電阻測定方法，用來測定 電路基板之導電圖案之電阻，其特徵是所具備之步驟包含 有：連接步驟，在阻抗電橋之上述第1分支連接檢查對象， 9 3Π/發明說明書(補件)/93-05/93103667 200421707 該電橋在鄰接第1分支之第2分支配置由電阻成分和電抗 成分構成之電路元件，在分別與上述第1和第2分支面對 之第3和第4分支之各個配置純電阻；供給步驟，對上述 阻抗電橋供給高頻信號；檢測步驟，用來檢測上述高頻信 號中之施加在上述檢查對象之第1高頻信號和施加在上述 電路元件之第2高頻信號之電壓和電流之位準差和相位 差；獲得步驟，根據上述檢測到之位準差和相位差，用來 獲得上述檢查對象之電阻成分和電抗成分；和識別步驟， 根據上述檢查對象之電阻成分和電抗成分之值用來識別上 述導電圖案是否良好。 例如，其特徵是更具備有調整步驟，根據上述位準差和 相位差用來調整上述電路元件之電阻成分和電抗成分，以 利用上述調整使上述阻抗電橋成為平衡狀態時之上述電阻 成分作為上述導電圖案之電阻值。 【實施方式】 下面參照附圖用來詳細的說明實施形態例。本實施形態 例之電路檢查裝置使用阻抗電橋電路，以檢查對象和檢查 裝置成為非接觸之方式檢查作為檢查對象之電路基板之電 路（導電圖案），根據其結果可以識別導電圖案之良否。圖 1是外觀斜視圖，用來表示使用本實施形態例之電路檢查 裝置進行電路檢查時之方式，圖2是剖面圖，用來表示電 路檢查（電阻測定）時之檢查裝置和檢查對象之相互之位置 關係。 如圖1所示，本實施形態例之電路檢查裝置由上部感測 10 312/發明說明書(補件)/93-05/93103667 200421707 器3和下部感測器2，及用以電連接該等感測器之電 路1構成。在開始電阻值之測定時，使檢查對象5 0 (例 設有導電圖案之電路基板）依照圖中之箭頭方向移動， 裝載在下部感測器2上之指定位置（亦即，定位在後面 之電極）之後，使上部感測器3重疊和密著在檢查對！ 之上側。其結果是檢查對象5 0成為在上下方向被該等 器2、3包夾，形成與感測器2、3密著之狀態。 上部感測器3之構成例如在配合檢查對象之5 0之大 銅板4貼合高介電質薄膜5，使全體具有直方體之形 成為所謂之 GND(接地）貝他感測器。被配置在與該上 測器3面對之位置之下部感測器2具有在絕緣基板9 面配置有多個電極 1 1〜1 7 (該等之電極例如由銅構成 構造，具有全體成為直方體之形狀。另外，在下部感 2之上面，覆蓋有高介電質薄膜8(在圖1中以二點虛 示），以使各個電極1 1〜1 7之一部份殘留之方式，覆 其他部份之全體。 另外，上部感測器3和下部感測器2可以使面對之 大小成為相同之大小，亦可以使下部感測器2之面積 上部感測器3之面積（例如，參照圖1、圖2 )。另外， 電質薄膜5、8在此處是使用例如高介電質之聚醯亞月矣 緣薄膜）。 如圖1所示，被配置在下部感測器2上之各個電極 1 7，例如全體成為”小木勺π或"匙狀n形狀，具有其一 面積變大之圓狀部21〜27。該等之圓狀部21〜27,在 312/發明說明書(補件)/93-05/93103667 橋電 如， 當被 所述 t 50 感測 小之 狀， 部感 之上 :)之 測器 線表 蓋在 面之 大於 高介 f (絕 1 1〜 部之 電阻 11 200421707 測定時使檢查對象5 0定位在下部感測器2上時，成為承載 在形成於電路基板之突塊電極（突塊部）之部份，配合該等 之突塊部之位置被配置在下部感測器2上。因此，電極1 1 〜1 7之圓狀部2 1〜2 7在下部感測器2上，成為與依照檢 查對象 50之穿通孔之形成位置上所配置之突起部相同之 位置。 另外，在電極11〜17中，未被高介電質薄膜8覆蓋之部 份具有作為測定端子之功能，在該等之部份經由導線 20 連接有電橋電路1。導線2 0適當的變換連接到與成為檢查 對象之導電圖案（穿通孔）對應之電極1 1〜1 7。另外，導線 2 0可以依照需要使用同軸電纜或屏蔽線，成為可以避免外 來之雜訊等之影響之構造。 在電阻測定時，如圖2所示，檢查對象5 0被下部和上部 之兩個感測器2、3包夾，成為與該等密著之狀態下所形成 在檢查對象50之穿通孔35、36，其一端經由高介電質薄 膜5維持與銅板4接近之狀態，其另外一端經由電連接在 穿通孔35、36之突起部31、32，和高介電質薄膜8，維持 與電極1 1〜1 7接近之狀態。在此處之接近狀態是指對施加 之電信號，直流上為絕緣狀態（非接觸），在交流上（特別是 高頻信號）成為導通狀態。 電橋電路1具有後面所述之高頻信號之供給源，該高頻 信號供給（施加）在上部感測器3之銅板4和下部感測器2 上之電極1 1〜1 7之間。因此，密著在該等感測器2、3間 之檢查對象5 0之穿通孔3 5、3 6，在電阻測定時亦被施加 12 312/發明說明書(補件)/93-05/93103667 200421707 該高頻信號。這時，檢查對象5 0連接到構成電橋電路 1 之阻抗電橋之一邊，檢查對象5 0如後面所示，等價地具有 由電路基板之穿通孔35、36之電阻成分，電容成分等構成 之電路構造。 下面說明本實施形態例之電路檢查裝置之電路檢查（電 阻值測定）之原理，和電路檢查裝置之構造。圖3表示本實 施形態例之電路檢查裝置（包含上述之電橋電路 1 )之具體 之電路構造。如圖3所示，該電路檢查裝置，接受來自高 頻信號振盪器（OSC) 51之高頻信號，具有阻抗電橋41用來 獲得電橋之平衡狀態/不平衡狀態。構建成在該阻抗電橋 4 1之四邊（4個分支）分別配置：純電阻R 1、R 3 (在此處該等 之電阻值相等（R1=R3));可變電阻R2和可變電容C1之串 聯連接之電路元件；和具有未知之阻抗Zx之檢查對象。 在該電路檢查裝置中，來自高頻信號振盪器51之高頻信 號，施加在阻抗電橋41之A - D間，獲得這時之電橋41之 平衡狀態，根據電橋之分支電流（分流之電流）和電壓之相 位差和位準差，求得檢查對象之電阻值。這時，如上述之 方式，檢查對象 5 0，和成為測定信號之輸入部之電極 11 〜1 7，和維持成為接地（G N D)板之上部感測器3，經由高介 電質薄膜8、5成為直流上非接觸狀態，對高頻信號成為電 導通狀態。 因為從高頻信號振盪器5 1對電橋4 1供給例如數1 Ο Μ Η z 〜數1 Ο Ο Μ Η ζ之高頻信號，所以接受此種高頻信號之對象會 產生阻抗降低。亦即，高頻信號之路徑是從振盪源，通過 13 312/發明說明書(補件)/93-05/93103667 200421707 介入在檢查對象之高介電質薄膜，在構成該檢查對象之穿 通孔流動，到達電路接地線。因此，在電橋4 1未成為平衡 狀態之情況時，在電橋4 1之點A -點C - Z X -點D之路徑，和 點A -點B -點D之路徑，分別具有相位和位準不同之高頻電 流i !、i 2流動。另外，該高頻信號假如是容易判定相位差 之波形時，可以使用正弦波信號，亦可以使用矩形波信號。 因此，在電橋41之不平衡時，在電橋41之點C、點B 有相位和位準不同之高頻電流i !、i 2流動，產生電流i I、 i2之位準差，和電壓V!、v2之位準差。在該等之信號位準 之差分中，電壓之差分被連接在點C、點B之差動放大器 42直接放大，成為電壓之位準差Δν的被輸出。 另外一方面，對於電流之差分，在連接於點C，點Β之 電壓一電流變換部4 0，根據電壓成分變換成為電流成分之 後，被下一段之差動放大器53放大。因此，電橋41之電 流之差分成為電橋4 1之點C、Β之電流之位準差△ I，被差 動放大器53輸出。 另外，該等之差動放大器42、53之輸入阻抗極高（通常 為數Μ Ω〜數1 0 0 Μ Ω )，所以流入到其輸入端之電流可以忽 略。另外，差動放大器42、53具有數MHz以上之頻寬之放 大特性，在差動輸入具有高增益，和具有除去同相成分之 功能。 成為類比信號之電流位準差△ I，和電壓位準差△ V中， 電流位準差△ I在A / D變換部5 4被變換成為表示其值之數 位信號，電壓位準差△ V在A / D變換部4 3被變換成為與位 14 312/發明說明書(補件)/93-05/93103667 200421707 準差對應之數位信號。 另外，當電橋 41為不平衡狀態時，在電橋之分支流動 之高頻電流 i 1、i 2之相位亦成為不同（亦即’在該兩個電 流產生相位差）。在此處因為調整成使被配置在電橋4 1之 鄰接之2個分支（A-B、A-C)之電阻R1、R3之電阻值成為相 等，所以在分支電流產生相位差之不平衡狀態是指被配置 在電橋 41 之 B-D 所示分支之電路元件之阻抗 Zbd (Z b d = R 2 + 1 / j ω C 1 )，和連接在O D所示分支之未知阻抗Ζ χ 在電性不等效。 因此，判定部 5 5判定 A / D變換後之數位值是否在指定 範圍内。亦即，來自A / D變換部4 3、5 4之輸出分別依照電 橋之電路元件（阻抗）被分支，將高頻信號之電壓位準差， 和電流位準差變換成為數位值之值，判定部5 5判定該等之 值是否在預先設定之臨限值内。 實質上判定電路 5 5在電橋 41之分支電流沒有相位差 時，進行檢查對象（電路基板之穿通孔）所具有之電阻成分 是否良好之判定。因此，假如電阻成分之值在預先設定之 臨限值内時，判定部5 5就判定為檢查對象之電阻成分之值 (測定到之電路基板之穿通孔之電阻值）為正常，輸出其判 定結果R。 在本實施形態例之電路檢查裝置中，在電橋 41之點 C 和點B，除了上述之差動放大器4 2、5 3外，更連接有相位 比較部4 7。該相位比較部4 7使在不平衡狀態之電橋4 1流 動之電流i 1、i 2之各個相位0。，0 !進行比較，以其差分 15 312/發明說明書(補件)/93-05/93103667 200421707 00— 01作為的進行輸出。 另外，相位差一電抗變換部4 8根據該相位比較部4 7所 檢測到之相位差△ 0 ，輸出電抗之值 X。亦即，將利用相 位比較部4 7所檢測到之相位差△ 0，作為電抗成分之差分 的進行輸出。在此處以該值X作為判定基準（0 Ω )，可以用 來判斷測定到之電阻值是否在正常（適當）之範圍内。（例 如，當該值大幅偏離判定基準 0 ( Ω )時，電阻值不能成為 適當之測定值）。 圖4是連接在電橋41之分支C-D之未知阻抗Zx(46)之 等效電路。作為本實施形態例之電路檢查裝置之測定對象 者是被配置在上述之檢查對象 5 0 (電路基板）内之例如由 銅構成之穿通孔35、36。當以電性等效電路表示該穿通孔 時，如圖4所示，例如可以視為具有電路構造61，其構成 包含有：電阻成分R，與路徑之長度部份相當；寄生電感成 分L，與該電阻成分R串聯連接；和寄生電容成分C。 另外，在本實施形態例之電路檢查裝置中，如上述之方 式，使用高頻信號作為測定信號，檢查對象5 0經由高介電 質薄膜8、5電連接在上部感測器3和下部感測器2 (利用 高頻信號成為導通狀態）。因此，在該等之感測器2、3和 檢查對象50之間，存在有利用高介電質薄膜8、5而成電 容成分串聯連接。該電容成分成為圖4所示之2個電容器 Cg 〇 在電橋41之分支C-D設置端子a、b，連接在該等端子 a、b之Z X (欲測定之未知阻抗）成為使施加在電橋4 1之高 16 312/發明說明書(補件)/93-05/93103667 200421707 頻信號通過之測定路徑之阻抗。因此，Zx之等效電路如圖 4所示，成為在上述之電路構造61之兩端，串聯連接有由 高介電質薄膜8、5構成之電容成分Cg。 依照此種方式，在本實施形態例之電路檢查裝置中，電 橋之電流和電壓測定之結果所獲得之電抗之差分（相位差） 變換成為電容量，和信號位準之差分變換成為電阻值，相 當於電路基板之穿通孔等所構成之測定路徑之阻抗成分 (由穿通孔之電阻成分和電抗成分等構成）。 這時，因為測定路徑中之高介電質薄膜 8、5所構成之 電容成分為已知，經由進行該電容成分之電抗校正，可以 正確的檢測由穿通孔之寄生電感成分L和寄生電容成分C 構成之電抗成分。 另外一方面，假如電橋 41為平衡狀態時，使檢查對象 5 0之未知阻抗成為Z X = R + j X，利用 R3 · ( R2+ 1/j ω Cl ) =R1 · (R+ j X )........................(1 ) ，其平衡條件成為 R2 · R3 = R · R1，而且，X · Rl=-R3/w Cl..................(2) 另外，在此處因為R1 = R3，所以Zbd = Zx之關係可以成立， 變成為 R = R2，X = -1 / ω C1...................................................(3) 。其結果是被配置在電橋41之分支B-D之電路元件之電阻 成分和電感成分，直接成為測定對象之穿通孔之電阻成分 和電抗成分。 17 312/發明說明書(補件)/93-05/93103667 200421707 因此，在平衡狀態之電橋4 1之點C、B具有相位和信號 位準一致之電流流動。因此，在點C、B間不會產生電壓位 準差，亦不會產生電流之位準差，所以差動放大器4 2、5 3 之各個之輸出之電壓，電流位準差Δν、ΔΙ均成為零。這 時，相位比較部4 7因為對同相信號檢測不到相位差，所以 相位比較部4 7之輸出（相位之差分△ 0 )亦成為零。 另外，在本實施形態例之電路檢查裝置中，將差動放大 器4 2之輸出之電壓位準差△ V，和相位比較部4 7所檢測到 之相位差△ 0 ，回饋到C R調整部5 2，根據該回饋量調整 阻抗電橋41之分支B-D之可變電阻R2和可變電容C1。該 調整重複進行直至電壓位準差和相位差均成為零（從相位 差一電抗變換部48輸出之電抗之值X成為零）。亦即，重 複該調整直至由電路元件R 2和C 1構成之阻抗Zbd和欲測 定之阻抗Z X成為相等，電壓V 1、V 2之相位和位準成為相同 (沒有相位差和位準差）。 下面說明具備有上述構造之電路檢查裝置之電路之檢 查方法。圖5是流程圖，用來表示本實施形態例之電路檢 查裝置之檢查（電阻測定）步驟。首先，在圖5之步驟S1， 將檢查對象（測定對象）之電路基板裝載在檢查裝置之指定 位置。此處之指定位置是指被配置在圖1等所示之下部感 測器2上之電極1 1〜1 7之圓狀部2 1〜2 7之位置，在該等 之位置，使突塊部對準作為檢查對象之電路基板之穿通孔。 另外，檢查對象之裝載可以利用圖中未顯示之搬運機器 人進行，亦可以由測定者（操作者）本身直接進行裝載作業。 18 312/發明說明書(補件)/93-05/93103667 200421707 在步驟 S 2，對包含檢查對象之阻抗電橋供給高頻信 (測定信號）。這時，依照電橋之平衡狀態，使施加之高 信號之電流之一部份分流到檢查對象，其餘之電流分流 由上述之可變電阻R2和可變電容C1串聯連接而成之電 元件。 在步驟S 3，檢測在檢查對象流動之高頻信號，和預先 定之流向電路元件之高頻信號之電壓，電流之位準差和 位差。然後，在步驟S 5，根據在上述步驟S 3所檢測到 位準差和相位差，獲得檢查對象之電阻成分和電抗成分 判定該等之值是否在預先設定之臨限值内。 假如在步驟S 5之判定結果為N 0時，因為檢查對象之 阻成分和電抗成分不在預先設定之臨限值内，表示在其 外之值，所以在步驟S7判定為檢查對象之導電圖案例如 其鄰接之圖案短路，或在途中有斷線，其導電圖案之狀 成為不良。但是，假如來自檢查對象之檢測值在預先設 之臨限值内時，就在步驟S 8判定導電圖案為正常。然後 使處理前進到步驟S 1 0。 在步驟S1 0判斷是否已完成所有之導電圖案之測定， 未完成測定時，就在步驟S 1 1變更檢查對象導電圖案。 質上進行圖1所示之輸入測定信號之電極1 1〜1 7之變 (包含導線之連接變更），對下一個之檢查對象之導電圖 供給高頻信號，再度重複進行步驟S 3以後之處理。 另外一方面，在完成所有之導電圖案之測定之情況時 就在步驟S 1 5停止高頻信號之供給，將檢查對象拆離檢 312/發明說明書(補件)/93-05/93103667 號 頻 到 路 設 相 之 電 以 與 態 定 9 在 實 換 案 9 查 19 200421707 裝置，結束本測定處理。在本實施形態例中，假如相位差 一電抗變換部4 8根據相位比較電路4 7檢測到之相位差△ 0，輸出之電抗之值X為零時，高頻信號振盪器5 1就接受 該X作為振盪停止信號，在測定結束時停止高頻信號之振 盪。 如以上所說明之方式，在阻抗電橋電路之電橋之一邊連 接檢查對象，當根據該電橋之平衡狀態進行檢查（電阻值測 定）時，使用高頻信號作為測定信號，使該檢查對象和電橋 電路經由高介電質薄膜電連接，構成測定信號之信號路 徑，可以與檢查裝置維持非接觸狀態的測定檢查對象之電 路基板上之導電圖案之電阻值。 另外，在檢查時因為檢查對象和檢查裝置可以維持非接 觸之狀態，所以亦可以適用在混合導電圖案之複雜電路圖 案構造之電路基板之電阻測定。 另外，阻抗電橋電路之構成元件使用與頻率無關之電 阻，在電橋流動之電流之相位和位準以相同之方式維持平 衡狀態，同時經由調整該電橋之構成元件之電容量和電阻 值，可以保持對外來雜訊等之干擾具有耐性的進行電阻測 定，在所有之元件可以等效的緩和其變動，可以提高測定 精確度。另外，經由檢測所獲得之電抗成分之相位差可以 確保寬廣之測定範圍。 另外，本發明並不只限於上述之實施形態例，在不脫離 本發明之主旨之範圍内可以進行各種變更。例如，代替上 述之可變電阻R 2和可變電容C1之調整者，亦可以將其構 20 312/發明說明書(補件)/93-05/93103667 200421707 造設置成為根據相位比較部 4 7所檢測到之相位差△ 0進 行移相（移相處理），利用乘算器使移相後之信號和來自高 頻信號振盪器5 1之信號（原信號）進行乘算。 利用此種乘算，施加到電橋 4 1之高頻信號之頻率變成 依照移相量變換，根據施加之高頻信號，在相位差一電抗 變換部4 8之輸出之電抗之值X成為零之時刻，可以對與頻 率無關之電阻成分進行測定。 如以上所說明之方式，依照本發明時，可以使檢查對象 和檢查裝置維持非接觸狀態，以良好之精確度測定檢查對 象之導電圖案之電阻。 另外，依照本發明時，可以以簡單之構造判定電路基板 等之導電圖案是否良好。 【圖式簡單說明】 圖1是外觀斜視圖，用來表示使用本實施形態例之電路 檢查裝置進行電路檢查時之方式。 圖2是剖面圖，用來表示電路檢查時之檢查裝置和檢查 對象之相互之位置關係。 圖 3表示實施形態例之電路檢查裝置之具體之電路構 造。 圖4表示具有未知之阻抗Zx之檢查對象之等效電路。 圖5是流程圖，用來表示實施形態例之電路檢查裝置之 檢查步驟。 (元件符號說明）200421707 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to, for example, a circuit inspection device, a circuit inspection method, a resistance measurement device, and a resistance measurement method for identifying whether a conductive pattern of a circuit substrate is good. [Prior Art] In recent years, as devices have become smaller and lighter, conductive patterns formed on circuit boards and the like built into the devices tend to become thinner and more complicated. At the same time, during the manufacture of circuit boards and the like, it is important and necessary to check whether the conductive pattern is broken or short-circuited to maintain the reliability of the device. The inspection method of the conductive pattern carried out in the prior art is to contact the inspection pin with both ends of the conductive pattern to be inspected, send an electrical signal to the conductive pattern from the inspection pin at one end, and receive the electrical signal with the inspection pin at the other end. This type of contact type inspection method (inspection pin contact method) is generally used for conducting a continuity test of the conductive pattern (for example, Patent Document 1). This type of inspection pin contact method is to set metallic pin probes on all terminals, and send electrical signals to the conductive pattern via the probes. That is, in the inspection pin contact method, since the pin probe is directly contacted with the inspection object, a good S / N ratio (signal-to-noise ratio) for the inspection signal is an advantage. [Patent Document 1] Japanese Patent Laid-Open No. 6 2-2 6 9 0 7 5 However, in the above-mentioned prior art inspection method, when the pattern on the substrate is mutual 5 312 / Invention Specification (Supplement) / 93-05 / 93103667 200421707 The fineness of the distance can be checked by the circuit base of the inspection object to ensure that there is a problem of physical contact with each other. In addition to the pin-to-pin determination of the conductive pattern of the inspection object, the method of the prior art directly measures the inspection object. It is a type of problem when measuring from low resistance to high power with high accuracy. The purpose of the problem is to touch the state and carry out inspection methods. The purpose of the resistance measurement device is to provide a good circuit test and resistance measurement method. The solution is to solve the above-mentioned constitution. That is, it is characterized by having similar or wiring problems. That is, in the case of configuration, there is no need for needles, and inter-probe inspections may occur, or only partly. In addition, for the purpose of alignment tools, it is used to increase the accuracy with high accuracy. Another direct contact is being examined for injuries. On the other hand, in this way, the nets that cannot be linearized need to use this method, and the device will be large. [Summary of the Invention] The present invention maintains the above-mentioned inspection device as a non-interrogation device, circuit inspection. In addition, the substrate of the invention The conductive pattern method and the resistance measuring device are used to achieve such a purpose. For example, the following is used to inspect the circuit board. The conductive pattern of the board is difficult to use. The dense area is used to set up the probe. Production of inspection clamps, so there will be inspection fees. Because the inspection clamps have the voltage and current of the product itself or the pattern, it will cause measurement errors. The measurement device becomes a high price to provide inspection objects and inspection objects. Circuit inspection and resistance measurement method. The simple structure determines the circuit inspection device, which is one of the means of the circuit inspection problem. A circuit inspection device: the first electrode is used to match the above 312 / Invention Specification (Supplement) / 93-05 / 93103667 6 200421707 One of the inspection objects of the circuit board supplies a high-frequency signal, and the position where the inspection object is located away from the specified distance is determined; the second electrode, the other side of the inspection object of the circuit substrate is located at the specified distance from the inspection; the inspection device is used for To detect the first high-frequency signal applied to the object connected to the first branch of the impedance bridge via the first and second electrodes; and a detection device for detecting a circuit element applied to the second branch adjacent to the first branch No. 2; obtaining means for obtaining the resistance and reactance components of the object to be checked according to the above-mentioned detected level and phase difference of the voltage and current of the first high-frequency signal and frequency signal; and the identifying means according to The obtained resistance component and reactance component are used to identify that the above inspection is good. For example, it is further equipped with an adjusting device that adjusts the electrical circuit constant until the level difference and phase difference become zero, and is used to impedance the bridge into a balanced state. According to the adjusted amount, the resistance of the inspection object is used. value. In addition, for example, it is characterized in that the inspection object is separated from the predetermined distance via a high dielectric, and the first high-frequency signal passes through a signal path composed of an upper electrode, the second electrode, the inspection object, and the high dielectric film. The present invention, which is another means for solving the above-mentioned problems, includes, for example, the aforementioned constitution. That is, a circuit inspection method for inspecting a board, which is characterized in that the steps include: a connection step of connecting an inspection object to an impedance bridge via an electrode and a second electrode according to No. 1 312 / Invention Specification of the impedance bridge (Supplementary Document) ) / 93-05 / 93103667 is located and located at the object of inspection. 1 electrode is described. Check is configured with high-frequency signal. 2nd high. The above is to check whether the image is the same as the circuit element. The first thin film has the following circuit basis. First branch, 7 200421707 The first electrode is used to supply a high-frequency signal to one of the inspection objects of the circuit board, and is positioned at a specified distance from the inspection object, and the second electrode is positioned at the circuit board. The other side of the inspection object is separated from the inspection object by a specified distance; the first detection step is used to detect the first high-frequency signal applied to the inspection object; and the second detection step is used to detect that the inspection object is placed adjacent to the above. The second high-frequency signal of the circuit element of the second branch of the first branch; the obtaining step is based on the first high-frequency signal and the second high-frequency signal detected above. The voltage and current level difference and phase difference, for obtaining a resistance component and reactance component of the examination object; and a step of identifying, in accordance with values of the resistance component and reactance component of electricity, used to identify the inspection target is good. For example, the feature is further provided with: an adjustment step for adjusting the circuit constants of the circuit elements until the level difference and phase difference become zero, so that the bridge is in a balanced state; and an obtaining step, according to the adjustment after the adjustment The amount is used to obtain the resistance value of the inspection object. For example, it is characterized in that the inspection object is separated from the specified distance through a high-dielectric substance film, and the first detection step is used to detect the passage of the first electrode, the second electrode, the inspection object, and the high dielectric material. The above-mentioned first high-frequency signal in a signal path made of a thin film. In addition, the present invention, which is another means for solving the above-mentioned problems, has a configuration described below, for example. That is, a resistance measuring device for measuring the resistance of a conductive pattern on a circuit board is provided with an impedance bridge configured to connect a test object at a first branch and a second branch adjacent to the first branch Circuit components composed of a resistance component and a reactance component are arranged. 8 312 / Invention Specification (Supplement) / 93-05 / 93103667 200421707 In each of the third and fourth branches facing the above-mentioned first and second branches, respectively Pure resistance; high-frequency signal source for supplying high-frequency signals to the impedance bridge; detection device for checking the first high-frequency signal of the high-frequency signal applied to the inspection object and the circuit element The level difference and phase difference of the voltage and current of the second high-frequency signal; and an obtaining device for obtaining the resistance component and the reactance component of the inspection object according to the detected level difference and phase difference; and according to the inspection object The value of the resistance component and the reactance component can identify whether the conductive pattern is good or not. For example, it is further equipped with an adjusting device for adjusting the resistance component and the reactance component of the circuit element based on the level difference and the phase difference, and using the adjustment when the impedance bridge is brought into a balanced state as the resistance component as The resistance value of the conductive pattern. For example, it is further equipped with a plurality of electrodes arranged to correspond to the conductive pattern of the inspection object, and a first sensor for transmitting the high-frequency signal through a high-dielectric film covering the electrodes. Supplied to one of the conductive patterns; and a second sensor to maintain the other end of the conductive pattern at a ground level via a high-dielectric film; the inspection object is sandwiched between the first sensor and the second sensor The sensors are connected to the first branch, and the first high-frequency signal passes through a signal path composed of the inspection object and the high-dielectric film. In addition, the present invention, which is another means for solving the above-mentioned problems, has a configuration described below, for example. That is, a resistance measurement method for measuring the resistance of the conductive pattern of a circuit board, which is characterized in that the steps include: a connection step, connecting the inspection object at the first branch of the impedance bridge, 9 3Π / Invention Specification (Supplement) / 93-05 / 93103667 200421707 This bridge is arranged in the second branch adjacent to the first branch. Circuit elements composed of a resistance component and a reactance component are arranged in the third branch facing the first and second branches respectively. And the fourth branch are each provided with pure resistance; a supplying step for supplying a high-frequency signal to the impedance bridge; and a detecting step for detecting the first high-frequency signal of the high-frequency signal applied to the inspection object and the The level difference and phase difference of the voltage and current of the second high-frequency signal of the circuit element; an obtaining step for obtaining the resistance component and the reactance component of the inspection object according to the detected level difference and phase difference; and identifying Step: Use the values of the resistance component and the reactance component of the inspection object to identify whether the conductive pattern is good. For example, it is further provided with an adjustment step for adjusting the resistance component and the reactance component of the circuit element according to the level difference and the phase difference, and using the adjustment when the impedance bridge is brought into a balanced state as the resistance component as The resistance value of the conductive pattern. [Embodiment] The embodiment will be described in detail below with reference to the drawings. The circuit inspection device of this embodiment uses an impedance bridge circuit to inspect the circuit (conducting pattern) of the circuit substrate as an inspection target in a non-contact manner so that the inspection object and the inspection device become non-contact. Based on the results, it is possible to identify the goodness of the conductive pattern. Fig. 1 is an external perspective view showing a method for performing a circuit inspection using the circuit inspection device of this embodiment. Fig. 2 is a cross-sectional view showing the mutual relationship between the inspection device and an inspection object during a circuit inspection (resistance measurement). Location relationship. As shown in FIG. 1, the circuit inspection device of this embodiment is composed of an upper sensor 10 312 / invention specification (supplement) / 93-05 / 93103667 200421707 and a sensor 3 and a lower sensor 2, and is used to electrically connect such devices. The sensor circuit 1 is configured. When starting the measurement of the resistance value, move the inspection object 50 (for example, a circuit board provided with a conductive pattern) in the direction of the arrow in the figure, and load it at a designated position on the lower sensor 2 (that is, locate it at the back Electrode), make the upper sensor 3 overlap and closely check the pair! On the side. As a result, the inspection object 50 is sandwiched by the devices 2 and 3 in the up-down direction and is in a state of being in close contact with the sensors 2 and 3. The structure of the upper sensor 3 is, for example, a high-dielectric film 5 bonded to a large copper plate 4 of the object to be inspected, so that the entire body has a rectangular parallelepiped shape and is called a GND (ground) beta sensor. The lower sensor 2 is disposed at a position facing the upper sensor 3. The lower sensor 2 has a plurality of electrodes 1 1 to 1 7 arranged on the surface of the insulating substrate 9 (these electrodes are made of, for example, copper, and have a rectangular shape as a whole. The shape of the body. In addition, a high-dielectric film 8 (shown by two dots in FIG. 1) is covered on the lower sense 2 so that a part of each of the electrodes 1 1 to 17 remains, Cover the whole of the other parts. In addition, the upper sensor 3 and the lower sensor 2 can be made to face the same size, or the area of the lower sensor 2 and the area of the upper sensor 3 (for example, (Refer to Fig. 1 and Fig. 2). In addition, the dielectric films 5 and 8 are made of, for example, a high-dielectric polyisocyanate thin film). As shown in FIG. 1, each of the electrodes 17 arranged on the lower sensor 2 has, for example, a “wooden spoon” or “spoon-shaped n” shape, and has circular portions 21 to 27 each having an enlarged area. The rounded parts 21 ~ 27 are described in 312 / Invention Specification (Supplement) / 93-05 / 93103667 Bridge Electric, such as when the small shape is sensed by the t50, above the part sense :) The surface of the wire meter cover is larger than the high dielectric f (absolutely 1 1 to the resistance of the part 11 200421707). When the test object 50 is positioned on the lower sensor 2 during measurement, it becomes a bump electrode (projection) carried on the circuit board. The part of the block) is arranged on the lower sensor 2 according to the position of the protruding part. Therefore, the round parts 2 1 to 2 of the electrodes 1 1 to 1 7 are on the lower sensor 2. It becomes the same position as the protruding portion arranged on the formation position of the through hole according to the inspection object 50. In addition, the portions of the electrodes 11 to 17 that are not covered by the high-dielectric film 8 have a function as a measurement terminal. The bridge circuit 1 is connected to the part through the lead 20. The lead 20 is properly connected to and becomes the inspection. The electrodes 1 1 to 17 corresponding to the conductive pattern (through-hole) of the object. In addition, the coaxial cable or shielded wire can be used as the lead 20 to avoid the influence of external noise and other structures. During resistance measurement, As shown in FIG. 2, the inspection object 50 is sandwiched between the lower and upper sensors 2 and 3 to form through-holes 35 and 36 formed in the inspection object 50 in such a state of close contact with each other. The state close to the copper plate 4 is maintained through the high-dielectric film 5, and the other end is electrically connected to the protrusions 31 and 32 of the through-holes 35 and 36 and the high-dielectric film 8 to maintain contact with the electrodes 1 1 to 1 7 Approaching state. Here, approaching state refers to the applied electrical signal, which is insulated (non-contact) on DC, and turned on on AC (especially high-frequency signals). The bridge circuit 1 has the following description. A high-frequency signal supply source, which is supplied (applied) between the copper plate 4 of the upper sensor 3 and the electrodes 1 1 to 17 on the lower sensor 2. Therefore, it is closely attached to these sensors. Inspection objects between testers 2 and 3 50 through holes 3 5 and 3 6 This high-frequency signal is also applied during resistance measurement 12 312 / Invention Specification (Supplement) / 93-05 / 93103667 200421707. At this time, the inspection object 50 is connected to one side of the impedance bridge constituting the bridge circuit 1, and the inspection The object 50 has a circuit structure equivalently composed of resistance components, capacitance components, etc. of the through-holes 35 and 36 of the circuit substrate, as shown below. The circuit inspection (resistance measurement of the circuit inspection device of this embodiment example) will be described below. ) And the structure of the circuit inspection device. Fig. 3 shows the specific circuit structure of the circuit inspection device (including the above-mentioned bridge circuit 1) of this embodiment. As shown in Fig. 3, the circuit inspection device receives a high-frequency signal from a high-frequency signal oscillator (OSC) 51, and has an impedance bridge 41 for obtaining a balanced / unbalanced state of the bridge. Constructed to be arranged on the four sides (4 branches) of the impedance bridge 41: pure resistors R1, R3 (the resistance values of these are equal (R1 = R3)); variable resistors R2 and variable Capacitor C1 is a circuit element connected in series; and an inspection object with unknown impedance Zx. In this circuit inspection device, the high-frequency signal from the high-frequency signal oscillator 51 is applied between A and D of the impedance bridge 41 to obtain the equilibrium state of the bridge 41 at this time. The phase difference and level difference between the current) and the voltage can be used to obtain the resistance value of the inspection object. At this time, as described above, the inspection target 50, the electrodes 11 to 17 serving as the input part of the measurement signal, and the sensor 3 maintained as the upper part of the ground (GND) board are passed through the high-dielectric film 8, 5 It is in a non-contact state on DC, and is in a conductive state with respect to high-frequency signals. Since the high-frequency signal oscillator 51 supplies the bridge 41 with a high-frequency signal, for example, a number of 10 μM Η z to a number of 100 μM Η ζ, an object receiving such a high-frequency signal may have a reduced impedance. That is, the path of the high-frequency signal is from the oscillation source through 13 312 / Invention Specification (Supplement) / 93-05 / 93103667 200421707 to intervene in the high-dielectric thin film of the inspection target, and flows through the through-holes constituting the inspection target. , Reach the circuit ground. Therefore, when the bridge 41 is not in an equilibrium state, the path of the point A-point C-ZX-point D and the path of the point A-point B-point D of the bridge 41 have phase sums, respectively. High-frequency currents i!, I 2 of different levels flow. In addition, if the high-frequency signal is a waveform whose phase difference is easy to determine, a sine wave signal or a rectangular wave signal may be used. Therefore, when the bridge 41 is unbalanced, high-frequency currents i !, i2 of different phases and levels flow at points C and B of the bridge 41, resulting in a level difference between the currents i I and i2, and Level difference between voltages V! And v2. Among these signal level differences, the voltage difference is directly amplified by a differential amplifier 42 connected to points C and B, and is output as a voltage level difference Δν. On the other hand, the current difference is connected to the voltage-current conversion unit 40 at point C and point B and converted into a current component according to the voltage component, and then amplified by the difference amplifier 53 in the next stage. Therefore, the difference between the currents of the bridge 41 becomes the level difference ΔI of the currents at the points C and B of the bridge 41, and is output by the differential amplifier 53. In addition, the input impedances of these differential amplifiers 42 and 53 are extremely high (usually several mega-ohms to several 100 mega-ohms), so the current flowing into their input terminals can be ignored. In addition, the differential amplifiers 42 and 53 have an amplification characteristic of a bandwidth of several MHz or more, a high gain at a differential input, and a function of removing in-phase components. In the analog signal, the current level difference ΔI and the voltage level difference Δ V, the current level difference Δ I is converted into a digital signal indicating the value in the A / D conversion section 54, and the voltage level difference Δ V The A / D conversion section 43 is converted into a digital signal corresponding to the bit error of bit 14 312 / Invention Specification (Supplement) / 93-05 / 93103667 200421707. In addition, when the bridge 41 is in an unbalanced state, the phases of the high-frequency currents i 1 and i 2 flowing in the branches of the bridge also become different (that is, a phase difference occurs between the two currents). Here, because the resistances R1 and R3 of the two adjacent branches (AB, AC) arranged on the bridge 41 are adjusted to be equal, the unbalanced state where the phase difference occurs in the branch current means that the The impedance Zbd (Z bd = R 2 + 1 / j ω C 1) of the circuit element arranged on the branch indicated by BD of the bridge 41 is not electrically equivalent to the unknown impedance Z χ connected on the branch indicated by OD. Therefore, the determination unit 55 determines whether the digital value after the A / D conversion is within the specified range. That is, the outputs from the A / D conversion sections 4 3 and 5 4 are respectively branched according to the circuit elements (impedance) of the bridge, and the voltage level difference and current level difference of the high-frequency signal are converted into digital values. The determination unit 55 determines whether these values are within a predetermined threshold. Substantially, the judgment circuit 5 5 judges whether the resistance component of the inspection object (the through hole of the circuit board) is good when the branch current of the bridge 41 has no phase difference. Therefore, if the value of the resistance component is within a predetermined threshold value, the determination unit 55 determines that the value of the resistance component (the measured resistance value of the through-hole of the circuit substrate) to be inspected is normal, and outputs its determination. Results R. In the circuit inspection device of this embodiment, a phase comparison section 47 is connected to the points C and B of the bridge 41 in addition to the differential amplifiers 4 2 and 5 3 described above. The phase comparison section 47 makes each phase 0 of the currents i 1 and i 2 flowing in the bridge 41 in an unbalanced state. , 0! For comparison, and output the difference 15 312 / Invention Specification (Supplement) / 93-05 / 93103667 200421707 00-01 as the difference. In addition, the phase difference-reactance conversion unit 48 outputs a value X of the reactance based on the phase difference Δ0 detected by the phase comparison unit 47. That is, the phase difference Δ0 detected by the phase comparison section 47 is used as the difference of the reactance components to be output. Here, the value X is used as the judgment standard (0 Ω), which can be used to judge whether the measured resistance value is within the normal (appropriate) range. (For example, when the value deviates significantly from the judgment standard 0 (Ω), the resistance value cannot be an appropriate measured value). Fig. 4 is an equivalent circuit of an unknown impedance Zx (46) connected to the branch C-D of the bridge 41. As the measurement target of the circuit inspection device of this embodiment, the through-holes 35 and 36 made of copper, for example, are arranged in the above-mentioned inspection target 50 (circuit board). When the through-hole is represented by an electrical equivalent circuit, as shown in FIG. 4, for example, it can be regarded as having a circuit structure 61, which includes: a resistance component R, which is equivalent to the length of the path; a parasitic inductance component L, It is connected in series with this resistance component R; and a parasitic capacitance component C. In addition, in the circuit inspection device of this embodiment, as described above, a high-frequency signal is used as a measurement signal, and the inspection object 50 is electrically connected to the upper sensor 3 and the lower sensor via the high-dielectric film 8 and 5. Tester 2 (conducted by high-frequency signal). Therefore, there is a capacitor component connected in series between the sensors 2, 3 and the inspection object 50 using the high-dielectric thin films 8, 5 in series. This capacitance component becomes two capacitors Cg shown in FIG. 4. Terminals a and b are provided on the branch CD of the bridge 41, and ZX (unknown impedance to be measured) connected to these terminals a and b is applied to the bridge. 4 1 high 16 312 / Invention Specification (Supplement) / 93-05 / 93103667 200421707 The impedance of the path through which the frequency signal passes. Therefore, as shown in FIG. 4, the equivalent circuit of Zx is a capacitor component Cg composed of high-dielectric thin films 8, 5 connected in series at both ends of the above-mentioned circuit structure 61. In this way, in the circuit inspection device of this embodiment, the difference (phase difference) in the reactance obtained from the measurement of the current and voltage of the bridge is converted into a capacitance, and the difference in signal level is converted into a resistance value. , Which is equivalent to the impedance component (consisting of the resistance component and reactance component of the through-hole) of the measurement path constituted by the through-hole of the circuit board and the like. At this time, because the capacitance components formed by the high-dielectric thin films 8 and 5 in the measurement path are known, by performing the reactance correction of the capacitance components, the parasitic inductance component L and the parasitic capacitance component C of the through-hole can be accurately detected. Composition of reactance. On the other hand, if the bridge 41 is in a balanced state, the unknown impedance of the inspection object 50 is ZX = R + j X, and R3 · (R2 + 1 / j ω Cl) = R1 · (R + j X) .. ... (1), the equilibrium conditions are R2 · R3 = R · R1, and X · Rl = -R3 / w Cl. ....... (2) In addition, because R1 = R3, the relationship of Zbd = Zx can be established, and becomes R = R2, X = -1 / ω C1 ...................................... ... (3). As a result, the resistance components and inductance components of the circuit elements arranged in the branches B-D of the bridge 41 directly become the resistance components and reactance components of the through-holes to be measured. 17 312 / Description of the Invention (Supplement) / 93-05 / 93103667 200421707 Therefore, the points C and B of the bridge 41 in the equilibrium state have a current flowing in the same phase and signal level. Therefore, no voltage level difference or current level difference will occur between points C and B. Therefore, the voltage and current level differences Δν, ΔΙ of the outputs of each of the differential amplifiers 4 2 and 5 3 are both Become zero. At this time, since the phase comparison section 47 cannot detect a phase difference with respect to the in-phase signal, the output (phase difference Δ 0) of the phase comparison section 47 also becomes zero. In addition, in the circuit inspection device of this embodiment, the voltage level difference ΔV of the output of the differential amplifier 42 and the phase difference Δ0 detected by the phase comparison section 47 are fed back to the CR adjustment section 5 2. Adjust the variable resistor R2 and the variable capacitor C1 of the branch BD of the impedance bridge 41 according to the feedback amount. This adjustment is repeated until both the voltage level difference and the phase difference become zero (the value X of the reactance output from the phase difference-reactance conversion section 48 becomes zero). That is, the adjustment is repeated until the impedance Zbd composed of the circuit elements R 2 and C 1 and the impedance ZX to be measured become equal, and the phases and levels of the voltages V 1 and V 2 become the same (there is no phase difference and level difference). . The following describes a method for inspecting a circuit provided with the circuit inspecting device having the above structure. Fig. 5 is a flowchart showing the inspection (resistance measurement) steps of the circuit inspection device of this embodiment. First, in step S1 of FIG. 5, the circuit board of the inspection target (measurement target) is mounted at a designated position of the inspection device. The designated position here refers to the positions of the rounded portions 2 1 to 2 7 of the electrodes 1 1 to 17 arranged on the lower sensor 2 shown in FIG. 1 and the like. The parts are aligned with the through holes of the circuit substrate to be inspected. In addition, loading of the inspection object may be performed by a transfer robot not shown in the figure, or the loading operation may be performed directly by the measuring person (operator) himself. 18 312 / Invention Specification (Supplement) / 93-05 / 93103667 200421707 In step S2, a high-frequency signal (measurement signal) is supplied to the impedance bridge including the inspection object. At this time, according to the equilibrium state of the bridge, a part of the applied high signal current is shunted to the inspection object, and the rest of the current shunt is an electric element formed by the above-mentioned variable resistor R2 and variable capacitor C1 connected in series. In step S3, the voltage level, current level difference, and level difference of the high-frequency signal flowing in the inspection object and a predetermined high-frequency signal flowing to the circuit element are detected. Then, in step S5, based on the level difference and phase difference detected in the above step S3, the resistance component and the reactance component of the inspection object are obtained, and it is determined whether or not the values are within a preset threshold. If the determination result in step S 5 is N 0, because the resistance component and reactance component of the inspection object are not within the preset threshold value, indicating the values outside them, the conductive pattern determined as the inspection object in step S 7 is, for example, The adjacent pattern is short-circuited, or there is a disconnection in the middle, and the conductive pattern becomes defective. However, if the detection value from the inspection object is within a preset threshold value, it is determined in step S8 that the conductive pattern is normal. The process is then advanced to step S 1 0. In step S10, it is determined whether the measurement of all the conductive patterns has been completed. If the measurement is not completed, the conductive pattern to be inspected is changed in step S1. Perform the change of the electrode 1 1 to 17 (including the change of the connection of the lead) for inputting the measurement signal shown in FIG. 1 in quality, and supply a high-frequency signal to the next conductive pattern of the inspection object, and repeat the steps after step S 3 again. deal with. On the other hand, when the measurement of all conductive patterns is completed, the supply of high-frequency signals is stopped at step S 1 5 and the inspection object is removed and inspected 312 / Invention Specification (Supplement) / 93-05 / 93103667 Set the phase-to-phase power at the road to settle with the state 9 in the actual exchange case 9 check 19 200421707 device, and end the measurement process. In the example of this embodiment, if the phase difference-reactance conversion unit 4 8 detects the phase difference Δ 0 based on the phase comparison circuit 4 7 and the output reactance value X is zero, the high-frequency signal oscillator 51 will accept the X is used as the oscillation stop signal, and the oscillation of the high-frequency signal is stopped at the end of the measurement. As described above, the inspection object is connected to one side of the bridge of the impedance bridge circuit. When the inspection (resistance value measurement) is performed according to the equilibrium state of the bridge, a high-frequency signal is used as a measurement signal to make the inspection object It is electrically connected to the bridge circuit through a high-dielectric film to constitute a signal path of the measurement signal, and the resistance value of the conductive pattern on the circuit substrate of the inspection target can be measured in a non-contact state with the inspection device. In addition, since the inspection object and the inspection device can maintain a non-contact state during inspection, it can also be applied to the resistance measurement of a circuit board having a complex circuit pattern structure with a mixed conductive pattern. In addition, the constituent elements of the impedance bridge circuit use frequency-independent resistors, and the phase and level of the current flowing in the bridge are maintained in a balanced state in the same way, while the capacitance and resistance values of the constituent elements of the bridge are adjusted The resistance measurement can be performed while maintaining resistance to external noise and other disturbances. All components can mitigate its variation equivalently, which can improve the measurement accuracy. In addition, the phase difference of the reactance components obtained through inspection can ensure a wide measurement range. In addition, the present invention is not limited to the above-mentioned embodiment examples, and various changes can be made without departing from the gist of the present invention. For example, instead of the above-mentioned adjustment of the variable resistor R 2 and the variable capacitor C1, the structure 20 312 / Invention Specification (Supplement) / 93-05 / 93103667 200421707 can be configured to be based on the phase comparison section 47. The detected phase difference Δ 0 is subjected to phase shifting (phase shift processing), and a multiplier is used to multiply the phase-shifted signal and the signal (original signal) from the high-frequency signal oscillator 51. With this multiplication, the frequency of the high-frequency signal applied to the bridge 41 is transformed according to the phase shift amount. Based on the applied high-frequency signal, the value of the reactance X at the output of the phase difference-reactance conversion section 48 becomes zero. At that time, a resistance component independent of frequency can be measured. As described above, according to the present invention, the inspection object and the inspection device can be maintained in a non-contact state, and the resistance of the conductive pattern of the inspection object can be measured with good accuracy. In addition, according to the present invention, it is possible to determine whether a conductive pattern of a circuit board or the like is good with a simple structure. [Brief description of the drawings] Fig. 1 is a perspective view of an external appearance for showing a method for performing a circuit inspection using the circuit inspection device of this embodiment. Fig. 2 is a sectional view showing a positional relationship between an inspection device and an inspection object during a circuit inspection. Fig. 3 shows a specific circuit configuration of the circuit inspection device according to the embodiment. FIG. 4 shows an equivalent circuit of an inspection object having an unknown impedance Zx. Fig. 5 is a flowchart showing the inspection steps of the circuit inspection device according to the embodiment. (Description of component symbols)
Rl 、 R3 純電阻 21 312/發明說明書(補件)/93-05/93103667 200421707 R2 可 變 電 阻 C1 可 變 電 容 Z X 未 知 阻 抗 1 電 橋 電 路 2 下 部 感 測 器 3 上 部 感 測 器 4 銅 板 5、ί 5 高 介 電 質 薄 膜 9 絕 緣 基 板 1 1〜 17 電 極 20 導 線 2 1〜 27 圓 狀 部 31、 32 突 起 部 35 ' 36 穿 通 孔 40 電 壓 — 電 流 變 換 部 41 阻 抗 電 橋 42〜 53 差 動 放 大 器 43、 54 A/D : 變： 換， 47 相 位 比 較 部 48 相 位 差 — 電 抗 變 換部 50 檢 查 對 象 51 高 頻 信 號 振 盪 器 52 CR 調 整 部 55 判 定 部 312/發明說明書(補件)/93-05/93103667 22Rl, R3 Pure resistance 21 312 / Invention specification (Supplement) / 93-05 / 93103667 200421707 R2 Variable resistor C1 Variable capacitor ZX Unknown impedance 1 Bridge circuit 2 Lower sensor 3 Upper sensor 4 Copper plate 5, ί 5 High-dielectric film 9 Insulating substrate 1 1 ~ 17 Electrode 20 Conductor 2 1 ~ 27 Round part 31, 32 Protruding part 35 '36 Through-hole 40 Voltage-current conversion part 41 Impedance bridge 42 ~ 53 Differential amplifier 43, 54 A / D: change: change, 47 phase comparison section 48 phase difference-reactance conversion section 50 inspection object 51 high-frequency signal oscillator 52 CR adjustment section 55 determination section 312 / invention specification (supplement) / 93-05 / 93103667 22