CN104767572A - Interstage tester of wireless communication device - Google Patents
Interstage tester of wireless communication device Download PDFInfo
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- CN104767572A CN104767572A CN201410009133.5A CN201410009133A CN104767572A CN 104767572 A CN104767572 A CN 104767572A CN 201410009133 A CN201410009133 A CN 201410009133A CN 104767572 A CN104767572 A CN 104767572A
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Abstract
The invention provides an interstage tester of a wireless communication device. The wireless communication device includes a component to be tested and an inferior component, wherein the component to be tested is electrically connected with the inferior component via a signal line. The interstage tester is arranged on the signal line, electrically connected with the component to be tested and the inferior component, and provided with an upper plate, a lower plate and an intermediate layer. The intermediate layer is arranged between the upper plate and the lower plate, and comprises a first block and a second block, the first block generates an air impedance, and the second block generates a regulation impedance. Thus, the interstage tester can be used to test the state of the component to be tested in the wireless communication device according to the air impedance and the regulation impedance.
Description
Technical field
The invention provides a kind of inter-stage testing apparatus, and particularly relate to a kind of inter-stage testing apparatus of radio communication device, for the inter-stage testing apparatus of the situation of element in test wireless communication device.
Background technology
Radio communication (wireless communication) has become a kind of designer trends of mobile product with regard to current technology.Wireless communication unit is generally and is arranged at System on Chip/SoC (System onChip, be called for short SoC) in, make System on Chip/SoC can by the circuit of wireless communication unit in addition microminiaturized and modularization, and required function element is integrated in single chips, and form radio communication device, to meet the demand of mobile product now.
But because the function element in radio communication device is numerous, if there is certain function element to have flaw in radio communication device, general detecting instrument is not easy to detect which function element has flaw.Function in order to ensure radio communication device is normal, if when known discoverys radio communication device usefulness is not good or certain function element has a flaw, namely abandon whole system chip, reality belongs to waste.
Summary of the invention
In view of this, the invention provides a kind of inter-stage testing apparatus of radio communication device.Described inter-stage testing apparatus can detect the situation of element in radio communication device, and changes when inter-stage testing apparatus detects the element of flaw or damage.By this, user only needs to change to be had the element of flaw or damage in radio communication device and not to need to abandon whole radio communication device, and manufacturing cost can be made significantly to reduce.
The embodiment of the present invention provides a kind of inter-stage testing apparatus of radio communication device.Radio communication device is provided with earth connection on an element under test, a holding wire, once earth connection and subordinate's element.Element under test is respectively by upper earth connection, holding wire, lower earth connection electrical connection subordinate element.Inter-stage testing apparatus comprises upper plate, lower plate and intermediary layer.First earth electrode of lower plate is by upper earth connection electrical connection the first earth terminal of element under test and the 3rd earth terminal of subordinate's element.The lower plate pickup electrode of lower plate is by the holding wire electrical connection measured signal end of element under test and subordinate's signal end of subordinate's element.And the second earth electrode of lower plate is by lower earth connection electrical connection the second earth terminal of element under test and the 4th earth terminal of subordinate's element.Intermediary layer is arranged between upper plate and lower plate.Intermediary layer comprises the first block and the second block, and the first block is adjacent second zone block.First block has air chamber, and air chamber contact lower plate, to produce fixing air impedance.Second block then has impedance adjustment chamber, and impedance adjustment chamber contact lower plate.Wherein, in impedance adjustment chamber, there is conducting resinl, ground plate, substrate layer and metallic plate.Conducting resinl is located in lower plate, in order to ground plate to be electrically connected the first earth electrode and the second earth electrode.Conducting resinl is sequentially folded and is provided with ground plate, substrate layer and metallic plate.Substrate layer has a predetermined thickness, regulates impedance to produce according to predetermined thickness.
Comprehensive the above, the inter-stage testing apparatus of the radio communication device that the embodiment of the present invention provides and can regulate the impedance ratio between impedance detect the situation of element under test in radio communication device according to air impedance.
Further understand feature of the present invention and technology contents for enable, refer to following detailed description for the present invention and accompanying drawing, but these illustrate and institute's accompanying drawings is only used to the present invention is described, but not any restriction is done to right of the present invention.
Accompanying drawing explanation
Figure 1A is the schematic diagram of the radio communication device of one embodiment of the invention.
Figure 1B is the schematic diagram of the element under test in the inter-stage testing apparatus test wireless communication device of one embodiment of the invention.
Fig. 2 A is the exploded view of the inter-stage testing apparatus of one embodiment of the invention.
Fig. 2 B is the exploded view of the intermediary layer of one embodiment of the invention.
Fig. 3 A is the exploded view of the inter-stage testing apparatus of another embodiment of the present invention.
Fig. 3 B is the end view of the inter-stage testing apparatus of another embodiment of the present invention.
Fig. 4 A is the equivalent circuit diagram of the detecting element inter-stage testing apparatus not in electrical contact of another embodiment of the present invention.
Fig. 4 B is the equivalent circuit diagram of the detecting element inter-stage testing apparatus in electrical contact of another embodiment of the present invention.
[symbol description]
10: radio communication device
20: element under test
30: subordinate's element
38: upper earth connection
40: holding wire
42: lower earth connection
50: testing apparatus
55: detecting element
55a: upper grounded probe
55b: signal probe
55c: lower grounded probe
100,200: inter-stage testing apparatus
110,210: upper plate
120,220: intermediary layer
122,222: conducting resinl
123: protuberance
124,224: ground plate
126,226: substrate layer
128,228: metallic plate
130,230: lower plate
ACT: air chamber
CL: lower joint pin
CS: signal joint pin
CU: upper joint pin
PG1: the first earth electrode
PG2: the second earth electrode
PG3: the three earth electrode
PG4: the four earth electrode
PLS: lower plate pickup electrode
PUS: upper plate pickup electrode
R1, R11: the first block
R2, R22: the second block
TG1: the first earth terminal
TG2: the second earth terminal
TG3: the three earth terminal
TG4: the four earth terminal
TNS: subordinate's signal end
TTS: measured signal end
HL: lower perforation
HS: signal perforation
HU: upper perforation
Z1: air impedance
Z2: regulate impedance
ZCT: impedance adjustment chamber
Zt: Impedance measurement
Embodiment
Hereinafter, the present invention will be described in detail by graphic explanation various example embodiment of the present invention.But concept of the present invention may embody in many different forms, and should not be construed as and be limited to set forth exemplary embodiment herein.In addition, graphic middle same reference numbers can in order to element like representation class.
First, please refer to Figure 1A and Figure 1B, Figure 1A is the schematic diagram of the radio communication device of one embodiment of the invention.Figure 1B is the schematic diagram of the element under test in the inter-stage testing apparatus test wireless communication device of one embodiment of the invention.
As illustrated in figures ia and ib, radio communication device 10 has element under test 20, subordinate's element 30, upper earth connection 38, holding wire 40 and lower earth connection 42.Element under test 20 is electrically connected to subordinate's element 30 respectively by upper earth connection 38, holding wire 40 and lower earth connection 42.In the present embodiment, element under test 20 is certain element in radio communication device, and is electrically connected with previous stage element (be not plotted in graphic in).Subordinate's element 30 is then the next stage element of element under test 20.If user is for detecting the situation of element under test 20, the inter-stage testing apparatus 100 of the present embodiment can be arranged between element under test 20 and subordinate's element 30 and (be arranged on upper earth connection 38, holding wire 40 and lower earth connection 42 by inter-stage testing apparatus 100) by user, as shown in Figure 1B.Certainly, if user is for detecting the situation of subordinate's element 30, the inter-stage testing apparatus 100 of the present embodiment can be arranged between subordinate's element 30 and its next stage element by user.For convenience of description, next will be arranged between element under test 20 and subordinate's element 30 with inter-stage testing apparatus 100, and the situation detecting element under test 20 explains.
Then, please also refer to Fig. 2 A, Fig. 2 A is the exploded view of the inter-stage testing apparatus of one embodiment of the invention.As shown in Figure 2 A, element under test 20 is electrically connected subordinate's element 30 respectively by upper earth connection 38, holding wire 40 and lower earth connection 42.Inter-stage testing apparatus 100 comprises upper plate 110, lower plate 120 and intermediary layer 130.First earth electrode PG1 of lower plate 130 is electrically connected the first earth terminal TG1 of element under test 20 and the 3rd earth terminal TG3 of subordinate's element 30 by upper earth connection 38.The lower plate pickup electrode PLS of lower plate 130 is electrically connected the measured signal end TTS of the element under test 20 and subordinate signal end TNS of subordinate's element 30 by holding wire 40.Second earth electrode PG2 of lower plate 130 is then electrically connected the second earth terminal TG2 of element under test 20 and the 4th earth terminal TG4 of subordinate's element 30 by lower earth connection 42.Intermediary layer 120 is then located between upper plate 110 and lower plate 130.Inter-stage testing apparatus 100 is made to form the inter-stage test structure of dual-port ground-signal-ground (Ground-Signal-Ground is called for short GSG).In the present embodiment, the first earth electrode PG1, lower plate pickup electrode PLS and the second earth electrode PG2 can be arranged in lower plate 130, to be electrically connected with upper earth connection 38, holding wire 40 and lower earth connection 42 respectively, as shown in Figure 2 A.Or the first earth electrode PG1, lower plate pickup electrode PLS and the second earth electrode PG2 can arrange and be exposed to the bottom of lower plate 130, to facilitate with upper earth connection 38, holding wire 40 and lower earth connection 42 (not being plotted in Fig. 2 A) in electrical contact.And the relation that arranges of the first earth electrode PG1, lower plate pickup electrode PLS, the second earth electrode PG2 and upper earth connection 38, holding wire 40 and lower earth connection 42 also can design according to actual situation, the present invention is not restricted this.
Therefore, user can utilize external testing apparatus electrical connection inter-stage testing apparatus 100 to measure the current situation of element under test 20.Such as, external test arrangements is electrically connected to the first earth electrode PG1, the lower plate pickup electrode PLS of lower plate 130 and whether the second earth electrode PG2 has flaw or damage (not being plotted in Fig. 2 A) to measure element under test 20.Again such as, upper plate 110 has three contact poles, and three contact poles are electrically connected to the first earth electrode PG1, lower plate pickup electrode PLS and the second earth electrode PG2 respectively, whether element under test 20 is extremely measured in three contacts making external test arrangements can contact upper plate 110 flaw or damage (not being plotted in Fig. 2 A), and the present invention is not restricted this.In addition, in the present embodiment, upper plate 110 and lower plate 130 are printed circuit board (PCB) (printed circuitboard is called for short PCB).Intermediary layer 120 is isolation material, and is preferably plastic material, and the present invention is not restricted this.
Come, please also refer to Fig. 2 B, intermediary layer 120 comprises the first block R1 and the second block R2, and the first block R1 adjacent second zone block R2.In the present embodiment, the area equation of the first block R1 and the second block R2, affects the testing result of inter-stage testing apparatus 100 to avoid unnecessary stray capacitance to produce.And if stray capacitance is too small to ignoring, then do not need the impact considering stray capacitance, make the area of the first block R1 and the second block R2 not need equal, the present invention is not restricted this.
First block R1 has air chamber ACT, and air chamber ACT contacts lower plate 130 to produce air impedance.In the present embodiment, air impedance is set as 50 ohm, and the signal in inter-stage testing apparatus 100 is more not easily interacted.Certainly, air impedance also can be set as other fixed value, and this is not restricted in the present invention.Second block R2 has impedance adjustment chamber ZCT, and impedance adjustment chamber ZCT contacts lower plate 130.There is in the ZCT of impedance adjustment chamber conducting resinl 122, ground plate 124, substrate layer 126 and metallic plate 128.Conducting resinl 122 is located in lower plate 130, in order to ground plate 124 to be electrically connected the first earth electrode PG1 and the second earth electrode PG2.Conducting resinl 122 is then sequentially folded and is provided with ground plate 124, substrate layer 126 and metallic plate 128.Substrate layer 126, for having the substrate of a predetermined thickness, regulates impedance to produce according to predetermined thickness.Therefore, inter-stage testing apparatus 100 and can regulate impedance to form an equiva lent impedance according to fixing air impedance.
In the present embodiment, conducting resinl 122 is arranged on around the second block R2, and is not arranged at contiguous first block R1 part, " ㄈ " font as shown in Figure 2 B.And ground plate 124 identical with the shape of conducting resinl 122 (namely ground plate 124 is " ㄈ " font with the shape of conducting resinl 122), and ground plate 124 is electrically connected to the first earth electrode PG1 and the second earth electrode PG2 by conducting resinl 222, but ground plate 124 can not be electrically connected to lower plate pickup electrode PLS, to reduce ground plate 124 and conducting resinl 122 impact is connected electrically in the holding wire 40 of lower plate pickup electrode PLS.Certainly, the shape of ground plate 124 and conducting resinl 122 also can be other kind of pattern, and the present invention is not restricted this.
At this, first earth electrode PG1 and the second earth electrode PG2 can be designed to and the Different Plane of lower plate pickup electrode PLS in lower plate 130, when making ground plate 124 can be electrically connected to the first earth electrode PG1 and the second earth electrode PG2, but lower plate pickup electrode PLS can not be electrically connected to.Or the shape of conducting resinl 122 can be set to not reach lower plate pickup electrode PLS(as, the scope that the lower plate pickup electrode PLS that the protuberance 123 of " ㄈ " font of conducting resinl 122 is designed to exceed lower plate 130 is arranged), the present invention is not restricted this.Between lower plate 130, conducting resinl 122, ground plate 124, substrate layer 126, metallic plate 128, intermediary layer 120 and upper plate 210, then utilized chip adhesive agent engages, and person of an ordinary skill in the technical field should know material and the operational mode of chip adhesive agent, therefore do not repeat them here.
In addition, in the present embodiment, ground plate 124 and metallic plate 128, for be arrangeding in parallel, make to form capacitance between ground plate 124, substrate layer 126 and metallic plate 128, and produce adjustment impedance accordingly.Because capacitance and impedance are inversely proportional to.Therefore, if the predetermined thickness of substrate layer 126 is thicker, regulate impedance will be larger.Similarly, if the predetermined thickness of substrate layer 126 is thinner, adjustment impedance will be less.Certainly, regulate impedance that the material changing substrate layer 126 also can be utilized to adjust.In the present embodiment, substrate layer 126 is glass fibre material (being called for short FR4), and also can be other materials, the present invention is not restricted this.
Therefore, user can regulate impedance according to the predetermined thickness of the working band design substrate layer 126 of element under test 20 to produce, and makes inter-stage testing apparatus 100 form according to the adjustment impedance after fixing air impedance and design the equiva lent impedance meeting the working band of element under test 20.And then user can be provided to utilize outside testing apparatus electrical connection inter-stage testing apparatus 100 to measure the current situation of element under test 20.
Next, please also refer to Fig. 3 A and Fig. 3 B.Fig. 3 A is the exploded view of the inter-stage testing apparatus of another embodiment of the present invention.Fig. 3 B is the end view of the inter-stage testing apparatus of another embodiment of the present invention.As shown in Fig. 3 A and Fig. 3 B, inter-stage testing apparatus 200 comprises upper plate 210, intermediary layer 220, lower plate 230, upper joint pin CU, signal joint pin CS and lower joint pin CL.And inter-stage testing apparatus 200 about structure and the annexation of upper plate 210, intermediary layer 220 and lower plate 230 and inter-stage testing apparatus 100 about the structure of upper plate 110, intermediary layer 120 and lower plate 130 and annexation roughly the same.
Different places is, upper plate 210 has the 3rd earth electrode PG3, upper plate pickup electrode PUS and the 4th earth electrode PG4.Lower plate 230 has the first earth electrode PG1, lower plate pickup electrode PLS and the second earth electrode PG2.And intermediary layer 220 also has upper perforation HU, signal perforation HS and lower perforation HL, to run through intermediary layer 220 respectively.3rd earth electrode PG3 is arranged by upper perforation HU is corresponding with the first earth electrode PG1, and in upper joint pin CU insertion perforation HU to be electrically connected the 3rd earth electrode PG3 and the first earth electrode PG1.Upper plate pickup electrode PUS is arranged by signal perforation HS is corresponding with lower plate pickup electrode PLS, and signal joint pin CS inserts signal perforation HS to be electrically connected upper plate pickup electrode PUS and lower plate pickup electrode PLS.4th earth electrode PG4 is arranged by lower perforation HL is corresponding with the second earth electrode PG2, and lower joint pin CL inserts lower perforation HL to be electrically connected the 4th earth electrode PG4 and the second earth electrode PG2.
In the present embodiment, upper perforation HU, the signal perforation HS of intermediary layer 220 and lower perforation HL are for being arranged in the first block R11.Second block R22 of intermediary layer 220 is provided with conducting resinl 222, ground plate 224, substrate layer 226 and metallic plate 228.And about the corresponding relation of the corresponding relation between the first block R11 with the second block R22 haply and between the first block R1 and the second block R2 identical.In addition, the structure of conducting resinl 222, ground plate 224, substrate layer 226 and metallic plate 228 is also identical with annexation with the structure of conducting resinl 122, ground plate 124, substrate layer 126 and metallic plate 128 haply with annexation.Therefore do not remake at this and repeat.
Next, user can utilize the 3rd earth electrode PG3, upper plate pickup electrode PUS and the 4th earth electrode PG4 of detecting element 55 inter-stage testing apparatus 200 in electrical contact, and detecting element 55 is electrically connected to measurement mechanism 50, to measure the current situation of element under test 20 further, as shown in Figure 3 B.In the present embodiment, detecting element 55 can be a probe, and detecting element 55 has upper grounded probe 55a, signal probe 55b and a lower grounded probe 55c(i.e. probe corresponds to three probes).Upper grounded probe 55a the 3rd earth electrode PG3 in electrical contact.Signal probe 55b upper plate pickup electrode in electrical contact PUS.Lower grounded probe 55c the 4th earth electrode PG4 in electrical contact.Make user that the detecting element 55 on measurement mechanism 50 can be utilized to be electrically connected to inter-stage testing apparatus 200, and measure the situation of element under test 20 with the inter-stage test structure of GSG.And the project that detecting element 55 also can measure element under test 20 according to actual needs changes, the present invention is not restricted this.
In addition, if inter-stage testing apparatus 200 does not go up joint pin CU, signal joint pin CS and lower joint pin CL.3rd earth electrode PG3 is arranged by upper perforation HU is corresponding with the first earth electrode PG1, but the 3rd earth electrode PG3 is not electrically connected the first earth electrode PG1.Upper plate pickup electrode PUS is arranged by signal perforation HS is corresponding with lower plate pickup electrode PLS, but upper plate pickup electrode PUS is not electrically connected lower plate pickup electrode PLS.And the 4th earth electrode PG4 arrange by lower perforation HL is corresponding with the second earth electrode PG2, but the 4th earth electrode PG4 is not electrically connected the second earth electrode PG2(is not plotted in Fig. 3 A-Fig. 3 B).
User also can utilize grounded probe 55a by perforation HU to the first earth electrode PG1 in the 3rd earth electrode PG3 insertion, makes the 3rd earth electrode PG3 be electrically connected the first earth electrode PG1.Signal probe 55b inserts signal perforation HS to lower plate pickup electrode PLS by upper plate pickup electrode PUS, upper plate pickup electrode PUS is made to be electrically connected lower plate pickup electrode PLS, and lower grounded probe 55c inserts lower perforation HL to the second earth electrode PG2 by the 4th earth electrode PG4, makes the 4th earth electrode PG4 be electrically connected the second earth electrode PG2.By this, user can utilize the detecting element 55 on measurement mechanism 50 to be electrically connected to inter-stage testing apparatus 200 then, and measures the situation (not being plotted in Fig. 3 A-3B) of element under test 20 with the inter-stage test structure of GSG.
How user utilizes inter-stage testing apparatus 200 to measure the situation of element under test 20 for convenience of description, below during inter-stage testing apparatus 200 not in electrical contact with the detecting element 55 of measurement mechanism 50, the air impedance in inter-stage testing apparatus 200 and adjustment impedance design are 50 ohm; And during the detecting element 55 of measurement mechanism 50 inter-stage testing apparatus 200 in electrical contact, the air impedance in inter-stage testing apparatus 200 is designed to 50 ohm and regulate impedance design to be 24 ohm to explain.Therefore, measurement mechanism 50 can further surveying work in the situation of the element under test 20 of 2.4Ghz/5Ghz ISM band.
As shown in fig. 4 a and fig. 4b, Fig. 4 A is the equivalent circuit diagram of the detecting element inter-stage testing apparatus not in electrical contact of another embodiment of the present invention.Fig. 4 B is the equivalent circuit diagram of the detecting element inter-stage testing apparatus in electrical contact of another embodiment of the present invention.When detecting element 55 is not had electrical contact to inter-stage testing apparatus 200 by user, the electrical connection of one end of air impedance Z1 is regulated one end of impedance Z 2 by the equivalent circuit diagram of inter-stage testing apparatus 200, and namely the other end of air impedance Z1 electrical connection measured signal end TTS(is electrically connected to element under test 20), regulate the other end of impedance Z 2 to be then electrically connected to subordinate signal end TNS(and be namely electrically connected to subordinate's element 30).Air impedance Z1 and adjustment impedance Z 2 are 50 ohm (namely the equiva lent impedance of whole inter-stage testing apparatus 200 is 50 ohm), as shown in Figure 4 A.
And when detecting element 55 is had electrical contact to inter-stage testing apparatus 200 by user, and when providing Impedance measurement Zt to be 50 ohm (namely identical with air impedance Z1), upper grounded probe 55a is electrically connected the first earth electrode PG1 by the 3rd earth electrode PG3, signal probe 55b is electrically connected lower plate pickup electrode PLS by upper plate pickup electrode PUS, and lower grounded probe 55c is electrically connected the second earth electrode PG2(by the 4th earth electrode PG4 and is not plotted in Fig. 4 B).
Now, the equivalent circuit diagram of inter-stage testing apparatus 200 is one end of one end electrical connection adjustment impedance Z 2 of air impedance Z1.Namely the other end electrical connection measured signal end TTS(of air impedance Z1 is electrically connected to element under test 20) and one end of Impedance measurement Zt.The other end of Impedance measurement Zt is electrically connected to upper plate pickup electrode PUS, to be electrically connected to outside measurement mechanism 50 by detecting element 55.Regulate the other end of impedance Z 2 then ground connection (namely regulate between impedance Z 2 and subordinate's element 30 and be equivalent to open circuit).Now, air impedance is still 50 ohm, but regulates impedance to change into by 50 ohm 24 ohm (namely the equiva lent impedance of whole inter-stage testing apparatus 200 is 24/50 ohm), as shown in Figure 4 B.
Then, measurement mechanism 50 can measure the current situation of signal that element under test 20 exports then.For example, element under test 20 should export the signal of 15dBm under normal circumstances.If measurement mechanism 50 measures the signal of 15dBm, represent the element that element under test 20 is normal operation.And if measurement mechanism 50 measures the signal of 10dBm, then represent the element that element under test 20 is flaw or damage.Now, user then problematic element under test 20 can be replaced by can the element under test 20 of normal operation.
In sum, the inter-stage testing apparatus that the embodiment of the present invention provides can detect the situation of element in radio communication device, and changes when inter-stage testing apparatus detects the element of flaw or damage.By this, user only needs to change to be had the element of flaw or damage in radio communication device and not to need to abandon whole radio communication device, and manufacturing cost can be made significantly to reduce.
The foregoing is only embodiments of the invention, it is also not used to limit to the scope of the claims of the present invention.
Claims (10)
1. the inter-stage testing apparatus of a radio communication device, described radio communication device has earth connection on an element under test, a holding wire, once earth connection and subordinate's element, described element under test is electrically connected described subordinate element respectively by described upper earth connection, described holding wire and described lower earth connection, it is characterized in that, described inter-stage testing apparatus comprises:
One upper plate;
One lower plate, one first earth electrode of described lower plate is electrically connected one first earth terminal of described element under test and one the 3rd earth terminal of described subordinate element by described upper earth connection, the pole of partitioned signal once of described lower plate is electrically connected a measured signal end of described element under test and subordinate's signal end of described subordinate element by described holding wire, and one second earth electrode of described lower plate is electrically connected one second earth terminal of described element under test and one the 4th earth terminal of described subordinate element by described lower earth connection; And
One intermediary layer, be arranged between described upper plate and described lower plate, described intermediary layer comprises one first block and one second block, contiguous described second block of described first block, described first block has an air chamber, and described air chamber contacts to produce an air impedance with described lower plate, described second block has an impedance adjustment chamber, and described impedance adjustment chamber contacts with described lower plate;
Wherein, there is in described impedance adjustment chamber a conducting resinl, a ground plate, a substrate layer and a metallic plate, described conducting resinl is arranged in described lower plate, in order to described ground plate is electrically connected described first earth electrode and described second earth electrode, and sequentially foldedly on described conducting resinl be provided with described ground plate, described substrate layer and described metallic plate, described substrate layer has a predetermined thickness, regulates impedance to produce one according to described predetermined thickness.
2. the inter-stage testing apparatus of radio communication device according to claim 1, it is characterized in that, described upper plate has one the 3rd earth electrode, a upper plate pickup electrode and one the 4th earth electrode, described intermediary layer also has perforation on, a signal perforation and once perforation, described 3rd earth electrode is arranged accordingly by described upper perforation and described first earth electrode, described upper plate pickup electrode is arranged accordingly by described signal perforation and described lower plate pickup electrode, and described 4th earth electrode is arranged accordingly by described lower perforation and described second earth electrode.
3. the inter-stage testing apparatus of radio communication device according to claim 1, is characterized in that, described conducting resinl is located at around described second block, and described conducting resinl is not arranged on the position of contiguous described first block.
4. the inter-stage testing apparatus of radio communication device according to claim 3, is characterized in that, the shape of described ground plate is identical with the shape of described conducting resinl.
5. the inter-stage testing apparatus of radio communication device according to claim 2, it is characterized in that, described inter-stage testing apparatus also comprises joint pin on, signal joint pin and lower joint pin, described upper joint pin inserts described upper perforation to be electrically connected described 3rd earth electrode and described first earth electrode, described signal joint pin inserts described signal perforation to be electrically connected described upper plate pickup electrode and described lower plate pickup electrode, and described lower joint pin inserts described lower perforation to be electrically connected described 4th earth electrode and described second earth electrode.
6. the inter-stage testing apparatus of radio communication device according to claim 5, it is characterized in that, described inter-stage testing apparatus also comprises a detecting element, described detecting element has grounded probe on, a signal probe and once grounded probe, described upper grounded probe described 3rd earth electrode in electrical contact, described signal probe described upper plate pickup electrode in electrical contact, described lower grounded probe described 4th earth electrode in electrical contact.
7. the inter-stage testing apparatus of radio communication device according to claim 1, is characterized in that, described intermediary layer is made up of described first block and described second block, and the area equation of the area of described first block and described second block.
8. the inter-stage testing apparatus of radio communication device according to claim 1, is characterized in that, described inter-stage testing apparatus forms an equiva lent impedance according to described air impedance and described adjustment impedance.
9. the inter-stage testing apparatus of radio communication device according to claim 1, is characterized in that, described intermediary layer is an isolation material.
10. the inter-stage testing apparatus of radio communication device according to claim 1, is characterized in that, described substrate layer is a glass fibre material.
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| CN201410009133.5A CN104767572B (en) | 2014-01-08 | 2014-01-08 | Interstage tester of wireless communication device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080224315A1 (en) * | 2007-03-14 | 2008-09-18 | Sanyo Electric Co., Ltd. | Semiconductor device and manufacturing method thereof |
| CN101581744A (en) * | 2008-05-15 | 2009-11-18 | 京元电子股份有限公司 | Device and method for detecting testing environment of circuit |
| CN101839961A (en) * | 2009-03-19 | 2010-09-22 | 广达电脑股份有限公司 | Test system and method |
| CN103281144A (en) * | 2013-06-03 | 2013-09-04 | 深圳市双赢伟业科技股份有限公司 | Method for testing wireless performance of wireless product |
-
2014
- 2014-01-08 CN CN201410009133.5A patent/CN104767572B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080224315A1 (en) * | 2007-03-14 | 2008-09-18 | Sanyo Electric Co., Ltd. | Semiconductor device and manufacturing method thereof |
| CN101581744A (en) * | 2008-05-15 | 2009-11-18 | 京元电子股份有限公司 | Device and method for detecting testing environment of circuit |
| CN101839961A (en) * | 2009-03-19 | 2010-09-22 | 广达电脑股份有限公司 | Test system and method |
| CN103281144A (en) * | 2013-06-03 | 2013-09-04 | 深圳市双赢伟业科技股份有限公司 | Method for testing wireless performance of wireless product |
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| CN104767572B (en) | 2017-04-12 |
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