TWI705253B - Detection device, socket device and a socket - Google Patents

Abstract

A detection device comprise a pressing device and a socket device. The socket device comprise a circuit board and a plurality of socket. The socket has a body, the body is disposed on the circuit board. The body and the circuit board form a receiving groove together. A lift structure, a support structure, an elasticity assembly and a probe assembly are arranged in the receiving groove. The lift structure has a recesses for accommodating the chip and the recesses is exposed outside the body. The elasticity assembly is arranged between the lift structure and the support structure. When the chip is arranged on the recesses and the lift structure is not pressed, the chip and the probe assembly are disconnected. When the chip is arranged on the recesses and the lift structure is pressed, the chip and the probe assembly are connected.

Description

Testing equipment, wafer carrying device and electrical connection unit

The invention relates to a detection equipment, a wafer carrying device and an electrical connection unit, in particular to a detection equipment, a wafer carrying device and an electrical connection unit for detecting a wafer.

The existing common memory detection equipment detects the memory by inserting multiple memories into multiple electrical connection sockets on the circuit board by manually or mechanically one by one. Afterwards, multiple memories are inspected through the circuit board and multiple electrical connectors. However, in specific applications, it often happens that the memory is not firmly connected to the electrical connector (for example, the pins of the memory are not completely connected to the pins of the electrical connector), and the memory should be a good product, but it is It was judged as a problem that failed the test and was a defective product.

The main purpose of the present invention is to provide a testing device, a chip carrying device and an electrical connection unit to improve the prior art. The memory testing equipment uses manual or mechanical arms to insert the memory into the electrical connection socket one by one for testing. During operation, it is easy to cause the problem that the memory is not firmly inserted into the electrical connector, resulting in incorrect detection results.

In order to achieve the above objective, the present invention provides an inspection device for inspecting multiple wafers. The inspection device includes a wafer carrying device and a pressing device. The chip carrying device includes: at least one circuit board and a plurality of electrical connection units. A plurality of electrical connection units are arranged on the circuit board, and the plurality of electrical connection units are used to carry multiple chips, Each electrical connection unit includes: a body, a supporting structure, a lifting structure, at least one elastic component and a plurality of probe components. The body has a top wall and a ring side wall. The top wall has an opening. One end of the ring side wall is connected with the periphery of the top wall. The other end of the ring side wall is arranged on the circuit board. The top wall, the ring side wall and the circuit board jointly form a container. Place the groove; the top wall opposite sides are defined as an outer side and an inner side, and the inner side is located in the containing groove. The supporting structure is arranged on the circuit board, and the supporting structure is located in the containing groove. The lifting structure is arranged in the accommodating groove. The lifting structure has a base and a bearing portion. The base is located in the accommodating groove, the base extends to one side to form a bearing portion, and at least a part of the bearing portion is located in the opening; the bearing portion is away from the base. A plurality of limiting portions are formed extending on one side of the, and at least a part of the plurality of limiting portions penetrates the opening, and the plurality of limiting portions and the carrying portion jointly form a wafer receiving slot for accommodating the wafer; The lifting structure also has a plurality of connecting holes, and the plurality of connecting holes penetrate the base and the bearing part. The elastic component is arranged in the accommodating groove, one end of the elastic component is fixed to the lifting structure, the other end of the elastic component is fixed to the supporting structure, the elastic restoring force generated by the pressure of the elastic component makes the base abut against the inner surface of the top wall, and A gap is formed between the lifting structure and the supporting structure. One end of each probe assembly is fixedly arranged on the supporting structure, and the probe assembly is used for connecting with the circuit board, and the other end of the plurality of probe assemblies is penetrated through the plurality of connecting holes. The pressing device can be controlled to simultaneously press the limit parts of a plurality of electrical connection units, so that the plurality of limit parts move to the inside of the corresponding body. Wherein, when the wafer accommodating groove is provided with a wafer, and the limiting portion is not pressed by the pressing device, the probe assembly located in the multiple connection holes is not connected with the multiple contact portions of the wafer. Wherein, when the chip container is provided with a chip and the pressing device abuts against the outer side surface of the top wall, the limiting part exposed on the body will be pressed by the pressing device and retracted in the body, and a plurality of probes The needle assembly abuts the contact parts, and the probe assemblies and the wafer are connected to each other.

In order to achieve the above objective, the present invention also provides a chip carrier device, which includes: a circuit board and a plurality of electrical connection units. A plurality of electrical connection units are arranged on the circuit board, and the multiple electrical connection units are used to carry multiple chips. Each electrical connection unit includes: a body, a supporting structure, a lifting structure, at least one elastic component and a plurality of probes Components. The body has a top wall and a ring side wall. The top wall has an opening. One end of the ring side wall is connected with the periphery of the top wall. The other end of the ring side wall is arranged on the circuit board. The top wall, the ring side wall and the circuit board jointly form a container. Place the groove; the top wall opposite sides are defined as an outer side and an inner side, and the inner side is located in the containing groove. The supporting structure is arranged on the circuit board, and the supporting structure is located in the containing groove. The lifting structure is arranged in the accommodating groove. The lifting structure has a base and a bearing portion. The base is located in the accommodating groove, the base extends to one side to form a bearing portion, and at least a part of the bearing portion is located in the opening; the bearing portion is away from the base. A plurality of limiting portions are formed extending on one side of the, and at least a part of the plurality of limiting portions penetrates the opening, and the plurality of limiting portions and the carrying portion jointly form a wafer receiving slot for accommodating the wafer; The lifting structure also has a plurality of connecting holes, and the plurality of connecting holes penetrate the base and the bearing part. The elastic component is arranged in the accommodating groove, one end of the elastic component is fixed to the lifting structure, the other end of the elastic component is fixed to the supporting structure, the elastic restoring force generated by the pressure of the elastic component makes the base abut against the inner surface of the top wall, and A gap is formed between the lifting structure and the supporting structure. One end of each probe assembly is fixedly arranged on the supporting structure, and the probe assembly is used for connecting with the circuit board, and the other end of the plurality of probe assemblies is penetrated through the plurality of connecting holes. Wherein, when the wafer accommodating slot is provided with a wafer, and the limiting portion is not pressed by a pressing device, the probe assembly located in the plurality of connecting holes is not connected with the multiple contact portions of the wafer. Wherein, when the chip container is provided with a chip and the pressing device abuts against the outer side surface of the top wall, the limiting part exposed on the body will be pressed by the pressing device and retracted in the body, and a plurality of probes The needle assembly abuts the contact parts, and the probe assemblies and the wafer are connected to each other.

In order to achieve the above object, the present invention further provides an electrical connection unit, which is disposed on a circuit board. The electrical connection unit includes: a body, a supporting structure, a lifting structure, elastic components, and a plurality of probe components. The body has a top wall and a ring side wall. The top wall has an opening. One end of the ring side wall is connected with the periphery of the top wall. The other end of the ring side wall is arranged on the circuit board. The top wall, the ring side wall and the circuit board jointly form a container. Place the groove; the top wall opposite sides are defined as an outer side and an inner side, and the inner side is located in the containing groove. The supporting structure is arranged on the circuit board, and the supporting structure is located in the containing groove in. The lifting structure is arranged in the accommodating groove. The lifting structure has a base and a bearing portion. The base is located in the accommodating groove, the base extends to one side to form a bearing portion, and at least a part of the bearing portion is located in the opening; the bearing portion is away from the base. A plurality of limiting portions are formed extending from one side of the, and at least a part of the plurality of limiting portions penetrates the opening, and the plurality of limiting portions and the carrying portion jointly form a wafer receiving groove, and the wafer receiving groove is used for accommodating a chip ; The lifting structure also has a plurality of connecting holes, a plurality of connecting holes penetrate the base and the carrying portion. The elastic component is arranged in the accommodating groove, one end of the elastic component is fixed to the lifting structure, the other end of the elastic component is fixed to the supporting structure, the elastic restoring force generated by the pressure of the elastic component makes the base abut against the inner surface of the top wall, and A gap is formed between the lifting structure and the supporting structure. One end of each probe assembly is fixedly arranged on the supporting structure, and the probe assembly is used for connecting with the circuit board, and the other end of the plurality of probe assemblies is penetrated through the plurality of connecting holes. Wherein, when the wafer accommodating slot is provided with a wafer, and the limiting portion is not pressed by a pressing device, the probe assembly located in the plurality of connecting holes is not connected with the multiple contact portions of the wafer. Wherein, when the chip container is provided with a chip and the pressing device abuts against the outer side surface of the top wall, the limiting part exposed on the body will be pressed by the pressing device and retracted in the body, and a plurality of probes The needle assembly abuts the contact parts, and the probe assemblies and the wafer are connected to each other.

The beneficial effects of the present invention may be that: the detection equipment, the wafer carrying device and the electrical connection unit of the present invention can cooperate with each other through the lifting structure, elastic components, multiple probe components and insulating support components of the electrical connection unit. When the wafer is set in the wafer accommodating groove, and the pressing device presses against the limiting portion, the lifting structure and the wafer carried by it are moved in a direction close to the multiple probe assemblies, so that the multiple probe assemblies can be pressed against A plurality of chips can be used to improve the problem of incorrect connection between the chip and the electrical connector in the prior art, which leads to incorrect detection results.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are only for reference and illustration, and are not intended to limit the present invention.

E‧‧‧Testing equipment

E1‧‧‧Chip Carrier

1.‧‧Circuit board

2‧‧‧Electrical connection unit

20‧‧‧Probe assembly

201‧‧‧Needle body

2011‧‧‧Limiting convex part

201A‧‧‧Contact terminal

201B‧‧‧End

201C‧‧‧Exposed section

201D‧‧‧Internal section

201E‧‧‧Fixed section

202‧‧‧Spring

202A‧‧‧First compact section

202B‧‧‧flexible section

202C‧‧‧Second compact section

21‧‧‧Ontology

21A‧‧‧Opening

21B‧‧‧Slot

21C‧‧‧Keyhole

211‧‧‧Top Wall

2111‧‧‧Outer side

2112‧‧‧Inside

212‧‧‧ring side wall

22‧‧‧Lifting structure

22A‧‧‧Connecting hole

22B‧‧‧chip container

22C‧‧‧Clamping slot

221‧‧‧Base

222‧‧‧Carrier Department

223‧‧‧Limiting part

223A‧‧‧Outer side

23‧‧‧Supporting structure

23A‧‧‧Clamping slot

231‧‧‧Base structure

231A‧‧‧Perforation

232‧‧‧Auxiliary structure

232A‧‧‧Support hole

2321‧‧‧Top structure

24‧‧‧Elastic components

E2‧‧‧Pressure device

30‧‧‧Temperature adjustment components

31‧‧‧Temperature regulator

311‧‧‧Flat structure

3111‧‧‧Flat contact surface

312‧‧‧Protrusion

31A‧‧‧Fluid inlet

31B‧‧‧Fluid outlet

32‧‧‧Cover body

32A‧‧‧accommodating space

40‧‧‧Exhaust assembly

401‧‧‧Hood

40A‧‧‧Groove

40B‧‧‧Containing opening

40C‧‧‧Exhaust hole

50‧‧‧Airtight Parts

60‧‧‧Structural reinforcement

60A‧‧‧Clamping groove

SP‧‧‧Containing space

C‧‧‧chip

C1‧‧‧Contact

C2‧‧‧Outer side

S‧‧‧Gap

T‧‧‧Probe channel

D1‧‧‧Pitch

D2‧‧‧Distance

H1‧‧‧Height

G‧‧‧Gap

Figure 1 is a schematic diagram of the detection device of the present invention.

Figure 2 is an exploded schematic diagram of the detection device of the present invention.

Fig. 3 is a partial enlarged schematic diagram of the electrical connection unit of the present invention disposed on a circuit board.

Figure 4 is a schematic exploded cross-sectional view of the electrical connection unit of the present invention.

5 is a schematic cross-sectional view of the electrical connection unit of the present invention taken along the section line V shown in FIG. 3.

6 is a schematic cross-sectional view of the electrical connection unit of the present invention taken along the section line VI shown in FIG. 3.

FIG. 7 is a schematic diagram of the electrical connection unit of the present invention provided with a chip.

8 is a schematic cross-sectional view of the electrical connection unit of the present invention taken along the section line VII shown in FIG. 7.

9 is a schematic diagram of the electrical connection unit of the present invention being pressed by the pressing device.

10 is a schematic cross-sectional view of the electrical connection unit of the present invention taken along the section line X shown in FIG. 9.

Figure 11 is an exploded schematic view of the probe assembly of the electrical connection unit of the present invention.

Fig. 12 is a schematic diagram of the pressing device of the detection equipment of the present invention.

FIG. 13 is a schematic diagram from another perspective of the pressing device of the detection equipment of the present invention.

14 is a schematic cross-sectional view of the detection device of the present invention taken along the section line XIV shown in FIG. 1.

In the following description, if it is pointed out, please refer to the specific drawing or as shown in the specific drawing, it is only used to emphasize in the subsequent description, and most of the related content appears in the specific drawing, but not It is restricted that only specific drawings can be referenced in this subsequent description.

Please refer to FIG. 1 and FIG. 2, which are schematic diagrams of assembly and disassembly of the detection device of the present invention. As shown in the figure, the inspection equipment E includes: a wafer carrying device E1 and a pressing device E2.

The chip carrier device E1 has a circuit board 1 and a plurality of electrical connection units 2. A plurality of electrical connection units 2 are fixedly arranged on the circuit board 1, and each electrical connection unit 2 is used to carry Chip C (shown in Figure 7), each electrical connection unit 2 is provided with a plurality of probe assemblies 20 (shown in Figure 4), one end of each probe assembly 20 is used to connect with the circuit board 1, and each probe The other end of the needle assembly 20 is used to connect with the chip C, and the multiple probe assemblies 20 are used to connect the chip C and the circuit board 1 to each other. In different applications, there can be multiple circuit boards 1 and not limited to a single circuit board 1. The chip C referred to here particularly refers to a memory (such as a NAND Flash), but is not limited to this.

In specific applications, the circuit board 1 may be provided with at least one control unit (not shown, such as various types of microprocessors) or the circuit board 1 may be connected to a control device (not shown, such as a computer device) , And the control unit or control device can be connected to each wafer C through the circuit board 1 to perform inspection operations on each wafer C. Regarding the inspection work performed by the control unit or control device on the chip C, it may be different according to actual requirements and the difference of the chip C; the control unit or the control device may simultaneously perform the same operation on all the chips C provided on the circuit board 1 The inspection operation, or the control unit or the control device may also perform different inspection operations on the wafers C arranged in different areas of the circuit board 1, which is not limited here.

The pressing device E2 can be controlled to press against the side of each electrical connection unit 2 where the chip C is provided, so that the chip C can be firmly connected to the probe in the electrical connection unit 2 when the chip C is being inspected. The components 20 are connected. In different embodiments, the pressing device E2 can also be used to change the temperature of each wafer C, so that the wafer C can perform inspection operations at a high temperature or a low temperature.

As shown in FIG. 3, it is a schematic diagram of a single electrical connection unit 2 provided on the circuit board 1 of the present invention; FIG. 4 is an exploded cross-sectional schematic view of a single electrical connection unit 2; A schematic view of the electrical connection unit 2 taken along the section line V shown in FIG. 3; FIG. 6 is a schematic view of the electrical connection unit 2 provided on the circuit board 1 taken along the section line VI shown in FIG. As shown in FIGS. 3 to 6, each electrical connection unit 2 includes: a plurality of probe assemblies 20, a main body 21, a lifting structure 22, a supporting structure 23 and four elastic components 24.

The body 21 has a top wall 211 and a ring side wall 212, the top wall 211 has an opening In the hole 21A, one side of the ring side wall 212 is connected to the periphery of the top wall 211, and the other side of the ring side wall 212 is fixedly arranged on the circuit board 1. The top wall 211, the ring side wall 212 and the circuit board 1 together form a receiving groove 21B. The two opposite sides of the top wall 211 are defined as an outer side 2111 and an inner side 2112. In practical applications, the top wall 211 and the ring side wall 212 may be integrally formed, and the body 21 may also have a plurality of lock holes 21C (as shown in FIG. 3), and the plurality of lock holes 21C may be combined with a plurality of locking members (for example, The screws) cooperate with each other to fix the main body 21 to the circuit board 1, but the manner of fixing the main body 21 to the circuit board 1 is not limited to this.

The lifting structure 22 includes a base 221 and a supporting portion 222. The base 221 is completely disposed in the accommodating groove 21B, and the base 221 extends to one side to form a supporting portion 222, and a portion of the supporting portion 222 can penetrate through the opening 21A. The bearing portion 222 has four limiting portions 223 extending away from the base 221. The four limiting portions 223 may be located at the four corners of the bearing portion 222, and the four limiting portions 223 and the bearing portion 222 jointly forms a wafer receiving groove 22B, the wafer receiving groove 22B is used to provide the setting of the chip C, and the four limiting portions 223 are used to engage the chip C with each other. Each limiting portion 223 can be roughly L-shaped, but not limited to this; the number of limiting portions 223 can also be changed according to requirements, not limited to four, and the location of the limiting portion 223 is not as shown in the figure As shown as a limit, the four limit parts 223 may not be arranged at the four corners. The lifting structure 22 also has a plurality of connecting holes 22A (as shown in FIG. 6 ), and each connecting hole 22A is provided through the base 221 and the carrying portion 222.

A part of the plurality of probe assemblies 20 is fixedly arranged in the support structure 23, and the plurality of probe assemblies 20 are fixedly arranged at one end of the support structure 23 for connecting with the circuit board 1; the other of the plurality of probe assemblies 20 One end is located in the plurality of connecting holes 22A, and one end of the probe assembly 20 located in the plurality of connecting holes 22A is used to connect with the contact portion C1 of the chip C.

As shown in FIGS. 4 to 6, the supporting structure 23 is disposed in the accommodating groove 21B, and four elastic components 24 are disposed between the supporting structure 23 and the lifting structure 22. Each elastic component 24 may be, for example, a compression spring, and the lifting structure 22 and the supporting structure 23 are mutually exclusive. The opposite sides may be respectively formed with engaging grooves 22C, 23A corresponding to each other, and both ends of each elastic component 24 are correspondingly engaged with the engaging grooves 22C, 23A. In different applications, the lifting structure 22 and the supporting structure 23 may be respectively formed with engaging protrusions in the engaging grooves 22C and 23A, and the two ends of each elastic component 24 may correspond to the two engaging protrusions. Locked and fixed to each other.

The four elastic components 24 enable the base 221 of the lifting structure 22 to abut against the inner side surface 2112 of the top wall 211, and a gap S is formed between the base 221 and the supporting structure 23 (as shown in FIG. 6). In practical applications, when the electrical connection unit 2 is fixed on the circuit board 1, and the limit portion 223 of the electrical connection unit 2 is not pressed by an external force, the four elastic components 24 located between the lifting structure 22 and the supporting structure 23 It may be slightly compressed, and the elastic restoring force generated by the compression of the elastic component 24 will make the lifting structure 22 stably abut against the inner surface 2112 of the top wall 211.

In particular, the number of elastic components 24 of the electrical connection unit 2 is not limited to the above four. The number of elastic components 24 can be changed according to requirements, for example, it can also be one.

As shown in FIGS. 7 and 8, when the wafer C is fixedly disposed in the wafer receiving groove 22B, and the pressing device E2 (as shown in FIG. 2) does not press the limiting portion 223, the multiple contact portions of the wafer C C1 corresponds to the plurality of connecting holes 22A, and each probe assembly 20 is not connected with the plurality of contact parts C1 (for example, does not contact each other), and the lifting structure 22 and the supporting structure 23 are between A gap S is formed. In the embodiment shown in FIG. 8, the outer surface C2 of the wafer C away from the lifting structure 22 may not protrude from the limiting portion 223, but is not limited to this. In different embodiments, the outer surface C2 of the wafer C It may also be substantially flush with the outer surface 223A of the limiting portion 223, or the outer surface C2 of the wafer C may also slightly protrude from the outer surface 223A of the limiting portion 223. It is worth mentioning that, in the figure of this embodiment, the contact part C1 is a solder ball as an example, but the contact part C1 may be a pin, a flat pad, etc., and is not limited thereto.

As shown in FIGS. 9 and 10, when the wafer C is set in the wafer receiving groove 22B, and the pressing device E2 abuts against the outer surface 2111 of the top wall 211, the limiting portion 223 will be When pressed and retracted into the main body 21, that is, the lifting structure 22 will move in the direction of the circuit board 1 relative to the plurality of probe assemblies 20.

When the pressing device E2 presses the limiting portion 223 to retract the limiting portion 223 in the main body 21, the lifting structure 22 will move relative to the plurality of probe assemblies 20, and when the lifting structure 22 abuts against the supporting structure 23, the multiple probe assemblies 20 will pass through the multiple connecting holes 22A, and one end of the multiple probe assemblies 20 will correspond to the multiple contact portions C1 of the top wafer C, and the multiple probes The component 20 is connected to the chip C accordingly. It should be noted that when the lifting structure 22 abuts against one side of the supporting structure 23, as long as the multiple probe assemblies 20 can be connected to the wafer C, the multiple probe assemblies 20 may not pass through multiple connections.孔22A. In the drawing of this embodiment, after the lifting structure 22 is pressed, the limiting portion 223 can be completely retracted in the main body 21 as an example, but it is not limited to this. In different embodiments, After the lifting structure 22 is pressed, the limiting portion 223 may not be completely retracted in the main body 21.

When the pressing device E2 abuts against the outer surface 2111 of the electrical connection unit 2, the plurality of probe assemblies 20 may be pressed against the chip C, and the outer surface C2 of the chip C is pressed against the inner side of the pressing device E2. When the outer surface C2 of the chip C abuts against the inner side of the pressing device E2, the spring 202 of the plurality of probe assemblies 20 will be compressed, and the elastic restoring force generated by the compression of the spring 202 will make the chip C stable Abut against the inner surface of the pressing device E2.

Please refer to FIG. 6 again. In particular, if the length direction of the probe assembly 20 is defined as an axial direction (ie, the Y-axis direction shown in the figure), when the lifting structure 22 is not pressed (at this time, the base 221 may be against the top wall 211), the distance D2 between the end of each probe assembly 20 and the opening at one end of the corresponding connecting hole 22A may be smaller than the distance D1 between the lifting structure 22 and the supporting structure 23 in the axial direction, In this way, when the lifting structure 22 is pressed against one side of the supporting structure 23 (as shown in FIG. 10), one end of the probe assembly 20 will pass through the connecting hole 22A, thereby ensuring the safety of the probe assembly 20 One end can be connected to the contact portion C1 of the wafer C (for example, contact each other).

It should be noted that as long as the lifting structure 22 is pressed, the multiple probe assemblies 20 It can be connected with multiple contact portions C1 not connected to the chip C to be connected to multiple contact portions C1. The above-mentioned distance D2 and spacing D1 can be adjusted according to requirements, that is, after the lifting structure 22 is pressed Under the premise that the plurality of probe assemblies 20 can contact the plurality of contact portions C1, when the probe assembly 20 is pressed by the lifting structure 22, the probe assembly 20 may or may not protrude from the corresponding connection hole 22A.

As shown in FIG. 6, the height H1 of the portion of each limiting portion 223 exposed from the main body 21 in the axial direction (ie the Y-axis direction shown in the figure) is less than or equal to when the limiting portion 223 is not pressed , The distance D1 between the lifting structure 22 and the supporting structure 23 in the axial direction, so that each limiting portion 223 can be retracted in the main body 21 when pressed by the pressing device E2. In an embodiment where the height H1 of the portion of each limiting portion 223 exposed to the main body 21 in the axial direction (ie the Y-axis direction shown in the figure) is equal to the distance D1 between the lifting structure 22 and the supporting structure 23, When the pressing device E2 abuts against the outer surface 2111 of the main body 21, the lifting structure 22 will correspondingly abut against one side of the supporting structure 23.

According to the above, when the pressing device E2 abuts against the outer side 2111 of the electrical connection unit 2, the plurality of probe assemblies 20 will press against the chip C, and the chip C will abut against one side of the pressing device E2. , The control unit or the control device can perform inspection operations on the wafer C, and at the same time control the pressure device E2 to raise or lower the temperature, so that the wafer C performs inspection operations in a high temperature state or a low temperature state.

When the pressing device E2 abuts against the outer surface 2111 of the plurality of electrical connection units 2, the pressing device E2 is attached to the outer surface C2 of the plurality of chips C at the same time. Therefore, the pressing device E2 is controlled to increase the temperature or When the temperature is lowered, the temperature of the plurality of wafers C will change with the pressing device E2, and the temperature of the plurality of wafers C will approach the same. In this way, the inspection operation of the plurality of wafers C can be ensured at approximately the same temperature.

In the prior art, the way to make multiple wafers C perform inspection operations in a high temperature environment at the same time is: first set the circuit board with multiple wafers C inserted in the oven; then use the hot air blower in the oven to make the oven The internal temperature increases, so that multiple wafers C can be inspected in a high-temperature environment; however, this prior art inspection method cannot accurately control the temperature of each area in the oven. Therefore, it will not be able to ensure that each The wafer C is in the state of expected temperature to perform inspection operations, which leads to the problem of inaccurate inspection results. In contrast, the above-mentioned detection device E of the present invention can greatly improve the above-mentioned problems in the prior art.

As shown in FIGS. 4, 6 and 10, in practical applications, the supporting structure 23 may include a base structure 231 and an auxiliary structure 232. The base structure 231 is disposed in the accommodating groove 21B, and the base structure 231 and the main body 21 are fixed to each other (for example, a plurality of screws are used to fix the main body 21 to each other). The base structure 231 has a plurality of through holes 231A, and one end of the plurality of probe assemblies 20 is fixedly disposed in the plurality of through holes 231A.

It is worth mentioning that one of the main functions of the base structure 231 is to stably set the probe assembly 20 upright in the accommodating groove 21B. Therefore, the aperture of the perforation 231A of the base structure 231 may be slightly smaller than that of the probe assembly 20. The maximum outer diameter, and each probe assembly 20 and the through hole 231A can be arranged in a snap-fit manner. Regarding the number of perforations 231A of the base structure 231, the depth of each perforation 231A, the spacing distance between the perforations 231A, the arrangement of the plurality of perforations 231A, etc., they can be changed according to requirements. The figure shown is only one of the exemplary states. In this way, it is not limited.

The auxiliary structure 232 is disposed in the accommodating groove 21B, and the auxiliary structure 232 is located between the base structure 231 and the top wall 211, and the auxiliary structure 232 and the base structure 231 are fixed to each other (for example, using screws to lock each other). The auxiliary structure 232 has a plurality of support holes 232A, the plurality of support holes 232A are spaced apart from each other, the plurality of support holes 232A and the plurality of perforations 231A of the base structure 231 are communicated with each other, and the plurality of support holes 232A are connected to the plurality of connecting holes 22A Correspondingly, the multiple connecting holes 22A, the multiple supporting holes 232A, and the multiple through holes 231A will jointly form multiple probe channels T, and the multiple probe assemblies 20 are correspondingly provided in the multiple probe channels T.

As shown in Figure 11, it is an exploded schematic diagram of a single probe assembly. The probe assembly 20 includes a needle body 201 and a spring 202. The needle body 201 is a rod-shaped structure, and the two ends of the needle body 201 are defined as a contact end 201A and a tail end 201B. The position of the needle body 201 adjacent to the contact end 201A has a limiting protrusion 2011 (the figure is a ring structure For example, but its appearance is not limited to this), the limiting protrusion 2011 divides the needle body 201 into an exposed section 201C and a built-in section 201D, and the spring 202 is correspondingly sleeved inside the needle body 201 The section 201D, and the exposed section 201C of the needle body 201 is not covered with a spring 202.

The needle body 201 is separated from the built-in section 201D by a fixed section 201E. The fixed section 201E is located adjacent to the limiting protrusion 2011. The outer diameter of the needle body 201 in the fixed section 201E is larger than that of the needle body 201. The outer diameter of the remaining sections of the built-in section 201D.

The spring 202 is sequentially divided from one end to the other end by a first compact section 202A, an elastic section 202B, and a second compact section 202C. The inner diameter of the spring 202 in the first tight section 202A is smaller than the outer diameter of the needle body 201 in the fixed section 201E. When the spring 202 is sleeved on the inner section 201D of the needle body 201, the first tight area of the spring 202 The segment 202A is corresponding to the fixed section 201E of the needle body 201 and is fixed to each other, and the end of the spring 202 adjacent to the first tight section 202A is correspondingly abutted against one side of the limiting protrusion 2011. That is to say, through the design that the inner diameter of the first tight section 202A of the spring 202 and the outer diameter of the needle body 201 and the fixed section 201E cooperate with each other, one end of the spring 202 can be fixedly arranged in the fixed section 201E of the needle body 201 .

The pitch of the spring 202 in the first tight section 202A and the second tight section 202C is smaller than the pitch of the spring 202 in the elastic section 202B. In practical applications, the spring 202 is in the first tight section. The pitch of 202A or the second tight section 202C can be close to zero, that is, regardless of whether the spring 202 is compressed, the spring 202 will not deform in the first tight section 202A or the second tight section 202C. The first compact section 202A and the second compact section 202C of the spring 202 only serve as structures that are fixed to the needle body 201 and the base structure 231.

The length of the spring 202 in the first compact section 202A is smaller than the length of the spring 202 in the elastic section 202B; the length of the spring 202 in the second compact section 202C is determined by the depth of the perforation 231A of the base structure 231.

In practical applications, the spring 202 of each probe assembly 20 can be a conductive material Quality, when the spring 202 is sleeved on the needle body 201 and the first tight section 202A of the spring 202 and the fixed section 201E of the needle body 201 are fixed to each other, the tail end 201B of the needle body 201 may not be exposed to the spring 202, and when When the electrical connection unit 2 is fixed to the circuit board 1, one end of the spring 202 having the second tight section 202C abuts against the circuit board 1, and the spring 202 is connected to the circuit board 1, and the distance between the circuit board 1 and the chip C The current and signal are transmitted through the needle body 201 and the spring 202.

As shown in FIGS. 6 and 11, the auxiliary structure 232 may have an abutting structure 2321 in each supporting hole 232A, and each abutting structure 2321 is used to abut the limiting protrusion 2011 of the pin body 201. When the probe assembly 20 is disposed in the probe channel T, the limiting protrusion 2011 of the needle body 201 will correspondingly abut the abutting structure 2321, and the abutting structure 2321 can accordingly restrict the needle body 201 from lifting relative to the auxiliary structure 232 The direction of the structure 22 moves. Since the position-limiting convex portion 2011 of the needle body 201 abuts against the abutting structure 2321 correspondingly, the built-in section 201D of the needle body 201 is correspondingly located in the auxiliary structure 232 and the base structure 231 (that is, the supporting structure 23). Most of the exposed section 201C of the body 201 is correspondingly exposed outside the support structure 23, and the section of the needle body 201 adjacent to the contact end 201A is correspondingly located in the connecting hole 22A.

It is worth mentioning that, as shown in FIG. 3 and FIG. 6, in practical applications, each electrical connection unit 2 can be fixed to the circuit board 1 in a locking manner, and each probe assembly 20 is adjacent to the circuit board 1. One end can be connected to the circuit board 1 in abutting manner, and each probe assembly 20 is not fixed to the circuit board 1 by welding; in this way, the relevant personnel can disassemble and replace any electrical circuit on the circuit board 1 as required. The connection unit 2 can also be disassembled and replaced by any of the probe assemblies 20 in each electrical connection unit 2 according to requirements.

Please refer to FIGS. 8 and 10 together. When the pressing device E2 no longer presses against the limiting portion 223, the elastic restoring force generated by the pressing of the elastic component 24 will push the lifting structure 22 against the lifting structure 22. The position adjacent to the auxiliary structure 232 moves to a position where it abuts against the inner surface 2112 of the top wall 211. When the lifting structure 22 moves from the state of FIG. 10 to the state of FIG. 8, the lifting structure 22 will make the wafer C With multiple The contact ends 201A of the needle body 201 are separated from each other, so that the wafer C is no longer connected to the plurality of probe assemblies 20.

It is worth mentioning that, as shown in FIGS. 6 and 10, the height H1 of the portion of each limiting portion 223 exposed to the main body 21 in the axial direction (ie the Y-axis direction shown in the figure) is smaller than the limiting portion 223. When the portion 223 is not pressed, in the embodiment of the distance D1 between the lifting structure 22 and the supporting structure 23 in the axial direction, when the pressing device E2 abuts against the outer surface 2111, the lifting structure 22 and the auxiliary structure 232 will be A gap G may be formed. Through the design of the gap G, when the lifting structure 22 or the auxiliary structure 232 has a production error, it can still be ensured that the pressing device E2 can abut against the outer surface 2111.

In a different embodiment, when the pressing device E2 presses the lifting structure 22 and the plurality of probe assemblies 20 are connected to the contact portion C1 of the wafer C, the pressing device E2 may also not press against the outer surface 2111, and the lifting structure 22 abuts one side of the supporting structure 23. Based on the above, in simple terms, when the chip C is set in the chip pocket 22B of the electrical connection unit 2 and the lifting structure 22 is not pressed, the multiple probe assemblies 20 are not connected to the chip C; when the lifting structure 22 When compressed and retracted in the main body 21, the plurality of probe assemblies 20 will press against the wafer C and be connected to it; when the lifting structure 22 is no longer pressed, the lifting structure 22 will return to the state when it is not pressed. State, and the wafer C will no longer be connected to the multiple probe assemblies 20.

Please refer to FIGS. 12 to 14 together. FIGS. 12 and 13 show an exploded schematic view of one embodiment of the pressing device E2 of the detection device E of the present invention. FIG. 14 shows the pressing device E2 of this embodiment. A schematic cross-sectional view of a plurality of electrical connection units 2 leaning against. As shown in the figure, the pressing device E2 may include a temperature adjusting component 30 and a suction component 40. The number of temperature adjustment components 30 can be changed according to demand, and is not limited to one.

The temperature adjustment component 30 may include a temperature regulator 31 and a cover 32. One side of the temperature regulator 31 has a flat structure 311, and the flat structure 311 has a flat contact surface 3111. The temperature regulator 31 may have a heating coil (not shown) inside, and the heating coil can be controlled to generate heat. Inside the temperature regulator 31 The part may also have at least one fluid channel (not shown), and the fluid channel may be connected to a fluid inlet 31A and a fluid outlet 31B of the temperature regulator 31, and the cryogenic fluid may enter the fluid channel from the fluid inlet 31A Then, it flows out from the fluid outlet 31B. In particular, the pressing device E2 shown in FIG. 9 may be the flat structure 311 of the temperature adjustment assembly 30 of this embodiment. Regarding the number of fluid inlets 31A and fluid outlets 31B, it can be increased according to demand, and is not limited to a single one. The number of temperature regulators 31 is not limited to a single one. In different embodiments, the number of temperature regulators 31 may also be more than two.

As shown in FIGS. 14 and 10, when the pressing device E2 is pressed against the plurality of electrical connection units 2, the flat structure 311 of the pressing device E2 will correspondingly abut against the outer side surface 2111 of each electrical connection unit 2 and each chip The outer surface C2 of C. At this time, relevant personnel or equipment can control the temperature regulator 31 to act through the control unit or the control equipment, so that the heating coil generates heat energy, thereby increasing the temperature of the flat structure 311, so that the wafer C Perform detection operations under high temperature conditions; alternatively, relevant personnel or equipment can control the operation of the low temperature fluid storage equipment (not shown) connected to the temperature regulator 31 through the control unit or control equipment, so that the low temperature fluid storage equipment The stored low-temperature fluid enters the temperature regulator 31 through the fluid inlet 31A, so that the temperature of the flat structure 311 is lowered, so that the wafer C is inspected at a low temperature.

Specifically, in practical applications, the pressing device E2 may also have only a heating coil without a fluid passage, or the pressing device E2 may also have only a fluid passage without a heating coil, that is, the pressing The device E2 is not limited to have both heating and cooling functions, and the pressing device E2 may also have only heating or cooling functions. In an embodiment in which the pressing device E2 does not have a heating coil but only has a fluid channel, the high-temperature liquid may also flow into the fluid channel, so that the pressing device E2 can still have a heating function.

The above-mentioned temperature adjustment component 30 is only one exemplary aspect, and the actual application is not limited to the above description. For example, the temperature adjustment component 30 may also include Consistently cold wafers. The cover 32 is fixedly arranged on one side of the temperature regulator 31, and the cover 32 is used to block the transfer of thermal insulation energy, so as to prevent the heat generated by the temperature regulator 31 from quickly escaping outward, or to prevent the transfer of external heat energy to low temperatures. The temperature regulator 31 through which the fluid flows. In practical applications, an accommodating space 32A can be formed between the cover 32 and the temperature regulator 31, and the accommodating space 32A can be filled with any member that can prevent heat transfer. The appearance and size of the temperature regulator 31 and the cover 32 can be changed according to requirements, and the figure shown is only one of the exemplary aspects. In addition, the method of generating heat by the temperature regulator 31 is not limited to using a heating coil, and the temperature regulator 31 is not limited to using a low-temperature fluid to achieve the effect of lowering the temperature.

The air extraction assembly 40 has a cover body 401, one side of the cover body 401 is concavely formed with a groove 40A, the cover body 401 has a receiving opening 40B, and the receiving opening 40B communicates with the groove 40A. The temperature regulator 31 opposite to the flat structure 311 may be formed with a protruding portion 312, the flat structure 311 is fixedly disposed in the groove 40A, and the protruding portion 312 is correspondingly exposed from the receiving opening 40B. The fluid inlet 31A and the fluid outlet 31B are arranged on the protruding portion 312, but not limited to this. The location of the fluid inlet 31A and the fluid outlet 31B can be changed according to requirements. The cover 32 is disposed on the side of the cover 401 opposite to the side where the groove 40A is formed. The cover 401 also has two air extraction holes 40C, and the two air extraction holes 40C are used to connect with an air extraction device. Regarding the appearance and size of the cover 401, the number and size of the exhaust holes 40C, etc., all can be changed according to requirements, and the figure shown is only an exemplary aspect.

As shown in Figs. 14 and 10, when the pressing device E2 is disposed on one side of the circuit board 1, the flat structure 311 of the temperature regulator 31 will correspondingly abut against the limiting portions 223 of the plurality of electrical connection units 2. The cover 401, the circuit board 1, and the flat structure 311 jointly form an accommodating space SP, and the air extraction hole 40C is connected to the accommodation space SP. In this way, the air extraction device can perform the air extraction on the accommodation space SP through the air extraction hole 40C. The air extraction operation is used to draw out the air in the accommodating space SP to make the accommodating space SP into a negative pressure state, thereby pressing the auxiliary flat structure 311 on the circuit board 1 The upper limit portion 223 of the plurality of electrical connection units 2.

More specifically, when the pressing device E2 presses the limiting portion 223, the pressing device E2 must resist the elastic restoring force generated by the elastic component 24 and the plurality of probe assemblies 20. Therefore, when the circuit board 1 is provided When the number of electrical connection units 2 increases, the force required by the pressing device E2 to simultaneously press the limit portions 223 of the multiple electrical connection units 2 will increase accordingly; in this case, the above-mentioned pressing device E2 cooperates The air extraction device, so that the accommodating space SP is in a negative pressure state, can greatly reduce the force required for the pressing device E2 to simultaneously press down the multiple limit parts 223.

When the pressure-resisting device E2 cooperates with the pumping equipment, the accommodating space SP is in a negative pressure state, and the temperature regulator 31 is heating or cooling a plurality of wafers, because the accommodating space SP is in a vacuum or It is close to the vacuum state, therefore, the probability that the temperature of the accommodating space SP is affected by the external environment can be effectively reduced.

As shown in FIG. 2, in different embodiments, the suction assembly 40 may also include an airtight member 50 and a structural reinforcement member 60. The airtight member 50 may have a ring structure, and the airtight member 50 is disposed between the cover body 401 and the circuit board 1, and the airtight member 50 is used to prevent the external air and the accommodating space SP from circulating. In a specific application, the airtight member 50 can be clamped to the circuit board 1 or the cover 401, which is not limited here; the appearance, size, and location of the airtight member 50 can be changed according to requirements, and it is not here. limit. It is particularly noted that in practical applications, corresponding airtight components may be additionally provided at any position that may affect the airtightness of the accommodating space SP. For example, as shown in FIG. 3, each keyhole 21C The inner part may be provided with an elastic rubber ring; or a gel may be poured into the key hole 21C to enhance the air-tight effect between the lock member and the key hole.

One side of the structural reinforcement 60 is concavely formed with an engaging groove 60A, and the circuit board 1 is engaged and fixed in the engaging groove 60A. The structural reinforcement 60 is used to strengthen the overall structural strength of the circuit board 1, thereby avoiding the problem of deformation of the circuit board 1 during the process of pumping air to the accommodating space SP by the pumping device. In a better embodiment, the circuit board 1 and the structural reinforcement 60 are mutually locked and fixed through the locking groove 60A, the circuit board 1 The structural reinforcement member 60 can also be fixed to each other through a plurality of locking members (such as screws), a sealing rubber ring can be arranged between the locking member and the circuit board 1, or it can be welded, sprayed airtight glue, etc. , To seal the gap that may exist between the fastener and the circuit board 1.

In different embodiments, the number of structural reinforcements 60 and their placement positions can also be changed according to requirements. For example, the detection device can also have two structural reinforcements 60, and the circuit board 1 is sandwiched between the two. Between 60 structural reinforcements.

To sum up, the inspection equipment and wafer carrying device of the present invention can simultaneously press the wafers arranged on multiple electrical connection units by the pressing device, so that multiple wafers can be inspected at the same temperature at the same time. The electrical connection unit of the present invention, through the mutual cooperation of the lifting structure, the elastic assembly, the probe assembly and other components, can enable the wafer to be firmly connected to the multiple probe assemblies during inspection operations.

The above are only preferred and feasible embodiments of the present invention, which do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the protection scope of the present invention.

1.‧‧Circuit board

20‧‧‧Probe assembly

201‧‧‧Needle body

21‧‧‧Ontology

211‧‧‧Top Wall

2111‧‧‧Outer side

22‧‧‧Lifting structure

22A‧‧‧Connecting hole

221‧‧‧Base

223‧‧‧Limiting part

23‧‧‧Supporting structure

231‧‧‧Base structure

232‧‧‧Auxiliary structure

E2‧‧‧Pressure device

C‧‧‧chip

C1‧‧‧Contact

C2‧‧‧Outer side

G‧‧‧Gap

Claims (12)

A testing device is used for testing multiple wafers. The testing device includes: a wafer carrying device, which includes: at least one circuit board; a plurality of electrical connection units, which are arranged on the circuit board; The electrical connection unit is used to carry a plurality of the chips, and each of the electrical connection units includes a body having a top wall and a ring side wall, the top wall has an opening, and one end of the ring side wall is connected to the The peripheral edges of the top wall are connected, the other end of the ring side wall is disposed on the circuit board, and the top wall, the ring side wall and the circuit board jointly form an accommodation groove; the top walls are opposite to each other Two side surfaces are defined as an outer side surface and an inner side surface, the inner side surface is located in the accommodating groove; a support structure is arranged on the circuit board, and the support structure is located in the accommodating groove; The lifting structure is arranged in the accommodating groove, the lifting structure has a base and a bearing portion, the base is located in the accommodating groove, the base extends to one side to form the bearing portion, so At least a part of the supporting portion is located in the opening; the supporting portion extends to a side away from the base to form a plurality of limiting portions, and at least a portion of the plurality of limiting portions penetrates the opening , And a plurality of the limiting portion and the carrying portion jointly form a wafer accommodating groove, and the wafer accommodating groove is used for accommodating the wafer; the lifting structure further has a plurality of connecting holes, and a plurality of connecting holes The hole penetrates the base and the carrying portion; at least one elastic component is disposed in the accommodating groove, one end of the elastic component is fixed to the lifting structure, and the other of the elastic component The end is fixed to the supporting structure, the elastic restoring force generated by the elastic component is pressed to make the base abut against the inner side of the top wall, and the lifting structure and the supporting structure are formed between There is a gap; a plurality of probe assemblies, one end of each of the probe assemblies is fixedly arranged on the supporting structure, and each of the probe assemblies is used to connect with the circuit board, the plurality of probe assemblies The other end penetrates through the plurality of connecting holes; a pressing device which can be controlled to simultaneously press against the limiting portions of the plurality of electrical connection units, so that the plurality of limiting portions correspond to each other The internal movement of the body; wherein, when the wafer pocket is provided with the wafer, and the limiting portion is not pressed by the pressing device, the connecting holes located in the The probe assembly is not connected to the multiple contact parts of the wafer; wherein, when the wafer receiving groove is provided with the wafer, and the pressing device abuts against the outer side surface of the top wall , The limiting portion exposed to the main body will be pressed by the pressing device and retracted in the main body, and a plurality of the probe assemblies will abut a plurality of the contact portions, And a plurality of the probe assemblies and the wafer are connected to each other; wherein, when the wafer accommodating slot is provided with the wafer, and the pressing device abuts against the outer side surface of the top wall, A plurality of the probe assemblies are pressed against a plurality of the contact parts, and the wafer is away from the outer side surface of the lifting structure, and correspondingly abuts against a side of the pressing device against the limiting part. The detection device according to claim 1, wherein the length direction of each of the probe assemblies is defined as an axial direction, and the height of the portion of each of the limiting portions exposed to the body along the axial direction , Less than or equal to the distance between the lifting structure and the supporting structure in the axial direction when the limiting portion is not pressed distance. The detection device according to claim 1 or 2, wherein the length direction of each probe assembly is defined as an axial direction, and when the lifting structure is not pressed, the end of each probe assembly corresponds to it The distance of the opening at one end of the connecting hole is less than or equal to the distance between the lifting structure and the supporting structure in the axial direction when the lifting structure is not pressed. The inspection device according to claim 3, wherein, when the wafer holder is provided with the wafer, and the pressing device abuts against the outer side surface of the top wall, a plurality of the probes One end of the component passes through a plurality of said connecting holes. The inspection device according to claim 3, wherein when the wafer is provided with the wafer and the pressing device is pressed against the limiting portion, and the lifting structure abuts against the supporting structure When a plurality of the probe assemblies are pressed against a plurality of the contact parts, and the wafer is away from the outer side surface of the lifting structure, corresponding to the side of the pressing device against the limiting part . The inspection device according to claim 5, wherein when the wafer is provided in the wafer container, and the pressing device is pressed against the limiting portion, and the lifting structure abuts against the supporting structure At this time, one end of the plurality of probe assemblies penetrates a plurality of the connecting holes. A chip carrying device includes: a circuit board; a plurality of electrical connection units disposed on the circuit board, the plurality of electrical connection units are used to carry a plurality of the chips, and each of the electrical connection units includes: A body having a top wall and a ring side wall, the top wall has an opening, one end of the ring side wall is connected to the periphery of the top wall, and the other end of the ring side wall is disposed on the circuit board , The top wall, the ring side wall and the circuit board jointly form a containing groove; the top walls are mutually The opposite sides are defined as an outer side and an inner side, the inner side is located in the accommodating groove; a support structure, which is arranged on the circuit board, and the support structure is located in the accommodating groove ; A lifting structure, which is disposed in the accommodating groove, the lifting structure has a base and a bearing portion, the base is located in the accommodating groove, the base extends to one side to form the bearing portion At least a part of the bearing portion is located in the opening; the bearing portion extends to a side away from the base to form a plurality of limiting portions, and at least a portion of the plurality of limiting portions penetrates the A hole is formed, and a plurality of the limiting portion and the carrying portion jointly form a wafer accommodating groove for accommodating the wafer; the lifting structure further has a plurality of connecting holes, a plurality of The connecting hole penetrates the base and the carrying portion; at least one elastic component is disposed in the accommodating groove, one end of the elastic component is fixed to the lifting structure, and the other end of the elastic component is fixed to In the supporting structure, the elastic restoring force generated by the compression of the elastic component causes the base to abut against the inner side surface of the top wall, and a gap is formed between the lifting structure and the supporting structure; A plurality of probe assemblies, one end of each of the probe assemblies is fixedly arranged on the supporting structure, and the probe assembly is used to connect with the circuit board, and the other end of the plurality of probe assemblies is penetrated In a plurality of the connecting holes; wherein, when the chip receiving slot is provided with the chip and the limiting portion is not pressed by a pressing device, the probe located in the plurality of connecting holes The needle assembly is not connected with the multiple contact parts of the wafer; wherein, when the wafer receiving groove is provided with the wafer, and the pressing device abuts against the outer side surface of the top wall, The limiting portion exposed to the body will be pressed by the pressing device and retracted in the body, and a plurality of the probe assemblies will abut a plurality of the contact portions, and Multiple probes The components and the wafer are connected to each other; wherein, when the wafer pocket is provided with the wafer, and the pressing device abuts against the outer side surface of the top wall, a plurality of the probe assemblies A plurality of the contact parts are pressed against, and the wafer is away from the outer side surface of the lifting structure, and correspondingly abuts against the side of the pressing device against the limiting part. The wafer carrier device according to claim 7, wherein the length direction of each of the probe assemblies is defined as an axial direction, and the portion of each of the limiting portions exposed to the body is along the axial direction The height is less than or equal to the distance between the lifting structure and the supporting structure in the axial direction when the limiting portion is not pressed. The wafer carrying device according to claim 7 or 8, wherein the length direction of each probe assembly is defined as an axial direction, and when the lifting structure is not pressed, the end of each probe assembly and The corresponding opening distance of one end of the connecting hole is less than or equal to the distance between the lifting structure and the supporting structure in the axial direction when the lifting structure is not pressed. An electrical connection unit is arranged on a circuit board. The electrical connection unit comprises: a body having a top wall and a ring side wall, the top wall has an opening, and one end of the ring side wall is connected to the top The peripheries of the walls are connected, the other end of the ring side wall is disposed on the circuit board, the top wall, the ring side wall and the circuit board jointly form an accommodation groove; the two opposite sides of the top wall Defined as an outer side surface and an inner side surface, the inner side surface is located in the accommodating groove; a supporting structure, which is arranged on the circuit board, and the supporting structure is located in the accommodating groove; a lifting structure , It is arranged in the accommodating groove, the lifting structure has a base and a bearing portion, the base is located in the accommodating groove, the base extends to one side to form the bearing portion, and the bearing At least part of In the opening; the carrying portion extends to a side away from the base to form a plurality of limiting portions, at least a part of the plurality of limiting portions penetrates the opening, and a plurality of the The limiting portion and the carrying portion jointly form a wafer accommodating slot for accommodating a wafer; the lifting structure further has a plurality of connecting holes, and the plurality of connecting holes penetrates the base and the The carrying portion; at least one elastic component, which is disposed in the accommodating groove, one end of the elastic component is fixed to the lifting structure, the other end of the elastic component is fixed to the supporting structure, the elastic component The elastic restoring force generated by the pressure makes the base abut against the inner side surface of the top wall, and a gap is formed between the lifting structure and the supporting structure; a plurality of probe assemblies, each of the One end of the probe assembly is fixedly arranged on the supporting structure, and the probe assembly is used to connect with the circuit board, and the other ends of the plurality of probe assemblies pass through the plurality of connecting holes; wherein , When the wafer accommodating groove is provided with the wafer, and the limiting portion is not pressed by a pressing device, the probe assembly located in the plurality of connecting holes is different from the multiple of the wafer. The contact parts are connected; wherein, when the wafer receiving groove is provided with the wafer, and the pressing device abuts against the outer side surface of the top wall, it is exposed to the limit of the body The position portion will be pressed by the pressing device and retracted in the body, and the plurality of probe assemblies will press against the plurality of contact portions, and the plurality of probe assemblies and the The wafers are connected to each other; wherein, when the wafer pocket is provided with the wafer, and the pressing device abuts against the outer side surface of the top wall, a plurality of the probe assemblies are at most There are two contact parts, and the wafer is away from the outer side surface of the lifting structure, corresponding to the side of the pressing device pressing against the limiting part. The electrical connection unit according to claim 10, wherein each of the probe assemblies The length direction is defined as an axial direction, and the height of each of the limiting portions exposed to the main body along the axial direction is less than or equal to when the limiting portion is not pressed, the lifting The distance between the structure and the supporting structure in the axial direction. The electrical connection unit according to claim 10 or 11, wherein the length direction of each probe assembly is defined as an axial direction, and when the lifting structure is not pressed, the end of each probe assembly and The corresponding opening distance of one end of the connecting hole is less than or equal to the distance between the lifting structure and the supporting structure in the axial direction when the lifting structure is not pressed.

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