CN111951879A

CN111951879A - Detection device

Info

Publication number: CN111951879A
Application number: CN201910410618.8A
Authority: CN
Inventors: 蔡振龙; 基因·罗森塔尔
Original assignee: First Inspection Co Ltd
Current assignee: First Inspection Co Ltd
Priority date: 2019-05-16
Filing date: 2019-05-16
Publication date: 2020-11-17

Abstract

A detection device comprises a chip bearing device and a pressing device. The chip bearing device comprises a circuit board and a plurality of electric connection units. The plurality of electrical connection units are used for bearing a plurality of chips. The pressing device comprises a cover body and a pressing piece. The cover body is arranged on one side of the circuit board, an accommodating space is formed by the cover body and the circuit board together, and the plurality of electric connection units arranged on the circuit board are correspondingly positioned in the accommodating space. The air extraction equipment can extract the air in the accommodating space outwards so as to enable the accommodating space to be in a negative pressure state. The pressing piece is arranged between the cover body and the plurality of electric connection units and is positioned in the accommodating space. When the air-extracting device extracts the air in the accommodating space outwards, the pressing piece presses the plurality of electric connection units and the chip, so that the chip is connected with the electric connection units.

Description

Detection device

Technical Field

The present invention relates to a testing apparatus, and more particularly, to a testing apparatus for testing a chip.

Background

In the conventional common memory detection device, a memory is detected by inserting a plurality of memories into a plurality of electrical bases on a circuit board one by using a manual or mechanical arm. Subsequently, the plurality of memories are tested through the circuit board and the plurality of electrical pedestals. However, in a specific application, the memory is often not firmly connected to the electrical base (for example, the pins of the memory are not completely connected to the pins of the electrical base), and the memory is determined to be good but determined to be not qualified.

Disclosure of Invention

The main objective of the present invention is to provide a detection device, which is used to solve the problem in the prior art that when the memory detection device uses a manual or mechanical arm to insert the memories into the electrical base one by one for performing the detection operation, the memory is not firmly inserted into the electrical base, which may cause the detection result to be incorrect.

In order to achieve the above object, the present invention provides a detection apparatus for detecting a plurality of chips, the detection apparatus comprising a chip carrying device and a pressing device, the chip carrying device comprising at least one circuit board and a plurality of electrical connection units; the plurality of electric connection units are arranged on the circuit board and used for bearing a plurality of chips; a pressing device, comprising: the cover body is arranged on one side of the circuit board, the cover body and the circuit board jointly form an accommodating space, a plurality of electric connection units arranged on the circuit board are correspondingly positioned in the accommodating space, the cover body can be connected with an air extraction device, and the air extraction device can extract air in the accommodating space outwards so as to enable the accommodating space to be in a negative pressure state; the pressing piece is arranged between the cover body and the plurality of electric connection units, and at least one part of the pressing piece is positioned in the accommodating space; when the air in the accommodating space is pumped out by the air pumping equipment and the pressure of the accommodating space reaches a preset pressure, the pressing part presses the plurality of electric connection units and the chips arranged in the electric connection units, so that each chip is connected with the corresponding electric connection unit.

Preferably, the cover body has at least one air exhaust hole or the circuit board has at least one air exhaust hole, and the air exhaust device can exhaust the air in the accommodating space outwards through the air exhaust hole.

Preferably, each of the electrical connection units includes a body, a support structure, a lifting structure, at least one elastic component, and a plurality of probe components, the body has a top wall and a ring-shaped side wall, the top wall has an opening, one end of the ring-shaped side wall is connected to the periphery of the top wall, the other end of the ring-shaped side wall is disposed on the circuit board, and the top wall, the ring-shaped side wall, and the circuit board together form a receiving groove; two opposite side surfaces of the top wall are defined as an outer side surface and an inner side surface, and the inner side surface is positioned in the accommodating groove; the supporting structure is arranged on the circuit board and is positioned in the accommodating groove; the lifting structure is arranged in the accommodating groove and is provided with a base part and a bearing part, the base part is positioned in the accommodating groove, the base part extends towards one side to form the bearing part, and at least one part of the bearing part is positioned in the opening; the bearing part extends towards one side far away from the base part to form a plurality of limiting parts, at least one part of the limiting parts penetrates through the opening, a chip containing groove is formed by the limiting parts and the bearing part together, and the chip containing groove is used for containing one chip; the lifting structure is also provided with a plurality of connecting holes which penetrate through the base part and the bearing part; at least one elastic component is arranged in the accommodating groove, one end of the elastic component is fixed on the lifting structure, and the other end of the elastic component is fixed on the supporting structure; the elastic restoring force generated by the compression of the elastic component enables the base part to abut against the inner side surface of the top wall, and a gap is formed between the lifting structure and the supporting structure; one end of each probe assembly is fixedly arranged on the supporting structure, the probe assemblies are connected with the circuit board, and the other ends of the probe assemblies penetrate through the connecting holes; when the chip accommodating groove is provided with the chip and the limiting part is not pressed by the pressing part, the probe assemblies positioned in the connecting holes are not contacted with the contact parts of the chip; when the chip accommodating groove is provided with the chip, and the pressing piece abuts against the outer side surface of the top wall, the pressing piece is exposed out of the limiting part of the body, is pressed by the pressing device and is retracted into the body, the probe assemblies abut against the contact parts, and the probe assemblies and the chip are connected with each other.

Preferably, the length direction of each probe assembly defines an axial direction, and the height of the portion of each limiting portion exposed out of the body along the axial direction is less than or equal to the distance between the lifting structure and the support structure along the axial direction when the limiting portion is not pressed.

Preferably, the length direction of each probe assembly defines an axial direction, and when the lifting structure is not pressed, the distance between the tail end of each probe assembly and the opening of one end of the corresponding connecting hole is smaller than or equal to the distance between the lifting structure and the support structure along the axial direction when the lifting structure is not pressed.

Preferably, when the chip accommodating groove is provided with the chip, and the abutting device abuts against the outer side surface of the top wall, the plurality of probe assemblies abut against the plurality of contact portions, and the chip is far away from the outer side surface of the lifting structure and correspondingly abuts against the abutting device to abut against one side of the limiting portion.

Preferably, when the chip accommodating groove is provided with the chip, and the abutting device abuts against the outer side surface of the top wall, one end of the plurality of probe assemblies penetrates through the plurality of connecting holes.

Preferably, when the chip accommodating groove is provided with the chip, the abutting device abuts against the limiting portion, and the lifting structure abuts against the supporting structure, the plurality of probe assemblies abut against the plurality of contact portions, and the chip is far away from the outer side surface of the lifting structure and correspondingly abuts against the abutting device to abut against one side of the limiting portion.

Preferably, when the chip accommodating groove is provided with the chip, the abutting device abuts against the limiting part, and the lifting structure abuts against the supporting structure, one end of the plurality of probe assemblies penetrates through the plurality of connecting holes.

The beneficial effects of the invention can be that: the detection equipment can be matched with external air extraction equipment to extract air from the accommodating space, so that the accommodating space can be in a negative pressure state, and the pressing piece can tightly press the chips arranged on the plurality of electric connection units so as to ensure that each chip can be tightly connected with the electric connection units.

For a better understanding of the nature and technical aspects of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description, and are not intended to be limiting.

Drawings

FIG. 1 is a schematic view of a detection apparatus according to the present invention.

FIG. 2 is an exploded view of the detecting device of the present invention.

Fig. 3 is a partially enlarged schematic view of the electrical connection unit disposed on the circuit board according to the present invention.

Fig. 4 is an exploded cross-sectional view of the electrical connection unit of the present invention.

Fig. 5 is a cross-sectional view of the electrical connection unit of the present invention taken along a section line V shown in fig. 3.

Fig. 6 is a cross-sectional view of the electrical connection unit of the present invention taken along the section line VI shown in fig. 3.

Fig. 7 is a schematic view of the chip provided with the electrical connection unit of the present invention.

Fig. 8 is a cross-sectional view of the electrical connection unit of the present invention taken along a section line VIII shown in fig. 7.

Fig. 9 is a schematic cross-sectional view of the electrical connection unit of the present invention with a chip under pressure.

FIG. 10 is an exploded view of the probe assembly of the electrical connection unit of the present invention.

Fig. 11 is a schematic view of the pressing device of the detecting apparatus of the present invention.

Fig. 12 is a schematic view of another view angle of the pressing device of the detecting apparatus of the present invention.

Fig. 13 is a schematic cross-sectional view illustrating that the pressing device of the detecting apparatus of the present invention presses on the plurality of electrical connection units.

FIG. 14 is a schematic cross-sectional view of another embodiment of the detection apparatus of the present invention.

Fig. 15 is a schematic cross-sectional view of another embodiment of the pressing device of the detecting apparatus of the present invention.

Fig. 16 is a schematic cross-sectional view of a pressing device of a detecting apparatus according to another embodiment of the present invention.

Detailed Description

In the following description, reference is made to or shown in the accompanying drawings for the purpose of illustrating the subject matter described herein, and in which is shown by way of illustration only, and not by way of limitation, specific reference may be made to the drawings.

Please refer to fig. 1 and fig. 2, which are schematic diagrams illustrating an assembly and an disassembly of the detecting device of the present invention. As shown, the detection device E includes: a chip carrying device E1 and a pressing device E2.

The chip carrier E1 has a circuit board 1 and a plurality of electrical connection units 2. The plurality of electrical connection units 2 are fixedly disposed on the circuit board 1, each electrical connection unit 2 is used for carrying a chip C (as shown in fig. 7), a plurality of probe assemblies 20 (as shown in fig. 4) are disposed in each electrical connection unit 2, one end of each probe assembly 20 is used for being connected with the circuit board 1, the other end of each probe assembly 20 is used for being connected with the chip C, and the plurality of probe assemblies 20 are used for enabling the chip C and the circuit board 1 to be connected with each other. In different applications, the circuit board 1 may be a plurality of, but not limited to, a single circuit board 1. The chip C is particularly referred to as a memory (e.g., NAND Flash), but not limited thereto.

In a specific application, the circuit board 1 may be provided with at least one control unit (not shown, such as various microprocessors) or the circuit board 1 may be connected with a control device (not shown, such as a computer device), and the control unit or the control device may be connected with each chip C through the circuit board 1, so as to perform a detection operation on each chip C. What kind of detection operation is performed on the chip C by the control unit or the control device may be different according to actual requirements and different chips C; the control unit or the control device may perform the same detection operation on all the chips C disposed on the circuit board 1 at the same time, or the control unit or the control device may perform different detection operations on the chips C disposed on different areas of the circuit board 1, which is not limited herein.

The pressing device E2 can be controlled to press the side of each electrical connection unit 2 where the chip C is disposed, so that the chip C can be stably connected to the probe assembly 20 in the electrical connection unit 2 connected thereto when the chip C is tested. In various embodiments, the pressing device E2 may be used to change the temperature of each chip C, so that the chip C can be tested in a high temperature state or a low temperature state.

As shown in fig. 3, a schematic view of a single electrical connection unit 2 disposed on a circuit board 1 is shown; FIG. 4 is an exploded cross-sectional view of a single electrical connection unit 2; fig. 5 is a schematic view of the electrical connection unit 2 disposed on the circuit board 1, taken along the section line V shown in fig. 3; fig. 6 is a schematic view of the electrical connection unit 2 disposed on the circuit board 1, taken along a section line VI shown in fig. 3. As shown in fig. 3 to 6, each electrical connection unit 2 includes: a plurality of probe assemblies 20, a body 21, a lifting structure 22, a supporting structure 23 and four elastic assemblies 24.

The body 21 has a top wall 211 and a circular sidewall 212, the top wall 211 has an opening 21A, one side of the circular sidewall 212 is connected to the periphery of the top wall 211, the other side of the circular sidewall 212 is fixedly disposed on the circuit board 1, and the top wall 211, the circular sidewall 212 and the circuit board 1 together form a receiving slot 21B. Opposite sides of the top wall 211 define an outer side 2111 and an inner side 2112. In practical applications, the top wall 211 and the annular side wall 212 may be integrally formed, the body 21 may further have a plurality of locking holes 21C (as shown in fig. 3), and the plurality of locking holes 21C may cooperate with a plurality of locking members (e.g., screws) to fix the body 21 to the circuit board 1, but the way of fixing the body 21 to the circuit board 1 is not limited thereto.

The lifting structure 22 includes a base 221 and a supporting portion 222. The base 221 is completely disposed in the receiving groove 21B, the base 221 extends toward one side to form a bearing portion 222, and a portion of the bearing portion 222 can pass through the opening 21A. The carrying portion 222 extends to a side away from the base portion 221 to form four limiting portions 223, the four limiting portions 223 are located at four corners of the carrying portion 222, a chip accommodating groove 22B is formed by the four limiting portions 223 and the carrying portion 222, the chip accommodating groove 22B is used for accommodating a chip C, and the four limiting portions 223 are used for being mutually clamped with the chip C. Each stopper 223 may be substantially L-shaped, but not limited thereto; the number of the limiting portions 223 may also be varied according to the requirement, and is not limited to four, and the arrangement positions of the limiting portions 223 are not limited to those shown in the drawings, and the four limiting portions 223 may also not be arranged at four corners. The lifting structure 22 further has a plurality of connection holes 22A (shown in fig. 6), and each connection hole 22A is disposed through the base portion 221 and the bearing portion 222.

A part of the probe assemblies 20 is fixedly arranged in the supporting structure 23, and the probe assemblies 20 are fixedly arranged at one end of the supporting structure 23 and are used for being connected with the circuit board 1; the other ends of the probe assemblies 20 are located in the connecting holes 22A, and one end of the probe assembly 20 located in the connecting holes 22A is used to connect with the contact portion C1 of the chip C.

As shown in fig. 4 to 6, the supporting structure 23 is disposed in the accommodating groove 21B, and the four elastic elements 24 are disposed between the supporting structure 23 and the lifting structure 22. Each elastic member 24 may be, for example, a compression spring, and the lifting structure 22 and the support structure 23 may have engaging

grooves

22C and 23A formed on the sides facing each other, respectively, and both ends of each elastic member 24 may be correspondingly engaged with the

engaging grooves

22C and 23A. In different applications, the lifting structure 22 and the supporting structure 23 may have engaging protrusions formed in the

engaging grooves

22C and 23A, respectively, and two ends of each elastic component 24 may be correspondingly engaged and fixed with the two engaging protrusions.

The four elastic members 24 enable the base portion 221 of the lifting structure 22 to abut against the inner side surface 2112 of the top wall 211, and enable a gap S (shown in fig. 6) to be correspondingly formed between the base portion 221 and the supporting structure 23. In practical applications, when the electrical connection unit 2 is fixed on the circuit board 1 and the limiting portion 223 of the electrical connection unit 2 is not pressed by an external force, the four elastic elements 24 located between the lifting structure 22 and the supporting structure 23 may be slightly compressed, and the elastic restoring force generated by the compressed elastic elements 24 will make the lifting structure 22 firmly abut against the inner side 2112 of the top wall 211.

In particular, the number of the elastic elements 24 of the electrical connection unit 2 is not limited to four, and the number of the elastic elements 24 may be varied according to the requirement, for example, may be one.

As shown in fig. 7 and 8, when the chip C is fixedly disposed in the chip accommodating slot 22B and the pressing device E2 (shown in fig. 2) does not press the limiting portion 223, the plurality of contact portions C1 of the chip C are correspondingly accommodated in the plurality of connecting holes 22A, each probe assembly 20 is not connected with the plurality of contact portions C1 (e.g., does not contact with each other), and a gap S is formed between the lifting structure 22 and the supporting structure 23. In the embodiment shown in fig. 8, the outer side surface C2 of the chip C away from the lifting structure 22 may not protrude from the limiting portion 223, but not limited thereto, in different embodiments, the outer side surface C2 of the chip C may be substantially flush with the outer side surface 223A of the limiting portion 223, or the outer side surface C2 of the chip C may slightly protrude from the outer side surface 223A of the limiting portion 223. It should be noted that in the drawings of the present embodiment, the contact portion C1 is exemplified as a solder ball, but the contact portion C1 may be a pin, a flat pad, etc., and is not limited thereto.

As shown in fig. 13, when the chip C is disposed in the chip accommodating slot 22B and the pressing device E2 abuts against the outer side surface 2111 of the top wall 211, the limiting portion 223 is pressed to be retracted into the main body 21, that is, the lifting structure 22 moves toward the circuit board 1 relative to the plurality of probe assemblies 20.

When the pressing device E2 presses the position-limiting portion 223 to retract the position-limiting portion 223 into the main body 21, the lifting structure 22 will move relative to the plurality of probe assemblies 20, and when the lifting structure 22 presses against one side of the supporting structure 23, the plurality of probe assemblies 20 will correspondingly penetrate through the plurality of connecting holes 22A, and one end of the plurality of probe assemblies 20 will correspondingly press against the plurality of contact portions C1 of the chip C, so that the plurality of probe assemblies 20 are connected with the chip C. It should be noted that, when the lifting structure 22 abuts against one side of the supporting structure 23, the plurality of probe assemblies 2 may not penetrate through the plurality of connecting holes 22A as long as the plurality of probe assemblies 2 can be connected with the chip C. In the drawings of the present embodiment, therefore, after the lifting structure 22 is pressed, the limiting portion 223 may be completely retracted into the body 21, but not limited thereto, and in different embodiments, after the lifting structure 22 is pressed, the limiting portion 223 may not be completely retracted into the body 21.

When the pressing device E2 abuts against the outer side 2111 of the electrical connection unit 2, the plurality of probe assemblies 20 may push against the chip C, so that the outer side C2 of the chip C abuts against the inner side of the pressing device E2. When the outer side surface C2 of the chip C abuts against the inner side of the abutting device E2, the springs 202 of the probe assemblies 20 are compressed, and the elastic restoring force generated by the compression of the springs 202 makes the chip C stably abut against the inner side surface 2112 of the abutting device E2.

Referring to fig. 6, it is particularly noted that, if the length direction of the probe assembly 20 is defined as an axial direction (i.e., the Y-axis direction shown in the figure), when the lifting structure 22 is not pressed (in this case, the base portion 221 may abut against the top wall 211), the distance D2 between the end of each probe assembly 20 and the opening of one end of the corresponding connecting hole 22A may be smaller than the distance D1 between the lifting structure 22 and the supporting structure 23 along the axial direction, so that when the lifting structure 22 is pressed against one side of the supporting structure 23 (as shown in fig. 10), one end of the probe assembly 20 penetrates through the connecting hole 22A, thereby ensuring that one end of the probe assembly 20 can be connected with (e.g., mutually contact with) the contact portion C1 of the chip C.

It should be noted that, as long as the lifting structure 22 is pressed, the probe assemblies 20 can be changed from not contacting the contact portions C1 of the chip C to contacting the contact portions C1, the distance D2 and the distance D1 can be adjusted according to the requirement, that is, the probe assemblies 20 may or may not protrude from the corresponding connecting holes 22A when the lifting structure 22 is pressed on the premise that the probe assemblies 20 can contact the contact portions C1 after the lifting structure 22 is pressed.

As shown in fig. 6, a height H1 of a portion of each limiting portion 223 exposed from the body 21 along the axial direction (i.e., the Y-axis direction shown in the figure) is smaller than or equal to a distance D1 between the lifting structure 22 and the supporting structure 23 along the axial direction when the limiting portion 223 is not pressed, so that each limiting portion 223 can be retracted into the body 21 when pressed by the pressing device E2. In an embodiment where the height H1 of the portion of each stopper 223 exposed from the body 21 in the axial direction (i.e., the Y-axis direction shown in the figure) is equal to the distance D1 between the lifting structure 22 and the supporting structure 23, when the pressing device E2 abuts against the outer side surface 2111 of the body 21, the lifting structure 22 will abut against one side of the supporting structure 23 correspondingly.

As described above, when the pressing device E2 abuts against the outer side 2111 of the electrical connection unit 2, the plurality of probe assemblies 20 will abut against the chip C, and the chip C abuts against one side of the pressing device E2, at this time, the control unit or the control equipment can perform the detection operation on the chip C, and simultaneously control the pressing device E2 to increase or decrease the temperature, so that the chip C performs the detection operation in the high temperature state or the low temperature state.

Since the pressing device E2 is simultaneously attached to the outer side surfaces C2 of the chips C when the pressing device E2 is pressed against the outer side surfaces 2111 of the electrical connection units 2, when the pressing device E2 is controlled to increase or decrease the temperature, the temperatures of the chips C change with the pressing device E2, and the temperatures of the chips C approach to be the same, so that the chips C can be detected at substantially the same temperature.

In the prior art, the way of simultaneously performing the detection operation on the plurality of chips C in the high-temperature environment is as follows: firstly, arranging a circuit board 1 inserted with a plurality of chips C in an oven; then, the temperature in the oven is raised by utilizing an air heater in the oven, so that the plurality of chips C can be detected in a high-temperature environment; however, the temperature of each region in the oven cannot be accurately controlled by the detection method of the prior art, and thus, the chips C cannot be detected at the expected temperature, which results in inaccurate detection results. In view of the above-mentioned detection apparatus E of the present invention, the problems of the prior art can be substantially improved.

As shown in fig. 4, 6 and 10, in practical applications, the supporting structure 23 may include a base structure 231 and an auxiliary structure 232. The base structure 231 is disposed in the receiving groove 21B, and the base structure 231 and the body 21 are fixed to each other (for example, fixed to the body 21 by a plurality of screws). The base structure 231 has a plurality of through holes 231A, and one end of the probe assemblies 20 are fixedly disposed in the through holes 231A.

It should be noted that one of the main functions of the base structure 231 is to stably erect the probe assembly 20 in the receiving groove 21B, so the aperture of the through hole 231A of the base structure 231 may be slightly smaller than the maximum outer diameter of the probe assembly 20, and each probe assembly 20 and the through hole 231A may be disposed in a snap-fit manner. The number of the through holes 231A of the base structure 231, the depth of each through hole 231A, the spacing distance between the through holes 231A, the arrangement of the through holes 231A, etc. may vary according to requirements, and the illustration is only an exemplary embodiment, and is not limited thereto.

The auxiliary structure 232 is disposed in the receiving groove 21B, the auxiliary structure 232 is located between the base structure 231 and the top wall 211, and the auxiliary structure 232 and the base structure 231 are fixed to each other (for example, fastened to each other by screws). The auxiliary structure 232 has a plurality of supporting holes 232A, the supporting holes 232A are disposed at intervals, the supporting holes 232A are communicated with the through holes 231A of the base structure 231, the supporting holes 232A are disposed corresponding to the connecting holes 22A, the supporting holes 232A and the through holes 231A together form a plurality of probe channels T, and the probe assemblies 20 are disposed corresponding to the probe channels T.

As shown in fig. 10, which is an exploded view of a single probe assembly 20. The probe assembly 20 includes: a needle 201 and a spring 202. The pin body 201 is a rod-shaped structure, and two ends of the pin body 201 define a contact end 201A and a tail end 201B. The position of the needle 201 adjacent to the contact end 201A has a limit protrusion 2011 (a ring structure is shown in the figure, but the shape is not limited thereto), the limit protrusion 2011 divides the needle 201 into an exposed section 201C and an embedded section 201D, the spring 202 is correspondingly sleeved on the embedded section 201D of the needle 201, and the exposed section 201C of the needle 201 is not sleeved with the spring 202.

The needle 201 further separates a fixing section 201E from the hidden section 201D, the fixing section 201E is located adjacent to the limit protrusion 2011, and the outer diameter of the needle 201 in the fixing section 201E is larger than the outer diameter of the needle 201 in the remaining sections of the hidden section 201D.

The spring 202 is sequentially partitioned into a first tight section 202A, an elastic section 202B and a second tight section 202C from one end to the other end. The inner diameter of the spring 202 in the first tightening section 202A is smaller than the outer diameter of the needle 201 in the fixing section 201E, and when the spring 202 is sleeved on the hidden section 201D of the needle 201, the first tightening section 202A of the spring 202 is correspondingly fastened with the fixing section 201E of the needle 201, and one end of the spring 202 adjacent to the first tightening section 202A is correspondingly abutted against one side of the limit protrusion 2011. That is, one end of the spring 202 can be fixedly disposed on the fixing section 201E of the needle 201 by the design that the inner diameter of the first tightening section 202A of the spring 202 and the outer diameter of the needle 201 on the fixing section 201E are matched with each other.

The distance (pitch) between the first tight section 202A and the second tight section 202C of the spring 202 is smaller than the distance (pitch) between the spring 202 and the elastic section 202B, and in practical applications, the distance (pitch) between the spring 202 and the first tight section 202A or the second tight section 202C can be close to zero, i.e., the spring 202 is not deformed in the first tight section 202A or the second tight section 202C regardless of whether the spring 202 is compressed, and the first tight section 202A and the second tight section 202C of the spring 202 only serve as structures for fixing the needle 201 and the base structure 231 to each other.

The length of the spring 202 in the first tight section 202A is smaller than the length of the spring 202 in the elastic section 202B; the length of the spring 202 in the second tightening segment 202C can be determined according to the depth of the through hole 231A of the base structure 231.

In practical applications, the spring 202 of each probe assembly 20 may be made of a conductive material, when the spring 202 is sleeved on the pin body 201 and the first tightening section 202A of the spring 202 and the fixing section 201E of the pin body 201 are fixed to each other, the tail end 201B of the pin body 201 may not be exposed out of the spring 202, and when the electrical connection unit 2 is fixed to the circuit board 1, one end of the spring 202 having the second tightening section 202C abuts against the circuit board 1, the spring 202 is connected to the circuit board 1, and the current and the signal between the circuit board 1 and the chip C are transmitted through the pin body 201 and the spring 202.

As shown in fig. 6 and 10, the auxiliary structure 232 may have a propping structure 2321 in each supporting hole 232A, and each propping structure 2321 is used for propping against the limit protrusion 2011 of the pin 201. When the probe assembly 20 is disposed in the probe channel T, the limit protrusion 2011 of the probe body 201 correspondingly abuts against the abutting structure 2321, and the abutting structure 2321 can limit the movement of the probe body 201 relative to the auxiliary structure 232 toward the lifting structure 22. Since the limit protrusion 2011 of the pin 201 is correspondingly abutted against the abutting structure 2321, the built-in section 201D of the pin 201 is correspondingly located in the auxiliary structure 232 and the base structure 231 (i.e., the supporting structure 23), most of the exposed section 201C of the pin 201 is correspondingly exposed out of the supporting structure 23, and a section of the pin 201 adjacent to the contact end 201A is correspondingly located in the connection hole 22A.

It should be noted that, as shown in fig. 3 and fig. 6, in practical applications, each electrical connection unit 2 may be fixed to the circuit board 1 by locking, and each probe assembly 20 adjacent to one end of the circuit board 1 may be connected to the circuit board 1 by abutting, and each probe assembly 20 is not fixed to the circuit board 1 by soldering; therefore, the relevant personnel can replace any one of the electrical connection units 2 on the circuit board 1 according to the requirement, and the relevant personnel can also replace any one of the probe assemblies 20 in each of the electrical connection units 2 according to the requirement.

Referring to fig. 8 and 9, when the pressing device E2 no longer presses the limiting portion 223, the elastic restoring force generated by the pressing of the elastic component 24 pushes the lifting structure 22, so that the lifting structure 22 moves from a position adjacent to the auxiliary structure 232 to a position abutting against the inner side surface 2112 of the top wall 211, and in the process that the lifting structure 22 moves from the state of fig. 10 to the state of fig. 8, the lifting structure 22 separates the chip C from the contact ends 201A of the plurality of pins 201, so that the chip C is no longer connected to (for example, no longer contacts) the plurality of probe assemblies 20.

It should be noted that, as shown in fig. 6 and 10, in an embodiment where a height H1 of a portion of each limiting portion 223 exposed from the body 21 along the axial direction (i.e., the Y-axis direction shown in the figures) is smaller than a distance D1 between the lifting structure 22 and the supporting structure 23 along the axial direction when the limiting portion 223 is not pressed, when the pressing device E2 is pressed against the outer side surface 2111, a gap G may be formed between the lifting structure 22 and the auxiliary structure 232, and by the design of the gap G, when the lifting structure 22 or the auxiliary structure 232 has a production error, the pressing device E2 can still be ensured to be pressed against the outer side surface 2111.

In various embodiments, when the pressing device E2 presses the lifting structure 22 and the plurality of probe assemblies 20 are connected to (e.g., contact) the contact portions C1 of the chip C, the pressing device E2 may not press the outer side surface 2111, and the lifting structure 22 presses one side of the supporting structure 23.

In summary, when the chip C is disposed in the chip accommodating slot 22B of the electrical connection unit 2 and the lifting structure 22 is not pressed, the plurality of probe assemblies 20 are not connected to the chip C; when the lifting structure 22 is pressed and retracted in the body 21, the plurality of probe assemblies 20 are connected to each other against the chip C; when the lifting structure 22 is no longer pressed, the lifting structure 22 returns to the non-pressed state, and the chip C is no longer connected to the probe assemblies 20.

Referring to fig. 11 to 13 together, fig. 11 and 12 are exploded schematic views illustrating an embodiment of a pressing device E2 of a detecting apparatus E of the present invention, and fig. 13 is a schematic cross-sectional view illustrating the pressing device E2 of the present embodiment abutting against a plurality of electrical connection units 2. As shown, the pressing device E2 may include a temperature adjustment assembly 30 and a pumping assembly 40. The number of the temperature adjustment assemblies 30 may vary according to the requirements, and is not limited to one.

The temperature adjustment assembly 30 may include a temperature regulator 31 and a cover 32. The temperature regulator 31 has a flat structure 311 on one side, the flat structure 311 has a flat contact surface 3111, and the temperature regulator 31 may have heating coils (not shown) inside, which can be controlled to generate heat energy. The temperature regulator 31 may also have at least one fluid passage (not shown) therein, and the fluid passage may be in communication with a fluid inlet 31A and a fluid outlet 31B of the temperature regulator 31, and the cryogenic fluid may enter the fluid passage from the fluid inlet 31A and then exit from the fluid outlet 31B. In particular, the pressing device E2 shown in fig. 9 may be the flat structure 311 of the temperature adjustment assembly 30 described in this embodiment. The number of the fluid inlets 31A and the fluid outlets 31B may be increased according to the requirement, and is not limited to a single one. The number of the temperature regulators 31 is not limited to a single one, and in different embodiments, the number of the temperature regulators 31 may be two or more.

As shown in fig. 12 and 9, when the pressing device E2 presses against the electrical connection unit 2, the flat structure 311 of the pressing device E2 correspondingly presses against the outer side 2111 of the electrical connection unit 2 and the outer side C2 of each chip C, and at this time, the relevant personnel or equipment can control the operation of the temperature regulator 31 through the control unit or the control equipment, so as to enable the heating coil to generate heat energy, thereby increasing the temperature of the flat structure 311, and accordingly enabling the chip C to perform the detection operation in a high temperature state; alternatively, the related personnel or equipment can control the operation of the cryogenic fluid storage equipment (not shown) connected to the temperature regulator 31 through the control unit or control equipment, so that the cryogenic fluid stored in the cryogenic fluid storage equipment enters the temperature regulator 31 through the fluid inlet 31A, thereby lowering the temperature of the flat structure 311, and accordingly, the chip C is subjected to the detection operation in the low temperature state.

In particular, in practical applications, the pressing device E2 may have only a heating coil without a fluid channel, or the pressing device E2 may have only a fluid channel without a heating coil, that is, the pressing device E2 is not limited to have both heating and cooling functions, and the pressing device E2 may have only heating or cooling functions. In the embodiment where the pressing device E2 has no heating coil but only has a fluid channel, it is also possible to let the high temperature liquid flow into the fluid channel, thereby making the pressing device E2 still have the heating function.

The temperature adjustment assembly 30 is only an exemplary embodiment, and the practical application is not limited to the above description, for example, the temperature adjustment assembly 30 may also include a cooling chip.

The cover 32 is fixedly disposed at one side of the temperature regulator 31, and the cover 32 is used to block the transmission of heat energy, so as to prevent the heat energy generated by the temperature regulator 31 from rapidly escaping outwards, or prevent the external heat energy from being transmitted to the temperature regulator 31 through which the cryogenic fluid flows. In practical applications, a receiving space 32A may be correspondingly formed between the cover 32 and the temperature regulator 31, and the receiving space 32A may be filled with any member capable of blocking heat energy transmission. The shapes, sizes, etc. of the temperature regulator 31 and the cover 32 may vary according to requirements, and are shown as an example. The mode of generating the thermal energy by the temperature regulator 31 is not limited to the use of a heating coil, and the temperature regulator 31 is not limited to the use of a cryogenic fluid to achieve the effect of reducing the temperature.

The air extracting assembly 40 has a cover 401, a recess 40A is formed in one side of the cover 401, the cover 401 has an accommodating opening 40B, and the accommodating opening 40B is communicated with the recess 40A. A protrusion 312 may be formed on a side of the temperature regulator 31 opposite to the flat structure 311, the flat structure 311 is fixedly disposed in the groove 40A, and the protrusion 312 is correspondingly exposed out of the receiving opening 40B. The fluid inlet 31A and the fluid outlet 31B are disposed on the protrusion 312, but not limited thereto, the positions of the fluid inlet 31A and the fluid outlet 31B may be changed according to the requirement. The cover 32 is disposed on the side of the cover 401 opposite to the side where the groove 40A is formed. The enclosure 401 further has two pumping holes 40C, and the two pumping holes 40C are used for connecting with a pumping device. The appearance and size of the mask 401, the number and size of the pumping holes 40C, etc. may be varied according to requirements, and are shown as an example.

As shown in fig. 13 and 9, when the pressing device E2 is disposed on one side of the circuit board 1, the flat structure 311 of the temperature regulator 31 will correspondingly abut against the limiting portions 223 of the plurality of electrical connection units 2, the cover 401, the circuit board 1 and the flat structure 311 together form an accommodating space SP, and the air-extracting hole 40C is communicated with the accommodating space SP, so that the air-extracting device can perform air-extracting operation on the accommodating space SP through the air-extracting hole 40C to extract air in the accommodating space SP outwards, so as to make the accommodating space SP in a negative pressure state, thereby pressing the auxiliary flat structure 311 against the limiting portions 223 of the plurality of electrical connection units 2 disposed on the circuit board 1.

More specifically, when the pressing device E2 presses the position-limiting portion 223, the pressing device E2 must resist the elastic restoring force generated by the elastic component 24 and the plurality of probe components 20, so that when the number of the electrical connection units 2 disposed on the circuit board 1 increases, the acting force required by the pressing device E2 to press the position-limiting portions 223 of the plurality of electrical connection units 2 simultaneously increases; in this case, the pressing device E2 is used in conjunction with the air extractor to make the accommodating space SP in a negative pressure state, so that the acting force required by the pressing device E2 to press down the plurality of limiting portions 223 at the same time can be greatly reduced.

When the pressing device E2 is matched with an air extracting device to make the accommodating space SP in a negative pressure state and the temperature regulator 31 heats or cools the plurality of chips, the accommodating space SP is in a vacuum state or a state close to the vacuum state, so that the probability that the temperature of the accommodating space SP is affected by the external environment can be effectively reduced.

Referring to both FIG. 2 and FIG. 14, in various embodiments, the pumping assembly 40 may further include an airtight member 50 and a structural reinforcing member 60. The air seal 50 may be a ring structure, the air seal 50 is disposed between the housing 401 and the circuit board 1, and the air seal 50 is used to prevent the external air from flowing through the accommodating space SP. In a specific application, the airtight member 50 may be engaged with the circuit board 1 or the housing 401, which is not limited herein; the shape, size and position of the air seal 50 can be changed according to the requirement, and is not limited herein. It should be noted that, in practical applications, a corresponding airtight member may be additionally disposed at any position that may affect the airtightness of the accommodating space SP, for example, as shown in fig. 3, an elastic rubber ring may be disposed in each locking hole 21C; or the locking hole 21C may be filled with glue to enhance the air-tight effect between the locking member and the locking hole.

One side of the structural reinforcement member 60 is recessed to form an engaging groove 60A, and the circuit board 1 is engaged and fixed in the engaging groove 60A. The structural reinforcement member 60 is used to reinforce the overall structural strength of the circuit board 1, so as to avoid the problem that the circuit board 1 deforms during the process of exhausting the accommodating space SP by the air exhausting equipment. In a preferred embodiment, in addition to the circuit board 1 and the structural reinforcement member 60 being fastened and fixed to each other through the fastening groove 60A, the circuit board 1 and the structural reinforcement member 60 may be fixed to each other through a plurality of fasteners (e.g., screws), a sealing rubber ring may be disposed between the fasteners and the circuit board 1, or a gap that may exist between the fasteners and the circuit board 1 may be sealed by welding, spraying an airtight adhesive, or the like.

In different embodiments, the number of the structural reinforcements 60 and the arrangement positions thereof may also be changed according to requirements, for example, the detection apparatus may also have two structural reinforcements 60, and the circuit board 1 is sandwiched between the two structural reinforcements 60.

Please refer to fig. 14, which is a schematic cross-sectional view illustrating another embodiment of the detecting apparatus of the present invention. The embodiment is different from the embodiment shown in fig. 13 in that: the detection device E may also be provided without the airtight member 50, and the housing 401 may be directly abutted against one side of the circuit board 1. In a specific application, the cover 401 and the circuit board 1 may have structures that can be engaged with each other.

Please refer to fig. 15, which is a schematic cross-sectional view illustrating a detecting apparatus according to another embodiment of the present invention. The embodiment is different from the embodiment shown in fig. 14 in the following point: the pressing device E2 of the detecting device 1 can also be provided with no temperature adjusting assembly 30 but with the air extracting assembly 40. The air extracting component 40 is provided with a cover body 401A, one side of the cover body 401A is concave to form a groove 40A, but the cover body 401A does not have the accommodating opening 40B; in addition, the pressing device E2 further includes a pressing element 70.

The cover 401A covers one side of the circuit board 1, the cover 401A and the circuit board 1 together form an accommodating space SP, and the cover 401A also has at least one air extracting hole 40C (as shown in fig. 12), and the air extracting device can extract air in the accommodating space SP outwards through the air extracting hole 40C. The pressing element 70 may be detachably fixed to the cover 401A, and the pressing element 70 is correspondingly located in the groove 40A. In various applications, the pressing member 70 may be fixed in the cover 401A by non-detachable means such as adhesion.

The cover 401A may be fixed to one side of the circuit board 1 by a plurality of fasteners (e.g., screws); when the cover body 401A covers the circuit board 1, the pressing element 70 is correspondingly located between the cover body 401A and the plurality of electrical connection units 2, and the pressing element 70 correspondingly presses the chip C (as shown in fig. 9) disposed on the plurality of electrical connection units 2; when the cover 401A is fixedly disposed on the circuit board 1 and the air extracting device extracts air from the accommodating space SP, when the pressure of the accommodating space SP reaches a predetermined pressure (negative pressure), the pressing member 70 will simultaneously retract the limiting portions 223 of the plurality of electrical connection units 2 into the corresponding main bodies 21, and the pressing member 70 will correspondingly abut against one side of the chip C opposite to the electrical connection units 2, so that the chip C will be connected to the plurality of probe assemblies 20 in the electrical connection units 2. As shown in fig. 16, in another embodiment, the cover 401B and the pressing element 70 may be integrally formed, and the cover 401B and the pressing element 70 are not limited to be members independent of each other.

In summary, the detecting apparatus and the chip carrying device of the present invention can utilize the pressing device to simultaneously press the chips disposed on the plurality of electrical connection units, so that the plurality of chips can be simultaneously detected in almost the same temperature state. The electric connection unit of the invention can ensure that the chip can be firmly connected with a plurality of probe assemblies when the chip is detected by mutually matching the lifting structure, the elastic assembly, the probe assembly and other members.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, so that all equivalent technical changes made by using the contents of the present specification and the accompanying drawings are included in the scope of the present invention.

Claims

1. An inspection apparatus for inspecting a plurality of chips, the apparatus comprising:

a chip carrier device, comprising:

at least one circuit board; and

a plurality of electrical connection units disposed on the circuit board, the plurality of electrical connection units being configured to carry a plurality of the chips: and

a pressing device, comprising:

the cover body is arranged on one side of the circuit board, an accommodating space is formed by the cover body and the circuit board together, the plurality of electric connection units arranged on the circuit board are correspondingly positioned in the accommodating space, the cover body can be connected with an air extraction device, and the air extraction device can extract air in the accommodating space outwards so as to enable the accommodating space to be in a negative pressure state;

the pressing piece is arranged between the cover body and the plurality of electric connection units, and at least one part of the pressing piece is positioned in the accommodating space; and

when the air in the accommodating space is pumped out by the air pumping equipment and the pressure of the accommodating space reaches a preset pressure, the pressing part presses the plurality of electric connection units and the chips arranged in the electric connection units, so that each chip is connected with the corresponding electric connection unit.

2. The detecting apparatus according to claim 1, wherein the cover has at least one air hole or the circuit board has at least one air hole, and the air-extracting apparatus can extract air in the accommodating space through the air hole.

3. The detection apparatus according to any one of claims 1 or 2, wherein each of the electrical connection units comprises:

the circuit board comprises a body, a first connecting piece and a second connecting piece, wherein the body is provided with a top wall and an annular side wall, the top wall is provided with an opening, one end of the annular side wall is connected with the periphery of the top wall, the other end of the annular side wall is arranged on the circuit board, and a containing groove is formed by the top wall, the annular side wall and the circuit board; two opposite side surfaces of the top wall are defined as an outer side surface and an inner side surface, and the inner side surface is positioned in the accommodating groove;

the supporting structure is arranged on the circuit board and is positioned in the accommodating groove;

the lifting structure is arranged in the accommodating groove and is provided with a base part and a bearing part, the base part is positioned in the accommodating groove, the base part extends towards one side to form the bearing part, and at least one part of the bearing part is positioned in the opening; the bearing part extends towards one side far away from the base part to form a plurality of limiting parts, at least one part of the limiting parts penetrates through the opening, a chip containing groove is formed by the limiting parts and the bearing part together, and the chip containing groove is used for containing one chip; the lifting structure is also provided with a plurality of connecting holes which penetrate through the base part and the bearing part;

the elastic assembly is arranged in the accommodating groove, one end of the elastic assembly is fixed to the lifting structure, and the other end of the elastic assembly is fixed to the supporting structure; the elastic restoring force generated by the compression of the elastic component enables the base part to abut against the inner side surface of the top wall, and a gap is formed between the lifting structure and the supporting structure;

one end of each probe assembly is fixedly arranged on the supporting structure, the probe assemblies are connected with the circuit board, and the other ends of the probe assemblies penetrate through the connecting holes;

when the chip accommodating groove is provided with the chip and the limiting part is not pressed by the pressing part, the probe assemblies positioned in the connecting holes are not contacted with the contact parts of the chip;

when the chip accommodating groove is provided with the chip, and the pressing piece abuts against the outer side surface of the top wall, the pressing piece is exposed out of the limiting part of the body, is pressed by the pressing device and is retracted into the body, the probe assemblies abut against the contact parts, and the probe assemblies and the chip are connected with each other.

4. The detecting apparatus according to claim 3, wherein the length direction of each probe assembly defines an axial direction, and the height of the portion of each position-limiting portion exposed from the body along the axial direction is less than or equal to the distance between the lifting structure and the supporting structure along the axial direction when the position-limiting portion is not pressed.

5. The detecting apparatus according to claim 3 or 4, wherein the length direction of each probe assembly defines an axial direction, and when the lifting structure is not pressed, the distance between the end of each probe assembly and the opening of one end of the corresponding connecting hole is smaller than or equal to the distance between the lifting structure and the supporting structure along the axial direction when the lifting structure is not pressed.

6. The detecting apparatus according to claim 5, wherein when the chip accommodating slot is provided with the chip and the pressing device abuts against the outer side surface of the top wall, the plurality of probe assemblies abut against the plurality of contact portions, and the chip is away from the outer side surface of the lifting structure and correspondingly abuts against the pressing device against one side of the limiting portion.

7. The detecting apparatus according to claim 4, wherein when the chip accommodating slot is provided with the chip and the pressing device abuts against the outer side surface of the top wall, one end of the plurality of probe assemblies penetrates through the plurality of connecting holes.

8. The detecting apparatus according to claim 3, wherein when the chip accommodating slot is provided with the chip, the pressing device presses against the position-limiting portion, and the lifting structure presses against the supporting structure, the plurality of probe assemblies press against the plurality of contact portions, and the chip is away from the outer side surface of the lifting structure and correspondingly presses against the pressing device against one side of the position-limiting portion.

9. The detecting apparatus according to claim 6, wherein when the chip accommodating slot is provided with the chip, the pressing device presses against the position-limiting portion, and the lifting structure presses against the supporting structure, one end of the plurality of probe assemblies penetrates through the plurality of connecting holes.