201001581 九、發明說明： 【發明所屬之技術領域】 本發明是關於一種測試座及測試機台，尤其是一種具 變溫裝置之半導體元件測試座及測試機台。 【先前技術】 隨半導體元件之集積化，較複雜之半導體元件腳位動 辄數百個，為能與電路板或連接器上之接腳保持良好導接 關係，該等腳位多密佈於單一側面；相反於該面，則形成 有一平坦表面，一方面供吸嘴吸取搬移，另方面亦可供下 壓，為便於說明，以下將設置有複數腳位之面稱為導接 面’平坦之上表面稱為頂面。 測試此類半導體元件檢測之設備 如圖1所示，預先設置具有複數接點122之連接器12, 以一對一對應半導體元件1〇導接面1〇2之腳位1〇4。機 台上並設置有供對應於半導體元件1〇頂面iQ6下屋之機 械臂14 ’使半導體元件1〇之腳位1〇4與連接器u之接 點122完成電連接，如此成為訊號供應、傳遞與回報之通 道’以配合測試要求’對各類之半導體元件ig進行檢測。 當然，即使圖1中之腳幻04與接·點⑵的外型分別以凹 狀接點與彈性頂針為例，但常見之各種型態並不僅限於 此’腳位104與接點122亦常見有接腳與插槽之對應模式。 此外’半導體元件於進行檢測時，為忠實模擬未來半 導體元件可能對應環境，例如置放於野外工作站之電腦可 能於南低溫、高濕度、或高鹽分地區使用、抑或飛行器航 5 201001581 行於高空低溫之中，在在都是對半導體元件使用環境之考 驗：因此於檢測時，亦加入相關溫度因素，破認半導體元 件是否足堪適用於預期之嚴苛環境。 為加諸待測半導體元件預設溫度環境，業者紛紛開發 +出相異解決方案，最早是選擇直接遮蓋檢測區域，並將遮 蓋區域整體溫度直接升降；但此種方法—方面可能產生溫 度不均勻現象，再方面，改變溫度之環境區域愈大，所耗 費能源愈多，在操作上並不經濟。 隨後，有業者提出如在機械臂之底端加裝變溫裝置， 以在抵壓半導體元件時，精確控㈣作位置之溫声.伸 是’由於機械臂本身必須升降，且底端負有吸取搬移半導 體元件之使命，有時還要設置三向浮動頭以吸收公差，要 同時穿過浮動頭而顧及吸取裝置與變溫裳置之設置，無疑 使機械臂之造價遽增，也因結構複雜化而較需頻繁保 修。 、 更有業者如美國第6,636,062號發明專利，揭露如圖 2所示之變基座在其内部設置加熱/冷卻組，由上而 下分別為加熱組206、吸熱器204、外密封墊212與底座 202 ’底座202更具有冷卻劑入口 214與冷卻劑出口 2丨6， 可知加熱/冷卻組200具有熱/冷兩組系統，並以液體為冷 卻劑，利用冷卻劑入口 214與冷卻劑出口 216進行循環， 讓連接器之基座擔負變溫責任，從而提供預定之溫度&環 境。然而，如上所述，當半導體元件之腳位達數百個，密 佈於半導體元件之導接面，此時一方面要在連接器基座中 201001581 縫隙中形 之液體流 安排數百隻接腳，另方面還需在規避諸多接腳的 成導熱管道，尤其導熱管道内需容許進行熱交換 通而不洩漏’無疑是高難度之規劃。 因此，若能提供一種構造精簡、耗能低、應用模式多 樣、無需改變機械臂構造且不影響其他機構，可針對受測 半導體7G件提供準確之溫度變化致因，並可簡易地應用至 各類型測試機台’應為最佳解決方案。 【發明内容】 因此，本發明之一目的在提供一種給予受測元件加熱 /致冷環境、耗能極低、變溫範圍均勻、結構精簡且效果 確實之具變溫裝置之半導體元件測試座及測試機台。 本發明另一目的，在提供一種結構簡單、造價因而降 低的具變溫裝置之半導體元件測試座及測試機台。 本發明之再一目的，在提供一種保養維修方便、使用 可靠度隨之提升的具變溫裝置之半導體元件測試座及測 試機台。 因此，本發明所揭露具變溫裝置之半導體元件測試 座，该半導體兀件具有一個形成有複數腳位之導接面、及 一個相反於該導接面之頂面，該測試座包含：一組具有複 數對應該等腳位之接點、供電氣連接該半導體元件之連接 器 "且/、有兩個包括一個加熱面及一個致冷面之變溫 面，供相對該連接器在一個供該半導體元件置於/脫離電 氣連接該連接器之開啟位置、及以該二變溫面之一對應該 半導體兀件頂面之作用位置間移動的變溫裝置；及一組供 7 201001581 面迫 抵推該變溫農置、使該對應該半導體元件頂面之變溫 緊至該半導體元件頂面的加壓震置。 此外，本發日請述具變溫心之半導體元件測試機 台’該等受測半導體元件具有一個形成有複數腳位之導接 面、及-個相反於該導接面之頂面，該機台包含：一個基 座；複數設置於該基座之測試座，包括：一組具有複數二 應該等腳位之接點、供電氣連接該等受測半導體元件之連 接器；-組具有兩個包括—個加熱面及—個致冷面之變溫 面’供相對該連接器在-個供該等受測半導體元件置於/ 脫離電氣連接該連接器之開啟位置、及以該二變溫面之— 對應該半導體元件頂面之作用位置間移動的變溫裝置；及 一組供抵推該變溫裝置、使該對應該半導體元件頂面之變 溫面迫緊至該等受測半導體元件頂面的加壓裝置；一組供 應該等受測半導體元件至該等測試座、並自該等測試座移 除該等受測半導體元件之供入/移出裝置；—組分類” 來自該供入/移出裝置受測半導體元件之分類裝置；及— 組用以驅動該供入/移出裝置、接受該等測試座测得資 料、並依照該等測得資料指令該分類裝置之控制裝置。 藉由將致冷晶片或其他類型之變溫裝置置放於連接 器谷置半導體it件之空間上方，並以機械臂抵壓該變溫裝 置，使對應之待測半導體元件獲致安全之預設溫度環境， …、W加/JEL /致冷，且無論機械臂、變溫裝置、及連接器名士 構都彼此獨立，並無結構複雜化之顧慮，加以變溫裴置可 知封閉之熱交換機制，更大幅降低污染受測元件之風險。 201001581 【實施方式】 、有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之較佳實施例的詳細說明中，將可清楚 的呈現。 本毛月第-貫知例如圖3所示，測試座3係應用於半 件10之制，對應半導體元件10,本發明包含連 接：32與接點322，以供安置半導體元件10並提供導通 功能，圖1切示之半導體元件10已接受加壓袭置38之 吸嘴382攜行定位於連接器32上方，準備接受檢測。 測試座3之變溫裝置34提供變溫功能，包含升溫與 降溫，在本例中，變溫裝置34包括一個本體342、以及 一片致冷晶片344,致冷晶片344具有兩個表面，分別為 加^面346與致冷面348,本例中，係以致冷面348對應 半導體το# 1〇為例，以提供例如零下十度等預設溫度環 境’當然’如需對半導體元件1〇加溫，僅需改將加熱面 346朝向半導體元件1〇即可。亦可將極性交換，使其致 冷面可成為加熱面，加熱面成為致冷面。 加壓裝置38除攜行半導體元件1〇至待測位置外，並 具提供額定下壓力之功能，一方面迫使變溫裝置34之致 冷面348與可確實導熱接觸半導體元件1〇之頂面，並使 半導體元件10導接面之各腳位確實迫緊而電氣連接至連 接器32之接腳’以進行半導體元件丨〇之檢測。 當檢測完畢後’如圖4所示’需由加壓裴置3 8之吸 嘴382再度將半導體元件1〇移出連接器位置，此時變^ 201001581 ΐ置由I將被由上述變溫面對應半導體元件頂面之作用位 直由本體342沿虛飨麻-七^ | 平面古a 料所不之枢軸方向，由原先之大致水 二方向翻轉至至少9〇。，從而移開至容許半導體元件置 於^離電氣連接連接器之開啟位置。丰^兀件置 置^然’如熟悉本技術領域者所能輕易理解，依前述位 =，本體亦可採用其他途徑在開啟位置與作用位置間 传依〜如^ 5本案第二較佳實施例所示，其中本體342’ 頭方向’水平旋轉9〇。，自虛線所示之開啟位置進 _ ★斤丁之作用位置’·或如圖6本案第三較佳實施例所201001581 IX. Description of the Invention: [Technical Field] The present invention relates to a test stand and a test machine, and more particularly to a semiconductor component test stand and a test machine having a temperature change device. [Prior Art] With the accumulation of semiconductor components, the legs of more complicated semiconductor components are hundreds of pins, so that they can be well-bonded to the pins on the circuit board or the connector. The side surface; opposite to the surface, a flat surface is formed, on the one hand, the suction nozzle is sucked and removed, and the other side is also available for pressing. For convenience of explanation, the surface provided with the plurality of foot positions is hereinafter referred to as the guide surface. The upper surface is called the top surface. Apparatus for testing such semiconductor element detection As shown in Fig. 1, a connector 12 having a plurality of contacts 122 is provided in advance to correspond one-to-one to the pin position 1〇4 of the semiconductor element 1 〇 junction surface 1〇2. The machine is provided with a robot arm 14' corresponding to the top surface iQ6 of the semiconductor component 1 to make the electrical connection between the pin 1〇4 of the semiconductor component 1 and the contact 122 of the connector u, thus becoming a signal supply. , the channel of transmission and return 'to meet the test requirements' for the detection of various types of semiconductor components ig. Of course, even if the shape of the foot illusion 04 and the point (2) in FIG. 1 are respectively a concave contact and an elastic thimble, the common various types are not limited to this, and the foot 104 and the contact 122 are also common. There is a corresponding mode of the pin and the slot. In addition, 'semiconductor components are used to perform tests to faithfully simulate future semiconductor components that may correspond to the environment. For example, computers placed in field workstations may be used in low temperature, high humidity, or high salinity areas, or aircraft navigation 5 201001581. Among them, the test is used in the environment of semiconductor components: therefore, when testing, the relevant temperature factors are also added to determine whether the semiconductor components are suitable for the expected harsh environment. In order to add the preset temperature environment of the semiconductor components to be tested, the industry has developed a different solution. The earliest choice is to directly cover the detection area and directly raise and lower the overall temperature of the cover area; however, this method may cause temperature unevenness. Phenomenon, on the other hand, the larger the environmental area that changes the temperature, the more energy is consumed and the operation is not economical. Subsequently, some manufacturers proposed to install a temperature-changing device at the bottom end of the mechanical arm to accurately control (4) the position of the temperature sound when the semiconductor component is pressed. The extension is because the mechanical arm itself must be raised and lowered, and the bottom end is sucked. The mission of moving semiconductor components, sometimes to set up a three-way floating head to absorb tolerances, to pass through the floating head at the same time, taking into account the setting of the suction device and the variable temperature skirt, which undoubtedly increases the cost of the robot arm and complicates the structure. More frequent warranty is required. Further, for example, the invention patent of US Pat. No. 6,636,062 discloses that the variable base shown in FIG. 2 has a heating/cooling group disposed therein, and the heating group 206, the heat absorber 204, and the outer gasket 212 are respectively from top to bottom. The base 202' base 202 further has a coolant inlet 214 and a coolant outlet 2丨6. It can be seen that the heating/cooling group 200 has two sets of hot/cold systems, and uses a liquid as a coolant, and a coolant inlet 214 and a coolant outlet 216. The cycle is performed, and the base of the connector is responsible for temperature change, thereby providing a predetermined temperature & environment. However, as described above, when the number of pins of the semiconductor element is hundreds, which is densely covered on the guiding surface of the semiconductor element, on the one hand, hundreds of pins are arranged in the liquid flow in the gap of the 201001581 in the connector base. In addition, it is necessary to avoid the heat conduction of many pins, especially in the heat pipe, which is required to allow heat exchange without leakage, which is undoubtedly a difficult plan. Therefore, if a structure is reduced, the energy consumption is low, the application mode is diverse, the structure of the arm is not changed, and other mechanisms are not affected, accurate temperature change causes can be provided for the 7G piece to be tested, and can be easily applied to each The type test machine 'should be the best solution. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a semiconductor component test stand and tester having a temperature change device with a heating/cooling environment, a low energy consumption, a uniform temperature range, a compact structure, and a reliable effect. station. Another object of the present invention is to provide a semiconductor component test stand and test machine having a variable temperature device which is simple in construction and low in cost. Still another object of the present invention is to provide a semiconductor component test stand and a test stand having a temperature change device which is convenient for maintenance and maintenance and which has improved reliability. Therefore, the present invention discloses a semiconductor device test stand having a temperature change device, the semiconductor device having a conductive surface formed with a plurality of pins, and a top surface opposite to the conductive surface, the test socket comprising: a set a connector having a plurality of contacts corresponding to the pins, a connector for supplying the gas to the semiconductor component, and/or two temperature-increasing surfaces including a heating surface and a cooling surface for supplying the connector to the connector a semiconductor device is placed/disengaged from an open position of the connector, and a temperature changing device that moves between one of the two temperature changing surfaces corresponding to a top surface of the semiconductor element; and a set of 7 201001581 faces The temperature is set to a temperature, and the top surface of the corresponding semiconductor element is heated to a pressure shock of the top surface of the semiconductor element. In addition, the semiconductor component testing machine with variable temperature is described on the present day. The semiconductor components to be tested have a guiding surface formed with a plurality of pins, and a top surface opposite to the guiding surface. The table comprises: a base; a plurality of test sockets disposed on the base, comprising: a set of contacts having a plurality of pins, and a connector for supplying the tested semiconductor components; the group has two a heating surface comprising a heating surface and a cooling surface for providing an opening position for the connector to be placed/disengaged from the connector, and an opening position of the connector a temperature-changing device corresponding to the movement between the action positions of the top surface of the semiconductor element; and a set of means for urging the temperature change device to urge the temperature-changing surface of the top surface of the corresponding semiconductor element to the top surface of the semiconductor element under test a pressurizing device; a supply/removal device for supplying the semiconductor elements to be tested to the test sockets and removing the semiconductor elements to be tested from the test sockets; - group classification" from the supply/removal Device tested half a sorting device for the conductor elements; and - a control device for driving the feed/removal device, receiving the test piece data, and commanding the sorting device in accordance with the measured data. By cooling the wafer or Other types of temperature change devices are placed above the space of the connector valley semiconductor device, and the variable temperature device is pressed by the mechanical arm to make the corresponding semiconductor component to be tested safe to a preset temperature environment, ..., W plus / JEL / Refrigeration, and regardless of the robot arm, temperature change device, and connector celebrity structure are independent of each other, there is no structural complexity concerns, the temperature change device can be known to the closed heat exchange system, which greatly reduces the risk of contaminating the tested components. The above-mentioned and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the present invention. As shown in FIG. 3, the test socket 3 is applied to the half piece 10, corresponding to the semiconductor component 10. The present invention comprises a connection 32 and a contact 322 for mounting the semiconductor component 10 and For the conduction function, the semiconductor component 10 shown in FIG. 1 has been subjected to the suction nozzle 382 of the pressurizing device 38 and is positioned above the connector 32 to be ready for detection. The temperature change device 34 of the test socket 3 provides a temperature change function, including temperature rise and Cooling, in this example, the temperature change device 34 includes a body 342, and a sheet of cooled wafer 344 having two surfaces, a surface 346 and a cooling surface 348, respectively, in this example, cooled The surface 348 corresponds to the semiconductor το# 1 〇 as an example to provide a predetermined temperature environment such as minus ten degrees. Of course, if the semiconductor element 1 is heated, it is only necessary to change the heating surface 346 toward the semiconductor element 1 . The polarity can also be exchanged so that the cooling surface can become the heating surface, and the heating surface becomes the cooling surface. The pressing device 38 carries the function of providing the rated down pressure in addition to carrying the semiconductor element 1 to the position to be tested. In this aspect, the cooling surface 348 of the temperature change device 34 is forced to be in thermal contact with the top surface of the semiconductor device 1 and the pins of the semiconductor device 10 are surely pressed and electrically connected to the pins of the connector 32. Semi-guided Shu square of the detecting element. When the detection is completed, as shown in FIG. 4, the semiconductor element 1 is removed from the connector position by the nozzle 382 of the pressurizing device 38, and the change of the 201001581 device is determined by the above-mentioned variable temperature surface. The action of the top surface of the semiconductor component is directly reversed by the body 342 along the pivotal direction of the virtual ramie-seven-in-one plane, from the original water direction to at least 9 〇. Thereby moving away to allow the semiconductor component to be placed in the open position of the electrical connection connector. According to the above-mentioned position =, the body can also adopt other ways to pass between the open position and the active position. For example, the second preferred embodiment of the present invention As shown, the body 342' head is rotated ' horizontally 9 turns. , from the open position shown by the dashed line, the action position of the jin ding, or the third preferred embodiment of the present invention.
Ltt 342”亦可沿水平方向平移，自虛線所示開啟位置 當 、線所不之作用位置’亦即本體之位置變換途徑非 常靈活，可供機構工程師設計應用。 再者，如圖7與圖8本案第四較佳實施例所示，為更 效率地將致冷晶片所發之熱散佈至空氣中，變溫裝置更 组熱管36’’，，在本例中，該熱管36，，，係-組兩端 封閉之中空毛細營辦^)，，，. 體362 ’毛細官體362，，’中填充有部 刀揮發性液體364’’’，毛細管體362”，與致冷晶片之發埶 面導接之-側，將吸取致冷晶片發熱面的熱量，構成一個 揮發端366’’’ ’相反地，揮發之液體將佈滿毛細管體，並 在-個遠離揮發端鳩”，之冷凝端368，，，，藉由其他例如 風扇由管體外吹拂，將揮發性液體⑽，”由氣態重新冷凝 回液癌’進行熱交換，觸毛細管而在管體中往返。 入如圖9及圓10所示’本案之測試機台$第一實施例 L 3基座4、複數測試座3、供入/移出裝置6、分類裝 201001581 置7與控制裝置8。供入/移 應受測半導體元件至複數測試座36:、=_時’供 除受測半導體元件；分類裝 、“K座3移 ^ ^ . 、置7分類來自供入/移出|罟 =測：導體元件；控制裝“則用 移 置6、接受各測試座3所 ’移出裝 分類裝置7運作。供人/移^依照測得資料指令 置放容置有複數待列丰專 進一步包括：-组供 I =數待測+導體元件之承載盤^的供料件 641= 件62沒取待測半導體元件之沒取件 數、'且供㈣取件64置放待測半導體㈣' 且分別 對應各測試座3之移動件66。 刀 之環境，本^受測試時係確實㈣溫控準確 义兄案第—實施例之機台(圖未示)更包含如圖u 所不’―組氣㈣蓋於測試座3’之遮罩92，；為預防 體元件因溫度變化產；ψ $ @ 凝露現象’更設置供應乾燥氣體 遮罩92内之供氣裝置94，。除此之外，機台之變溫装置 結構大致與前述第一實施例相仿，不再贅述。 依照上述各實施例說明，應用變溫裝置於測試座或將 測試座進-步應用至測試機台，搭配相關裝置，可提供待 =半導體溫度準確、無污染顧慮且無冷凝機會之檢測環 境，完全克服習知技術中可能發生之缺失，因此藉由本發 明確實可以有效達成本案之所有上述目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明書内$所作之簡單的等效變化與修飾，皆 11 201001581 應仍屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 . 圖1是習知半導體元件檢測之立體示意圖； 圖2是習知半導體加熱裝置之分解立體示意圖； . 圖3是本發明中測試座第一實施例之立體示意圖； 圖4疋本發明中變溫裝置第一實施例之立體示意圖； 圖5是本發明中變溫裝置第二實施例之立體示意圖； 圖6是本發明中變溫裝置第三實施例之立體示意圖； 圖7是本發明中變溫裝置第四實施例熱交換機制示意圖 圖8是本發明申變溫裝置第四實施例之立體示意圖； 圖9是本發明測試機台第一實施例之俯視圖； 圖10是本發明測試機台第一實施例之方塊圖；及 圖11是本發明第二實施例測試機台局部之立體示意圖 \ 12 201001581 【主要元件符號說明 10…半導體元件 104…腳位 12.. .連接器 14.. .機械臂 200.·.力σ熱/冷卻組 204.. .吸熱器 212.. .外密封墊 216.. .冷卻劑出 3、3 ’測試座 32.. .連接器 34.. .變溫裝置 344、344，，，·.·致冷晶片 346.. .加熱面 36’’’…熱管 364’’’...揮發性液體 368’’’...冷凝端 38…加壓裝置 4.. .基座 6.. .供入/移出裝置 622.. .承載盤 6 6...移動件 8.. .控制裝置 94’…供氣裝置 102.. .導接面 10 6...頂面 122.. .接點 202.. .底座 206.. .加熱組 214.. .冷卻劑入口 322.. .接點 342、342’、342，，…本體 348.. .致冷面 362’’’...毛細管體 366’’’…揮發端 382.. .吸嘴 5、5’...測試機台 62.. .供料件 64.. .汲取件 7.. .分類裝置 92’…遮罩 13Ltt 342" can also be translated in the horizontal direction, from the position shown by the dotted line, the position where the line does not work, that is, the position change path of the body is very flexible, which can be designed and applied by the mechanical engineers. Again, as shown in Figure 7 and 8 In the fourth preferred embodiment of the present invention, in order to more efficiently dissipate the heat generated by the cooled wafer into the air, the temperature changing device further sets the heat pipe 36", in this example, the heat pipe 36, - The hollow capillary operation closed at both ends of the group ^),,,. Body 362 'Capillary body 362,, 'filled with a knife volatility liquid 364''', capillary body 362", and the hairpin of the cryogenic wafer The side of the surface guide will absorb the heat of the heating surface of the cooled wafer to form a volatile end 366''''. Conversely, the volatilized liquid will fill the capillary body and condense at a distance away from the volatile end. The end 368,,, is blown from the outside of the tube by other means such as a fan, and the volatile liquid (10), "recondensed from the gaseous state back to the liquid cancer" for heat exchange, contacts the capillary tube and travels back and forth in the tube body. As shown in Fig. 9 and circle 10, the test machine of the present invention is the first embodiment. The L 3 base 4, the plurality of test sockets 3, the feeding/removing device 6, the sorting device 201001581, and the control device 8. Supply/receive the semiconductor component under test to the complex test block 36:, =_ when 'division of the semiconductor component to be tested; classification, "K-seat 3 shift ^ ^., set 7 classification from supply/removal|罟= Test: Conductor component; control device "uses displacement 6, accepts each test stand 3' to move out of the loading and sorting device 7 to operate. The supplier/shift ^ according to the measured data command placement has a plurality of to-be-listed further including: - group for I = number of conductors to be tested + carrier element of the carrier ^ ^ 641 = piece 62 is not taken The number of unreceived components of the semiconductor component, 'and the (four) pickup 64 placed the semiconductor to be tested (4)' and respectively correspond to the moving component 66 of each test stand 3. The environment of the knife, this ^ is subject to the test (4) temperature control accurate Yi brother case - the machine of the embodiment (not shown) also contains the figure shown in Figure u - "gas" (four) cover the cover of the test seat 3' The cover 92, in order to prevent the body element from being produced due to temperature changes; ψ $ @ condensation phenomenon is further provided to supply the air supply means 94 in the dry gas mask 92. In addition, the structure of the temperature change device of the machine is substantially similar to that of the first embodiment described above, and will not be described again. According to the above embodiments, the application of the temperature change device to the test stand or the test block is applied to the test machine in a step-by-step manner, and the related device can provide a detection environment for the semiconductor temperature to be accurate, pollution-free, and free of condensation. Overcoming the deficiencies that may occur in the prior art, all of the above objects of the present invention can be effectively achieved by the present invention. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent change and modification made in the patent application scope and the invention specification of the present invention. , all 11 201001581 should still be within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a conventional semiconductor device; Fig. 2 is an exploded perspective view of a conventional semiconductor heating device; Fig. 3 is a perspective view showing a first embodiment of the test stand of the present invention; 4 is a perspective view of a first embodiment of a temperature change device according to the present invention; FIG. 5 is a perspective view of a second embodiment of the temperature change device of the present invention; FIG. 6 is a perspective view of a third embodiment of the temperature change device of the present invention; FIG. 8 is a perspective view of a fourth embodiment of the temperature change device of the present invention; FIG. 9 is a plan view of the first embodiment of the test machine of the present invention; FIG. A block diagram of a first embodiment of a machine; and FIG. 11 is a perspective view of a portion of a test machine according to a second embodiment of the present invention. \ 12 201001581 [Main component symbol description 10: semiconductor component 104... pin 12: connector 14 .. . Robot arm 200.·. force σ heat/cooling group 204.. Heat absorber 212.. Outer gasket 216.. Coolant out 3, 3 'test seat 32.. Connector 34.. Temperature changing device 344, 34 4,,,··· Cooling wafer 346.. heating surface 36'''...heat pipe 364'''... volatile liquid 368'''...condensing end 38...pressurizing device 4... Base 6... Feeding/removing device 622.. Carrying plate 6 6... Moving member 8. Control device 94'... Air supply device 102.. Guide surface 10 6... Top surface 122.. . Contact 202.. . Base 206.. Heating group 214.. Coolant inlet 322.. Contact 342, 342', 342, ... body 348.. Cooling surface 362'' '...capillary body 366'''...volatile end 382.. suction nozzle 5, 5'... test machine 62.. feed member 64.. picking member 7.. classification device 92' ...mask 13