KR20170056187A - Interface module and apparatus for testing semiconductor devices having the same - Google Patents

Abstract

Disclosed is a semiconductor device test apparatus comprising: a test chamber which provides a space for electrically testing semiconductor devices arranged on a test tray; a test module which provides test signals for testing the semiconductor devices and tests the semiconductor devices based on output signals from the semiconductor devices; and an interface module which transmits the test signals and the output signals between a test head and the semiconductor devices. The interface module comprises: a plurality of socket boards connected to the semiconductor devices; an interface board on which the socket boards are mounted; and temperature adjustment pipes which are arranged between or on the socket boards and are provided with temperature adjusting fluid for adjusting temperatures of the socket boards.

Description

TECHNICAL FIELD [0001] The present invention relates to an interface module and an apparatus for testing semiconductor devices having the same,

Embodiments of the present invention relate to an interface module and a semiconductor device test apparatus including the same. More particularly, the present invention relates to a test head for providing test signals to semiconductor devices, an interface module for connecting the semiconductor devices, and a semiconductor device test apparatus including the same.

In general, semiconductor devices may be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above may be manufactured as a finished product through a dicing process, a bonding process, and a packaging process .

The semiconductor devices manufactured as described above can be judged as good or defective through electrical property inspection. Wherein the electrical characteristic inspection includes a plurality of transfer modules for transferring the semiconductor devices, a test module for inspecting the semiconductor devices, and an interface module for interconnecting the semiconductor devices and the test module, Device may be used.

The interface module may include an interface board disposed between the test module and a test tray accommodating the semiconductor devices, and socket boards mounted on the interface board and connected to the semiconductor devices.

The semiconductor device test apparatus includes a match plate having a plurality of pushers for pressing the semiconductor elements to connect the semiconductor elements to the socket boards and a driving unit for operating the match plate .

Meanwhile, the test process for the semiconductor devices may be classified into a high-temperature process and a low-temperature process. For example, the high-temperature process is performed at an inspection temperature of about 85 ° C to 130 ° C, Lt; RTI ID = 0.0 > 55 C < / RTI > For the high-temperature process and the low-temperature process, the match plate may be provided with thermoelectric elements for controlling the temperature of the semiconductor devices through the pushers.

On the other hand, test sockets for connection with the semiconductor devices are mounted on the socket boards, power supply elements for inspecting the semiconductor devices, and resistors, capacitors, amplifiers, Passive components can be mounted.

However, the temperature of the socket boards can be raised by the power supply elements mounted on the socket boards and the passive elements for signal conversion, thereby making it difficult to maintain the semiconductor elements at a desired inspection temperature have. In particular, in the case of a low temperature process, there is a problem that it is difficult to lower the temperature of the semiconductor elements to a target inspection temperature.

Korean Registered Patent No. 10-0671397 (January 12, 2007) Korean Registered Patent No. 10-1228207 (Feb.

Embodiments of the present invention provide an interface module capable of adjusting the temperature of socket boards connected to semiconductor devices, and a semiconductor device testing apparatus including the interface module.

According to an aspect of the present invention, there is provided an interface module including: a plurality of socket boards for transmitting inspection signals to semiconductor devices for electrically inspecting semiconductor devices housed in a test tray; And temperature control pipes provided on the interface board between the socket boards or on the socket boards and provided with a temperature controlling fluid for controlling the temperature of the socket boards.

According to embodiments of the present invention, the temperature control pipes may be disposed parallel to each other, and both side ends of the temperature control pipes may be connected to a supply pipe and a recovery pipe for supplying and recovering the temperature control fluid, respectively.

According to embodiments of the present invention, when air is used as the temperature control fluid, the temperature control pipe may include a plurality of ejection holes for ejecting the air into a space adjacent to the socket boards.

According to embodiments of the present invention, test sockets for connection with the semiconductor devices may be disposed on the socket boards.

According to embodiments of the present invention, the interface module may further include a temperature sensor for measuring a temperature of the socket boards.

According to another aspect of the present invention, there is provided a semiconductor device testing apparatus comprising: a test chamber for providing a space for electrically inspecting semiconductor devices accommodated in a test tray; And a test module for testing the semiconductor devices based on output signals from the semiconductor devices and an interface module for transferring the test signals and output signals between the test head and the semiconductor devices . The interface module may include a plurality of socket boards connected to the semiconductor devices, an interface board on which the socket boards are mounted, and a plurality of socket boards disposed on the socket boards or between the socket boards, And temperature control pipes for providing a temperature controlling fluid for controlling the temperature of the fluid.

According to embodiments of the present invention, the temperature control pipes may be disposed parallel to each other, and both side ends of the temperature control pipes may be connected to a supply pipe and a recovery pipe for supplying and recovering the temperature control fluid, respectively.

According to embodiments of the present invention, when air is used as the temperature control fluid, the temperature control pipe may include a plurality of injection holes for injecting the air into the test chamber.

According to embodiments of the present invention, the air may be ejected toward the socket boards.

According to embodiments of the present invention, test sockets for connection with the semiconductor devices may be disposed on the socket boards.

According to embodiments of the present invention, the test module may include a base board connected to the socket boards through a plurality of connectors in the test chamber.

According to embodiments of the present invention, the semiconductor device testing apparatus may further include a temperature sensor for measuring the temperature of the socket boards.

According to the embodiments of the present invention, a plurality of injection nozzles for injecting the temperature control gas into the test chamber may be disposed at edge portions of the test chamber.

According to embodiments of the present invention, the test chamber may be provided with at least one outlet for discharging the injected temperature control gas to the outside of the test chamber.

According to embodiments of the present invention, air may be used as the temperature controlling gas.

According to embodiments of the present invention, the test chamber may be provided with a match plate having a plurality of pushers for bringing the semiconductor elements into close contact with the socket boards, A plurality of holes may be provided.

In the test tray, insert assemblies accommodating the semiconductor devices may be mounted, and the insert assemblies may be provided with a plurality of holes for passing the temperature controlling gas.

According to embodiments of the present invention as described above, a test apparatus for testing electrical characteristics of semiconductor devices includes a test module for testing the semiconductor devices and an interface module for connection between the semiconductor devices and the test module. . ≪ / RTI > The interface module may include a plurality of socket boards for connection with the semiconductor devices and a plurality of temperature control pipes disposed adjacent to the socket boards to adjust the temperature of the socket boards. In addition, a temperature control gas for controlling the temperature of the socket boards may be injected into the test chamber in which the inspection of the semiconductor devices is performed.

The temperature of the socket boards can be easily adjusted to a desired level by using the temperature controlling pipes and the temperature controlling gas so that the temperature of the semiconductor devices can be easily raised or lowered to the target inspection temperature And can be kept constant at the above inspection temperature. As a result, the reliability of the electrical characteristics of the semiconductor devices can be greatly improved.

1 is a schematic block diagram illustrating an interface module and a semiconductor device test apparatus including the same according to an embodiment of the present invention.
2 is a schematic plan view for explaining the interface module shown in FIG.
3 is a schematic enlarged cross-sectional view for explaining the interface module shown in Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

In the embodiments of the present invention, when one element is described as being placed on or connected to another element, the element may be disposed or connected directly to the other element, . Alternatively, if one element is described as being placed directly on another element or connected, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used in the embodiments of the present invention is used for the purpose of describing specific embodiments only, and is not intended to be limiting of the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the regions described in the drawings, but include deviations in the shapes, and the elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements and is not intended to limit the scope of the invention.

1 is a schematic block diagram illustrating an interface module and a semiconductor device test apparatus including the same according to an embodiment of the present invention.

1, an interface module 120 according to an exemplary embodiment of the present invention and a semiconductor device testing apparatus 100 including the same may be used for electrical inspection of semiconductor devices 10 (see FIG. 3) . For example, the interface module 120 and the test apparatus 100 may provide electrical test signals to a plurality of semiconductor elements 10 housed in a test tray 20, Can be used to check the electrical performance of the semiconductor devices 10 by analyzing the output signals from the semiconductor devices 10.

The test apparatus 100 may include a test chamber 102 that provides a space for performing an electrical inspection process on the semiconductor devices 10. Although not shown, the test apparatus 100 transfers the semiconductor elements 10 from a customer tray (not shown) to a test tray 20, and transfers the test tray 20 to the inside of the test chamber 102 The test tray 20 is removed from the test chamber 102 after the inspection process is completed in the test chamber 102 and the semiconductor elements 10 accommodated in the test tray 20 are removed from the test chamber 102. Then, (Not shown) for transferring the wafer to a customer tray (not shown). A preheating chamber (not shown) for controlling the temperature of the semiconductor elements 10 in advance and a heat-generating chamber (not shown) for recovering the temperature of the semiconductor elements 10 to room temperature may be included, The test chamber 102 may be disposed between the preheating chamber and the heat-generating chamber.

The test apparatus 100 is a test system that provides test signals to the semiconductor devices 10 and tests the electrical performance of the semiconductor devices 10 based on output signals from the semiconductor devices 10 Module 110 may be included.

The test module 110 may include a test head 112 for providing the test signals and analyzing the output signals and a base board 114 disposed on the test head 112. At this time, the base board 114 may be disposed in the test chamber 102 and may be connected to the test head 112 by connecting cables or connectors.

The test apparatus 100 may include an interface module 120 for transferring the test signals and the output signals between the test head 112 and the semiconductor devices 10. [

FIG. 2 is a schematic plan view for explaining the interface module shown in FIG. 1, and FIG. 3 is a schematic enlarged cross-sectional view for explaining the interface module shown in FIG.

2 and 3, the interface module 120 includes a plurality of socket boards 122 connected to the semiconductor devices 10 to transfer the test signals and the output signals, An interface board 124 on which the boards 122 are mounted and temperature control pipes 130 provided with a temperature controlling fluid for controlling the temperature of the socket boards 122.

3, the semiconductor module 10 accommodated in the test tray 20 is mounted on the upper surface of the interface module 120 to face the interface module 120, A match plate 140 having a plurality of pushers 142 for connecting to the boards 122 may be disposed. The match plate 140 may be operated by a driving unit 144 as shown in FIG. 1 and the semiconductor elements 10 may be connected to the socket boards 122, .

The test tray 20 may be provided between the interface module 120 and the match plate 140. The test tray 20 may be provided with a plurality of insert assemblies 30 may be provided. The insert assemblies 30 may have openings for accommodating the semiconductor elements 10 and a support film (not shown in detail) for supporting the semiconductor elements 10 Not shown). The support film may be provided with guiding holes for guiding the position of the semiconductor elements 10 such that the external connection terminals of the semiconductor elements 10, for example, solder balls protrude downward .

The interface module 120 and the match plate 140 are disposed in the horizontal direction while the base board 114, the interface module 120, and the match plate 140 are disposed in the horizontal direction. However, The arrangement direction of the plate 140 can be variously changed. For example, the base board 114, the interface module 120, and the match plate 140 may be arranged in a vertical direction, and the base board 114 may be disposed above the interface module 120 And the match plate 140 may be disposed under the interface module 120. Therefore, the scope of the present invention is not limited by the arrangement direction and order of the base board 114, the interface module 120, and the match plate 140.

On the socket boards 122, test sockets 126 for connection with the semiconductor devices 10 may be disposed. Although not shown in detail, the test sockets 126 may have contact terminals for connection with external connection terminals of the semiconductor devices 10. [ For example, pogo pins may be used as the contact terminals. However, since the contact terminals can be realized in various forms, the scope of the present invention is not limited by the configuration of the contact terminals.

A power supply element for inspecting the semiconductor devices 10 and a passive element such as a resistor, a capacitor, and an amplifier for analog / digital conversion of the test signals and output signals are formed under the socket boards 122 Respectively.

The interface board 124 may have openings for exposing the socket boards 122 downwardly as shown, and the socket boards 122 are connected to the base board 114 through the openings . For example, the socket boards 122 may be electrically connected to the base board 114 by a plurality of male and female connectors 116, 128.

The temperature of the socket boards 122 may be raised by the power supply elements and passive elements and the temperature control pipes 130 may be used to control the temperature of the socket boards 122 have. For example, when performing a high-temperature process on the semiconductor elements 10, the socket boards 122 are heated so that the temperature of the semiconductor elements 10 can easily rise to the inspection temperature necessary for the high- And when the low temperature process is performed, the temperature of the semiconductor devices 10 can be easily lowered and maintained at the inspection temperature necessary for the low temperature process.

According to one embodiment of the present invention, the temperature control pipes 130 may be disposed parallel to each other as shown in FIG. 2, and both ends of the temperature control pipes 130 may be connected to the temperature control fluid To supply piping 132 and recovery piping 134 for supply and recovery. The temperature control pipes 130 are disposed on the socket boards 122 between the test socket 126 and the temperature control pipes 130 are disposed on the socket boards 122. However, And may be disposed between the socket boards 122. However, the method of arranging the temperature control pipes 130 may be variously changed, and the scope of the present invention is not limited by the arrangement of the temperature control pipes 130 as shown in the drawings.

The temperature controlling pipes 130 may be provided with a temperature controlling fluid for controlling the temperature of the socket boards 122. As the fluid for temperature control, a liquid or gaseous heat transfer medium may be used. The temperature control pipes 130 may be connected to a temperature control module 150. The temperature control module 150 may include a heater for heating the temperature control fluid and a cooler for cooling the temperature control fluid .

According to an embodiment of the present invention, air may be used as the temperature controlling fluid. In this case, though not shown, the temperature controlling pipes 130 are provided with a space adjacent to the socket boards 122, A plurality of injection holes for injecting the air into the test chamber 102 may be provided. For example, the ejection holes may eject the air sideways toward the socket boards 122. Also, although not shown, the interface module 120 may include a temperature sensor (not shown) for measuring the temperature of the socket boards 122, Can be adjusted according to the temperature of the socket boards 122 measured by the sensors. For example, the temperature sensor may be mounted on the interface board 124 and contact one of the socket boards 122, or alternatively may be mounted directly on one of the socket boards 122. Also, a non-contact temperature sensor may be used, in which case the position of the temperature sensor may be varied.

2, the test apparatus 100 may be disposed at the edge portions of the test chamber 102 to supply a temperature control gas to the test chamber 102 And may include a plurality of injection nozzles 160 for spraying. The temperature regulating gas may be used to regulate the temperature inside the test chamber 102 and may be used particularly to facilitate temperature control of the socket boards 122.

As one example, air may be used as the temperature controlling gas. In particular, when air is used as the temperature control gas, the test chamber 102 may have at least one outlet for discharging the injected temperature control gas to the outside. The pushers 142 and the insert assemblies 30 may be provided with a plurality of holes for passing the air in order to further improve the temperature control effect of the socket boards 122 by the air. have.

As described above, when air is used as the temperature controlling fluid and the temperature controlling gas, the air preferably has a dew point lower than the inspection temperature required for the low temperature processing of the semiconductor devices 10. [ This is to prevent condensation from occurring in the test chamber 102 due to the injected air. In addition, when air is used as the temperature control fluid and the temperature control gas, the injection nozzles 160 may be connected to the temperature control module 150.

Alternatively, when an inert gas such as nitrogen is used as the temperature controlling fluid and / or the temperature controlling gas, the outlet of the test chamber 102 may include a separate recovery pipe (not shown) for recovering the inert gas Can be connected.

According to the embodiments of the present invention as described above, the test apparatus 100 for testing the electrical characteristics of the semiconductor elements 10 includes a test module 110 for testing the semiconductor elements 10, And an interface module 120 for connection between the semiconductor devices 10 and the test module 110. The interface module 120 includes a plurality of socket boards 122 for connection with the semiconductor devices 10 and a plurality of socket boards 122 disposed adjacent to the socket boards 122 to control the temperature of the socket boards 122 And a plurality of temperature control pipes 130 for controlling the temperature. In addition, a temperature control gas for temperature control of the socket boards 122 may be injected into the test chamber 102 in which the inspection of the semiconductor devices 10 is performed.

The temperature of the socket boards 122 can be easily adjusted to a desired level by using the temperature controlling pipes 130 and the temperature controlling gas, The temperature can be easily raised or lowered to an inspection temperature which is higher than the inspection temperature and can be kept constant at the inspection temperature. As a result, the reliability of the inspection of the electrical characteristics of the semiconductor elements 10 can be greatly improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the following claims. It can be understood that.

10: Semiconductor device 20: Test tray
30: insert assembly 100: test device
102: test chamber 110: test module
112: test head 114: base board
120: Interface module 122: Socket board
124: interface board 126: test socket
130: Temperature control pipe 132: Supply pipe
134: return pipe 140: match plate
142: Pusher 150: Temperature control module
160: injection nozzle

Claims (17)

A plurality of socket boards for transmitting inspection signals to the semiconductor devices to electrically inspect the semiconductor elements housed in the test tray;
An interface board on which the socket boards are mounted; And
And temperature control lines disposed on the interface board between the socket boards or on the socket boards and provided with a temperature controlling fluid for controlling the temperature of the socket boards. The interface module as claimed in claim 1, wherein the temperature control pipes are disposed parallel to each other, and both end portions of the temperature control pipes are connected to a supply pipe and a recovery pipe for supplying and recovering the temperature controlling fluid, respectively. The interface module of claim 1, wherein, when air is used as the temperature control fluid, the temperature control pipe includes a plurality of ejection holes for ejecting the air into a space adjacent to the socket boards. The interface module of claim 1, wherein test sockets for connection to the semiconductor devices are disposed on the socket boards. The interface module of claim 1, further comprising a temperature sensor for measuring a temperature of the socket boards. A test chamber for providing a space for electrically inspecting the semiconductor elements housed in the test tray;
A test module for providing test signals for testing the semiconductor devices and testing the semiconductor devices based on output signals from the devices;
And an interface module for transferring the test signals and output signals between the test head and the semiconductor elements,
The interface module includes a plurality of socket boards connected to the semiconductor devices, an interface board on which the socket boards are mounted, and a plurality of socket boards disposed on the socket boards, Wherein the temperature control piping is provided with a temperature control fluid for controlling the temperature of the semiconductor device. 7. The semiconductor device test method according to claim 6, wherein the temperature control pipes are arranged in parallel with each other, and both side ends of the temperature control pipes are connected to a supply pipe and a recovery pipe for supplying and recovering the temperature controlling fluid, respectively Device. [7] The apparatus of claim 6, wherein when the air is used as the temperature control fluid, the temperature control pipe includes a plurality of injection holes for injecting the air into the test chamber. 9. The apparatus of claim 8, wherein the air is injected toward the socket boards. 7. The semiconductor device test apparatus according to claim 6, wherein test sockets for connection with the semiconductor elements are disposed on the socket boards. 7. The semiconductor device test apparatus according to claim 6, wherein the test module includes a base board connected to the socket boards through a plurality of connectors in the test chamber. 7. The semiconductor device test apparatus according to claim 6, further comprising a temperature sensor for measuring a temperature of the socket boards. 7. The apparatus of claim 6, further comprising a plurality of injection nozzles disposed at edge portions of the test chamber and spraying a temperature control gas into the test chamber. 14. The semiconductor device test apparatus according to claim 13, wherein the test chamber is provided with at least one outlet for discharging the injected temperature control gas to the outside of the test chamber. 14. The semiconductor device test apparatus according to claim 13, wherein air is used as the temperature controlling gas. 14. The apparatus of claim 13, further comprising a match plate disposed within the test chamber and having a plurality of pushers for contacting the semiconductor elements to the socket boards,
Wherein the pushers are provided with a plurality of holes for passing the temperature controlling gas. 14. The semiconductor device according to claim 13, wherein the test tray is mounted with insert assemblies accommodating the semiconductor elements,
Wherein the insert assemblies are provided with a plurality of holes for passing the temperature controlling gas.

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