KR102202079B1 - Temperature measuring device and method of calibrating temperature in test handler using the same - Google Patents

Abstract

Disclosed are a temperature measuring device and a temperature correcting method of a test handler using the same. The temperature measuring device of the present invention comprises: a jig plate having the same structure as a test tray used for an electrical test of a semiconductor package; a sensor mounting unit having the same structure as an insert assembly mounted on the test tray for accommodating the semiconductor package, and mounted on the jig plate; and a temperature sensor package having the same size as the semiconductor package, and mounted in the sensor mounting unit at the same position where the semiconductor package is accommodated in the insert assembly. The temperature sensor package is heated or cooled to a preset temperature in a state that the temperature sensor package is in close contact with an interface board using a push block of a test handler. A temperature measured by the temperature sensor package and the preset temperature are compared to correct a temperature of the test handler.

Description

Temperature measuring device and temperature calibration method of test handler using the same {TEMPERATURE MEASURING DEVICE AND METHOD OF CALIBRATING TEMPERATURE IN TEST HANDLER USING THE SAME}

Embodiments of the present invention relate to a temperature measuring device and a method of calibrating the temperature of a test handler using the same. More specifically, the present invention relates to a temperature measuring apparatus for measuring the temperature of a test handler in the same environment as the environment in which a test process of a semiconductor package is performed, and a method of calibrating the temperature of the test handler using the same.

In general, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above are converted into semiconductor packages through a dicing process, a bonding process, and a packaging process. Can be manufactured.

The semiconductor packages manufactured as described above may be determined as good or defective products through electrical characteristic inspection. For the electrical characteristic inspection, a test handler for handling the semiconductor packages and a tester for inspecting the semiconductor packages may be used.

In the case of the electrical characteristic inspection, after receiving the semiconductor packages in insert assemblies mounted on a test tray, the tester may be electrically connected to external terminals of the semiconductor packages stored in the insert assemblies, and then an inspection process may be performed. have.

The insert assemblies may have pockets in which the semiconductor packages are accommodated, and the tester may be electrically connected to the semiconductor packages through an interface board or a high-fix board. The interface board includes socket boards connected to the tester, test sockets mounted on the socket boards and electrically connecting the semiconductor packages and the socket boards, and the semiconductor with respect to the test sockets. It may include socket guides for aligning the packages.

The socket guide may have an opening so that the test socket is exposed in a direction of the test tray, and a pocket portion of the insert assembly may be inserted into the opening. The pocket of the insert assembly may accommodate the semiconductor package so that the semiconductor package is exposed in the direction of the test socket, and external terminals of the semiconductor package include the test socket while the pocket portion of the insert assembly is inserted into the opening. Can be in contact with the connection terminals of.

Meanwhile, the semiconductor packages may be heated or cooled to a preset test temperature. As an example, the test handler may include a test chamber in which the test process is performed, and an internal temperature of the test chamber may be maintained at the test temperature. That is, temperatures of the semiconductor packages and the interface board may be uniformly controlled within the test chamber.

Unlike the above, the semiconductor packages may be in close contact with the interface board by push blocks, and temperature control units for heating or cooling the semiconductor packages to the test temperature may be connected to the push blocks. That is, the temperature of the semiconductor packages may be controlled by heat transferred from the temperature control units through the push blocks. In this case, the temperature of the semiconductor packages may be controlled based on the temperature of the push blocks. However, it is very difficult to measure the temperature of the push blocks in the test environment of actual semiconductor packages, and even when the temperature of the push blocks can be measured, the temperature between the temperature of the push blocks and the temperature of the semiconductor packages heated by them is Since deviation may occur, it is very difficult to precisely control the semiconductor packages to a target test temperature.

Republic of Korea Patent Publication No. 10-1877667 (Registration date July 5, 2018) Korean Registered Patent Publication No. 10-1936348 (Registration date January 02, 2019)

Embodiments of the present invention provide a temperature measuring device capable of measuring the temperature of a test handler in an environment substantially identical to the actual test environment of semiconductor packages in order to solve the above-described problems, and to calibrate the temperature of the test handler using the same. Its purpose is to provide a method.

A temperature measuring apparatus according to an aspect of the present invention for achieving the above object includes a jig plate having the same structure as a test tray used for electrical testing of a semiconductor package, and in the test tray for storage of the semiconductor package. A temperature sensor package having the same structure as the insert assembly to be mounted, a sensor mounting portion mounted on the jig plate, and having the same size as the semiconductor package and mounted in the sensor mounting portion at the same position where the semiconductor package is accommodated in the insert assembly It may include.

According to some embodiments of the present invention, the temperature sensor package may include a sensing unit for measuring temperature and a molding unit for packaging the sensing unit using the same material as the semiconductor package.

According to some embodiments of the present invention, the sensing unit may include a resistance temperature sensor or a thermocouple sensor.

According to some embodiments of the present invention, the jig plate is disposed adjacent to an interface board for electrical testing of the semiconductor package, and the temperature sensor package is the semiconductor package to connect the semiconductor package to the interface board. It is possible to measure the temperature in a pressed state by a push block that presses.

According to some embodiments of the present invention, the temperature sensor package may have protrusions having the same structure as external terminals of the semiconductor package.

According to another aspect of the present invention for achieving the above object, a jig plate having the same structure as a test tray used for electrical testing of a semiconductor package, and an insert assembly mounted on the test tray to accommodate the semiconductor package A temperature including a sensor mounting portion having the same structure as and mounted on the jig plate, and a temperature sensor package having the same size as the semiconductor package and mounted in the sensor mounting portion at the same position as the semiconductor package is accommodated in the insert assembly A temperature calibration method for calibrating a temperature of a test handler using a measuring device, the method comprising: positioning the temperature measuring device adjacent to the interface board such that the temperature sensor package is located between a push block and an interface board. And, pressing the temperature sensor package to be in close contact with the interface board using the push block; heating or cooling the temperature sensor package to a preset temperature using a temperature control unit connected to the push block; and , Comparing the preset temperature with the temperature measured by the temperature sensor package, and calibrating the temperature of the test handler.

According to some embodiments of the present invention, the temperature control unit includes a thermoelectric element, and a driving current of the temperature control unit so that the temperature measured by the temperature sensor package reaches the preset temperature in the temperature calibration step. Can be adjusted.

According to the embodiments of the present invention as described above, the temperature sensor package may measure the temperature in an environment substantially the same as the test process of the actual semiconductor package, and based on the temperature measured by the temperature sensor package, the The temperature of the test handler can be calibrated. That is, in an actual test process, the driving current of the temperature control unit may be adjusted based on the measured temperature so that the temperature of the semiconductor package reaches a preset test temperature. Accordingly, even when a plurality of semiconductor packages are simultaneously tested, the temperature of each of the semiconductor packages can be controlled very precisely, and accordingly, the test quality of the semiconductor packages can be greatly improved.

1 is a schematic diagram illustrating a test handler for electrical testing of semiconductor devices.
FIG. 2 is a schematic diagram illustrating a state in which the components of the test handler shown in FIG. 1 are combined.
3 is a schematic diagram for explaining a temperature measuring device according to an embodiment of the present invention.
4 is a schematic cross-sectional view illustrating the temperature sensor package shown in FIG. 3.
5 is a flowchart illustrating a method of calibrating a temperature of a test handler using the temperature measuring apparatus shown in FIG. 3.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention does not have to be configured as limited to the embodiments described below, and may be embodied in various other forms. The following examples are provided to sufficiently convey the scope of the present invention to those skilled in the art, rather than provided to enable the present invention to be completely completed.

In the embodiments of the present invention, when one element is described as being disposed on or connected to another element, the element may be directly disposed on or connected to the other element, and other elements are interposed therebetween. It could be. Alternatively, if one element is described as being placed or connected directly on another element, there cannot be another element between them. Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers, and/or parts, but the above items are not limited by these terms. Won't.

The terminology used in the embodiments of the present invention is used only for the purpose of describing specific embodiments, and is not intended to limit the present invention. In addition, unless otherwise limited, all terms including technical and scientific terms have the same meaning that can be understood by those of ordinary skill in the art of the present invention. The terms, such as those defined in conventional dictionaries, will be interpreted as having a meaning consistent with their meaning in the context of the description of the related art and the present invention, and ideally or excessively external intuition unless explicitly limited. It will not be interpreted.

Embodiments of the invention are described with reference to schematic diagrams of ideal embodiments of the invention. Accordingly, changes from the shapes of the diagrams, for example changes in manufacturing methods and/or tolerances, are those that can be sufficiently anticipated. Accordingly, embodiments of the present invention are not described as limited to specific shapes of regions described as diagrams, but include variations in shapes, and elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements, nor is it intended to limit the scope of the present invention.

1 is a schematic diagram illustrating a test handler for electrical testing of semiconductor devices, and FIG. 2 is a schematic diagram illustrating a state in which components of the test handler shown in FIG. 1 are combined.

1 and 2, the test handler 100 may be used to test the electrical performance of the semiconductor package 10. Specifically, the test handler 100 may be connected to a tester (not shown) for electrical testing of the semiconductor package 10, and provides an electrical test signal to the semiconductor package 10, and the semiconductor package 10 The electrical performance of the semiconductor package 10 may be inspected by analyzing the output signal from. The test handler 100 connects the interface board 110 electrically connected to the tester and the semiconductor package 10 to the interface board 110 in order to connect the semiconductor package 10 to the interface board 110. ) And a temperature control connected to the rear of the push block 120 to heat or cool the semiconductor package 10 to a preset test temperature through the push block 120 It may include a unit 130.

Although not shown, the tester may provide signals for electrical testing of the semiconductor package 10, and the electrical performance of the semiconductor package 10 by analyzing the output signals from the semiconductor package 10 Can be checked. The tester may include a test board (not shown) for providing the test signals and receiving the output signals, and the test board may be electrically connected to the interface board 110.

The interface board 110 is mounted on the socket board 112 and the socket board 112 electrically connected to the test board, and electrically connects the semiconductor package 10 and the socket board 112 It may include a test socket 114 for the test socket 114 and a socket guide 118 for aligning the semiconductor package 10 with the test socket 114. The socket guide 118 may have an opening 118A exposing the test socket 114, and although not shown, to be fixed to the socket board 112 by a plurality of fastening bolts (not shown). I can. The test socket 114 may have connection terminals 116 for connection with the external terminals 12 of the semiconductor package 10, and between the socket board 112 and the socket guide 118 Can be placed.

The interface board 110 may be a generally well-known high-fix board, and may include a frame 119 on which the socket board 112 is mounted. As shown, although one socket board 112 is mounted on the frame 119, a plurality of socket boards 112 are provided to simultaneously perform electrical tests on a plurality of semiconductor packages 10. This may be mounted on the frame 119.

The test handler 100 includes an insert assembly 140 in which a pocket 142 for accommodating the semiconductor package 10 is formed so that the external terminals 12 of the semiconductor package 10 are exposed in the direction of the interface board 110. ), and a test tray 144 disposed adjacent to the interface board 110 for electrical testing of the semiconductor package 10 and on which the insert assembly 140 is mounted. As shown, one insert assembly 140 is mounted on the test tray 144, but a plurality of insert assemblies 140 are used to simultaneously perform electrical tests on a plurality of semiconductor packages 10. ) May be mounted on the test tray 144.

The test handler 100 is disposed adjacent to the test tray 144 and the match plate 150 on which the push block 120 is mounted, and the semiconductor package 10 by the push block 120 A driving unit (not shown) for pushing the match plate 150 to be in close contact with the interface board 110 may be included. As an example, an insulating member 152 for preventing heat transfer from the push block 120 to the match plate 150 may be mounted on the match plate 150, and the push block 120 It may be mounted on the member 152. Meanwhile, the pocket portion of the insert assembly 140 may be inserted into the opening 118A of the socket guide 118 by the driving unit, and then the semiconductor package 10 by the push block 120 May be connected to the test socket 114.

The push block 120 protrudes from the flange part 122 in the direction of the interface board 110 to press the flange part 122 connected to the temperature control unit 130 and the semiconductor package 10. It may include a pressing portion 124. As the temperature control unit 130, as an example, a thermoelectric element may be used, and although not shown, heat transfer fins for dissipating or absorbing heat are provided at the rear portion of the temperature control unit 130 or separately The heat sink can be connected. As shown, one push block 120 is mounted on the match plate 150, but a plurality of push blocks 120 are matched for an electrical test on a plurality of semiconductor packages 10 It may be mounted on the plate 150.

Further, although not shown, the test handler 100 includes a load unit that transfers a plurality of semiconductor packages 10 from a customer tray to a plurality of insert assemblies 140 mounted on the test tray 144, An unloading unit for transferring the semiconductor packages 10 on which the test process has been completed from the test tray 144 to a customer tray, and transferring the test tray 144 from the load unit to a position adjacent to the interface board 110 And a tray transfer unit that transfers the test tray 144 to the unload unit after the test process is completed, and the like.

Additionally, the test handler 100 may be configured from the insulating member 152 or the match plate 150 to the interface board 110 for alignment between the semiconductor package 10 and the test socket 114. A first alignment pin 160 extending and a second alignment pin 162 protruding from the socket guide 118 in a direction opposite to the first alignment pin 160 may be included, and the insert assembly 140 ) May be provided with a first alignment hole 170 into which the first alignment pin 160 is inserted and a second alignment hole 172 into which the second alignment pin 162 is inserted. The first alignment hole 170 and the second alignment hole 172 may be disposed coaxially, and each may have an inner diameter corresponding to the first alignment pin 160 and the second alignment pin 162. In addition, the second alignment pin 162 may be provided with an alignment groove 164 into which the end of the first alignment pin 160 is inserted. However, since the detailed configuration of the test handler 100 described above can be changed in a wide variety, the scope of the present invention will not be limited by what has been described above.

3 is a schematic diagram illustrating a temperature measuring apparatus according to an exemplary embodiment of the present invention, and FIG. 4 is a schematic cross-sectional view illustrating a temperature sensor package illustrated in FIG. 3.

3 and 4, the temperature measuring apparatus 200 according to an embodiment of the present invention may be used to measure the temperature of the test handler 100. Specifically, the temperature measuring device 200 may be used to obtain an approximation of the actual temperature of the semiconductor package 10 while a test process is performed on the semiconductor package 10 in the test handler 100. have. The temperature measuring device 200 includes a jig plate 210 having the same structure as the test tray 144 and a sensor mounting portion mounted on the jig plate 210 having the same structure as the insert assembly 140 ( 220 and the same size as the semiconductor package 10 and the temperature at which the semiconductor package 10 is mounted in the sensor mounting unit 220 at the same position as the location where the semiconductor package 10 is accommodated in the pocket 142 of the insert assembly 140 A sensor package 230 may be included. As shown, one sensor mounting part 220 and one temperature sensor package 230 are used, but the jig plate 210 has as many insert assemblies 140 mounted on the test tray 144. A plurality of sensor mounting units 220 and temperature sensor packages 230 may be mounted. In addition, differently from the above, a plurality of sensor mounting parts 220 and temperature sensor packages 230 are mounted on the jig plate 210 to correspond to some of the insert assemblies 140 mounted on the test tray 144 It could be.

The sensor mounting part 220 may have a pocket 222 having the same shape as the insert assembly 140, and the temperature sensor package 230 may have one side exposed toward the interface board 110. 222). The temperature sensor package 230 includes a sensing unit 232 for measuring temperature and a molding unit 234 for packaging the sensing unit 232 using the same material as the semiconductor package 10 as shown in FIG. 4. Can include. For example, the temperature sensor package 230 may be manufactured by a molding process of packaging the sensing unit 232 using an epoxy mold compound (EMC). In addition, as an example, a temperature resistance sensor or a thermocouple sensor may be used as the sensing unit 232. Packaging the sensing unit 232 with a material such as an epoxy mold compound as described above is to obtain a temperature value closest to the temperature of the semiconductor package 10 in the test environment of the actual semiconductor package 10.

Additionally, although not shown, the temperature measuring device 200 includes a data recorder connected to the temperature sensor package 230 and for reading and recording a value output from the temperature sensor package 230, and the data recorder. A power supply unit for supplying power, and a circuit breaker for cutting off power supply from the power supply unit when the temperature applied to the temperature sensor package 230 is out of the measurement range of the sensing unit 232 may be included. have. The temperature sensor package 230 and the data recorder may be connected to each other through wired or wireless communication, and when they are connected to each other through the wireless communication, the jig plate 210 is connected to the temperature sensor package 230 and the A wireless communication unit for transmitting and receiving signals to and from the data recorder may be mounted.

To measure the temperature of the test handler 100, instead of the test tray 144, the jig plate 210 is disposed adjacent to the interface board 110, and the temperature sensor package 230 is applied to the interface board. It may be performed in a state where the temperature sensor package 230 is pressed using the push block 120 so as to be in close contact with the 110. That is, in a state in which the push block 120 and the temperature sensor package 230 are in close contact with each other, the temperature sensor package 230 may be heated or cooled to a preset temperature by the temperature control unit 130, The temperature of the temperature sensor package 230 may be measured by the sensing unit 232. According to an embodiment of the present invention, for more accurate measurement, the temperature sensor package 230 may have protrusions 236 having the same structure as the external terminals 12 of the semiconductor package 10, and the The protrusions 236 may be in close contact with the connection terminals 116 of the test socket 114 by the push block 120.

5 is a flowchart illustrating a method of calibrating a temperature of a test handler using the temperature measuring apparatus shown in FIG. 3.

Referring to FIG. 5, in step S100, the temperature measuring device 200 is attached to the interface board 110 so that the temperature sensor package 230 is positioned between the push block 120 and the interface board 110. The temperature sensor package 230 may be pressed so that the temperature sensor package 230 is in close contact with the interface board 110 using the push block 120 in step S110. Subsequently, in step S120, the temperature sensor package 230 may be heated or cooled to a preset temperature using the temperature control unit 130 connected to the push block 120. At this time, since the temperature measurement device 200 has substantially the same structure as the test tray 144 in which the semiconductor package 10 is mounted, the temperature measurement by the temperature measurement device 200 is performed by the actual semiconductor package 10. In the test process, the temperature measurement of the semiconductor package 10 may be substantially the same.

Subsequently, the temperature of the test handler 100 may be calibrated by comparing the preset temperature with the temperature measured by the temperature sensor package 230 in step S130. Specifically, the driving current of the temperature control unit 130 may be adjusted so that the temperature measured by the temperature sensor package 230 reaches the preset temperature. That is, the driving current of the temperature control unit 130 may be adjusted so that the temperature of the semiconductor package 10 reaches a preset test temperature in a test process of the actual semiconductor package 10. Meanwhile, in the above, temperature calibration using one temperature sensor package 230 is described, but when the test handler 100 includes a plurality of temperature control units 130, the temperature measurement device 200 Temperature sensor packages 230 corresponding to the temperature control units 130 may be provided, and the temperature calibration step may be performed individually for each of the temperature control units 130.

According to the embodiments of the present invention as described above, the temperature sensor package 230 may measure the temperature in an environment substantially the same as the test process of the actual semiconductor package 10, and the temperature sensor package 230 The temperature of the test handler 100 may be calibrated based on the temperature measured by. That is, the driving current of the temperature control unit 130 may be adjusted based on the measured temperature so that the temperature of the semiconductor package 10 reaches a preset test temperature in an actual test process. Therefore, even when a plurality of semiconductor packages 10 are simultaneously tested, the temperature of each of the semiconductor packages 10 can be controlled very precisely, and accordingly, the test quality of the semiconductor packages 10 is greatly improved. Can be.

Although the above has been described with reference to the preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention described in the following claims. You will understand that there is.

10: semiconductor package 12: external terminal
100: semiconductor package test device 110: interface board
112: socket board 114: test socket
116: connection terminal 118: socket guide
119: frame 120: push block
122: flange portion 124: pressing portion
130: temperature control unit 140: insert assembly
142: pocket 144: test tray
150: match plate 152: heat insulating member
200: temperature measuring device 210: jig plate
220: sensor mounting portion 222: pocket
230: temperature sensor package 232: sensing unit
234: molding part 236: protrusion

Claims (9)

A jig plate having the same structure as a test tray used for electrical testing of a semiconductor package;
A sensor mounting portion having the same structure as the insert assembly mounted on the test tray for receiving the semiconductor package and mounted on the jig plate;
A temperature sensor package having the same size as the semiconductor package, mounted in the sensor mounting unit at the same position as the semiconductor package is accommodated in the insert assembly, and including a sensing unit for measuring temperature;
A data recorder connected to the temperature sensor package and for reading and recording a value output from the temperature sensor package;
A power supply unit for supplying power to the data recorder; And
And a circuit breaker configured to cut off the power supply from the power supply when the temperature applied to the temperature sensor package exceeds the measurement range of the sensing unit. The temperature measuring apparatus of claim 1, wherein the temperature sensor package further comprises a molding part for packaging the sensing part with the same material as the semiconductor package. The temperature measuring apparatus of claim 2, wherein the sensing unit comprises a resistance temperature sensor or a thermocouple sensor. The method of claim 1, wherein the jig plate is disposed adjacent to an interface board for electrical testing of the semiconductor package, and the temperature sensor package pushes the semiconductor package to connect the semiconductor package to the interface board. It measures the temperature in the state pressed by the block,
The push block is mounted on a match plate disposed adjacent to the jig plate, and a heat insulating member is disposed between the push block and the match plate to prevent heat transfer. The temperature measuring apparatus of claim 1, wherein the temperature sensor package has protrusions having the same structure as external terminals of the semiconductor package. A jig plate having the same structure as a test tray used for electrical testing of a semiconductor package, and a sensor mounting portion mounted on the jig plate having the same structure as an insert assembly mounted on the test tray for storage of the semiconductor package; , A temperature sensor package having the same size as the semiconductor package, mounted in the sensor mounting part at the same position as the position in which the semiconductor package is received in the insert assembly, and including a sensing part for measuring temperature, and connected to the temperature sensor package A data recorder for reading and recording a value output from a temperature sensor package, a power supply for supplying power to the data recorder, and from the power supply when the temperature applied to the temperature sensor package is outside the measurement range of the sensing unit. In the temperature calibration method for calibrating the temperature of the test handler using a temperature measuring device including a circuit breaker for cutting off the power supply of,
Positioning the jig plate adjacent to the interface board so that the temperature sensor package is positioned between the push block and the interface board;
Pressing the temperature sensor package to be in close contact with the interface board using the push block;
Heating or cooling the temperature sensor package to a preset temperature by using a temperature control unit connected to the push block; And
And calibrating the temperature of the test handler by comparing the preset temperature with the temperature measured by the temperature sensor package. The method of claim 6, wherein the temperature control unit comprises a thermoelectric element,
In the temperature calibration step, the temperature calibration method, characterized in that controlling the driving current of the temperature control unit so that the temperature measured by the temperature sensor package reaches the preset temperature. The method of claim 6, wherein the temperature sensor package further comprises a molding part for packaging the sensing part with the same material as the semiconductor package. The method of claim 6, wherein the temperature sensor package has protrusions having the same structure as external terminals of the semiconductor package.

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