KR20070070769A - Test socket apparatus for semiconductor package - Google Patents

Abstract

A test socket device of a semiconductor package is provided to directly transfer heat to the semiconductor package, to reduce heat loss, and to easily control temperature by using a hot plate and a temperature sensor unit to test the temperature characteristic of the CLCC(Ceramic Leaded Chip Carrier) type CIS(Complementary Metal Oxide Semiconductor Image sensor) semiconductor package. A test socket device(100) of a semiconductor package(10) is composed of a socket lower part(130) installed on a test circuit board to load the semiconductor package; a socket upper part(110) combined or separated correspondingly to the socket lower part to electrically connect the loaded semiconductor package, the socket lower part, and the test circuit board in testing the semiconductor package; a hot plate(112) installed at the socket upper part to control temperature of the semiconductor package; and a temperature sensor unit installed at the socket upper part to detect the temperature of the semiconductor package.

Description

TEST SOCKET APPARATUS FOR SEMICONDUCTOR PACKAGE}

1 is a perspective view schematically showing the configuration of a test socket device according to the present invention;

2 is a cross-sectional view of the test socket device shown in FIG. 1;

3 is a front view showing a coupling state for testing a semiconductor package of the test socket device shown in FIG.

4 is a plan view of the top of the socket shown in FIG. 1; And

5 is a plan view of the bottom of the socket shown in FIG.

Explanation of symbols on the main parts of the drawings

10 semiconductor device 12 pad

20: test circuit board 100: test socket device

110: upper socket 112: heat transfer plate

114: contact part 116: temperature sensor part

118: power connection portion 120: fastening member

122: pogo pin 124: spring

130: lower socket 132: chip fixing part

134: pogo pin

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing facility, and more particularly to a test socket device capable of temperature control for testing an image sensor module of a CLCC (Ceramic Leaded Chip Carrier) package type.

Typically, test equipment uses test sockets mounted on test circuit boards to test semiconductor packages. The test socket electrically connects the test circuit board and the terminals of the semiconductor package to test various characteristics of the semiconductor package.

For example, a test socket for testing a semiconductor package, for example, a CMOS leaded chip carrier (CLSS) type CMOS image sensor (CIS) module, uses a ceramic material. However, it is not easy to control the temperature because ceramic materials are difficult to raise or lower to the desired temperature.

For example, when testing the influence of the temperature of the semiconductor package by raising the temperature of the test socket itself, test result data similar to the case of raising the temperature of the actual semiconductor package may be obtained. However, as described above, since the test socket is made of a ceramic material, it is not easy to change the temperature due to the characteristics of the ceramic material. In addition, when raising the test socket to a high temperature, the test circuit board (PCB) provided under the test socket is required to withstand high temperatures. Therefore, when the temperature durability is degraded at the bonding portion between the test circuit board and the test socket, a problem arises in that the entire test circuit board needs to be replaced.

In general, the CLCC type CIS semiconductor package can be tested only at room temperature, and thus, a sample in a semiconductor package state returned and judged as defective by a customer cannot be tested by temperature. Therefore, the test was performed under room temperature conditions by changing various other variables for temperature.

In order to test the temperature effects on different types and types of semiconductor packages, other types of thermostats are used. For example, a method of transferring heat to a semiconductor package by supplying hot air such as a dryer. However, the CIS family uses direct heat transfer because it is not well suited for coagulation.

Other product families now have test equipment for hot testing. However, since CIS is an image product, an illuminator is used, and since the light emitter acts as a source, the test environment with other products is different. In the test environment of other products, after loading the semiconductor package into the test socket, the upper part of the semiconductor package is opened, while the upper part of the CIS is blocked, and the test socket is also made of ceramic, which is not easy for heat transfer.

In addition, the test method for the current temperature can calculate the test data for a certain temperature only in the wafer state. In order to test other characteristics, the temperature is again adjusted to test the wafer, and then the semiconductor package is assembled to verify the characteristics. This requires that at least one semiconductor package, such as the characteristics of the wafer and its semiconductor package, have to be reselected from the wafer, resulting in excessive package costs and waste of resources.

An object of the present invention is to provide a test socket device that is easy to control the temperature of a CLCC type semiconductor package.

It is another object of the present invention to provide a test socket device that facilitates temperature control when testing a CMOS image sensor module.

In order to achieve the above objects, the test socket device of the present invention is used to control the temperature by transferring heat directly to the semiconductor package, in order to test the characteristics of the ceramic lead chip carrier type CMOS image sensor semiconductor package according to the temperature conversion. There is one feature. As such, the test socket device can reduce heat loss and facilitate temperature control.

The test socket device according to the present invention comprises: a lower part of a socket installed on a test circuit board and loaded with the semiconductor package; A socket upper portion coupled to and separated from the lower socket and electrically connecting the loaded semiconductor package to the lower socket and the test circuit board during the semiconductor package test; A heat transfer plate provided on the socket to control the temperature of the semiconductor package; It is provided on the socket and includes a temperature sensor unit for sensing the temperature of the semiconductor package.

In one embodiment, the upper portion of the socket further includes a power supply for supplying power to the heat transfer plate.

In another embodiment, the semiconductor package is a CMOS image sensor, it is provided with a ceramic material.

In another embodiment, the temperature sensor unit includes a sensor for measuring the temperature of the semiconductor package, and variable resistors for adjusting the temperature of the heat transfer plate from a plurality of the measured temperatures.

In another embodiment, the heat transfer plate directly transmits heat to the semiconductor package to adjust the temperature of the semiconductor package.

The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be interpreted as being limited by the embodiments described below. These examples are provided to more fully explain the present invention to those skilled in the art. Therefore, the shape of the components in the drawings, etc. have been exaggerated to emphasize a more clear description.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. 1 to 5.

1 and 2 are diagrams showing the configuration of a test socket device according to the present invention.

1 and 2, the test socket device 100 is divided into a socket upper part 110 and a socket lower part 130 and is made of a ceramic material. The semiconductor package 10 is inserted between the upper socket 110 and the lower socket 130 to be fixedly loaded in the lower socket 130, and the upper socket 110, the semiconductor package 10, and the lower socket 130 are fixed to each other. Electrically connected.

The semiconductor package 10 is, for example, a CMOS image sensor, and is formed of a ceramic material in the form of a ceramic leaded chip carrier (CLCC).

As shown in FIG. 3 of the test fixture (not shown), the socket bottom 130 is installed on the test circuit board 20 of FIG. 3 and the semiconductor package 10 is loaded and fixed. That is, the lower socket 130 includes a chip fixing part 132 to fix the pad 12 of the semiconductor package 10 to face upward.

In addition, the socket upper portion 110 serves as a cover on the lower side of the socket 130, and includes fastening members 120 at both sides to be coupled to each other, and a pad (or pin) 12 of the semiconductor package 10 is disposed on the lower surface thereof. ) And a hot plate 112 for controlling the temperature of the semiconductor package 10 by generating and transferring heat to the contact portion 114 is in contact with the semiconductor package 10 loaded in the lower socket 130. do.

Accordingly, the socket top 110 electrically connects the semiconductor package 10, the socket bottom 130, and the test circuit board 20 through the contacts 114. In addition, as shown in FIG. 2, the socket top 110 is equipped with a spring 124 having a pogo pin shape on the heat transfer plate 112 to electrically connect with the socket bottom 130 and the semiconductor package 10. Increases adhesion with

Referring to FIG. 3, in the test socket device 100 of the present invention, when the semiconductor package 10 is mounted on the lower socket 130, the test circuit board 20 and the lower socket 130 are electrically connected to each other. The package 10 and the socket top 110 are electrically connected. In addition, the contact portion 114 to which the semiconductor package 10 and the upper socket 110 are connected is connected to the pogo pins 124 connected to the lower socket 130. Therefore, the temperature of the semiconductor package 10 loaded in the test socket device 100 is adjusted by using the heat transfer plate 112 of the upper socket 110 to process the test according to the temperature change.

Specifically, the upper socket 130 is connected to the lower socket 130 and the test circuit board 20 through a contact portion 114 having a plurality of pogo pins 124 formed in a rectangular shape. The heat transfer plate 112 is located inside the rectangle. In addition, the heat transfer plate 112 is connected to a spring 124 material such as a pogo pin in order to improve adhesion with the CLCC type CIS semiconductor package 10.

4 is a plan view of the upper part of the socket shown in FIG. 1, and FIG. 5 is a plan view of the lower part of the socket shown in FIG.

Referring to FIG. 4, the socket upper part 110 is provided at one side of an upper surface thereof, and includes a temperature sensor part 116 detecting a temperature of the test socket device 100, and a power supply part supplying a power voltage to the heat transfer plate 112. 118).

The test socket device 100 includes a power supply unit 118 for supplying power to adjust the temperature of the heat exchanger plate 112. The power supply unit 118 uses an internal power source, for example, an internal power source and an upper power source unit. There is a button (or switch) to select the channel to be connected. Therefore, the inconvenience caused by using the power when using the test socket device 100 from the outside has been eliminated.

In addition, it is easy to measure and set a constant temperature by electrically connecting the heat transfer plate 112 and the temperature sensor unit 116. As a result, accurate data can be obtained through the temperature sensor unit 116.

The temperature sensor unit 116 includes, for example, a temperature measuring sensor and a plurality of variable resistors. The temperature of the semiconductor package 10 is accurately measured through a temperature measuring sensor, and the temperature of the semiconductor package 10 is changed by adjusting the temperature of the heat transfer plate 112 through a plurality of variable resistors.

In addition, the power supply unit 118 is for supplying power to the heat transfer plate using an internal power source, and maintains constant temperature so as to prevent the uniformity of heat applied to the heat transfer plate 112 by the internal power supply. Here, the temperature control is appropriate for a temperature range from room temperature to less than about 150 ° C., for example, a suitable temperature that the test circuit board 20 can withstand. However, the temperature where the test socket device 100 and the test circuit board 20 is not in contact with each other can be independently.

5, the lower socket 130 includes a plurality of pogo pins electrically connected to the chip fixing part 132 on which the semiconductor package 10 is loaded and fixed, and the contact part 114 of the upper socket part 110. 134 and a plurality of holes are provided at the edge portion for installation in the test circuit board (20 in FIG. 3).

As described above, the test socket device 100 of the present invention can test and review characteristics related to temperature that could not be tested in a semiconductor package state without waste of wafers and in a short time. For example, a wafer test takes about 3 minutes to raise the temperature by about 5 ° C. However, it takes more than twice as much time to get off, which is a great physical and time loss. In running the test, the loss of temperature setting on the test fixture can be compensated for, resulting in a lot of accurate test data in a short time.

In particular, it is easy to test the impact on temperature, another factor in tests that require light sources. In this regard, a heat transfer plate may be used to more efficiently utilize a semiconductor package, for example, a semiconductor package in a CLCC type package, and calculate accurate test data thereof.

As described above, the test socket device of the present invention includes a heat transfer plate and a temperature sensor to test the characteristics of the CLCC type CIS semiconductor package with respect to temperature, thereby enabling direct heat transfer to the semiconductor package and reducing heat loss. It is easy to control the temperature.

In addition, if the test is performed by adjusting the temperature to a specific temperature using the heat transfer plate of the test socket device, the result data according to the exact test can be calculated.

In addition, by controlling the temperature exclusively in the semiconductor package without controlling the temperature of the entire test socket device, it is easy to test for temperature changes and does not affect other devices in contact.

In addition, the test socket device of the present invention can test the influence on the temperature which is currently impossible in the semiconductor package test, and can test in the semiconductor package state rather than the wafer state. In addition, by analyzing the data according to more temperature changes for the defective semiconductor package, it is possible to prepare a way to overcome the defective source.

Claims (6)

In the test socket device of the semiconductor package: A socket lower part installed on a test circuit board and to which the semiconductor package is loaded; A socket upper portion coupled to and separated from the lower socket and electrically connecting the loaded semiconductor package to the lower socket and the test circuit board during the semiconductor package test; A heat transfer plate provided on the socket to control the temperature of the semiconductor package; And a temperature sensor unit disposed on the socket to sense a temperature of the semiconductor package. The method of claim 1, The socket upper part further comprises a power supply for supplying power to the heat transfer plate. The method of claim 1, And the semiconductor package is a CMOS image sensor. The method according to claim 1 or 3, The semiconductor package is a test socket device, characterized in that the type provided with a ceramic material. The method of claim 1, The temperature sensor unit comprises a sensor for measuring the temperature of the semiconductor package, and a variable resistor for adjusting the temperature of the heat transfer plate from a plurality of the measured temperature. The method according to claim 1 or 5, And the heat transfer plate directly transfers heat to the semiconductor package to adjust the temperature of the semiconductor package.

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