KR20170056188A - Test module and apparatus for testing semiconductor devices having the same - Google Patents

Abstract

Disclosed is a semiconductor device test apparatus comprising: a test chamber which provides a space for electrically testing semiconductor devices placed in a test tray; a test head which provides test signals for testing the semiconductor devices and tests the semiconductor devices based on output signals from the semiconductor devices; a plurality of socket boards which are arranged in the test chamber and transmit the test signals and the output signals between the test head and the semiconductor devices; and a plurality of spraying nozzles which spray gas for temperature adjustment toward the socket boards to adjust the temperatures of the socket boards.

Description

Technical Field [0001] The present invention relates to a test module and a semiconductor device test apparatus including the test module.

Embodiments of the present invention relate to a test module and a semiconductor device test apparatus including the test module. More particularly, the present invention relates to a test module for providing inspection signals to semiconductor devices and inspecting the semiconductor devices based on output signals from the semiconductor devices, and a semiconductor device test apparatus including the same.

In general, semiconductor devices may be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above may be manufactured as a finished product through a dicing process, a bonding process, and a packaging process .

The semiconductor devices manufactured as described above can be judged as good or defective through electrical property inspection. The electrical characteristic test may be performed by a semiconductor device test apparatus including a plurality of transfer modules for transferring the semiconductor devices and a test module for inspecting the semiconductor devices. The test module may include a test head and an interface board, and the interface board may be used for connection with the semiconductor devices. Socket boards for connecting between the test head and the semiconductor devices may be mounted on the interface board.

The semiconductor device test apparatus includes a match plate having a plurality of pushers for pressing the semiconductor elements to connect the semiconductor elements to the socket boards and a driving unit for operating the match plate .

Meanwhile, the test process for the semiconductor devices may be classified into a high-temperature process and a low-temperature process. For example, the high-temperature process is performed at an inspection temperature of about 85 ° C to 130 ° C, Lt; RTI ID = 0.0 > 55 C < / RTI > For the high-temperature process and the low-temperature process, the match plate may be provided with thermoelectric elements for controlling the temperature of the semiconductor devices through the pushers.

On the other hand, test sockets for connection with the semiconductor devices are mounted on the socket boards, power supply elements for inspecting the semiconductor devices, and resistors, capacitors, amplifiers, Passive components can be mounted.

However, the temperature of the socket boards can be raised by the power supply elements mounted on the socket boards and the passive elements for signal conversion, thereby making it difficult to maintain the semiconductor elements at a desired inspection temperature have. In particular, in the case of a low temperature process, there is a problem that it is difficult to lower the temperature of the semiconductor elements to a target inspection temperature.

Korean Registered Patent No. 10-0671397 (January 12, 2007) Korean Registered Patent No. 10-1228207 (Feb.

Embodiments of the present invention provide a test module capable of adjusting the temperature of socket boards connected to semiconductor devices, and a semiconductor device testing apparatus including the same.

According to an aspect of the present invention, there is provided a test module for providing inspection signals for electrically inspecting semiconductor devices housed in a test tray, and for providing inspection signals based on output signals from the semiconductor devices, A test head for inspecting the semiconductor elements; a plurality of socket boards for transferring the test signals and output signals between the test head and the semiconductor elements; And a plurality of injection nozzles for spraying the temperature control gas.

According to embodiments of the present invention, the test module may further include an interface board on which the socket boards are mounted.

According to embodiments of the present invention, the test module further includes a base board disposed between the test head and the socket boards, wherein the spray nozzles are mounted on the base board, The control gas can be injected.

According to embodiments of the present invention, air may be used as the temperature controlling gas.

According to embodiments of the present invention, test sockets for connection with the semiconductor devices may be disposed on the socket boards.

According to embodiments of the present invention, the test module may further include a temperature sensor for measuring the temperature of the socket boards.

According to another aspect of the present invention, there is provided a semiconductor device testing apparatus comprising: a test chamber for providing a space for electrically inspecting semiconductor devices accommodated in a test tray; A test head disposed within the test chamber for delivering the test signals and the output signals between the test head and the semiconductor elements and for testing the semiconductor elements based on output signals from the semiconductor elements; A plurality of socket boards and a plurality of spray nozzles for spraying a temperature control gas toward the socket boards to adjust the temperature of the socket boards.

According to embodiments of the present invention, the semiconductor device testing apparatus may further include an interface board on which the socket boards are mounted.

According to embodiments of the present invention, the semiconductor device testing apparatus further includes a base board disposed in the test chamber and connected to the socket boards through a plurality of connectors, wherein the spray nozzles are mounted on the base board And the temperature control gas may be injected to the rear surface of the socket boards.

According to embodiments of the present invention, air may be used as the temperature controlling gas.

According to embodiments of the present invention, test sockets for connection with the semiconductor devices may be disposed on the socket boards.

According to embodiments of the present invention, the semiconductor device testing apparatus may further include a temperature sensor for measuring the temperature of the socket boards.

According to embodiments of the present invention, the semiconductor device testing apparatus may further include a plurality of second injection nozzles disposed at edge portions of the test chamber and injecting a second temperature control gas into the test chamber .

According to embodiments of the present invention, the test chamber may be provided with at least one outlet for discharging the injected temperature control gas and the second temperature control gas to the outside of the test chamber.

According to the embodiments of the present invention, air may be used as the second temperature control gas.

According to embodiments of the present invention, a match plate having a plurality of pushers for closely contacting the semiconductor devices with the socket boards is disposed in the test chamber, and the pusher is provided with a second temperature control gas A plurality of holes may be provided.

According to embodiments of the present invention, the test tray is equipped with insert assemblies accommodating the semiconductor devices, and the insert assemblies may include a plurality of holes for passing the second temperature controlling gas.

According to embodiments of the present invention as described above, a test apparatus for testing electrical characteristics of semiconductor elements may include a test module for testing the semiconductor elements. The test module includes a test head for providing test signals to the semiconductor devices and analyzing output signals from the semiconductor devices, a base board disposed on the test head, and socket boards for connection with the semiconductor devices . Particularly, the base board may be provided with a plurality of spray nozzles for spraying the temperature control gas to the socket boards to control the temperature of the socket boards. In addition, a second temperature control gas for controlling the temperature of the socket boards may be injected into the test chamber in which the semiconductor devices are inspected.

As described above, the temperature of the socket boards can be easily adjusted to a desired level by using the temperature controlling gas and the second temperature controlling gas, thereby easily raising or lowering the temperature of the semiconductor elements to the target inspection temperature And can be kept constant at the above inspection temperature. As a result, the reliability of the electrical characteristics of the semiconductor devices can be greatly improved.

1 is a schematic block diagram illustrating a test module and a semiconductor device test apparatus including the test module according to an embodiment of the present invention.
2 is a schematic plan view for explaining the interface board and the socket boards shown in FIG.
3 is a schematic enlarged cross-sectional view for explaining the test module shown in FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

In the embodiments of the present invention, when one element is described as being placed on or connected to another element, the element may be disposed or connected directly to the other element, . Alternatively, if one element is described as being placed directly on another element or connected, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used in the embodiments of the present invention is used for the purpose of describing specific embodiments only, and is not intended to be limiting of the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the regions described in the drawings, but include deviations in the shapes, and the elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements and is not intended to limit the scope of the invention.

1 is a schematic block diagram illustrating a test module and a semiconductor device test apparatus including the test module according to an embodiment of the present invention.

1, a test module 110 and a semiconductor device test apparatus 100 including the test module 110 according to an embodiment of the present invention can be used for electrical inspection of semiconductor devices 10 (see FIG. 3) . For example, the test module 110 and the test apparatus 100 may provide electrical test signals to a plurality of semiconductor devices 10 housed in a test tray 20, Can be used to check the electrical performance of the semiconductor devices 10 by analyzing the output signals from the semiconductor devices 10.

The test apparatus 100 may include a test chamber 102 that provides a space for performing an electrical inspection process on the semiconductor devices 10. Although not shown, the test apparatus 100 transfers the semiconductor elements 10 from a customer tray (not shown) to a test tray 20, and transfers the test tray 20 to the inside of the test chamber 102 The test tray 20 is removed from the test chamber 102 after the inspection process is completed in the test chamber 102 and the semiconductor elements 10 accommodated in the test tray 20 are removed from the test chamber 102. Then, (Not shown) for transferring the wafer to a customer tray (not shown). A preheating chamber (not shown) for controlling the temperature of the semiconductor elements 10 in advance and a heat-generating chamber (not shown) for recovering the temperature of the semiconductor elements 10 to room temperature may be included, The test chamber 102 may be disposed between the preheating chamber and the heat-generating chamber.

The test module 110 may provide test signals to the semiconductor devices 10 and may examine the electrical performance of the semiconductor devices 10 based on output signals from the semiconductor devices 10. [ have.

The test module 110 may include a test head 112 for providing the test signals and analyzing the output signals and a base board 114 disposed on the test head 112. At this time, the base board 114 may be disposed in the test chamber 102 and may be connected to the test head 112 by connecting cables or connectors.

An interface board 120 may be disposed on the test board 114 and the test signals and the output signals may be provided on the interface board 120 between the test head 112 and the semiconductor elements 10. [ Socket boards 122 (see FIG. 3) may be disposed for delivery.

FIG. 2 is a schematic plan view for explaining the interface board and the socket boards shown in FIG. 1, and FIG. 3 is a schematic enlarged cross-sectional view for explaining the test module shown in FIG.

2 and 3, the test apparatus 100 includes a plurality of pushers 142 for connecting the semiconductor devices 10 accommodated in the test tray 20 to the socket boards 122, And a match plate 140 provided with a plurality of match plates. The match plate 140 may be disposed to face the interface board 120 and may be operated by a driving unit 144 as shown in FIG. Specifically, the driving unit 144 may press the semiconductor elements 10 such that the semiconductor elements 10 are connected to the socket boards 122.

The test tray 20 may be provided between the interface board 120 and the match plate 140. The test tray 20 may be provided with a plurality of insert assemblies 30 may be provided. The insert assemblies 30 may have openings for accommodating the semiconductor elements 10 and a support film for supporting the semiconductor elements 10 is formed under the openings, . The support film may be provided with guiding holes for guiding the position of the semiconductor elements 10 such that the external connection terminals of the semiconductor elements 10, for example, solder balls protrude downward .

The interface board 120 and the match plate 140 are arranged in the horizontal direction while the base board 114, the interface board 120 and the match plate 140 are disposed in the horizontal direction. However, The arrangement direction of the plate 140 can be variously changed. For example, the base board 114, the interface board 120, and the match plate 140 may be arranged in a vertical direction, and the base board 114 may be disposed on the interface board 120 And the match plate 140 may be disposed under the interface board 120. Therefore, the scope of the present invention is not limited by the arrangement direction and order of the base board 114, the interface board 120, and the match plate 140.

Test sockets 124 for connection with the semiconductor devices 10 may be disposed on the socket boards 122. Although not shown in detail, the test sockets 124 may have contact terminals for connection with external connection terminals of the semiconductor devices 10. [ For example, pogo pins may be used as the contact terminals. However, since the contact terminals can be realized in various forms, the scope of the present invention is not limited by the configuration of the contact terminals.

A power supply element for inspecting the semiconductor devices 10 and a passive element such as a resistor, a capacitor, and an amplifier for analog / digital conversion of the test signals and output signals are formed under the socket boards 122 Respectively.

The interface board 120 may have openings 126 to expose the socket boards 122 downwardly as shown and the socket boards 122 may extend through the openings 126 And may be connected to the base board 114. For example, the socket boards 122 may be electrically connected to the base board 114 by a plurality of male and female connectors 116, 128.

The temperature of the socket boards 122 may be raised by the power supply elements and the passive elements. According to an embodiment of the present invention, the test module 110 may be mounted on the socket boards 122 And a plurality of injection nozzles 130 for spraying a temperature control gas toward the socket boards 122 to adjust the temperature.

For example, the injection nozzles 130 may be mounted on the base board 114 and may be formed on the rear surface of the socket boards 122 exposed through the openings 126, The temperature control gas can be injected to the lower surface of the socket boards 122 on which the passive elements are mounted.

The temperature controlling gas may heat the socket boards 122 when the high temperature process is performed on the semiconductor devices 10 so that the temperature of the semiconductor devices 10 can be easily adjusted to the inspection temperature necessary for the high temperature process And when the low temperature process is performed, the temperature of the semiconductor devices 10 can be easily lowered and maintained at the inspection temperature necessary for the low temperature process.

The injection nozzles 130 may be connected to the temperature control module 150 through a temperature control pipe 152. The temperature control module 150 may include a heater for heating the temperature control gas, And a cooler for cooling.

According to an embodiment of the present invention, air may be used as the temperature controlling gas. In this case, although not shown, at least one outlet (not shown) for discharging the air to the outside is provided in the test chamber 102 . Also, although not shown, the test module 110 may include a temperature sensor (not shown) for measuring the temperature of the socket boards 122, Can be adjusted according to the temperature of the socket boards 122 measured by the sensors. For example, the temperature sensor may be mounted on the interface board 120 and contact one of the socket boards 122, or alternatively may be mounted directly on one of the socket boards 122. Also, a non-contact temperature sensor may be used, in which case the position of the temperature sensor may be varied.

2, the test apparatus 100 may be disposed at the edge portions of the test chamber 102 to control the temperature of the test chamber 102 in the test chamber 102. For example, And a plurality of second injection nozzles 160 for injecting a gas. The second temperature control gas may be used to regulate the temperature inside the test chamber 102, and may be used particularly to further facilitate temperature control of the socket boards 122.

The second temperature control gas may be the same gas as the temperature control gas. In this case, the second injection nozzles 160 may be connected to the temperature control module 150. As one example, air may be used as the second temperature control gas. In order to further improve the temperature control effect of the socket boards 122 by the second temperature control gas, the pushers 142 and the insert assemblies 30 are provided with a plurality of holes (Not shown) may be provided.

If air is used as the temperature control gas and the second temperature control gas as described above, the air preferably has a dew point lower than the inspection temperature required for the low temperature process of the semiconductor devices 10. [ This is to prevent condensation from occurring in the test chamber 102 due to the injected air.

Alternatively, if an inert gas such as nitrogen is used as the temperature control gas and / or the second temperature control gas, the outlet of the test chamber 102 may be connected to a separate recovery pipe for recovering the inert gas. have.

According to embodiments of the present invention as described above, the test apparatus 100 for testing the electrical characteristics of the semiconductor elements 10 includes a test module 110 for testing the semiconductor elements 10 can do. The test module 110 includes a test head 112 that provides test signals to the semiconductor devices 10 and analyzes the output signals from the semiconductor devices 10, A base board 114 and socket boards 122 for connection with the semiconductor elements 10. [ Particularly, the base board 114 may be provided with a plurality of injection nozzles 130 for spraying the temperature control gas to the socket boards 122 to adjust the temperature of the socket boards 122. In addition, a second temperature control gas for controlling the temperature of the socket boards 122 may be injected into the test chamber 102 where the inspection of the semiconductor devices 10 is performed.

The temperature of the socket boards 122 can be easily adjusted to a desired level by using the temperature control gas and the second temperature control gas, It can be easily raised or lowered to a temperature and can be kept constant at the above inspection temperature. As a result, the reliability of the inspection of the electrical characteristics of the semiconductor elements 10 can be greatly improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the following claims. It can be understood that.

10: Semiconductor device 20: Test tray
30: insert assembly 100: test device
102: test chamber 110: test module
112: test head 114: base board
120: Interface board 122: Socket board
124: test socket 126: opening
130: jet nozzle 140: match plate
142: Pusher 150: Temperature control module
160: Second injection nozzle

Claims (17)

A test head for providing inspection signals to electrically inspect the semiconductor elements contained in the test tray and inspecting the semiconductor elements based on output signals from the semiconductor elements;
A plurality of socket boards for transmitting the test signals and output signals between the test head and the semiconductor elements; And
And a plurality of injection nozzles for spraying a temperature control gas toward the socket boards to adjust the temperature of the socket boards. The test module of claim 1, further comprising an interface board on which the socket boards are mounted. The apparatus of claim 1, further comprising: a base board disposed between the test head and the socket boards, wherein the spray nozzles are mounted on the base board and inject the temperature controlling gas onto a rear surface of the socket boards Test module. The test module according to claim 1, wherein air is used as the temperature control gas. The test module of claim 1, wherein test sockets for connection to the semiconductor devices are disposed on the socket boards. The test module of claim 1, further comprising a temperature sensor for measuring a temperature of the socket boards. A test chamber for providing a space for electrically inspecting the semiconductor elements housed in the test tray;
A test head for providing inspection signals for inspecting the semiconductor elements and inspecting the semiconductor elements based on output signals from the semiconductor elements;
A plurality of socket boards disposed in the test chamber and delivering the test signals and output signals between the test head and the semiconductor elements; And
And a plurality of injection nozzles for spraying a temperature control gas toward the socket boards to adjust the temperature of the socket boards. The semiconductor device test apparatus according to claim 7, further comprising an interface board on which the socket boards are mounted. [8] The apparatus of claim 7, further comprising: a base board disposed in the test chamber and connected to the socket boards through a plurality of connectors, the spray nozzles being mounted on the base board, And the gas is injected into the chamber. 8. The semiconductor device test apparatus according to claim 7, wherein air is used as the temperature controlling gas. 8. The semiconductor device test apparatus according to claim 7, wherein test sockets for connection with the semiconductor devices are disposed on the socket boards. 8. The semiconductor device test apparatus according to claim 7, further comprising a temperature sensor for measuring a temperature of the socket boards. 8. The apparatus of claim 7, further comprising a plurality of second injection nozzles disposed at edge portions of the test chamber and injecting a second temperature control gas into the test chamber. 14. The apparatus of claim 13, wherein the test chamber is provided with at least one outlet for discharging the injected temperature control gas and the second temperature control gas to the outside of the test chamber. 14. The semiconductor device test apparatus according to claim 13, wherein air is used as the second temperature control gas. 14. The apparatus of claim 13, further comprising a match plate disposed within the test chamber and having a plurality of pushers for contacting the semiconductor elements to the socket boards,
Wherein the pushers are provided with a plurality of holes for passing the second temperature controlling gas. 14. The semiconductor device according to claim 13, wherein the test tray is mounted with insert assemblies accommodating the semiconductor elements,
Wherein the insert assemblies are provided with a plurality of holes for passing the second temperature control gas.

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