TW201809704A - Electronic component conveying device and electronic component inspection device - Google Patents

Abstract

The invention provides an electronic component conveying device for alignment of electronic components with a simple mechanism and an electronic component inspection device. The electronic component conveying device (10) includes a movable base portion, namely a support portion (47); a maintaining portion, namely an absorbing portion (49), capable of being movably configured relative to the base portion and capable of maintaining the electronic component on a first surface of the electronic component, namely an IC device (9); and abutting portions, namely clamping portions (61, 62), capable of being movably configured relative to the base portion and capable of being abutted against a second surface, different from the first surface, of the electronic component, wherein when the abutting portions move on the maintaining portion relative to the base portion in the first direction, the electronic part is pressed in the second direction different from the first direction.

Description

Electronic component transfer device and electronic component inspection device

The invention relates to an electronic component conveying device and an electronic component inspection device.

There have been known electronic component inspection devices that inspect the electrical characteristics of electronic components such as IC devices. The electronic component inspection apparatus generally includes an inspection unit for inspecting an IC device, and an electronic part transfer device including a transport unit for transporting the IC device to the inspection unit. Such an electronic component inspection device requires an alignment mechanism such as centering of the IC device in order to accurately contact the external terminals of the finely arranged IC devices with the measurement terminals of the inspection unit. As an example of such an IC device alignment mechanism, for example, Patent Document 1 discloses a positioning chuck device that adsorbs an IC device to a suction nozzle (suction portion) and operates by an expansion member that is driven by a piston. The moving claw member presses the four side faces of the IC device at a right angle, and is held while being positioned (centered). [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 5-48299

[Problems to be Solved by the Invention] However, for example, the previous alignment mechanism disclosed in Patent Document 1 requires positioning of the IC device (electronic part) in addition to holding the adsorption source of the IC device (electronic part). A driving source of a (centering) mechanism such as a piston. In other words, in order to position (center) an IC device (electronic component), a complicated mechanism has to be used. In the formation of IC devices (electronic parts), when cutting is performed with a dicing groove (groove portion) as a starting point, there are, for example, protruding burrs (portions protruding outward) on the side of the IC device (electronic part) ) Or particles (concave portions on the inner side), etc., and the external shape collapses, it is difficult to position (center) the IC device (electronic part) due to the external shape collapse. [Technical Means for Solving the Problem] The present invention has been made to solve at least a part of the problems described above, and can be implemented as the following forms or application examples. [Application Example 1] The electronic component transfer device of this application example is characterized by including: a base portion; a holding portion that is movably disposed relative to the base portion, and can hold the electronic component on the first side of the electronic component; and a contact portion It is movably arranged relative to the base, and can be abutted on a second surface of the electronic component that is different from the first surface; and the abutting portion can be moved in the first direction relative to the base in the holding portion. At this time, the electronic component is pushed in a second direction different from the first direction. According to the electronic component conveying device of this application example, when the holding portion is moved in the first direction relative to the base portion, the abutting portion presses the electronic component in a second direction different from the first direction, so that a simple mechanism can be used easily Positioning (centering) of electronic parts. [Application Example 2] In the electronic component transfer device according to the application example described above, it is preferable that the electronic component is held by the holding portion by suction. According to this application example, the suction force of electronic parts can be easily changed. Thereby, the position of the held electronic component can be easily moved by the pressing of the abutting portion, and positioning (centering) can be easily performed. [Application Example 3] In the electronic component transfer device of the above application example, it is preferable that the adsorption of the electronic component and the movement of the holding portion with respect to the base portion are performed by the same suction source. According to this application example, since the movement of the suction and holding portion of the electronic component relative to the base portion is performed by the same suction source, the suction and holding can be performed by a simpler mechanism. [Application Example 4] In the electronic component transfer device of the application example described above, it is preferable that the abutting portion is rotatably disposed with respect to the base portion. According to this application example, by allowing the abutting portion to rotate relative to the base portion, the electronic component can be pushed in the second direction by a simple mechanism. [Application Example 5] In the electronic component transporting device of the application example, it is preferable that the abutting portion abuts the holding portion and rotates in conjunction with the movement of the holding portion. According to this application example, since the movement of the holding portion in the first direction can be used as a driving source of the rotation of the abutting portion, the movement of the holding portion and the rotation of the abutting portion can be easily linked by a simple mechanism. [Application Example 6] In the electronic component conveying device of the application example described above, preferably, the second direction is a direction orthogonal to the first direction. According to this application example, since the electronic component is pushed from a direction orthogonal to the held surface of the electronic component, the positioning (centering) of the electronic component can be performed accurately. [Application Example 7] In the electronic component conveying device of the above application example, it is preferable that the abutment portion is provided with a plurality of abutment portions, and the first abutment portion and the second abutment portion of the plurality of abutment portions are arranged. The electronic components are pushed in the first moving direction in opposite directions to the electronic components. According to this application example, since the plurality of abutment portions push the electronic components in mutually opposite directions along the first moving direction, the positioning (centering) of the electronic components can be performed easily and accurately. [Application Example 8] In the electronic component transfer device according to the above application example, it is preferable that the first contact portion and the second contact portion can move by the same amount of movement, respectively. According to this application example, the positioning (centering) of the electronic component can be accurately performed by the abutting portions having the same movement amounts. [Application Example 9] The electronic component transfer device of the application example preferably includes a third contact portion and a fourth contact portion; and the third contact portion and the fourth contact portion are orthogonal to the first contact portion. The second moving direction of the first moving direction moves in opposite directions to push the electronic component. According to this application example, the plurality of abutment portions can abut and push the electronic parts by movement from two orthogonal directions (the first movement direction and the second movement direction), so that it can be performed easily and more accurately. Positioning (centering) of electronic parts. [Application Example 10] In the electronic component transfer device of the application example described above, it is preferable that the third contact portion and the fourth contact portion can move by the same amount of movement, respectively. According to this application example, the positioning (centering) of the electronic component can be accurately performed by the third abutment portion and the fourth abutment portion having the same amount of movement. [Application Example 11] In the electronic component transfer device of the application example described above, it is preferable that the abutting portion includes an adjusting portion that can change a contact position with the electronic component. According to this application example, since the abutting position of the abutting portion and the electronic component can be set finely by the adjusting portion, the positioning (centering) of the electronic component can be performed more finely. [Application Example 12] The electronic component inspection device of this application example includes a holding portion that is movably disposed toward the base portion and can hold the above-mentioned electronic component by the first surface of the electronic component; and an abutting portion that is capable of It is arranged to move relative to the base, and can be in contact with a second surface of the electronic component that is different from the first surface; an electronic component mounting portion that can mount the electronic component; and an inspection portion that inspects the electronic component And the abutting portion is configured to press the electronic component in a second direction different from the first direction when the holding portion moves in the first direction relative to the base portion. According to the electronic component inspection device of this application example, it is possible to provide an electronic component inspection device that can easily and accurately perform positioning (centering) of electronic components by using a simple mechanism. [Application Example 13] The electronic component transfer device of this application example is capable of transporting electronic parts cut along a groove portion having a wall surface, and is characterized in that it includes a component placement section that abuts on the first surface of the electronic component and can The electronic component is arranged; and the abutting portion is movably arranged relative to the component arranging portion and can abut on the second surface of the electronic component which intersects the first surface of the electronic component; and The second surface includes the wall surface, and the abutting portion is in contact with the wall surface. According to the electronic component transporting device of this application example, the abutting portion abuts on the first surface and the electronic component arranged in abutment with the component disposing portion is cut (divided) along the groove portion of the second surface crossing the first surface. The wall surface of the groove part of the electronic component can be used for positioning (for example, centering) of the electronic component. Since the wall surface of the groove part of the electronic component can be formed by, for example, a cutting device, the position accuracy of the electronic component is high, and there is no burr (the portion protruding outward) or particles (the portion recessed inside), etc. And become a flat state. Therefore, the positioning (centering) of the electronic component can be easily performed by a simple mechanism in which the contact portion abuts against the wall surface (second surface) of the groove portion of the electronic component. [Application Example 14] In the electronic component transporting device of Application Example 13, it is preferable that the component disposing section includes: a holding section that holds the electronic component and is movable; and a placing section that is capable of facing upright The electronic component can be placed in the second direction intersecting the second surface, and the electronic component can be placed thereon; and the abutting portion can press the electronic component by the relative movement of the holding portion and the placing portion. According to the electronic component transfer device of this application example, the abutting portion presses the electronic component by the relative movement of the holding portion and the placing portion. In this way, the position of the electronic component that is movably held can be moved by a simple mechanism using the pressing of the abutting portion, and positioning (centering) can be performed easily. [Application Example 15] In the electronic component transfer device of Application Example 14, it is preferable that the abutting portion has an abutting surface, and the abutting surface can be abutted against the electronic component held by the holding portion. The wall surface is arranged on the placing portion. According to the electronic component conveying device of this application example, by making the abutting surface of the abutting portion abut the wall surface of the electronic component held by the holding portion, the electronic component can be smoothly slid along with the abutting surface and can be easily slid. Correct the slip in the rotation direction of the electronic component (tilt in plan view when the first surface is the front side). [Application Example 16] In the electronic component conveying device of Application Example 14, it is preferable that the abutting portion has an abutting surface, and the abutting surface can be made to abut the electronic part placed on the placing portion. The wall surface of the component is arranged on the holding portion. According to the electronic component conveying device of this application example, by abutting the abutting surface on the wall surface of the electronic component placed on the placement portion, the electronic component can be smoothly slid along with the abutting surface, and the electronic can be easily corrected. Sliding in the direction of rotation of the part (tilt in plan view when the first surface is the front side). [Application Example 17] In the electronic component conveying device according to any one of Application Examples 13 to 16, it is preferable that the abutting portion is provided with a plurality of contact portions so as to be at least from the second direction and orthogonal to the above. The third direction of the second direction is arranged to press the wall surface. According to the electronic component conveying device of this application example, the wall surface is pushed from the second direction and the third direction by a plurality of abutting portions, so that it is possible to easily correct the slippage in the rotation direction of the electronic component (using the first (The face is inclined when viewed from the top). [Application Example 18] According to the electronic component transporting device of any one of the above Application Examples 13 to 17, it is preferable that the electronic component is held by the holding portion or the placing portion by suction. According to the electronic component transfer device of this application example, it is possible to easily change the suction force of the electronic parts, and to obtain an appropriate suction force. Thereby, the held electronic components can be easily moved (slided) by the pressing of the abutting portion, and positioning (centering) can be easily performed. [Application Example 19] In the electronic component transporting device of Application Example 18, it is preferable that the pressing direction of the electronic component held by the holding portion or the placing portion with respect to the holding portion or the placing The frictional force of the portion is smaller than the pushing force of the abutting portion. According to the electronic component conveying device of this application example, since the friction force of the electronic component in the pushing direction is smaller (weak) than the holding portion or the placing portion compared to the pressing force of the abutting portion, The pressing of the abutting portion can easily move (slide) the electronic component, and can perform positioning (centering) of the electronic component. [Application Example 20] In the electronic component transporting device of Application Example 18 or 19 above, it is preferable that the abutting portion abuts a holding position of the holding portion or the placing portion in an arrangement direction of the abutting portion. The wall surface of the electronic component held with the specific deviation. According to the electronic component conveying device of this application example, it is possible to accurately and reliably perform positioning (centering) of the electronic component by pressing the abutting portion from the direction in which the electronic component is arranged. [Application Example 21] The electronic component inspection device of this application example can transport electronic components cut along a groove portion having a wall surface, and is characterized by including a component placement section that abuts on the first surface of the above-mentioned electronic component and is available for The aforesaid electronic components are arranged; the abutting portion is movably arranged relative to the aforesaid component arranging portion and can abut on a second surface of the electronic component which intersects with the first surface of the electronic component; and an inspection portion which Inspect the electronic component; the second surface includes the wall surface, and the abutting portion is in contact with the wall surface. According to the electronic component transporting device of this application example, the abutting portion abuts on the first surface and the electronic component arranged in abutment with the component disposing portion is cut (divided) along the groove portion of the second surface crossing the first surface. The wall surface of the groove part of the electronic component can be used for positioning (for example, centering) of the electronic component. Since the wall surface of the groove portion of the electronic component can be formed by, for example, a cutting device, the position accuracy of the electronic component is high, and there is no residue such as burrs during cutting, and the surface state of the wall surface is relatively flat. Therefore, it is possible to provide an electronic component inspection device capable of easily and accurately positioning (centering) the electronic component by a simple mechanism in which the abutting portion abuts against the wall surface (second surface) of the groove portion of the electronic component.

Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the embodiments shown in the attached drawings. In the following, for convenience of explanation, as shown in the figure, three axes that are orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. The direction parallel to the X axis is also referred to as "X direction" or "second direction", and the direction parallel to the Y axis is also referred to as "Y direction" or "third direction". The direction is also called "Z direction" or "1st direction". The directions of the arrows of the X-axis, Y-axis, and Z-axis are also referred to as positive sides (positive directions), and the directions opposite to the arrows are referred to as negative sides (negative directions). In addition, the so-called "horizontal" in the description of the present case is not limited to a complete level, as long as it does not hinder the transportation of electronic components, it also includes a state inclined slightly (for example, less than about 5 °) with respect to the level. In the following embodiments, the positive side in the Z direction on the drawing is referred to as "up" or "upper", and the negative side in the Z direction is referred to as "down" or "downward." In addition, the inspection device (electronic component inspection device) shown in the figure below is a device for inspecting / testing (hereinafter referred to as "inspection") the electrical characteristics of electronic components. The electronic components include, for example, BGA (Ball Grid Array: Ball Grid) IC devices such as LGA (Land Grid Array) packaging, or LCD (Liquid Crystal Display), OLED (Organic Electroluminescence Display), electronic paper, etc. Display devices; CIS (CMOS Image Sensor: CMOS image sensor), CCD (Charge Coupled Device: charge-coupled device), acceleration sensor, gyro sensor, pressure sensor and other sensors; further including crystal Various vibrators, etc. In the following, for convenience of explanation, a case where the above-mentioned IC device is used as an electronic component for inspection will be described as a representative, and it will be referred to as "IC device 9". <First Embodiment> First, an electronic component inspection apparatus according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 5. FIG. 1 is a schematic layout diagram showing an electronic component inspection apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic plan view showing a transfer section and an inspection section of the electronic component inspection apparatus according to the first embodiment. FIG. 3 is a cross-sectional view (vertical cross-sectional view) showing a hand unit and an inspection unit of a transport unit of the electronic component inspection apparatus. FIG. 4 is a cross-sectional view (vertical cross-sectional view) showing a pressed state of the electronic component by the hand unit shown in FIG. 3. FIG. 5 shows an example of the arrangement of the chuck portion of the hand unit, and is a plan view viewed from the position of A-A in FIG. 3. In addition, FIG. 3 and FIG. 4 show one of the several hand units of a conveyance part. As shown in FIG. 1, an inspection device 1 as an electronic component inspection device includes a supply section 2, a supply-side arrangement section 3, a conveyance section 4, an inspection section 5, a collection-side arrangement section 6, a collection section 7, and a section for performing each of these Control of the control section 8. In addition, the inspection device 1 includes a base 11 for arranging a supply unit 2, a supply-side alignment unit 3, a transport unit 4, an inspection unit 5, a collection-side alignment unit 6, and a collection unit 7; and a cover 12, which The base 11 is covered so as to accommodate the supply-side alignment unit 3, the transport unit 4, the inspection unit 5, and the collection-side alignment unit 6. In addition, the base surface 111, which is the upper surface of the base 11, is substantially horizontal, and constituent members of the supply-side alignment section 3, the conveying section 4, the inspection section 5, and the collection-side alignment section 6 are arranged on the base surface 111. This inspection device 1 is configured as follows: the supply unit 2 supplies the IC devices 9 to the supply-side array unit 3, the supplied IC devices 9 are arranged on the supply-side array unit 3, and the transport unit 4 transports the arrayed IC devices 9 to the inspection The inspection unit 5 and the inspection unit 5 inspect the IC devices 9 being transported. The transporting unit 4 transports / arranges the IC devices 9 that have been inspected at the recovery side alignment unit 6. The recovery unit 7 recovers the IC devices 9 arrayed at the recovery side alignment unit 6. According to such an inspection device 1, supply, inspection, and recovery of the IC device 9 can be performed automatically. In addition, the inspection device 1 includes a portion other than the inspection portion 5, that is, a supply portion 2, a supply-side arrangement portion 3, a conveyance portion 4, a collection-side arrangement portion 6, a collection portion 7, and a control portion 8, etc. (Electronic component transfer device) 10. The transfer device 10 performs transfer of the IC device 9 and the like. As shown in FIG. 3, the IC device 9 includes a main body portion 91 and a plurality of terminals (electrodes) 92 provided outside the main body portion 91. Each terminal 92 is electrically connected to a circuit portion inside the main body portion 91. The shape of the main body portion 91 is not particularly limited; in this embodiment, the main body portion 91 has a substantially plate shape, and when viewed from the Z direction, it has a quadrangular shape in plan view. In this embodiment, the quadrangle is a square or a rectangle. Moreover, each terminal 92 is provided in the lower part (or side part) of the main-body part 91, and is for example spherical, hemispherical, flat, etc. The configurations of the transport section 4 and the inspection section 5 are described below. ≪Transfer Section≫ The transfer section 4 constituting the electronic component transfer device is a unit that transfers the IC device 9 arranged on the mounting table 341 of the supply-side array section 3 to the inspection section 5 as shown in FIG. 2, and The IC device 9 that has completed the inspection in the inspection unit 5 is transported to the collection-side alignment unit 6. Such a transfer unit 4 includes a shuttle 41, a supply robot 42, an inspection robot 43, and a collection robot 44. -Shuttle-The shuttle 41 is used to transfer the IC device 9 on the mounting table 341 to the inspection section 5 and to further transfer the IC device 9 that has been inspected by the inspection section 5 to the collection side arrangement section 6 The shuttle nearby. In this shuttle 41, four bags 411 for accommodating the IC device 9 are formed side by side in the X direction. The shuttle 41 is guided by a linear guide, and can be reciprocated in the X direction by a drive source such as a linear motor. —Supply Robot— The supply robot 42 is a robot that transfers the IC device 9 placed on the mounting table 341 to the shuttle 41. This supply robot 42 has a support frame 421 supported by the base 11, a mobile frame 422 supported by the support frame 421 and capable of reciprocating in the Y direction with respect to the support frame 421, and four hand units supported by the mobile frame 422 ( Holding robot) 423. Each hand unit 423 includes a lifting mechanism and a suction nozzle, and can hold the IC device 9 by suction. —Inspection Robot— The inspection robot 43 is a robot that transfers the IC device 9 stored in the shuttle 41 to the inspection unit 5, and transfers the IC device 9 that has completed the inspection from the inspection unit 5 to the shuttle 41. In addition, the inspection robot 43 may press the IC device 9 against the inspection unit 5 by the suction portion 49 of the hand unit 433 during inspection to apply a specific inspection pressure to the IC device 9. This inspection robot 43 is shown in FIG. 2, and has a support frame 431 supported by the base 11, a moving frame 432 supported by the support frame 431 and capable of reciprocating in the Y direction with respect to the support frame 431, and a moving frame 432 Supported 4 hand units (holding robot) 433. The configuration of each hand unit 433 is not particularly limited, and the illustrated configuration is an example. As will be described later, each hand unit 433 includes a suction portion 49 (see FIG. 3) and the like that suction the IC device 9. —Recycling Robot— The recycling robot 44 is a robot that transfers the IC device 9 that has completed the inspection in the inspection unit 5 to the recycling-side alignment unit 6. This recovery robot 44 has a support frame 441 supported by the base 11, a mobile frame 442 supported by the support frame 441 and capable of reciprocating in the Y direction with respect to the support frame 441, and four hand units supported by the mobile frame 442 ( Holding robot) 443. Each hand unit 443 includes a lifting mechanism and a suction nozzle, and can hold the IC device 9 by suction. Such a transfer unit 4 transfers the IC device 9 as follows. First, the shuttle 41 moves to the left (negative X direction) in the figure, and the supply robot 42 transfers the IC device 9 on the mounting table 341 to the shuttle 41 (step 1). Then, the shuttle 41 moves toward the center (positive X direction), and the inspection robot 43 transfers the IC device 9 on the shuttle 41 to the inspection unit 5 (step 2). Thereafter, the inspection robot 43 transfers the IC device 9 that has completed the inspection in the inspection section 5 to the shuttle 41 (step 3). Then, the shuttle 41 moves to the right side (positive X direction) in the figure, and the collection robot 44 transfers the IC device 9 that has been inspected on the shuttle 41 to the collection-side arrangement unit 6 (step 4). By repeating such steps 1 to 4, the IC device 9 disposed on the mounting table 341 of the supply-side array section 3 can be transferred to the collection-side array section 6 through the inspection section 5. The configuration of the transfer unit 4 has been described above. As the configuration of the transfer unit 4, as long as the IC device 9 on the mounting table 341 can be transferred to the inspection unit 5, and the IC device 9 that has completed the inspection can be transferred to the recycling side. The section 6 is not particularly limited. For example, the shuttle 41 may be omitted, and any one of the supply robot 42, the inspection robot 43, and the collection robot 44 may be used to transfer from the mounting table 341 to the inspection unit 5 and from the inspection unit 5 to the collection side alignment unit 6. . ≪Inspection Section≫ The inspection section 5 is a unit (tester) for inspecting / testing the electrical characteristics of the IC device 9. As shown in FIG. 3, the inspection section 5 is used by attaching and detaching a mounting section (electronic component mounting section) 51 to a carrier board (circuit board) 54 built in the inspection section 5. The mounting portion 51 is a bag made of, for example, a resin that holds and mounts the IC device 9 and can be replaced according to the type of the IC device 9. On the upper surface of the mounting portion 51, four recessed portions 52 (refer to FIG. 2) accommodating the IC device 9, and escape grooves 525 when the chuck portions 61 and 62 described below are lowered are provided. The recessed portions 52 (see FIG. 2) can accommodate and place the IC devices 9 one by one. In addition, although the number of the formation of the recessed part 52 is four in this embodiment, it is not limited to this, It may be one, two, three, or five or more. In addition, although the arrangement of the recessed portions 52 is arranged in one row in the X direction in this embodiment, it is not limited to this, and may be arranged in a matrix form in a plurality of units in the X direction and the Y direction, respectively. One line is arranged in the Y direction. As shown in FIG. 3, each recessed portion 52 has a tapered side wall portion 523, which is convenient for the IC device 9 to enter and exit. Further, a plurality of probe pins (first conductive members) 522 that are electrically connected (contactable) to the plurality of terminals 92 of the IC device 9 are provided on the bottom 524 of the recessed portion 52. Each probe pin 522 is electrically connected to the control unit 8 through a wiring 526 provided on the carrier board 54. Each terminal 92 of the IC device 9 placed in each recess 52 is pressed by each hand pin 522 of the inspection robot 43 with a specific inspection pressure (see FIG. 4). Accordingly, each terminal 92 of the IC device 9 is electrically connected (contacted) with each probe pin 522, and the inspection of the IC device 9 is performed by the probe pin 522. The inspection of the IC device 9 is performed based on a program stored in the control unit 8. In addition, each of the probe pins 522 may be configured to freely enter and leave the bottom 524. (Control Unit) The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit performs inspection of the electrical characteristics of the IC device 9 arranged in the inspection unit 5 based on, for example, a program stored in an internal memory (not shown). The drive control unit controls, for example, the drive of each of the supply unit 2, the supply-side array unit 3, the transport unit 4, the inspection unit 5, the recovery-side array unit 6, and the recovery unit 7 to carry the IC device 9 and the like. The control unit 8 may also perform temperature control of the IC device 9. In addition, when performing the inspection of the electrical characteristics of the IC device 9, the positions of the terminals 92 of the IC device 9 and the positions of the probe pins 522 of the inspection section 5 must be accurately aligned. Placing section 51. Especially for the small-sized package or multi-pin IC device 9, the distance between the terminals 92 is very narrow, so that the distance between the probe pins 522 is also narrowed. Therefore, the terminals 92 of the IC device 9 are accurately performed. The alignment with the probe pins 522 of the inspection section 5 is more important. Needless to say, if the position of each terminal 92 and the position of each probe pin 522 deviate, the desired inspection cannot be performed, but it can be determined that the reliability of the IC device 9 that can pass such inspection is more reliable as a product. low. The configuration of the hand unit 433 having an alignment function (centering function) for preventing such a positional shift of the IC device 9 will be described below. —Hand Unit— As shown in FIGS. 3 and 4, the hand unit 433 includes an IC device 9 that can be held (see FIG. 3), and can press the IC device 9 in the holding state against the mounting portion 5 (see FIG. 4). Make up. The hand unit 433 includes a first substrate 45, a second substrate 46, a support portion 47 as a base portion, a lower end portion 48, a suction portion 49 as a holding portion, and a chuck portion as an abutting portion, which are sequentially arranged from above. 61, 62. In addition, a plurality of chuck portions 61 and 62 serving as abutment portions and functioning as positioning the IC device 9 shown in FIGS. 3 and 4 are arranged. In this embodiment, as shown in FIG. 5, chuck portions 61 and 62 are provided on both sides of the adsorption portion 49 in the X-axis direction, and two chuck portions 61 and 62 are disposed in the Y-axis direction. The chuck portions 63 and 64 on the side. In the present embodiment, four chuck sections 61, 62, 63, and 64 are shown, but the present invention is not limited to this, and the number of arrangement, the arrangement position, and the like can be appropriately changed. In this embodiment, the chuck portion 61 corresponds to the first chuck portion as the first contact portion, and the chuck portion 62 corresponds to the second chuck portion and the chuck portion 63 as the second contact portion. The third chuck section and the chuck section 64 as the third contact section correspond to the fourth chuck section as the fourth contact section. Each of the chuck sections 61, 62, 63, and 64 has the same configuration. In the following description, the chuck sections 61 and 62 are exemplified and described. The first substrate 45 functions to support the hand unit 433 and the like with respect to the moving frame 432 (see FIG. 2). The first substrate 45 has a planar upper surface and a lower surface. In addition, in the first substrate 45, a through hole 452 constituting a part of the suction flow path 430 is formed to be opened to the upper and lower surfaces, and is connected to the ejector 13 as an intake source on the upper surface side. In this way, by the action of the ejector 13, the suction flow path 430 is brought into a negative pressure state (vibration state), and the IC device 9 can be adsorbed by the adsorption portion 49. In addition, by the action of the ejector 13, the space formed by the through holes 452, 462, 463, and the like in the suction flow path 430 is in a negative pressure state (vacuum state), and the suction portion 49 can be made relative to the support portion 47. Move upward (positive Z direction). In this way, the suction of the IC device 9 and the movement of the suction portion can be performed by the same suction source (the ejector 13), and a simpler mechanism can be provided. The release of the adsorption can be achieved by vacuum destruction by the ejector 13. In this embodiment, the second substrate 46 is a plate member, and has a flat upper surface and a lower surface. In the hand unit 433, the lower surface of the first substrate 45 is in contact with the upper surface of the second substrate 46. Further, on the second substrate 46, a first through hole 463 formed by opening on the upper surface and a second through hole 462 communicating with the first through hole 463 and opening on the lower surface are formed on the upper surface side and the first through hole 462. The through hole 452 of the substrate 45 communicates. Thereby, the first through-hole 463 and the second through-hole 462 can form a part of the suction flow path 430 together with the through-hole 452. On the upper surface of the second substrate 46, a ring-shaped concave portion 464 is formed concentrically with the first through hole 463 and the second through hole 462. By inserting a ring-shaped gasket 434 into the recessed portion 464 in a compressed state, the airtightness between the first through-hole 463 and the second through-hole 462 and the through-hole 452 constituting a part of the suction flow path 430 can be maintained. . The constituent materials of the first substrate 45 and the second substrate 46 are not particularly limited; for example, various metal materials can be used. Among these, aluminum or aluminum alloy is preferably used. By using aluminum or an aluminum alloy, the weight of the hand unit 433 can be reduced. The support portion 47 serving as the base is a supporter that can move (slide) the suction portion (holding portion) 49 of the suction IC device 9 in the vertical direction. In addition, the support portion 47 is a supporter capable of rotating the chuck portions 61 and 62. In this embodiment, the support portion 47 is formed of a disc-shaped member, and a planar upper surface thereof abuts a lower surface of the second substrate 46. The support portion 47 has a structure including an inner ring 473, an outer ring 474 arranged concentrically with the inner ring 473, and a chuck support portion 472 provided in the outer ring 474. The inner cavity portion 471 of the inner ring 473 communicates with the second through hole 462 of the second substrate 46 on the upper surface side (the positive Z direction side). Thereby, the inner cavity portion 471 can constitute a part of the suction flow path 430. Moreover, a part (upper end portion 491) of the suction portion 49 is inserted into the inner cavity portion 471 from the lower surface side (negative Z direction side). Above the connecting portion of the inner ring 473 and the outer ring 474, a ring-shaped concave portion 467 formed concentrically with the inner ring 473 is formed. By inserting a ring-shaped gasket 437 into the recessed portion 467 in a compressed state, the airtightness between the inner cavity portion 471 and the first through hole 463 and the second through hole 462 can be maintained. On the other hand, a coil spring 438 that is an elastic member is disposed outside the inner ring 473 and further below the outer ring 474. The coil spring 438 is in an extended state. The upper end is connected to the outer ring 474 and the lower end is connected to the flange portion 494 of the suction portion 49. Thereby, the suction part 49 can be energized downward. The inner ring 473 is inserted into the inside of the coil spring 438. Thereby, the coil spring 438 is supported from the inside, so that it can expand and contract stably (refer to FIG. 3 and FIG. 4). The chuck support portion 472 is disposed on the outer side of the inner ring 473 and is located below the outer ring 474 further than the position where the coil spring 438 is disposed. The chuck support portion 472 is provided at a position corresponding to each of the four chuck portions 61, 62, 63, and 64. The chuck support portion 472 includes a groove portion in which each of the chuck portions 61 and 62 (63, 64) can be moved and inserted, and each of the chuck portions 61 and 62 can be rotated by a shaft 612 and 622 described later. To support. The suction section 49 as a holding section is a member that suctions the IC device 9 and presses it against the mounting section 51. The suction portion 49 is cylindrical, and its upper end portion 491 is inserted into the inner cavity portion 471 of the inner ring 473 of the support portion 47 in a state of "clearance fit" or "transition fit". Thereby, the adsorption | suction part 49 can be moved stably in an up-down direction. The suction portion 49 abuts on the upper surface (first surface) of the IC device 9 at a position at the lower end of the movement. In addition, at the position where the lower end of the suction portion 49 moves, the chuck portions 61 and 62 described later are retracted and opened. In addition, by making the suction flow path 430 into a negative pressure state (vacuum state), the suction section 49 suctions the IC device 9 on the suction surface 493 and moves toward the upper end position (in FIG. 3, the first direction indicated by arrow m1 Direction). At this time, the chuck sections 61 and 62 for positioning described later move in a direction approaching the IC device 9 (the second direction indicated by arrows m2 and m3 in FIG. 3) in conjunction with the movement of the suction section 49, and can The IC device 9 is centered by being brought into contact with the outer peripheral surface (second surface) of the IC device 9. Further, the suction unit 49 moves downward (opposite to the first direction) as the hand unit 433 descends, and presses the IC device 9 onto the placement unit 51 (see FIG. 4), and after pressing, accompanies the hand unit 433 It rises and moves upward. Then, by releasing the negative pressure state (vacuum state) of the suction flow path 430, the suction unit 49 releases the suction of the IC device 9 and moves to the position where it moves to the lower end. The positions of the moving lower end and the moving upper end of the suction portion 49 may be changed according to the type of the IC device 9, for example. One opening of the inner cavity portion 492 of the adsorption portion 49 communicates with the first through hole 463 of the second substrate 46, and the other opening communicates with the adsorption port 497 through the connection hole 496. Thereby, the inner cavity portion 492, the connection hole 496, and the suction port 497 can constitute a part of the suction flow path 430. Further, as described above, by the action of the ejector 13, the suction flow path 430 is brought into a negative pressure state (vacuum state), and the IC device 9 can be adsorbed. At this time, the suction surface 493 of the suction portion 49 and the upper surface of the main body portion 91 of the IC device 9 are in close contact with each other, and the suction flow path 430 is hermetically sealed by the close contact. Thereby, the negative pressure state of the suction flow path 430 can be maintained, and accordingly, the IC device 9 can be prevented from falling off from the suction portion 49. A flange portion 494 is formed on the outer peripheral portion of the suction portion 49 and includes a diameter-enlarged portion whose diameter is increased. The upper surface of the flange portion 494 functions as a driving surface that moves the upper and lower portions of the coil spring 438 and the end portions 614 and 624 of one of the chuck portions 61 and 62 in contact with each other. The lower surface of the flange portion 494 functions as a stopper (brake) that abuts the lower end portion 48 and stops the movement of the suction portion 49 when the suction portion 49 moves downward. On the upper end portion 491 of the suction portion 49 embedded in the inner cavity portion 471 of the inner ring 473 of the support portion 47, a ring-shaped concave portion 495 formed concentrically with the upper end portion 491 is formed. A ring-shaped gasket 439 is inserted into the recessed portion 495 in a compressed state. The pad 439 has elasticity, thereby limiting the contact area of the suction portion 49 to the inner ring 473 (inner cavity portion 471). Therefore, the sliding resistance is also reduced, and the suction portion 49 can move smoothly in the inner ring 473. In addition, with the gasket 439, the airtightness of the suction flow path 430 can be maintained even during the movement (sliding) of the suction portion 49. The chuck portions 61 and 62 (chuck portions 63 and 64) as the abutting portion have a function of performing alignment (centering) of the IC device 9 sucked by the suction portion 49. The chuck sections 61 and 62 are connected to the chuck support section 472 provided in the outer ring 474 of the support section 47 as a base via the shafts 612 and 622. The chuck sections 61 and 62 can be rotated (moved) around the shafts 612 and 622. . The chuck portions 61 and 62 have one end portions 614 and 624 on one side of the flange portion 494 of the suction portion 49 and the other end portions 613 and 623 on the opposite side with respect to the shafts 612 and 622. One end portions 614 and 624 are in contact with the upper surface of the flange portion 494, and the other end portions 613 and 623 are in contact with the outer peripheral surface (second surface) of the IC device 9. The outer peripheral surface (second surface) of the IC device 9 may also be referred to as a side surface of the IC device 9. In addition, the one end portions 614 and 624 move in conjunction with the movement of the flange portion 494 of the abutting adsorption portion 49 in the first direction. By the movement of the one end portions 614 and 624, the chuck portions 61 and 62 rotate around the shafts 612 and 622, whereby the other end portions 613 and 623 can be oriented in a second direction orthogonal to the first direction (the first direction Moving direction) (directions of arrows m2 and m3 shown in FIG. 3). Specifically, the chuck section (first chuck section) 61 and the chuck section (second chuck section) 62 are opposite to each other in a second direction (first moving direction) orthogonal to the first direction. , The outer peripheral surface (second surface) of the IC device 9 is pushed by moving with the same amount of movement. In this way, the plurality of chuck sections (the first chuck section) 61 and the chuck sections (the second chuck section) 62 move in the first moving direction and move from the opposite directions with the same amount of movement, thereby pushing the IC. Since the device 9 can be easily and accurately positioned (centered) by the IC device 9. The chuck section (third chuck section) 63 and the chuck section (fourth chuck section) 64 provided on both sides of the holding section 49 in the Y-axis direction shown in FIG. The second movement direction, in which the first movement direction is orthogonal, moves in opposite directions with the same amount of movement, and presses the outer peripheral surface (second surface) of the IC device 9. In other words, the chuck section (the third chuck section) 63 and the chuck section (the fourth chuck section) 64 can be pressed against the chuck section (the first chuck section) 61 and the chuck section (the second section). The outer peripheral surface (second surface) of the IC device 9 in the direction orthogonal to the outer peripheral surface (second surface) of the IC device 9 pushed by the chuck portion) 62. In this way, the plurality of abutment portions (chuck portions 61, 62, 63, and 64) can abut and press the IC device by moving from two orthogonal directions (the first moving direction and the second moving direction). The outer peripheral surface (second surface) of 9 enables the positioning (centering) of the IC device 9 to be performed easily and more reliably. In addition, the front end portions of the one end portions 614 and 624 abutting the upper surface of the flange portion 494 and the other end portions 613 and 623 abut the front end portions of the outer peripheral surface (second surface) of the IC device 9, preferably They are spherical or hemispherical. In particular, since the one end portions 614 and 624 are in contact with the upper surface of the flange portion 494, the end portion slides on the upper surface of the flange portion 494 and moves in the first direction. Therefore, it is preferable to reduce the frictional resistance caused by the sliding. It is spherical or hemispherical. In this way, the chuck portions 61 and 62 can rotate relative to the chuck support portion 472 provided on the outer ring 474 of the support portion 47, and the IC device 9 can be pushed in the second direction by a simple mechanism. In addition, since the movement of the flange portion 494 of the suction portion 49 in the first direction is the driving source of the rotation of the chuck portions 61 and 62, the movement of the suction portion 49 and the chuck portion can be achieved by a simple mechanism. The rotations of 61 and 62 are linked. In addition, since the upper surface (the first surface) of the IC device 9 to be held is pressed from the orthogonal direction (the second direction) to the outer peripheral surface (the second surface) of the IC device 9, it can be performed accurately and accurately. Alignment (centering) of the IC device 9. One of the end portions 614 and the other end portion 613 is connected by connecting portions 615 and 611, and a fitting hole (not shown) with the shaft 612 is provided in the connecting portion 611. In addition, the other end portion 624 and the other end portion 623 are connected by connecting portions 625 and 621, and a fitting hole (not shown) with the shaft 622 is provided in the connecting portion 621. The connecting portions 615 and 611 are configured to have an inclination with respect to the Z direction, and the center of gravity G of the chuck portion 61 is located above the shaft 612 and closer to the suction portion 49 side. Similarly, the connecting portions 625 and 621 are configured so as to have an inclination with respect to the Z direction, and the center of gravity G of the chuck portion 62 is located above the shaft 622 and closer to the suction portion 49 side. By positioning the center of gravity G in this way, one end portion 614, 624 can be brought into abutment with the flange portion 494 by using the weight of the chuck portions 61, 62, and the arrangement of the chuck portions 61, 62 can be simplified. As the chuck portions 61 and 62 move the suction portion 49 downward (opposite to the first direction), the other end portions 613 and 623 move away from the suction portion 49 (opposite to the second direction). The states of the suction part 49 and the chuck parts 61 and 62 after the movement are shown by two-dot chain lines in FIG. 3. That is, as the suction portion 49 is moved downward (opposite to the first direction), the chuck portions 61 and 62 are rotated at the other end portions 613 and 623 in the opening direction, and become a card indicated by a two-dot chain line. The state of the disc portions 61m and 62m. The suction portion 49 is located at the lower end of the movement of the suction portion 49 when the chuck portions 61 and 62 are in the opened state, and abuts on the upper surface (first surface) of the IC device 9. In addition, as the chuck portions 61 and 62 move the suction portion 49 upward (the first direction indicated by the arrow m1 in the figure), the other end portions 613 and 623 approach the suction portion 49 side (in the figure) 2nd direction indicated by arrows m2 and m3). Then, the other end portions 613 and 623 of the chuck portions 61 and 62 push the outer peripheral surface (the second surface) of the IC device 9 toward the center side and the opposite directions by the movement in the second direction. By pressing, the IC device 9 is moved, and the alignment (centering) of the IC device 9 can be performed. At this time, the suction unit 49 sucks the IC device 9 on the suction surface 493 by setting the suction flow path 430 to a negative pressure state (vacuum state). Here, the adsorption force F1 of the IC device 9 must be greater than the weight W1 of the IC device 9. In addition, the alignment (centering) of the IC device 9 is set to be corrected by moving the suction position of the suctioned IC device 9 by the pressing of the chuck portions 61 and 62, so it must be compared with the IC The adsorption force F1 of the device 9 adsorbed on the adsorption surface 493 increases the pressing force P of the chuck portions 61 and 62. That is to say, P> F1> W1 (1). In addition, the adsorption force F1 of the IC device 9 is based on the diameter through the adsorption port 497.The cross-sectional area obtained by d1 is obtained by correlating (product) the suction force of the ejector 13 as a suction source. The pushing force P of the chuck portions 61 and 62 is a moving force F2 that moves upward from the suction portion 49, and one end portion 614 and 624 and the other end portion are supported by the chuck portions 61 and 62 as the fulcrum. 613, 623 position (the principle) related decisions. The upward movement of the suction section 49 is performed at the same time as the suctioned IC device 9 is moved by the pressing of the chuck sections 61 and 62. Therefore, the moving force F2 of the suction portion 49 moving upward is set to be higher than the contact resistance (friction force) R1 of the suction portion 49 and the inner ring 473 (including the inner cavity portion 471 and the pad 439), and the spring force of the coil spring 438 The values obtained by the pressing force P of C1 and the chuck portions 61 and 62 are large. That is, it becomes a relationship of F2> R1 + C1 + P ... (2). The moving force F2 of the suction portion 49 moving upward is based on the diameter of the end surface 476 of the upper end portion 491 of the suction portion 49.The cross-sectional area obtained by d2 is obtained by the correlation (product) of the suction force of the ejector 13 as a suction source. Here, since the suction force of the ejector 13 as the suction source is the same, the diameter of the suction port 497 can be selected byd1 and the diameter of the end face 476 of the upper end portion 491 of the adsorption portion 49d2 sets the suction force F1 and the moving force F2. As shown in FIG. 4, the lower end portion 48 can be brought into contact with the placement portion 51 when the hand unit 433 presses the IC device 9 toward the placement portion 51. The lower end portion 48 is formed of a ring-shaped member and is connected to a chuck support portion 472 provided on the outer ring 474 of the support portion 47. The upper surface of the lower end portion 48 comes into contact with the flange portion 494 of the suction portion 49 and functions as a stopper (stopper) that determines a stop position on the lower side of the suction portion 49. In addition, the lower end portion 48 is located at a position different from the suction portion 49 that directly contacts the IC device 9, that is, it is arranged concentrically with the suction portion 49 so as to surround the suction portion 49. The lower surface 481 of the lower end portion 48 is the lowermost surface of a portion other than the suction portion 49 of the hand unit 433 that is in contact with the IC device 9. Therefore, the lower end portion 48 becomes the lowermost surface including the hand unit 433. The constituent materials of the support portion (base portion) 47, the lower end portion 48, and the adsorption portion (holding portion) 49 are not particularly limited; for example, various metal materials can be used. Among these, carbon steel is preferably used. Aluminum or copper, etc. Carbon steel is preferred because of its stable strength and excellent wear resistance. In addition, the person having the lower end portion 48 (hereinafter referred to as "the former") and the abutting portion of the lower end portion 48 (hereinafter referred to as the "the latter"). In the present embodiment, the former refers to the hand unit 433 of the inspection robot 43 and the latter The mounting section 51 of the inspection section 5 is not particularly limited. For example, the former may be the hand unit 423 of the supply robot 42, the latter may be the shuttle 41, the former may be the hand unit 433 of the inspection robot 43, and the latter may be the shuttle 41. The inspection device (electronic component inspection device) 1 according to the above-mentioned first embodiment includes the transfer unit 4 as an electronic component transfer device. As a result, when the suction portion 49 as the holding portion which suctions the IC device 9 as the electronic component is moved in the first direction relative to the support portion 47 as the base portion, the chuck portions 61 and 62 as the abutment portions are directed toward the first portion. The IC device 9 can be positioned (centered) by pushing the IC device 9 in a second (orthogonal) direction with different directions. In this way, the positioning (centering) of the IC device 9 can be easily performed by a simple mechanism.之 Variations of the abutting section≫ In addition, as the chuck sections 61 and 62 of the abutting section, the following modified examples can be applied. Hereinafter, modification examples of the chuck sections 61 and 62 will be described with reference to FIGS. 6 and 7. FIG. 6 is a cross-sectional view (vertical cross-sectional view) showing a first modification of the chuck portion of the hand unit 433a. Fig. 7 is a cross-sectional view (vertical cross-sectional view) showing a second modification of the chuck portion of the hand unit 433b. In addition, in the description of this modified example, a configuration different from the above-mentioned first embodiment will be described. The same components as those in the first embodiment will be denoted by the same reference numerals, and related descriptions will be omitted. (Modification 1) The chuck portions 61a and 62a as the abutment portions of the modification 1 shown in FIG. 6 are provided with the positioning (positioning of the IC device 9 adsorbed by the adsorption portion 49) similarly to the first embodiment. Heart). The chuck portions 61 a and 62 a are connected to a chuck support portion 472 provided on the outer ring 474 of the support portion 47 as a base via shafts 612 and 622 and are rotatably arranged around the shafts 612 and 622. The chuck portions 61 a and 62 a have end portions 614 and 624 which are located on the flange portion 494 side of the suction portion 49 and are the same as the first embodiment, and which are located on opposite sides to the shafts 612 and 622 and which are different from the first embodiment. The other end portion (adjustment portion) 81, 82. One end portions 614 and 624 are in contact with the upper surface of the flange portion 494, and the other end portions 81 and 82 are in contact with the outer peripheral surface (second surface) of the IC device 9. The other end portions 81 and 82 as the adjustment portion are screw members 811 and 821 having hemispherical front end portions 812 and 822, and are fixed to screw portions (threads) (not shown) provided in the connecting portions 611a and 621a. Make up. The other end portions 81 and 82 serving as the adjustment portion are arranged so as to change the contact position with the IC device 9. With the configuration of the first modification, the contact position of the other end portions 81 and 82 with the outer peripheral surface (second surface) of the IC device 9 can be finely adjusted, and the chuck portions 61a and 62a can be easily performed. Fine adjustment of the amount of press-in. Therefore, positioning (centering) of the IC device 9 can be performed more finely. (Modification 2) As in the first embodiment, the chuck portions 61b and 62b as the abutment portions of the modification 2 shown in FIG. Heart). The chuck portions 61b and 62b are connected to a chuck support portion 472 provided on the outer ring 474 of the support portion 47 as a base via shafts 612 and 622, and are arranged to be rotatable around the shafts 612 and 622. The chuck portions 61b and 62b have end portions (adjustment portions) 85 and 86 located on the flange portion 494 side of the suction portion 49 and different from the first embodiment, and on the opposite side to the shafts 612 and 622 and opposite to the first portion. 1 The other end portions 613 and 623 having the same embodiment. One end portions 85 and 86 are in contact with the upper surface of the flange portion 494, and the other end portions 613 and 623 are in contact with the outer peripheral surface (second surface) of the IC device 9. The one end portions (adjustment portions) 85 and 86 have screw members 851 and 861 having hemispherical front end portions 852 and 862 screwed in and fixed to screw portions (threads) (not shown) provided in the connection portions 615b and 625b. The end portions 85 and 86 which are one of the adjustment portions are arranged so that the contact position with the flange portion 494 can be changed. That is, the contact position between the other end portions 613 and 623 and the outer peripheral surface (second surface) of the IC device 9 can be changed (adjusted) by changing (adjusting) the contact position between the one end portions 85 and 86 and the flange portion 494. The centering position of the IC device 9 can be adjusted. With the configuration of such a modification 2, the position of the one end portion 85, 86 and the flange portion 494 can be changed (adjusted), and the other end portion 613, 623 can be finely adjusted to the IC device 9. The abutting position of the outer peripheral surface (second surface) makes it easy to finely adjust the press-in amount of the chuck portions 61b, 62b (the other end portions 613, 623). Therefore, positioning (centering) of the IC device 9 can be performed more finely. A configuration in which the chuck portions 61a and 62a of the first modification and the chuck portions 61b and 62b of the second modification are used in combination may be applied. For example, one may be the chuck portion 61a of the modification 1 and the other may be the chuck portion 62b of the modification 2, or one may be the chuck portion 61b of the modification 2 and the other One is the chuck portion 62a of the first modification. In addition, Modification 1 and Modification 2 may also be applied to other chuck portions (equivalent to the chuck shown in FIG. 5) provided in a direction orthogonal to the chuck portions 61a, 62a or 61b, 62b. The chuck section (third chuck section) 63 and the chuck section (fourth chuck section 64)). <Second Embodiment> Next, an electronic component inspection apparatus according to a second embodiment of the present invention will be described with reference to FIG. 8. FIG. 8 is a cross-sectional view (vertical cross-sectional view) showing a hand unit of a transport unit of an electronic component inspection apparatus according to a second embodiment of the present invention. Hereinafter, the second embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIG. 8. The differences from the first embodiment described above will be mainly described, and the same items will be marked the same. And its description is omitted. The inspection device (electronic component inspection device) 1c of the second embodiment has the structure and adsorption of the inspection portion 49c as a holding portion of each hand unit 433c of the inspection robot 43c, and the chuck portions 61c and 62c as the contact portions. The parts 49 and the chuck parts 61 and 62 are different from each other in the same manner as the inspection device (electronic component inspection device) 1 of the first embodiment described above. As shown in FIG. 8, the inspection device 1c of this embodiment is such that one end portions 614c, 624c of the chuck portions 61c, 62c abut against the inclined surface 498a of the flange portion 498 of the suction portion 49c, and the direction of the inclined surface 498a The chuck portions 61c and 62c are rotated in conjunction with the movement in the vertical direction. This configuration will be described in detail below. The holding portion 49c has a cylindrical shape and, similar to the first embodiment, its upper end portion 491 is fitted into the inner cavity portion 471 of the inner ring 473 of the support portion 47 in a "clearance fit" or "transition fit" state. . Thereby, the adsorption | suction part 49c can be moved stably in an up-down direction. The suction portion 49c abuts on the upper surface (first surface) of the IC device 9 at a position where the lower end of the chuck portions 61c and 62c, which will be described later, is opened. In addition, by setting the suction flow path 430 to a negative pressure state (vacuum state), the suction portion 49c sucks the IC device 9 with the suction surface 493, and moves toward the first direction at a position on the upper end of the movement. At this time, the chuck portions 61c and 62c described later move in a direction (second direction) approaching the IC device 9 in conjunction with the movement of the suction portion 49c, and can abut against the outer peripheral surface of the IC device 9 (the 2 sides) and centering of the IC device 9 is performed. The configuration related to the suction flow path 430 of the suction section 49c and the suction of the IC device 9 are the same as those of the first embodiment, and therefore descriptions thereof are omitted. A flange portion 498 is formed on the outer peripheral portion of the suction portion 49c and includes a diameter-enlarged portion whose diameter is increased. The upper surface of the flange portion 498 functions as a spring seat connected to the lower end of the coil spring 438. In addition, the outer peripheral side surface of the flange portion 498 has an inclined surface 498a that decreases in diameter as it approaches the upper side. The inclined surface 498a moves up and down as abutting one of the end portions 614c and 624c of the chuck portions 61c and 62c. The driving surface functions. The lower surface of the flange portion 498 is in contact with the lower end portion 48 when the suction portion 49c moves downward, and functions as a stopper (brake) that stops the movement of the suction portion 49c. The chuck portions 61c and 62c as the abutting portions have a function of performing alignment (centering) of the IC device 9 sucked by the suction portion 49c. The chuck portions 61c and 62c are connected to a chuck support portion 472 provided on the outer ring 474 of the support portion 47 as a base via shafts 612 and 622, and are rotatably arranged around the shafts 612 and 622. The chuck portions 61c and 62c have one end portions 614c and 624c on one side of the flange portion 498 of the suction portion 49c and the other end portions 613 and 623 on the opposite side with respect to the shafts 612 and 622. One end portions 614c and 624c are in contact with the inclined surface 498a, which is the outer peripheral side surface of the flange portion 498, and the other end portions 613, 623 are in contact with the outer peripheral surface (second surface) of the IC device 9. The outer peripheral surface (second surface) of the IC device 9 may also be referred to as a side surface of the IC device 9. In addition, the one end portions 614c and 624c move in conjunction with the movement (sliding) of the inclined surface 498a of the flange portion 498 of the abutting adsorption portion 49c in the first direction. By the movement of the one end portions 614c and 624c, the chuck portions 61c and 62c rotate around the shafts 612 and 622, whereby the other end portions 613 and 623 can be oriented in a second direction orthogonal to the first direction ( 1st moving direction). The chuck portions 61c and 62c are pressed against the inclined surface 498a by the chuck portions 61c and 62c or an energizing mechanism (for example, a coil spring or a leaf spring). Thereby, the one end portions 614c and 624c can move in accordance with the movement of the inclined surface 498a. Specifically, the chuck section (first chuck section) 61c and the chuck section (second chuck section) 62c are opposite to each other in a second direction (first moving direction) orthogonal to the first direction. , The outer peripheral surface (second surface) of the IC device 9 is pushed by moving with the same amount of movement. In this way, the plurality of chuck sections (the first chuck section) 61c and the chuck sections (the second chuck section) 62c respectively move in the first moving direction from the opposite directions by the same amount of movement, thereby pressing the IC. Since the device 9 can be easily and accurately positioned (centered) by the IC device 9. Even the structure of the second embodiment described above can be used as a counteracting force when the suction portion 49c as the holding portion constituting the conveying portion 4c as the electronic component conveying device moves in the first direction relative to the supporting portion 47 as the base portion. The chuck portions 61c and 62c of the connection portion press the IC device 9 in a second direction (orthogonal) different from the first direction to position (center) the IC device 9. In this way, the positioning (centering) of the IC device 9 can be easily performed with a simple mechanism. <Third Embodiment> Next, an electronic component inspection apparatus according to a third embodiment of the present invention will be described with reference to FIG. 9. FIG. 9 is a cross-sectional view (vertical cross-sectional view) showing a hand unit of a transport unit of an electronic component inspection apparatus according to a third embodiment of the present invention. Hereinafter, a third embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 9. The differences from the above-mentioned second embodiment will be mainly described, and the same items will be marked with the same symbols. The description is omitted. In addition, the inspection device (electronic component inspection device) 1d of the third embodiment differs from the chuck portions 61c and 62c in that the chuck portions 65 and 66 are the contact portions of the hand units 433d of the inspection robot 43d. The rest are the same as the inspection device 1c of the second embodiment. The suction portion 49c serving as a movement source of the chuck portions 65 and 66 has a cylindrical shape and has the same configuration as that of the second embodiment. Therefore, although a detailed description is omitted, a flange portion 498 formed of a diameter-enlarged portion whose diameter is enlarged is formed on the outer peripheral portion of the suction portion 49c. The upper surface of the flange portion 498 functions as a spring seat connected to the lower end of the coil spring 438. Further, the outer peripheral side surface of the flange portion 498 has an inclined surface 498a that decreases in diameter as it approaches the upper side, and this inclined surface 498a becomes a movement source of the chuck portions 65 and 66. In addition, the lower surface of the flange portion 498 abuts the lower end portion 48 when the suction portion 49c moves downward, and functions as a stopper (stopper) that stops the movement of the suction portion 49c. As shown in FIG. 9, the third embodiment is configured such that the chuck portions 65 and 66 have a so-called cross shape (wellbore shape). The chuck portions 65 and 66 have a function of performing alignment (centering) of the IC device 9 sucked by the suction portion 49c. The chuck section (first chuck section) 65 and the chuck section (second chuck section) 66 of the present embodiment abut one of the end portions 651a and 661a of the first rod members 651 and 661 which will be described later in a cross shape. The chuck section (first chuck section) 65 and the chuck section (second chuck section) of the inclined surface 498a of the flange section 498 of the suction section 49c are linked to the upward and downward movement of the inclined surface 498a. ) 66 action (open and close). Hereinafter, the chuck portions 65 and 66 of this embodiment will be described in detail. One chuck section (first chuck section) 65 includes a first rod member 651 and a second rod member 652 which are arranged in parallel to each other in the X direction; and intersects the first rod member 651 and the second rod member 652 and extends along Z. The third rod member 653 and the fourth rod member 654 are arranged in parallel with each other. The first rod member 651 is arranged so that one end portion 651a faces the inclined surface 498a of the flange portion 498 of the suction portion 49c, and the third rod member 653 and the fourth rod member 654 which can intersect with each other via the axes Q11 and Q12 Connected to each other. The second rod member 652 is disposed so that one end portion 652a faces the outer peripheral surface (second surface) of the IC device 9 adsorbed by the adsorption portion 49c, and passes through the third rod member 653 and the fourth rod member 654 which can intersect with each other. The shafts Q13 and Q14 are connected to rotate with each other. The third rod member 653 is connected to a central portion of the first rod member 651 and the second rod member 652, and is connected to a chuck support portion 472d provided on the outer ring 474d of the support portion 47d via a shaft C11, and the shaft C11 may be It is arranged to rotate in the center. The fourth rod member 654 is connected to a central portion of the first rod member 651 and the second rod member 652, and is connected to the chuck support portion 472d provided on the outer ring 474d of the support portion 47d via a shaft C12, and the shaft C12 may be It is arranged to rotate in the center. The chuck section (first chuck section) 65 configured as described above can move the second rod member 652 in a direction opposite to the moving direction of the first rod member 651. To describe in detail, for example, when the first rod member 651 is moved in the X direction, one end portion of the third rod member 653 and the fourth rod member 654 moves in the same direction via the axes Q11 and Q12. As a result, the third rod member 653 and the fourth rod member 654 rotate about the axes C11 and C12. When the third rod member 653 and the fourth rod member 654 rotate around the axes C11 and C12, the other ends of the third rod member 653 and the fourth rod member 654 are opposite to the moving direction of the first rod member 651. The direction is negative X direction movement. In association with this movement, the second rod member 652 moves in the negative X direction via the axes Q13 and Q14. In this example, the chuck section (first chuck section) 65 moves in a direction away from the IC device 9, that is, in a direction in which the chuck section (first chuck section) 65 is opened. In addition, the other chuck section (second chuck section) 66 includes a first rod member 661 and a second rod member 662 arranged in parallel to each other in the X direction, and intersects the first rod member 661 and the second rod member 662. The third rod member 663 and the fourth rod member 664 are arranged in parallel with each other in the Z direction. The first rod member 661 is arranged so that one end portion 661a and the inclined surface 498a of the flange portion 498 of the suction portion 49c face each other, and the third rod member 663 and the fourth rod member 664 which can intersect with each other via the axes Q21 and Q22 Connected to each other. The second rod member 662 is arranged so that one end portion 662a faces the outer peripheral surface (second surface) of the IC device 9 adsorbed by the adsorbing portion 49c, and passes through the third rod member 663 and the fourth rod member 664 which can intersect with each other. The shafts Q23 and Q24 are connected to rotate with each other. The third rod member 663 is connected to the central portion of the first rod member 661 and the second rod member 662, and is connected to the chuck support portion 472d provided on the outer ring 474d of the support portion 47d via a shaft C21. The shaft C21 may be The center is arranged to rotate. The fourth rod member 664 is connected to the central portion of the first rod member 661 and the second rod member 662, and is connected to the chuck support portion 472d provided on the outer ring 474d of the support portion 47d via a shaft C22, and the shaft C22 may be It is arranged to rotate in the center. The chuck section (second chuck section) 66 having such a configuration can cause the second rod member 662 to move in the same direction as the first rod member 661 by the same operation as the chuck section (first chuck section) 65 described above. Move in the opposite direction. To describe in detail, for example, if the first rod member 661 is moved in the negative X direction, one end portion of the third rod member 663 and the fourth rod member 664 moves in the same direction via the axes Q21 and Q22. As a result, the third rod member 663 and the fourth rod member 664 rotate about the axes C21 and C22. When the third rod member 663 and the fourth rod member 664 rotate around the axes C21 and C22, the other ends of the third rod member 663 and the fourth rod member 664 are opposite to the moving direction of the first rod member 661. The direction is moving in the positive X direction. In association with this movement, the second rod member 662 moves in the positive X direction via the axes Q23 and Q24. In this example, the predetermined chuck section (second chuck section) 66 is moved away from the IC device 9, that is, the direction in which the chuck section (second chuck section) 66 is opened. The chuck section (first chuck section) 65 and the chuck section (second chuck section) 66 are provided with coil springs 655 and 665 as end portions 651a and 661a of the first rod members 651 and 661. An energizing mechanism that abuts on the inclined surface 498a of the flange portion 498 of the suction portion 49c. As described above, the chuck portion (the first chuck portion) 65 and the chuck portion (the second chuck portion) 66 are flanges in which one of the end portions 651a and 661a of the first rod members 651 and 661 abuts against the suction portion 49c. The inclined surface 498a of the portion 498 moves the chuck portion (first chuck portion) 65 and the chuck portion (second chuck portion) 66 in conjunction with the upward and downward movement of the inclined surface 498a. Here, the alignment (centering) operation of the IC device 9 by the chuck sections 65 and 66 will be described. The chuck portions 65 and 66 are linked with the upward movement of the suction portion 49c (direction of arrow m1 in the figure), and one end portions 651a and 661a of the first rod members 651 and 661 move in the directions of arrows P1 and P3 . With this, the third rod members 653 and 663 and the fourth rod members 654 and 664 rotate around the axes C11 and C12 and the axes C21 and C22, respectively, and the second rod members 652 and 662 move toward the arrows P2 and P4 in the figure. Moving in the direction, the end portions 652a, 662a press the outer peripheral surface (second surface) of the IC device 9. In this way, since the plurality of chuck sections (first chuck section) 65 and the chuck sections (second chuck section) 66 are respectively moved in the first moving direction (X direction), the moving amounts are the same from the opposite directions. Since the IC device 9 is pushed, positioning (centering) of the IC device 9 can be performed easily and accurately. Even with the structure of the third embodiment described above, the suction portion 49c as the holding portion constituting the conveying portion 4 as the electronic component conveying device can be used as a counteracting force when it moves in the first direction relative to the supporting portion 47d as the base portion. The chuck portions 65 and 66 of the connection portion press the IC device 9 in a second direction (orthogonal) different from the first direction to position (center) the IC device 9. In this way, the positioning (centering) of the IC device 9 can be easily performed with a simple mechanism. <Fourth Embodiment> First, an electronic component inspection apparatus according to a fourth embodiment of the present invention will be described with reference to FIGS. 10 to 14. FIG. 10 is a layout diagram showing an outline of an electronic component inspection apparatus according to a fourth embodiment of the present invention. FIG. 11 is a schematic plan view showing a transfer section and an inspection section of the electronic component inspection apparatus according to the fourth embodiment. FIG. 12 is a cross-sectional view (vertical cross-sectional view) illustrating a hand unit and an inspection unit of a transport unit of the electronic component inspection apparatus. 13 is a cross-sectional view showing an outline (before dicing) of cutting (division) of an electronic component (IC device). FIG. 14 is a cross-sectional view showing a cut (divided) electronic component (IC device). In addition, FIG. 12 illustrates one of a plurality of hand units of the transfer unit. As shown in FIG. 10, an inspection device 1A as an electronic component inspection device includes a supply section 2, a supply-side arrangement section 3, a conveyance section 4A, an inspection section 5A, a collection-side arrangement section 6, a collection section 7, and each of these sections Control of the control section 8. In addition, the inspection device 1A includes a base 11 on which a supply unit 2, a supply-side alignment unit 3, a transport unit 4A, an inspection unit 5A, a recovery-side alignment unit 6, and a recovery unit 7 are disposed; and a cover 12 is provided. The base 11 is covered so as to accommodate the supply-side alignment unit 3, the transport unit 4A, the inspection unit 5A, and the collection-side alignment unit 6. In addition, the base surface 111, which is the upper surface of the base 11, is substantially horizontal, and constituent members of the supply-side alignment section 3, the conveying section 4A, the inspection section 5A, and the collection-side alignment section 6 are arranged on the base surface 111. The inspection device 1A is configured as follows: the supply unit 2 supplies the IC devices 9 to the supply-side array unit 3, the IC devices 9 supplied and arranged in the supply-side array unit 3, and the transport unit 4A transports the arrayed IC devices 9 to the inspection unit. 5A, the inspection unit 5A inspects the IC devices 9 that are transported, the transport unit 4A transports / arranges the IC devices 9 that have been inspected at the recovery side alignment unit 6, and the recovery unit 7 recovers the IC devices 9 arrayed at the recovery side alignment unit 6. According to such an inspection device 1A, the supply, inspection, and recovery of the IC device 9 can be performed automatically. In addition, the inspection device 1A includes a portion other than the inspection portion 5A, that is, a supply portion 2, a supply-side arrangement portion 3, a conveyance portion 4A, a collection-side arrangement portion 6, a collection portion 7, and a control portion 8, etc. (Electronic component transfer device) 10. The transfer device 10A performs transfer of the IC device 9 and the like. As shown in FIG. 12, the IC device 9 includes a main body portion 91 and a plurality of terminals (electrodes) 92 provided outside the main body portion 91. Each terminal 92 is electrically connected to a circuit portion inside the main body portion 91. The shape of the main body portion 91 is not particularly limited; in this embodiment, the main body portion 91 has a substantially plate shape, and when viewed from the Z direction, it has a quadrangular shape in plan view. In this embodiment, the quadrangle is a square or a rectangle. Moreover, each terminal 92 is provided in the lower part (or side part) of the main-body part 91, and is for example spherical, hemispherical, flat, etc. The configurations of the conveyance section 4A and the inspection section 5A are described below. ≪Transfer Section≫ As shown in FIG. 11, the transfer section 4A constituting the electronic component transfer device transfers the IC device 9 disposed on the mounting table 341 of the supply-side array section 3 to the inspection section 5A, and ends the inspection section 5A. The IC device 9 under inspection is transported to a unit of the recovery-side alignment section 6. Such a transfer unit 4A includes a shuttle 41, a supply robot 42, an inspection robot 43A, and a collection robot 44. -Shuttle-The shuttle 41 is used to transfer the IC device 9 on the mounting table 341 to the inspection section 5A, and to further transfer the IC device 9 that has been inspected after the inspection of the inspection section 5A to the recovery side alignment section 6 The shuttle nearby. In this shuttle 41, four bags 411 for accommodating the IC device 9 are formed side by side in the X direction. The shuttle 41 is guided by a linear guide, and can be reciprocated in the X direction by a drive source such as a linear motor. —Supply Robot— The supply robot 42 is a robot that transfers the IC device 9 placed on the mounting table 341 to the shuttle 41. This supply robot 42 has a support frame 421 supported by the base 11, a mobile frame 422 supported by the support frame 421 and capable of reciprocating in the Y direction with respect to the support frame 421, and four hand units supported by the mobile frame 422 ( Holding robot) 423. Each hand unit 423 includes a lifting mechanism and a suction nozzle, and can hold the IC device 9 by suction. -Inspection Robot-The inspection robot 43A is a robot that transfers the IC device 9 stored in the shuttle 41 to the inspection section 5A, and transfers the IC device 9 that has completed the inspection from the inspection section 5A to the shuttle 41. In addition, during inspection, the inspection robot 43A may press the IC device 9 against the inspection unit 5A by the suction unit 49 (see FIG. 12) of the hand unit 433A to apply a specific inspection pressure to the IC device 9. This inspection robot 43A is shown in FIG. 11, and has a support frame 431 supported by the base 11, a moving frame 432 supported by the support frame 431 and capable of reciprocating in the Y direction with respect to the support frame 431, and a moving frame 432 Supported 4 hand units (holding robot) 433A. The configuration of each hand unit 433A is not particularly limited, and the configuration shown in the figure is an example. In addition, as will be described later, each hand unit 433A includes a suction portion 49 (see FIG. 12) and the like that suction the IC device 9. —Recycling Robot— The recycling robot 44 is a robot that transfers the IC device 9 that has completed the inspection in the inspection unit 5A to the collection-side alignment unit 6. This recovery robot 44 has a support frame 441 supported by the base 11, a mobile frame 442 supported by the support frame 441 and capable of reciprocating in the Y direction with respect to the support frame 441, and four hand units supported by the mobile frame 442 ( Holding robot) 443. Each hand unit 443 includes a lifting mechanism and a suction nozzle, and can hold the IC device 9 by suction. The transfer unit 4A transfers the IC device 9 in the following manner. First, the shuttle 41 moves to the left (negative X direction) in the figure, and the supply robot 42 transfers the IC device 9 on the mounting table 341 to the shuttle 41 (step 1). Then, the shuttle 41 moves toward the center (positive X direction), and the inspection robot 43A transfers the IC device 9 on the shuttle 41 to the inspection unit 5A (step 2). Thereafter, the inspection robot 43A transfers the IC device 9 that has completed the inspection in the inspection section 5A to the shuttle 41 (step 3). Then, the shuttle 41 moves to the right side (positive X direction) in the figure, and the collection robot 44 transfers the IC device 9 that has been inspected on the shuttle 41 to the collection-side arrangement unit 6 (step 4). By repeating such steps 1 to 4, the IC device 9 can be transported to the collection-side alignment section 6 through the inspection section 5A. The configuration of the transfer unit 4A has been described above; however, as the configuration of the transfer unit 4A, as long as the IC device 9 on the mounting table 341 can be transferred to the inspection unit 5A, and the IC device 9 that has completed the inspection can be transferred to the collection side The arrangement section 6 is not particularly limited. For example, the shuttle 41 may be omitted, and any one of the supply robot 42, the inspection robot 43A, and the recovery robot 44 may be used to transfer from the mounting table 341 to the inspection section 5A, and from the inspection section 5A to the recovery side alignment section 6. Transport. ≪Inspection Section≫ The inspection section 5A is a unit (tester) for inspecting / testing the electrical characteristics of the IC device 9. As shown in FIG. 12, the inspection section 5A is used by attaching and detaching a mounting section (component placement section) 51A to a carrier board (circuit board) 54 built in the inspection section 5A. The placement portion 51A constituting the component placement portion is a bag made of, for example, a resin to hold and place the IC device 9, and can be replaced according to the type of the IC device 9. The mounting portion 51A constituting the component placement portion includes a main body portion 56 and a mounting base 57 protruding upward from the main body portion. Because the IC device 9 is mounted on the upper surface 571 of the mounting table 57 and the IC device 9 is slid to perform positioning, it is more ideal for a surface state that facilitates sliding, such as a mirror-polished surface state. The mounting table 57 can mount the IC devices 9 one by one. The main body portion 56 and the mounting base 57 of the mounting portion 51A are provided with an air suction hole 504 opened on the upper surface 571. The number of the mounting tables 57 is four in this embodiment, but it is not limited to this, and may be one, two, three, or five or more. In addition, although the arrangement form of the mounting table 57 in the present embodiment is arranged in one row in the X direction, it is not limited to this, and may be arranged in a matrix form in a plurality of units in the X direction and the Y direction, respectively. One line can be arranged in the Y direction. As shown in FIG. 12, each mounting table 57 can easily place the IC device 9 on the upper surface 571 by protruding upward from the main body section 56. In addition, a plurality of probe pins (first conductive members) 522 that are electrically connected (accessible) to the plurality of terminals 92 of the IC device 9 are provided on the mounting table 57. Each of the probe pins 522 is electrically connected to the control unit 8 through a wiring (not shown) provided in the carrier plate 54. Each terminal 92 of the IC device 9 placed on each mounting table 57 is pressed by each of the probe pins 522 with a specific inspection pressure by the pressing of the hand unit 433A of the inspection robot 43A. Thereby, since the terminals 92 of the IC device 9 and the probe pins 522 are electrically connected (contacted), the inspection of the IC device 9 is performed through the probe pins 522. The inspection of the IC device 9 is performed based on a program stored in the control unit 8. In addition, each of the probe pins 522 may be configured to freely enter and leave the upper surface 571. (Control Unit) The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit performs, for example, inspection of the electrical characteristics of the IC device 9 arranged in the inspection unit 5A based on a program stored in a memory (not shown). The drive control unit controls, for example, the drive of each of the supply unit 2, the supply-side alignment unit 3, the transport unit 4A, the inspection unit 5A, the collection-side alignment unit 6, and the collection unit 7 to carry the IC device 9 and the like. The control unit 8 may also perform temperature control of the IC device 9. In addition, when performing the inspection of the electrical characteristics of the IC device 9, the positions of the terminals 92 of the IC device 9 and the positions of the probe pins 522 of the inspection section 5A must be accurately aligned. Placing section 51A. Especially for the small-sized package or multi-pin IC device 9, the distance between the terminals 92 is very narrow, so that the distance between the probe pins 522 is also narrowed. Therefore, the terminals 92 of the IC device 9 are accurately performed. The alignment with the probe pins 522 of the inspection section 5A is more important. Needless to say, if the position of each terminal 92 and the position of each probe pin 522 deviate, the desired inspection cannot be performed, but it can be determined that the reliability of the IC device 9 that can pass such inspection is more reliable as a product. low. The configuration of a hand unit 433A having an alignment function (centering function) for preventing such a positional shift of the IC device 9 will be described below. In addition, as shown in FIG. 13, the IC devices 9 used here are cut by grinding (grinding) with, for example, a rotating cutting blade (a disc-shaped rotating grindstone) DB, and the IC devices 9 are cut in plural in parallel. The disposed substrate 900 is singulated. In this specification, cutting (cutting) the substrate 900 along the dicing groove is referred to as cutting or singulation. In detail, a single-chip IC device 9 can be obtained by cutting (cutting) a portion of the groove portion 918 formed by the contact of the dicing blade DB. In this embodiment, an IC device 9 which is singulated in this manner is used. In addition, it is known that in this way (cutting) of the IC device 9, the shape of the wall surfaces (second surface) 913, 914 on both sides of the groove portion 918 after being cut by the cutter DB is relatively stable (shape The accuracy is better). For example, protrusions (burrs) 919b or depressions (grains) 919c as shown in FIG. 14 are generated without cutting (cutting) by the cutting blade DB, and the shape is not stable (the shape accuracy is poor). —Hand Unit— As shown in FIG. 12, the hand unit 433A has a structure in which the IC device 9 is held, and the IC device 9 in the held state can be pressed against the placement portion 51A. The hand unit 433A includes a first substrate 45, a second substrate 46, a support portion 47A serving as a base, a lower end portion 48A, a suction portion 49 serving as a holding portion, and a first abutment, which are arranged in order from the top. The part 401 and the second abutting part 402 (see FIG. 17B) are two abutting parts. In addition, in this embodiment, as shown in FIG. 17B, the first abutting portion 401 and the second abutting portion 402 are abutted from two directions (the second direction and the third direction) that are orthogonal to each other. The wall surfaces 913 and 914 (see FIG. 14), which are stable (good shape accuracy) side faces of the IC device 9, are arranged. The first substrate 45 has a function of supporting the hand unit 433A and the like with respect to the moving frame 432 (see FIG. 11). The first substrate 45 has a planar upper surface and a lower surface. In addition, the first substrate 45 is opened at the upper and lower surfaces to form a through hole 452 constituting a part of the suction flow path 430, and is connected to the ejector 13 as a suction source on the upper surface side. In addition, by the action of the ejector 13, the suction flow path 430 is brought into a negative pressure state (vacuum state) and the IC device 9 can be adsorbed by the adsorption portion 49. The release of the adsorption can be performed by vacuum destruction with the ejector 13. The second substrate 46 is a plate member in this embodiment, and has a flat upper surface and a lower surface. In the hand unit 433A, the lower surface of the first substrate 45 and the upper surface of the second substrate 46 are in contact with each other. A second through-hole 463 is formed in the second substrate 46 so as to be opened on the upper surface, and a second through-hole 462 that communicates with the first through-hole 463 and is opened on the lower surface is formed on the upper surface side and the first through-hole. The through hole 452 of the substrate 45 communicates. Thereby, the first through-hole 463 and the second through-hole 462 can form a part of the suction flow path 430 together with the through-hole 452. On the upper surface of the second substrate 46, a ring-shaped concave portion 464 is formed concentrically with the first through hole 463 and the second through hole 462. By inserting a ring-shaped gasket 434 into the recessed portion 464 in a compressed state, the airtightness between the first through-hole 463 and the second through-hole 462 and the through-hole 452 constituting a part of the suction flow path 430 can be maintained. . The constituent materials of the first substrate 45 and the second substrate 46 are not particularly limited; for example, various metal materials can be used. Among these, aluminum or aluminum alloy is preferably used. By using aluminum or aluminum alloy, the weight of the hand unit 433A can be reduced. The support portion 47A serving as the base is a supporter capable of moving (sliding) the suction portion (holding portion) 49 of the suction IC device 9 in the vertical direction. In this embodiment, the support portion 47A is formed of a disk-shaped member, and the planar upper surface thereof abuts the lower surface of the second substrate 46. The support portion 47A has a structure including an inner ring 473 and an outer ring 474A arranged concentrically with the inner ring 473. The inner cavity portion 471 of the inner ring 473 communicates with the second through hole 462 of the second substrate 46 on the upper surface side (the positive Z direction side). Thereby, the inner cavity portion 471 can constitute a part of the suction flow path 430. Moreover, a part (upper end portion 491) of the suction portion 49 is inserted into the inner cavity portion 471 from the lower surface side (negative Z direction side). Above the connecting portion of the inner ring 473 and the outer ring 474A, a ring-shaped concave portion 467 formed concentrically with the inner ring 473 is formed. By inserting a ring-shaped gasket 437 into the recessed portion 467 in a compressed state, the airtightness between the inner cavity portion 471 and the first through hole 463 and the second through hole 462 can be maintained. On the other hand, a coil spring 438 that is an elastic member is disposed outside the inner ring 473 and further below the outer ring 474A. The coil spring 438 is in an extended state, and its upper end is connected to the outer ring 474A, and its lower end is connected to the flange portion 494 of the suction portion 49. Thereby, the suction part 49 can be energized downward. The inner ring 473 is inserted into the inside of the coil spring 438. Thereby, since the coil spring 438 is supported from the inside, it can expand and contract stably (refer FIG. 12). The lower end portion 48A is formed of a ring-shaped member and is connected to the lower surface of the outer ring 474A of the support portion 47A. The upper surface 483 of the lower end portion 48A is in contact with the flange portion 494 of the suction portion 49 and functions as a stopper (brake) that determines a stop position on the lower side of the suction portion 49. In addition, the lower end portion 48 is located at a position different from the suction portion 49 that directly contacts the IC device 9, that is, it is arranged concentrically with the suction portion 49 so as to surround the suction portion 49. The lower surface 48B of the lower end portion 48A is connected to a first contact portion 401 and a second contact portion 402 which are contact portions described later. The lower surface 482 of the lower end portion 48A is the lowermost surface of the portion other than the suction portion 49, the first contact portion 401, and the second contact portion 402 of the hand unit 433A that are in contact with the IC device 9. In addition, when the lower end portion 48A is connected to the mounting portion 51A by the hand unit 433A and the IC device 9 is pressed, the lower surface 482 may abut the mounting portion 51A. The suction portion 49 as a holding portion is a member that suctions the IC device 9 and presses it against the placing portion 51A. The suction portion 49 is cylindrical, and its upper end portion 491 is inserted into the inner cavity portion 471 of the inner ring 473 of the support portion 47A in a state of "clearance fit" or "transition fit". Thereby, the adsorption | suction part 49 can be moved stably in an up-down direction. The suction portion 49 abuts on the upper surface 911 of the IC device 9 at a position at the lower end of the movement (see FIG. 14). Then, by bringing the suction flow path 430 into a negative pressure state (vacuum state), the suction portion 49 sucks the IC device 9 on the suction surface 493. Further, the suction section 49 moves downward as the hand unit 433A is lowered, and presses the IC device 9 on the mounting section 51A (the mounting table 57). Then, if the mounted IC device 9 is pressed toward the upper surface 571 of the mounting table 57 via the suction portion 49, the suction portion 49 moves upward due to the reaction force of the suction portion 49 against the urging force of the coil spring 438. The coil spring 438 compresses the movement amount of the suction part 49, and can further press the IC device 9 according to the compression amount. Thereby, each terminal 92 of the IC device 9 can be brought into contact with the probe pin 522 corresponding to the terminal 92. The pressed suction part 49 moves upward as the hand unit 433A rises. Then, by releasing the negative pressure state (vacuum state) of the suction flow path 430, the adsorption unit 49 releases the adsorption of the IC device 9. The positions of the moving lower end and the moving upper end of the suction portion 49 may be changed according to the type of the IC device 9, for example. One opening of the inner cavity portion 492 of the adsorption portion 49 communicates with the first through hole 463 of the second substrate 46, and the other opening communicates with the adsorption port 497 through the connection hole 496. Thereby, the inner cavity portion 492, the connection hole 496, and the suction port 497 can constitute a part of the suction flow path 430. In addition, as described above, the suction flow path 430 is brought into a negative pressure state (vacuum state) by the operation of the ejector 13 and can adsorb the IC device 9. At this time, the suction surface 493 of the suction portion 49 and the upper surface 911 (see FIG. 14) of the main body portion 91 of the IC device 9 are in close contact with each other, and the suction flow path 430 is hermetically sealed by the tight contact. Thereby, the negative pressure state of the suction flow path 430 can be maintained, and therefore, the IC device 9 can be prevented from falling off from the suction portion 49. A flange portion 494 is formed on the outer peripheral portion of the suction portion 49 and includes a diameter-enlarged portion whose diameter is increased. The upper surface of the flange portion 494 functions as a spring seat connecting the lower end of the coil spring 438. The lower surface of the flange portion 494 has a function of a stopper (brake) that abuts the lower end portion 48A and stops the movement of the suction portion 49 when the suction portion 49 moves downward. A ring-shaped concave portion 495 is formed on the upper end portion 491 of the suction portion 49 of the embedded portion 471 embedded in the inner ring 473 of the support portion 47A, concentrically with the upper end portion 491. A ring-shaped gasket 439 is inserted into the recessed portion 495 in a compressed state. The pad 439 has elasticity, thereby limiting the contact area of the suction portion 49 to the inner ring 473 (inner cavity portion 471), thereby reducing sliding resistance and allowing the suction portion 49 to move smoothly within the inner ring 473. In addition, with the gasket 439, the airtightness of the suction flow path 430 can be maintained even during the movement (sliding) of the suction portion 49. The first abutting portion 401 and the second abutting portion 402, which are connected to the lower surface 482 of the lower end portion 48A, have contact positions for the IC device 9 placed on the placing portion 51A (the placing table 57). Centering) function. As shown in FIG. 17B, the first abutting portion 401 is arranged so as to be able to be pressed from the second direction along the X-axis direction, and is a wall surface 913 which is the second surface of the IC device 9. The second abutting portion 402 is The wall surface 914 which is a second surface of the IC device 9 can be pressed by being abutted from a third direction along the Y-axis direction. In this way, the first contact portion 401 and the second contact portion 402 are brought into contact with the wall surfaces 913 and 914 which are the second surface of the IC device 9. Therefore, the first contact portion 401 and the second contact portion 402 are described later. The abutting surfaces 403f and 404f are, for example, as shown in FIG. 12, disposed at positions facing the upper side (positive Z direction) of the IC device 9. The first abutment portion 401 and the second abutment portion 402 are, as shown in FIG. 12 and FIG. 17B, provided with thick-walled portions 405 and 406 and thin-walled portions 403 and 404 extending from below the thick-walled portions 405 and 406. . The upper surface of the first contact portion 401 and the second contact portion 402 is the thick wall portions 405 and 406 connected to the lower surface 482 of the lower end portion 48A. The thin-walled portions 403 and 404 have flat contact surfaces 403f and 404f as end surfaces of the front end portions thereof. The abutting surfaces 403f and 404f are arranged so as to abut on the wall surfaces 913 and 914 which are the second surfaces of the IC device 9. Then, the abutment surfaces 403f and 404f are in contact with the wall surfaces 913 and 914 which are the second surface of the IC device 9, and the IC device 9 is positioned (centered). In addition, the surfaces of the abutting surfaces 403f and 404f are preferably smooth surfaces having no unevenness such as mirror polishing. In this way, for example, the mirror-polished surface-shaped contact portions 403f and 404f are brought into contact with the wall surfaces 913 and 914 of the IC device 9 and pushed, and the IC device 9 slides smoothly along the contact surfaces 403f and 404f. The deviation (inclination) of the rotation direction in a plan view when the upper surface 911 (see FIG. 14) of the IC device 9 as the first surface is the front side can be easily corrected, so that the positioning (centering) can be accurately performed. The constituent materials of the support portion (base portion) 47, the lower end portion 48A, and the adsorption portion (holding portion) 49 are not particularly limited; for example, various metal materials can be used. Among these, carbon steel is preferably used. In addition, It may also be aluminum or copper. Carbon steel is ideal because of its stable strength and excellent wear resistance. In addition, the person having the lower end portion 48A (hereinafter referred to as "the former") and the abutting portion of the lower end portion 48A (hereinafter referred to as the "the latter"), in the present embodiment, the former is the hand unit 433A of the inspection robot 43A and the latter is The placement section 51A of the inspection section 5A is not limited to this. For example, the former may be a hand unit 423 for supplying the robot 42, the latter may be a shuttle 41, the former may be a hand unit 433A of the inspection robot 43A, and the latter may be a shuttle 41. —Positioning Operation— The positioning operation of the electronic component (IC device 9) of the electronic component inspection device according to the fourth embodiment will be described below with reference to FIGS. 15A to 15C, FIGS. 16A to 16C, and FIGS. 17A to 17C. 15A is a cross-sectional view showing the IC device 9 as an electronic component held at an offset position when viewed from the Y-axis direction. FIG. 15B is a cross-sectional view (Y-axis direction viewing angle) showing a state where a contact portion (first contact portion 401) faces the IC device 9 held at the offset position. FIG. 15C is a cross-sectional view (Y-axis direction view) of the IC device 9 positioned by a contact portion (first contact portion 401). 16A is a cross-sectional view showing the IC device 9 as an electronic component held at an offset position when viewed from the X-axis direction. FIG. 16B is a cross-sectional view (X-axis direction viewing angle) showing a state where the other abutting portion (second abutting portion 402) faces the IC device 9 held at the offset position. FIG. 16C is a cross-sectional view (X-axis direction viewing angle) of the IC device 9 positioned by another abutting portion (second abutting portion 402). FIG. 17A is a plan view showing an IC device as an electronic component held at an offset position when viewed from the Z-axis direction (A-A perspective of FIG. 12). FIG. 17B is a plan view (a Z-axis direction view) showing a state in which the contact portions (the first contact portion 401 and the second contact portion 402) face the IC device held at the offset position. FIG. 17C is a plan view (Z-axis direction viewing angle) of the IC device 9 positioned by the contact portions (the first contact portion 401 and the second contact portion 402). First, the operation of the first contact portion 401 that abuts on the wall surface 913 of the IC device 9 from the second direction along the X-axis direction will be described with reference to FIGS. 15A, 15B, 15C, and 17A, 17B, and 17C. As shown in FIGS. 15A and 17A, the IC device 9 is mounted with the first surface lower surface 912 facing the upper surface 571 of the mounting table 57 of the mounting portion 51A. In addition, the IC device 9 can be sucked and held on the mounting table 57 by the suction hole 504 of the mounting section 51A set to a negative pressure. As described above, if the IC device 9 is held by suction, the suction force can be easily changed, and the position of the IC device 9 can be easily moved (slided) by pushing. In addition, at this time, the IC device 9 is held with a specific deviation (a shifted position in advance) with respect to the arrangement direction (see FIG. 15B) of the first contact portion 401. Specifically, in this embodiment, since the first abutment portion 401 is located in the negative X direction, the IC device 9 is shifted such that the center position of the IC device 9 is located in the negative X direction with respect to the center position of the mounting table 57. Configuration. Then, as shown in FIGS. 15B and 17B, the hand unit 433A (refer to FIG. 12) is moved downward toward the IC device 9, and the suction portion (holding portion) 49 is brought closer to the Z direction of the upper surface 911 of the IC device 9. Stop at a specific position. The specific position in the Z direction referred to here is a position where the contact surface 403f of the first contact portion 401 and the wall surface 913 of the IC device 9 face each other. At this time, the hand unit 433A (see FIG. 12) is lowered at a position where a space is provided between the contact surface 403f of the first contact portion 401 and the wall surface 913 of the IC device 9. Therefore, the center position of the suction portion (holding portion) 49 is shifted from the center position of the mounting table 57 so as to be positioned in the negative X direction like the IC device 9. Then, the hand unit 433A (see FIG. 12) and the placement portion 51A are relatively moved in the X-direction (second direction), and the abutting surface 403f of the first abutting portion 401 abuts against the IC device. 9 的 墙面 913. The wall surface 913. In this embodiment, as shown in FIG. 15C and FIG. 17C, the first contact portion 401 is moved by the hand unit 433A (see FIG. 12) in the direction of the arrow m11 in the figure with respect to the fixed mounting portion 51A. The abutting surface 403f abuts and presses the wall surface 913 of the IC device 9. Thereby, the IC device 9 is slid (moved) on the mounting table 57 to a specific position, for example, the center position of the IC device 9 and the center position of the suction part (holding part) 49 are substantially overlapped to perform alignment (centering) ). In other words, the lower surface 912 (the first surface) of the IC device 9 is slid on the mounting table 57. 16A, 16B, 16C, and 17A, 17B, and 17C, the operation of the second contact portion 402 that abuts on the wall surface 914 of the IC device 9 in the third direction along the Y-axis direction will be described. As shown in FIGS. 16A and 17A, the IC device 9 is sucked and held on the mounting table 57 similarly to FIG. 15A described above. At this time, the IC device 9 is held with a specific deviation (a shifted position in advance) with respect to the arrangement direction (see FIG. 16B) of the second contact portion 402. Specifically, in this embodiment, since the second abutting portion 402 is located in the positive Y direction, the IC device 9 is shifted such that the center position of the IC device 9 is located in the positive Y direction relative to the center position of the mounting table 57. Configuration. Then, as shown in FIGS. 16B and 17B, the hand unit 433A (see FIG. 12) is moved downward toward the IC device 9, and the suction portion (holding portion) 49 is brought closer to the Z direction of the upper surface 911 of the IC device 9. Stop at a specific position. The specific position in the Z direction referred to here is a position where the contact surface 404f of the second contact portion 402 and the wall surface 914 of the IC device 9 face each other. At this time, the hand unit 433A (see FIG. 12) is lowered at a position where a space is provided between the contact surface 404f of the second contact portion 402 and the wall surface 914 of the IC device 9. Therefore, the center position of the suction section (holding section) 49 is shifted from the center position of the mounting table 57 so as to be positioned in the positive Y direction in the same manner as the IC device 9. Then, the hand unit 433A (see FIG. 12) and the placement portion 51A are relatively moved in a direction (third direction) along the Y direction, and the abutting surface 404f of the second abutting portion 402 abuts against the IC device. 9 of the wall surface 914. In this embodiment, as shown in FIG. 16C and FIG. 17C, the hand unit 433A (see FIG. 12) is moved in the direction of the arrow m12 in the figure with respect to the fixed mounting portion 51A, and the second abutting portion The abutting surface 404f of 402 abuts and presses the wall surface 914 of the IC device 9. Thereby, the IC device 9 is slid (moved) on the mounting table 57 to a specific position, for example, the center position of the IC device 9 and the center position of the suction part (holding part) 49 are substantially overlapped to perform alignment (centering) ). In other words, the lower surface 912 (the first surface) of the IC device 9 is slid on the mounting table 57. The adsorption force of the IC device 9 held by the mounting portion 51A (the mounting table 57) is preferably smaller than the pressing force of the contact portion (the first contact portion 401 and the second contact portion 402). In addition, the adsorption force of the IC device 9 held by the mounting portion 51A can also be referred to as the pressing direction of the abutting portion (the first abutting portion 401 and the second abutting portion 402), the IC device 9 The frictional force of the lower surface 912 (the first surface) with respect to the mounting portion 51A. In this way, the IC device 9 can be easily moved by the pressing of the abutting portions (the first abutting portion 401 and the second abutting portion 402), and the IC device 9 can be easily positioned (centered). Further, the position of the IC device 9 can be corrected even when the IC device 9 is shifted in a plan view when the top surface 911 which is the first surface is the front surface (facing the top surface 911). In detail, by pressing the first abutting portion 401 and the second abutting portion 402 against the wall surfaces 913 and 914 of the IC device 9, the corner portion of the IC device 9 can follow each of the abutting surfaces. 403f and 404f slide, and the wall surfaces 913 and 914 are brought into contact with the abutment surfaces 403f and 404f, and can be set to a state without rotation offset. In the above, the first contact portion 401 or the second contact portion 402 is moved by the hand unit 433A (see FIG. 12) in the direction of the arrow m11 or the arrow m12 with respect to the fixed mounting portion 51A. The IC device 9 is moved and pushed, but it is not limited to this. As shown in FIG. 17B, the IC device 9 placed on the mounting portion 51A can be moved in the direction of the arrow m13 or the arrow m14 with respect to the hand unit 433A (see FIG. 12) that has not moved in the X direction and the Y direction. While pushing the IC device 9. That is, as the IC device 9 placed on the placement portion 51A relatively moves with respect to the first abutment portion 401 and the second abutment portion 402 that have not moved in the X and Y directions, the wall surfaces 913 and 914 of the IC device 9 The contact surfaces 403f and 404f are pressed and pressed. Thereby, the IC device 9 can be slid (moved) to a specific position on the mounting table 57, for example, the center position of the IC device 9 and the center position of the suction part (holding part) 49 approximately overlap with each other for positioning (positioning). heart). As described with reference to FIG. 17B, the first abutting portion 401 and the second abutting portion 402 are capable of abutting from two mutually orthogonal directions (the second direction and the third direction) to press the IC device. The wall surfaces 9 and 914 are arranged. In this way, since a plurality of abutment portions (the first abutment portion 401 and the second abutment portion 402) are arranged, they are pressed from a plurality of directions (the second direction and the third direction orthogonal to the second direction). The wall surfaces 913 and 914 can easily and accurately correct (center) the deviation of the rotation direction of the IC device 9 (the inclination in the top view when the above surface 911 is the front surface), or in a plurality of directions (the second direction and The third direction is orthogonal to the second direction). In addition, the movement of the first abutment portion 401 in the second direction and the movement of the second abutment portion 402 in the third direction can move either one in advance, or both of them in the second direction and the third direction. The directions move simultaneously. According to the inspection device (electronic component inspection device) 1 of the fourth embodiment described above, the abutment portions (the first abutment portion 401 and the second abutment portion 402) abut on the first surface (lower surface 912) that is held by suction. The groove portion 918 of the IC device 9 which abuts and is disposed on the upper surface 571 of the mounting table 57 constituting the placement portion 51A of the component placement portion is cut along the second surface that intersects the first surface (lower surface 912) ( The wall surfaces 913 and 914 of the IC device 9 are divided, and the IC device 9 can be positioned (eg, centered). Since the wall surfaces 913 and 914 of the groove portion 918 provided when the IC device 9 is singulated are formed by, for example, a cutting device, the position accuracy of the IC device 9 is high, and there is no protrusion 919b when it is bent, for example. Or depression 919c (see FIG. 14) and other irregularities remain, so the surface state is relatively flat. Therefore, the abutment portion (the first abutment portion 401 and the second abutment portion 402) can abut against the wall surface (second surface) 913, 914 of the IC device 9, and the IC device 9 can be easily carried out. Positioning (centering). In addition, the relative movement of the suction portion 49 as the holding portion and the placement portion 51A (the placement table 57) constituting the component placement portion causes the IC device 9 to be contacted portion (the first contact portion 401 and the second contact portion). 402) Push. In this way, the position of the IC device 9 movably held by suction can be moved by a simple mechanism using the pressing of the abutting portions (the first abutting portion 401 and the second abutting portion 402), thereby Easy positioning (centering). <Fifth Embodiment> Next, an electronic component inspection apparatus according to a fifth embodiment of the present invention will be described with reference to FIG. 18. FIG. 18 is a cross-sectional view (vertical cross-sectional view) showing a transport unit (hand unit and shuttle) of an electronic component inspection apparatus according to a fifth embodiment of the present invention. Note that the upper and upper sides of the drawing in FIG. 18 are referred to as "upper" or "upper", and the lower sides are referred to as "lower" or "lower" (the same applies to the other embodiments). In addition, FIG. 18 illustrates the configuration of one of the plurality of hand units of the transfer unit and a shuttle corresponding to the hand unit. Hereinafter, a fifth embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 18, and the differences from the fourth embodiment described above will be mainly described, and the same items will be marked with the same The symbols will be omitted. The inspection device 1B, which is an electronic component inspection device according to the fifth embodiment, is the contact portion corresponding to the contact portion (the first contact portion 401 and the second contact portion 402) of the fourth embodiment (the fifth embodiment). The configuration is the same as that of the inspection device 1A of the fourth embodiment except that the configuration and arrangement position of the first contact portion 401B and the second contact portion 402B) are different. Specifically, in the fourth embodiment described above, the contact portions (the first contact portion 401 and the second contact portion 402) are connected to the lower surface 482 of the lower end portion 48A. However, in this embodiment, as shown in FIG. 18 As shown, the contact portions (the first contact portion 401B and the second contact portion 402B) are connected to the shuttle 41 constituting the transfer portion 4B. Hereinafter, the configuration of the shuttle 41 and the contact portions (the first contact portion 401B and the second contact portion 402B) connected to the shuttle 41 will be mainly described. In the configuration of this embodiment, the lower end portion 48B is not connected to the abutting portion (the first abutting portion 401 and the second abutting portion 402) as described in the fourth embodiment. The lower end portion 48B has a length in the Z direction of the upper surface 483 and the lower surface 482 that is shorter than the length in the Z direction of the upper surface 483 and the lower surface 482 of the lower end portion 48A. The structure of the lower end portion 48B of this embodiment other than this is the same as that of the lower end portion 48A of the fourth embodiment. Therefore, the description of the lower end portion 48B is omitted. The shuttle 41 is the same as the fourth embodiment shown in FIG. 11, and is used to transport the IC device 9 on the mounting table 341 to the vicinity of the inspection section 5A, and further to the IC device 9 inspected by the inspection section 5A. It is transported to the vicinity of the collection-side alignment section 6. In the shuttle 41, four bags 411 for accommodating the IC device 9 are formed side by side along the X direction. The shuttle 41 is guided by a linear guide, and can be reciprocated in the X direction by a drive source such as a linear motor. In addition, although the number of formation of the bag-shaped object 411 is four in this embodiment, it is not limited to this, and may be one, two, three, or five or more. In addition, although the arrangement form of the bag-shaped object 411 is arranged along the X direction in this embodiment, it is not limited to this, but may be arranged in a matrix form in the unit of a plurality of units along the X direction and the Y direction. You can also arrange one line in the Y direction. As shown in FIG. 18, the bag-shaped object 411 is provided with a tapered opening 413 having a side wall portion which is recessed and inclined from the upper surface of the shuttle 41, and a mounting portion of the IC device 9 provided at the bottom of the opening 413 414, and a retreat portion 412 for avoiding the abutment of the terminal 92 of the IC device 9 concavely provided at the bottom of the opening 413. The bag-shaped object 411 facilitates the entrance and exit of the IC device 9 due to its tapered opening 413. On the upper surface 418 of the shuttle 41, two abutting portions of a first abutting portion 401B and a second abutting portion 402B are arranged. In addition, in this embodiment, the first abutting portion 401B and the second abutting portion 402B are abutted from two mutually orthogonal directions (the second direction and the third direction) to press the IC device 9 The wall surfaces 913 and 914 are arranged (see FIGS. 17A, 17B, and 17C). The first abutting portion 401B and the second abutting portion 402B as abutting portions connected to the upper surface 418 of the shuttle 41 have positioning (centering) of the IC device 9 that is held and held by the suction portion 49 from the bag 411. ) Function. In the same manner as the fourth embodiment described with reference to FIG. 17B, the alignment (centering) of the IC device 9 as the first surface upper surface 911 by the suction portion 49 is performed. In addition, the first abutment portion 401B can be arranged from the second direction along the X-axis direction and can be pressed against the wall surface 913 which is the second surface of the IC device 9. The second abutment portion 402B can be provided along the Y-axis. The third direction is arranged so as to abut against and press the wall surface 914 as the second surface of the IC device 9. The first abutment portion 401B and the second abutment portion 402B are provided on the upper side of the thick-walled portions 405B and 406B and the thick-walled portions 405B and 406B (side of the hand unit 433B), as shown in FIGS. ) Extended thin-walled portions 403B and 404B. The first contact portion 401B and the second contact portion 402B are connected to the upper surface 418 of the shuttle 41 at the lower surface of the thick-walled portions 405B and 406B. The thin-walled portions 403B and 404B have abutting surfaces 403Bf and 404Bf which are flat surfaces as end surfaces of the front end portions thereof. The abutting surfaces 403Bf and 404Bf are arranged so as to abut on the wall surfaces 913 and 914 which are the second surface of the IC device 9. The abutting surfaces 403Bf and 404Bf abut on the wall surfaces 913 and 914 as the second surface of the IC device 9 to perform positioning (centering) of the IC device 9. The surfaces of the abutting surfaces 403Bf and 404Bf are preferably in a smooth surface state with no unevenness such as mirror polishing, as in the fourth embodiment. —Positioning Operation— Hereinafter, referring to FIGS. 19A to 19C and FIGS. 20A to 20C, the positioning operation of the electronic component (IC device 9) of the electronic component inspection device according to the fifth embodiment will be described. FIG. 19A is a cross-sectional view showing the IC device 9 as an electronic component held at an offset position when viewed from the Y-axis direction. FIG. 19B is a cross-sectional view (Y-axis direction view) showing a state in which a contact portion (first contact portion 401B) faces the IC device 9 held at the offset position. FIG. 19C is a cross-sectional view (Y-axis direction view) of the IC device 9 positioned by a contact portion (first contact portion 401B). FIG. 20A is a cross-sectional view showing the IC device 9 as an electronic component held at an offset position when viewed from the X-axis direction. FIG. 20B is a cross-sectional view (X-axis direction viewing angle) showing a state where the other abutting portion (second abutting portion 402B) faces the IC device 9 held at the offset position. FIG. 20C is a cross-sectional view (X-axis direction viewing angle) of the IC device 9 positioned by another abutting portion (second abutting portion 402B). First, the operation of the first contact portion 401B that abuts on the wall surface 913 of the IC device 9 from the second direction along the X-axis direction will be described with reference to FIGS. 19A, 19B, and 19C. As shown in FIG. 19A, the suction portion 49 of the hand unit 433B abuts on the first surface upper surface 911 of the IC device 9 placed on the bag 411 of the shuttle 41. At this time, the IC device 9 is located in the arrangement direction of the first abutment portion 401B with a specific offset (shifted in advance). Specifically, in this embodiment, since the first abutment portion 401B is located in the negative X direction, the IC device 9 is located in the negative X direction with the center position of the IC device 9 relative to the center position of the adsorption portion 49 as the holding portion. Way offset configuration. Next, as shown in FIG. 19B, the suction portion 49 (hand unit 433B: see FIG. 18) of the IC device 9 is held upward by the suction (the direction shown by the arrow H1 in the figure) to a specific position. At this time, the IC device 9 is shifted and held (sucked) in such a manner that the center position of the IC device 9 is located in the negative X direction with respect to the center position of the suction portion 49 as a holding portion. The specific position is a position where the contact surface 403Bf of the first contact portion 401B and the wall surface 913 of the IC device 9 face each other. A space is provided between the contact surface 403Bf of the first contact portion 401B and the wall surface 913 of the IC device 9. Then, the suction portion 49 (hand unit 433B) and the shuttle 41 are relatively moved in the X-direction (second direction), and the abutting surface 403Bf of the first abutting portion 401B abuts to press the IC device 9 Wall surface 913. In this embodiment, as shown in FIG. 19C, the shuttle 41 moves in the direction of the arrow m11 in the figure with respect to the fixed adsorption portion 49, and the abutting surface 403Bf of the first abutting portion 401B abuts to press the IC. The wall surface 913 of the device 9. Thereby, the IC device 9 in the state held by the suction portion 49 is slid (moved) to a specific position, for example, the center position of the IC device 9 and the center position of the suction portion (holding portion) 49 approximately overlap with each other for alignment ( centering). Next, the operation of the second abutting surface 402B that abuts on the wall surface 914 of the IC device 9 from the third direction along the Y-axis direction will be described with reference to FIGS. 20A, 20B, and 20C. As shown in FIG. 20A, the suction portion 49 of the hand unit 433B is the first upper surface 911 of the IC device 9 that is in contact with the bag-shaped object 411 placed on the shuttle 41 in the same manner as in FIG. 19A described above. At this time, the IC device 9 is located in the arrangement direction of the second abutting portion 402B with a specific offset (a shifted position in advance). Specifically, in this embodiment, since the second abutting portion 402B is located in the positive Y direction, the IC device 9 is located in the positive Y direction with the center position of the IC device 9 relative to the center position of the adsorption portion 49 as the holding portion. Way offset configuration. Next, as shown in FIG. 20B, the suction portion 49 (hand unit 433B) of the IC device 9 is held upward by the suction (holding direction 433B) to a specific position. At this time, the IC device 9 is shifted and held (sucked) in such a manner that the center position of the IC device 9 is positioned in the positive Y direction with respect to the center position of the suction portion 49 as a holding portion. The specific position is a position where the contact surface 404Bf of the second contact portion 402B and the wall surface 914 of the IC device 9 face each other. A space is provided between the contact surface 404Bf of the second contact portion 402B and the wall surface 914 of the IC device 9. Then, the suction portion 49 and the shuttle 41 are relatively moved in the direction (third direction) in the Y direction, and the abutting surface 404Bf of the second abutting portion 402B abuts to press the wall surface 914 of the IC device 9. In this embodiment, as shown in FIG. 20C, the shuttle 41 moves in the direction of the arrow m12 in the figure with respect to the fixed adsorption portion 49, and the abutting surface 404Bf of the second abutting portion 402B abuts and is pressed. The wall surface 914 of the IC device 9. Thereby, the IC device 9 in the state held by the suction part 49 can be slid (moved) to a specific position, for example, the position where the center position of the IC device 9 and the center position of the suction part (holding part) 49 approximately overlap to perform alignment. Bit (centering). The IC device 9 is sucked and held by the suction portion (holding portion) 49 through a suction flow path 430 set to a negative pressure. As described above, if the IC device 9 is held by suction, the suction force can be easily changed, and it can be pushed by the contact portions (the first contact portion 401B and the second contact portion 402B) from the X direction and the Y direction. The position of the IC device 9 can be easily moved. The adsorption force of the IC device 9 held by the adsorption portion 49 is preferably smaller than the pressing force of the contact portion (the first contact portion 401B and the second contact portion 402B). In addition, the suction force of the IC device 9 held by the suction portion 49 can also be referred to as the pressing direction of the abutment portion (the first abutment portion 401B and the second abutment portion 402B) on the IC device 9. The frictional force of the surface 911 (the first surface) with respect to the suction portion 49. Thus, the IC device 9 can be easily moved by the pressing of the abutting portions (the first abutting portion 401B and the second abutting portion 402B), and the IC device 9 can be easily positioned (centered). In addition, even in the fifth embodiment, the IC device 9 can be corrected even in a case where the IC device 9 is shifted in a rotation direction in a plan view from a direction in which the first surface (upper surface) 911 is a front surface. position. In detail, the first contact portion 401B and the second contact portion 402B are brought into contact with each other to push the wall surfaces 913 and 914 of the IC device 9, and the corner portions of the IC device 9 follow each of the contact surfaces 403Bf and 404Bf. And sliding, the wall surfaces 913 and 914 are brought into contact with the contact surfaces 403Bf and 404Bf, and can be set to a state without rotation offset. In the above, the shuttle 41 moves in the direction of the arrow m11 or the arrow m12 with respect to the adsorption portion 49 fixed in the X direction and the Y direction, and the first contact portion 401B or the second contact portion 402B moves. The IC device 9 is pushed, but it is not limited to this. For example, the IC device 9 can be pressed by moving the suction portion 49, that is, the IC device 9 held by the suction portion 49, toward the X direction and the Y direction with respect to the shuttle 41 that does not move in the X direction and the Y direction. That is, when the IC device 9 held by the suction portion 49 moves with respect to the first abutment portion 401B and the second abutment portion 402B that are not moved in the X direction and the Y direction, the wall surfaces 913 and 914 of the IC device 9 abut. The contact surfaces 403Bf and 404Bf are pressed. Thereby, the IC device 9 can be slid (moved) to a specific position while being held by the suction portion 49 to perform alignment (centering). In addition, the movement of the first abutment portion 401B in the second direction and the movement of the second abutment portion 402B in the third direction can move either one in advance, or both of them in the second direction and the third direction. The directions move simultaneously. According to the inspection device (electronic component inspection device) 1B of the fifth embodiment described above, the abutment portions (the first abutment portion 401B and the second abutment portion 402B) abut on the first surface (upper surface 911) and abut the structure Wall surface 913 of IC device 9 that is cut (divided) along the groove portion 918 of the second surface that intersects with the first surface (upper surface 911) of the IC device 9 that is disposed as the suction portion 49 of the holding portion. , 914, and positioning (for example, centering) of the IC device 9 can be performed. In addition, the relative movement of the suction portion 49 as the holding portion and the shuttle 41 constituting the component placement portion causes the IC device 9 to be pressed by the contact portions (the first contact portion 401B and the second contact portion 402B). In this way, the position of the IC device 9 that can be movably held by suction can be moved by a simple mechanism that is pushed by the abutting portions (the first abutting portion 401B and the second abutting portion 402B), and Easy positioning (centering). As described above, the inspection device (electronic component inspection device) 1B according to the fifth embodiment has the same effects as the inspection device (electronic component inspection device) 1 according to the fourth embodiment. <Sixth Embodiment> Next, an electronic component inspection apparatus according to a sixth embodiment of the present invention will be described with reference to FIG. 21. FIG. 21 is a schematic layout diagram showing an electronic component inspection apparatus according to a sixth embodiment of the present invention. The inspection device 1C, which is an electronic component inspection device according to the sixth embodiment, includes a supply section 2, a supply-side arrangement section 3, a conveyance section 4C, an inspection section 5A, a collection-side arrangement section 6, a collection section 7, and control of these sections. The control section 8. In addition, the inspection device 1C includes a base 11 on which a supply unit 2, a supply-side alignment unit 3, a transport unit 4C, an inspection unit 5A, a collection-side alignment unit 6, and a collection unit 7 are disposed; and a cover 12 for receiving The base 11 is covered with the supply-side alignment unit 3, the conveyance unit 4C, the inspection unit 5A, and the recovery-side alignment unit 6. In addition, the base surface 111, which is the upper surface of the base 11, is substantially horizontal, and constituent members of the supply-side alignment portion 3, the conveying portion 4C, the inspection portion 5A, and the collection-side alignment portion 6 are arranged on the base 111. In addition, the inspection device 1C includes a portion other than the inspection portion 5A, that is, a supply portion 2, a supply-side arrangement portion 3, a conveyance portion 4C, a collection-side arrangement portion 6, a collection portion 7, and a control portion 8, etc. (Electronic component transfer device) 10C. The transfer device 10C performs transfer of the IC device 9 and the like. The inspection device 1C as an electronic component inspection device according to the sixth embodiment differs from the inspection device 1A according to the fourth embodiment in that it has a transport unit in which a part position detection unit 105 is added to the transport unit 4 of the fourth embodiment. 4C. The following description focuses on the difference from the above-mentioned fourth embodiment, that is, the configuration of the component position detection unit 105, and the same components are denoted by the same reference numerals, and descriptions thereof will be omitted. The part position detection unit 105 included in the conveying unit 4C includes a visual positioning mechanism that controls the above-mentioned abutment unit (the first abutment unit 401, 401B, and the first abutment unit based on image information (position information) obtained from a camera, etc.) 2 the movement of the abutting portions 402, 402B). The part position detection unit 105 of this embodiment detects the placement portion 51A before positioning (centering) by the contact portion (the first contact portion 401 and the second contact portion 402) of the fourth embodiment described above. (Mounting stage 57) The holding position of the IC device 9 held (adsorbed). The part position detection unit 105 includes a camera and can obtain a holding position of the IC device 9 as image information. In addition, the part position detection unit 105 of the sixth embodiment can also detect the position before positioning (centering) by the abutment unit (the first abutment unit 401B and the second abutment unit 402B) of the fifth embodiment. The holding position of the IC device 9 held (sucked) by the suction part 49. The detected holding position information of the IC device 9 is processed by the control unit 8, thereby determining, for example, which of the first abutment portions 401 and 401B and the second abutment portions 402 and 402B are moved and arrived first. It is connected to the wall surfaces 913 and 914 of the IC device 9 and operates the transfer unit 4C. In addition, the control unit 8 determines, based on, for example, the amount of offset of the IC device 9 or the amount of inclination (the amount of offset in the rotation direction). First, the first contact portions 401 and 401B and the second contact portions 402 and 402B Which of the two moves can be positioned (centered) more efficiently and correctly. In addition, the control unit 8 can control the moving speed, the amount of movement, and the like of the first abutting portions 401 and 401B and the second abutting portions 402 and 402B based on the held position information of the detected IC device 9. As described above, in addition to the configurations of the fourth and fifth embodiments described above, the configuration including the part position detection unit 105 described in the sixth embodiment can be used to efficiently perform more accurate positioning. heart). Although the electronic component transfer device and the electronic component inspection device according to the present invention have been described above with reference to the illustrated embodiments, the present invention is not limited to this. Each part constituting the electronic component transfer device and the electronic component inspection device may be compatible with other components. Replace any structure that performs the same function. Moreover, you may add arbitrary structures. In addition, the electronic component transfer device and the electronic component inspection device of the present invention may be a combination (a feature) of any two or more of the embodiments described above.

1‧‧‧Inspection device
1A‧‧‧Inspection device
1B‧‧‧Inspection device
1C‧‧‧Inspection device
1d‧‧‧Inspection device
2‧‧‧ Supply Department
3‧‧‧Supply side alignment section
4‧‧‧ Transport Department
4B‧‧‧Transportation Department
4C‧‧‧Transportation Department
4c‧‧‧Transportation Department
5‧‧‧ Inspection Department
5A‧‧‧ Inspection Department
6‧‧‧Recycling side alignment section
7‧‧‧Recycling Department
8‧‧‧Control Department
9‧‧‧IC device
10‧‧‧ transport device
10A‧‧‧Transporting device
10B‧‧‧Transporting device
10C‧‧‧Transportation device
11‧‧‧ base
12‧‧‧ cover
13‧‧‧ Ejector
41‧‧‧ shuttle
42‧‧‧ supply robot
43‧‧‧ Inspection Robot
43A‧‧‧ Inspection Robot
43c‧‧‧ Inspection Robot
43d‧‧‧ Inspection Robot
44‧‧‧Recycling robot
45‧‧‧The first substrate
46‧‧‧ 2nd substrate
47‧‧‧ as the support department of the base
47A‧‧‧Support Department
47d‧‧‧Support Department
48‧‧‧ lower end
48A‧‧‧ lower end
49‧‧‧Adsorption section as holding section
49c‧‧‧Adsorption Department
51‧‧‧mounting section (electronic parts mounting section)
51A‧‧‧mounting section
52‧‧‧ Recess
54‧‧‧Carrier board (circuit board)
56‧‧‧Body
57‧‧‧mounting table
61‧‧‧Chuck section (1st chuck section)
61a‧‧‧Chuck Division
61b‧‧‧Chuck Department
61c‧‧‧Chuck Department
61m‧‧‧chuck section when opened
62‧‧‧Chuck section (second chuck section)
62a‧‧‧Chuck Division
62b‧‧‧Chuck Department
62c‧‧‧Chuck Department
62m‧‧‧chuck section when opened
63‧‧‧Chuck section (third chuck section)
64‧‧‧Chuck section (4th chuck section)
81‧‧‧ the other end
82‧‧‧ the other end
85‧‧‧ one end
86‧‧‧One end
91‧‧‧Body
92‧‧‧Terminal
105‧‧‧Part position detection section
111‧‧‧ base surface
341‧‧‧mounting table
401‧‧‧The first abutment
401B‧‧‧The first abutment
402‧‧‧The second abutment
402B‧‧‧The second abutment
403‧‧‧thin-walled section
403f‧‧‧ abutting surface
404‧‧‧Thin-walled
404f‧‧‧ abutting surface
405‧‧‧thick-walled section
406‧‧‧thick-walled section
411‧‧‧bag
412‧‧‧Retreat
413‧‧‧ opening
414‧‧‧Placement Department
418‧‧‧ Top surface
421‧‧‧Support
422‧‧‧mobile stand
423‧‧‧hand unit
430‧‧‧suction channel
431‧‧‧Support
432‧‧‧mobile stand
433‧‧‧hand unit
433A‧‧‧Hand Unit
433c‧‧‧hand unit
433a‧‧‧hand unit
433b‧‧‧hand unit
433d‧‧‧hand unit
434‧‧‧pad
437‧‧‧ cushion
438‧‧‧ Coil Spring
439‧‧‧ cushion
441‧‧‧support frame
442‧‧‧mobile stand
443‧‧‧hand unit
452‧‧‧through hole
462‧‧‧The second through hole
463‧‧‧The first through hole
464‧‧‧Concave
467‧‧‧Concave
471‧‧‧ Internal cavity
472‧‧‧Chuck Support Department
472d‧‧‧chuck support
473‧‧‧Inner Ring
474‧‧‧outer ring
474A‧‧‧outer ring
474d‧‧‧outer ring
476‧‧‧face
481‧‧‧ lower surface
482‧‧‧lower surface
483‧‧‧upper surface
491‧‧‧ upper end
492‧‧‧ Internal cavity
493‧‧‧ adsorption surface
494‧‧‧ flange
495‧‧‧ recess
496‧‧‧Connecting hole
497‧‧‧ adsorption port
498‧‧‧ flange
498a‧‧‧inclined surface
504‧‧‧suction hole
522‧‧‧ Probe Pin
523‧‧‧Sidewall
524‧‧‧ bottom
525‧‧‧Retreat
526‧‧‧Wiring
571‧‧‧upper surface
611‧‧‧ Connection Department
611a‧‧‧connection
612‧‧‧axis
613‧‧‧ the other end
614‧‧‧ one end
614c‧‧‧One end
615‧‧‧Connection Department
615b‧‧‧ Connection
621‧‧‧ Connection Department
621a‧‧‧connection
622‧‧‧axis
623‧‧‧ the other end
624‧‧‧ one end
624c‧‧‧One end
625‧‧‧Connection Department
625b‧‧‧ Connection
651‧‧‧The first rod member
651a‧‧‧One end
652‧‧‧ 2nd member
652a‧‧‧ one end
653‧‧‧3rd rod member
654‧‧‧4th rod member
655‧‧‧ Coil Spring
661‧‧‧The first rod member
661a‧‧‧ one end
662a‧‧‧ end
665‧‧‧ Coil Spring
811‧‧‧Threaded member
812‧‧‧ front end
821‧‧‧Threaded member
822‧‧‧Front end
851‧‧‧Threaded member
861‧‧‧Threaded member
900‧‧‧ substrate
911‧‧‧upper surface
912‧‧‧lower surface
913‧‧‧wall
914‧‧‧Wall surface
918‧‧‧Slot
919b‧‧‧ raised
919c‧‧‧Dent
F1‧‧‧ Adsorption
F2‧‧‧moving force
C1‧‧‧Spring force
C11‧‧‧axis
C12‧‧‧axis
C21‧‧‧axis
C22‧‧‧axis
DB‧‧‧Cutter
G‧‧‧ Center of Gravity
m1‧‧‧arrow (first direction (first moving direction))
m2‧‧‧arrow (second direction (first moving direction))
m3‧‧‧arrow (second direction (first moving direction))
m11‧‧‧arrow
m12‧‧‧arrow
m13‧‧‧arrow
m14‧‧‧arrow
P‧‧‧Pressure
P1‧‧‧arrow
P2‧‧‧arrow
P3‧‧‧arrow
Q11‧‧‧axis
Q12‧‧‧axis
Q13‧‧‧axis
Q14‧‧‧axis
Q21‧‧‧axis
Q22‧‧‧axis
Q23‧‧‧axis
Q24‧‧‧axis
R1‧‧‧contact resistance (friction)
W1‧‧‧ IC device weight
X‧‧‧ direction
Y‧‧‧ direction
Z‧‧‧ direction
d1‧‧‧diameter of suction port
d2‧‧‧face diameter

FIG. 1 is a schematic layout diagram showing an electronic component inspection apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic plan view showing a transfer section and an inspection section of the electronic component inspection apparatus according to the first embodiment. FIG. 3 is a cross-sectional view (vertical cross-sectional view) showing a hand unit and an inspection unit of a transport unit of the electronic component inspection apparatus. FIG. 4 is a cross-sectional view (vertical cross-sectional view) showing a state in which the hand unit presses the electronic component. FIG. 5 shows an arrangement example of the chuck portion of the hand unit, and is a plan view taken along A-A of FIG. 3. Fig. 6 is a cross-sectional view (vertical cross-sectional view) showing a first modification of the chuck portion of the hand unit. 7 is a cross-sectional view (vertical cross-sectional view) showing a second modification of the chuck portion of the hand unit. FIG. 8 is a cross-sectional view (vertical cross-sectional view) of a hand unit of a transport unit of an electronic component inspection apparatus according to a second embodiment of the present invention. FIG. 9 is a cross-sectional view (vertical cross-sectional view) showing a hand unit of a transport unit of an electronic component inspection apparatus according to a third embodiment of the present invention. FIG. 10 is a layout diagram showing an outline of an electronic component inspection apparatus according to a fourth embodiment of the present invention. FIG. 11 is a schematic plan view showing a transfer section and an inspection section of the electronic component inspection apparatus according to the fourth embodiment. FIG. 12 is a cross-sectional view (vertical cross-sectional view) illustrating a hand unit and an inspection unit of a transport unit of the electronic component inspection apparatus. 13 is a cross-sectional view showing an outline (before dicing) of cutting (division) of an electronic component (IC device). FIG. 14 is a cross-sectional view showing a cut (divided) electronic component (IC device). 15A is a cross-sectional view showing an electronic component (IC device) held at an offset position when viewed from the Y-axis direction. 15B is a cross-sectional view (Y-axis direction perspective view) showing a state in which a contact portion faces an electronic component (IC device) held at an offset position. 15C is a cross-sectional view (Y-axis direction perspective view) of an electronic component (IC device) positioned by a contact portion. 16A is a cross-sectional view showing an electronic component (IC device) held at an offset position when viewed from the X-axis direction. FIG. 16B is a cross-sectional view (X-axis direction view) showing a state where the other abutting portion faces the electronic component (IC device) held at the offset position. FIG. 16C is a cross-sectional view (X-axis direction view) of an electronic component (IC device) positioned by another abutting portion. FIG. 17A is a plan view showing an electronic component (IC device) held at an offset position when viewed from the Z-axis direction. FIG. 17B is a plan view (a Z-axis direction view) showing a state where the abutting portion faces the electronic component (IC device) held at the offset position. FIG. 17C is a plan view (view of the Z-axis direction) of an electronic component (IC device) positioned by the contact portion. FIG. 18 is a cross-sectional view (vertical cross-sectional view) showing a transport unit (hand unit and shuttle) of an electronic component inspection apparatus according to a fifth embodiment of the present invention. FIG. 19A is a cross-sectional view of an electronic component (IC device) that is held at an offset position with respect to the suction portion when viewed from the Y-axis direction. FIG. 19B is a cross-sectional view (Y-axis direction view) showing a state in which a contact portion faces an electronic component (IC device) held at an offset position. FIG. 19C is a cross-sectional view (a Y-axis perspective) of an electronic component (IC device) positioned by a contact portion. FIG. 20A is a cross-sectional view showing an electronic component (IC device) that is held at an offset position with respect to the suction portion when viewed from the X-axis direction. FIG. 20B is a cross-sectional view (X-axis direction view) showing a state where the other abutting portion faces the electronic component (IC device) held at the offset position. 20C is a cross-sectional view (X-axis direction perspective view) of an electronic component (IC device) positioned by another abutting portion. FIG. 21 is a schematic layout diagram showing an electronic component inspection apparatus according to a sixth embodiment of the present invention.

1‧‧‧Inspection device

4‧‧‧ Transport Department

5‧‧‧ Inspection Department

9‧‧‧IC device

13‧‧‧ Ejector

43‧‧‧ Inspection Robot

45‧‧‧The first substrate

46‧‧‧ 2nd substrate

47‧‧‧ as the support department of the base

48‧‧‧ lower end

49‧‧‧Adsorption section as holding section

51‧‧‧mounting section (electronic parts mounting section)

52‧‧‧ Recess

54‧‧‧Carrier board (circuit board)

61‧‧‧Chuck section (1st chuck section)

61m‧‧‧chuck section when opened

62‧‧‧Chuck section (second chuck section)

62m‧‧‧chuck section when opened

91‧‧‧Body

92‧‧‧Terminal

430‧‧‧suction channel

433‧‧‧hand unit

434‧‧‧pad

437‧‧‧ cushion

438‧‧‧ Coil Spring

439‧‧‧ cushion

452‧‧‧through hole

462‧‧‧The second through hole

463‧‧‧The first through hole

464‧‧‧Concave

467‧‧‧Concave

471‧‧‧ Internal cavity

472‧‧‧Chuck Support Department

473‧‧‧Inner Ring

474‧‧‧outer ring

476‧‧‧face

481‧‧‧ lower surface

491‧‧‧ upper end

492‧‧‧ Internal cavity

493‧‧‧ adsorption surface

494‧‧‧ flange

495‧‧‧ recess

496‧‧‧Connecting hole

497‧‧‧ adsorption port

522‧‧‧ Probe Pin

523‧‧‧Sidewall

524‧‧‧ bottom

525‧‧‧Retreat

526‧‧‧Wiring

611‧‧‧ Connection Department

612‧‧‧axis

613‧‧‧ the other end

614‧‧‧ one end

615‧‧‧Connection Department

621‧‧‧ Connection Department

622‧‧‧axis

623‧‧‧ the other end

624‧‧‧ one end

625‧‧‧Connection Department

G‧‧‧ Center of Gravity

m1‧‧‧arrow (first direction (first moving direction))

m2‧‧‧arrow (second direction (first moving direction))

m3‧‧‧arrow (second direction (first moving direction))

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

d1‧‧‧diameter of suction port

d2‧‧‧face diameter

Claims (9)

An electronic component conveying device capable of conveying electronic components cut along a groove portion having a wall surface, comprising: a component disposing portion which abuts on the first surface of the electronic component and can be used for disposing the electronic component; and The abutting portion is movably disposed relative to the component disposing portion and can abut on a second surface of the electronic component that intersects with the first surface of the electronic component; and the second surface includes the wall surface, The abutting portion is in contact with the wall surface. For example, the electronic component transfer device according to claim 1, wherein the component disposing section includes: a holding section that holds the electronic component and is movable; and a placing section that can be oriented in a second direction orthogonal to the second surface. It is mobilely arranged and can mount the electronic component; and the abutting portion can press the electronic component by the relative movement of the holding portion and the placing portion. In the electronic component conveying device according to claim 2, wherein the abutting portion has an abutting surface, and the abutting surface can be abutted against the wall surface of the electronic component held by the holding portion and disposed on the placing portion. In the electronic component transfer device according to claim 2, wherein the abutting portion has an abutting surface, and the abutting surface can be abutted on the wall surface of the electronic component placed on the placing portion and disposed on the holding portion. . For example, the electronic component conveying device according to any one of claims 1 to 4, wherein the abutting portion is provided with a plurality of abutment portions and is arranged to be able to be pushed at least from the second direction and a third direction orthogonal to the second direction Press the above wall surface. The electronic component transfer device according to any one of claims 1 to 4, wherein the electronic component is held by the holding portion or the placing portion by suction. In the electronic component transfer device according to claim 6, wherein the frictional force of the pressing direction of the electronic component held by the holding portion or the placing portion with respect to the holding portion or the placing portion is greater than that of the abutting portion. The pushing pressure is small. In the electronic component conveying device according to claim 6, wherein the abutting portion abuts on the electronic component held by the holding portion or the holding portion with a specific deviation in a direction in which the abutting portion is arranged and held Wall surface. An electronic component inspection device capable of transporting electronic parts cut along a groove portion having a wall surface, comprising: a component disposing portion which abuts on the first surface of the electronic component, and can be used for disposing the electronic component; The contact portion is movably disposed relative to the component placement portion and can abut on the second surface of the electronic component that intersects the first surface of the electronic component; and an inspection portion that inspects the electronic component; The second surface includes the wall surface, and the abutting portion is in contact with the wall surface.