JP2017167019A - Electronic component conveyance device, and electronic component inspection apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device capable of positioning of an electronic component with an easy mechanism and an electronic component inspection apparatus.SOLUTION: An carrier device (electronic component conveyance device) 10 includes: a component disposition part that comes into contact with a first plane of an electronic component (IC device 9) and is capable of disposing the electronic component; and contact parts (first contact part 401 and second contact part 402) which are disposed movably with respect to the component disposition part and are capable of coming into contact with a second plane of the electronic component crossing the first plane of the electronic component. The second plane has a wall surface of a groove of the electronic component, which is segmented along the groove, and the contact part comes into contact with the wall surface.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects electrical characteristics of an electronic component such as an IC device has been known. This electronic component inspection apparatus generally includes an inspection unit that inspects an IC device and an electronic component transfer device that includes a transfer unit for transferring the IC device to the inspection unit. In such an electronic component inspection apparatus, an alignment mechanism for performing centering of the IC device, for example, in order to bring the external terminals of the IC device arranged finely into contact with the measurement terminals of the inspection unit. Was needed.

  As an example of such an IC device alignment mechanism, for example, Patent Document 1 discloses that an IC device is attracted to a suction nozzle (suction part) by a claw member that is moved by an expansion member driven by a piston. A positioning chuck device having a configuration in which four side surfaces are pressed at right angles and held while performing positioning (centering) is disclosed.

Japanese Patent Laid-Open No. 5-48299

  However, in the conventional alignment mechanism disclosed in Patent Document 1, for example, a mechanism for positioning (centering) the IC device (electronic component) in addition to the suction source for holding the IC device (electronic component). For example, a drive source such as a piston was required. In other words, a complicated mechanism has to be used to position (center) the IC device (electronic component).

  Also, in the formation of IC devices (electronic parts), if the dicing groove (groove part) is used as a starting point, for example, protruding burrs (parts projecting outside) or aggres (inside parts) are formed on the side surfaces of the IC device (electronic parts). In some cases, the outer shape may be disturbed due to the stagnation of the outer shape, and it is difficult to position (center) the IC device (electronic component).

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An electronic component transport apparatus according to this application example is an electronic component transport apparatus capable of transporting an electronic component that is cut along a groove having a wall surface, and abuts against the first surface of the electronic component. A component placement portion on which the electronic component can be placed, and a contact portion disposed so as to be movable with respect to the component placement portion and capable of contacting the second surface of the electronic component intersecting the first surface of the electronic component. A contact portion, wherein the second surface includes the wall surface, and the contact portion is in contact with the wall surface.

  According to the electronic component transport device described in this application example, the electronic component arranged with the first surface in contact with the component arrangement portion is divided along the groove portion that is the second surface intersecting the first surface. A contact part contacts the wall surface of the groove part of an electronic component, and positioning (for example, centering) of an electronic component can be performed. Since the wall surface of the groove of the electronic component is formed by, for example, a dicing device, the positional accuracy with respect to the electronic component is high, and, for example, a burr (a part protruding outward) or an egress (inward) There are no drowned parts), and the surface is in good condition. Therefore, the electronic component can be easily positioned (centered) by a simple mechanism in which the contact portion comes into contact with the wall surface (second surface) of the groove portion of the electronic component.

  Application Example 2 In the electronic component transport apparatus according to the application example described above, the component placement unit holds the electronic component and is movable in a second direction perpendicular to the second surface. And a placement portion on which the electronic component can be placed, and the contact portion can press the electronic component by relative movement between the holding portion and the placement portion. preferable.

  According to this application example, the electronic component is pressed against the contact portion by the relative movement between the holding portion and the placement portion. As described above, the position of the electronic component held so as to be movable can be moved by a simple mechanism by pressing the contact portion, and positioning (centering) can be easily performed.

  Application Example 3 In the electronic component transport apparatus according to the application example, the contact portion has a contact surface, and the contact surface is held on the wall surface of the electronic component held by the holding portion. It is preferable that it is arrange | positioned at the said description part so that contact | abutment is possible.

  According to this application example, by bringing the contact surface of the contact portion into contact with the wall surface of the electronic component held by the holding portion, the electronic component can easily slide along the contact surface. The shift in the rotation direction of the electronic component (inclination in plan view when the first surface is the front surface) can be easily corrected.

  Application Example 4 In the electronic component transport apparatus according to the application example described above, the contact portion has a contact surface, and the contact surface of the electronic component placed on the mounting portion is the front. It is preferable that the holding portion is disposed so as to be able to contact the wall surface.

  According to this application example, by bringing the contact surface into contact with the wall surface of the electronic component placed on the placement unit, the electronic component can easily slide along the contact surface, and the rotation of the electronic component can be performed. Directional deviation (tilt in plan view when the first surface is the front surface) can be easily corrected.

  Application Example 5 In the electronic component transport device according to the application example described above, a plurality of the contact portions are arranged and can press the wall surface from at least the second direction and a third direction orthogonal to the second direction. It is preferable to arrange | position.

  According to this application example, the wall surface is pressed from the second direction and the third direction by the plurality of abutting portions, and thus the displacement of the rotation direction of the electronic component (plan view when the first surface is the front surface) Can be easily corrected.

  Application Example 6 In the electronic component transport apparatus according to the application example described above, it is preferable that the electronic component is held by the holding unit or the mounting unit by suction.

  According to this application example, the suction force of the electronic component can be easily changed, and an appropriate suction force can be obtained. Accordingly, the held electronic component can be easily moved (slid) by pressing the contact portion, and positioning (centering) can be easily performed.

  Application Example 7 In the electronic component transport device according to the application example described above, the frictional force with respect to the holding unit or the mounting unit in the pressing direction of the electronic component held by the holding unit or the mounting unit is It is preferable that the pressure is smaller than the pressing force by the contact portion.

  According to this application example, since the frictional force of the electronic component with respect to the holding portion or the mounting portion in the pressing direction is smaller (weak) than the pressing force by the contact portion, the electronic component can be easily pressed by pressing the contact portion. Can be moved (slid), and electronic components can be positioned (centered).

  Application Example 8 In the electronic component conveying apparatus according to the application example described above, the contact portion is predetermined in a direction in which the contact portion is disposed with respect to a holding position of the holding portion or the mounting portion. It is preferable that the electronic component is held in contact with the wall surface of the electronic component.

  According to this application example, the electronic component can be accurately and reliably positioned (centered) by pressing the contact portion from the direction in which the electronic components are arranged in a biased manner.

  Application Example 9 An electronic component inspection apparatus according to this application example is an electronic component inspection apparatus capable of transporting an electronic component cut along a groove having a wall surface, and abuts against the first surface of the electronic component. A component placement portion on which the electronic component can be placed, and a contact portion disposed so as to be movable with respect to the component placement portion and capable of contacting the second surface of the electronic component intersecting the first surface of the electronic component. A contact portion; and an inspection portion for inspecting the electronic component, wherein the second surface includes the wall surface, and the contact portion is in contact with the wall surface.

  According to the electronic component inspection apparatus described in this application example, the electronic component arranged with the first surface in contact with the component arrangement portion is divided along the groove portion that is the second surface intersecting the first surface. A contact part contacts the wall surface of the groove part of an electronic component, and positioning (for example, centering) of an electronic component can be performed. Since the wall surface of the groove of the electronic component is formed by, for example, a dicing device, the position accuracy with respect to the electronic component is high, and there is no remaining burrs at the time of folding, for example, and the surface state of the wall surface is in order. ing. Accordingly, there is provided an electronic component inspection apparatus capable of easily and accurately positioning (centering) an electronic component by a simple mechanism in which the contact portion contacts the wall surface (second surface) of the groove portion of the electronic component. be able to.

1 is a layout view schematically showing an electronic component inspection apparatus according to a first embodiment of the present invention. The top view which shows the outline of the conveyance part and inspection part of the electronic component inspection apparatus which concern on 1st Embodiment. Sectional drawing (vertical sectional view) which shows the hand unit and inspection part of the conveyance part of an electronic component inspection apparatus. Sectional drawing which shows the outline | summary (before division | segmentation) of the cutting | disconnection (cleaving) of an electronic component (IC device). Sectional drawing which shows the divided | segmented electronic component (IC device). Sectional drawing which shows the electronic component (IC device) hold | maintained at the offset position when it sees from a Y-axis direction. Sectional drawing which shows the state which made one contact part oppose the electronic component (IC device) hold | maintained at the offset position (Y-axis direction view). Sectional drawing which shows the electronic component (IC device) positioned by one contact part (Y-axis direction view). Sectional drawing which shows the electronic component (IC device) hold | maintained in the offset position when it sees from a X-axis direction. Sectional drawing (X-axis direction view) which shows the state which made the other contact part oppose the electronic component (IC device) hold | maintained at the offset position. Sectional drawing (X-axis direction view) which shows the electronic component (IC device) positioned by the other contact part. The top view which shows the electronic component (IC device) hold | maintained at the offset position when it sees from a Z-axis direction. The top view (Z-axis direction view) which shows the state which made the contact part confront the electronic component (IC device) hold | maintained at the offset position. The top view which shows the electronic component (IC device) positioned by the contact part (Z-axis direction view). Sectional drawing (vertical sectional drawing) which shows the conveyance part (hand unit and shuttle) of the electronic component inspection apparatus which concerns on 2nd Embodiment of this invention. Sectional drawing which shows the electronic component (IC device) hold | maintained in the offset position with respect to the adsorption | suction part when it sees from a Y-axis direction. Sectional drawing which shows the state which made one contact part oppose the electronic component (IC device) hold | maintained at the offset position (Y-axis direction view). Sectional drawing which shows the electronic component (IC device) positioned by one contact part (Y-axis direction view). Sectional drawing which shows the electronic component (IC device) hold | maintained in the offset position with respect to the adsorption | suction part when it sees from a X-axis direction. Sectional drawing (X-axis direction view) which shows the state which made the other contact part oppose the electronic component (IC device) hold | maintained at the offset position. Sectional drawing (X-axis direction view) which shows the electronic component (IC device) positioned by the other contact part. FIG. 7 is a layout view schematically showing an electronic component inspection apparatus according to a third embodiment of the present invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

  In the following, for convenience of explanation, as shown in the figure, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction” or “second direction”, a direction parallel to the Y axis is also referred to as “Y direction” or “third direction”, and a direction parallel to the Z axis is referred to as “ Also referred to as “Z direction” or “first direction”. Further, the direction of the arrow of each axis of the X axis, the Y axis, and the Z axis is also referred to as a plus side (plus direction), and the direction opposite to the arrow is also referred to as a minus side (minus direction). In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered.

<First Embodiment>
First, an electronic component inspection apparatus according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a layout diagram showing an outline of an electronic component inspection apparatus according to the first embodiment of the present invention. FIG. 2 is a plan view illustrating an outline of a transport unit and an inspection unit of the electronic component inspection apparatus according to the first embodiment. FIG. 3 is a cross-sectional view (vertical cross-sectional view) of the hand unit and the inspection unit of the transport unit of the electronic component inspection apparatus. FIG. 4 is a cross-sectional view showing an outline (before division) of cutting (cleaving) of an electronic component (IC device). FIG. 5 is a cross-sectional view showing the divided electronic component (IC device).

  The upper side in the drawing of FIG. 3 is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower” (the same applies to the drawings of other embodiments). Moreover, in FIG. 3, one of the hand units of the transport unit is illustrated.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball Grid Array) package and an LGA (Land Grid Array) package, an LCD (Liquid Crystal Display), and an OLED (Organic Electroluminescence Display). Electronic devices including display devices such as electronic paper, CIS (CMOS Image Sensor), CCD (Charge Coupled Device), various sensors such as acceleration sensors, gyro sensors, pressure sensors, and various vibrators including crystal vibrators This is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of parts. Hereinafter, for convenience of explanation, the case where the IC device is used as an electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 9”.

  As shown in FIG. 1, an inspection apparatus 1 as an electronic component inspection apparatus includes a supply unit 2, a supply side arrangement unit 3, a transport unit 4, an inspection unit 5, a collection side arrangement unit 6, and a collection unit 7. And a control unit 8 for controlling each of these units. The inspection apparatus 1 includes a supply unit 2, a supply side arrangement unit 3, a conveyance unit 4, an inspection unit 5, a base 11 on which a collection side arrangement unit 6 and a collection unit 7 are arranged, a supply side arrangement unit 3, and a conveyance unit 4. And a cover 12 that covers the base 11 so as to accommodate the inspection unit 5 and the collection side arrangement unit 6. The base surface 111 which is the upper surface of the base 11 is substantially horizontal, and the constituent members of the supply side array unit 3, the transport unit 4, the inspection unit 5, and the collection side array unit 6 are arranged on the base surface 111. ing.

  In such an inspection apparatus 1, the supply unit 2 supplies the IC device 9 to the supply side arrangement unit 3, the supplied IC device 9 is arranged in the supply side arrangement unit 3, and the arranged IC device 9 is transferred to the conveyance unit 4. Is transported to the inspection unit 5, the inspection unit 5 inspects the IC device 9 that has been transported, and the transport unit 4 transports / arranges the IC device 9 that has been inspected to the collection side array unit 6. The collection unit 7 collects the arranged IC devices 9. According to such an inspection apparatus 1, supply, inspection, and collection of the IC device 9 can be automatically performed. The inspection apparatus 1 is transported by a configuration excluding the inspection unit 5, that is, by a part of the supply unit 2, the supply side arrangement unit 3, the conveyance unit 4, the collection side arrangement unit 6, the collection unit 7, and the control unit 8. An apparatus (electronic component conveying apparatus) 10 is configured. The transport device 10 transports the IC device 9 and the like.

  As shown in FIG. 3, the IC device 9 includes a main body 91 and a plurality of terminals (electrodes) 92 provided outside the main body 91. Each terminal 92 is electrically connected to a circuit portion inside the main body portion 91. The shape of the main body 91 is not particularly limited, but in the present embodiment, the main body 91 is generally plate-shaped and is rectangular when viewed from the Z direction, that is, in plan view. Further, the quadrangle is a square or a rectangle in the present embodiment. Each terminal 92 is provided at the lower part (or side part) of the main body 91 and has, for example, a spherical shape, a hemispherical shape, or a flat plate shape.

Hereinafter, configurations of the transport unit 4 and the inspection unit 5 will be described.
≪Transport section≫
As shown in FIG. 2, the transport unit 4 constituting the electronic component transport apparatus transports the IC device 9 disposed on the mounting stage 341 of the supply side array unit 3 to the inspection unit 5. This is a unit that transports the IC device 9 that has been inspected to the collection side array unit 6. Such a transport unit 4 includes a shuttle 41, a supply robot 42, an inspection robot 43, and a collection robot 44.

-Shuttle-
The shuttle 41 transports the IC device 9 on the mounting stage 341 to the vicinity of the inspection unit 5, and further transports the inspected IC device 9 inspected by the inspection unit 5 to the vicinity of the collection side array unit 6. It is a shuttle to do. In such a shuttle 41, four pockets 411 for accommodating the IC device 9 are formed side by side in the X direction. The shuttle 41 is guided by a linear motion guide and can be reciprocated in the X direction by a drive source such as a linear motor.

-Supply robot-
The supply robot 42 is a robot that conveys the IC device 9 disposed on the placement stage 341 to the shuttle 41. Such a supply robot 42 is supported by the base 11, a support frame 421 supported by the support frame 421, a movable frame 422 that can reciprocate in the Y direction with respect to the support frame 421, and a movable frame 422. And four hand units (gripping robots) 423. Each hand unit 423 includes a lifting mechanism and a suction nozzle, and can hold the IC device 9 by suction.

-Inspection robot-
The inspection robot 43 is a robot that transports the IC device 9 accommodated in the shuttle 41 to the inspection unit 5 and also transports the IC device 9 that has been inspected from the inspection unit 5 to the shuttle 41. The inspection robot 43 can also apply a predetermined inspection pressure to the IC device 9 by pressing the IC device 9 against the inspection unit 5 by the suction unit 49 (see FIG. 3) of the hand unit 433 during the inspection.

  As shown in FIG. 2, the inspection robot 43 includes a support frame 431 supported by the base 11, and a moving frame 432 that is supported by the support frame 431 and can reciprocate in the Y direction with respect to the support frame 431. And four hand units (gripping robots) 433 supported by the moving frame 432. The arrangement of each hand unit 433 is not particularly limited, and the arrangement shown is an example. As will be described later, each hand unit 433 includes a suction portion 49 (see FIG. 3) that sucks the IC device 9 and the like.

-Recovery robot-
The collection robot 44 is a robot that conveys the IC device 9 that has been inspected by the inspection unit 5 to the collection side arrangement unit 6. Such a collection robot 44 is supported by the support frame 441 supported by the base 11, the moving frame 442 supported by the support frame 441 and reciprocally movable in the Y direction with respect to the support frame 441, and the moving frame 442. And four hand units (gripping robots) 443. Each hand unit 443 includes an elevating mechanism and a suction nozzle, and can hold the IC device 9 by suction.

  Such a transport unit 4 transports the IC device 9 as follows. First, the shuttle 41 moves to the left (minus X direction) in the figure, and the supply robot 42 transports the IC device 9 on the placement stage 341 to the shuttle 41 (STEP 1). Next, the shuttle 41 moves to the center (plus X direction), and the inspection robot 43 transports the IC device 9 on the shuttle 41 to the inspection unit 5 (STEP 2). Next, the inspection robot 43 transports the IC device 9 that has been inspected by the inspection unit 5 to the shuttle 41 (STEP 3). Next, the shuttle 41 moves to the right side (plus X direction) in the figure, and the recovery robot 44 transports the inspected IC device 9 on the shuttle 41 to the recovery side arrangement unit 6 (STEP 4). By repeating such STEP 1 to STEP 4, the IC device 9 can be transported to the collection side array unit 6 via the inspection unit 5.

  The configuration of the transport unit 4 has been described above. As the configuration of the transport unit 4, the IC device 9 on the mounting stage 341 is transported to the inspection unit 5, and the IC device 9 that has been inspected is collected on the collection side array unit 6. If it can be conveyed to, it will not be specifically limited. For example, the shuttle 41 is omitted, and any one of the supply robot 42, the inspection robot 43, and the collection robot 44 is used to transport the placement stage 341 to the inspection unit 5, and from the inspection unit 5 to the collection side arrangement unit 6. You may carry to.

≪Inspection Department≫
The inspection unit 5 is a unit (tester) that inspects and tests the electrical characteristics of the IC device 9. As shown in FIG. 3, the inspection unit 5 is used by detachably mounting a mounting unit (component placement unit) 51 on a load board (circuit board) 54 built in the inspection unit 5.

  The placement unit 51 constituting the component placement unit is, for example, a resin socket that holds and places the IC device 9, and can be replaced depending on the type of the IC device 9. The mounting portion 51 constituting the component placement portion includes a main body portion 56 and a mounting table 57 that protrudes upward from the main body portion. The upper surface 571 of the mounting table 57 is desirably a surface state suitable for sliding, for example, a mirror-finished surface state, in order to position the IC device 9 and slide the IC device 9. The mounting table 57 can mount the IC devices 9 one by one. An intake hole 504 that opens to the upper surface 571 is provided in the main body 56 and the mounting table 57 of the mounting unit 51. The number of mounting tables 57 is four in the present embodiment, but is not limited thereto, and may be one, two, three, or five or more. Moreover, although the arrangement | positioning aspect of the mounting base 57 is arrange | positioned in 1 row along the X direction in this embodiment, it is not limited to this, It has arrange | positioned in the X direction and the Y direction in the form of a matrix, respectively. Alternatively, one line may be arranged along the Y direction.

  As shown in FIG. 3, each mounting table 57 protrudes upward from the main body portion 56, and the IC device 9 can be easily mounted on the upper surface 571 thereof. The mounting table 57 is provided with a plurality of probe pins (first conductive members) 522 that can be electrically connected (contacted) to the plurality of terminals 92 of the IC device 9. Each probe pin 522 is electrically connected to the control unit 8 via a wiring (not shown) provided on the load board 54.

  Each terminal 92 of the IC device 9 mounted on each mounting table 57 is pressed against each probe pin 522 with a predetermined inspection pressure by pressing of the hand unit 433 of the inspection robot 43. Thereby, each terminal 92 and each probe pin 522 of the IC device 9 are electrically connected (contacted), and the IC device 9 is inspected via the probe pin 522. The inspection of the IC device 9 is performed based on a program stored in the control unit 8. Each probe pin 522 may be configured to be able to appear and retract with respect to the upper surface 571.

≪Control part≫
The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit, for example, inspects the electrical characteristics of the IC device 9 disposed in the inspection unit 5 based on a program stored in a memory (not shown). The drive control unit controls the driving of each of the supply unit 2, the supply side arrangement unit 3, the conveyance unit 4, the inspection unit 5, the collection side arrangement unit 6, and the collection unit 7, for example, conveyance of the IC device 9 and the like. To do. The control unit 8 can also control the temperature of the IC device 9.

  When the inspection of electrical characteristics is performed on the IC device 9, the position of each terminal 92 of the IC device 9 and the position of each probe pin 522 in the inspection unit 5 are accurately matched, and the IC device 9. Needs to be set on the mounting portion 51. In particular, in the IC device 9 having a small package or a multi-pin configuration, the pitch between the terminals 92 is extremely narrow, and the pitch between the probe pins 522 is accordingly narrowed. It is more important to accurately align the 9 terminals 92 and the probe pins 522 in the inspection unit 5. Naturally, if the position of each terminal 92 and the position of each probe pin 522 are shifted, a desired inspection cannot be performed, and the IC device 9 obtained through such an inspection is a product. It is judged that the reliability is low. Hereinafter, the configuration of the hand unit 433 having an alignment function (centering function) for preventing such displacement of the IC device 9 will be described.

  As shown in FIG. 4, the IC device 9 used here grinds a substrate 900 on which a plurality of IC devices 9 are arranged side by side with, for example, a rotating dicing blade (disk-shaped grindstone) DB. It is separated into pieces by so-called dicing (polishing). Specifically, the IC device 9 can be obtained as a single piece by breaking (dividing) the groove portion 918 formed by contacting the dicing blade DB. In this embodiment, the IC device 9 separated in this way is used. In the IC device 9 thus broken (divided), the wall surfaces (second surfaces) 913 and 914 on both sides of the groove 918 cut by the dicing blade DB have a stable shape (good shape accuracy). However, the break (divided) portion that the dicing blade DB does not reach may have protrusions (burrs) 919b and dents (eglets) 919c as shown in FIG. 5, for example, and the shape is not stable (shape accuracy is poor). Are known.

-Hand unit-
As shown in FIG. 3, the hand unit 433 has a configuration in which the IC device 9 is held and the IC device 9 in the held state can be pressed against the placement unit 51. The hand unit 433 includes a first substrate 45, a second substrate 46, a support portion 47 as a base portion, a lower end portion 48, and a suction portion 49 as a holding portion constituting a component placement portion, which are arranged in order from above. The first contact portion 401 and the second contact portion 402 (see FIG. 8B) have two contact portions. In the present embodiment, as shown in FIG. 8B, the first contact portion 401 and the second contact portion 402 are formed from two directions (second direction and third direction) orthogonal to each other from the IC device. 9 is in contact with a wall surface 913, 914 (see FIG. 5) which is a side surface having a stable shape (good shape accuracy), and is arranged so as to be pressed.

  The first substrate 45 has a function of supporting the hand unit 433 with respect to the moving frame 432 (see FIG. 2). The first substrate 45 has a planar upper surface and lower surface. Further, the first substrate 45 is formed with a through hole 452 forming a part of the suction flow path 430 on the upper and lower surfaces, and is connected to the ejector 13 as an intake source on the upper surface side. Then, when the ejector 13 is operated, the suction flow path 430 is in a negative pressure state (vacuum state), and the IC device 9 can be sucked by the suction portion 49. Note that this suction can be released by performing a vacuum break with the ejector 13.

  In the present embodiment, the second substrate 46 is composed of a plate member, and has a planar upper surface and lower surface. In the hand unit 433, the lower surface of the first substrate 45 and the upper surface of the second substrate 46 are in contact with each other. In addition, the second substrate 46 is formed with a first through hole 463 formed in the upper surface and a second through hole 462 in communication with the first through hole 463 and opened in the lower surface. The upper surface communicates with the through hole 452 of the first substrate 45. Thereby, the first through hole 463 and the second through hole 462 can form a part of the suction flow path 430 together with the through hole 452.

  On the upper surface of the second substrate 46, a ring-shaped recess 464 formed concentrically with the first through hole 463 and the second through hole 462 is formed. A ring-shaped packing 434 is inserted into the concave portion 464 in a compressed state, whereby the first through-hole 463 and the second through-hole 462 that constitute a part of the suction channel 430, and the through-hole It is possible to maintain the airtightness between 452.

  In addition, it does not specifically limit as a constituent material of the 1st board | substrate 45 and the 2nd board | substrate 46, For example, various metal materials can be used, It is preferable to use aluminum or aluminum alloy among these. By using aluminum or an aluminum alloy, the weight of the hand unit 433 can be reduced.

  The support part 47 as a base part supports the adsorption | suction part (holding | maintenance part) 49 which adsorb | sucks the IC device 9 so that a movement (sliding) to an up-down direction is possible. In the present embodiment, the support portion 47 is formed of a disk-shaped member, and the planar upper surface is in contact with the lower surface of the second substrate 46. The support portion 47 has a structure having an inner ring 473 and an outer ring 474 arranged concentrically with the inner ring 473.

  The lumen portion 471 of the inner ring 473 communicates with the second through hole 462 of the second substrate 46 on the upper surface side (plus Z direction side). Thereby, the lumen part 471 can constitute a part of the suction flow path 430. A part (upper end portion 491) of the suction portion 49 is inserted into the lumen portion 471 from the lower surface side (minus Z direction side).

  A ring-shaped recess 467 formed concentrically with the inner ring 473 is formed above the connecting portion between the inner ring 473 and the outer ring 474. A ring-shaped packing 437 is inserted into the concave portion 467 in a compressed state, and thereby the airtightness between the lumen portion 471 and the first through hole 463 and the second through hole 462 is maintained. be able to.

  On the other hand, a coil spring 438 that is an elastic member is disposed outside the inner ring 473 and below the outer ring 474. The coil spring 438 is in an extended state, and has an upper end connected to the outer ring 474 and a lower end connected to the flange portion 494 of the suction portion 49. Thereby, the adsorption | suction part 49 can be urged | biased toward the downward direction. An inner ring 473 is inserted inside the coil spring 438. As a result, the coil spring 438 is supported from the inside, and thus can stably expand and contract (see FIG. 3).

  The lower end portion 48 is formed of a ring-shaped member and is connected to the lower surface of the outer ring 474 of the support portion 47. The upper surface of the lower end portion 48 abuts on the flange portion 494 of the suction portion 49 and functions as a stopper (stopper) that determines a stop position on the lower side of the suction portion 49. And the lower end part 48 is arrange | positioned concentrically with the said adsorption | suction part 49 in the position different from the adsorption | suction part 49 which contacts the IC device 9 directly, ie, surrounding the adsorption | suction part 49. FIG. A first contact portion 401 and a second contact portion 402 as contact portions described later are connected to the lower surface 482 of the lower end portion 48. Note that the lower surface 482 of the lower end portion 48 is the lowermost surface of the portion excluding the suction portion 49 that contacts the IC device 9 of the hand unit 433, the first contact portion 401, and the second contact portion 402. The lower end 48 may be configured such that the lower surface 482 can come into contact with the placement unit 51 when the hand unit 433 presses the IC device 9 against the placement unit 51.

  The suction part 49 as a holding part is a member that sucks the IC device 9 and presses it against the mounting part 51. The suction portion 49 has a cylindrical shape, and an upper end portion 491 thereof is fitted into the inner cavity portion 471 of the inner ring 473 of the support portion 47 in a “clearance fit” or “intermediate fit” state. Thereby, the adsorption | suction part 49 can move stably to an up-down direction.

  The suction part 49 contacts the upper surface 911 (see FIG. 5) of the IC device 9 at the position of the lower end of movement. Then, by setting the suction flow path 430 to a negative pressure state (vacuum state), the suction portion 49 sucks the IC device 9 with the suction surface 493. Further, the suction unit 49 moves downward as the hand unit 433 descends, and presses the IC device 9 against the mounting unit 51 (mounting table 57). When the mounted IC device 9 is pressed toward the upper surface 571 of the mounting table 57 via the suction portion 49, the suction portion 49 receives the reaction force and resists the biasing force of the coil spring 438. Move up. The coil spring 438 is compressed by the amount of movement of the suction portion 49, and the IC device 9 can be further pressed by this amount of compression. Thereby, each terminal 92 of the IC device 9 and the probe pin 522 corresponding to the terminal 92 can be brought into contact with each other. The suction part 49 after pressing moves upward as the hand unit 433 rises. Then, the suction part 49 releases the suction of the IC device 9 by releasing the negative pressure state (vacuum state) of the suction channel 430. Note that the positions of the moving lower end and the moving upper end of the suction portion 49 can be changed according to, for example, the type of the IC device 9.

  The lumen portion 492 of the suction portion 49 has one opening communicating with the first through hole 463 of the second substrate 46 and the other communicating with the suction port 497 via the connection hole 496. Accordingly, the lumen portion 492, the connection hole 496, and the suction port 497 can constitute a part of the suction channel 430. As described above, when the ejector 13 is operated, the suction flow path 430 is in a negative pressure state (vacuum state), and the IC device 9 can be adsorbed. At this time, the suction surface 493 of the suction portion 49 and the upper surface 911 (see FIG. 5) of the main body portion 91 of the IC device 9 are in close contact with each other, and the suction flow path 430 is hermetically sealed by this close contact. . Thereby, the vacuum state of the suction flow path 430 is maintained, and therefore, the IC device 9 can be prevented from falling off from the suction portion 49.

  A flange portion 494 is formed on the outer peripheral portion of the suction portion 49. The flange portion 494 is formed of a diameter-expanded portion whose outer diameter is increased. The upper surface of the flange portion 494 functions as a spring seat that connects the lower end of the coil spring 438. Further, the lower surface of the flange portion 494 has a function as a stopper (per unit) that comes into contact with the lower end portion 48 and stops the movement of the suction portion 49 when the suction portion 49 moves downward.

  A ring-shaped recess 495 formed concentrically with the upper end 491 is formed at the upper end 491 of the suction part 49 fitted into the inner cavity 471 of the inner ring 473 of the support 47. A ring-shaped packing 439 is inserted into the recess 495 in a compressed state. The packing 439 has elasticity, so that the contact area where the adsorbing portion 49 contacts the inner ring 473 (lumen portion 471) can be suppressed, and thus the sliding resistance is reduced, and the adsorbing portion 49 is reduced. Can move smoothly in the inner ring 473. Further, the air tightness of the suction channel 430 can be maintained by the packing 439 even when the suction portion 49 is moving (sliding).

  The first contact portion 401 and the second contact portion 402 as contact portions connected to the lower surface 482 of the lower end portion 48 are the IC device 9 placed on the placement portion 51 (mounting table 57). It has a function to perform the positioning (centering) of. As shown in FIG. 8B, the first contact portion 401 is in contact with the wall surface 913 as the second surface of the IC device 9 from the second direction along the X-axis direction so as to be capable of being pressed. The part 402 is disposed so as to be in contact with and pressable against the wall surface 914 as the second surface of the IC device 9 from the third direction along the Y-axis direction. Thus, in order to make the 1st contact part 401 and the 2nd contact part 402 contact | abut on the wall surface 913,914 as a 2nd surface of IC device 9, the 1st contact part 401 and the 2nd In the contact portion 402, contact surfaces 403f and 404f, which will be described later, are arranged, for example, at positions facing the upper side (plus Z direction) of the IC device 9, as shown in FIG.

  As shown in FIG. 3 and FIG. 8B, the first contact portion 401 and the second contact portion 402 are thick portions 405 and 406 and thin portions extending from below the thick portions 405 and 406. 403 and 404 are provided. In the first contact portion 401 and the second contact portion 402, the upper surfaces of the thick portions 405 and 406 are connected to the lower surface 482 of the lower end portion 48. The thin-walled portions 403 and 404 have contact surfaces 403f and 404f provided in a flat shape as end surfaces of the tip portions. The contact surfaces 403f and 40Bf are disposed so as to be able to contact a wall surface 913 and 914 as the second surface of the IC device 9. The abutting surfaces 403f and 404f abut against a wall surface 913 and 914 as the second surface of the IC device 9 to position the IC device 9 (centering). In addition, it is preferable that the surfaces of the contact surfaces 403f and 404f are smooth surfaces having no irregularities such as a mirror finish.

  In this way, for example, the IC device 9 follows the contact surfaces 403f and 404f by pressing the contact surfaces 403f and 404f having a mirror finish on the wall surfaces 913 and 914 of the IC device 9 and pressing them. It is easy to slide, and the deviation (inclination) in the rotation direction in plan view when the upper surface 911 (see FIG. 5) of the IC device 9 that is the first surface is the front surface can be easily corrected, and positioning (centering) can be performed. It can be done accurately.

  The constituent material of the support part (base part) 47, the lower end part 48, and the adsorption part (holding part) 49 described above is not particularly limited. For example, various metal materials can be used, and among these, carbon steel is used. It is preferable to use aluminum, copper or the like. Carbon steel is preferred because it is stable in strength and has good wear resistance.

  In this embodiment, the one having the lower end portion 48 (hereinafter referred to as “the former”) and the one having the lower end portion 48 in contact (hereinafter referred to as “the latter”) are the hand unit 433 of the inspection robot 43 in this embodiment. The latter is the placement unit 51 of the inspection unit 5, but is not limited thereto. For example, the former may be the hand unit 423 of the supply robot 42, the latter may be the shuttle 41, the former may be the hand unit 433 of the inspection robot 43, and the latter may be the shuttle 41.

-Positioning operation-
Hereinafter, the positioning operation of the electronic component (IC device 9) of the electronic component inspection apparatus according to the first embodiment will be described with reference to FIGS. 6A to 6C, FIGS. 7A to 7C, and FIGS. 8A to 8C. FIG. 6A is a cross-sectional view showing the IC device 9 as an electronic component held at the offset position when viewed from the Y-axis direction. FIG. 6B is a cross-sectional view (viewed in the Y-axis direction) showing a state in which one contact portion (first contact portion 401) faces the IC device 9 held at the offset position. FIG. 6C is a cross-sectional view (viewed in the Y-axis direction) showing the IC device 9 positioned by one contact portion (first contact portion 401). FIG. 7A is a cross-sectional view showing the IC device 9 as an electronic component held at the offset position when viewed from the X-axis direction. 7B is a cross-sectional view (as viewed in the X-axis direction) showing a state where the IC device 9 held at the offset position faces the other contact portion (the second contact portion 402). Fig. 8A is a cross-sectional view (as viewed in the X-axis direction) showing the IC device 9 positioned by the other abutting portion (second abutting portion 402) Fig. 8A is a view from the Z-axis direction (A in Fig. 3). Fig. 8B is a plan view showing an IC device as an electronic component held at the offset position in (-A view), and Fig. 8B shows a contact portion (first contact portion 401) on the IC device held at the offset position. Fig. 8C is a plan view (as viewed in the Z-axis direction) showing a state in which the second abutting portion 402 and the second abutting portion 402 are opposed to each other. FIG. 9 is a plan view (viewed in the Z-axis direction) showing the IC device 9 positioned according to FIG.

  First, the operation of the first contact portion 401 that contacts the wall surface 913 of the IC device 9 from the second direction along the X-axis direction will be described with reference to FIGS. 6A, 6B, 6C, and 8A, 8B, 8C. Will be described with reference to FIG.

  As shown in FIGS. 6A and 8A, the IC device 9 is placed with the lower surface 912 as the first surface facing the upper surface 571 of the mounting table 57 of the mounting portion 51. The IC device 9 is adsorbed and held on the mounting table 57 by the suction hole 504 that is set to a negative pressure of the mounting unit 51. Thus, if the IC device 9 is held by suction, the suction force can be easily changed, and the position of the IC device 9 can be easily moved (slid) by pressing.

  At this time, the IC device 9 is held with a predetermined deviation (previously shifted in position) in the direction in which the first contact portion 401 is disposed (see FIG. 6B). Specifically, in the present embodiment, since the first contact portion 401 is positioned in the minus X direction, the IC device 9 has a center position of the IC device 9 in the minus X direction with respect to the center position of the mounting table 57. It is arranged so as to be biased.

  Next, as shown in FIGS. 6B and 8B, the hand unit 433 (see FIG. 3) is moved downward toward the IC device 9, and the suction portion (holding portion) 49 is brought close to the upper surface 911 of the IC device 9. Stops at a predetermined position in the Z direction. Here, the predetermined position in the Z direction is a position where the contact surface 403f of the first contact portion 401 and the wall surface 913 of the IC device 9 face each other. At this time, the hand unit 433 (see FIG. 3) descends at a position where a space is provided between the contact surface 403f of the first contact portion 401 and the wall surface 913 of the IC device 9. Therefore, the center position of the suction part (holding part) 49 is offset with respect to the center position of the mounting table 57 so as to be positioned in the minus X direction, like the IC device 9.

  Then, by moving the hand unit 433 (see FIG. 3) and the placement unit 51 in the direction along the X direction (second direction), the contact surface 403f of the first contact unit 401 becomes the IC. It contacts and presses against the wall surface 913 of the device 9. In the present embodiment, as shown in FIGS. 6C and 8C, the hand unit 433 (see FIG. 3) moves in the direction of the arrow m11 in the figure with respect to the fixed placement unit 51, thereby The contact surface 403f of the first contact portion 401 contacts and presses against the wall surface 913 of the IC device 9. As a result, the IC device 9 is slid (moved) on the mounting table 57 to a predetermined position, for example, the center position of the suction portion (holding portion) 49 to a position where the center position of the IC device 9 substantially overlaps, and alignment (centering) )I do. In other words, the lower surface 912 (first surface) of the IC device 9 slides on the mounting table 57.

  Next, the operation of the second contact portion 402 that contacts the wall surface 914 of the IC device 9 from the third direction along the Y-axis direction will be described with reference to FIGS. 7A, 7B, 7C, and 8A, 8B, FIG. This will be described with reference to 8C.

  As shown in FIGS. 7A and 8A, the IC device 9 is adsorbed and held on the mounting table 57 in the same manner as in FIG. 6A described above. At this time, the IC device 9 is held with a predetermined deviation (previously shifted in position) in the direction in which the second contact portion 402 is disposed (see FIG. 7B). Specifically, in the present embodiment, since the second contact portion 402 is positioned in the plus Y direction, the IC device 9 is such that the center position of the IC device 9 is in the plus Y direction with respect to the center position of the mounting table 57. It is arranged so as to be biased.

  Next, as shown in FIGS. 7B and 8B, the hand unit 433 (see FIG. 3) is moved downward toward the IC device 9, and the suction portion (holding portion) 49 is brought close to the upper surface 911 of the IC device 9. Stops at a predetermined position in the Z direction. Here, the predetermined position in the Z direction is a position where the contact surface 404f of the second contact portion 402 and the wall surface 914 of the IC device 9 face each other. At this time, the hand unit 433 (see FIG. 3) is lowered at a position where a space is provided between the contact surface 404f of the second contact portion 402 and the wall surface 914 of the IC device 9. Therefore, the center position of the suction part (holding part) 49 is offset from the center position of the mounting table 57 so as to be positioned in the plus Y direction as in the IC device 9.

  Then, by moving the hand unit 433 (see FIG. 3) and the placement unit 51 in the direction along the Y direction (third direction), the contact surface 404f of the second contact unit 402 becomes the IC. It contacts and presses against the wall surface 914 of the device 9. In the present embodiment, as shown in FIG. 7C and FIG. 8C, the hand unit 433 (see FIG. 3) moves in the direction of the arrow m12 in the figure relative to the fixed placement portion 51, thereby The contact surface 404f of the second contact portion 402 contacts and presses against the wall surface 914 of the IC device 9. As a result, the IC device 9 is slid (moved) on the mounting table 57 to a predetermined position, for example, the center position of the suction portion (holding portion) 49 to a position where the center position of the IC device 9 substantially overlaps, thereby aligning (centering). )I do. In other words, the lower surface 912 (first surface) of the IC device 9 slides on the mounting table 57.

  The suction force of the IC device 9 held on the mounting part 51 (mounting table 57) is smaller than the pressing force by the contact parts (the first contact part 401 and the second contact part 402). It is preferable. It should be noted that the suction force of the IC device 9 held on the mounting portion 51 is the mounting portion in the pressing direction pressed by the contact portions (the first contact portion 401 and the second contact portion 402). In other words, the frictional force of the lower surface 912 (first surface) of the IC device 9 with respect to 51 can be said. In this way, the IC device 9 can be easily moved by pressing the contact portions (the first contact portion 401 and the second contact portion 402), and the IC device 9 is positioned (centering). Can be easily performed.

  In addition, the position of the IC device 9 is corrected even when the IC device 9 is displaced in the rotational direction in a plan view from the direction when the upper surface 911 as the first surface is the front surface (facing directly to the upper surface 911). can do. Specifically, the first contact portion 401 and the second contact portion 402 are pressed against the wall surfaces 913 and 914 of the IC device 9 so as to follow the contact surfaces 403f and 404f. The corners of the device 9 slide, and the wall surfaces 913 and 914 come into contact with the contact surfaces 403f and 404f so that there is no rotational deviation.

  Further, in the above description, the hand unit 433 (see FIG. 3) moves in the direction of the arrow m11 or the arrow m12 in the drawing with respect to the fixed placement unit 51, so that the first contact portion 401 or Although the 2nd contact part 402 moved and pressed the IC device 9, it is not restricted to this. As shown in FIG. 8B, with respect to the hand unit 433 (see FIG. 3) that does not move in the X direction and the Y direction, the IC device 9 placed on the placement unit 51 is indicated by an arrow m13 or an arrow m14. The IC device 9 can be pressed by moving in this direction. That is, when the IC device 9 placed on the placement portion 51 moves relative to the first contact portion 401 and the second contact portion 402 that do not move in the X direction and the Y direction, The wall surfaces 913 and 914 of the IC device 9 are in contact with and pressed against the contact surfaces 403f and 404f. As a result, the IC device 9 is slid (moved) on the mounting table 57 to a predetermined position, for example, the center position of the suction portion (holding portion) 49 to a position where the center position of the IC device 9 substantially overlaps, thereby aligning (centering). )It can be performed.

  In addition, as described with reference to FIG. 8B, the first contact portion 401 and the second contact portion 402 are connected to the IC device 9 from two directions (second direction and third direction) orthogonal to each other. It is contact | abutting to the wall surface 913,914, and is arrange | positioned so that a press is possible.

  Thus, from a plurality of directions (second direction and third direction orthogonal to the second direction) by a plurality of abutting portions (first abutting portion 401 and second abutting portion 402). In order to press the wall surfaces 913, 914, the displacement of the IC device 9 in the rotational direction (tilt in plan view when the upper surface 911 is the front surface) and a plurality of directions (second direction and second direction orthogonal to the second direction) The misalignment along the three directions can be corrected (centered) easily and more reliably.

  Further, either the movement of the first abutting portion 401 in the second direction and the movement of the second abutting portion 402 in the third direction may be performed by moving either one in advance or both. It may be moved simultaneously in the second direction and the third direction.

  According to the inspection apparatus (electronic component inspection apparatus) 1 according to the first embodiment described above, the first surface (which is sucked and held on the upper surface 571 of the mounting table 57 of the mounting unit 51 constituting the component placement unit). The lower surface 912 abuts against the wall surfaces 913 and 914 of the IC device 9 divided along the groove portion 918 that is the second surface intersecting the first surface (lower surface 912) of the IC device 9 disposed in contact with the lower surface 912. The parts (the first contact part 401 and the second contact part 402) come into contact with each other, and the IC device 9 can be positioned (for example, centered). Since the wall surfaces 913 and 914 formed by the groove portions 918 provided when the IC device 9 is separated into pieces are formed by, for example, a dicing apparatus or the like, the position accuracy with respect to the IC device 9 is high, and There are no remaining irregular portions such as protrusions 919b and dents 919c (see FIG. 5), and the surface state is in order. Therefore, the IC device 9 can be easily operated by a simple mechanism in which the contact portions (the first contact portion 401 and the second contact portion 402) come into contact with the wall surfaces (second surface) 913, 914 of the IC device 9. Positioning (centering) can be performed.

  Further, the IC device 9 is brought into contact with the contact portions (the first contact portion 401 and the second contact portion 401) by the relative movement between the suction portion 49 as a holding portion constituting the component placement portion and the placement portion 51 (mounting table 57). The contact portion 402) is pressed. In this way, the position of the IC device 9 that is held movably by suction is moved by a simple mechanism by pressing of the contact portions (the first contact portion 401 and the second contact portion 402). Therefore, positioning (centering) can be easily performed.

Second Embodiment
Next, an electronic component inspection apparatus according to a second embodiment of the present invention will be described with reference to FIG. FIG. 9 is a cross-sectional view (vertical cross-sectional view) showing a transport unit (hand unit and shuttle) of the electronic component inspection apparatus according to the second embodiment of the present invention.

  The upper side in the drawing of FIG. 9 is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower” (the same applies to the drawings of other embodiments). Further, FIG. 9 illustrates one of a plurality of hand units of the transport unit and a configuration of a shuttle corresponding to the hand units.

  Hereinafter, the second embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to FIG. 9, but the description will focus on the differences from the first embodiment described above, and similar matters will be described. Are denoted by the same reference numerals, and the description thereof is omitted.

  The inspection apparatus 1B as the electronic component inspection apparatus according to the second embodiment corresponds to the contact portions (the first contact portion 401 and the second contact portion 402) of the first embodiment described above. It is the same as that of 1st Embodiment except the structures and arrangement positions of a contact part (1st contact part 401B and 2nd contact part 402B in 2nd Embodiment) differing. Specifically, in the above-described first embodiment, the contact portions (the first contact portion 401 and the second contact portion 402) are connected to the suction portion 49. As shown in FIG. 9, the contact portions (the first contact portion 401 </ b> B and the second contact portion 402 </ b> B) are connected to the shuttle 41 that constitutes the transport unit 4. Hereinafter, the configuration of the shuttle 41 and the contact portions (the first contact portion 401B and the second contact portion 402B) connected to the shuttle 41 will be mainly described.

  The suction part 49 as the holding part in the configuration of the present embodiment is connected to the contact parts (the first contact part 401 and the second contact part 402) as described in the first embodiment. Absent. The structure of the adsorption | suction part 49 concerning this embodiment other than this is the same as that of 1st Embodiment. Therefore, the suction part 49 is denoted by the same reference numeral in FIG. 9 and its description is omitted.

  Similarly to the first embodiment shown in FIG. 2, the shuttle 41 transports the IC device 9 on the mounting stage 341 to the vicinity of the inspection unit 5. Further, the shuttle 41 is further inspected by the inspection unit 5. The completed IC device 9 is transported to the vicinity of the collection side arrangement unit 6. In the shuttle 41, four pockets 411 for accommodating the IC device 9 are formed side by side in the X direction. The shuttle 41 is guided by a linear motion guide and can be reciprocated in the X direction by a drive source such as a linear motor. The number of pockets 411 formed is four in the present embodiment, but is not limited to this, and may be one, two, three, or five or more. In addition, the arrangement mode of the pockets 411 is arranged in one row along the X direction in the present embodiment, but is not limited to this, and a plurality of arrangements may be arranged in a matrix in the X direction and the Y direction. Alternatively, one line may be arranged along the Y direction.

  As shown in FIG. 9, the pocket 411 is dug in a concave shape from the upper surface of the shuttle 41, and the tapered opening 413 in the inclined side wall portion and the mounting portion 414 of the IC device 9 provided at the bottom of the opening 413 are formed. And an escape portion 412 for avoiding contact with the terminal 92 of the IC device 9 provided in a concave shape at the bottom of the opening 413. In the pocket 411, the IC device 9 can be easily taken in and out by the tapered opening 413.

  On the upper surface 418 of the shuttle 41, two contact portions of a first contact portion 401B and a second contact portion 402B are disposed. In the present embodiment, the first abutting portion 401B and the second abutting portion 402B are separated from each other in two directions (second direction and third direction). 5 (see FIG. 5) and is arranged so as to be pressed (see FIG. 8).

  The first contact portion 401B and the second contact portion 402B as contact portions connected to the upper surface 418 of the shuttle 41 are positions of the IC device 9 that are attracted and held by the attracting portion 49 from the pocket 411. It has a function to perform alignment (centering). Similar to the first embodiment described with reference to FIG. 8B, the IC device 9 having the upper surface 911 serving as the first surface adsorbed by the adsorbing portion 49 is aligned (centered). The first contact portion 401B can be pressed against the wall surface 913 as the second surface of the IC device 9 from the second direction along the X-axis direction, and the second contact portion 402B can be pressed. The IC device 9 is disposed in such a manner that it can be pressed against the wall surface 914 as the second surface of the IC device 9 from the third direction along the axial direction.

  As shown in FIG. 9 and FIGS. 10A and 11A described later, the first abutting portion 401B and the second abutting portion 402B are formed on the upper side of the thick portion 405B, 406B and the thick portion 405B, 406B (hand unit 433 side) and the thin-walled portions 403B and 404B. In the first contact portion 401B and the second contact portion 402B, the lower surfaces of the thick portions 405B and 406B are connected to the upper surface 418 of the shuttle 41. The thin-walled portions 403B and 404B have contact surfaces 403Bf and 404Bf provided in a planar shape as end surfaces of the tip portions. The contact surfaces 403Bf and 404Bf are disposed so as to be able to contact a wall surface 913 and 914 as the second surface of the IC device 9. The abutting surfaces 403Bf and 404Bf abut against a wall surface 913 and 914 as the second surface of the IC device 9 to position the IC device 9 (centering). The surfaces of the contact surfaces 403Bf and 404Bf are the same as in the first embodiment. For example, a smooth surface state having no irregularities such as mirror finish is preferable.

-Positioning operation-
Hereinafter, the positioning operation of the electronic component (IC device 9) of the electronic component inspection apparatus according to the second embodiment will be described with reference to FIGS. 10A to 10C and FIGS. 11A to 11C. FIG. 10A is a cross-sectional view showing the IC device 9 as an electronic component held at the offset position when viewed from the Y-axis direction. FIG. 10B is a cross-sectional view (viewed in the Y-axis direction) showing a state where one abutting portion (first abutting portion 401B) is opposed to the IC device 9 held at the offset position. FIG. 10C is a cross-sectional view (viewed in the Y-axis direction) showing the IC device 9 positioned by one contact portion (first contact portion 401B). FIG. 11A is a cross-sectional view showing the IC device 9 as an electronic component held at an offset position when viewed from the X-axis direction. 11B is a cross-sectional view (as viewed in the X-axis direction) showing a state where the IC device 9 held at the offset position faces the other contact portion (the second contact portion 402B). It is sectional drawing (X-axis direction view) which shows IC device 9 positioned by the other contact part (2nd contact part 402B).

  First, the operation of the first contact portion 401B that contacts the wall surface 913 of the IC device 9 from the second direction along the X-axis direction will be described with reference to FIGS. 10A, 10B, and 10C.

  As shown in FIG. 10A, the suction part 49 of the hand unit 433 comes into contact with the upper surface 911 as the first surface of the IC device 9 placed in the pocket 411 of the shuttle 41. At this time, the IC device 9 is positioned with a predetermined deviation (previously shifted in position) in the direction in which the first contact portion 401B is disposed. Specifically, in the present embodiment, since the first contact portion 401B is positioned in the minus X direction, the IC device 9 is positioned at the center position of the IC device 9 with respect to the center position of the suction portion 49 as a holding portion. Are arranged so as to be offset in the minus X direction.

  Next, as shown in FIG. 10B, the suction portion 49 (hand unit 433: see FIG. 9) that holds the IC device 9 by suction moves upward (in the direction indicated by arrow P1 in the drawing) to a predetermined position. At this time, the IC device 9 is held (sucked) in such a way that the center position of the IC device 9 is positioned in the minus X direction with respect to the center position of the suction part 49 as the holding part. The predetermined position is a position where the contact surface 403Bf of the first contact portion 401B and the wall surface 913 of the IC device 9 face each other. In addition, a space is provided between the contact surface 403Bf of the first contact portion 401B and the wall surface 913 of the IC device 9.

  Then, by moving the suction portion 49 (hand unit 433) and the shuttle 41 in the direction along the X direction (second direction), the contact surface 403Bf of the first contact portion 401B becomes the IC device 9. It abuts against the wall surface 913 and presses. In this embodiment, as shown in FIG. 10C, the shuttle 41 moves in the direction of the arrow m11 in the figure with respect to the fixed suction portion 49, whereby the contact surface of the first contact portion 401B. 403Bf contacts and presses against the wall surface 913 of the IC device 9. As a result, the IC device 9 held in the suction portion 49 is slid (moved) to a predetermined position, for example, to the position where the center position of the IC device 9 substantially overlaps the center position of the suction portion (holding portion) 49, Perform alignment (centering).

  Next, the operation of the second contact portion 402B that contacts the wall surface 914 of the IC device 9 from the third direction along the Y-axis direction will be described with reference to FIGS. 11A, 11B, and 11C.

  As shown in FIG. 11A, the suction portion 49 of the hand unit 433 contacts the upper surface 911 serving as the first surface of the IC device 9 placed in the pocket 411 of the shuttle 41, as in FIG. 10A described above. At this time, the IC device 9 is positioned with a predetermined deviation (previously shifted in position) in the direction in which the second contact portion 402B is disposed. Specifically, in the present embodiment, since the second contact portion 402B is located in the plus Y direction, the IC device 9 is positioned at the center position of the IC device 9 with respect to the center position of the suction portion 49 as the holding portion. Are arranged so as to be located in the plus Y direction.

  Next, as shown in FIG. 11B, the suction portion 49 (hand unit 433) holding the IC device 9 by suction moves upward (in the direction indicated by arrow P1 in the drawing) to a predetermined position. At this time, the IC device 9 is held (sucked) so that the center position of the IC device 9 is positioned in the plus Y direction with respect to the center position of the suction part 49 as a holding part. The above-mentioned predetermined position is a position where the contact surface 404Bf of the second contact portion 402B and the wall surface 914 of the IC device 9 face each other. In addition, a space is provided between the contact surface 404Bf of the second contact portion 402B and the wall surface 914 of the IC device 9.

  Then, the abutment surface 404Bf of the second abutment portion 402B abuts against the wall surface 914 of the IC device 9 by relatively moving the suction portion 49 and the shuttle 41 in the direction along the Y direction (third direction). Touch and press. In the present embodiment, as shown in FIG. 11C, the shuttle 41 moves in the direction of the arrow m12 in the drawing with respect to the fixed suction portion 49, whereby the contact surface of the second contact portion 402B. 404Bf contacts and presses against the wall surface 914 of the IC device 9. As a result, the IC device 9 held in the suction portion 49 is slid (moved) to a predetermined position, for example, to the position where the center position of the IC device 9 substantially overlaps the center position of the suction portion (holding portion) 49, Perform alignment (centering).

  The IC device 9 is sucked and held by the suction portion (holding portion) 49 by the suction flow path 430 having a negative pressure. Thus, if the IC device 9 is held by suction, the suction force can be easily changed, and the contact portions from the X direction and the Y direction (first contact portion 401B and second contact portion 402B). It becomes possible to easily move the position of the IC device 9 by pressing.

  Further, it is preferable that the suction force of the IC device 9 held by the suction part 49 is smaller than the pressing force by the contact parts (the first contact part 401B and the second contact part 402B). The suction force of the IC device 9 held by the suction part 49 is applied to the suction part 49 in the pressing direction pressed by the contact parts (the first contact part 401B and the second contact part 402B). In other words, the frictional force of the upper surface 911 (first surface) of the IC device 9 can be said. In this way, the IC device 9 can be easily moved by pressing the contact portions (the first contact portion 401B and the second contact portion 402B), and the IC device 9 is positioned (centering). Can be easily performed.

  Also in the second embodiment, the position of the IC device 9 is corrected even when the IC device 9 is displaced in the rotational direction in a plan view from the direction where the first surface (upper surface 911) is the front. Can do. Specifically, the first contact portion 401B and the second contact portion 402B are brought into contact with the wall surfaces 913 and 914 of the IC device 9 and pressed, so that the IC follows the contact surfaces 403Bf and 404Bf. The corner portion of the device 9 slides, and the wall surfaces 913 and 914 come into contact with the contact surfaces 403Bf and 404Bf so that there is no rotational deviation.

  In the above description, the shuttle 41 moves in the direction of the arrow m11 or the arrow m12 in the figure with respect to the suction portion 49 fixed in the X direction or the Y direction, so that the first contact portion 401B or the first contact portion Although the 2 contact part 402B moved and pressed the IC device 9, it is not restricted to this. For example, the IC device 9 is pressed by moving the suction portion 49 against the shuttle 41 that does not move in the X and Y directions, that is, the IC device 9 held by the suction portion 49 in the X and Y directions. can do. That is, the wall surface of the IC device 9 is moved by moving the IC device 9 held by the suction portion 49 with respect to the first contact portion 401B and the second contact portion 402B that do not move in the X direction and the Y direction. 913 and 914 are in contact with the contact surfaces 403Bf and 404Bf and pressed. As a result, the IC device 9 can be slid (moved) to a predetermined position while being held by the suction portion 49 to perform alignment (centering).

  Further, either the movement of the first contact portion 401B in the second direction and the movement of the second contact portion 402B in the third direction may be preceded by either one or both. It may be moved simultaneously in the second direction and the third direction.

  According to the inspection apparatus (electronic component inspection apparatus) 1B according to the second embodiment described above, an IC in which the first surface (upper surface 911) is disposed in contact with the suction section 49 as a holding section constituting the component arrangement section. On the wall surface 913, 914 of the IC device 9 divided along the groove portion 918 which is the second surface intersecting the first surface (upper surface 911) of the device 9, the abutting portion (the first abutting portion 401B and the first abutting portion 401B). 2 abutment portions 402 </ b> B) abut, and the IC device 9 can be positioned (for example, centered).

  Further, the IC device 9 is brought into contact with the contact portions (first contact portion 401B and second contact portion 402B) by the relative movement between the suction portion 49 as a holding portion constituting the component placement portion and the shuttle 41. Pressed. In this way, the position of the IC device 9 that is held movably by suction is moved by a simple mechanism by pressing the contact portions (the first contact portion 401B and the second contact portion 402B). Therefore, positioning (centering) can be easily performed.

  As described above, the inspection apparatus (electronic component inspection apparatus) 1B according to the second embodiment described above has the same effect as the inspection apparatus (electronic component inspection apparatus) 1 of the first embodiment.

<Third Embodiment>
Next, an electronic component inspection apparatus according to a third embodiment of the present invention will be described with reference to FIG. FIG. 12 is a layout view schematically showing an electronic component inspection apparatus according to the third embodiment of the present invention.

  As in the first embodiment (see FIG. 1), the inspection apparatus 1C as the electronic component inspection apparatus according to the third embodiment includes a supply unit 2, a supply side arrangement unit 3, a transport unit 4a, and an inspection unit. The unit 5, the collection side arrangement unit 6, the collection unit 7, and the control unit 8 that controls these units are provided. The inspection apparatus 1C includes a supply unit 2, a supply side array unit 3, a transport unit 4a, an inspection unit 5, a recovery side array unit 6 and a recovery unit 7, a base 11, a supply side array unit 3, and a transport unit 4a. And a cover 12 that covers the base 11 so as to accommodate the inspection unit 5 and the collection side arrangement unit 6. The base surface 111 which is the upper surface of the base 11 is substantially horizontal, and the constituent members of the supply side array unit 3, the transport unit 4a, the inspection unit 5, and the collection side array unit 6 are arranged on the base surface 111. ing. Further, in the inspection apparatus 1C, conveyance is performed by a configuration excluding the inspection unit 5, that is, a supply unit 2, a supply side arrangement unit 3, a conveyance unit 4a, a collection side arrangement unit 6, a collection unit 7, a part of the control unit 8, and the like. An apparatus (electronic component conveying apparatus) 10a is configured. The transport apparatus 10a transports the IC device 9 and the like.

  The inspection apparatus 1C as the electronic component inspection apparatus according to the third embodiment has the component position detection unit 105 in the transport unit 4a in addition to the configuration of the first embodiment. Different from device 1. Hereinafter, the configuration of the component position detection unit 105, which is the difference from the first embodiment described above, will be mainly described, and the same configuration is denoted by the same reference numeral, and the description thereof is omitted.

  The component position detection unit 105 provided in the transport unit 4a is based on, for example, image information (position information) obtained from an imaging camera or the like, and the above-described contact parts (first contact parts 401 and 401B, and A vision alignment mechanism for controlling the movement of the second contact portions 402 and 402B) is provided.

  The component position detection unit 105 according to the present embodiment is mounted before positioning (centering) by the contact portions (the first contact portion 401 and the second contact portion 402) according to the first embodiment described above. The holding position of the IC device 9 held (adsorbed) on the mounting portion 51 (mounting table 57) is detected. The component position detection unit 105 includes an imaging camera and can obtain the holding position of the IC device 9 as image information.

  The component position detection unit 105 in the third embodiment performs positioning (centering) by the contact portions (the first contact portion 401B and the second contact portion 402B) of the second embodiment described above. It is also possible to detect the holding position of the previous IC device 9 held (sucked) by the suction unit 49.

  Information on the detected holding position of the IC device 9 is processed by the control unit 8, and for example, which of the first contact portions 401 and 401B and the second contact portions 402 and 402B is moved first. Then, it is determined whether to contact the wall surfaces 913 and 914 of the IC device 9, and the transport unit 4a is operated. Note that the control unit 8 uses the first contact portions 401 and 401B and the second contact portion 402 based on, for example, the amount of shift of the IC device 9 and the amount of tilt (shift amount in the rotational direction). , 402B, it is determined which one has been moved first more efficiently and accurately (centering) is possible. Further, the control unit 8 determines the moving speed and the moving amount of the first contact portions 401 and 401B and the second contact portions 402 and 402B based on the detected information on the holding position of the IC device 9. Can be controlled.

  Thus, in addition to the configuration of the first embodiment and the second embodiment described above, by using the configuration having the component position detection unit 105 described in the third embodiment, more accurate positioning (centering) is achieved. It can be done efficiently.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  DESCRIPTION OF SYMBOLS 1,1B, 1C ... Inspection apparatus as an electronic component inspection apparatus, 2 ... Supply part, 3 ... Supply side arrangement | positioning part, 341 ... Mounting stage, 4, 4a ... Conveyance part, 41 ... Shuttle, 401 ... First contact 402, second contact portion, 403, 404 ... thin portion, 403f, 404f ... contact surface, 405, 406 ... thick portion, 411 ... pocket, 42 ... supply robot, 421 ... support frame, 422 ... moving frame, 423 ... hand unit, 43 ... inspection robot, 430 ... suction channel, 433 ... hand unit, 434 ... packing, 437 ... packing, 438 ... coil spring, 439 ... packing, 44 ... recovery robot, 441 ... support frame 442: Moving frame, 443: Hand unit, 45 ... First base, 452 ... Through hole, 46 ... Second base, 462 ... Second through hole, 463 ... First Through-holes, 467 ... concave portions, 47 ... support portions as base portions, 471 ... lumen portions, 473 ... inner rings, 474 ... outer rings, 48 ... lower end portions, 482 ... lower surfaces, 49 ... adsorption portions as holding portions, 491 ... upper end part, 492 ... lumen part, 493 ... suction surface, 494 ... flange part, 495 ... concave part, 496 ... connection hole, 497 ... suction port, 5 ... inspection part, 51 ... placement part (component placement part) 504, intake holes, 522, probe pins, 54, load board (circuit board), 56, main body, 57, mounting table, 571, upper surface, 6 ... collection side arrangement unit, 7 ... collection unit, 8 ... control unit , 9 ... IC device, 91 ... main body, 92 ... terminal, 900 ... substrate, 911 ... upper surface (first surface), 912 ... lower surface (first surface), 913, 914 ... wall surface (second surface), 918 ... Groove part, 10 ... conveying device as an electronic component conveying device, 11 ... base, 11 ... base surface, 12 ... cover, 13 ... ejector, m11, m12 ... arrows.

Claims (9)

An electronic component transport apparatus capable of transporting an electronic component cleaved along a groove having a wall surface,
A component placement portion that is capable of placing the electronic component in contact with the first surface of the electronic component;
A contact portion that is movably disposed with respect to the component placement portion and is capable of contacting the second surface of the electronic component that intersects the first surface of the electronic component;
The second surface includes the wall surface,
The electronic component transport apparatus according to claim 1, wherein the contact portion is in contact with the wall surface. The component placement unit is
A holding unit that holds the electronic component and is movable;
A placement portion that is movably arranged in a second direction orthogonal to the second surface and on which the electronic component can be placed,
The electronic component conveying apparatus according to claim 1, wherein the contact portion is capable of pressing the electronic component by a relative movement between the holding portion and the placement portion.   The contact portion has a contact surface, and the contact portion is disposed in the mounting portion so as to be able to contact the wall surface of the electronic component held by the holding portion. The electronic component conveying apparatus according to claim 2.   The contact portion has a contact surface, and the contact portion is disposed in the holding portion so as to be able to contact the wall surface of the electronic component placed on the placement portion. The electronic component conveying apparatus according to claim 2.   5. The contact portion is provided in a plurality, and is arranged so as to be capable of pressing the wall surface from at least the second direction and a third direction orthogonal to the second direction. The electronic component conveying apparatus according to any one of the above.   The electronic component conveying apparatus according to any one of claims 1 to 5, wherein the electronic component is held by the holding portion or the placement portion by suction.   The friction force with respect to the holding part or the mounting part in the pressing direction of the electronic component held by the holding part or the mounting part is smaller than a pressing force by the contact part. Item 7. The electronic component carrying device according to Item 6. The contact portion is
Abutting on the wall surface of the electronic component held with a predetermined deviation in the direction in which the abutting portion is arranged with respect to the holding position of the holding portion or the mounting portion. The electronic component conveying apparatus according to claim 6 or 7, characterized in that An electronic component inspection apparatus capable of transporting an electronic component cleaved along a groove having a wall surface,
A component placement portion that is capable of placing the electronic component in contact with the first surface of the electronic component;
A contact portion that is movably disposed with respect to the component placement portion and is capable of contacting the second surface of the electronic component that intersects the first surface of the electronic component;
An inspection unit for inspecting the electronic component,
The second surface includes the wall surface,
The electronic component inspection apparatus, wherein the contact portion is in contact with the wall surface.

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