JP4984259B2 - Sample holding mechanism - Google Patents

Description

The present invention relates to a sample holding mechanism used mainly in a process for processing a plate-like substrate sample such as a semiconductor wafer or a glass plate.

  In a semiconductor processing apparatus, it may be necessary to fix and use a sample wafer. For example, in a sputtering apparatus in which the target is facing upward, the processing surface of the sample wafer must be faced down. For this reason, the sample wafer is fixed to a jig called a substrate holder. In addition to this, in many devices such as ion milling and other anodic bonding devices, etc., the processing surface of the sample wafer needs to be directed downward or laterally, and the wafer is fixed. There must be. In addition, fixing is indispensable even in the case where the device moves only by being placed on a processing place in the apparatus.

Conventionally, when two sample wafers having the same diameter are bonded using, for example, a bonding apparatus, at least one wafer must be fixed in order to perform an alignment operation. When bonding to the substrate holder after fixing to the substrate holder, representative methods include a method of fixing with a holding jig, a method of holding the outer periphery of the wafer at the edge, a vacuum suction or electrostatic force to the substrate holder. There is a method of adsorption.

An example of the receiving edge method is shown in FIG. This figure is a schematic cross-sectional view of the wafer bonding apparatus, and the lower sample wafer 885 is placed on the heating susceptor 850. Further, the heating susceptor is fixed to a fine movement mechanism 895 for alignment of the two sample wafers. On the other hand, the sample wafer 880 positioned on the upper side at the time of bonding is held by the edge portion 805 by using the substrate holder 800 and receiving the outer peripheral portion near the wafer edge.

After aligning the two sample wafers with the infrared microscope head 860 and the monitor 865, the infrared microscope head is retracted, and the operation proceeds to a crimping operation with a press head (not shown) for crimping. However, as shown in FIG. 8A, when joining from above and below, if the diameter of the upper sample wafer is the same or smaller than that of the lower sample wafer, the sample wafers are pressed together. Sometimes, even if the thickness of the substrate holder is made thinner than that of the sample wafer, the receiving edge 805 is in the way, so that it is not possible to immediately proceed to the crimping operation when the alignment operation is completed.

  As a means for solving the above problem, for example, in the case of an annular substrate holder, this is divided into several fan-shaped parts to make them independent holders. By sequentially pulling out, the upper sample wafer can be brought into contact with the lower sample wafer sequentially from the outer peripheral portion. Thereby, it is possible to shift to the crimping operation without the substrate holder interposed. However, in the above means, the upper sample wafer is likely to be misaligned in the process of pulling out the independent holder, and it is extremely difficult to perform pressure bonding by high-precision alignment.

On the other hand, among the fixing methods using the suction method, the vacuum suction method cannot be used in a vacuum atmosphere, and therefore electrostatic chucks are frequently used for pressure bonding under reduced pressure. An example is shown in FIG. The upper sample wafer 880 is held by the electrostatic chuck head 810 by electrostatic adsorption. A power source 815 in the figure is a power source for an electrostatic chuck. As shown in the figure, the electrostatic chuck head does not suck the entire back surface of the upper sample wafer, but secures a monitor region 882 for alignment on the outer periphery of the wafer, and uses the remaining central portion as a suction region. .

However, as described above, since the alignment monitor area is limited, the alignment accuracy may be lower than when the entire wafer surface is monitored. In addition, the electrostatic chuck mechanism has a problem that the structure is complicated and the mechanism cost is high. Further, after the alignment, the electrostatic chuck mechanism must be retracted in addition to the infrared microscope head 860, which complicates the pressure bonding apparatus.
JP 08-186065

  It is an object of the present invention to provide a sample holding mechanism in which the presence of the sample holding mechanism does not become an obstacle even when the operation is shifted to the crimping operation with the substrate sample (wafer or the like) being mounted on the sample holding mechanism. .

  The greatest feature of the present invention is that a plate sample holding mechanism is constituted by a plate frame and a pushing unit, the substrate sample is held in a region surrounded by the plate frame, and only the peripheral edge surface of the substrate sample is provided. It is in contact with the holding mechanism. As a result, if the thickness of the sample holding mechanism is made thinner than the substrate sample to be held, the sample holding mechanism exists even if the substrate sample (wafer, etc.) is moved to the crimping operation with the sample holding mechanism mounted. There is no obstacle.

  The above-mentioned “if the thickness of the sample holding mechanism is made thinner than the substrate sample to be held” can be expressed more accurately as follows: “The surface of the substrate sample mounted in the region surrounded by the plate-shaped frame body. The sample holding mechanism is within a region sandwiched between two virtual planes defined by the virtual plane including the virtual plane including the back surface of the substrate sample.

Details of the present invention will be described below with reference to the drawings showing examples of the present invention. The plate-like frame of the present invention refers to a donut-like thin plate-like frame 110 as shown in FIGS. 1 (A) and 1 (B), for example. A substrate sample 180 is held in a region 140 surrounded by a plate-shaped frame as shown in FIG.

  As shown in FIG. 1C [enlarged cross-sectional view], the distal end of the piston 132 is the end surface of the peripheral portion of the substrate sample 180 due to the restoring force of the spring body 136 in the pushing unit 130 disposed on the plate-like frame 110. The substrate sample is held by pressing.

  The pushing unit 130 includes a cylinder 134, a spring body 136, and a piston 132. The piston can be rotated in the cylinder, and when the piston is pushed into the cylinder, the piston of a predetermined length protrudes from the cylinder just before the compression of the spring body starts. .

The pushing unit is in a state in which the axial line along which the piston slides and the front surface (or back surface) of the plate frame are parallel to each other, and in a region surrounded by the plate frame, the predetermined length of the piston 3 or more of the pushing unit is embedded and fixed in the plate-like frame body in a state of protruding.

  As the layout of the pushing unit, the pushing unit is arranged at a position where the sum of the forces that press the edge of each edge of the substrate sample (vector sum) and the sum of the couples acting on the substrate sample (vector sum) are both zero. do it. The spring constant of each spring body does not necessarily have to be the same. After the pushing unit is arranged at a desired position, the spring constant of each spring body may be set so as to meet the above conditions.

  Further, when the substrate sample to be held has two orthogonal planar shape symmetry axes as in the case of the circular substrate sample 180 as shown in FIG. 1B, two orthogonal planes In a typical system, the pushing unit is arranged at a predetermined position on the extended line of the shape symmetry axis, and the substrate sample is held by a spring body having an equal spring constant.

Moreover, it is preferable that the tangential direction of the moving axis of the piston and the peripheral edge of the substrate sample is substantially orthogonal. Thereby, the substrate sample can be held more stably. Further, the spring body is not particularly limited as long as it generates a repulsive force when the piston is pushed into the cylinder, and is preferably a coil spring.

Also, assuming that the point of contact between the tip of each piston and the peripheral edge of the substrate sample is one point-like point, a polygon obtained by sequentially connecting these virtual points is assumed and held by each piston. It is preferable that the center of gravity of the substrate sample exists inside the assumed polygon when the center of gravity of the substrate sample projected onto the plane including the assumed polygon. As a result, the rotational force in the direction orthogonal to the sample surface (due to the weight of the substrate sample) can be reduced, and thus the substrate sample can be stably held.

More preferably, the projected centroid of the substrate sample and the centroid of the assumed polygon are approximately matched. As a result, the rotational force described above can be suppressed to a minimum, so that a more stable substrate sample can be held.

Further, depending on the shape of the end face of the peripheral edge of the substrate sample to be held, the tip shape of the piston is a V-shaped groove, a cross-shaped V-shaped groove, or a sharp needle shape as shown in FIGS. Further, since it is necessary to push the piston into the cylinder when the substrate sample is detached, it is desirable to provide a hook projection or groove (not shown) on the side surface of the piston as shown in FIG. .

  Moreover, the constituent material of the sample holding mechanism of the present invention is not particularly limited as long as it can be constructed. When used in a processing step that requires heating, a metal material or a ceramic material, or a combination of the above two materials is used.

(1) By using the sample holding mechanism of the present invention, it is possible to proceed to the crimping operation as it is with the substrate sample (wafer or the like) mounted on the holding mechanism. The presence of the sample holding mechanism is not an obstacle to the crimping operation. Therefore, for example, when crimping two upper and lower wafers, even when the upper wafer size held is smaller than the lower one, the crimping operation can be performed with the wafer mounted on the holding mechanism. Become. Moreover, the use in a vacuum atmosphere is also possible.

(2) By using the sample holding mechanism of the present invention, the handling area can be made larger than the actual size of the substrate sample. Thus, even if it is an automatic or semi-automatic process apparatus that normally limits the wafer size that can be handled, for example, if a sample wafer having a diameter of 70 mm is mounted on a sample holding mechanism having an outer diameter of 100 mm, a dedicated apparatus for 100 mm It is possible to handle a sample wafer of Φ70 mm using Since there is no need to use a tray for changing the diameter, problems due to heat conduction during heating / cooling, which is often a problem when using the tray, are also solved.

Several embodiments of the present invention will be described below with reference to the drawings. In order to make the drawing easy to see, the substrate sample in the plan view has a dotted pattern.

  1A to 1C mainly show a sample holding mechanism for holding a circular substrate sample. 1A is a schematic perspective view of a sample holding mechanism in this embodiment, FIG. 1B is a schematic plan view of the sample holding mechanism in a state where a circular substrate sample is held, and FIG. 1C is FIG. FIG.

  The sample holding mechanism includes a plate-like frame body 110 and a pushing unit 130, and the substrate sample 180 is held in a region 140 surrounded by the plate-like frame body. As shown in FIG. 1C, the pushing unit 130 includes a cylinder 134, a coil spring 136 that is a spring body housed in the cylinder, and a piston 132. When the piston is pushed into the cylinder, the coil spring is compressed, and the restoring force generates a pressing force at the tip (exposed side) of the piston.

The pushing unit is attached and fixed to the inner peripheral edge of the plate-like frame as shown in the figure. In this example, the pushing unit was positioned at a portion obtained by cutting a part of the plate-like frame body, and fixed by an appropriate method such as welding, brazing, or caulking.

Further, the thickness of the plate-like frame including the pushing unit is set to be equal to or less than the thickness of the substrate sample. That is, a region sandwiched between two planes defined by a virtual plane including the surface of the substrate sample mounted in the region 140 surrounded by the plate-shaped frame and a virtual plane including the back surface of the substrate sample. It means that the sample holding mechanism of the present invention, that is, the plate-like frame including the pushing unit is completely contained.

  Hereinafter, the sample holding mechanism of this example will be described by taking a silicon wafer having a diameter of 100 mm and a thickness of 0.5 mm as an example of the substrate sample 180. As shown in FIG. 1 (B), the shape of the outer periphery and the inner periphery of the plate-like frame body is concentric, and the diameter of the inner periphery circle is about 110 mm. The plate-like frame 110 is a donut-like frame made of a stainless steel plate having a thickness of about 0.4 mm, and a metal pushing unit 130 is attached to this.

A total of four pushing units are arranged at corresponding positions on two orthogonal axes of shape symmetry of the silicon wafer. The tip of the piston 132 in each pushing unit is adjusted to a state where it protrudes 7 mm from the peripheral part 120 (cylinder open end) in the frame (however, the piston position just before the restoring force is generated by the compression of the coil spring). The spring constant of each coil spring was the same, and the spring constant was about 20 gf / mm. As shown in FIG. 1C, the peripheral portion of the silicon wafer to be held is chamfered and rounded. On the other hand, a V-shaped groove 138 is provided at the tip of the piston pressed against the edge of the peripheral edge of the silicon wafer.

In order to mount the silicon wafer on the sample holding mechanism of this example, after placing the sample holding mechanism on a flat table (not shown), the four pistons at the peripheral edge of the plate-like frame are placed in each cylinder. Push in an appropriate amount. Next, as shown in FIG. 1 (B), after placing the silicon wafer in the region surrounded by the plate-shaped frame, each V-shaped groove at the tip of the piston is brought into contact with the peripheral edge of the silicon wafer. Return the piston that was pushed into the cylinder to its original position.

  As a result, the silicon wafer is held by the four V-shaped grooves that are in contact with the peripheral edge. Since a pressing force (restoring force of the coil spring: about 40 gf) is applied to each piston, the silicon wafer does not detach from the piston due to the weight of the sample holding mechanism. Similarly, even when only the plate-like frame is supported, the silicon wafer is not detached from the sample holding mechanism by its own weight. Furthermore, the wafer does not fall out of the holding mechanism due to a load caused by an acceleration that the holding mechanism including the wafer receives during a normal transfer operation.

  As can be seen from the present embodiment, the greatest feature of the present invention is that when holding the substrate sample, the piston as the holder holds and holds the sample by contacting and pressing only the peripheral edge of the substrate sample. The thickness of the sample holding mechanism located in the region outside the outer peripheral edge of the substrate is made thinner than the substrate sample.

  Hereinafter, an application example of the sample holding mechanism of this example when two silicon wafers having the same diameter are bonded and bonded together (thermocompression bonding) will be described with reference to FIG. FIG. 7A is a schematic cross section of a thermocompression bonding apparatus in the case of performing pattern alignment of two wafers using the sample holding mechanism of this example (alignment operation for superimposing patterns on each wafer vertically). FIG. FIG. 7B is a schematic cross-sectional view showing a state in which the thermocompression operation is continuously performed after the pattern matching operation is completed.

First, as shown in FIG. 7A, the lower wafer 785 is placed on the heating susceptor 750 installed on the base 755. Next, the upper wafer 780 positioned above is held by the sample holding mechanism 700 of this example. Next, a portion close to the outer periphery of the holding mechanism is supported by the support 790. Then, the upper wafer is lowered using the fine movement mechanism 795 connected to the support, and the distance between the upper and lower wafers is brought close to a distance that allows pattern matching. Next, the fine adjustment mechanism is operated to perform pattern matching between the upper and lower wafers. The state of pattern matching during this period is monitored using a monitor system including an infrared microscope head 760 and a monitor 765.

  When the pattern alignment is completed, the fine movement mechanism is operated to further lower the upper wafer and bring it into intimate contact with the lower wafer. Next, as shown in FIG. 7B, the infrared microscope head is retracted, and instead, a press plate 770 for thermocompression is pressed against the upper wafer 780, thermocompression is performed under predetermined conditions, and the upper and lower two wafers are separated. Join. Even when the upper wafer is pressed by the press plate, it is not necessary to remove the sample holding mechanism 700, so that the positional deviation between the upper and lower wafers after pattern matching can be suppressed. Further, since the thermocompression using a press plate larger than the diameter of the wafer to be crimped can be performed while the wafer is mounted on the sample holding mechanism, the reliability of the crimping is improved.

  In this example, the sample holding mechanism applied to the circular substrate sample has been described, but the present invention is not limited to this. The sample holding mechanism shown in the present embodiment can be applied to any substrate sample that has two orthogonal symmetry axes in a planar shape such as an ellipse, square, or rectangle (a shape that is vertically and horizontally symmetrical). In this case, it is necessary to make the shape of the inner peripheral edge of the plate frame correspond to the shape of the substrate sample, not the circle. However, it is not always necessary to have a shape close to a similar shape, and it is sufficient if only the vicinity where the pushing unit is attached has a shape with an appropriate gap from the substrate sample.

  As a second embodiment of the present invention, an embodiment of a “piston” that is a component of a pushing unit will be described below. First, a cylindrical piston shape was used so that the piston could rotate in the cylinder. This is because when the V-shaped groove provided at the tip of the piston comes into contact with the peripheral edge of the substrate sample, the piston rotates so that the V-shaped groove is perfectly aligned with the sample edge. "Is better."

  Furthermore, FIG. 2 shows an embodiment in which a cross-shaped V-shaped groove is provided at the tip of the piston. 2A is a cross-sectional view of a piston 232 having a cross-shaped V-shaped groove at the tip, and FIG. 2B is a view of an end surface showing the cross-shaped V-shaped groove at the tip of the piston. As shown in the figure, two orthogonal V-shaped grooves 238 are provided at the tip of a piston that can rotate in the cylinder.

  The adoption of the cross-shaped V-shaped groove makes it easier to set the substrate sample on the holding mechanism than when it has one V-shaped groove. In the case of a rotatable single V-shaped groove type piston, the direction of the V-shaped groove at the time of setting may not always coincide with the peripheral position of the substrate sample, and the direction adjustment is necessary.

On the other hand, in the case of the cruciform V-shaped groove type of this example, since there are two V-shaped grooves, the “familiarity” between the piston tip and the peripheral edge of the substrate sample during the substrate sample mounting operation can be made easier. . That is, when the tip of the piston comes into contact with the peripheral edge of the substrate sample, unless the direction of the V-shaped groove and the sample peripheral edge is significantly shifted, if the sample peripheral edge enters one of the V-shaped grooves, This is because the direction of the V-shaped groove and the direction of the peripheral edge of the sample are automatically aligned by the rotation of the piston.

  A third embodiment of the present invention is shown in FIG. FIG. 3A is a schematic cross-sectional view of the pushing unit 330. A coil spring 336 is accommodated in the cylinder 334. Further, there is a piston 332 that can slide and rotate in the cylinder, and a V-shaped groove 338 is provided at the tip thereof. Further, two protrusions 333 are symmetrically arranged on the side surface near the piston tip.

  By using these protrusions, the operation of attaching / detaching the substrate sample to / from the sample holding mechanism becomes extremely simple. The above will be described below with reference to FIG. FIG. 3B is a perspective view for explaining an operation of moving the piston (pushing into the cylinder side) that is required when the substrate sample is attached / detached. The protrusion 333 is provided on the side surface of the piston 332.

To move the piston to the cylinder side when loading or unloading the substrate sample, set the bifurcated fork 350 as shown in the figure, then hook the protrusion with the bifurcated fork and move it in the direction of the arrow to move the piston to the cylinder. Can move in the direction. Although not shown, a plurality of forked forks set for each piston can be moved all at once by air pressure, electromagnetic drive method, etc. Automation is also possible.

  A fourth embodiment of the present invention will be described with reference to FIG. 4A is a schematic plan view showing a state in which a rectangular substrate sample 480 is mounted on the sample holding mechanism of this example, and FIG. 4B is an enlarged view of the QQ cross section in FIG. 4A. .

  This example differs greatly from the first embodiment in the shape of the tip of the piston constituting the pushing unit and the number and layout of the pushing units. As shown in FIG. 4B, the pushing unit 430 attached to the plate-like frame 410 includes a cylinder 434, a coil spring 436, and a piston 432 as in the first embodiment. The shape of the tip of the contacting piston is made into a sharp needle shape. Thereby, holding | maintenance is made easy with respect to the board | substrate sample whose peripheral part end surface is a plane.

  Further, in this example, the pushing unit is not placed on the shape symmetry axis of the substrate sample, but is arranged at three points as shown in FIG. In this case, the arrangement of each pushing unit and the spring constant are adjusted so that the vector sum of the pressing force of each piston and the vector sum of each couple are both zero. In the example of FIG. 4 (A), the two coil springs in the pushing unit disposed below are of the same spring constant, and the one coil spring located above is disposed below. A coil spring having a value twice the spring constant of the coil spring was used. As a result, the substrate sample is stably held in a balanced manner in a predetermined region surrounded by the plate-like frame.

  In this example, the description of the same conditions as in Example 1 was omitted. Moreover, the rectangular substrate sample holding method described above is not limited to the above three-point support. Similar to the first embodiment, it is also possible to use a sample holding mechanism in which a total of four pushing units are arranged at corresponding positions on two orthogonal shape symmetry axes of the sample. Further, when the peripheral edge of the substrate sample is chamfered and rounded and convex, a piston having a V-shaped tip as in the first embodiment can be applied.

A fifth embodiment of the present invention will be described with reference to FIG. FIG. 5 is a schematic plan view showing a state in which a rectangular substrate sample 580 is mounted on the sample holding mechanism of this example, as in the fourth embodiment. A total of eight pushing units 530 are disposed on the plate-like frame 510. The edge surface of the peripheral edge of the substrate sample is chamfered and has a rounded convex shape. For this reason, the substrate sample is held by the piston 532 whose tip shape is a V-shaped groove. Since other conditions are similar to those of the other embodiments, detailed description is omitted.

In this embodiment, the spring constants of the coil springs in the eight pushing units are the same, and the approximate figure made up of the arrangement shape of the pushing units and the substrate sample is symmetrical left and right and up and down. Thus, regarding the arrangement of the pushing unit, it is not always necessary to arrange the pushing unit on the symmetry axis even when the substrate sample has two symmetry axes orthogonal to each other.

In this embodiment, when it is assumed that the point of contact between the tip of each piston in the pushing unit and the peripheral edge of the substrate sample is one point-like point, the virtual points obtained by sequentially connecting these virtual points are obtained. When a square is assumed, the centroid position of the substrate sample projected in the plane including the assumed polygon substantially coincides with the centroid position of the assumed polygon.

  A sixth embodiment of the present invention will be described below. Note that a description of the same parts as in the above-described embodiments will be omitted. FIG. 6 is a plan view showing an example in which an indeterminate substrate sample 680 whose sample has no symmetrical axis is held by the sample holding mechanism of the present invention. The sample holding mechanism is composed of a plate-like frame 610 and four pushing units 630 attached thereto.

  A V-shaped groove is provided at the tip of each piston 632, and each piston presses the end surface of the peripheral edge of the sample almost vertically as in the first to fifth embodiments. In order to hold the substrate sample in a balanced manner as shown in the figure, it is necessary to individually adjust the pressing force of each piston. That is, the pressing force of each piston is set so that the total sum (vector sum) of the forces that each piston presses on the edge of the sample peripheral edge and the total sum (vector sum) of the couples acting on the sample surface become zero. Need to be adjusted individually.

  In the embodiment shown in FIG. 6, the individual pressing forces of the two pistons 632 located on the upper side of the drawing need to be larger than the individual pressing forces of the pistons 632 located on the lower side of the drawing. In order to adjust the pressing force of each piston, the spring constant of the coil spring or the amount of deflection of the spring can be adjusted, or both the spring constant and the amount of deflection can be adjusted. It can be held stably in the area surrounded by the body.

  In Examples 1 to 6 described above, the shape of the outer peripheral edge of the plate-like frame of the sample holding mechanism is circular or rectangular. However, the shape is not limited to this and depends on the use of the sample holding mechanism. It can be a shape. Furthermore, the shape of the inner peripheral edge of the plate-like frame body is sufficient as long as an empty space is secured so that the substrate sample can be held in the region surrounded by the plate-like frame body. Further, if the desired stroke amount of the piston is ensured at the place where the pushing unit is to be arranged, the shape of the inner edge portion of the plate-like frame body does not necessarily have to be substantially similar to the shape of the substrate sample.

  Furthermore, in Examples 1 to 6 described above, the pressing direction of the piston is made substantially perpendicular to the end surface of the outer edge of the substrate sample, but the piston tip exceeds the frictional drag at the contact point with the sample end surface. It is possible to push the end face diagonally as long as it is parallel to the sample plane (provided that the vector sum of the pressing force and the vector sum of the couple are both zero) as long as it does not occur .

  Needless to say, if the plate-like frame can be provided with a cavity having the same dimensions as the inner diameter of the cylinder that accommodates the piston, this cavity can be substituted for the cylinder. Furthermore, the pushing unit can be configured as follows. That is, in order to prevent the piston from falling out of the cylinder, a step is provided on the side surface of the piston stored in the cylinder, and a step on the side surface of the piston is received at part or all of the open end of the cylinder. A pushing unit may be configured by providing a “brief stopper”.

In the pushing unit configured as described above, it is possible to apply a predetermined amount of the restoring force of the coil spring to the piston in an initial state where the step of the piston is in contact with the “brief stopper”. If this is used, a desired pressing force can be obtained only by pushing back the piston with a relatively short stroke even when the substrate sample is set in the sample holding mechanism using a coil spring having a weak spring constant.

Furthermore, the constituent material of the sample holding mechanism of the present invention is not particularly limited as long as function construction is possible. When used in a processing step that requires heating, a metal material or a ceramic material, or a combination of the above two materials is used.

  INDUSTRIAL APPLICABILITY The present invention can be used to handle a sample having a different diameter that is smaller than a standard size that can be handled (such as a wafer diameter) in the same manner as a standard size sample, particularly in an automatic / semi-automatic electronic device manufacturing process apparatus. It can also be used for alignment operation of two substrate samples in a bonding apparatus for pressure bonding.

(A) Schematic perspective view of sample holding mechanism in Example 1 (B) Schematic plan view of sample holding mechanism in Example 1 (C) SS sectional enlarged view in FIG. 1 (B) (A) Cross section of piston (B) End view of piston tip (A) Schematic cross-sectional view of the pushing unit (B) Perspective view explaining the push-in operation of the piston (A) Schematic plan view of sample holding mechanism in Example 4 (B) QQ cross-sectional enlarged view in FIG. Schematic plan view of the sample holding mechanism in Example 5 Schematic plan view of the sample holding mechanism in Example 6 (A) Schematic cross-sectional view of a thermocompression bonding apparatus using the sample holding mechanism according to the present invention (B) Schematic cross-sectional view during a crimping operation in a thermocompression bonding apparatus using the sample holding mechanism according to the present invention (A) Schematic cross-sectional view of a conventional wafer bonding apparatus using a receiving edge method (B) Schematic cross-sectional view of a conventional wafer bonding apparatus using an electrostatic chuck

Explanation of symbols

110, 410, 510, 610—plate-like frame 120—peripheries 130, 330, 430, 530, 630—bushing units 132, 232, 332, 432, 532, 632—pistons 134, 334 434-cylinder 136-spring bodies 138, 238, 338-V-shaped groove 140-areas 180, 480, 580, 680 surrounded by plate-like frame bodies-silicon wafers 190, 195--symmetric in shape Axis 333—protrusions 336, 436—coil spring 350—two fork 700—sample holding mechanism 750,850—heating susceptor
755--bases 760, 860--infrared microscope heads 765, 865--monitor 770--press plate 780--upper wafer 785--lower wafer 790--supports 795,895--fine movement mechanism 800-- Sample holder 805-receiving edge 810-electrostatic chuck 815-electrostatic chuck power supply 880-upper sample wafer 882-monitor area 885-lower sample wafer

Claims (7)

A sample holding mechanism configured to hold a substrate sample by a pushing unit in a region surrounded by a plate-like frame body, which is composed of a plate-like frame body and a pushing unit,
The pushing unit includes a cylinder closed at one end, a spring body accommodated in the cylinder, a V-shaped groove or a cross-shaped V at a piston tip that slides and rotates in the cylinder and protrudes from an open end of the cylinder. It is composed of a piston with a groove, and when the compression of the spring body by the piston starts, a part of the piston protrudes from the open end of the cylinder by a predetermined length,
Pushing unit in a state in which the axial line on which the piston slides and the front surface (or back surface) of the plate-like frame body are parallel to each other and a predetermined length of the piston protrudes into a region surrounded by the plate-like frame body 3 or more parts are embedded or fixed in the plate frame,
Holding the substrate sample by pressing the outer peripheral edge of the substrate sample at the tip of the piston by the restoring force of the spring body of the pushing unit,
In addition, the pushing unit is arranged at a position where the sum of the forces (vector sum) that presses the end faces of the outer peripheral edge of the substrate sample and the sum of the couple forces acting on the substrate sample (vector sum) are both zero. ,
Furthermore, an area sandwiched between two virtual planes defined by a virtual plane including the front surface of the substrate sample and a virtual plane including the back surface of the substrate sample mounted in the area surrounded by the plate-like frame body A sample holding mechanism in which a plate-like frame (including a pushing unit) is accommodated. The sample holding mechanism according to claim 1, wherein a tip shape of the piston is a sharp needle shape. The sample holding mechanism according to claim 1 or 2, wherein the spring body provided in the pushing unit is a coil spring. Protruding projections or grooves for fork-like jigs are provided on the exposed side surface of the piston while holding the substrate sample,
A piston having a V-shaped groove or a cross-shaped V-shaped groove is characterized in that two or four protrusions or two or four grooves are provided at a position corresponding to a valley line of the V-shaped groove. The sample holding mechanism according to any one of claims 1 to 3. The substrate sample to be held has two orthogonal planar shape symmetry axes, and a pushing unit is disposed at a predetermined position on the extension line of the two orthogonal planar shape symmetry axes of the substrate sample. The sample holding mechanism according to any one of claims 1 to 4, wherein the sample holding mechanism is held. Assuming that the contact point between the tip of each piston and the outer peripheral edge of the substrate sample is one point, assuming a polygon obtained by connecting these assumed points sequentially,
When the center of gravity of the substrate sample held by each piston is projected into a plane including the assumed polygon, the center of gravity of the substrate sample exists inside the assumed polygon, and preferably the projected center of gravity of the substrate sample and The sample holding mechanism according to any one of claims 1 to 4, wherein the center of gravity of the assumed polygon substantially matches. The sample holding mechanism according to any one of claims 1 to 6, wherein the sample holding mechanism is configured by combining a metal material, a ceramic material, or the two materials.