JP6820000B2 - Wafer expansion device - Google Patents

Description

The present invention relates to a wafer expansion device that separates and expands a diced wafer into chips.

A semiconductor wafer in which a predetermined electric circuit is formed through a film forming process is cut into individual chips in a dicing process, and then the wafer is placed on the wafer to prevent damage due to interference between the chips and to facilitate pickup. By uniformly expanding the dicing film in the XY directions (planar direction) (expanding), the chips are divided into predetermined intervals. An example of expanding the wafer after dicing is shown in FIGS. 16A and 16B.

As shown in FIG. 16A, the dicing wafer 103 is attached to the dicing film 102 having adhesiveness and expandability, which is stretched on the dicing frame 101 which is an annular frame body. The dicing frame 101 is fixed on the elevating stage 106 of the wafer expansion device 105 with a holding plate (not shown). Then, as shown in FIG. 16B, the dicing film 102 is pushed up from below by the ascent of the elevating stage 106 (direction of arrow 111) to expand the dicing wafer 103, thereby dividing the diced wafer 103 into the chips 103a at uniform intervals. Can be done. After that, the wafer 103 and the dicing film 102 divided into the chips are sandwiched and fixed by fitting the inner ring 107 and the outer ring 108 from above and below (in the direction of arrow 112). Then, the protruding portion (side surface side of the elevating stage 106) of the dicing film 102 along the outer ring 108 is cut by a cutter and conveyed to the pickup process.

Conventionally, when the dicing film 102 to which the dicing wafer 103 is attached as described above is expanded, the outer ring is manually fitted into the inner ring 107 to hold the expansion, and the dicing film 102 protrudes from the dicing film 102. Unnecessary parts were cut with a cutter, but there were cases where the chips were damaged due to contact between the chips during the fitting and cutting operations. In order to solve such a problem, a wafer expansion device capable of fitting an outer ring and cutting a dicing film continuously and stably is disclosed (see Patent Document 1).

Utility Model Registration No. 3168329

The wafer expansion device described in Patent Document 1 facilitates fitting of the outer ring and cutting of the dicing film. However, after fixing the dicing film expanded by the inner ring and the outer ring, the outer ring is attached to the ring holding portion ( In order to remove it from the ring holder), an additional operation of lowering the elevating stage by a certain distance is required. Further, since the cut portion of the dicing film is slackened due to the lowering of the elevating stage, it is necessary to perform operations such as raising the elevating stage again before cutting, which hinders rapid processing.

An object of the present invention is to provide a wafer expansion device that quickly and accurately divides and expands a dicing wafer attached to a film into each chip.

In order to solve the above problems, the wafer expansion device according to the present invention can elevate and expand a film on which a diced wafer is attached to the front surface by pushing it up from the back surface to expand the wafer and divide the wafer into a plurality of chips. The film is fitted on the outer periphery of the elevating stage, the first ring detachably provided on the elevating stage, and the first ring that has reached a predetermined position by ascending the elevating stage. A ring holding that detachably holds the second ring so that the film is placed between the second ring and the outer periphery of the first ring at which the second ring has reached the predetermined position. includes a part, wherein the ring holding part is pivotally connected to the apparatus main body provided with the elevation stage, the said second ring held in above the elevation stage by the rotation operation the It is a configuration that is positioned at the diced position where it is diced to the ring of 1 .
Further, in the wafer expansion device according to the present invention, the ring holding portion is a stretchable pressing portion that holds the second ring by applying a predetermined pressing force to the outer circumference of the second ring from the radial direction. It can be configured to have.

According to such a configuration , the second ring sandwiches the film on the outer circumference of the first ring that has reached a predetermined position by raising the elevating stage while the ring holding portion is positioned at the fitting position. And fit. After the second ring is fitted to the first ring, the holding of the second ring by the ring holding portion can be released at the same time as the rotation operation of the ring holding portion.
Further, since the ring holding portion has a stretchable pressing portion that is held on the outer periphery of the second ring by a predetermined pressing force from the radial direction, after the second ring is fitted to the outer periphery of the first ring. Since the second ring can be easily removed from the ring holding portion without lowering the elevating stage, the dicing film to which the wafer divided and expanded into each chip is attached after cutting the film is applied. It can be taken out quickly and accurately. The predetermined pressing force is such that the second ring can be held and can be easily removed after being fitted with the first ring.

In the wafer expansion device according to the present invention, the pressing portion has a pressing member that presses the outer periphery of the second ring from the radial direction and an elastic member that urges the pressing member in the radial direction. be able to.

According to such a configuration, the pressing portion has a pressing member that presses the outer circumference of the second ring from the radial direction and an elastic member that urges the pressing member in the radial direction. The second ring fitted to the first ring can be easily removed without requiring a descent operation or the like.

In the wafer expansion device according to the present invention, a plurality of the pressing portions may be provided at predetermined intervals in the circumferential direction.

According to such a configuration, since the pressing portions are provided at predetermined intervals in the circumferential direction, the second ring can be held at a predetermined pressing force from the radial direction.

In the wafer expansion device according to the present invention, the ring holding portion can be configured to rotate between a fitting position for fitting the first ring and a standby position for mounting the second ring. ..

According to such a configuration, the ring holding portion rotates to the fitting position where the first ring is fitted and the standby position where the second ring is mounted, so that the second ring can be fitted and fitted. Subsequent removal can be done quickly.

According to the wafer expansion device according to the present invention, Li ring holding portion is held by a predetermined pressing force from the radial direction to the outer periphery of the second ring, because it has a retractable pressing portion, the second ring is the when mounted on an outer periphery of the first ring can be released easily its holding said second ring from-ring holder. Thus, division into chips, can be taken out off Irumu that adhering a wafer which has expanded quickly and easily.

FIG. 1 is a perspective view of a wafer expansion device according to an embodiment of the present invention. FIG. 2A is a partial cross-sectional view of the wafer expansion device shown in FIG. 1 (No. 1). FIG. 2B is a partial cross-sectional view of the wafer expansion device shown in FIG. 1 (No. 2). FIG. 3A is a cross-sectional view of the outer ring holder. FIG. 3B is a sectional view taken along the line AA of FIG. 3A showing the outer ring holder. FIG. 4 is an enlarged view of part B of FIG. 3B. FIG. 5A is a front view of a film cutter device attached to and used in the wafer expansion device according to the present embodiment. FIG. 5B is a front view of the film cutter device mounted on the wafer expansion device. FIG. 5C is a perspective view of the film cutter device. FIG. 6A is an enlarged view of the cutter operation unit of the film cutter device (No. 1). FIG. 6B is an enlarged view of the cutter operation unit of the film cutter device (No. 2). FIG. 7 is a partially enlarged view of the periphery of the cutter blade of the cutter operation unit. FIG. 8 is a partial explanatory view of an operation of expanding a wafer after dicing to each chip by the wafer expansion device according to the embodiment of the present invention (No. 1). FIG. 9 is a partial explanatory view of an operation of expanding the dicing wafer to each chip by the wafer expansion device following FIG. 8 (No. 2). FIG. 10 is a partial explanatory view of an operation of expanding the dicing wafer to each chip by the wafer expansion device following FIG. 9 (No. 3). FIG. 11 is a partial explanatory view of an operation of expanding the wafer after dicing to each chip by the wafer expansion device following FIG. 10 (No. 4). FIG. 12 is a partial explanatory view of an operation of expanding the wafer after dicing to each chip by the wafer expansion device following FIG. 11 (No. 5). FIG. 13 is a partial explanatory view of an operation of expanding the wafer after dicing to each chip by the wafer expansion device following FIG. 12 (No. 6). FIG. 14 is a partial explanatory view of an operation in which the film cutter device is attached to the wafer expansion device in order to cut outside the predetermined range of the dicing tape expanded by the wafer expansion device, following FIG. 13 (FIG. 14). Part 7). FIG. 15 is a perspective view of the divided wafer on the dicing film after the outside of the predetermined range of the dicing tape expanded by the wafer expansion device is cut by the film cutter device. FIG. 16A is a schematic view after dicing and before wafer expansion (conventional view). FIG. 16B is a schematic view of the expanded wafer (conventional view).

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

The wafer expansion according to the embodiment of the present invention is configured as shown in FIG.

In FIG. 1, the wafer expansion device 11 includes a device main body 12 which is a box body having a protruding step for operation, a dicing frame holding plate 13 which is openably and closably connected to the device main body 12, and the device main body 12 as well. It has an outer ring holding mechanism 15 (ring holding portion) connected so as to be openable and closable, an elevating stage 16 housed in the apparatus main body 12, and an operating portion 17 for operating the apparatus.

The device main body 12 is provided with an operation unit 16 including an operation button, an operation switch, etc. on the upper surface 12a of the protruding step, and the elevating stage 16 moves up and down from the inside of the device main body 12 on the upper surface 12b of the device main body 12. A circular opening 19 is formed for this purpose. At the end of the upper surface 12b on the upper surface 12a side, a tightening portion 18 for tightening and fixing the dicing frame holding plate that presses the dicing frame 30 (see FIG. 8) against the upper surface 12b is provided. Further, a locking portion 20 for locking the outer ring holding mechanism 15 is provided inside the upper surface 12b from the tightening portion 18 at a position adjacent to the tightening portion 18. A pair of pressing plate opening / closing shaft portions 13a and 13b (see FIG. 10) that allow the dicing frame pressing plate 13 to be opened / closed at the end of the upper surface 12b on the side facing the tightening portion 18 and the locking portion 20 (see FIG. 10). Is provided, and on the outside thereof, a holding mechanism opening / closing shaft portion 15a that enables the outer ring holding mechanism 15 to be opened / closed is provided.

The dicing frame holding plate 13 is a rectangular frame having a circular opening in the center, and a rod-shaped lever 13c is attached to the tip opposite to the side where the holding plate rotation shafts 13a and 13b are provided. There is. By operating the lever 13c with respect to the tightening portion 18, the dicing frame 30 can be pressed and fixed to the device main body portion 12 by the dicing frame holding plate 13.

The outer ring holding mechanism 15 is a rectangular frame body 15b, has a circular opening in the center, and holds the outer ring 23 (second ring) along the opening, and has an octagonal outer circumference. The ring holder 26 is attached. Then, three leg portions 15c, 15d, 15e connected to the holding mechanism rotation shaft portion 15a, and a locking leg portion 15f for locking with the locking portion 20 are provided. When the locking leg portion 15f is locked to the locking portion 20, the outer ring holder 26 is positioned at a predetermined height from the upper surface 12 by the leg portions 15c, 15d, 15e and the locking leg portion 15f. become. The outer ring 23 is a circular ring-shaped member, and as will be described later, the outer ring 23 is fitted to the outer periphery of the inner ring 25 (first ring), which is a circular ring-shaped member, with a dicing film 31 interposed therebetween. (See FIG. 15). As will be described later, the inner ring 25 and the outer ring 23 are relatively tightly fitted so that the wafer 32 is divided into the chips 32a and the expanded state is held together with the expanded dicing film 31. The diameter (radius) of the outer circumference of the inner ring 25 and the diameter (radius) of the inner circumference of the outer ring 23 are almost the same. The inner ring 25 and the outer ring 23 are ring-shaped members formed of elastic synthetic resin or the like. The dicing film 31 is a tape having expandability for protecting and fixing the wafer during the dicing process of the semiconductor wafer and holding it until the pickup process.

The outer ring holder 26 will be described with reference to FIGS. 1, 3A, 3B and 4. The outer ring holder 26 is an octagonal frame having a circular opening in the center, and is four outer sides 26a out of eight outer sides 26a, 26b, 26c, 26d, 26e, 26f, 26g, and 26h. , 26c, 26e, 26g are fastened to the frame body 15b of the outer ring holding mechanism 15 (see FIG. 1). As shown in FIG. 3A, a circular opening is provided inside the frame portion of the six outer sides 26b, 26c, 26d, 26f, 26g, 26h of the outer ring holder 26 to hold the outer ring 23. Plungers 35a, 35b, 35c, 35d, 35e, and 35f (appropriately collectively referred to as "plungers 35") are provided as pressing portions for applying radial pressing force toward the center. As shown in FIG. 4, the plunger 35, which is a pressing portion, has a plunger pin 36a, which is a pressing member that presses the outer circumference of the outer ring 23 located at a predetermined gap in the opening, and a plunger pin 36a, which is the outer ring 23. It is composed of a plunger expansion / contraction portion 36b that biases in the radial direction toward the outer circumference. The plunger expansion / contraction portion 36b is formed of a compression spring which is an elastic member. As shown in FIG. 4, the tip of the plunger pin 36a can be expanded and contracted from the position of L1 to the position of L2, and when holding the outer ring 23, it is at the position of L3 between L1 and L2. The pressing force of the outer ring 23 by the plunger 35 is such that the outer ring 23 can be held, and when the outer ring 23 is fitted to the inner ring 25, the outer ring 23 is rotated by rotating the outer ring holding mechanism 15. The plunger 35 (the outer ring holder 26 is set so as to be easily released from the holding.

The elevating stage 16 will be described with reference to FIGS. 1, 2A and 2B. The elevating stage 16 is formed by an elevating mechanism 38 including an elevating drive motor 37, an elevating shaft 38a, an auxiliary shaft 38b, etc. provided inside the apparatus main body 12, and is formed by an opening 19 of the upper surface 12b of the apparatus main body 12. It can move up and down between a position and a predetermined position above. By expanding the dicing film 31 (see FIG. 8) by raising the elevating stage 16, the wafer 32 (shown by a chain line on FIG. 1) on the dicing film 31 can be divided into chips and expanded. The elevating stage 16 is a truncated cone-shaped elevating table, and a step 16a is formed on the outer periphery of the upper surface, and the inner ring 25 is mounted on the step 16a. As will be described later, the dicing frame 30 to which the dicing film 31 to which the dicing wafer 32 is attached is attached to the upper surface 12b around the opening 19 where the elevating stage 16 is located is fixed by the dicing frame holding plate 13. Will be done. The dicing film 31 is expanded by raising the elevating stage 16, the wafer 32 is divided into the chips 32a at equal intervals, and the inner ring 25 mounted on the step 16a on the outer periphery of the elevating stage 16 is attached to the elevating stage 16. A dicing film 31 is interposed inside the outer ring holder 26 located above the above. Then, the outer ring 23 is easily released from the holding by the outer ring holder 26 by the rotation of the outer ring holding mechanism 15 (see FIG. 13).

Next, the film cutter device 41 for cutting off the remaining portion of the dicing film 31 protruding from the fitting portion between the outer ring 23 and the inner ring 25 is shown in FIGS. 5A, 5B, 5C, 6A, 6B and 6B. This will be described with reference to FIG. In the present embodiment, the film cutter device 41 is retrofitted to the wafer expansion device 11, and after the wafer 32 is divided and expanded into a plurality of chips 32a by expanding the dicing film 31 by raising the elevating stage 16, the outer ring The holding mechanism 15 is rotated to move it to the standby position (open position), and the film cutter device 41 is mounted on the surface of the dicing frame holding plate 13 fixed to the device main body 12. The film cutter device 41 includes a base 42a, which is a ring-shaped thin plate having an opening at the center, and a slide base 42b, which is a ring-shaped thin plate having an opening at the center, located above the base 42a. , A cutter operating portion 43 that slides along the inner circumference of the slide base 42b on the opening side, and four axially shaped legs 45a, 45b, 45c, 45d provided around the lower part of the base 42a. Have. The base 42a and the slide base 42b are vertically connected to each other with a predetermined interval by a connecting metal fitting. The legs 45a, 45b, 45c, 45d (appropriately collectively referred to as "legs 45") are threaded rod-shaped shafts, and the height adjusting screws 46a, 46b, 46c, 46d (as appropriate). As appropriate, "adjustment screws 46") are screwed together. By adjusting the height of the adjusting screw 46, the height of the cutter blade 47, which will be described later, can be adjusted to an appropriate position. The legs 45a, 45b, 45c, 45d adjusted to have a predetermined height by the adjusting screw 46 are provided with four holes 13d, 13e, 13f, 13g (FIGS. 10 and 14) formed in the dicing frame holding plate 13. By inserting it into (see), the film cutter device 41 can be used.

The cutter operation unit 43 of the film cutter device 41 is a device that cuts an unnecessary portion of the dicing film 31 with a cutter blade 47 while sliding along the inner peripheral side of the operating table 42b. The cutter operation unit 43 houses a plate-shaped slide plate 48 that slides and moves on the operating table 42b and a cutter blade 47, and has a frame-like shape that slides across the slide plate 48 and the operating table 42b. The slide support portion 49, the cylindrical columns 50a and 50b erected on the left and right of the upper surface of the slide plate 48, the insertion shafts 51a and 51b that are inserted and moved into the cylindrical columns 50a and 50b, and the insertion shafts 51a and 51b are fixed by screwing. A piece-shaped support plate 52 to support, a cylindrical member 53 having a spiral groove formed between the insertion shafts 51a and 51b and screwed to the support plate 52, and a cylindrical member inserted through the slide plate 48 at one end. A rotating shaft 56 inserted into the 53 and provided with a cutter blade mounting portion 55 having a cutter blade 47 at the other end, and a spherical operating knob portion mounted on the support plate 52 on the opposite side of the cylindrical member 53. It is equipped with 57.

The rotating shaft 56 inserted into the cylindrical member 53 is formed with an engaging portion (not shown) that moves along a spiral groove formed on the inner peripheral surface of the cylindrical member 53, and the cylindrical member 53 moves up and down. When moving in the direction, the engaging portion moves along the spiral groove, and the rotation shaft 56 rotates. By changing this vertical movement to rotational movement, when the operation knob portion 57 of FIG. 6A is pushed down, the cylindrical member 53 moves downward, the rotation shaft 56 rotates, and the cutter blade 47 is in the standby position (FIG. It will rotate from 6A) to the cutting position (FIG. 6B). The details of the cutter blade 47 and the dicing film 31 at the cutting position of FIG. 6B are shown in FIG. In FIG. 7, the cutter blade 47 attached to the tip of the cutter blade attachment portion 55 is inserted into the dicing film 31 by the rotation of the rotation shaft 56 by pushing down the operation knob portion 57. Due to the fitting of the outer ring 23 and the inner ring 25, a groove portion 16b is formed at the cutting position of the dicing tape 31 protruding from the fitting portion over the entire outer circumference of the elevating stage 16 for easy cutting. The groove portion 16b is directly below the step 16a on which the inner ring 25 is mounted. When the cutter blade 47 is at the position shown in FIG. 7, the film cutter device 41 is slid and moved in the circumferential direction of the workbench 42b while the cutter operation unit 43 is pressed down, and the cutter blade 47 fits the cutter blade 47. The dicing tape 31 protruding from the joint portion can be cut and the excess portion can be separated.

Next, the operation of the wafer expansion device 11 according to the embodiment of the present invention will be described below with reference to the drawings (FIGS. 8 to 15, etc.).

In FIG. 8, when the wafer 32 is separated and expanded by the wafer expansion device 11, the outer ring 23 is attached to the outer ring holder 26 with the outer ring holding mechanism 15 in the standby state (open state) as an initial preparation. The outer ring holder 26 holds the outer ring 23 by applying a predetermined pressing force in the radial direction with respect to the outer peripheral surface of the outer ring 23 by six plungers 35a to 35f. Next, the inner ring 25 is attached to the step 16a formed on the outer peripheral end of the upper surface of the elevating stage 16. Further, a dicing frame 30 to which the dicing film 31 to which the diced wafer 32 is attached is attached is arranged around the opening 19 of the upper surface 12b of the apparatus main body 12. At this time, the wafer 32 is arranged so as to be located directly above the elevating stage 16. FIG. 9 shows a wafer expansion device 11 when the outer ring 23, the inner ring 25, and the dicing frame 30 are arranged and mounted at the predetermined positions.

Next, in order to fix the dicing frame 30 arranged at a predetermined position on the upper surface 12b of the apparatus main body 12 (see FIG. 9), the dicing frame holding plate 13 is obliquely raised as shown in FIG. From the standby position (open position) to the holding position (closed position) at which the opening 19 is closed, the holding plate opening / closing shafts 13a and 13b are rotated as rotation axes. After rotating to the holding position, the lever 13c is operated to tighten the tightening portion 18, and the dicing frame 30 is fixed to the device main body portion 12. In addition, four holes 13d, 13e, 13f, and 13g are formed in the vicinity of the four corners of the dicing frame holding plate 13 in order to insert and attach the film cutter device 41 described later.

Next, as shown in FIG. 11, the holding mechanism opening / closing shaft portion 15a is engaged as a rotation axis from the standby position (open position) in the state where the outer ring holding mechanism 15 is raised to the locking position in which the outer ring holding mechanism 15 is in a substantially horizontal state. Rotate to the stop position (closed position). When the outer ring holding mechanism 15 rotates to the locking position, the rod-shaped locking leg portion 15f is inserted into the hole of the locking portion 20 provided on the upper surface 12b of the device main body portion 12, and the fitting formed inside the hole is formed. Lock with a part (not shown). The locking leg portion 15f locked by the fitting portion is manually moved in the horizontal direction to release the locking.

Next, the elevating stage 16 is raised to a predetermined position by operating the operation switch of the operation unit 17 provided on the upper surface 12a of the device main body portion 12. Since the dicing frame 30 is fixed around the opening 19 of the upper surface 12b of the apparatus main body 12 by the dicing frame holding plate 13, the dicing film 31 having expandability is stretched by the raising of the elevating stage 16, and the wafer is stretched. The portion to which 32 is attached expands in the XY direction (horizontal direction). Then, as shown in FIG. 12, the diced wafer 32 is also expanded in the XY directions and divided into chips at predetermined intervals. When the elevating stage 16 is raised, the inner ring 25 and the outer ring 23 are fitted with the dicing film 31 sandwiched between them at the same time as the expansion and division of the wafer 32 by the expansion of the dicing film 31 (see FIG. 7). The inner ring 25 mounted on the step 16a formed on the outer periphery of the upper surface of the elevating stage 16 rises together with the elevating stage 16 and is held by the outer ring holder 26 of the outer ring holding mechanism 15 at the locking position. It fits on the inner circumference of 23.

As described above, the outer ring holder 26 is provided with six plungers (pressing portions) 35a to 35f at predetermined intervals in the circumferential direction of the opening thereof (see FIG. 3A), and the plungers 35a to 35f are used to describe the outer ring holder 26. A predetermined pressing force is applied in the radial direction to the outer circumference of the outer ring 23 located in the opening to hold the outer ring 23 (see FIG. 4). When the inner ring 25 and the outer ring 23 are fitted by raising the elevating stage 16, the diameter (radius) of the outer circumference of the inner ring 25 and the diameter (radius) of the outer ring 23 are substantially the same, so that the dicing film 31 is in between. Will be firmly fitted with the. From this, when the outer ring holding mechanism 15 at the locking position (closed position) in FIG. 12 is rotated to the standby position (open position) shown in FIG. 13, the outer ring 23 can be easily held by the outer ring holder 26. It is released and the fit between the inner ring 25 and the outer ring 23 is maintained. Since the inner ring 25 and the outer ring 23 are fitted with the expanded dicing film 31 sandwiched between them, the chips 32a of the wafer 32 can be separated and maintained in the expanded state. As shown in FIG. 14, in order to remove the portion of the dicing film 31 expanded by raising the elevating stage, which is located on the side surface side of the elevating stage 16 and protrudes from the fitting position of the inner ring 25 and the outer ring 23. , The film cutter device 41 is installed on the upper surface 12b of the device main body 12.

In FIG. 14, the film is formed in the four holes 13d, 13e, 13f, and 13g formed in the dicing frame holding plate 13 which is fixed to the tightening portion 18 of the apparatus main body 12 by the operation of the lever 13c and is in a closed state. The four legs 45a, 45b, 45c, 45d of the cutter device 41 are inserted, respectively, and the installation height is adjusted by the adjusting screws 46a, 46b, 46c, 46d inserted in the legs, and the cutter blade at the time of cutting 47 is set at the optimum height position for cutting the dicing film 31 (see FIG. 7). The film cutter device 41 uses the legs 45a, 45b, 45c, 45d whose installation heights are adjusted by the adjusting screws 46a, 46b, 46c, 46d as described above, and the four holes 13d of the dicing frame holding plate 13. The setting is made by inserting into 13e, 13f, and 13g. Next, by pushing down the operation knob portion 57 of the cutter operation portion 43, the cutter blade 47 is rotated from the standby position (FIG. 6A) to the cutting position (FIGS. 6B and 7). As shown in FIG. 7, the tip of the cutter blade 47 rotated to the cutting position reaches the inside of the groove portion 16b formed over the outer circumference of the elevating stage 16, so that the operation knob portion 57 is placed on the inner circumference of the operating table 42b. By sliding the dicing film 31 around the outer ring 23, the dicing film 31 directly under the outer ring 23 can be cut on the side surface of the elevating stage 16 over the entire circumference of the outer ring 23.

FIG. 15 shows a perspective view of the wafer 32 divided and expanded into a plurality of chips 32a on the dicing film 31 after the unnecessary dicing film 31 directly under the outer ring 23 is cut by the film cutter device 41. In FIG. 15, the diced wafer 32 expanded together with the dicing film 31 is divided into chips 32a at predetermined intervals, and the end portion of the dicing film 31 is fitted with the outer ring 23 and the inner ring 25 (shown by the broken line). It is sandwiched between the parts. In this way, the portion of the dicing film 31 that protrudes from the outer ring 23 can be cut directly under the outer ring 23 by the film cutter device 41, so that there is almost no uncut portion, and the dicing film 31 is re-cut as in the conventional case. It is possible to quickly proceed to the next step of wafer processing without the trouble of cutting with a cutter or the like.

According to the wafer expansion device 11 according to the present embodiment, the dicing film 31 and the wafer 32 are expanded by raising the elevating stage 16, and at the same time, the inner ring 25 and the outer ring 23 mounted on the elevating stage 16 are fitted. , The fitting operation of the outer ring after expanding the wafer as in the conventional case is not required. Further, after the inner ring 25 and the outer ring 23 are fitted together, the outer ring 23 can be removed from the outer ring holder 26 as it is, and it is necessary to lower the elevating stage once and then remove the outer ring 23 as in the conventional case. Therefore, the work is simple, quick, and accurate.

Although some embodiments of the present invention and modified examples of each part have been described above, the embodiments and modified examples of each part are presented as examples, and the scope of the invention is not intended to be limited. .. These novel embodiments described above can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the invention described in the claims.

In the wafer expansion device according to the present invention, since the outer ring holding portion has a stretchable pressing portion that is held on the outer periphery of the outer ring by a predetermined pressing force from the radial direction, the outer ring is fitted to the outer periphery of the inner ring. In such a case, the outer ring can be easily released from the outer ring holding portion and removed, so that the work is simple and easy and the next processing step can be quickly proceeded. However, it is useful as a die-dipped wafer expansion device.

11 Wafer expansion device 12 Device body 13 Dicing frame holding plate 13c Lever 15 Outer ring holding mechanism (ring holding part)
16 Elevating stage 16a Step 16b Groove 17 Operation part 18 Tightening part 19 Opening 20 Locking part 23 Outer ring (second ring)
25 Inner ring (first ring)
26 Outer ring holder 30 Dicing frame 31 Dicing film (film)
32 Wafer 32a Chip 35 (35a to 35f) Plunger 37 Motor 38 Elevating mechanism 41 Film cutter device 43 Cutter operation part 45 (45a to 45d) Leg part 46 (46a to 46d) Adjusting screw 47 Cutter blade 48 Slide plate 49 Slide support part 57 Operation knob

Claims (5)

An elevating stage that pushes up the film on which the diced wafer is attached to the front surface from the back surface to expand it, and divides the wafer into multiple chips to expand it.
A first ring detachably provided on the elevating stage and
A second ring that fits the film in between on the outer circumference of the first ring that has reached a predetermined position by raising the elevating stage.
As the second ring is篏合in between the film to the outer periphery of the first ring to reach the predetermined position, it has a ring holding part that detachably holds the second ring ,
The ring holding portion is rotatably connected to the main body of the device provided with the elevating stage, and the second ring held above the elevating stage is fitted to the first ring by the rotating operation. Wafer expansion device that is positioned at the matching position . The wafer expansion device according to claim 1, wherein the ring holding portion has a stretchable pressing portion that holds the second ring by applying a predetermined pressing force to the outer periphery of the second ring from the radial direction. The wafer expansion device according to claim 2 , wherein the pressing portion includes a pressing member that presses the outer periphery of the second ring from the radial direction and an elastic member that urges the pressing member in the radial direction. The wafer expansion device according to claim 2 or 3 , wherein a plurality of the pressing portions are provided at predetermined intervals in the circumferential direction. Said ring retaining portion, said fitting position, the wafer expansion device according to any one of claims 1 to 4 pivots between a standby position for mounting said second ring.

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