JP2002237516A - Wafer protective case - Google Patents

Wafer protective case

Info

Publication number
JP2002237516A
JP2002237516A JP2001030894A JP2001030894A JP2002237516A JP 2002237516 A JP2002237516 A JP 2002237516A JP 2001030894 A JP2001030894 A JP 2001030894A JP 2001030894 A JP2001030894 A JP 2001030894A JP 2002237516 A JP2002237516 A JP 2002237516A
Authority
JP
Japan
Prior art keywords
wafer
semiconductor wafer
protection case
portion
wf
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001030894A
Other languages
Japanese (ja)
Inventor
Akishi Okuhara
晃史 奥原
Original Assignee
Seiko Epson Corp
セイコーエプソン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, セイコーエプソン株式会社 filed Critical Seiko Epson Corp
Priority to JP2001030894A priority Critical patent/JP2002237516A/en
Publication of JP2002237516A publication Critical patent/JP2002237516A/en
Withdrawn legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a wafer protective case by which the quality of a wafer is kept accompanying easy handling, at carrying and operating of a semiconductor wafer. SOLUTION: This wafer protective case 10 is provided with a hinge part 11 and attaching/detaching parts 12 so as to be openable. One semiconductor wafer WF is housed, so as to expose the integrated circuit area CA of the main surface and to wrap all the peripheral edge part EG with a groove 13. The peripheral edge protective form of housing the semiconductor wafer so as to warp the entire wafer peripheral edge part is provided for each semiconductor wafer, and the semiconductor wafer WF is carried, while being kept housed in the wafer protective case 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer protection case used in a line for an LSI manufacturing process and an inspection process, and particularly to a wafer protection case for maintaining the quality of a semiconductor wafer during transportation and operation.

[0002]

2. Description of the Related Art In a wafer process in LSI manufacturing, it is essential to transport a semiconductor wafer along a manufacturing line.
A wafer carrier is used for accommodating and transporting a plurality of wafers. Vacuum suction arm (air tweezers) to pull out wafers one by one from wafer carrier by vacuum suction arm (air tweezers)
In general, work such as housing in a room is performed.

In recent years, semiconductor wafers have become larger in diameter, and in particular, there has been a tendency to become thinner in a shipping inspection process. In such a case, great care must be taken in handling the wafer as it is as described above.

[0004]

For example, when a wafer is suctioned by a vacuum suction arm or the like and extracted from a wafer carrier, there is a risk of contact with another wafer. This is because a wafer having a large diameter and a reduced thickness has a remarkable warpage. Further, the thin arm itself may come into contact with another wafer. As a result, the working efficiency cannot be increased due to concern about damage to the wafer.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and aims to provide a wafer protection case capable of maintaining the quality of a semiconductor wafer with easy handling during transport and operation of the semiconductor wafer. is there.

[0006]

SUMMARY OF THE INVENTION A wafer protection case according to the present invention has at least a hinge portion and a detachable portion for opening and closing, and exposes an integrated circuit region on a main surface of one semiconductor wafer and a peripheral portion thereof. It is characterized in that everything is housed in a groove.

[0007] According to the wafer protection case according to the present invention, there is provided a peripheral protection mode in which the semiconductor wafer is enclosed so as to enclose the entire wafer peripheral portion for each semiconductor wafer. The semiconductor wafer can be transported while being stored in the wafer protection case. As a result, the entire periphery of the wafer becomes strong, and the wafer is prevented from warping during transfer. By protecting the peripheral portion of the wafer, which requires careful handling, transportation and operation are facilitated, and high reliability is obtained.

Further, the wafer protection case according to the present invention comprises:
It has at least a hinge portion and a detachable portion for opening and closing, and is characterized in that one semiconductor wafer is placed so as to expose the integrated circuit region on the main surface and to wrap from the periphery to the entire back surface.

According to the above-mentioned wafer protection case according to the present invention, a case is provided in which the entire semiconductor wafer is wrapped so as to cover the entire periphery of the wafer and the entire back surface of the wafer.
Accordingly, when the suction of the back surface side of the wafer is used during the transfer as well as the strengthening of the entire peripheral portion of the wafer, the wafer does not directly touch the wafer. By protecting the peripheral portion of the wafer, which requires careful handling, transportation and operation are facilitated, and high reliability is obtained.

[0010] In addition, as an easy form for mounting and dismounting the case,
According to the above two wafer protection cases according to the present invention, the hinge portion and the detachable portion are provided so as to open and close in a direction in which the plane of the semiconductor wafer expands. Further, in the above two wafer protection cases according to the present invention, the hinge portion and the attaching / detaching portion are provided so as to open and close in a direction from the main surface to the back surface of the semiconductor wafer.

Further, from the viewpoints of preventing the rotation of the wafer and protecting the wafer by attaching and detaching the case, according to the two wafer protection cases according to the present invention, at least the contact portion where the semiconductor wafer is accommodated is covered with the elastic member. It has a region.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 (a) to 1 (c) show a main configuration of a wafer protection case according to a first embodiment of the present invention, wherein (a) is an outline plan view and (b) FIG. 2 is an outline plan view mounted on a wafer, and FIG. 2C is a sectional configuration view taken along line 1C-1C in FIG.

The wafer protection case 10 has a hinge portion 11 and a detachable portion 12 so that it can be opened and closed. One semiconductor wafer WF is placed so that the integrated circuit area CA on the main surface thereof is exposed and the entire periphery EG is surrounded by the groove 13. Positioning for storing the semiconductor wafer WF may be determined by the shape of the groove 13.

The wafer protection case 10 is made of, for example, aluminum,
It is composed of a metal material such as stainless steel. Alternatively, a configuration in which a conductive coating as an antistatic material is applied to a plastic material may be used.

It is desirable that the groove 13 be pinched without damaging the peripheral edge of the wafer WF. For example, the elastic member 14 made of a coating of polyimide resin or the like has a configuration in which the peripheral edge of the wafer is held. The elastic members 14 may not be provided in the entire area of the groove 13 and may be provided at a plurality of locations at predetermined intervals. This contributes to prevention of rotation of the wafer WF and protection of the wafer WF when the wafer protection case 10 is attached and detached.

FIGS. 2A and 2B respectively show FIGS.
It is the schematic which shows an example of a structure of the hinge part 11 and the attachment / detachment part 12 shown to (b). As shown in FIG.
Also in this case, the movable shaft 111 is flattened as much as possible without projection, and the thickness is made equal to other portions. Further, as shown in (b), the attaching / detaching portion 12 is fixed in a fitting shape when closed. The closed part has the same thickness as the other parts.

According to the configuration of the above-described embodiment, there is provided a peripheral edge protection mode in which the semiconductor wafer is housed so as to enclose the entire wafer peripheral portion. The semiconductor wafer WF can be transported while being stored in the wafer protection case 10. For example, if the thickness of the wafer protection case 10 is smaller than the width of the storage groove of the wafer carrier (not shown), the transfer use in the wafer carrier can be realized.

As a result, the entire periphery of the wafer becomes strong, and the wafer is prevented from warping during transfer. By protecting the peripheral portion of the wafer, which requires careful handling, transportation and operation can be facilitated and high reliability can be obtained.

FIGS. 3A to 3C show a main configuration of a wafer protection case according to a second embodiment of the present invention.
(A) is an outline plan view, (b) is an outline plan view mounted on a wafer, and (c) is a cross-sectional configuration diagram taken along line 3C-3C in (b) diagram.

The wafer protection case 20 has a hinge portion 21 and a predetermined number of detachable portions 22 so as to be openable and closable. One semiconductor wafer WF is placed so as to expose the integrated circuit area CA on the main surface and to cover the entire back surface from the peripheral edge EG. Positioning when the semiconductor wafer WF is placed may be determined by a mark (not shown) formed by minute projections or the like in the plane area 23.

The wafer protection case 20 is made of, for example, aluminum,
It is composed of a metal material such as stainless steel. Alternatively, a configuration in which a conductive coating as an antistatic material is applied to a plastic material may be used.

The planar region 23 for protecting the rear surface of the wafer WF is preferably coated with an elastic member 24 such as a polyimide resin so as not to damage the rear surface of the wafer WF. It is desirable that a coating region of the elastic member 24 is also provided on the ring portion 25 that holds the peripheral edge of the wafer. Of course, a configuration may be provided at a plurality of locations at predetermined intervals instead of the entire area. This contributes to preventing the rotation of the wafer WF and protecting the wafer WF when the wafer protection case 20 is attached and detached.

FIGS. 4A and 4B respectively show FIGS.
It is the schematic which shows an example of the structure of the hinge part 21 and attachment / detachment part 22 shown to (b). As shown in FIG.
Also in this case, the movable shaft 211 is flattened as much as possible without projection, and the thickness is made equal to other portions. Further, as shown in (b), the attachment / detachment portion 22 is fixed in a fitting shape when closed, and is desirably provided at two or more locations (here, three locations). The closed part has the same thickness as the other parts.

According to the configuration of the above-described embodiment, a case is provided in which the semiconductor wafer is housed so as to cover the entire periphery of the wafer and the entire back surface of the wafer for each semiconductor wafer. Thus, in addition to strengthening the entire peripheral portion of the wafer (preventing warpage), when using suction on the back surface side of the wafer during transfer, the wafer does not directly touch the wafer. The semiconductor wafer WF can be transported while being stored in the wafer protection case 20. For example, if the thickness of the wafer protection case 20 is smaller than the width of the storage groove of the wafer carrier (not shown), the transfer use in the wafer carrier can be realized.

As a result, the entire periphery of the wafer becomes strong, and the wafer is prevented from warping during transfer. By protecting the peripheral portion of the wafer, which requires careful handling, transportation and operation can be facilitated and high reliability can be obtained.

FIGS. 5 (a) to 5 (c) show a main configuration of a wafer protection case to which the configuration of the second embodiment is applied, which is a modification of the configuration shown in FIG. 1, and FIG. Figure,
(B) is an outline plan view mounted on the wafer, (c) is (b)
It is sectional drawing which follows the 5C-5C line in the figure. FIG. 1
The same parts as those described above are denoted by the same reference numerals and description thereof is omitted.

That is, the mechanism of the wafer protection case 50 is the same as that of FIG.
2 is provided so as to open and close in the direction in which the plane of the semiconductor wafer WF spreads.

With such a mechanism, one semiconductor wafer WF is placed so as to expose the integrated circuit area CA on the main surface thereof and to cover the entire back surface from the peripheral edge EG. It is important that the back surface of the wafer WF is not damaged as in the second embodiment.
The same effects as in the second embodiment can be expected.

FIGS. 6 (a) to 6 (c) show a main part of a wafer protection case to which the configuration of the first embodiment is applied in a modification of the configuration of FIG. 3, and FIG. Figure,
(B) is an outline plan view mounted on the wafer, (c) is (b)
FIG. 6 is a sectional configuration view taken along line 6C-6C in the figure. FIG. 3
The same parts as those described above are denoted by the same reference numerals and description thereof is omitted.

That is, the mechanism of the wafer protection case 60 is the same as that of FIG.
2 is provided so as to open and close in the direction from the main surface to the back surface of the semiconductor wafer WF.

With such a mechanism, one semiconductor wafer WF is housed so that the integrated circuit area CA on the main surface thereof is exposed and the entire periphery EG is surrounded by the holding of the groove. As in the first embodiment, it is important to hold the wafer WF without damaging the peripheral edge thereof, and the same effects as in the first embodiment can be expected.

[0032]

As described above, according to the present invention, 1
With respect to one semiconductor wafer WF, a peripheral edge protection form is realized such that the integrated circuit region on the main surface is exposed and the entire peripheral portion or the rear surface is covered. As a result, it is possible to provide a wafer protection case that can maintain the quality of the semiconductor wafer with easy handling at the time of transporting and operating the semiconductor wafer.

[Brief description of the drawings]

1 (a) to 1 (c) show a main part configuration of a wafer protection case according to a first embodiment of the present invention, where (a) is an outline plan view, and (b) is an outline plan mounted on a wafer. FIG. 1C is a cross-sectional view taken along the line 1C-1C in FIG.

FIGS. 2A and 2B are schematic diagrams each illustrating an example of a configuration of a hinge unit and a detachable unit illustrated in FIG. 1B;

3 (a) to 3 (c) show a main part configuration of a wafer protection case according to a second embodiment of the present invention, where (a) is an outline plan view, and (b) is an outline plane mounted on a wafer. FIG. 3C is a cross-sectional view taken along line 3C-3C in FIG.

FIGS. 4A and 4B are schematic diagrams each illustrating an example of a configuration of a hinge unit and a detachable unit illustrated in FIG. 3B;

FIGS. 5 (a) to 5 (c) show a main configuration of a wafer protection case to which the configuration of the second embodiment is applied in a modification of the configuration of FIG. 1, and FIG. , (B) is an outline plan view mounted on the wafer, (c) is 5C- in FIG.
It is sectional drawing which follows 5C line.

6 (a) to 6 (c) show a main part configuration of a wafer protection case to which the configuration of the first embodiment is applied, which is a modification of the configuration of FIG. 3, and FIG. , (B) is an outline plan view mounted on the wafer, (c) is 6C- in FIG.
It is sectional drawing which follows 6C line.

[Explanation of symbols]

 10, 20, 50, 60: wafer protection case 11, 21, hinge part 111, 211 movable shaft 12, 22, detachable part 13, groove 14, 24, elastic member 25, ring part WF, semiconductor wafer CA, integrated circuit Area EG: Peripheral part

 ──────────────────────────────────────────────────続 き Continued on front page F term (reference) 3E068 AA33 AB04 AC06 BB01 CC04 CC12 CD02 CE03 DD06 DD09 DD14 DD40 DE06 EE26 EE37 3E096 AA01 BA16 BB04 CA01 CB02 CB10 DA05 DA18 DB07 DC01 FA12 FA30 GA14 5F031 CA02 DA13 FA01 PA12 MA13

Claims (5)

[Claims]
1. A semiconductor wafer having at least a hinge portion and an attaching / detaching portion for opening and closing, wherein one semiconductor wafer is housed so that an integrated circuit region on a main surface thereof is exposed and the entire peripheral portion is surrounded by a groove. Wafer protection case.
2. A semiconductor wafer having at least a hinge portion and an attaching / detaching portion for opening and closing, wherein one semiconductor wafer is housed so as to expose an integrated circuit region on a main surface thereof and to wrap from a peripheral portion to an entire back surface. Wafer protection case.
3. The wafer protection case according to claim 1, wherein the hinge portion and the attachment / detachment portion are provided so as to open and close in a direction in which the plane of the semiconductor wafer expands.
4. The wafer protection case according to claim 1, wherein the hinge portion and the attachment / detachment portion are provided so as to open and close in a direction from a main surface to a back surface of the semiconductor wafer.
5. The wafer protection case according to claim 1, wherein at least a contact portion in which the semiconductor wafer is accommodated has a region covered with an elastic member.
JP2001030894A 2001-02-07 2001-02-07 Wafer protective case Withdrawn JP2002237516A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001030894A JP2002237516A (en) 2001-02-07 2001-02-07 Wafer protective case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001030894A JP2002237516A (en) 2001-02-07 2001-02-07 Wafer protective case

Publications (1)

Publication Number Publication Date
JP2002237516A true JP2002237516A (en) 2002-08-23

Family

ID=18895045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001030894A Withdrawn JP2002237516A (en) 2001-02-07 2001-02-07 Wafer protective case

Country Status (1)

Country Link
JP (1) JP2002237516A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035484A1 (en) 2004-09-27 2006-04-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor manufacturing equipment and semiconductor manufacturing method
JP2009272464A (en) * 2008-05-08 2009-11-19 Techno Fine:Kk Sample holding mechanism
JP2010258288A (en) * 2009-04-27 2010-11-11 Sanyo Electric Co Ltd Fixture, and method of manufacturing semiconductor device using the same
JP2012004522A (en) * 2010-06-21 2012-01-05 Brewer Science Inc Method and apparatus for removing reversibly mounted device wafer from carrier substrate
US9099512B2 (en) 2008-01-24 2015-08-04 Brewer Science Inc. Article including a device wafer reversibly mountable to a carrier substrate
US9263314B2 (en) 2010-08-06 2016-02-16 Brewer Science Inc. Multiple bonding layers for thin-wafer handling
CN110376847A (en) * 2018-04-12 2019-10-25 上海微电子装备(集团)股份有限公司 A kind of basal edge protection ring element, lithographic equipment and guard method

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035484A1 (en) 2004-09-27 2006-04-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor manufacturing equipment and semiconductor manufacturing method
US7994067B2 (en) 2004-09-27 2011-08-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor manufacturing equipment with an open-topped cassette apparatus
US9111981B2 (en) 2008-01-24 2015-08-18 Brewer Science Inc. Method for reversibly mounting a device wafer to a carrier substrate
US9099512B2 (en) 2008-01-24 2015-08-04 Brewer Science Inc. Article including a device wafer reversibly mountable to a carrier substrate
JP2009272464A (en) * 2008-05-08 2009-11-19 Techno Fine:Kk Sample holding mechanism
JP2010258288A (en) * 2009-04-27 2010-11-11 Sanyo Electric Co Ltd Fixture, and method of manufacturing semiconductor device using the same
JP2012004522A (en) * 2010-06-21 2012-01-05 Brewer Science Inc Method and apparatus for removing reversibly mounted device wafer from carrier substrate
US8852391B2 (en) 2010-06-21 2014-10-07 Brewer Science Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
US9263314B2 (en) 2010-08-06 2016-02-16 Brewer Science Inc. Multiple bonding layers for thin-wafer handling
US9472436B2 (en) 2010-08-06 2016-10-18 Brewer Science Inc. Multiple bonding layers for thin-wafer handling
CN110376847A (en) * 2018-04-12 2019-10-25 上海微电子装备(集团)股份有限公司 A kind of basal edge protection ring element, lithographic equipment and guard method

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20080513