JP2004153157A - Vacuum pincette and semiconductor wafer carrying method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum pincette and a semiconductor wafer carrying method capable of maintaining the quantity of a wafer while simplifying dealing performance at the time of carrying and operating a thin semiconductor wafer. <P>SOLUTION: A vacuum pincette 10 is formed with a plurality of suction pads 11 whose wafer holding side end parts are respectively formed with vent holes. A supporting part 12 is also used as vent piping 13, and configured of a central key portion 121 and a branch path portion 122 to each suction pad 11. The key portion 121 is formed with a pump mechanism 14 for adjusting fluid in the suction pads 11. The adjustment of the fluid by the pump mechanism 14 may be carried out under the consideration of the adjustment of the strength of air to be suck up or the adjustment of the strength of air to be emitted on the contrary. That is, it is possible to adjust the flow of air in the vent piping 13. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to vacuum tweezers and a semiconductor wafer transfer method used in a line of an LSI manufacturing process and an inspection process, and particularly applied when transferring a thin semiconductor wafer.
[0002]
[Prior art]
In a wafer process in LSI manufacturing, it is essential to transport a semiconductor wafer along a manufacturing line. A wafer carrier is used for accommodating and transporting a plurality of wafers. Generally, operations such as extracting wafers one by one from a wafer carrier with a vacuum suction arm (air tweezers) and storing wafers one by one in a wafer carrier with a vacuum suction arm (air tweezers) are generally performed. In recent years, semiconductor wafers have been increasing in diameter and tending to be thinner. When the thickness is reduced, there is a risk that the wafer may be bent, warped, or at worst broken by its own weight.
[0003]
At present, workers handle thin semiconductor wafers in which it is difficult to handle air tweezers as described above. For example, handling of a thin wafer processed to 100 μm or less through a wafer back surface grinding step or the like. Such a thin wafer may be contained in a stacked wafer carrier. In the stacked wafer carrier, a plurality of thin wafers are stacked with a buffer film interposed therebetween. Workers wear vinyl gloves and the like for preventing static electricity and dust, and carry them to chuck tables of various manufacturing equipment by hand handling.
[0004]
[Problems to be solved by the invention]
When the diameter of a semiconductor wafer is increased and the thickness of the semiconductor wafer is reduced, deflection and warpage of the wafer due to its own weight are remarkable, and it becomes impossible to handle air tweezers in a normal production line. As a result, the handling of such a thin wafer by an operator increases. When removing a thin wafer from a stacked wafer carrier or putting a thin wafer into the stacked wafer carrier, the operator picks up a point on the outer peripheral portion of the wafer and then shifts to using both hands. As a result, the wafer is extremely strained, and there is a danger of cracking. As a result, the handling efficiency of the thin wafer cannot be increased due to concerns about damage.
[0005]
The present invention has been made in view of the above circumstances, and provides a vacuum tweezer and a semiconductor wafer transfer method capable of maintaining the quality of a thin semiconductor wafer while transferring the thin semiconductor wafer with easy handling during operation. Things.
[0006]
[Means for Solving the Problems]
The vacuum tweezers according to [claim 1] of the present invention includes:
A plurality of suction pads each provided with a vent,
A support portion provided on each of the suction pads and also serving as a ventilation pipe,
A pump mechanism that manifests adjustment of fluid in the suction pad;
It is characterized by having.
[0007]
According to the vacuum tweezers according to the present invention, the suction target is dispersed and held by the plurality of suction pads. Thereby, stress such as bending due to its own weight is reduced for a thin wafer or the like that requires sufficient care in handling.
[0008]
A vacuum tweezer according to [claim 2] of the present invention is dependent on [claim 1],
At least one suction pad is provided near the center of the suction target, and a plurality of suction pads are provided near the periphery of the suction target at appropriate intervals. When the suction target is assumed to be thin, the configuration is such that the deflection is reduced.
[0009]
A vacuum tweezer according to [claim 3] of the present invention is dependent on [claim 1] or [claim 2],
The support is made of an elastic member. Prevents damage to the adsorption object.
[0010]
A vacuum tweezer according to [Claim 4] of the present invention is dependent on any of [Claim 1] to [Claim 3],
The pump mechanism is an electric motor pump. Increase the retention time of the adsorption target.
[0011]
The method for transferring a semiconductor wafer according to claim 5 of the present invention includes:
When using a carrier that can stack a plurality of thin semiconductor wafers with a buffer film in between,
Vacuum tweezers for holding and releasing the main surface of the semiconductor wafer by adjusting the fluid with a plurality of suction pads extending from the support portion also serving as a ventilation pipe hold at least one of the semiconductor wafers and hold the semiconductor wafer out of or from the carrier. It is characterized by being moved into a carrier.
[0012]
According to the method for transporting a semiconductor wafer according to the present invention, the main surface of the semiconductor wafer is dispersed and held by the vacuum tweezers on which the plurality of suction pads act. Thereby, when the thin wafer is moved into and out of the carrier, stress such as bending due to its own weight is reduced.
[0013]
A method for transporting a semiconductor wafer according to claim 6 of the present invention is dependent on claim 5,
The semiconductor wafer is suction-held together with the buffer film by the vacuum tweezers. It is possible to adopt a form in which the main surface of the semiconductor wafer does not directly contact the suction pad of the vacuum tweezers. The buffer film may be porous as long as it allows air to pass through.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
FIGS. 1A and 1B show a configuration of a main part of a vacuum tweezer according to a first embodiment of the present invention, wherein FIG. 1A is a schematic view and FIG. 1B is a schematic plan view holding a semiconductor wafer.
The vacuum tweezers 10 are provided with a plurality of suction pads 11 each having a vent hole at each end of the wafer holding side. The support part 12 also serves as the ventilation pipe 13 and is composed of a central base part 121 and a branch path part 122 to each suction pad 11. In the support portion 12, at least the branch path portion 122 and the suction pad 11 are made of a soft rubber member or a soft resin member, silicon rubber, or the like. This prevents damage to the wafer being sucked. The base 121 may be made of the same soft material. However, there should be no trouble such as deformation of the ventilation pipe 13. In addition, a pump mechanism 14 for adjusting the fluid in the suction pad 11 is provided in the main body 121. As for the adjustment of the fluid in the pump mechanism 14, it is conceivable to adjust the strength of the sucked air or to adjust the discharge of the air. That is, the flow of air in the ventilation pipe 13 is adjusted. The pump mechanism 14 may be a motor pump, or a battery-driven motor pump or a manual air pump if handled directly by an operator.
[0015]
In this embodiment, one suction pad 11 is provided near the center of the semiconductor wafer Waf, and four suction pads 11 are provided near the periphery of the semiconductor wafer Waf at substantially equal intervals. By supporting at five locations, the thin semiconductor wafer Waf processed to a size of 100 μm or less is dispersed and held, and stress such as bending during transportation or operation is reduced. Note that if more uniform support is required, the number of supports is not limited to the above five, but may be more.
[0016]
2A and 2B show a main configuration of vacuum tweezers according to a second embodiment of the present invention, wherein FIG. 2A is a schematic view and FIG. 2B is a schematic plan view holding a semiconductor wafer. The same parts as those in the first embodiment are denoted by the same reference numerals.
Compared with the first embodiment, the vacuum tweezers 20 are different in the following points. A certain length of the branch path section 122 from the base section 121 to each suction pad 11 can be adjusted (length adjustment pipe 15). The length adjusting tube 15 can be attached and detached and replaced to adjust the length of the branch path portion 122 to the holding side end to the wafer periphery. The length adjusting tube 15 is a hard resin tube made of a silicone resin or the like. Thus, it is possible to select and mount the length adjusting tube 15 according to the size of the wafer to be held and transported. As in the first embodiment, a pump mechanism 14 for adjusting the fluid in the suction pad 11 is provided on the main body 121.
[0017]
According to the vacuum tweezers according to each of the above-described embodiments, the branch path portion 122 is formed using the length adjusting tube 15 according to the size of the wafer to be held and transported. Thus, the suction target is dispersed and held by the plurality of suction pads 11. Therefore, stress such as bending due to its own weight is reduced for a thin wafer or the like that requires sufficient care in handling.
[0018]
FIG. 3 is a schematic diagram illustrating a method for transporting a semiconductor device according to a third embodiment of the present invention. According to FIG. 3, a plurality of thin semiconductor wafers are stored in a carrier 32 which can be stacked with a buffer film 31 interposed therebetween. After removing the buffer film 31, the operator uses, for example, the vacuum tweezers 10 having the configuration shown in FIG. In other words, it has the support portion 12 and performs suction holding and release of the main surface of the semiconductor wafer Waf without adjusting the fluid to each suction pad 11. Thereby, one semiconductor wafer Waf is held and moved out of the carrier 31 or into the carrier 31.
[0019]
The buffer film 31 is disposed between the semiconductor wafers Waf when they are stacked. It is also conceivable to make the buffer film 31 porous and perform suction holding and release of the main surface of the semiconductor wafer Waf together with the buffer film 31. Thereby, one semiconductor wafer Waf is held by the vacuum tweezers 10 (or 20) via the buffer film 31. By adjusting the fluid to each suction pad 11, only the semiconductor wafer Waf may be opened while holding the buffer film 31. Alternatively, after opening the buffer film 31 and the semiconductor wafer Waf, only the buffer film 31 may be captured and moved. Thus, the vacuum tweezers 10 (or 20) does not directly contact the main surface of the semiconductor wafer Waf, and contributes to prevention of contamination.
[0020]
FIG. 4 is a schematic diagram illustrating a method for transporting a semiconductor device according to a fourth embodiment of the present invention. In comparison with the third embodiment, the robot arm 41 is equipped with vacuum tweezers 10 (or 20). The other components are the same as those of the third embodiment, and therefore are denoted by the same reference numerals as those in FIG. That is, the support section 12 is attached to the robot arm 41, and performs suction holding and release of the main surface of the semiconductor wafer Waf without adjusting the fluid to each suction pad 11. Thereby, one semiconductor wafer Waf is held and moved out of the carrier 31 or into the carrier 31.
[0021]
As in the third embodiment, the buffer film 31 may be made porous, and the buffer film 31 may be suction-held and released on the main surface of the semiconductor wafer Waf. Thereby, one semiconductor wafer Waf is held by the vacuum tweezers 10 (or 20) via the buffer film 31. By adjusting the fluid to each suction pad 11, only the semiconductor wafer Waf may be opened while holding the buffer film 31. Alternatively, after opening the buffer film 31 and the semiconductor wafer Waf, only the buffer film 31 may be captured and moved. Accordingly, the vacuum tweezers 10 (or 20) does not directly contact the main surface of the semiconductor wafer Waf, and contributes to prevention of contamination.
【The invention's effect】
As described above, according to the present invention, the suction target is dispersed and held by the plurality of suction pads. Thereby, stress such as bending due to its own weight is reduced for a thin wafer or the like that requires sufficient care in handling. As a result, it is possible to provide a vacuum tweezer and a semiconductor wafer transfer method capable of maintaining the quality of a thin semiconductor wafer with easy handling during transfer and operation.
[Brief description of the drawings]
FIGS. 1A and 1B show a main configuration of vacuum tweezers according to a first embodiment of the present invention, wherein FIG. 1A is a schematic view and FIG. 1B is a schematic plan view holding a semiconductor wafer.
FIGS. 2A and 2B show a main configuration of vacuum tweezers according to a second embodiment of the present invention, wherein FIG. 2A is a schematic view and FIG. 2B is a schematic plan view holding a semiconductor wafer.
FIG. 3 is a schematic diagram illustrating a method for transporting a semiconductor device according to a third embodiment of the present invention.
FIG. 4 is a schematic view illustrating a method for transporting a semiconductor device according to a fourth embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Vacuum tweezers, 11 ... Suction pad, 121 ... Trunk part, 122 ... Branch path part, 13 ... Ventilation piping, 14 ... Pump mechanism, 15 ... Length adjustment pipe, 31 ... Buffer film, 32 ... Carrier, 41 ... Robot Arm, Waf: semiconductor wafer.

Claims (6)

A plurality of suction pads each provided with a vent,
A support portion provided on each of the suction pads and also serving as a ventilation pipe,
A pump mechanism that manifests adjustment of fluid in the suction pad;
A vacuum tweezer, comprising: 2. The vacuum tweezers according to claim 1, wherein at least one suction pad is provided near a center of the suction target object, and a plurality of suction pads are provided near a periphery of the suction target object at appropriate intervals. The vacuum tweezers according to claim 1, wherein the support portion is made of an elastic member. The vacuum tweezers according to any one of claims 1 to 3, wherein the pump mechanism is an electric motor pump. When using a carrier that can stack a plurality of thin semiconductor wafers with a buffer film in between,
Vacuum tweezers for holding and releasing the main surface of the semiconductor wafer by adjusting the fluid with a plurality of suction pads extending from the support part also serving as a ventilation pipe hold at least one of the semiconductor wafers and hold the semiconductor wafer out of or from the carrier. A method for transporting a semiconductor wafer, wherein the method is carried into a carrier. 6. The method according to claim 5, wherein the semiconductor wafer is sucked and held together with the buffer film by the vacuum tweezers.

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