JPH05315434A - Semiconductor wafer retainer - Google Patents

Semiconductor wafer retainer

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Publication number
JPH05315434A
JPH05315434A JP11439892A JP11439892A JPH05315434A JP H05315434 A JPH05315434 A JP H05315434A JP 11439892 A JP11439892 A JP 11439892A JP 11439892 A JP11439892 A JP 11439892A JP H05315434 A JPH05315434 A JP H05315434A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
member
wafer
semiconductor wafer
surface
film member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP11439892A
Other languages
Japanese (ja)
Inventor
Yoichi Ishikawa
洋一 石川
Original Assignee
Nec Yamagata Ltd
山形日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To firmly retain the whole part of a wafer with uniform retaining force when the wafer has warp or unevenness.
CONSTITUTION: The title retainer is equipped with the following; a board member 1 having an exhaust vent 15 on one surface, a flexible elastic film member 3 which is fixed on the periphery of the other surface of the board member 1 and has a plurality of suction ports 4, and a spacer member 2 which is inserted between the film member 3 and the board member 1. The film member 3 is transformed in accordance with warp and unevenness of a wafer, and brought into contact with the whole surface of a wafer 5. The susction ports 4 suck the wafer and retain it.
COPYRIGHT: (C)1993,JPO&Japio

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、半導体ウェーハを保持し、搬送する半導体ウェーハ保持具に関する。 The present invention relates to holding the semiconductor wafer, a semiconductor wafer holder for conveying.

【0002】 [0002]

【従来の技術】通常、半導体ウェーハを把み保持したりする際には、半導体ウェーハに損傷や汚染しないように、埃が付きにくい材質で軟い材料で製作されたピンセットや真空吸着による保持具で行なわれていた。 BACKGROUND ART Usually, when or pinch holding the semiconductor wafer, so as not to damage or contaminate the semiconductor wafer, the retainer by tweezers or a vacuum suction fabricated with soft, material hard material attached dirt It had been done in. しかしながら、近年、半導体ウェーハの大口径化に伴い、ピンセットでは保持力が弱く、真空吸着を利用した保持具が使われるようになった。 However, in recent years, with the larger diameter of the semiconductor wafer, weak holding force with tweezers, became holder using vacuum suction is used.

【0003】図3(a)及び(b)は従来の半導体ウェーハ保持具の例を示す図である。 [0003] 3 (a) and (b) is a diagram showing an example of a conventional semiconductor wafer holder. 従来、この種の保持具は、例えば、図3(a)に示すように、真空排気によるウェーハ5を吸着する吸着口をもつ吸着板6や、例えば、図3(b)に示すように、上部から高圧流体を引き込み、噴出口7から流体が放射状に噴出させ、この噴出口7の開口面積と比較して十分小さい開口面積の吸着口8をもつ中空盤体9が使用されていた。 Conventionally, this kind of retainer, for example, as shown in FIG. 3 (a), and suction plate 6 having a suction port for sucking the wafer 5 by evacuation, for example, as shown in FIG. 3 (b), draw high-pressure fluid from the upper, fluid from the ejection port 7 is ejected radially, hollow plate member 9 having a suction port 8 of sufficiently small opening area compared to the opening area of ​​the ejection port 7 were used.

【0004】前者の保持具は、ウェーハキャリアからウェーハを取出したり、収納したりする際に使用され、後者はウェーハを一つの場所から他の場所に移載する際に用いられていた。 [0004] The former retainer and retrieve the wafer from the wafer carrier, are used to or housed, the latter was used at the time of transferring the wafers from one location to another.

【0005】 [0005]

【発明が解決しようとする課題】上述した従来の半導体ウェーハ保持具では、真空吸着板の保持具では、ウェーハが歪んでいる場合に吸着穴が全部ウェーハと接触せず、リークするために保持出来なかったり、後者の中空盤体のものでは、歪んだウェーハを保持するもののウェーハの外側の一部を吸着したりするので、ウェーハを均等な吸着力で保持することができず、しばしば落として破損させる問題があった。 In THE INVENTION Problems to be Solved] The above-described conventional semiconductor wafer holder, the holder of the vacuum sucking plate, without suction hole in contact with the whole wafer when the wafer is distorted, can hold in order to leak or not, intended for the latter hollow panel member, because or adsorb a portion of the outer wafer to hold the wafer distorted, can not be holding the wafer with a uniform suction force, often down to corruption there has been a problem to be.

【0006】本発明の目的は、ウェーハが歪んでいても全面を均一に保持し、強力にウェーハを保持する半導体ウェーハ保持具を提供することである。 An object of the present invention, the wafer is distorted not uniformly maintained even the entire surface is to provide a semiconductor wafer holder for holding a strong wafer.

【0007】 [0007]

【課題を解決するための手段】本発明の半導体ウェーハ保持具は、一面に排気口をもつ板部材と、この板部材の他面にその周囲を被着して取付けられるとともに複数の穴が形成される柔軟な弾性のある膜部材と、この膜部材と前記板部材に挿入されるスペーサ部材を備えている。 Means for Solving the Problems A semiconductor wafer holder of the present invention includes a plate member having an exhaust port on one side, a plurality of holes with mounted by adhering the periphery thereof to the other surface of the plate member formed a film member with a flexible resilient to be provided with a spacer member which is inserted into the plate member and the film member.

【0008】 [0008]

【実施例】次に本発明について図面を参照して説明する。 EXAMPLES The present invention will be described below with reference to the drawings.

【0009】図1(a)及び(b)は本発明の一実施例を示す半導体ウェーハ保持具の平面図及び断面図である。 [0009] Figure 1 (a) and (b) are a plan view and a sectional view of a semiconductor wafer holder showing an embodiment of the present invention. この半導体ウェーハ保持具は、図1に示すように、 The semiconductor wafer holder, as shown in FIG. 1,
一面側に排気経路1aに通ずる排気口1bをもつ板部材1と、この板部材1の他面側に取付けられるとともに複数の吸着口4をもつ弾性のある柔軟な膜部材3と、この膜部材3と板部材1との間に挿入されるスペーサ部材2 A plate member 1 having an exhaust port 1b communicating with the exhaust passage 1a on one side, a flexible membrane member 3 an elastic having a plurality of suction ports 4 with mounted on the other surface of the plate member 1, the film member 3 and the spacer member 2 to be inserted between the plate member 1
とで構成されている。 It is composed of a.

【0010】ここで膜部材3は、例えば、薄いゴム板か樹脂板から製作し、表面にごみが付着しないように、フッ素加工処理を施すことである。 [0010] Here, film member 3, for example, made from a thin rubber plate or a resin plate, such dust does not adhere to the surface is to apply a fluorine processing. また、図面には示さないが排気口1bに接続される真空排気管は、保持具が操作し易いようにフレキシブルチューブとすることである。 Further, the vacuum exhaust pipe not shown in the drawing is connected to the exhaust port 1b is that the holder is a flexible tube for easy operation. なおスペーサ部材3は板部材1より突出させ排気経路1aと通ずる穴を設けることである。 Note spacer member 3 is to provide a hole communicating with the exhaust path 1a is protruded from the plate member 1.

【0011】図2(a)〜(c)は図1の半導体ウェーハ保持具の操作手順を説明するため断面図である。 [0011] FIG. 2 (a) ~ (c) are sectional views for explaining the procedure of operation the semiconductor wafer holder of Figure 1. 次に、この半導体ウェーハ保持具の操作手順について説明する。 Next, a procedure of operating the semiconductor wafer holder. まず、図2(a)に示すように、膜部材3をウェーハ5に接触させながら、板部材1をウェーハ5に乗せる。 First, as shown in FIG. 2 (a), while contacting the membrane member 3 on the wafer 5, put the plate member 1 in the wafer 5. 次にスペーサ部材2で形成される空間部を真空排気し、ウェーハ5を膜部材3に吸着する。 Then the space formed by the spacer member 2 is evacuated, to adsorb the wafer 5 to the film member 3. 次に、図2 Next, as shown in FIG. 2
(c)に示すように、他の場所に半導体ウェーハ保持具を移動させ、保持されたウェーハ5を移載する部分と接触させながら、前記空間部に空気を導入し、ウェーハ5 (C), the move the semiconductor wafer holder to another location, while in contact with the retained transferred portions of the wafer 5, by introducing air into the space portion, the wafer 5
を解放し、移載を完了する。 To release, to complete the transfer.

【0012】このように柔軟な膜部材であれば、ウェーハ5に反りや凹凸があっても、ウェーハ5の表面状態に応じて膜部材3が変形し、ウェーハ5の全面と接触し、 [0012] With this flexible film member, even if warpage or irregularities on the wafer 5, the film member 3 is deformed according to the surface state of the wafer 5, in contact with the entire surface of the wafer 5,
吸着口4を塞ぎ吸着するので、ウェーハ面を均一の吸着で保持できる。 Since adsorption close the suction port 4 can hold the wafer surface with a uniform suction.

【0013】なおこの実施例では、スペーサ部材2を板部材1より突出させているが、スペーサ部材2を膜部材に貼付けても良い。 [0013] Note that in this embodiment, although the spacer member 2 to protrude from the plate member 1 may be pasted to the spacer member 2 to the membrane member. この場合は、膜部材の自重を増加させることになるので、膜部材と板部材の引き離しが容易に行えるので、ウェーハの解放がより早く出来る利点がある。 In this case, it means to increase the weight of the film member, since the distancing of the film member and the plate member easily, there is an advantage that the release of the wafer can be more quickly.

【0014】 [0014]

【発明の効果】以上説明したように本発明は、排気経路に通ずる排気口を一面にもつ板部材の他面にその周囲で取付けられるとともに複数の吸着口を有する柔軟な弾性のある膜部材と、この膜部材と前記板部材との間に挿入され前記膜部材と前記板部材とを所定の間隔に引離すスペーサ部材とを設けることによって、前記膜部材がウェーハの反りあるいは凹凸に応じて変形しながらウェーハ全面と接触し、複数の吸着口で吸着することが出来る。 The present invention described above, according to the present invention includes a film member with a flexible elasticity of a plurality of suction openings together with the attached an exhaust port communicating with the exhaust path around the other side of the plate member having on one surface , by providing a spacer member for separating the said plate member and the film member is inserted between the plate member and the film member to a predetermined distance, deforming said membrane member in response to the warp or unevenness of the wafer the entire surface of the wafer and contact can be adsorbed by the plurality of suction ports while.
従って、本発明によれば、ウェーハが歪んでいても全面を均一な保持力で強力に保持出来る半導体ウェーハ保持具が得られるという効果がある。 Therefore, according to the present invention, a semiconductor wafer holder that can strongly hold the entire surface it is distorted wafer with a uniform holding force there is an effect that is obtained.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の一実施例を示す半導体ウェーハ保持具の平面図及び断面図である。 1 is a plan view and a cross-sectional view of a semiconductor wafer holder showing an embodiment of the present invention.

【図2】図1の半導体ウェーハ保持具の操作手順を説明するための断面図である。 2 is a sectional view for explaining the operation procedure of the semiconductor wafer holder of Figure 1.

【図3】従来の半導体ウェーハ保持具の例を示す図である。 3 is a diagram showing an example of a conventional semiconductor wafer holder.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 板部材 1a 排気経路 1b 排気口 2 スペーサ部材 3 膜部材 4,8 吸着口 5 ウェーハ 6 吸着板 7 噴出口 9 中空盤体 1 the plate member 1a exhaust path 1b exhaust port 2 spacer member 3 film member 4,8 suction port 5 wafer 6 attraction plate 7 spout 9 hollow panel member

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 一面に排気口をもつ板部材と、この板部材の他面にその周囲を被着して取付けられるとともに複数の穴が形成される柔軟な弾性のある膜部材と、この膜部材と前記板部材に挿入されるスペーサ部材を備えることを特徴とする半導体ウェーハ保持具。 And 1. A plate member having an exhaust port on one side, and the film member with a flexible resilient plurality of holes with mounted is formed by adhering the periphery thereof to the other surface of the plate member, the film semiconductor wafer holder, characterized in that it comprises a spacer member to be inserted into the plate member and the member.
JP11439892A 1992-05-07 1992-05-07 Semiconductor wafer retainer Withdrawn JPH05315434A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11439892A JPH05315434A (en) 1992-05-07 1992-05-07 Semiconductor wafer retainer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11439892A JPH05315434A (en) 1992-05-07 1992-05-07 Semiconductor wafer retainer

Publications (1)

Publication Number Publication Date
JPH05315434A true true JPH05315434A (en) 1993-11-26

Family

ID=14636687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11439892A Withdrawn JPH05315434A (en) 1992-05-07 1992-05-07 Semiconductor wafer retainer

Country Status (1)

Country Link
JP (1) JPH05315434A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1320121A2 (en) * 2001-12-03 2003-06-18 Nitto Denko Corporation Semiconductor wafer transport method and apparatus
JP2009260317A (en) * 2008-04-12 2009-11-05 Erich Thallner Device and method for adding wafer to carrier and/or separating from carrier
WO2012112025A1 (en) * 2011-02-16 2012-08-23 Texchem Advanced Products Incorporated Sdn. Bhd. Single and dual stage wafer cushion and wafer separator

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1320121A2 (en) * 2001-12-03 2003-06-18 Nitto Denko Corporation Semiconductor wafer transport method and apparatus
EP1320121A3 (en) * 2001-12-03 2006-07-05 Nitto Denko Corporation Semiconductor wafer transport method and apparatus
JP2009260317A (en) * 2008-04-12 2009-11-05 Erich Thallner Device and method for adding wafer to carrier and/or separating from carrier
WO2012112025A1 (en) * 2011-02-16 2012-08-23 Texchem Advanced Products Incorporated Sdn. Bhd. Single and dual stage wafer cushion and wafer separator

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19990803