TWI449125B - Suction pad for semiconductor package - Google Patents

Description

Suction cup for semiconductor package processing device

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a semiconductor package processing apparatus, and more particularly to a chuck, although the present invention is suitable for a wide range of applications, but is particularly suitable for more efficiently absorbing and retaining a semiconductor package.

Generally, a semiconductor package includes a semiconductor wafer on which a circuit board having a plurality of transistors and capacitors is formed on a substrate. Moreover, a lead frame connected to the semiconductor wafer is disposed on the semiconductor package.

The semiconductor package of the above configuration is fixed and arranged on a chuck and then transferred to a cutting device for separate cutting and separation through a cutting process. The semiconductor package processing apparatus detects processing states of a plurality of semiconductor packages and then classifies the semiconductor packages.

The semiconductor package processing device transports the semiconductor package for processing, inspecting, or classifying a corresponding semiconductor package. To this end, a vacuum pick-up detector is primarily used as a means of transferring the semiconductor package.

Specifically, a chuck is attached to a terminal portion of one of the vacuum suction detectors to facilitate picking up and holding the semiconductor package.

Recently, the chuck typically has a surface on which a contact termination is formed to prevent damage to the semiconductor package during transfer/conditioning of the semiconductor package. In this case, except that a surface portion of the contact terminal is formed in the surface In addition, the chuck sucks and holds an edge portion of the semiconductor package.

However, as semiconductor packages have high density and higher buildup, they tend to remove this edge portion. Therefore, it is more difficult to pick up and hold the semiconductor package.

Moreover, each time the size or type of semiconductor package is changed, it is necessary to replace the original chuck with a new chuck that matches the semiconductor package. Therefore, the working process for absorbing and holding a semiconductor package is complicated.

Further, the suction cup of the prior art is formed of hard rubber. In particular, the thickness of the edge portion for sealing the adsorption space is 0.3 to 0.5 mm (mm) and the length is 0.5 to 0.8 mm (mm). The suction cup of the prior art is hardly flexible and relatively hard.

Accordingly, in view of the above, the present invention is directed to a chuck for a semiconductor package whereby one or more problems due to limitations and disadvantages of the prior art are eliminated.

One of the objects of the present invention is to provide a suction cup through which a semiconductor package having a protruding surface can be effectively sucked and held.

Another object of the present invention is to provide a chuck that can be adapted to the pattern of the contact termination of a semiconductor package.

Other features and advantages of the invention will be set forth in part in the description which follows. The objectives and other advantages of the invention will be apparent from the description and the scope of the appended claims Constructed and combined with the schema part, it can be realized and obtained.

In order to achieve these and other advantages of the present invention, the present invention is embodied and broadly described. The suction cup of a semiconductor package processing apparatus of the present invention includes a main body having an air absorbing hole; and at least one soft seal. And the sealing member is flexibly deformed according to a surface contour of the suction target for sealing an adsorption space, wherein the adsorption space is associated with the air suction hole.

Preferably, the seal member includes a flange that is disposed on a lower portion of the body.

The flange forms an adsorption space by flexible deformation and then performs sealing. The flange is formed of a soft material for flexible deformation. Therefore, it is possible to ensure that the adsorption space is sufficient for vacuum adsorption without being affected by the surface profile of the adsorption target.

This flange can be formed by a crucible. Also, 矽 provides full flexibility.

More preferably, the flange and the main system are integrally formed for being arranged in a single block structure. Alternatively, the flange and the body may be formed of different materials or may be bonded together by an adhesive.

The thickness of the flange gradually decreases from one of the roots of the flange toward the terminal end of one of the flanges. Therefore, the terminal portion has sufficient flexibility. If the terminal portion is sufficiently flexible, the flange can be flexibly deformed according to the surface contour of a package and can be well deformed to cover the adsorption space. Therefore, the adsorption efficiency can be improved.

More preferably, at least a portion of the inner side of the flange is inclined in the outer direction of the flange. In particular, the inner side of the flange is arranged such that the cross-sectional area of the adsorption space faces convex The terminal part of the edge is gradually increasing. The adsorption efficiency can be improved by providing an adsorption space of an appropriate width. Also, the upper portion of the flange can exert a considerable bending force due to the deformation in the suction, and the upper portion is formed to be relatively thick, whereby durability can be improved.

More preferably, the outer side of the flange includes a vertical surface and an inclined surface which is inclined in an outward direction. The inclined surface provides flexibility in the suction of the adsorption target to fully ensure the adsorption space. Also, the vertical plane provides a restoring force among the absorbing targets that are unloaded to reach the destination, thereby contributing to the rapid drop of the absorbing target.

The cross section of the flange can have a different shape. For example, the flange can have a circular or polygonal cross section.

More preferably, the flange includes at least two flanges that are uniformly spaced apart from each other to overlap each other. For example, the two flanges can have an inner flange and an outer flange, wherein the outer flange is disposed around the outer portion of the inner flange.

Such a plurality of flanges can improve the suction efficiency by tightly sealing the adsorption space.

In this case, the inner flange can have less flexibility than the outer flange. For this purpose, the inner flange can be thicker or shorter than the outer flange. Also, one of the outer sides of the inner flange can be vertically disposed.

The terminal portion of the inner flange is sufficiently flexible. For this purpose, the thickness of the terminal portion of the inner flange may be equal or substantially equal to the terminal portion of the outer flange.

A vacuum residual pressure can be maintained between the inner flange and the outer flange. This residual pressure The force can prevent a package from freely separating from a suction cup. Therefore, when the package is unloaded from the destination, the residual pressure prevents rapid separation of the package. When the package falls from the destination by releasing the vacuum state, the package preferably falls in the horizontal direction. Otherwise, the location of the package can vary or can be turned upside down. However, this residual pressure prevents the package from falling horizontally. In this case, the inner flange applies a restoring force to the package to facilitate horizontal drop of the package by rapid and uniform separation from the suction cup.

At the same time, there may be a stopper, which is used to prevent a package from being excessively sucked and held through the suction cup. If the package is excessively adhered to the suction cup, a smashing phenomenon can occur, which can interrupt the rapid transfer of the package. Therefore, the stopper is used to prevent the crucible from sticking to the crucible.

In order to further achieve these and other advantages of the object of the present invention, a chuck of a semiconductor package processing apparatus of the present invention includes a main body having a plurality of air suction holes, the main body being configured as a single block, and a plurality of soft Sealing plates which are flexibly deformable according to the surface profile of an adsorption target, which respectively seal the adsorption spaces associated with the plurality of air suction holes.

The chuck can be assembled with the semiconductor package, thereby facilitating quick work.

The suction cup includes a sealing plate that is attached to the body as a seal. In this case, the body may include a protruding portion that is attached to the surface of the adsorption target to prevent deformation of the adsorption target during the suction process.

Also, the body may have a recess, and the sealing plate may be fixed and attached to the recess. Also, the side walls of the grooves may have the function of protruding portions.

In order to further obtain these and other advantages of the object of the present invention, a chuck of a semiconductor package processing apparatus of the present invention includes a plurality of bodies each including a plurality of air suction holes, and a plurality of soft flanges, the soft protrusions The edge is respectively disposed on the plurality of bodies, and the soft flanges are flexibly deformed according to a surface contour of one of the adsorption targets, and the soft flanges are arranged to seal a plurality of adsorption spaces, and the plurality of adsorption spaces are respectively and plural The air suction holes are associated with each other, and these bodies are integrally formed with these soft flange systems.

Therefore, the suction cup of the present invention can be applied to different structures capable of sucking and holding a package, such as an unloading pickup, a unit pickup, a turntable pickup, a chuck, a turntable (during cutting), and the like.

Meanwhile, in the prior art, the chuck is in contact with the edge portion of a semiconductor package for sucking and holding a semiconductor package, and the chuck of the present invention breaks through the prior art by canceling the contact terminal on the chuck. The sticking idea of the present invention employs a novel and extraordinary concept and can be named "Lee" sucker according to the inventor's last name.

It is to be understood that the foregoing general description of the invention and the claims

Therefore, the present invention has the following effects and advantages.

First, the chuck of the present invention is freely deformable according to a surface profile of a semiconductor package to be sucked and held, thereby facilitating, for example, a ball gate array (BGA). Absorption and retention of uneven surfaces in packages, BOC packages and similar packages.

Secondly, regardless of the type of semiconductor package to be sucked and held, a single chuck can be used without the need for a separate suction cup replacement, thereby reducing work time and manufacturing costs.

Hereinafter, preferred embodiments of the present invention will be described in detail in conjunction with the drawings.

Hereinafter, a chuck and a semiconductor package processing apparatus according to an embodiment of the present invention will be described with reference to "Fig. 1" to "Fig. 6". The semiconductor package processing apparatus uses the chuck to pick up and hold a semiconductor package.

First, a semiconductor package processing apparatus includes a pick-up holder 10 and a chuck 100, wherein the pick-up holder 10 is connected to an external air suction device for sucking and holding a semiconductor package 1, and the chuck 100 is provided for picking up One of the terminal portions of the holder 10.

In this case, the semiconductor package 1 includes a semiconductor package provided with a plurality of contact terminals protruding from one side of the semiconductor package. For example, the semiconductor package 1 includes a ball grid array (BGA) package belonging to a large scale integrated circuit (LSI). In a ball grid array (BGA) package, a plurality of hemispherical contact terminals are two Dimension arrays are arranged on a printed circuit board (PCB) with bare wafers to replace the wires.

The chuck 100 of the present invention draws and holds the surface of the ball grid array package on which the ball contact terminals are formed. In this case, a table in which a spherical contact terminal is formed The reason why the surface is sucked and held is mainly that the spherical contact terminal through the adsorbed semiconductor package is adaptively faced upward to reduce the damage caused by the interference between the contact terminal and the tray containing the semiconductor package. .

The pickup holder 10 can be mounted to move vertically or horizontally through a transfer device provided to the semiconductor package processing apparatus. The head portion 11 of the pickup holder 10 has a shape corresponding to the suction cup 100, and the suction cup 100 is mounted on the head portion 11 of the pickup holder 10.

The suction cup 100 includes a main body 110 and a flange 120. A cavity is formed in the main body 110, and the flange 120 extends downward from the main body 110 for connecting with the main body 110.

Referring to "Fig. 3", the main body 110 has a shape similar to a column in which a square cavity is formed in the square column. Also, the inside of the body 110 corresponds to the outside of the pickup holder 10, that is, the outside of the head of the pickup.

In detail, a separation preventing portion 150 is disposed inside the main body 110 to prevent the suction cup 100 from being separated from the pickup holder 10. Since the suction cup 100 is formed of a soft material, it can be easily detached from the pickup holder 10. Therefore, the separation preventing portion 150 can hold the outside of the pickup holder 10 to prevent separation.

As shown, the separation preventing portion 150 may have a convex shape corresponding to the concave shape in the head portion 11 of the pickup holder 10. Of course, the separation preventing portion 150 may have any shape corresponding to the outer portion of the pickup holder 10, such as a concave shape.

The flange 120 is adhered close to the surface of the semiconductor package by being freely deformed according to the surface profile of the drawn semiconductor package. Moreover, the main body 110 may further include a spacing portion 130, and an air suction hole 131 is formed in the spacing portion 130.

Moreover, the main body 110 may further include a slanted portion 140 having a predetermined inclination angle in the direction of the flange 120 from a portion connected to the flange 120.

Meanwhile, in the spacer portion 130, a shock absorbing convex portion 133 is disposed adjacent to the air suction hole 131 for absorbing and picking up during the process of sucking and holding a suction target, that is, a semiconductor package. The device applies a shock to the semiconductor package.

In addition, a through hole 132 is formed in the spacing portion 130. The through hole 132 is a moving path of a pressing member (not shown) for removing the sucked and held target, that is, A specific pressure is applied to the semiconductor package during the process of placing the drawn and held semiconductor package in a receiving tray.

Preferably, the through hole 132 is formed in the middle of the spacer portion 130 because the pressure member can uniformly apply pressure to the semiconductor package if pressure is likely to be applied to the semiconductor package.

When a semiconductor package is sucked and held through a chuck, the air suction holes 131 can be aligned with the through holes 132 in order to quickly and safely suck and hold the semiconductor package.

At the same time, the flange 120 forms an adsorption space (S) with the semiconductor package therebetween. And the flange 120 can be freely deformed according to the surface profile of the drawn semiconductor package.

In this case, if the air is released outward through the air suction hole 131, the adsorption space S can maintain a vacuum state. Therefore, such air pressure can enable the semiconductor package to be sucked and held through the chuck 100.

During the process of drawing and holding the semiconductor package, the flange 120 is attached to the surface of the semiconductor package at an irregular deformation rate. For example, the flange 120 can be deformed irregularly in a direction perpendicular to the surface of the semiconductor package and in a direction tangential to the surface.

The flange 120 can be closely attached to the surface of the ball contact terminal and the surface of the semiconductor package having the ball contact terminal in such a manner as to cover at least a portion of the ball contact terminal projecting from the surface of the semiconductor package.

Referring to "Fig. 1" and "Fig. 3", the thickness of the flange 120 is gradually reduced from the top to the bottom. Since the thickness of the flange 120 decreases from the top toward the bottom, the lower portion of the flange 120 can be freely deformed along the surface of the semiconductor package and can improve the durability of the upper portion of the flange 120 having the most severe bending deformation. .

If the flange extends along a straight line with a thicker thickness, durability can be improved. However, it is relatively difficult for the flange to deform along the surface of the semiconductor package. If the flange extends along a straight line with a thin thickness, it can be freely deformed along the surface of the semiconductor package, but its durability can be lowered.

In this case, the thickness of the flange 120, and in particular, the thickness of the lower portion of the flange 120 is in the range of 0.1 to 0.5 millimeters (mm). Preferably, convex The lower portion of the rim 120 may have a thickness of approximately 0.2 millimeters (mm).

There may be a predetermined ratio between the thicknesses of the upper and lower portions of the flange 120. For example, if the lower portion of the flange 120 has a thickness of 0.2 millimeters (mm), the thickness of the upper portion of the flange 120 can be designed to be 0.3 to 0.8 millimeters (mm). Also, the length of the flange 120 may be 0.7 to 1.0 millimeters (mm).

If the thickness of the flange 120 is ultra-thin, the flange can be flexibly deformed by preventing air from leaking from the adsorption space during the process of sucking the semiconductor package.

The flange 120 is formed of a material containing tantalum, carbon, and a hardening substance. Further, the composition ratio of bismuth, carbon, and hardening substance can be set to 7:5:1.

Alternatively, the flange 120 can comprise a mixture of bismuth and carbon of about 3:1 (about 75%: 25%), and can further comprise about 1% hardened material. In this case, the hardened substance may contain a hardened substance of hydrogen peroxide.

The flange 120 has a Shore hardness (Hs) of 50 to 40. In this case, the Shore hardness indicates the hardness determined by the height of a rebound of a hammer when it falls from a predetermined height.

The suction cup 100 is formed of a non-conductive material. Further, the main body and the flange of the suction cup 100 can be integrally formed by injection molding.

Meanwhile, for example, as shown in FIG. 6, the flange 120 includes a vertical flange 121 and a slanted flange 123, the vertical flange 121 vertically protrudes from the outer side of the flange, and the slanted flange 123 is vertical The flange 121 extends and, at the position of the inclined flange 123, the outer side of the flange is inclined in the outward direction. And, the inclined flange 123 At least a portion of the portion is formed to be inclined in an outward direction of the flange.

Specifically, the inner side of the vertical flange 121 is formed to be inclined toward the outer side of the flange, and the outer side of the vertical flange 121 is formed to extend vertically from the spacing portion 130. On the other hand, the inner side and the outer side of the inclined flange 123 are formed to be inclined toward the outer side of the flange.

As a result, the flange has a gradually widened shape in appearance and the vertical flange 121 is relatively thicker than the inclined flange 123.

In this case, the inclined flange 123 forming the tip end of the flange 120 is freely deformable in accordance with the shape of the contact terminal, that is, the spherical shape. In detail, the slanted flange 123 of the flange 120 is in contact with at least one of the ball-shaped contact terminals and then sucks and maintains the surface on which the contact terminals are formed.

"Fig. 2" and "3" are schematic views of a state in which a chuck is used to pick up and hold a semiconductor package, and "Fig. 4" and "Fig. 5" are pressed by a chuck to a semiconductor package. The schematic diagram for picking up and holding the semiconductor package, and "figure 6" is a schematic diagram of the semiconductor package before and after handling.

Hereinafter, a process of absorbing and holding a semiconductor package in a semiconductor package processing apparatus of the present invention will be described in detail with reference to "Fig. 2" to "Fig. 6".

Please refer to "Figure 2" and "Figure 3". No pressure is applied to the chuck before picking up and holding a semiconductor package. In particular, the pick-up holder 10 and the chuck 100 placed in the head of the pick-and-place holder 10 are placed over the area of a semiconductor package.

In this case, the thickness of the shock absorbing convex portion 133 in the suction cup 100 is t1. Also, the lower body flange 120 of the suction cup 100 maintains its original shape during injection molding.

Referring to "Fig. 4" and "Fig. 5", if the pickup holder 10 is moved downward to suck and hold the semiconductor package, the flexible suction cup 100 can be temporarily pressed. At the same time, the head portion 11 of the pickup holder 10 applies pressure to the shock absorbing convex portion 133. Then, the shock absorbing convex portion 133 is compressed by the pressure applied by the head portion 11. When the pickup holder 10 applies pressure to the chuck 100 for sucking and holding the semiconductor package, the thickness of the shock absorbing convex portion 133 becomes t2.

As a result, the shock absorbing convex portion 133 is deformed from t1 to t2 through the pickup holder 10 to instantly absorb the shock applied to the semiconductor package, thereby protecting the semiconductor package.

Thereafter, referring to "Fig. 6", the thickness of the shock absorbing convex portion 133 is returned to the initial thickness t1 and the inclined flange 123 picks up and holds the spherical contact terminal or one of the semiconductor packages formed with the spherical contact terminal. surface.

Of course, during this process, an air suction device is passed through an air passage in a pick-up holder for absorbing air between the suction cup and the semiconductor package.

The suction cup according to another embodiment of the present invention will be described in detail below with reference to "Fig. 7" and "Fig. 8".

Referring to FIG. 7 and FIG. 8 , a suction cup according to another embodiment of the present invention includes a main body 210 and a main body 210 connected thereto. The flange 220. Also, the body 210 includes a spacing portion 230. The spacer portion 230 has an air suction hole 231, a through hole 232, and a shock absorbing convex portion 233. These details are substantially the same as the foregoing embodiment, and the description thereof will be omitted hereinafter.

However, the difference from the aforementioned suction cup is that the flange 220 of the present embodiment extends vertically downward, in which case the flange 220 extends to a predetermined thickness to the bottom of the spacing portion 230.

The material, processing method, and the like of the flange 200 are substantially the same as those of the foregoing embodiments, and the description thereof will be omitted below.

Different from the above-described embodiments, in the suction cups shown in "Fig. 9" and "Fig. 10", the thickness of the flange 320 protruding from the lower side of the main body is reduced downward. Specifically, the outer side of the flange 320 extends perpendicularly and downward from a spacing portion 330, and the inner side of the flange 320 is inclined in the outer direction of the flange 320.

As a result, the thickness of the flange 320 gradually decreases to extend downward, and the cross section of the adsorption space S gradually increases toward the lower side.

The top end of the flange 320, i.e., the flange extending from the spacing portion 330, is formed to be relatively thick. Thus, the durability of the flange can be improved even in the case where the bottom end of the flange is worn and damaged.

The difference from the foregoing embodiment is that in the suction cups shown in "11th" and "12th", the thickness of the flange 420 is irregular and the outer side of the flange 420 is formed by the flange 420 as a whole. The formed adsorption space S is inclined in the direction.

The flange 420 includes a vertical flange 421 and a slanted flange 423, a vertical flange The 421 extends vertically downward from an edge of a spacer portion 430, and the inclined flange 423 has a predetermined inclination angle with respect to the vertical flange 421.

Specifically, the inner side of the vertical flange 421 extends vertically in the direction of the lower portion of the spacing portion 430, and the inner side of the inclined flange 423 is inclined in the direction of the adsorption space S.

Hereinafter, the suction cups of other embodiments of the present invention will be described with reference to "Fig. 13" to "Fig. 15".

The suction cup 500 shown in Fig. 13 includes a cylindrical body 510 having an internal cavity. Also, the body 510 has a spacing portion 530. Moreover, a suction space S is formed between a flange 520 and an object to be sucked and held, and a flange 520 is formed to seal the adsorption space S.

The flange 520 projects vertically downward from the spacing portion 530 and is freely deformable according to the surface contour of the object.

In particular, the flange 520 can be closely attached to the surface of a ball contact terminal and the surface of the semiconductor package having the ball contact terminal, and the flange 520 can seal the ball protruding from the surface of an object, that is, the semiconductor package. At least a portion of a type of contact terminal.

The spacer portion 530 is provided with an air suction hole 531. Moreover, the spacer portion 530 has a through hole 532 serving as a moving path of a pressing member for removing a semiconductor package sucked and held through the chuck 500.

Moreover, the spacing portion 530 has a shock absorption adjacent to the air suction hole 531. The protruding portion 533, the shock absorbing convex portion 533 is configured to absorb the shock acting on the semiconductor package through a pick-up holder during picking up and holding the semiconductor package. The details thereof are the same as those of the foregoing embodiments and the description thereof will be omitted below.

Similar to the aforementioned suction cup shown in Fig. 13, the suction cup shown in Fig. 14/Fig. 15 includes a cylindrical body 610/710 and a flange 620/720 having a ring shape.

However, the flange 620 of the suction cup shown in Fig. 14 is inclined in the outer direction of the flange. Further, the flange 720 shown in Fig. 15 is inclined in the direction of the adsorption space S. That is, the flange 620 of the suction cup shown in "Fig. 14" is widened in the outer direction of the flange, and the flange 720 of the suction cup shown in Fig. 15 is contracted in the direction of the suction space S.

In this case, the suction cup shown in "Fig. 14" corresponds to the suction cup shown in "3" or "5". The suction cups shown in Figure 15 correspond to the suction cups shown in Figure 11 or Figure 12 above. In particular, the flange of the suction cup shown in "Fig. 14" / "Fig. 15" can be provided with a flange having a ring shape, and the "Fig. 3" / "Fig. 5" Each of the suction cups and the suction cup shown in "Fig. 11" and "Fig. 12" may be provided with a flange having a square ring.

Alternatively, the invention is not limited to the above embodiments, and optionally, the flange can have a cross section of a plurality of polygonal shapes, such as a square cross section or a circular cross section.

Fig. 16 and Fig. 17 are perspective views of a suction cup according to another embodiment of the present invention.

Referring to FIG. 16 and FIG. 17, a suction cup according to an embodiment of the present invention includes a main body 810/910 and a flange 820/920, and the main body 810/910 has a partition. Parts 830/930, and the flange 820/920 forms an adsorption space S with an object to be sucked and held.

As shown in Fig. 16, the spacer portion 830 has an air suction hole 831, a through hole 832, and a shock absorbing convex portion 833. These details are substantially the same as the foregoing embodiments, and the description thereof will be omitted below.

Meanwhile, each of the suction cups of this embodiment has a plurality of flanges which are different from the foregoing embodiments. Specifically, as shown in Fig. 16, a plurality of flanges are uniformly spaced apart from each other and overlap each other. The plurality of flanges 821 and 825 shown in Fig. 16 extend vertically and downward from the spacing portion 830. A pair of overlapping flanges 921 and 925 shown in Fig. 17 protrude from one edge of the partition portion 930 and are inclined in the outer direction of the flanges.

Please refer to FIG. 16 / FIG. 17 . The first flange 821 / 921 and the second flange 825 / 925 form a first adsorption space S1 with an object to be sucked and held, that is, a semiconductor package. a second adsorption space S2.

The second adsorption space S2 is prepared for the case where the first adsorption space S1 is not completely sealed. In the case where air leaks out of the space formed by the first flange and is not completely sealed, the second flange forms an air-tight adsorption space for suction Take and maintain the semiconductor package.

The above embodiments do not limit the different embodiments of the present invention. For example, as shown in Fig. 18, the plurality of flanges may have different protruding lengths from each other. In particular, the length of the first flange 921 may be set to 0.5 to 0.8 millimeters (mm) and the length of the second flange 925 may be set to 0.8 to 1.0 millimeters (mm). In this case, the difference in length between the first flange 921 and the second flange 925 is 0.2 to 0.5 millimeters (mm).

If the length of the first flange 921 is equal to the length of the second flange 925, the remaining vacuum pressure remaining in the second adsorption space S2 may prevent a package from being unloaded. Therefore, if there is a step difference between the two lengths, the influence of the remaining vacuum pressure can be reduced.

Alternatively, the plurality of flanges are mounted to be evenly spaced from one another such that each individual and independent sorption space can be formed between the flange and the object to be aspirated and retained.

For example, a first air suction hole 831 and a second air suction hole (not shown) can be separately disposed in the spacing portion, wherein the first air suction hole 831 is used to extract air in the first adsorption space S1. The second air suction hole is for extracting the air in the second adsorption space S2.

If a plurality of independent adsorption spaces are formed, they help to distribute the overall air adsorption of the object. Therefore, the adsorption force of the object can be improved.

In particular, in the case where the adsorption surface of the object to be sucked and held is uneven, for example, if the adsorption surface is uneven, a plurality of flanges different in height from each other are used for the respective adsorption spaces. Therefore, it is easy to suck and hold the object.

FIG. 19 and FIG. 20 are schematic views of a chuck of a semiconductor package processing apparatus according to another embodiment of the present invention.

Referring to "Fig. 19" and "20th drawing", the difference from the foregoing embodiment is that the suction cup of the present embodiment includes a plate-like sealing member separated from the main body 1010. The suction cup 1000 of the present embodiment includes a main body 1010 and a sealing plate 1020, wherein the main body 1010 has a cavity therein, and the sealing plate 1020 is attached to the main body 1010.

The body 1010 includes a spacing portion 1130 having a plurality of apertures. Further, a sealing plate 1020 is attached to the bottom surface of the spacing portion 1130.

In particular, the sealing plate 1020 is formed of a different material from the body 1010 and may be attached to the bottom surface of the spacing portion 1130. For example, the body 1010 is formed of a hard material, and the sealing plate 1020 may be formed of one of an ultrafine cloth, a cotton flannel, a gel fabric, a soft palate, and the like.

Alternatively, the sealing plate 1020 may be formed of a material of an adhesive tape formed of, for example, a polyurethane produced by "SK utis" Co., Ltd., in detail, the company uses a roll-type polyurethane. (polyurethane) foam form and sold under the name 〞eSORBA SRP series 〞.

If the sealing plate 1020 is formed of a polyurethane foam, the durability of the sealing plate 1020 can be improved as compared with a sealing plate formed of other materials. If the sealing plate 1020 is repeatedly used, the sealing plate 1020 may be damaged due to fatigue. However, due to the polyurethane The sealing plate 1020 is resistant to fatigue damage due to repeated use, and thus the durability is considerably improved.

The sealing plate 1020 formed of one of the above materials can be freely deformed according to the surface profile of the semiconductor package to be sucked and held.

Further, the main body of this embodiment can be formed of the same material as the suction cup of one of the above embodiments.

FIG. 21 is a schematic view of a suction cup according to still another embodiment of the present invention. The suction cup of the present embodiment is similar to the suction cup shown in the above-mentioned "19th" and "20th".

Referring to FIG. 21 to FIG. 23, a suction cup 1100 includes a main body 1110 and a sealing plate 1120 attached to the main body 1110. Similar to the suction cup shown in Fig. 19, the sealing plate 1120 can be formed of, for example, polyurethane and the like. "FIG. 23" is a schematic view of picking up a semiconductor package using the chuck 1100. In the process of picking up the semiconductor package, the sealing plate 1120 shown in Fig. 23 is sealed by vacuum covering by covering the contact terminals protruding from the surface of the semiconductor package. The sealing plate 1120 may be formed of any material that is freely deformable and sufficient to obtain a seal by covering the contact terminal, such as a polyurethane foam or the like.

24 to 26 are schematic views of a suction cup 1200 according to still another embodiment of the present invention, and the suction cup of the present embodiment is similar to the embodiment shown in "19th to 23rd". However, in this embodiment, a protruding portion 1211 is disposed on the main On body 1210. In the process of sucking and holding the package 1, the protruding portion 1211 is in contact with the surface of the semiconductor package 1 to prevent deformation of the semiconductor package 1. In "Fig. 26", the protruding portion 1211 is formed in contact with the edge portion of the semiconductor package 1. In this case, the protruding portion 1211 can be higher than the contact terminal of the semiconductor package 1. The protruding portion 1211 can be used as a stopper to prevent a package from being excessively adhered to the chuck, and if the semiconductor package 1 is excessively adhered to the chuck, the contact terminal of the package can be pressed and damaged. Also, the package is difficult to uninstall quickly.

Hereinafter, a semiconductor package processing apparatus having a chuck according to an embodiment of the present invention will be described with reference to "27th".

Referring to FIG. 27, a semiconductor package processing apparatus according to an embodiment of the present invention includes a pick-and-place holder 10 connected to an external air suction device for picking up and holding a semiconductor package. The chuck 100 is disposed at one end of the pick-and-place holder 10, and a test device 30 for testing the processing state of the semiconductor package.

The semiconductor package processing device can include a reflective member 50 disposed on the chuck 100 for the test device 30 to correctly identify image information on the semiconductor package.

In this case, the test apparatus 30 includes an image pickup apparatus capable of taking an image of the bottom surface of the semiconductor package 1. Moreover, the camera device includes a normal camera, a CCD camera or the like.

The process of the reflection member 50 taking in the image information of the bottom surface of the semiconductor package 1 The background image of the semiconductor package 1 can be arranged. Therefore, the cross section of the reflecting member 50 should be larger than the cross section of the suction cup 100 from the viewpoint of the test device. Also, the reflecting member 50 can be formed of any material such as metal, plastic, and the like.

The color of the reflective member 50 can be selected to be different from the color of the bottom surface of the semiconductor package. This is to allow the reflector 50 to be distinguished from the semiconductor package in the image taken by the test device.

For example, if the color of the bottom surface of the semiconductor package is black, the reflective member 50 can have any color that is different from the color of the bottom surface of the semiconductor package, such as white, yellow, and the like.

"Fig. 28" is a perspective view of a state in which a suction cup is used to suck and hold a BOC (Board-On-Chip) package 5.

Referring to Fig. 28, even if the surface of a package such as a BOC package is irregular and uneven, a soft flange is deformed along the surface of one of the packages, and the surface is sucked and held.

FIG. 29 and FIG. 30 are schematic views of a suction cup according to still another embodiment of the present invention. Similar to the suction cup shown in the aforementioned "16th drawing", the suction cup in this embodiment has a plurality of flanges.

Referring to FIG. 29, a suction cup includes a main body 1510 and a plurality of flanges 1521 and 1525. The main body 1510 has a spacing portion 1530.

In this case, the flange has a double flange structure. The double flange structure has an outer flange 1525 and an inner flange 1521, the inner flange 1521 and the outer flange The 1525 is evenly spaced apart and overlaps the outer flange 1525.

The height of the inner flange 1521 is different from the height of the outer flange 1525. In the suction cup shown in "Fig. 29", the height of the inner flange 1521 is smaller than the height of the outer flange 1525.

As shown in "Fig. 30", the inner side of the outer flange 1525 can be gradually widened downward. That is, it is tapered. In the suction cup shown in Fig. 29, the outer side of the outer flange 1525 can also be tapered.

The outer flange 1525 can have the same configuration as one of the flanges of the chuck shown in "1" to "15".

At the same time, the inner flange 1521 is located within the outer flange 1525, and the height of the inner flange 1521 is smaller than the height of the outer flange 1525.

As shown in Fig. 30, one inner side 1521a of the inner flange 1521 is tapered and its outer side 1521b is vertically disposed. Also, one of the root sides of the outer flange 1525 may be formed to be thicker than the minimum thickness of the outer flange 1525.

If the heights of the flanges are equal to each other, a residual vacuum pressure can be maintained between the inner flange 1521 and the outer flange 1525, thereby preventing the unloading of a package. For this reason, if the inner flange 1521 is formed to be lower than the outer flange 1525, the influence of the remaining vacuum pressure can be reduced. Also, in the process of unloading the package, the inner flange 1521 can effectively transfer the package efficiently by pushing a package with the restoring force of the flange. In this case, the outer portion 1521b of the inner flange 1521 is vertically disposed and the inner flange 1521 is formed thicker than the outer flange 1525. Full resilience.

Due to the residual vacuum pressure held between the inner flange 1521 and the outer flange 1525, the package may be unevenly separated from the suction cup. The package portion that is first separated from the suction cup is first dropped, whereby the package can be tilted down. Therefore, the package can be unloaded off the ground or upside down. However, the restoring force of the inner flange 1521 enables the package to be evenly separated and dropped from the suction cup. Therefore, the package can be unloaded without deviating from its ground position or upside down.

Thus, the inner flange 1521 enables the package to be quickly and evenly separated from the suction cup, thereby facilitating the package to be undisturbed or not upside down to reach the destination.

In this case, contrary to the case shown in "Fig. 30", the flange can be formed into a tapered shape in such a manner that the width gradually decreases downward.

The thicknesses of the inner flange 1521 and the outer flange 1525 are respectively formed to gradually decrease toward the terminal portion thereof. Since the terminal portions of the inner flange 1521 and the outer flange 1525 should be easily deformed according to the surface profile of a package for achieving vacuum sealing of a reliable seal, it is preferably formed to be thin.

The outer flange 1525 of the suction cup having the double flange is more flexible than when the inner flange 1521 is deformed. In the suction cup shown in "Fig. 30", the inner flange 1521 is formed thicker and shorter than the outer flange 1525. Preferably, the inner flange 1521 is formed to enable a package to be quickly separated by providing an appropriate restoring force to the package. And preferably, the outer flange 1525 can be based on the wheel of a package surface The profile is sufficiently and flexibly deformed to achieve a reliable seal sufficient to create vacuum adsorption.

Further, as shown in "Fig. 30", a stopper 1540 is disposed in the inner flange 1521. The stopper 1540 is for preventing a package from being excessively sucked and held by the chuck. If the package is excessively tightly adhered, it can cause cockroaches to stick. Therefore, the stopper 1540 is used to prevent the crucible from sticking to the crucible.

The vertical distance between the terminal portion of the stopper 1540 and the terminal portion of an outer flange 1525 is preferably formed to be greater than the height of the contact terminal of a package surface. During picking up a package, the stopper 1540 is in contact with the surface of a package and then prevents the package from sticking further to the chuck.

"31st" to "35th" is a schematic diagram of a unit pickup that simultaneously picks up and holds a plurality of semiconductor packages. If a tape package is cut by a blade into a plurality of individual semiconductor packages, the packages are simultaneously drawn and held by a single action and then transferred to a cleaning process. In this case, the unit pickup can be used.

Referring to FIG. 31, after the dicing process is completed, a semiconductor package is placed on a ram 9 and a semiconductor package absorbing device 101 is placed over the gantry 9 for absorbing and holding the semiconductor package.

The semiconductor package processing apparatus includes a frame having at least one or more air passages 161 and 171 associated with the external air suction device, and at least one suction cup 100 coupled to the air passage for sucking and holding a semiconductor package, And a suction cup holder 111 detachably assembled with the suction cup 100. Such a situation In the case where the suction cup 100 is substantially the same as the suction cup shown in "Fig. 1", the details thereof will be omitted below.

The frame includes a first frame 141 and a second frame 129, and the second frame 129 is located below the first frame 141. The air passage includes a main air passage 171 and a separate air passage 161 between the first frame 141 and the second frame 129, and the separate air passage 161 is associated with the main air passage 171 and the suction cup 100.

The chuck holder 111 is disposed in a main body below the second frame 129. In particular, the chuck holder 111 and the second frame 129 are integrally formed by injection molding.

Alternatively, the chuck holder 111 and the second frame 129 may be formed separately and then joined together. The following description will be combined with "40th drawing".

The suction cup is directly attached to a bottom of the second frame 129 through the bonding. In particular, in order to prevent air from leaking between the suction cup and the second frame 129, the suction cup and the second frame 129 are combined in an air seal. However, in order to replace the suction cup, the suction cup may be attached to or separated from the bottom of the second frame 129 by a force applied by a user.

Alternatively, the suction cup is loaded into the chuck holder 111 and attached to the bottom of the second frame 129.

Alternatively, a plurality of suction cups may be provided. Moreover, the plurality of suction cups can be manufactured as one body. In particular, each of the suction cups is disposed integrally with the bottom of the second frame 129 as being integrally spaced apart from each other. Moreover, each of the suction cups can be injected through each other Combine the terrain into one.

Since the suction cups are integrally formed by injection molding, the management of these suction cups can be simplified. In particular, in the case of attempting to replace these suction cups, a user can facilitate the replacement of the suction cups by attaching or detaching them as an integral suction cup.

The suction cup 100 can protrude from the bottom of the second frame 192 by a predetermined length. This allows the chuck 100 to be elastically deformed during the process of absorbing and holding the semiconductor package. Also, if the chuck is protruding, it is more convenient to be in contact with the semiconductor package.

Fig. 32 is a cross-sectional view showing a state in which a semiconductor package suction device of the present invention picks up and holds a semiconductor package on a chuck.

The detailed configuration of the chuck 9 is substantially the same as the prior art, and the description thereof will be omitted below. Of course, a suction cup can also be arranged on the top of the clamping table.

Fig. 33 is a cross-sectional view showing a state in which a semiconductor package suction device of the present invention carries a semiconductor package that has been taken up and held. The semiconductor package undergoes a cleaning process when it is drawn and held through the suction device.

Fig. 34 is a view showing a state in which a semiconductor package suction device of the present invention places a semiconductor package on a dry block. Further, Fig. 35 is a view showing a state in which a semiconductor package suction device of the present invention performs a semiconductor package.

In the dry block, designated air channels 50 and 70 are formed for drawing and holding the semiconductor package. Of course, the air passages 50 and 70 are configured to be associated with an external air suction device.

As shown in FIG. 34 and FIG. 35, the drying block includes a first block 40 and a second block 20, and the second block 20 is located below the first block 40. Unlike the clamping table, the drying block does not have a floppy disk for accommodating the semiconductor package.

Once the semiconductor package is secured over the first block 40, the semiconductor package is dried through the heating means of the drying block.

"37th" to "39th" is a schematic diagram of a unit pickup having the suction cups shown in "16th" and "17th".

The process of using this unit pickup to pick up and hold a semiconductor package will be described below.

Please refer to Figure 37. No pressure is applied to the chuck before adsorbing a semiconductor package. In this case, the spacer portion 830 and the flanges 821 and 825 maintain the original shape in the injection molding.

Please refer to "Fig. 38", as long as the semiconductor package is sucked by a chuck, the chuck is pressed temporarily and pressurefully. In this case, the thickness of the spacer portion 830 is immediately deformed to absorb the shock applied to the semiconductor package, thereby protecting the semiconductor package.

Referring to FIG. 39, the spacer portion 830 returns to the initial thickness and the flanges 821 and 825 pick up and hold a spherical contact terminal or a surface of a semiconductor package on which the spherical contact is formed. terminal.

During this process, each of the flanges encloses a portion of the ball contact terminal for tightly adhering the surface of the semiconductor package. And the air suction device is disposed at the top The air passage of the frame draws air between the suction cup and the semiconductor package.

In this case, the flange is a square ring that protrudes on a chuck body. Alternatively, the flange can be a circular or polygonal ring.

Fig. 40 is a schematic view of a different type of unit pickup in which the suction cup is substantially the same as the suction cup shown in Fig. 1, and therefore, the description of the details of the suction cup will be omitted hereinafter.

In the unit pickup shown in "Fig. 40", a chuck holder 1800 is detachably fitted to the frame, and more specifically, to a second frame 1300.

For assembly between the chuck holder 1800 and the second frame 1300, a first latching portion 1310 having a predetermined shape is disposed at a lower end portion of the second frame 1330, and a second latching portion 1810 The suction cup holder 1800 is disposed to correspond to the first blocking portion 1310.

The first latching portion 1310 includes a first recess recessed into the second frame 1330 and a first thread of the recess.

The second latching portion 1810 is disposed on a top edge of the chuck retainer 1800, and the second latching portion 1810 includes a second thread corresponding to the first thread.

After the chuck holder 1800 is threadedly locked to the second frame 1300, the suction cup is latched to the chuck holder.

Alternatively, the suction cup holder 1800 can be locked to the second frame 1300 after the suction cup is locked to the suction cup holder 1800. Optionally, a seal may be disposed between the chuck holder 1800 and the second frame 1300 to prevent air leakage.

Alternatively, the chuck holder 1800 and the second frame 1300 can be implemented in different ways in addition to the embodiments described above. For example, the suction cup holder 1800 and the second frame 1300 can be locked together by a fastener fitting hook.

"41" to "43" are schematic views of a unit pickup according to another embodiment of the present invention.

As shown in "41" to "43", the same reference numerals are used in the drawings to denote the same or similar components as the unit pickup described above. Also, the detailed description thereof will be omitted below.

First, a suction cup 1150 is similar to a plurality of suction cups formed integrally as shown in "23rd to 26th".

A plurality of through holes are formed in the suction cup 1150 for respectively corresponding to the respective air passages 161. Moreover, the suction cup 1150 is provided with a plurality of grooves 1131, and the grooves 1131 are corresponding to the through holes for enabling the plurality of flanges 1140 to be inserted and attached thereto.

A groove 1401 is disposed in the second frame 1400 of the unit pickup to allow the suction cup 1150 to be inserted and attached thereto. In the aforementioned unit pickup, there are a plurality of pickup holders. However, in the unit pickup of this embodiment, there is no pick holder of the aforementioned type. In this case, the suction cup 1150 is integrally inserted and attached to the second frame 1400, and the suction cup 1150 can be assembled to the second frame 1400. This assembly method facilitates assembly work and also facilitates maintenance and repair of the suction cup 1150 and the second frame 1400.

Fig. 44 is a schematic view showing a unit pickup of still another embodiment of the present invention. As shown in Figure 44, one of the unit pickers differs from the unit pick-up shown in Figures 41 to 43 as suction cups, and other aspects and "41" The unit pickup shown in "Fig. 43" is the same.

Referring to "Fig. 44", the suction cup 1180 used as a unit pickup does not have a recess for inserting and attaching a flange 1170. Further, the flange 1170 of the suction cup 1180 is formed integrally.

The flange 1170 is aligned in this position by aligning the flange 1170 with the corresponding position of the body 1160 of the suction cup 1180. The assembly of the suction cup 1180 can be completed.

The suction cup 1180 shown in Fig. 44 has an integral flange 1170. Therefore, the assembly work is very simple and the management of the flange 1170 is convenient.

In addition, "Fig. 45" is a bottom view of one of the unit pickups shown in "41" and "42".

While the invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention. Those skilled in the art will appreciate that various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the invention includes modifications and refinements that do not depart from the scope of the inventions. For example, the present invention is applicable to different structures capable of picking up and holding a package, such as an unloading picker, a unit picker, a turntable picker, a chuck, a turntable (during cutting), and the like.

The present invention relates to a semiconductor package processing apparatus, and more particularly to The suction cup of the present invention is suitable for more efficiently absorbing and holding a semiconductor package. Therefore, the chuck of the present invention is freely deformable according to a surface profile of a semiconductor package to be sucked and held, thereby facilitating the suction of an uneven surface such as a ball grid array (BGA) package, a BOC package, and the like. maintain.

1‧‧‧Semiconductor package

5‧‧‧BOC package

9‧‧‧Clamping table

10‧‧‧ Pickup holder

11‧‧‧ Pick the head of the holder

20‧‧‧Second block

30‧‧‧Testing device

40‧‧‧First block

50‧‧‧reflector

70‧‧‧Air passage

100, 500, 1000, 1100, 1150, 1180, 1200‧‧ ‧ sucker

101‧‧‧Semiconductor package suction device

110, 210, 510, 610, 710, 810, 910, 1010, 1110, 1160, 1210, 1510‧‧‧ subjects

111‧‧‧Sucker holder

120, 200, 220, 320, 420, 520, 620, 720, 820, 920, 1140, 1170‧‧‧ flange

121, 421‧‧‧ vertical flange

123, 423‧‧‧ slanted flange

129‧‧‧ second frame

130, 230, 330, 430, 530, 830, 930, 1130 ‧ ‧ interval

131, 231, 531‧‧ ‧ air suction holes

132, 232, 532, 832‧‧‧ through holes

133, 233, 533, 833 ‧ ‧ shock absorption convex part

140‧‧‧ tilted section

141‧‧‧ first frame

150‧‧‧Separation prevention section

161‧‧ separate air passage

171‧‧‧Main air passage

821, 921‧‧‧ first flange

825, 925‧‧‧ second flange

831‧‧‧First air suction hole

1020, 1120‧‧‧ sealing plate

1131, 1401‧‧‧ grooves

1211‧‧‧ highlight

1300, 1400‧‧‧ second framework

1310‧‧‧First blocked part

1521‧‧‧Internal flange

1521a‧‧‧ inside of the inner flange

1521b‧‧‧Outside the inner flange

1525‧‧‧External flange

1530‧‧‧ interval part

1540‧‧‧stop

1800‧‧‧Sucker holder

1810‧‧‧Second lock

S‧‧‧Adsorption space

S1‧‧‧First adsorption space

S2‧‧‧Second adsorption space

T1, t2, t3‧‧‧ thickness

1 is an exploded perspective view of a main structure of a semiconductor package processing apparatus using a chuck of an embodiment of the present invention before picking up and holding a semiconductor package; and FIG. 2 is a drawing of a chuck for picking up and holding a semiconductor A perspective view of the state before packaging; FIG. 3 is a cross-sectional view of FIG. 2; and FIG. 4 is a perspective view of the suction pad pressed against a semiconductor package for absorbing and holding the semiconductor package; Figure 4 is a cross-sectional view of the semiconductor package taken up and held prior to handling; Figure 7 is a perspective view of the suction cup of another embodiment of the present invention; 7 is a cross-sectional view of a suction cup according to still another embodiment of the present invention; FIG. 10 is a cross-sectional view of FIG. 9; and FIG. 11 is still another embodiment of the present invention. a perspective view of a suction cup of the example; Fig. 12 is a cross-sectional view of Fig. 11; 13 to 15 are perspective views of a suction cup according to another embodiment of the present invention; FIGS. 16 and 17 are perspective views of a suction cup according to another embodiment of the present invention; and FIG. 18 is a 17th view FIG. 19 and FIG. 20 are schematic views of a suction cup according to still another embodiment of the present invention; and FIGS. 21 to 23 are schematic views of a suction cup according to still another embodiment of the present invention; Figure 26 is a schematic view of a suction cup according to still another embodiment of the present invention; Figure 27 is a schematic view showing a state in which a semiconductor package processing apparatus of the present invention is used; and Figure 28 is a suction cup for sucking and holding A perspective view of a state of a BOC (Board-On-Chip) package 5; FIGS. 29 and 30 are schematic views of a suction cup according to still another embodiment of the present invention; and FIG. 31 is a semiconductor package suction of the present invention. A cross-sectional view of a state before the device is aspirated from a semiconductor package mounted on a clamping stage; and FIG. 32 is a cross-sectional view showing a state in which a semiconductor package suction device of the present invention picks up and holds a semiconductor package; The figure is a semiconductor package suction device of the present invention A cross-sectional view showing a state of a semiconductor package that is taken up and held; and FIG. 34 is a cross-sectional view showing a state in which a semiconductor package suction device of the present invention places a sucked and held semiconductor package in a dry block; Figure 35 is a cross-sectional view showing a state in which a semiconductor package suction device of the present invention performs a semiconductor package handling; and Figure 36 is a cross-sectional view of a suction cup using an embodiment of the present invention; 39 is a cross-sectional view showing a state in which a chuck of an embodiment of the present invention is used; and FIG. 40 is a cross-sectional view showing a semiconductor package suction device according to another embodiment of the present invention; FIG. 41 to FIG. A cross-sectional view of a semiconductor package processing apparatus and a chuck according to still another embodiment of the present invention; and FIG. 44 is a cross-sectional view of a semiconductor package processing apparatus and a chuck according to still another embodiment of the present invention; and The figure is a schematic diagram of a semiconductor package processing apparatus according to still another embodiment of the present invention.

1‧‧‧Semiconductor package

10‧‧‧ Pickup holder

11‧‧‧ Pick the head of the holder

100‧‧‧Sucker

110‧‧‧ Subject

120‧‧‧Flange

130‧‧‧ interval section

131‧‧‧Air suction holes

132‧‧‧through hole

133‧‧‧Vibration absorption convex part

140‧‧‧ tilted section

S‧‧‧Adsorption space

Claims (22)

A chuck for a semiconductor package processing apparatus, the chuck is used for a BOC package or a ball grid array package of a semiconductor package processing device and is formed of a non-conductive material, and the chuck comprises: a body having an air suction hole; At least one soft seal is flexibly deformed according to a surface contour of a suction target, the at least one soft seal is for sealing an adsorption space, the adsorption space is associated with the air suction hole; and a shock absorption convex portion The shock absorbing convex portion is disposed adjacent to the air absorbing hole and located between a pick-up holder and a semiconductor package, and the shock absorbing convex portion is used for sucking and holding the semiconductor package process Absorbing shock applied to the semiconductor package, wherein the seal includes a flange disposed on a lower portion of the body, wherein the seal is comprised of tantalum, carbon, and hardening Forming a material of the material, wherein the sealing member and the semiconductor package therebetween form the adsorption space, and the flange is according to a surface profile of the drawn semiconductor package By the deformation. The suction cup of the semiconductor package processing apparatus according to claim 1, wherein the flange and the main system are integrally formed to be arranged in a single block structure. A chuck for a semiconductor package processing apparatus according to claim 2, wherein the thickness of the flange gradually decreases from a root of the flange toward a terminal portion of the flange. The suction cup of the semiconductor package processing apparatus according to claim 3, wherein the lower portion of the flange has a thickness of 0.1 to 0.5 mm. The chuck of the semiconductor package processing apparatus of claim 3, wherein the upper portion of the flange has a thickness of 0.3 to 0.8 mm. The chuck of the semiconductor package processing apparatus according to claim 1, wherein the flange has a length of 0.7 to 1.0 mm. The chuck of the semiconductor package processing apparatus according to claim 1, wherein a ratio of a crucible, a carbon, and a hardening substance in the flange is set to 7:5:1. A chuck for a semiconductor package processing apparatus according to claim 1, wherein at least a portion of an inner side of the flange is inclined in an outer direction of the flange. The suction cup of the semiconductor package processing apparatus according to claim 1, wherein the outer side of the flange includes a vertical surface and an inclined surface which is inclined in an outward direction. A chuck for a semiconductor package processing apparatus according to claim 1, wherein the flange has a circular or polygonal cross section. A chuck for a semiconductor package processing apparatus according to claim 1, wherein the flange includes at least two flanges which are uniformly spaced apart from each other and overlap each other. The chuck of the semiconductor package processing apparatus of claim 11, wherein an inner flange of the at least two overlapping flanges is more than a flange of the outer two overlapping flanges short. The chuck of the semiconductor package processing apparatus of claim 12, wherein the inner flange and the outer flange have a length difference of about 0.2 to 0.5 millimeters (mm). The chuck of the semiconductor package processing apparatus according to claim 11, wherein the inner flange has a length of 0.4 to 0.8 mm (mm) and wherein the outer flange has a length of 0.7 to 1.0 mm (mm). . The chuck of the semiconductor package processing apparatus of claim 12, wherein the inner flange is thicker than the outer flange. The chuck of the semiconductor package processing apparatus of claim 15, wherein the thickness of the inner flange is gradually reduced from a root portion connected to the body to a terminal portion. The chuck of the semiconductor package processing apparatus according to claim 16, wherein the inner side of the inner flange is gradually inclined toward the terminal portion in an outer direction. The suction cup of the semiconductor package processing apparatus according to claim 17, wherein one of the outer sides of the inner flange is vertically disposed. The chuck of the semiconductor package processing apparatus according to claim 2 or 11, further comprising a stopper for limiting the adhesion of the adsorption target. The suction cup of the semiconductor package processing apparatus according to claim 19, wherein the stopper is disposed in the adsorption space. The suction cup of the semiconductor package processing apparatus of claim 2, wherein in the process of removing the sucked object, the body further comprises a through hole serving as a moving passage of a pressing member. The pressing member is used to apply a pressure to the adsorption target. A chuck for a semiconductor package processing apparatus, the chuck is used for a BOC package or a ball grid array package of a semiconductor package processing device and is formed of a non-conductive material, and the chuck comprises: a plurality of bodies, and the main systems respectively comprise a plurality of air suction holes; and a plurality of soft flanges respectively disposed on the main body, the soft flanges being flexibly deformed according to a surface contour of an adsorption target, the soft flanges Provided to seal a plurality of adsorption spaces, the adsorption spaces are respectively associated with the air suction holes; and a shock absorption convex portion, the vibration absorption convex portion is adjacent to the air suction hole And disposed between a pick-up holder and a semiconductor package, the shock absorbing convex portion for absorbing vibration applied to the semiconductor package during picking up and holding the semiconductor package, wherein the seal comprises Forming a material of carbon and a hardened material, wherein the seal and the semiconductor package therebetween form the adsorption space, and the flange is based on the surface of the drawn semiconductor package Profiles and free-form deformation.