KR19990030009U - Semiconductor Package Pick-Up Device - Google Patents
Semiconductor Package Pick-Up Device Download PDFInfo
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- KR19990030009U KR19990030009U KR2019970042679U KR19970042679U KR19990030009U KR 19990030009 U KR19990030009 U KR 19990030009U KR 2019970042679 U KR2019970042679 U KR 2019970042679U KR 19970042679 U KR19970042679 U KR 19970042679U KR 19990030009 U KR19990030009 U KR 19990030009U
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- semiconductor package
- pick
- rubber pad
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Abstract
본 고안은 반도체 패키지 픽-업장치에 관한 것으로, 종래에는 패키지의 상면을 흡착부로 밀착시 충격에 의하여 패키지의 상면을 손상시키는 문제점이 있었다. 본 고안 반도체 패키지 픽-업장치는 고무패드(12)의 연결부(12b)와 흡착부(12c) 사이에 완충부(20)를 설치하여, 패키지(11)의 흡착시 흡착부(12c)에 전해지는 충격을 완충부(20)에서 완충되도록 함으로써, 종래와 같이 흡착시 충격에 의하여 패키지의 상면을 손상시키는 것을 방지하게 되는 효과가 있다.The present invention relates to a semiconductor package pick-up apparatus, conventionally had a problem of damaging the upper surface of the package by the impact when the upper surface of the package in close contact with the adsorption unit. In the semiconductor package pick-up apparatus of the present invention, the buffer unit 20 is installed between the connection part 12b and the adsorption part 12c of the rubber pad 12 to be delivered to the adsorption part 12c when the package 11 is adsorbed. Since the shock is buffered in the shock absorbing portion 20, there is an effect of preventing damage to the upper surface of the package by the shock during the adsorption as in the prior art.
Description
본 고안은 반도체 패키지 픽-업장치에 관한 것으로, 특히 패키지의 손상을 방지하도록 하는데 적합한 반도체 패키지 픽-업장치에 관한 것이다.The present invention relates to a semiconductor package pick-up device, and more particularly to a semiconductor package pick-up device suitable for preventing damage to the package.
도 1은 종래 반도체 패키지 픽-업장치의 구성을 보인 정면도로서, 도시된 바와 같이 종래 반도체 패키지 픽-업장치는 패키지(1)의 상면을 흡착하기 위한 고무패드(2)와, 그 고무패드(2)에 상측으로 연결되어 있는 진공배관(3)으로 구성되어 있다. 그리고, 상기 고무패드(2)는 상기 진공배관(3)의 하단부가 삽입되는 원통부(4)와, 그 원통부(4)의 하단부에 연결되는 연결부(5)와, 그 연결부(5)의 하단부에 연결되는 흡착부(6)로 구성되어 있다.1 is a front view showing the configuration of a conventional semiconductor package pick-up device. As shown in the drawings, a conventional semiconductor package pick-up device includes a rubber pad 2 for absorbing an upper surface of a package 1 and a rubber pad ( It consists of the vacuum piping 3 connected to 2) upwards. The rubber pad 2 has a cylindrical portion 4 into which a lower end of the vacuum pipe 3 is inserted, a connecting portion 5 connected to a lower end of the cylindrical portion 4, and a connecting portion 5 of the cylindrical portion 4. It consists of the adsorption part 6 connected to the lower end part.
상기와 같이 구성되어 있는 종래 반도체 패키지 픽-업장치는 이송하고자 하는 패키지(1)의 상면에 흡착부(6)를 밀착시키고, 진공배관(3)를 통하여 진공을 발생시키면 흡착부(6)의 하면에 패키지(1)가 부착되며, 이와 같이 패키지(1)가 부착된 상태로 이송장소로 이송한 다음, 진공배관(3)의 진공을 차단하면 흡착부(6)의 하면에서 패키지(1)가 떨어져서 이송을 완료하게 된다.In the conventional semiconductor package pick-up apparatus configured as described above, the adsorption part 6 is brought into close contact with the upper surface of the package 1 to be transported, and when a vacuum is generated through the vacuum pipe 3, When the package 1 is attached to the lower surface, the package 1 is attached to the transfer place with the package 1 attached thereto, and then the vacuum of the vacuum pipe 3 is cut off, so that the package 1 is attached to the lower surface of the adsorption part 6. Will drop to complete the transfer.
그러나, 상기와 같이 구성되어 있는 종래 반도체 패키지 픽-업장치는 패키지(1)의 상면에 흡착부(6)를 밀착시 충격에 의하여 패키지(1)의 상면을 손상시키는 문제점이 있었다.However, the conventional semiconductor package pick-up apparatus configured as described above has a problem in that the upper surface of the package 1 is damaged by an impact when the adsorption portion 6 is closely attached to the upper surface of the package 1.
상기와 같은 문제점을 감안하여 안출한 본 고안의 목적은 패키지의 상면에 흡착부를 밀착시 패키지의 상면을 손상시키지 않도록 하는데 적합한 반도체 패키지 픽-업장치를 제공함에 있다.An object of the present invention devised in view of the above problems is to provide a semiconductor package pick-up device suitable for not damaging the upper surface of the package when the adsorption unit is in close contact with the upper surface of the package.
도 1은 종래 반도체 패키지 픽-업장치의 구성을 보인 정면도.1 is a front view showing the configuration of a conventional semiconductor package pick-up device.
도 2는 본 고안 반도체 패키지 픽-업장치의 구성을 보인 정면도.Figure 2 is a front view showing the configuration of the invention semiconductor package pick-up device.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
11 : 패키지12 : 고무패드11: package 12: rubber pad
12a : 원통부12b : 연결부12a: cylindrical portion 12b: connecting portion
12c : 흡착부13 : 진공배관12c: adsorption part 13: vacuum piping
20 : 완충부20a : 확개부20: buffer part 20a: extension part
20b : 축소부20b: reduction
상기와 같은 본 고안의 목적을 달성하기 위하여 원통부의 하단부에 연결부가 설치되어 있고, 그 연결부의 하단부에 패키지의 상면을 흡착하기 위한 흡착부가 설치되어 있는 고무패드와, 그 고무패드의 상단부에 연결되는 진공배관으로 구성되어 있는 반도체 패키지 픽-업장치에 있어서, 상기 연결부와 흡착부의 사이에 완충부가 형성되어 있는 것을 특징으로 하는 반도체 패키지 픽-업장치가 제공된다.In order to achieve the object of the present invention as described above, a connection part is provided at the lower end of the cylindrical part, and a rubber pad having an adsorption part for adsorbing the upper surface of the package at the lower end of the connection part is connected to the upper end of the rubber pad. In a semiconductor package pick-up device composed of a vacuum pipe, a semiconductor package pick-up device is provided, wherein a buffer part is formed between the connection part and the suction part.
이하, 상기와 같이 구성되어 있는 본 고안 반도체 패키지 픽-업장치를 첨부된 도면의 실시예를 참고하여 보다 상세히 설명하면 다음과 같다.Hereinafter, the present invention semiconductor package pick-up apparatus configured as described above will be described in more detail with reference to an embodiment of the accompanying drawings.
도 2는 본 고안 반도체 패키지 픽-업장치의 구성을 보인 정면도로서, 도시된 바와 같이, 본 고안 반도체 패키지 픽-업장치는 패키지(11)를 흡착하기 위한 고무패드(12)와, 그 고무패드(12)의 연결되며 진공을 발생시키기 위한 진공배관(13)으로 구성되어 있다.2 is a front view showing the configuration of the semiconductor package pick-up device of the present invention. As shown, the semiconductor package pick-up device of the present invention includes a rubber pad 12 for absorbing a package 11 and a rubber pad thereof. 12 is connected and consists of a vacuum pipe 13 for generating a vacuum.
그리고, 상기 고무패드(12)는 상기 진공배관(13)의 하단부가 삽입고정되는 원통부(12a)와, 그 원통부(12a)의 하단부에 연결되는 연결부(12b) 및 상기 패키지(11)의 상면을 흡착하기 위한 흡착부(12c)로 구성되어 있는 것은 종래와 동일하다.The rubber pad 12 includes a cylindrical portion 12a into which the lower end of the vacuum pipe 13 is inserted and fixed, a connecting portion 12b connected to the lower end of the cylindrical portion 12a, and the package 11. The structure of the adsorption | suction part 12c for adsorb | sucking an upper surface is the same as before.
여기서, 본 고안은 상기 연결부(12b)와 흡착부(12c)의 사이에 완충부(20)를 형성하여, 흡착부(12c)의 하면에 패키지(11)를 밀착시 충격을 완충할 수 있도록 되어 있다.Here, the present invention is to form a buffer portion 20 between the connecting portion 12b and the suction portion 12c, it is possible to cushion the shock when the package 11 in close contact with the lower surface of the suction portion (12c) have.
상기 완충부(20)는 상기 연결부(12b)의 하단부에 연결되는 확개부(20a)와, 그 확개부(20a)의 하단부에 연결됨과 아울러 흡착부(12c)의 상단에 연결되는 축소부(20b)로 구성되어 있다.The shock absorbing portion 20 is connected to the lower portion of the connecting portion 12b, the expansion portion 20a and the reduction portion 20b connected to the lower portion of the expansion portion 20a and connected to the upper end of the adsorption portion 12c. It consists of).
상기와 같이 구성되어 있는 본 고안 반도체 패키지 픽-업장치는 이송하고자 하는 패키지(11)의 상면에 흡착부(12c)를 밀착시키고, 진공배관(13)을 통하여 진공을 발생시키면 흡착부(12c)의 하면에 패키지(11)가 부착되며, 이와 같이 패키지(11)가 부착된 상태로 이송장소로 이송한 다음, 진공배관(13)의 진공을 차단하면 흡착부(12c)의 하면에서 패키지(11)가 떨어져서 이송을 완료하는 동작은 종래와 동일하다.In the semiconductor package pick-up apparatus of the present invention, which is configured as described above, the adsorption part 12c is brought into close contact with the upper surface of the package 11 to be transported, and when the vacuum is generated through the vacuum pipe 13, the adsorption part 12c is provided. When the package 11 is attached to the lower surface of the package 11, the package 11 is transferred to the transfer place with the package 11 attached thereto, and then the vacuum of the vacuum pipe 13 is cut off. The operation to complete the transfer with) is the same as in the prior art.
여기서, 본 고안은 패키지(11)의 상면에 흡착부(12c)를 밀착시 흡착부(12c)에 전해지는 충격이 완충부(20)에 의하여 완충되어 종래와 같이 충격에 의하여 패키지(11)의 상면을 손상시키는 것을 방지하게 된다.Here, in the present invention, when the adsorption portion 12c is brought into close contact with the upper surface of the package 11, the shock transmitted to the adsorption portion 12c is buffered by the shock absorbing portion 20, and the impact of the package 11 is achieved by the impact as in the prior art. This will prevent damage to the top surface.
이상에서 상세히 설명한 바와 같이, 본 고안 반도체 패키지 픽-업장치는 고무패드의 연결부와 흡착부 사이에 완충부를 설치하여, 패키지의 흡착시 흡착부에 전해지는 충격을 완충부에서 완충되도록 함으로써, 종래와 같이 흡착시 충격에 의하여 패키지의 상면을 손상시키는 것을 방지하게 되는 효과가 있다.As described in detail above, the inventive semiconductor package pick-up apparatus is provided with a cushioning portion between the connection portion and the adsorption portion of the rubber pad, so that the shock transmitted to the adsorption portion during the adsorption of the package is buffered in the buffer portion. Likewise, there is an effect of preventing the upper surface of the package from being damaged by the impact during adsorption.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970042679U KR19990030009U (en) | 1997-12-29 | 1997-12-29 | Semiconductor Package Pick-Up Device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970042679U KR19990030009U (en) | 1997-12-29 | 1997-12-29 | Semiconductor Package Pick-Up Device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19990030009U true KR19990030009U (en) | 1999-07-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019970042679U KR19990030009U (en) | 1997-12-29 | 1997-12-29 | Semiconductor Package Pick-Up Device |
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| Country | Link |
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| KR (1) | KR19990030009U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100934772B1 (en) * | 2006-05-19 | 2009-12-30 | 주식회사 에이디피엔지니어링 | Vacuum pad and substrate adsorption device having same |
| KR101446724B1 (en) * | 2007-04-23 | 2014-10-07 | 한미반도체 주식회사 | Suction Pad for Semiconductor Package |
-
1997
- 1997-12-29 KR KR2019970042679U patent/KR19990030009U/en not_active Application Discontinuation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100934772B1 (en) * | 2006-05-19 | 2009-12-30 | 주식회사 에이디피엔지니어링 | Vacuum pad and substrate adsorption device having same |
| KR101446724B1 (en) * | 2007-04-23 | 2014-10-07 | 한미반도체 주식회사 | Suction Pad for Semiconductor Package |
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