KR0129909Y1 - Pick-up apparatus for semiconductor package - Google Patents
Pick-up apparatus for semiconductor package Download PDFInfo
- Publication number
- KR0129909Y1 KR0129909Y1 KR2019950038595U KR19950038595U KR0129909Y1 KR 0129909 Y1 KR0129909 Y1 KR 0129909Y1 KR 2019950038595 U KR2019950038595 U KR 2019950038595U KR 19950038595 U KR19950038595 U KR 19950038595U KR 0129909 Y1 KR0129909 Y1 KR 0129909Y1
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- KR
- South Korea
- Prior art keywords
- semiconductor package
- adsorbed
- package
- contact
- pickup device
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 고안은 흡착된 패키지의 유동방지수단을 형성하므로써 패키지의 정위치 이탈없이 이송 및 이송 후의 후속작동을 수행할 수 있는 반도체 패키지 픽업장치에 관한 것으로써, 몸체와, 몸체에 형성된 반도체 패키지 흡착부와, 몸체에 형성되고 흡착된 반도체 패키지에 접하여 반도체 패키지의 유동을 방지하는 고정 가이드(Guide)를 포함하여 이루어진다.The present invention relates to a semiconductor package pickup device capable of performing subsequent operation after transfer and transfer without leaving the package in position by forming a flow preventing means of the adsorbed package, the body, the semiconductor package adsorption portion formed on the body and It includes a fixed guide (Guide) formed in the body and in contact with the semiconductor package adsorbed to prevent the flow of the semiconductor package.
여기서, 고정 가이드는 흡착된 반도체 패키지의 흡착된 면의 중심부로부터 상호 대칭되는 에지(Edge)부위에 각각 접하는 두개가 쌍으로 이루어지고, 적어도 한쌍 이상 형성되는 것이 특징이다.Here, the fixing guide is composed of two pairs, each of which is in contact with each other the edge (Edge) parts symmetrical from the center of the adsorbed surface of the adsorbed semiconductor package, characterized in that formed at least one pair.
Description
제1도는 종래의 반도체 패키지 픽업장치를 도시한 도면.1 is a view showing a conventional semiconductor package pickup device.
제2도는 본 고안에 따른 반도체 패키지의 일실시예를 도시한 도면.2 is a view showing an embodiment of a semiconductor package according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
20 : 반도체 패키지 21 : 몸체20 semiconductor package 21 body
22 : 흡착부 23 : 트래이22: adsorption portion 23: tray
24 : 고정가이드24: Fixed Guide
본 고안은 반도체 패키지 픽업(Pick-up) 장치에 관한 것으로, 특히 반도체 패키지 픽업 후 패키지의 유동을 방지하여 정위치 또는 원하는 정렬위치의 유지에 적당하도록 한 반도체 패키지 픽업 장치에 관한 것이다.The present invention relates to a semiconductor package pick-up device, and more particularly, to a semiconductor package pick-up device that prevents the flow of a package after semiconductor package pick-up so as to be suitable for maintaining a fixed position or a desired alignment position.
제1도는 종래의 반도체 패키지 픽업 장치를 도시한 도면으로, (a)는 정면도, (b)는 측면도, (c)는 다수개로 이루어진 픽업장치를 도시한 도면이다. 도면을 참조하여 간단히 설명하면, 몸체(11)와, 몸체에 형성된 진공 고무 패드로 형성된 흡착부(12)로 구성된다.1 is a view showing a conventional semiconductor package pickup device, (a) is a front view, (b) is a side view, (c) is a diagram showing a plurality of pickup devices. Briefly described with reference to the drawings, it consists of a body 11, and the suction unit 12 formed of a vacuum rubber pad formed on the body.
따라서, 트래이(Tray)(13)에 담겨진 반도체 패키지(10)를 흡착부(12)로 흡착하여 실린더 등의 작동으로 들어올린 후 원하는 위치 예를 들면 소켓의 삽입 위치로 이송하게 된다.Therefore, the semiconductor package 10 contained in the tray 13 is absorbed by the adsorption part 12, lifted up by an operation such as a cylinder, and then transferred to a desired position, for example, an insertion position of a socket.
그런데 종래의 장치는 흡착된 반도체 패키지의 유동을 방지하는 수단이 없이 단지 반도체 패키지를 흡착하여 이송하게 되므로써, 흡착시 및 이송시의 흡착된 패키지의 유동으로 인한 정위치 이탈이 발생하게 된다. 이러한 흡착된 반도체 패키지의 정위치 이탈은 소켓으로의 삽입 등의 후속 작동을 방해함으로써 공정 지연 등의 문제를 낳고 있다.However, the conventional apparatus does not have a means for preventing the flow of the adsorbed semiconductor package, so that only the semiconductor package is adsorbed and transferred, thereby causing in-situ deviation due to the flow of the adsorbed package during and during the adsorption. Such deviation of the adsorbed semiconductor package causes problems such as process delay by preventing subsequent operation such as insertion into the socket.
이에 본 고안은 상술한 종래의 문제점을 감안하여 안출된 것으로써, 흡착된 패키지의 유동방지수단을 형성하므로써 패키지의 정위치 이탈없이 이송 및 이송 후의 후속 작동을 수행할 수 있는 반도체 패키지 픽업 장치를 제공하려는 목적이 있다.Accordingly, the present invention has been made in view of the above-described conventional problems, and provides a semiconductor package pickup device capable of performing subsequent operations after transfer and transfer without leaving the package in position by forming a flow preventing means of the adsorbed package. It is intended to be.
본 고안의 반도체 패키지 픽업장치는, 몸체와, 몸체에 형성된 반도체 패키지 흡착부와, 몸체에 형성되고 흡착된 반도체 패키지에 접하여 반도체 패키지의 유동을 방지하는 고정 가이드(Guide)를 포함하여 이루어진다.The semiconductor package pick-up apparatus of the present invention includes a body, a semiconductor package adsorption unit formed in the body, and a fixing guide for preventing the flow of the semiconductor package in contact with the semiconductor package formed and adsorbed on the body.
여기서, 고정 가이드는 흡착된 반도체 패키지의 흡착된 면의 중심부로부터 상호 대칭되는 에지(Edge) 부위에 각각 접하는 두개가 쌍으로 이루어지고, 적어도 한쌍 이상 형성되는 것이 특징이다.Here, the fixed guide is formed in two pairs, each of which is in contact with each other the edge (Edge) parts symmetrical from the center of the adsorbed surface of the adsorbed semiconductor package, characterized in that formed at least one pair.
제2도는 본 고안에 따른 반도체 패키지 픽업장치의 바람직한 일실시예를 도시한 도면으로써, (a)는 정면도, (b)는 측면도, (c)는 다수개로 이루어진 픽업장치를 도시한 도면이다.2 is a view showing a preferred embodiment of the semiconductor package pickup device according to the present invention, (a) is a front view, (b) is a side view, (c) is a diagram showing a plurality of pickup devices.
이하, 도면을 참조하여 본 고안을 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the drawings.
도시한 바와 같이, 본 고안은 몸체(21)와, 몸체에 형성되고 진공 고무패드로 이루어진 흡착부(12)와, 몸체에 형성되고 흡착된 반도체 패키지와 접하여 흡착된 반도체 피키지의 유동을 방지하는 고정 가이드(Guide)(24)로 이루어지는데, 고정가이드(24)는 패키지(20)의 흡착된 면의 중심부로부터 상호 대칭되는 에지(Edge) 부위에 각각 접하는 두개가 쌍으로 이루어지고, 적어도 한쌍 이상 형성되도록 하면 된다. 제2도는 고정안내부(24)가 두쌍인 실시예이다.As shown, the present invention is fixed to prevent the flow of the adsorbed semiconductor package in contact with the body 21, the adsorption portion 12 formed on the body and made of a vacuum rubber pad, and the semiconductor package formed and adsorbed on the body Guide 24 is formed, the fixing guide 24 is composed of two pairs each in contact with the edge (Edge) areas symmetrical from each other from the center of the adsorbed surface of the package 20, formed at least one pair If you can. 2 is an embodiment in which the fixing guide 24 is two pairs.
따라서 본 고안의 반도체 패키지 픽업장치는 트래이(23) 등에 담겨진 반도체 패키지(20)의 상면을 흡착부(22)로 흡착하면 패키지(20)의 에지부위가 고정가이드(24)에 접하여 유동없이 정위치에 있게 되고, 실린더 등의 동작으로 트래이(23)로부터 들어올려진 후 원하는 위치 즉, 소켓의 삽입위치로 이송되어 삽입되어진다.Therefore, in the semiconductor package pickup device of the present invention, when the upper surface of the semiconductor package 20 contained in the tray 23 or the like is adsorbed by the adsorption portion 22, the edge portion of the package 20 is in contact with the fixed guide 24 and is positioned without flow. After being lifted from the tray 23 by the operation of a cylinder or the like, it is transferred to a desired position, that is, the insertion position of the socket, and inserted.
본 고안은 다음과 같은 개선효과가 있다.The present invention has the following improvement effect.
흡착된 반도체 패키지의 유동 방지수단이 없이 진공 고무 패드로 이루어진 흡착부로 단지 흡착하여 원하는 위치로 이송하는 종래의 장치와는 달리, 본 고안의 반도체 패키지 픽업장치는 고정 가이드를 형성하여 흡착된 패키지를 정위치에 고정하므로써 후속 작동으로의 진행이 원활하게 이루어질 수 있다. 따라서 공정 시간을 단축하여 생산수율의 향상을 도모할 수 있는 장점이 있다.Unlike the conventional apparatus which merely adsorbs and transfers to the desired position by the adsorption unit made of vacuum rubber pads without the flow preventing means of the adsorbed semiconductor package, the semiconductor package pickup device of the present invention forms a fixed guide to fix the adsorbed package. By fixing in position, progression to subsequent operations can be made smoothly. Therefore, there is an advantage that can shorten the process time to improve the production yield.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950038595U KR0129909Y1 (en) | 1995-12-06 | 1995-12-06 | Pick-up apparatus for semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950038595U KR0129909Y1 (en) | 1995-12-06 | 1995-12-06 | Pick-up apparatus for semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970046903U KR970046903U (en) | 1997-07-31 |
| KR0129909Y1 true KR0129909Y1 (en) | 1998-12-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950038595U KR0129909Y1 (en) | 1995-12-06 | 1995-12-06 | Pick-up apparatus for semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0129909Y1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210343993A1 (en) * | 2020-04-30 | 2021-11-04 | Baidu Usa Llc | Battery power management for a battery backup unit (bbu) shelf |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100356761B1 (en) * | 1999-08-31 | 2002-10-19 | (주)준텍 | Apparatus for adjusting semiconductor device position of semiconductor device automatic sorter tool |
-
1995
- 1995-12-06 KR KR2019950038595U patent/KR0129909Y1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210343993A1 (en) * | 2020-04-30 | 2021-11-04 | Baidu Usa Llc | Battery power management for a battery backup unit (bbu) shelf |
| US11978913B2 (en) * | 2020-04-30 | 2024-05-07 | Baidu Usa Llc | Battery power management for a battery backup unit (BBU) shelf |
Also Published As
| Publication number | Publication date |
|---|---|
| KR970046903U (en) | 1997-07-31 |
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