JPH06216168A - Manufacturing apparatus for semiconductor device - Google Patents

Abstract

PURPOSE:To suck and move an IC chip with a collet without causing damages or cracks in the surface protective film of the IC chip by providing an air inlet port at the side surface of the collet. CONSTITUTION:When a collet 2 is driven with a driving device and a protruding part 4b of the side surface having an air inlet port 4a comes into contact with the side surface of an IC chip 3, a side surface 3a of the IC chip 3 is sucked with a sucking device through the air inlet port 4a and attracted to the air inlet port 4a. When the side surface 3a of the IC chip 3 is attracted to the collet 2, the driving device drives the collet 2 again, and the IC chip 3 is moved to a semiconductor-chip attaching part such as a die pad of a lead frame. Thus, the occurrences of damages or cracks on the protective film of the semiconductor chip during the movement of the semiconductor chip caused by the collet can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a semiconductor device having a collet for adsorbing a semiconductor chip at an inlet and transferring it to a semiconductor chip mounting portion.

[0002]

2. Description of the Related Art FIG. 4 shows a main part of a conventional semiconductor device manufacturing apparatus. FIG. 4 (a) is a perspective view thereof, and FIG. 4 (b) is a side view thereof. In FIG. A semiconductor device manufacturing apparatus 3 provided with a cylindrical collet 2 having an intake port 2a communicating with (not shown) on the lower surface 2b is an IC chip after dicing.

Next, the operation will be described. First, the collet 2 is driven by a driving device (not shown) and the intake port 2
When the lower surface 2b having a contacts the surface of the IC chip 3,
As shown in FIG. 4b, the IC chip 3 is sucked by the suction device (not shown) and sucked in the suction port 2a. When the IC chip 3 is attracted to the collet 2, the driving device drives the collet 2 again, and the IC chip 3 is transferred to a semiconductor chip mounting portion (not shown) such as a die pad of a lead frame.

[0004]

Since the conventional semiconductor device manufacturing apparatus is configured as described above, when an IC chip is adsorbed by the collet, dust or the like adheres to the lower surface of the collet in contact with the IC chip. When adsorbing in the state, IC
There is a problem that the protective film on the chip surface is scratched or cracks are generated on the surface of the IC chip due to the generation of stress due to the dust and the like.

The present invention has been made to solve the above problems, and scratches the protective film on the surface of the IC chip.
Alternatively, it is another object of the present invention to provide a semiconductor device manufacturing apparatus capable of adsorbing and moving an IC chip with a collet without causing a crack.

[0006]

In the semiconductor device manufacturing apparatus according to the present invention, an inlet is provided on the side surface of the collet so that the side surface of the semiconductor chip is sucked and moved.

[0007]

In the semiconductor device manufacturing apparatus according to the present invention,
Since the side surface of the IC chip is attracted by the collet, I
The protective film of the C chip is not scratched or cracked.

[0008]

EXAMPLES Example 1. 1A and 1B show a main part of a semiconductor device manufacturing apparatus according to an embodiment of the present invention. FIG. 1A is a perspective view thereof and FIG. 1B is a side view thereof. A semiconductor device manufacturing apparatus 3 having a rectangular parallelepiped collet 4 having an intake port 4a communicating with an intake device (not shown) on the protrusion 4b is an IC chip after dicing.

Next, the operation will be described. First, the collet 2 is driven by a driving device (not shown) and the intake port 4
When the protrusion 4b on the side surface having a contacts the side surface of the IC chip 3, the side surface 3a of the IC chip 3 is sucked by an intake device (not shown) via the intake port 4a as shown in FIGS. Adsorbed to the intake port 4a. When the side surface 3a of the IC chip 3 is adsorbed by the collet 2, the driving device drives the collet 2 again, and the IC chip 3 is transferred to a semiconductor chip mounting portion (not shown) such as a die pad of a lead frame.

Embodiment 2. 2 shows a semiconductor device manufacturing apparatus according to another embodiment of the present invention. FIG. 2 (a) is a front view thereof, and FIG. 2 (b) is a side view thereof. The point is that an intake port 4a communicating with an intake device (not shown) is formed directly on the side surface of the rectangular collet 4 without forming a projecting portion on the side surface, and the same effect as the above-described embodiment is obtained. Since the operation is the same as that of the above embodiment, its explanation is omitted.

Embodiment 3. Although the collet 4 has a rectangular parallelepiped shape in the above embodiments, the shape of the collet 4 is not limited to this, and as shown in FIG. (Not shown)
Inlet 5a that communicates with the side and adsorbs the side surface of the semiconductor chip
This is a point that the square-shaped protrusion 5 having the shape is formed, and the same effect as that of the above-described embodiment is obtained. Since the operation is the same as that of the above embodiment, its explanation is omitted.

[0012]

As described above, according to the present invention, since the side surface of the semiconductor chip is sucked and moved by the collet, the protective film of the semiconductor chip is scratched or cracked when the semiconductor chip is moved by the collet. Is prevented, which makes it easier to manufacture highly reliable semiconductor devices.
In addition, there are effects such as an increase in manufacturing yield.

[Brief description of drawings]

FIG. 1 is a diagram showing a semiconductor device manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a semiconductor device manufacturing apparatus according to another embodiment of the present invention.

FIG. 3 is a diagram showing a semiconductor device manufacturing apparatus according to another embodiment of the present invention.

FIG. 4 is a diagram showing a conventional semiconductor device manufacturing apparatus.

[Explanation of reference numerals] 1 semiconductor device manufacturing apparatus 3 semiconductor chip 4 collet 4a intake port

Claims (1)

[Claims] 1. An apparatus for manufacturing a semiconductor device, comprising: an intake port communicating with an intake device; and a collet for adsorbing a semiconductor chip to the intake port and transferring the semiconductor chip to a semiconductor chip mounting portion. An apparatus for manufacturing a semiconductor device, which is provided on a side surface and is adapted to adsorb the side surface of the semiconductor chip.