JP6186940B2 - Method for transporting brittle material substrate - Google Patents

Description

  The present invention relates to a brittle material substrate such as a semiconductor wafer, which has a large number of functional regions (also referred to as device regions) formed in alignment in the vertical and horizontal directions, and a substrate that is broken for each functional region. The present invention relates to a transport method used when transporting by suction.

  Patent Document 1 proposes a substrate breaking device that breaks a substrate on which a scribe line is formed by pressing it perpendicularly to the surface along the scribe line from the back surface of the surface on which the scribe line is formed. Hereinafter, an outline of the break by such a break device will be described. It is assumed that a number of functional regions are formed in alignment on a semiconductor wafer to be broken. In the case of division, first, scribe lines are formed in the vertical direction and the horizontal direction at equal intervals between the functional areas on the substrate. And it breaks with a break device along this scribe line. Fig.1 (a) has shown sectional drawing of the board | substrate mounted in the breaking apparatus before dividing | segmenting. As shown in this figure, functional regions 101a, 101b and scribe lines S1, S2, S3,... In the case of dividing, an adhesive tape 102 is attached to the back surface of the substrate 101, and a protective film 103 is attached to the surface. In the case of a break, a scribe line to be broken, in this case a scribe line S2, is arranged in the middle of the receiving blades 105 and 106 as shown in FIG. The substrate 101 is pressed. In this way, a break by three-point bending between the pair of receiving blades 105 and 106 and the blade 104 has been performed.

JP 2004-39931 A

  When a breaker having such a structure is used to break a substrate on which a scribe is formed in a lattice shape, the lattice-shaped functional region and the unnecessary portion serving as a peripheral end material remain separated. When the functional region is an LED and the lens is formed so as to protrude from the surface, vacuum suction cannot be performed, so that there is a problem that it is difficult to transport only the functional region together. In addition, there is a problem that it is difficult to transport the peripheral end material regions together when they exist.

  The present invention has been made paying attention to such problems, and an object of the present invention is to make it possible to transport a broken functional area portion and a peripheral end material area as they are.

In order to solve this problem, the method for transporting a brittle material substrate according to the present invention has a functional region formed at a predetermined pitch in the vertical and horizontal directions on one surface so that the functional region is positioned at the center. A method of transporting a brittle material substrate that is broken along a scribe line formed in a lattice shape, wherein a functional region formed in the lattice shape of the brittle material substrate is adsorbed by a first transport head. after transport, and transports adsorbed scraps and a region around the brittle material substrate in the second conveying head.

In order to solve this problem, the method for transporting a brittle material substrate according to the present invention has a functional region formed at a predetermined pitch in the vertical and horizontal directions on one surface so that the functional region is positioned at the center. A method for transporting a brittle material substrate broken along a scribe line formed in a lattice shape on the substrate, wherein the second transport head sucks and transports a peripheral end material region of the brittle material substrate. After that , the first transport head sucks and transports the functional area formed in the lattice shape of the brittle material substrate.

  Here, the first transport head includes a head portion and a slider mechanism that holds the head portion so as to be movable up and down, and the head portion forms an airtight cavity between the lid plate and the lid plate. A base plate formed on a surface that does not contact the lid plate, and has an opening that is arranged to correspond to a functional region of the brittle material substrate and communicates with the cavity; and a surface that does not contact the lid plate of the base plate And an elastic sheet having openings arranged at positions corresponding to the openings of the base plate.

  Here, the second transport head includes a head portion and a slider mechanism that holds the head portion so as to be movable up and down, and the head portion forms an airtight cavity between the lid plate and the lid plate. A base plate having an opening communicating with the cavity on the outer periphery of the surface formed and not in contact with the lid plate; and the brittle material substrate is held around the cavity formed by the lid plate and the base plate so as to be movable up and down. A pusher plate in which pins are annularly planted at a pitch interval corresponding to the pitch of the functional region, and a state in which the pins of the pusher plate protrude from the opening of the base plate and are connected to the pusher plate; And a plunger that is driven to move up and down between the opening of the base plate It is arranged in an annular shape with a pitch corresponding to the pitch of the functional region of the brittle material substrate, and when the periphery of the brittle material substrate is transported by the second transport head, the pusher plate is lifted and does not protrude from the base plate It may be adsorbed in a state, and the pusher plate may be pulled down after conveyance and the pusher pin protrudes to drop off the end material.

  According to the present invention having such a feature, only the functional region can be adsorbed by bringing the elastic sheet of the first transport head into contact with the substrate that is broken along the scribe line. Further, only the peripheral end material portion can be sucked by bringing the second transport head into contact with the broken substrate. Therefore, the effect that the part of a functional area and the end material part can be collectively conveyed with the 1st and 2nd conveyance head, respectively is acquired.

FIG. 1 is a cross-sectional view showing a state of a conventional substrate during a break. FIG. 2 is a perspective view showing the overall configuration of the transport mechanism that realizes the embodiment of the present invention. FIG. 3 is a front view showing a transport mechanism for realizing the embodiment of the present invention. FIG. 4 is a perspective view showing the first transport head according to the embodiment of the present invention. FIG. 5 is a front view of the first transport head according to the present embodiment. FIG. 6 is a side view showing a part of the first transport head according to the present embodiment. FIG. 7 is a bottom view of the first transport head according to the present embodiment. FIG. 8 is a perspective view showing the head portion of the second transport head of the present embodiment. FIG. 9 is a front view and a bottom view of the head unit according to the second embodiment. FIG. 10 is a cross-sectional view taken along line AA and a line BB of the head portion of the second transport head according to the present embodiment. FIG. 11 is a front view and a side view of the pusher plate according to the present embodiment. 12A and 12B are a front view and a partial cross-sectional view illustrating an example of a substrate that is transported by the first and second transport heads of the present embodiment. FIG. 13 is a front view showing functional regions and end material portions of the substrate conveyed by the first and second conveyance heads of the present embodiment.

  A transport method according to an embodiment of the present invention will be described. FIG. 2 is a perspective view showing the overall configuration of a transport mechanism that realizes the present embodiment, and FIG. 3 is a front view thereof. As shown in these drawings, a beam 11 is held on the base 10 in parallel with the upper surface of the base 10 by a support (not shown), and a linear slider 12 is provided on the side of the beam 11. The linear slider 12 has a first transport head 13 and a second transport head 14. The first transport head 13 sucks and transports only a functional area of the substrate, which will be described later, and the second transport head 14 sucks and transports only the peripheral part of the periphery of the substrate. The linear slider 12 allows the first and second transport heads 13 and 14 to operate independently in the beam direction. The first and second transport heads 13 and 14 have substantially the same configuration, and each head portion can be freely moved up and down. A shooter 15 is provided on the side of the base 10 to drop unnecessary end material.

  Next, the 1st conveyance head 13 for attracting | sucking the functional area | region of a board | substrate is demonstrated. 4 is a perspective view showing the first transport head 13, FIG. 5 is a front view thereof, FIG. 6 is a side view of the transport head cut out, and FIG. 7 is a bottom view thereof.

  As shown in FIG. 4, in the transport head 13, a substantially L-shaped hanger 22 is vertically connected to a substantially square horizontal hanger base 21. A rectangular hanger bracket 23 is connected to the side of the hanger 22, and a rectangular hanger bracket 24 is attached to the hanger bracket 23 with its surface overlapped. The hanger bracket 24 is provided with a linear slider 25 that can move up and down. The linear slider 25 is configured to be able to flow an air flow in two directions, an upward direction and a downward direction, and can move up and down by switching the inflow. A pair of needle valves 26 a and 26 b is attached to the linear slider 25. By adjusting these needle valves 26a and 26b, the inflow amount of air can be controlled, and the moving speed in the upward direction and the moving speed in the downward direction can be set. Here, the linear slider 25 and the needle valves 26a and 26b constitute a slide mechanism that holds the head portion so as to be movable up and down.

  A head portion 30 is provided below the slider 25. Next, as shown in FIGS. 4 to 6, a rectangular base plate 31 and a lid plate 32 having substantially the same shape are provided below the head portion 30. The base plate 31 and the lid plate 32 are each formed with a recess in the center portion of the opposing surfaces, and are bonded together via an annular rubber sheet 33 in order to keep the airtight. An airtight space 34 is formed by each recess and the rubber sheet 33. As shown in the bottom view of the transport head 13 in FIG. 7, the base plate 31 is provided with guide openings 31a and 31b at diagonal corner positions. The openings 31a and 31b are for inserting the pins protruding on the substrate so that the head portion 30 can be accurately positioned with respect to the substrate. A large number of openings aligned in the xy directions are provided in a lattice shape on the lower surface of the base plate 31 so as to correspond to the functional area of the broken substrate.

  An elastic sheet 35 such as rubber is attached to the lower surface of the base plate 31. The elastic sheet 35 is provided with a large number of openings 36 aligned in the xy direction so as to correspond to the functional area of the substrate that has been broken except for the outer periphery of the four sides.

  The opening 36 of the elastic sheet 35 is connected to the airtight gap 34 through an opening provided at the same position of the base plate 31. Pipe joints 37 are provided at four locations on the upper surface of the lid plate 32 and communicate with the gap 34. The pipe joint 37 is connected to a vacuum suction device via a tube (not shown), and air can be ejected or sucked from the opening 36 by driving the vacuum suction device.

  Four arms 38a to 38d are provided vertically above the lid plate 32, and the upper plate 41 is horizontally attached via these arms 38a to 38d. On the upper surface of the upper plate 41, ball plungers 42a and 42b and ball plungers 42c and 42d (not shown) shown in FIG. The ball plunger has a ball and a spring provided therebelow, and holds the ball in a predetermined range so as to be movable up and down. Each ball of the ball plunger is in contact with the upper side plate 43. The side plate 43 is held by a frame-like cover plate 44 that holds the outer periphery thereof. Even when the transport head 13 is slightly tilted, the degree of contraction of one of the springs of the ball plunger changes, so that a slight angle variation of the transport head 13 can be elastically adjusted. The upper plate 41, the ball plungers 42a to 42d, and the cover plate 44 constitute an elastic coupling member that connects the head unit 30 to the lower part of the slide mechanism.

  Next, the second transport head 14 that sucks only the end material of the substrate will be described. The transport head 14 is substantially the same as the transport head 13, but the configuration of the lower head portion is different, so the difference will be described. 8 is a perspective view showing the head unit 50 of the transport head 14, FIG. 9A is a front view thereof, and FIG. 9B is a bottom view thereof. 10A is a cross-sectional view taken along the line AA in FIG. 9A, FIG. 10B is a cross-sectional view taken along the line BB, and FIG. 11 is a front view and a side view showing the pusher plate. As shown in these drawings, the head portion 50 has a rectangular base plate 51 and a lid plate 52 having substantially the same shape. The base plate 51 and the lid plate 52 are formed with a recess in the center portion of the opposing surfaces, and are bonded together via an annular rubber sheet 53 in order to keep them airtight. An airtight gap 54 is formed by the respective depressions and the rubber sheet 53. As shown in the bottom view of the transport head in FIG. 9B, the base plate 51 is provided with guide openings 51a and 51b at diagonal corner positions. The openings 51a and 51b are designed to allow the head portion 50 to be accurately positioned with respect to the substrate by inserting pins protruding from the upper surface outside the substrate.

  On the lower surface of the base plate 51, a large number of openings are provided in an annular shape along the vicinity of each side. All of these openings communicate with each other and are connected to a gap 54 formed by a recess between the base plate 51 and the lid plate 52. A pipe joint 56 is provided on the upper surface of the lid plate 52 and communicates with the gap 54. This pipe joint 56 is connected to a vacuum suction device via a tube (not shown), and by driving the vacuum suction device, air from the outside can be ejected or sucked from the opening 55.

  A pusher plate 61 that can move up and down is provided inside the gap 54. As shown in a front view and a side view in FIG. 11, the pusher plate 61 is thinned into a rectangular flat plate, and a large number of pusher pins 62 are arranged at regular intervals near the edge of the pusher plate 61. It is provided perpendicular to the surface. The lengths of the pusher pins 62 are all the same as shown in the figure.

  Furthermore, a plunger 63 is connected to the central portion of the pusher plate 61, and a plunger 65 is connected in the vertical direction via connection plates 64a and 64b. The pusher plate 61 moves up and down in the gap 54 between the base plate 51 and the lid plate 52 by driving the plunger 65.

  As shown in the perspective view of FIG. 8, four arms 71 a to 71 d are provided around the upper surface of the lid plate 52, and a flat bracket 72 is provided perpendicularly to the back surface of the base plate 51 therebetween. An air cylinder 73 is attached to the bracket 72. Further, the air cylinder 73 is provided with position sensors 74 a and 74 b for detecting the vertical movement of the plunger 64 connected to the pusher plate 61.

  Now, as shown in the bottom view of the transport head in FIG. 9B, an elastic sheet 75 made of an annular rubber or the like is attached around the base plate 51, and further, the pusher plate 61 described above is provided around the inside. A number of openings 76 are annularly provided at positions corresponding to the pins 62. When the plunger 65 is pulled down, the tip of the pusher pin 62 protrudes from the opening 76. When the plunger 65 is pulled up, the pusher pin 62 does not protrude from the opening 76 and is housed inside. Composed.

In the embodiment of the present invention, as shown in FIG. 12, the substrate 90 to be a break target has a large number of functional regions 91 at a constant pitch along the x-axis and y-axis in the manufacturing process. A substrate on which is formed. This functional area 91 is, for example, an area having a function as an LED, and a circular lens for the LED is formed on each surface in each functional area. In order to divide each functional area into LED chips, the scribe lines S _{y1 to} S _yn and the horizontal scribe lines S _{x1 to} S _yn are arranged so that each functional area is centered by a scribing device. _xm are formed so as to be orthogonal to each other. Accordingly, the pitches of these scribe lines S _{x1 to} S _xm and scribe lines S _{y1 to} S _yn are the same as the pitches of the functional region in the x-axis and y-axis directions. The scribe line S _x1 of the substrate 90, S _xm, on the inside of the S _y1, S _yn, a silicon resin is filled in transporting the substrates, the range of functional areas of the silicon resin LED is formed Therefore, a linear protrusion 92 slightly higher than the surface of the substrate 90 is formed around the outside of the functional region.

  The substrate 90 is broken along a scribe line by a breaking device. The substrate 90 immediately after being broken is divided along the scribe line, but is not separated. In other words, the divided substrate 90 is composed of an unnecessary portion serving as an outer peripheral end material and a plurality of grid-shaped LED chip portions excluding the outer periphery.

Here, the opening of the base plate 31 and the opening 36 of the elastic sheet 35 have a diameter slightly larger than the diameter of the LED lens formed in the functional area, and the LED chips in the functional area of the broken substrate 10 are sucked together. In this case, the lens of the LED is configured not to contact the elastic sheet 35 directly. The opening of the base plate 51, the pitch of the pusher pin 62 and the opening 76, the scribe line S _x1 to S _xm of the substrate 90, the same as the pitch of the S _y1 to S _yn.

  Next, when the LED chip in the functional area of the substrate 90 is transported, the transport head 13 is fixed in accordance with the broken substrate. At this time, when the transport head 13 is lowered from the upper part with respect to the substrate 90, a slight inclination or misalignment can be absorbed by the ball plunger. At this time, the opening 36 of the lowermost elastic sheet 35 of the head portion 30 corresponds to the lens portion of the LED. By sucking air from each opening 36, only the functional area of the substrate 90 can be sucked. Then, the functional area of the broken substrate, that is, the LED chip group 93 can be pulled up as shown in FIG.

  In this state, the LED chip group 93 can be transported to a desired position by moving the entire transport head in the x-axis direction or the y-axis direction.

  Next, when the peripheral edge material of the already broken substrate is transported using the transport head 14, the plunger 65 is first sucked and the pusher plate 61 is pulled up. The position sensor 44a detects the upward movement of the pusher plate. At this time, the pusher pin 62 is not projected from the opening 76 of the elastic sheet 75 as shown in FIG. Then, air is sucked from each opening 76 to fix the head 50 to the broken substrate. Then, by lifting the head as it is, the end material 94 around the broken substrate can be pulled together as shown in FIG. 13B.

  After the transport head 14 is moved to the shooter 15, air is ejected from the opening 76 by the vacuum suction device. As a result, at least one end material is removed, but since air leaks from it, many other end materials remain attached as they are. Therefore, the pusher plate 51 is pushed down as shown in FIG. At this time, the position sensor 44b detects the downward movement of the pusher plate. In this way, the pin 62 can be protruded from the opening 76, whereby all the end material adhering to the periphery can be removed.

  In this embodiment, only the functional area of the substrate is first transported by the transport head 13 and then the peripheral end material 94 is transported by the transport head 14. However, the peripheral end material 94 is transported by the transport head 14. May be transported first, and then the functional area 91 of the substrate may be transported by the transport head 13. If the LED chip group 93 in the functional area is transported after the peripheral edge material 94 is transported first, the linear protrusion 92 shown in FIG. 11 is included in the end material area, so that the functional area is transported. When this is done, the elastic sheet 35 of the first transport head 13 does not directly contact the linear protrusion 92, and it becomes easy to suck the functional areas together with air to attract and transport them.

  In this embodiment, an example in which LED chips of an LED substrate having a functional region having a lens on the upper surface are collectively conveyed by the conveying head 13 is described. However, the present invention is not limited to a chip having a lens on the surface, The present invention can also be applied to a chip having a functional area in which nothing protrudes, and can also be applied to a conveyance head that collectively conveys chips having a functional area having protrusions other than lenses.

  In this embodiment, an elastic coupling mechanism is provided between the upper portion of the head portion and the slider mechanism, but the elastic coupling mechanism is not necessarily provided.

  The present invention can adsorb only the functional areas arranged in a lattice shape after breaking the brittle material substrate and transport it to a required position, and can be effectively applied to a chip group transport device.

DESCRIPTION OF SYMBOLS 10 Base 11 Beam 12 Linear slider 13, 14 Conveyance head 15 Shutter 30, 50 Head part 31 Base plate 32 Lid plate 33 Rubber sheet 34 Gap 35 Elastic sheet 36 Opening 37 Fittings 38a-38d Arm 42 Bracket 43 Air cylinder 51 Base plate 52 Lid Plate 53 Rubber sheet 54 Gap 55 Pipe joint 61 Pusher plate 62 Pusher pin 63, 65 Plunger 64a, 64b Connection plate 71a-71d Arm 72 Bracket 73 Air cylinder 74a, 74b Optical sensor 75 Elastic sheet 76 Opening 90 Substrate 91 Functional area 92 Line Protrusion

Claims (4)

A brittle material substrate having functional regions formed at a predetermined pitch in the vertical direction and the horizontal direction on one surface and broken along scribe lines formed in a lattice shape so that the functional region is located at the center. A conveying method for conveying,
After transporting adsorbed a grid which is formed in functional areas of the brittle material substrate at a first conveying head,
A method for transporting a brittle material substrate, wherein a second transport head sucks and transports a peripheral edge material of the brittle material substrate. A brittle material substrate having functional regions formed at a predetermined pitch in the vertical direction and the horizontal direction on one surface and broken along scribe lines formed in a lattice shape so that the functional region is located at the center. A conveying method for conveying,
After transporting adsorbed scraps and a region around the brittle material substrate in the second conveying head,
A method for transporting a brittle material substrate, wherein the first transport head sucks and transports the functional area formed in a lattice shape of the brittle material substrate. The first transport head is
The head,
Comprising a slider mechanism for holding the head part vertically movable;
The head portion is
Lid plate,
Forming a hermetic cavity between the lid plate and a base plate having an opening communicating with the cavity arranged on a surface not contacting the lid plate so as to correspond to a functional region of the brittle material substrate;
3. The brittle material substrate according to claim 1, further comprising: an elastic sheet attached to a surface of the base plate that is not in contact with the lid plate and having an opening arranged at a position corresponding to the opening of the base plate. Transport method. The second transport head is
The head,
Comprising a slider mechanism for holding the head part vertically movable;
The head portion is
Lid plate,
Forming a hermetic cavity between the lid plate and a base plate having an opening communicating with the cavity on the outer periphery of the surface not contacting the lid plate;
A pusher plate, which is held in a cavity formed by the lid plate and the base plate so as to be movable up and down, and in which pins are implanted annularly at a pitch interval corresponding to the pitch of the functional region of the brittle material substrate;
A plunger connected to the pusher plate and driven so as to be movable up and down between a state in which a pin of the pusher plate protrudes from an opening of the base plate and a stored state;
The openings of the base plate are annularly arranged at a pitch corresponding to the pitch of the functional region of the brittle material substrate,
When the periphery of the brittle material substrate is transported by the second transport head, the pusher plate is lifted and sucked without protruding from the base plate, and after the transport, the pusher plate is pulled down, and the pusher pin is projected to remove the end material. 3. The method for transporting a brittle material substrate according to claim 1, wherein the brittle material substrate is removed.