JP2014011184A - Chip transporting system and chip tray - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip tray for containing semiconductor chips and a chip transporting system for picking up the chips from the chip tray to transfer them.SOLUTION: An assist pin 5 as a sheet pushing member pushes down an elastic body sheet 12 in the vicinity of a semiconductor chip 13. Thus, an air layer intervenes between a surface of the elastic body sheet 12 and a part of the rear surface of the semiconductor chip 13. Thereby, the semiconductor chip 13 is allowed easily to be picked up by suction of a chip suction collet 3.

Description

  The present invention relates to a chip transport system that picks up a semiconductor chip from a chip tray for housing a semiconductor chip and transports the semiconductor chip to a target position, and a chip tray used therefor.

  Conventionally, in the development stage of the semiconductor industry, there is a demand for a method of producing a necessary amount when necessary, not mass production. For this purpose, there is a need for a production method using a chip tray that can be produced in units of one semiconductor chip instead of the conventional wafer unit.

  Conventionally, a chip tray is used to fix a semiconductor chip so that the position of the semiconductor chip does not change when each semiconductor chip is transported.

  In this chip tray, a chip storage frame is molded on a substrate made of a hard resin, and the chip storage frame is provided with a plurality of pockets having a size slightly larger than the semiconductor chip for fixing the semiconductor chip.

  For this reason, in the conventional chip tray, the size of the pocket for storing the chip is determined at the time of resin processing of the tray. Therefore, each time the size of the semiconductor chip to be stored is changed, it is adjusted to the chip size. It is necessary to prepare a chip tray.

  In addition, since the semiconductor chip is stored in the hard resin pocket, the semiconductor chip collides with the side wall of the pocket due to vibration during transportation or the like, or the damaged semiconductor chip fragments adhere to the surface of the semiconductor chip. There is a problem that it becomes a cause of defects at the time of chip mounting.

  In order to solve this problem, Patent Documents 1 and 2 have been proposed.

  FIG. 7A is a plan view of a conventional chip tray disclosed in Patent Document 1, FIG. 7B is a vertical cross-sectional view taken along line AA ′ in FIG. 7A, and FIG. FIG. 8 is a vertical cross-sectional view taken along the line AA ′ of FIG.

  As shown in FIGS. 7A to 7C, in the conventional chip tray 100, the semiconductor chip 102 is mounted and fixed on the elastic sheet 101 having adhesiveness, and the collet 103 of the semiconductor chip 102 is used. In order to reduce the adhesion between the semiconductor chip 102 and the elastic sheet 101 at the time of pickup, a push-up pin 106 is abutted from the through-hole 105 provided in the flat plate 104 so that the end of the semiconductor chip 102 is elastic. The sheet 101 is peeled off. Stoppers 108 are arranged on the back side of every other through-hole 107 with the through-hole 105. A frame body 109 is attached to the back end of the flat plate 104.

  8A is a plan view of a conventional chip tray disclosed in Patent Document 2, FIG. 8B is a vertical cross-sectional view taken along the line BB ′ of FIG. 8A, and FIG. FIG. 9 is a longitudinal sectional view taken along line BB ′ when the conventional chip tray shown in FIG.

  As shown in FIGS. 8A to 8C, the conventional chip tray 200 has an adhesive sheet 203 that fixes the tray body 201 and the semiconductor chip 202, and the tray body 201 includes the adhesive sheet 203. Is held in a replaceable manner.

  The tray main body 201 has a protrusion 204. The tray main body 201 holds the adhesive sheet 203 and facilitates stacking of the tray main body 201. Furthermore, the tray body 201 has a structure in which a hole for ultraviolet irradiation or insertion of a push-up jig at the time of chip pick-up is opened in a flat portion inside the protrusion 204, and the adhesive force of the adhesive sheet 203 is increased by ultraviolet irradiation or heating. It is possible to change.

JP 2007-184465 A JP 2008-91696 A

  However, the conventional chip trays disclosed in Patent Documents 1 and 2 have the following problems because they need to push up and pick up the chips.

  First, in a small and thin chip such as an LED, when the chip surface having electrodes is set on the elastic sheet surface, that is, when the semiconductor chip is set on the elastic sheet with the back surface up, the chip It is necessary to push up the surface with a push-up pin and peel off part of the semiconductor chip and elastic sheet, but it is difficult to push up the center of the chip without touching the electrode part in a miniature chip with bump electrodes etc. ing.

  Next, in order to require a through-hole for pushing up the chip, the chip arrangement on the elastic sheet is restricted to the position of the through-hole. In other words, the number of mounted chips decreases when matched to a large-sized semiconductor chip, and large-sized semiconductor chips cannot be accommodated when matched to a small size. Therefore, a plurality of chip trays corresponding to chip size groups are required, and flexible. Sex is lost.

  The present invention solves the above-described conventional problems, and can prevent damage and damage to the chip surface even in a small-sized semiconductor chip, and also has a flexibility that can cope with semiconductor chips of different sizes. An object of the present invention is to provide a chip transfer system for picking up and transferring a semiconductor chip from the chip and a chip tray used therefor.

  The chip transport system of the present invention is a chip transport system that transports the semiconductor chip by chip suction from a chip tray that fixes the semiconductor chip on the elastic sheet, and the chip of the elastic sheet on which the semiconductor chip is mounted It has a sheet pressing member that presses the vicinity of the elastic sheet and interposes air between the surface of the elastic sheet and a part of the surface of the semiconductor chip, thereby achieving the above object.

  Preferably, the sheet pressing member in the chip conveyance system of the present invention has a vertical movement mechanism.

  Further preferably, the sheet pressing member is positioned below the chip suction portion during chip suction in the chip transport system of the present invention, and after the chip suction, the sheet pressing member retracts above the chip suction portion.

  Further preferably, the vertical movement mechanism in the chip transport system of the present invention is such that the elastic sheet is located above the chip suction surface and below the thickness dimension of the semiconductor chip from the chip suction surface. The sheet pressing member is moved up and down between a lower position where the front end of the surface can be pressed.

  Furthermore, it preferably has at least an opening that communicates the inner side and the outer side of the semiconductor chip side of the sheet pressing member in the chip conveyance system of the present invention.

  Furthermore, preferably, the sheet pressing member in the chip conveying system of the present invention has an angle at which the sheet pressing front end portion is inclined toward the chip side.

  Further preferably, the sheet pressing member in the chip transport system of the present invention is provided integrally or separately from the chip suction means for sucking the semiconductor chip.

  Further preferably, the sheet pressing member in the chip conveying system of the present invention is arranged so as to correspond to a position in the vicinity of at least two opposing sides of the two opposing sides of the semiconductor chip.

  Further preferably, the sheet pressing member in the chip conveying system of the present invention is made of a hard resin in which the tip pressing portion has a curved surface shape and / or the tip pressing portion is wider than the portion other than the tip pressing portion.

  Further preferably, in the chip conveying system of the present invention, at least the distance between the two pressing portions of the sheet pressing member can be set as an automatic pressing condition by parameter input.

  Further preferably, the positioning of the both end pressing portions of the sheet pressing member in the chip conveyance system of the present invention calculates the interval between the both end pressing portions based on the image recognition information of the semiconductor chip, and based on the calculation result. Thus, the interval between the both end pressing portions is set.

  Further preferably, the sheet pressing member in the chip conveying system of the present invention has at least one circular cross section or polygonal cross section.

  Further preferably, the sheet pressing member in the chip conveying system of the present invention has at least one oval cross-sectional shape or an elongated cross-sectional rectangular shape.

  Further preferably, the sheet pressing member in the chip transport system of the present invention has a quadrangular annular cross section corresponding to a position in the vicinity of the outer periphery of the semiconductor chip having a quadrangular shape in plan view.

  Further preferably, the sheet pressing member in the chip transport system of the present invention has at least one L-shaped cross section corresponding to a position near the corner of the semiconductor chip having a quadrangular shape in plan view.

  Further preferably, the sheet pressing member in the chip transport system according to the present invention has at least one oval cross-sectional shape corresponding to a position in the vicinity of at least one side of the positions in the vicinity of the four sides of the semiconductor chip having a quadrangular shape in plan view. It has a rectangular shape with an elongated cross section.

  The chip tray of the present invention is a chip tray used in the above-described chip transport system of the present invention, wherein the elastic sheet provided on the flat plate has a thickness of 1 mm or more and 2 mm or less. The above objective is achieved.

  Preferably, the hardness of the elastic sheet in the chip tray of the present invention is 20 ° to 60 ° (JIS type A).

  Furthermore, preferably, one or a plurality of semiconductor chips are mounted and fixed on the slightly adhesive surface of the elastic sheet in the chip tray of the present invention.

  With the above configuration, the operation of the present invention will be described below.

  In the present invention, there is provided a chip transport system for transporting a semiconductor chip by chip suction from a chip tray for fixing the semiconductor chip on the elastic sheet, and pressing the elastic sheet on the elastic sheet near the semiconductor chip. A sheet pressing member for interposing air between the surface and a part of the surface of the semiconductor chip is provided.

  This makes it easy to pick up the semiconductor chip by pressing the elastic sheet near the semiconductor chip with a sheet pressing member and interposing air between the surface of the elastic sheet and a part of the surface of the semiconductor chip. Even in a small-sized semiconductor chip, the chip surface can be prevented from being damaged or damaged, and the semiconductor chip is picked up and transported from a chip tray having flexibility capable of dealing with semiconductor chips of different sizes.

  As described above, according to the present invention, a semiconductor chip is picked up by pressing the elastic sheet near the semiconductor chip with the sheet pressing member and interposing air between the surface of the elastic sheet and a part of the surface of the semiconductor chip. In order to prevent damage and damage to the chip surface even in a small-sized semiconductor chip, the semiconductor chip can be picked up from a chip tray that has flexibility that can be applied to semiconductor chips of different sizes. Can be transported.

(A) is a top view which shows the principal part structural example of the chip tray in Embodiment 1 of this invention, (b) is the sectional view on the AA 'line of (a). It is a longitudinal cross-sectional view which shows the chip | tip adsorption | suction collet of the chip conveyance apparatus in Embodiment 1 of this invention. (A)-(d) is a principal part longitudinal cross-sectional view for demonstrating the structure and operation | movement of a chip | tip conveyance system in Embodiment 1 of this invention. It is a longitudinal cross-sectional view of the chip | tip adsorption | suction collet for demonstrating the case where both assist pins have an inclination angle inside. (A)-(f) is CC 'line cross-sectional view which shows roughly the various structures of the assist pin of FIG. (A) is a plan view of a bifurcated portion of an assist pin as a modification of Embodiment 1 of the present invention, and (b) is a chip suction when the assist pin of (a) is provided separately from the chip suction collet. It is a longitudinal cross-sectional view for demonstrating time. (A) is a plan view of a conventional chip tray disclosed in Patent Document 1, (b) is a vertical cross-sectional view taken along line AA ′ of (a), and (c) is a view when a chip is taken out after mounting the chip. It is an AA 'line longitudinal cross-sectional view of (a) which shows a state. (A) is a top view of the conventional chip tray currently disclosed by patent document 2, (b) is the BB 'line longitudinal cross-sectional view of (a), (c) is the conventional chip | tip of (a). It is a BB 'line longitudinal cross-sectional view at the time of stacking a tray up and down.

  Embodiments 1 and 2 of a chip tray of the present invention and a chip transport system using the chip tray will be described below in detail with reference to the drawings. In addition, each thickness, length, etc. of the structural member in each figure are not limited to the structure to illustrate from a viewpoint on drawing preparation.

(Embodiment 1)
FIG. 1A is a plan view showing a configuration example of a main part of a chip tray according to Embodiment 1 of the present invention, and FIG. 1B is a cross-sectional view taken along the line AA ′ of FIG.

  1A and 1B, a chip tray 2 according to Embodiment 1 is mounted on a flat plate 11 having a flat surface using, for example, resin or metal, and the surface of the flat plate 11. And an elastic sheet 12 having a flat surface made of silicon rubber or the like for sequentially arranging one or a plurality of semiconductor chips (not shown) thereon.

  The flat plate 11 is formed using, for example, resin or metal, and an elastic sheet 12 for placing the semiconductor chip 13 is placed on the surface of the flat plate 11.

  The elastic sheet 12 is formed using a material and a thickness that have a slight adhesive force for fixing a semiconductor chip 13 to be described later and that can be elastically deformed to some extent against local pressing by a pin or the like. In short, a plurality of semiconductor chips 13 described later are mounted and fixed on the slightly adhesive surface of the elastic sheet 12. Further, the elastic sheet 12 in the vicinity of the semiconductor chip 13 is pressed by the tip of an assist pin 5 described later, and air is put between the surface of the elastic sheet 12 and a part of the semiconductor chip 13 to be peeled off. It is supposed to be.

  If the thickness of the elastic sheet 12 is 1 mm or more, the surface of the elastic sheet 12 can be deformed to some extent when pressed, and the thickness of the elastic sheet 12 may be 2 mm or more. Higher cost. Accordingly, the thickness of the elastic sheet 12 is preferably 1 mm or more and 2 mm or less.

  The elastic sheet 12 employs, for example, a silicon sheet having a hardness of 40 ° and a thickness of 1.5 mm, and can be pressed from the surface to a depth of about 0.7 mm by the assist pin 5. Thereby, the vacuum suction to the chip suction collet 3 as the chip suction means of the semiconductor chip 13 described later can be easily performed. Therefore, the hardness of the elastic sheet 12 is preferably 20 ° to 60 ° (JIS type A). Preferably, the elastic sheet 12 has a hardness of 30 ° to 60 °. More preferably, the hardness of the elastic sheet 12 is 40 ° to 60 °. The lower the hardness of the elastic sheet 12, the better the adhesion with the semiconductor chip 13 described later. For example, when the hardness is 20 ° or less, there is a possibility that the elastic sheet 12 is also attached when the semiconductor chip 13 is picked up. When the hardness of the elastic sheet 12 is 60 ° or more, the adhesion becomes weak and the semiconductor chip 13 becomes difficult to fix on the elastic sheet 12.

  As described above, a plurality of semiconductor chips 13 to be described later set on the chip tray 2 are fixed to the chip size and the chip arrangement as in the prior art because the adhesive surface is fixed by the slightly sticky elastic sheet 12. Without limitation, a plurality of semiconductor chips 13 to be described later can be arranged in a matrix.

  FIG. 2 is a longitudinal cross-sectional view showing a chip suction collet of the chip transfer device according to the first embodiment of the present invention.

  In FIG. 2, the chip suction collet 3 in the chip transfer apparatus of the first embodiment has a circular or quadrangular cross-sectional outer shape, and a suction hole 4 is opened at the center of the end surface. 13 is adsorbed. On the outer peripheral side of the chip suction collet 3, assist pins 5 as sheet pressing members are arranged so as to be movable between an upper position and a lower position. The assist pin 5 is moved to a position lower than the end face where the suction hole 4 is opened when the semiconductor chip is sucked, and is retracted to a position higher than the end face where the suction hole 4 is opened when the semiconductor chip is transported and mounted. doing.

  In short, it has a vertical movement mechanism that moves the assist pin 5 as a sheet pressing member up and down, and the vertical movement mechanism is located above the chip suction surface (end face) of the chip suction collet 3 and from the chip suction surface to the semiconductor. The assist pin 5 is configured to be vertically movable between a lower position below the thickness dimension of the chip 13 and a lower position where the front end of the surface of the elastic sheet 12 can be pressed. .

  A drive source for movement between the upper position and the lower position of the assist pin 5 may be a solenoid or a motor. If a compression spring is interposed above the assist pin 5, when the assist pin 5 is pressed onto the elastic sheet 12, the assist pin 5 can be pressed onto the elastic sheet 12 with a constant pressure of the compression spring. it can.

  FIG. 3A to FIG. 3D are longitudinal sectional views of main parts for explaining the configuration and the operation of the chip transfer system according to the first embodiment of the present invention.

  In FIG. 3A to FIG. 3D, the chip transport system 1 according to the present embodiment 1 sucks the chip tray 2 according to the present embodiment 1 and the semiconductor chip 13 on the elastic sheet 12 of the chip tray 2. A chip conveying device that adsorbs to the end face of the collet 3 and conveys the semiconductor chip 13 to a predetermined position, and is integrally attached to the chip adsorbing collet 3 and is integrally attached to the chip adsorbing collet 3 at a position near the chip adsorbing collet 3 And an assist pin 5 as a sheet pressing member.

  An elastic sheet of the chip tray 2 for picking up a plurality of semiconductor chips 13 set on the chip tray 2 by sucking them at the end face of the chip suction collet 3 of the chip transfer device without damaging the semiconductor chips 13 It is necessary to reduce the adhesive force (or adhesive force) by interposing an air layer between the semiconductor chip 12 and the semiconductor chip 13.

  At the assist pin 5 installed in the vicinity of the chip suction collet 3 of the chip transfer device, when the chip suction collet 3 picks up the chip, the elastic sheet 12 is pressed on the elastic sheet 12 closest to the semiconductor chip 13 from above. An air layer is interposed between the semiconductor chip 13 and the elastic sheet 12 by deforming the surface.

  The size and shape of the assist pin 5 is selected according to the optimum chip size. In the first embodiment, a small chip of 1 mm □ or less such as an LED chip can be picked up. Spec.

  The assist pins 5 have a circular cross-sectional tip size diameter of 0.5 mm or less, and are arranged at two opposing sides of the semiconductor chip 13. Moreover, in order to make the elastic sheet 12 into a shape and material that does not damage the tip, the tip is made of a hard resin having a curved surface or a large area.

  In short, the assist pins 5 are arranged at two locations in the vicinity of at least one of the opposite sides of the semiconductor chip 13. Further, the assist pin 5 is made of a hard resin having a curved tip shape or / and a wide tip push portion.

  In the semiconductor chip 13 on the elastic sheet 12, in order to interpose an air layer between the elastic sheet 12 and the semiconductor chip 13, it is necessary to press on the elastic sheet 12 closest to the semiconductor chip 13 from above. . Therefore, as shown in FIG. 4, both assist pins 5 </ b> G are vertical movement mechanisms having an inward tilt angle. Thus, since both the assist pins 5G have an angle that inclines inward, it is possible to cope with a small chip even though it has a vertically moving mechanism and is bulky. Also in this case, both assist pins 5G inclined inward are moved up and down.

  Note that the sheet pressing mechanism having the assist pins 5G of the chip conveying device in FIG. 4 has the following functions, thereby enabling reliable pressing onto the elastic sheet 12 in the immediate vicinity of the chip. That is, positioning is performed by image recognition. It is possible to calculate and set automatic pressing conditions by parameter input.

  This parameter includes the chip size (or the interval between the assist pins 5G), the tray thickness (reference surface: distance from the stage surface to the chip tray surface), the depth of pushing, the assist pin size, the assist pin tilt angle, and the like. .

  That is, at least the tip distance between the assist pins 5G as the sheet pressing member can be calculated and set as an automatic pressing condition by parameter input. Further, the positioning of the tip of the assist pin 5G is performed by image recognition.

  In short, the distance between the tips of both assist pins 5G can be adjusted so as to be close or free by a drive unit such as a motor.

  In the first embodiment, the specifications of the assist pin 5 are not limited to the pin shape as described above, but are flat, U-shaped, or a sheet presser near the entire chip (four sides), etc. An optimum shape can be selected depending on the semiconductor chip 13 and the chip tray 2 to be used.

  5 (a) to 5 (f) are CC 'line cross-sectional views schematically showing various structures of the assist pin of FIG.

  In FIG. 5A, the elastic sheet 12 in the vicinity of the opposite side of the semiconductor chip 13 having a quadrangular shape in plan view is pressed into a circular shape or a polygonal shape by two cross-sectional or polygonal assist pins 5A. It is.

  In FIG. 5B, the elastic sheet 12 in the vicinity of the opposing side of the rectangular semiconductor chip 13 in plan view is formed into an oval shape with two elliptical cross sections or an elongated rectangular cross section by an assist pin 5B having a predetermined width. This is the case of pressing.

  FIG. 5C shows a case where the elastic sheet 12 in the vicinity of the four sides of the semiconductor chip 13 having a quadrangular shape in plan view is pressed by an assist pin 5C having a quadrangular cross section and a predetermined thickness. Here, the square annular assist pin 5C is provided with slits on four sides of the semiconductor chip 13, respectively. Since it is surrounded by the quadrangular annular assist pins 5C, if there is no slit, when air is sucked from the suction holes 4 on the end face, the air is lost inside, and the semiconductor chip 13 cannot be sufficiently sucked. Therefore, at least a part of the four sides forming the assist pin 5C as the sheet pressing member has an opening (or slit). In short, it has at least an opening that communicates the inside and the outside of the assist pin 5C as the sheet pressing member on the semiconductor chip 13 side.

  FIG. 5D shows a case where the top of the elastic sheet 12 in the vicinity of the four corners of the quadrilateral semiconductor chip 13 is pressed by an assist pin 5D having an L-shaped cross section with a predetermined thickness.

  FIG. 5E shows a case where the elastic sheet 12 in the vicinity of two opposing sides of the four sides of the semiconductor chip 13 having a square shape in plan view is pressed by two assist pins 5E having a predetermined cross section.

  In FIG. 5 (f), four assists having a predetermined width on the four sides of the cross section on the two opposing sides of the four sides of the four-sided semiconductor chip 13 in plan view, that is, on the elastic sheet 12 in the vicinity of all four sides. This is a case of pressing with the pin 5E.

  5A to 5F, a plurality of assist pins 5A to 5E are provided in pairs of opposite sides or diagonal portions. However, the present invention is not limited to this, and one assist pin may be provided.

  The assist pin 5A has at least one circular cross section or polygonal cross section corresponding to a position in the vicinity of the opposing side of the semiconductor chip 13 having a quadrangular shape in plan view.

  The assist pin 5B has at least one oval cross-sectional shape or an elongated cross-sectional rectangular shape corresponding to a position in the vicinity of the opposing side of the semiconductor chip 13 having a square shape in plan view.

  The assist pin 5D has at least one L-shaped cross section corresponding to positions near the four corners of the semiconductor chip 13 having a quadrangular shape in plan view.

  The assist pin 5E or 5F has at least one cross-sectional oval shape or a cross-sectionally elongated rectangular shape corresponding to at least the positions near the two opposite sides of the four sides of the rectangular semiconductor chip 13 in plan view. The assist pin 5E or 5F presses on the elastic sheet 12 in the vicinity thereof corresponding to the four side portions excluding the corners of the semiconductor chip 13 over substantially the same length as the side of the semiconductor chip 13. On the other hand, the assist pin 5B is located in the vicinity of the opposing side of the semiconductor chip 13 having a quadrangular shape in plan view, but is a part of the side and may be about half of the side or less than half of the side. There may be. Even if the assist pin 5B is half or less of the side, the assist pin 5A is longer than the circular cross section or the polygonal cross section.

  The operation of the above configuration will be described below.

  First, as shown in FIG. 3 (a), the chip suction collet 3 of the chip transport device has the assist pin 5 in the lower position directly above the transport target semiconductor chip 13 disposed on the elastic sheet 12. To reach. In short, the chip suction collet 3 and the chip transport device are moved above the semiconductor chip 13 to be picked up, and the chip position is recognized by image recognition. At this time, the assist pin 5 is lowered to a position for pressing the elastic sheet 12 when the chip suction collet 3 is lowered.

  Next, as shown in FIG. 3B, when the chip suction collet 3 of the chip transfer device is moved downward, the assist pin 5 first presses on the elastic sheet 12 in the vicinity of the semiconductor chip 13 to be recessed. Then, the elastic sheet 12 is peeled off from the outer peripheral side of the semiconductor chip 13. In short, by pressing the elastic sheet 12 in the vicinity of the outer peripheral portion of the chip with the assist pins 5 and denting the elastic sheet 12, an air layer is interposed between the semiconductor chip 13 and the elastic sheet 12, and the elastic body The adhesion between the sheet 12 and the back surface of the semiconductor chip 13 is reduced. That is, the assist pin 5 moves down to the chip suction position together with the chip suction collet 3. The tip of the assist pin 5 bumps the elastic body sheet 12 in the vicinity of the chip, and an air layer is interposed between the semiconductor chip 13 and the elastic body sheet 12 to reduce the chip adhesive force.

  Subsequently, as shown in FIG. 3C, the semiconductor chip 13 is sucked by the chip suction collet 3 of the chip transfer device. In short, the semiconductor chip 13 can be easily adsorbed to the central portion of the end face of the chip adsorbing collet 3 by vacuum adsorption using the adsorption hole 4.

  Thereafter, as shown in FIG. 3D, the assist pin 5 is moved upward and downward from the chip suction surface of the chip suction collet 3 after the semiconductor chip 13 is picked up by the function of vertically moving the assist pin 5 that holds the elastic sheet 12. Then, the chip suction collet 3 is conveyed to the target position, and the semiconductor chip 13 is mounted at the target position. In short, as the chip suction collet 3 rises, the assist pins 5 rise (retreat) to the upper part of the chip suction surface of the chip suction collet 3 to mount (mount) the semiconductor chip 13.

  As described above, according to the flexible chip tray 2 of the first embodiment and the chip transport device using the same, the elastic sheet 12 near the semiconductor chip 13 is elastically pressed by the assist pin 5 as a sheet pressing member. Since an air layer is interposed between the front surface of the body sheet 12 and a part of the back surface of the semiconductor chip 13, the semiconductor chip 13 is adsorbed by the chip adsorbing collet 3 so that it can be easily picked up. do not need. For this reason, it can respond to any chip size and chip arrangement.

  The semiconductor chip 13 can be picked up from the chip tray 2 of Embodiment 1 without damaging the semiconductor chip 13.

  Accordingly, the chip surface can be prevented from being scratched or damaged even in the small-sized semiconductor chip 13, and the semiconductor chip 13 is picked up and transported from the chip tray 2 having the flexibility to cope with the semiconductor chips 13 of different sizes. can do.

  In the first embodiment, the assist pin 5 as the sheet pressing member is integrally attached to the chip suction collet for sucking the semiconductor chip 13. However, the assist pin 5 is independent of the chip suction collet. It may be provided.

  6A is a plan view of a bifurcated portion of an assist pin as a modification of the first embodiment of the present invention, and FIG. 6B is a separate body from the chip suction collet 3 in FIG. 6A. It is a longitudinal cross-sectional view for demonstrating the time of chip | tip adsorption | suction at the time of providing as.

  As shown in FIG. 6A and FIG. 6B, the assist pin 5H as the sheet pressing member is located near the center line of the opposite side of the semiconductor chip 13 so that the tip portion sandwiches the semiconductor chip 13 from both sides. The top of the elastic sheet 12 is pressed. The assist pin 5H descends from above as a separate body from the chip suction collet 3 before the chip suction by the chip suction collet 3, and on the elastic body sheet 12 on both sides of the semiconductor chip 13, in particular, on both side centers of the semiconductor chip 13. The elastic sheet 12 on the line is pressed. Thus, by interposing air between the surface of the elastic sheet 12 and a part of the surface of the semiconductor chip 13, the semiconductor chip 13 can be easily picked up by the chip suction collet 3.

  Thereafter, the chip suction collet 3 is lowered above the semiconductor chip 13 and the semiconductor chip 13 is sucked onto the end face of the chip suction collet 3. Further, the chip suction collet 3 is lifted together with the semiconductor chip 13 and conveyed to the target position to mount the semiconductor chip 13 at the target position.

  At this time, the assist pin 5H that moves up and down the elastic sheet 12 raises the assist pin 5H after the semiconductor chip 13 is picked up and moves directly above the next semiconductor chip 13 to be picked up. Further, the assist pin 5H is lowered to press the elastic sheet 12 in the vicinity of the center line of the opposite side of the semiconductor chip 13 on both sides to wait for the semiconductor chip 13 to be picked up by the chip suction collet 3. Thus, by interposing air between the surface of the elastic sheet 12 and a part of the surface of the semiconductor chip 13, the semiconductor chip 13 can be easily picked up by the chip suction collet 3.

  As described above, also in the modification of the first embodiment, the elastic sheet 12 in the vicinity of the semiconductor chip 13 is pressed by the assist pin 5 as a sheet pressing member, and the surface of the elastic sheet 12 and a part of the semiconductor chip 13 are pressed. Since an air layer is interposed between the back surfaces so that the semiconductor chip 13 can be easily picked up by being picked up by the chip suction collet 3, the chip surface can be prevented from being scratched or damaged, and the semiconductor chips 13 having different sizes can be prevented. Also, the semiconductor chip 13 can be picked up and transported from the chip tray 2 having flexibility.

  In this case, since the assist pin 5H is provided separately from the chip suction collet 3, it can be controlled separately from the operation of the chip suction collet 3.

  In addition, as mentioned above, although this invention was illustrated using preferable Embodiment 1 of this invention, this invention should not be limited and limited to this Embodiment 1. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range from the description of the specific preferred embodiment 1 of the present invention based on the description of the present invention and the common general technical knowledge. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention provides an assist as a sheet pressing member on an elastic sheet in the vicinity of a semiconductor chip in the field of a chip tray for storing a semiconductor chip and a chip transport system for picking up and transporting a chip from the chip tray. Even with a small size semiconductor chip, it is easy to pick up the semiconductor chip by adsorbing it with a chip adsorption collet by interposing an air layer between the front surface of the elastic sheet and a part of the back surface of the semiconductor chip. The chip surface can be prevented from being scratched or damaged, and the semiconductor chip can be picked up and transported from a chip tray having flexibility capable of dealing with semiconductor chips of different sizes.

DESCRIPTION OF SYMBOLS 1 Chip conveyance system 11 Flat plate 12 Elastic body sheet 13 Semiconductor chip 2 Chip tray 3 Chip adsorption collet 4 Suction hole 5, 5A-5H, Assist pin (sheet pressing member)

Claims (19)

A chip transfer system for transferring a semiconductor chip by chip adsorption from a chip tray for fixing the semiconductor chip on an elastic sheet,
A chip transport system having a sheet pressing member that presses a position in the vicinity of a chip of the elastic sheet on which the semiconductor chip is mounted and causes air to intervene between the surface of the elastic sheet and a part of the surface of the semiconductor chip.   The chip conveyance system according to claim 1, wherein the sheet pressing member has a vertical movement mechanism.   The chip transport system according to claim 2, wherein the sheet pressing member is positioned below the chip suction portion when the chip is suctioned, and the sheet pressing member is retracted above the chip suction portion after the chip suction.   The vertical movement mechanism is configured such that the tip portion can press the surface of the elastic sheet at a position above the chip suction surface and below the thickness of the semiconductor chip from the chip suction surface. The chip conveyance system according to claim 3, wherein the sheet pressing member is moved up and down between the lower position and the lower position.   The chip transfer system according to claim 1, further comprising at least an opening that communicates the inner side and the outer side of the sheet pressing member on the semiconductor chip side.   The chip conveyance system according to claim 1, wherein the sheet pressing member has an angle at which a sheet pressing front end portion is inclined toward the chip side.   The chip conveyance system according to claim 1, wherein the sheet pressing member is provided integrally with or separately from a chip adsorbing unit that adsorbs the semiconductor chip.   2. The chip transport system according to claim 1, wherein the sheet pressing member is disposed so as to correspond to a position in the vicinity of at least two opposing sides of one of the two opposing sides of the semiconductor chip.   2. The chip transport system according to claim 1, wherein the sheet pressing member is made of a hard resin in which a tip pressing portion has a curved surface shape and / or the tip pressing portion is wider than a portion other than the tip pressing portion.   The chip transfer system according to claim 1, wherein at least an interval between both end pressing portions of the sheet pressing member can be set as an automatic pressing condition by parameter input.   The positioning of the both-end pressing portions of the sheet pressing member is calculated based on the image recognition information of the semiconductor chip, and the interval between the both-end pressing portions is set based on the calculation result. The chip transfer system according to claim 10.   The chip transport system according to claim 1, wherein the sheet pressing member has at least one circular cross section or polygonal cross section.   2. The chip transfer system according to claim 1, wherein the sheet pressing member has at least one oval cross-sectional shape or an elongated cross-sectional rectangular shape.   The chip transport system according to claim 5, wherein the sheet pressing member has a quadrangular cross-sectional shape corresponding to a position near the outer periphery of the semiconductor chip having a quadrangular shape in plan view.   2. The chip transport system according to claim 1, wherein the sheet pressing member has at least one L-shaped cross section corresponding to a position in the vicinity of a corner of the semiconductor chip having a quadrangular shape in plan view.   2. The sheet pressing member has at least one oval cross-sectional shape or an elongated cross-sectional rectangular shape corresponding to a position in the vicinity of at least one side of the positions in the vicinity of the four sides of the semiconductor chip having a quadrangular shape in plan view. Chip transfer system.   The chip tray used for the chip conveyance system according to any one of claims 1 to 16, wherein the elastic sheet provided on a flat plate has a thickness of 1 mm or more and 2 mm or less.   The chip tray according to claim 17, wherein the elastic sheet has a hardness of 20 ° to 60 ° (JIS type A).   The chip tray according to claim 17, wherein one or a plurality of semiconductor chips are mounted and fixed on the slightly adhesive surface of the elastic sheet.