KR101457867B1 - Interleaf packing module and wafer packing system having the same - Google Patents
Interleaf packing module and wafer packing system having the same Download PDFInfo
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- KR101457867B1 KR101457867B1 KR1020130123923A KR20130123923A KR101457867B1 KR 101457867 B1 KR101457867 B1 KR 101457867B1 KR 1020130123923 A KR1020130123923 A KR 1020130123923A KR 20130123923 A KR20130123923 A KR 20130123923A KR 101457867 B1 KR101457867 B1 KR 101457867B1
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- wafer
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- wafer box
- unit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
Abstract
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminar stacking module and a wafer packing system including the same, and more particularly, to a laminar stacking module for stacking wafers placed between wafers which have been processed in detail, and a wafer packing system including the same.
BACKGROUND ART [0002] In most of today's electronic devices, a large number of semiconductor devices are used. These semiconductor elements are formed on a wafer, and after the wafers are separated and made into respective semiconductor chips, they are packaged and mounted on a substrate and used. The wafers on which the semiconductor devices are formed are alternately stacked and packaged in a wafer box (also referred to as a "jar ") and transferred to the next separation and packaging process.
Wafer packing systems have been developed and automated for this process. The wafer packing system alternately arranges lanterns and wafers in a wafer box alternately and packs them.
Such a wafer packing system includes an interleaf stacking module for stacking interleaves. In the case of a conventional interleaving stack module, a plurality of interleaving chips are sucked and placed between the wafers when the interleave stack is adsorbed.
In addition, the conventional wafer packing system developed up to now only carries out up to the packing process, and the packaging and labeling are manually done, which causes a problem.
That is, the wafers to be packed are not all the same, and all the different wafers are packed. For example, in each wafer, defects may be generated in a chip formed at a specific position, and the wafer is contained in the ID information including the positional information of defective chips. Accordingly, a label including information on each of the wafers is attached to the wafer box. The label is attached incorrectly due to a mistake of the operator, and a lot of problems are caused.
SUMMARY OF THE INVENTION It is an object of the present invention to provide an intermittent stacking module capable of being picked up one by one and a wafer packing system including the same.
A problem to be solved by the present invention is to provide a wafer packing system capable of solving the above-mentioned problems by not only packing the wafer but also packing the wafer, packaging it, and automatically attaching it to the label.
According to an exemplary embodiment of the present invention for solving such a problem, a kanji loading module includes a base plate, a pair of first blowers, and a pair of second blowers.
The base plate supports the separator. The pair of first blowers are arranged to face each other in the first direction with the intervening gaps therebetween. And the pair of second blowers are arranged to face each other in the second direction intersecting the first direction with the interposer interposed therebetween.
At this time, it is preferable that the first direction and the second direction are perpendicular to each other.
For example, the first blower may be an air blower that blows air, and the second blower may be an ion blower that blows air containing ions.
In addition, the pair of second blowers may be arranged at different heights.
The base plate may further include a separator guide disposed on the base plate to surround the periphery of the separator to guide the separator.
At this time, the separable guide may include a housing, a separable jaw and an elastic member. The housing includes an opening. The separable jaw protrudes partly toward the opening to support the separator raised by the air from above. The elastic member includes an elastic member which is disposed inside the housing and urges the tab stopping jaw toward the opening.
A wafer packing system according to an exemplary embodiment of the present invention includes a wafer information checking unit, a loading unit, and a packing unit. The wafer information checking unit opens the cover of the wafer loaded in the load port to check wafer alignment and wafer information. The loading unit includes a wafer box loading module for loading an empty wafer box, a wafer box cover loading module for loading a wafer box cover, and a loading module mentioned above for loading a kanji. The packing unit alternately packs the wafers, which have been checked from the interposer stacking module and the wafer information checking unit, into an empty wafer box.
On the other hand, the packing system may further include a taping unit, a transfer unit, and a control unit. The taping unit arranges the wafer box cover on the top of the wafer box in which the separator and the wafer are packed alternately and tapers the boundary between the wafer box and the wafer box cover. The transfer unit transfers the wafer, the separator, the wafer box, and the wafer box cover. The control unit controls the wafer information checking unit, the loading unit, the packing unit, the taping unit, and the transfer unit.
On the other hand, the taping unit includes a label attaching module, and the control unit receives the wafer information from the wafer information checking unit, attaches a label including the received wafer information to the taping-completed wafer box The labeling module can be controlled.
On the other hand, the stacking unit may further include a sponge stacking module for stacking a lower sponge disposed on a lower surface of the empty wafer box and an upper sponge disposed on a wafer upper surface of the wafer box loaded with the wafer.
In operation, the control unit transfers the lower sponge of the sponge loading module to the wafer box transferred from the wafer box loading module, placing the sponge, and alternately loading the wafers of the wiper and the interleaf of the interleaving module And the wafer box cover of the wafer box cover loading module is attached to the wafer box and the transfer unit and the taping are attached to the wafer box cover to tap the border of the wafer box and the wafer box cover. The unit can be controlled.
The taping unit may include a tape supporting module for supporting the wound tape, a turntable module for supporting the wafer box to which the wafer box cover is coupled, one end of the tape of the tape supporting module, A turntable rotation module that rotates the turntable module and winds the tape at the boundary portion when one end of the tape is attached to the boundary between the wafer box cover and the wafer box by the attachment module, And a tape cutting module for cutting the tape.
At this time, the tape cutting module may include a push bar pushing in contact with the tape adhering surface, a fixing plate, and a tape pushed by the push bar to be driven toward the fixing plate to bond the tapes to each other A compression plate including a drive plate, and a cutter for cutting the tape pressed by the compression plate.
In the cutting operation, the control unit elevates the pushbars disposed at the lower portion on the basis of the imaginary horizontal plane and arranges them at the same height as the tape, and pushes the tape between the fixed plate and the compression plate And moving the clamping plate toward the fixed plate to adhere the tape to detach the push bar from the tape and to control the operation of the tape cutting module so that the cutter cuts the tape.
The push bar may include a vertical bar extending in the vertical direction and a pair of contact bars protruding in the horizontal direction at the upper and lower ends of the vertical bar and pushing in contact with the adhesive surface of the tape.
At this time, the pair of contact bars may protrude so as to decrease in the horizontal direction width as they are further away from the vertical bar.
The distance between the pair of contact bars may be larger than the height of the driving plate.
Further, the push bar can be surface-treated so that the portion of the push bar that touches the adhesive surface of the tape is not bonded to the tape.
The kanji loading module according to the exemplary embodiment of the present invention can facilitate the transfer of kanji sheets by separating the kanji sheets before they are transferred into a man and floating them, and prevent a plurality of kanji sheets from being fed at one time.
According to the wafer packing system according to the exemplary embodiment of the present invention, since the post-work of wafer packing, that is, the taping and labeling of the wafer box, is automated, not only the error in label attachment can be prevented, but also the productivity is improved .
1 is a plan view showing a wafer packing system according to an exemplary embodiment of the present invention.
FIG. 2 is a perspective view showing the intermittently stacked module shown in FIG. 1. FIG.
FIG. 3 is a schematic cross-sectional view showing the separating guide of the interleaved stacking module shown in FIG. 2. FIG.
4 is a schematic diagram showing the direction of air blown to illustrate the function of the first blower and the second blower of the lien stacking module;
FIG. 5 is a perspective view illustrating the intermittent stacking module and the interposing transfer robot shown in FIG. 1. FIG.
Fig. 6 is a perspective view showing a part of the taping unit shown in Fig. 1. Fig.
Figure 7 is a top view of the attachment module of Figure 6;
8 to 9 are schematic views for explaining the operation of the tape cutting module included in the taping unit shown in FIG.
10 is a perspective view showing a tape on which a grip portion is formed to facilitate separation of the tape from the wafer box.
BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings, It will be possible. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprising" or "having ", and the like, are intended to specify the presence of stated features, integers, steps, operations, elements, parts, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.
Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.
1 is a plan view showing a wafer packing system according to an exemplary embodiment of the present invention.
1, a
The wafer information checking unit opens the cover of the wafer (F) loaded in the load port (FOUP, F) to check the wafer alignment and wafer information. The wafer information may include various kinds of information of the wafer, for example, position information of a defective chip, a place where the wafer is to be transferred, and the like.
The stacking
The arrangement of the wafer
The
The
The
The
The
For example, the
The barcode
The security
The specific operation of the
The
After the wafer box with the sponge disposed thereon is transferred from the first position P1 to the second position P2, the
At this time, the linear iso-
When the packing operation of the wafer and the separator is completed at the second position P2, the wafer box packed with the wafer is again transported to the first position P1, and the sponge of the third position P3 is transported to the wafer box Is transferred to the fourth position P4, and the
On the other hand, the wafer loaded on the wafer box at the second position P2 is loaded with the wafer of the first load port LP1 and the wafer loaded at the wafer box of the fourth position P3 is loaded into the second load port LP2. Of the wafer W is loaded. Alternatively, the wafer loaded in the wafer box in the second position P2 is loaded with the wafer in the second load port LP2, and the wafer loaded in the wafer box in the fourth position P3 is loaded into the first load port LP1 May be loaded. However, the wafers of the first load port LP1 and the second load port LP2 are not mixed.
When the packing process is performed alternately, the packing time can be shortened and the productivity can be improved.
The sponge of the
At the fifth position P5, the wafer box to which the wafer box cover is coupled is transferred to the
These operations are performed under the control of the
Fig. 2 is a perspective view showing the kanji loading module shown in Fig. 1, Fig. 3 is a schematic cross-sectional view showing a kanji guide of the kanji loading module shown in Fig. 2, And a two-dimensional transfer robot.
2 to 4, the
When the
For example, the
Accordingly, the air generated by the pair of the
5, it is possible to blow air in both directions A and B to float the kanji in the air. However, when air is blown in both directions A and B as described above, If air is supplied in both directions of C and D at this time, the kanji becomes more stable in the air.
At this time, the interleaving paper floated in the air is supported by the
In more detail, the
On the other hand, in the case where the intermittent stopping
In order to solve such a problem, the above problem has been solved by forming the
Meanwhile, the
Meanwhile, the
In general, the separators are made of a material that inhibits the formation of foreign matter (dust), but the foreign materials are not completely blocked. Particularly, air is blown by the
At this time, it is preferable that the
Separated by the
At this time, it is preferable that the
On the other hand, each of the
Fig. 6 is a perspective view showing a part of the taping unit shown in Fig. 1, and Fig. 7 is a plan view showing the attachment module of Fig.
Referring to Figures 1, 6 and 7, the
The
The
The
The turntable rotation module (not shown) is disposed under the
Then, the
For example, the
The
At this time, the pair of
Further, the
The
Meanwhile, the distance between the pair of
The cutter (not shown) cuts the tape squeezed by the
In the cutting operation, the control unit (1600 in Fig. 1) raises the
Hereinafter, with reference to Figs. 8 and 9, the operation of the tape cutting module will be described in more detail.
8 to 9 are schematic views for explaining the operation of the tape cutting module included in the taping unit shown in FIG.
Referring to FIG. 8, in the cutting operation, first, the
Thereafter, the driving
9, the
While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
1000: Wafer packing system 1100: Wafer information checking unit
1200: Loading unit 1210: Wafer box loading module
1220: Wafer box cover loading module 1230: Kanji loading module
1231: First blower 1232: Second blower
1233: Suction pipe 1234: Base plate
1235:
1235c:
A: Rotation shaft 1240: Sponge loading module
1300: Packing unit 1441: Roller
1400: taping unit 1410: tape supporting module
1420: Turntable module 1430: Tape shear module
1431: Push
1431b: contact bar 1432:
1432a: Fixing
1440: attachment module 1441: cylinder
1450: label attaching module 1451: bar code label attaching part
1452: security label attaching part 1500: transfer unit
1510: Robot arm 1520: Manual transfer robot
1521: Vacuum ejector 1530: Linear transfer robot
1600: control unit WB: wafer box
T: Tape
Claims (18)
A pair of first blowers disposed to face each other in the first direction with the intervening gaps therebetween; And
A pair of second blowers disposed to face each other in the second direction intersecting the first direction with the interposer interposed therebetween; And
And a separator guide disposed on the base plate and surrounding the periphery of the separator to guide the separator.
Wherein the first direction and the second direction are perpendicular to each other.
Wherein the first blower is an air blower that blows air, and the second blower is an ion blower that blows air containing ions.
Wherein the pair of second blowers are arranged at different heights.
The separating guide includes:
A housing having an opening formed therein;
An interlocking jaw protruding toward the opening and supporting the intermittently raised upper portion by air; And
And an elastic member which is disposed inside the housing and urges the tab stopping jaw toward the opening portion.
A wafer box cover loading module for loading a wafer box cover, and a kanji loading module according to any one of the first to fourth and sixth aspects for loading a kanji, Loading unit; And
A packing unit for alternately packing the wafers of the interposer stacking module and the wafers which have been checked from the wafer information checking unit into an empty wafer box;
≪ / RTI >
A taping unit for placing the wafer box cover on an upper end of a wafer box where the lancet and the wafer are packed alternately and taping the boundary between the wafer box and the wafer box cover;
A transfer unit for transferring the wafer, the kanji, the wafer box, and the wafer box cover; And
A control unit for controlling the wafer information checking unit, the loading unit, the packing unit, the taping unit, and the transfer unit;
Further comprising:
Wherein the taping unit comprises a label attaching module,
Wherein the control unit controls the labeling module to receive the wafer information from the wafer information checking unit and to attach a label containing the received wafer information to the wafer box with the taping completed.
The stacking unit includes:
A sponge loading module for loading a lower sponge disposed on a lower surface of an empty wafer box and an upper sponge disposed on an upper surface of a wafer of a wafer box loaded with wafers;
≪ / RTI >
In operation,
Transferring the lower sponge of the sponge loading module to the wafer box transferred from the wafer box loading module, placing the sponge,
The wafers of the wafers are stacked alternately,
Placing a sponge of the sponge loading module thereon,
The wafer box cover of the wafer box cover loading module is coupled to the wafer box,
And to tap the boundary portion between the wafer box and the wafer box cover,
And controls the transfer unit and the taping unit.
The taping unit comprises:
A tape support module for supporting the wound tape;
A turntable module for supporting the wafer box to which the wafer box cover is coupled;
An attaching module for attaching one end of the tape of the tape supporting module to a boundary of the wafer box cover and the wafer box;
A turntable rotation module that rotates the turntable module and winds the tape at the boundary when the tape is attached to one end of the wafer box cover and the wafer box by the attaching module; And
A tape cutting module for cutting the tape;
≪ / RTI >
Wherein the tape cutting module comprises:
A push bar (PUSH BAR) pushing in contact with the adhesive surface of the tape;
A compression plate including a fixed plate and a drive plate which is driven toward the fixed plate to press the tape pushed by the push bar to adhere the tapes to each other; And
A cutter for cutting the tape pressed by the compression plate;
Wherein the wafer packing system comprises:
In the cutting operation,
The push bars disposed at the lower portion are raised to be at the same height as the tape with reference to a virtual horizontal plane,
Pushing the tape between the fixed plate and the compression plate using the push bar,
The pressing plate is moved toward the fixed plate to adhere the tape,
Releasing the push bar from the tape,
And the operation of the tape cutting module is controlled so that the cutter cuts the tape.
The push-
A vertical bar extending in a vertical direction; And
A pair of contact bars protruding in the horizontal direction at the upper and lower ends of the vertical bars to push and come in contact with the adhesive surface of the tape;
Wherein the wafer packing system comprises:
The pair of contact bars may include:
And a width in the horizontal direction decreases as the distance from the vertical bar increases.
Wherein a distance between said pair of contact bars is greater than a height of said drive plate.
The push-
Wherein a portion of the tape contacting the adhesive surface is surface-treated so as not to adhere to the tape.
Priority Applications (1)
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KR1020130123923A KR101457867B1 (en) | 2013-10-17 | 2013-10-17 | Interleaf packing module and wafer packing system having the same |
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KR1020130123923A KR101457867B1 (en) | 2013-10-17 | 2013-10-17 | Interleaf packing module and wafer packing system having the same |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101699882B1 (en) * | 2015-12-28 | 2017-01-31 | 코리아테크노(주) | Wafer transfer device |
KR101720547B1 (en) * | 2015-12-28 | 2017-03-31 | 코리아테크노(주) | Wafer transfer method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163091A (en) * | 1997-12-02 | 1999-06-18 | Komatsu Engineering Kk | Method and apparatus for packing wafer |
KR20090007900A (en) * | 2007-07-16 | 2009-01-21 | (주)미래컴퍼니 | Auto packing machine and method thereof |
KR101283312B1 (en) * | 2011-12-29 | 2013-07-09 | 로체 시스템즈(주) | Auto loading system for front opening shipping box |
-
2013
- 2013-10-17 KR KR1020130123923A patent/KR101457867B1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163091A (en) * | 1997-12-02 | 1999-06-18 | Komatsu Engineering Kk | Method and apparatus for packing wafer |
KR20090007900A (en) * | 2007-07-16 | 2009-01-21 | (주)미래컴퍼니 | Auto packing machine and method thereof |
KR101283312B1 (en) * | 2011-12-29 | 2013-07-09 | 로체 시스템즈(주) | Auto loading system for front opening shipping box |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101699882B1 (en) * | 2015-12-28 | 2017-01-31 | 코리아테크노(주) | Wafer transfer device |
KR101720547B1 (en) * | 2015-12-28 | 2017-03-31 | 코리아테크노(주) | Wafer transfer method |
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