TWI649155B - Transport device - Google Patents

Transport device Download PDF

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Publication number
TWI649155B
TWI649155B TW104120324A TW104120324A TWI649155B TW I649155 B TWI649155 B TW I649155B TW 104120324 A TW104120324 A TW 104120324A TW 104120324 A TW104120324 A TW 104120324A TW I649155 B TWI649155 B TW I649155B
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Taiwan
Prior art keywords
wafer
holding portion
suction
suction port
disposed
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TW104120324A
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Chinese (zh)
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TW201618899A (en
Inventor
大西健太
万德公丈
岡田繁史
占部裕之
渡邊勇輝
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

本發明之課題在於提供一種可恰當地吸引保持已彎曲之晶圓，且對直徑不同之晶圓也可容易地對應處理的搬送裝置。解決手段為將收容於片匣之晶圓從片匣搬出，或將晶圓朝片匣搬入之搬送裝置，並將其做成以下的構成：包含吸引保持晶圓之保持部，與使保持部移動之驅動部。其中，保持部具有保持部本體、開口於保持部本體的表面且相互間隔的複數個吸引口、連接於吸引源以將負壓傳達至吸引口之負壓傳達通路，及配置於吸引口之由彈性材所製成之吸附墊。複數個吸引口是在晶圓的徑向上以相間隔的形式設置，且吸附墊是選擇性地配置於所期望的吸引口上。 An object of the present invention is to provide a transfer apparatus that can appropriately suck and hold a bent wafer and can easily handle a wafer having a different diameter. The solution is a transfer device that carries a wafer accommodated in a cassette from a cassette or a wafer into which a wafer is carried, and has a configuration including a holding portion for sucking and holding the wafer, and a holding portion Mobile drive department. The holding portion has a holding portion main body, a plurality of suction ports that are open to the surface of the holding portion main body and are spaced apart from each other, a negative pressure transmission path that is connected to the suction source to transmit the negative pressure to the suction port, and is disposed at the suction port. An adsorption pad made of an elastic material. The plurality of suction ports are disposed in spaced intervals in the radial direction of the wafer, and the adsorption pads are selectively disposed on the desired suction ports.

Description

搬送裝置 Transport device 發明領域 Field of invention

本發明是關於一種將半導體晶圓等的板狀物從片匣搬出、或朝片匣搬入之搬送裝置。 The present invention relates to a transport apparatus that carries a sheet material such as a semiconductor wafer from a sheet cassette or carries it into a sheet cassette.

發明背景 Background of the invention

近年來為了實現小型輕量的元件晶片(device chip)，因此一直在尋求將矽等材料所製成之晶圓經由磨削以進行薄化加工之技術。在此磨削中所使用的是例如具備工作夾台及磨削輪的磨削裝置，該工作夾台用以吸引保持晶圓，該磨削輪是配置於工作夾台之上方且下表面固定有磨削用之磨石。 In recent years, in order to realize a small and lightweight device chip, a technique of thinning a wafer made of a material such as tantalum has been sought. What is used in this grinding is, for example, a grinding device having a working clamping table for attracting a holding wafer, and a grinding wheel disposed above the working clamping table and fixed on the lower surface. There is a grinding stone for grinding.

藉由一邊使工作夾台與磨削輪相互旋轉，一邊將磨削輪降下以將磨石按壓於晶圓的被加工面上，可以將晶圓磨削而薄化。然而，為了將伴隨著此薄化而剛性已降低了的晶圓分割成複數個元件晶片而利用切削刀等進行切削時，會容易發生破裂(chipping)(碎片)或裂開(cracking)(裂紋)等之問題。 By rotating the work chuck and the grinding wheel while rotating the grinding wheel to press the grindstone against the surface to be processed of the wafer, the wafer can be ground and thinned. However, in order to divide a wafer whose rigidity has been reduced by the thinning into a plurality of element wafers and perform cutting by a cutter or the like, chipping (fragmentation) or cracking (cracking) is likely to occur. ) and so on.

因此近年來，使波長難以被晶圓吸收之雷射光線聚光於晶圓的內部，而形成作為分割起點之改質層後，再 磨削晶圓之加工方法已被實用化(參照例如專利文獻1)。在這個加工方法中，是利用磨削時所施加的外力將晶圓薄化並且分割成複數個元件晶片，因此不需要切削剛性已降低之晶圓。 Therefore, in recent years, laser light having a wavelength that is difficult to be absorbed by the wafer is condensed inside the wafer to form a modified layer as a starting point of the division, and then A method of processing a ground wafer has been put into practical use (see, for example, Patent Document 1). In this processing method, the wafer is thinned and divided into a plurality of element wafers by an external force applied during grinding, so that it is not necessary to cut a wafer having reduced rigidity.

先前技術文獻 Prior technical literature 專利文獻 Patent literature

專利文獻1：國際公開第03/077295號公報 Patent Document 1: International Publication No. 03/077295

發明概要 Summary of invention

然而，當使雷射光線聚光於晶圓之內部而形成改質層時，晶圓會部分地膨脹而彎曲。通常，搬送晶圓之搬送裝置是利用具備有複數個吸引口之平坦的保持部吸引保持著晶圓，因此當如上述地導致晶圓彎曲時，在吸引口附近會發生空氣洩漏而無法恰當地吸引保持晶圓。 However, when the laser beam is condensed inside the wafer to form a modified layer, the wafer partially expands and bends. In general, the transfer device for transporting a wafer sucks and holds the wafer by a flat holding portion having a plurality of suction ports. Therefore, when the wafer is bent as described above, air leakage occurs in the vicinity of the suction port, and it is not possible to properly Attracting and holding the wafer.

只要將已彎曲之晶圓矯正成平坦，則上述之搬送裝置便可恰當地吸引保持晶圓。然而，由於晶圓的剛性會因改質層而降低，因此為了矯正晶圓而在吸引口局部地施加作用力時，晶圓發生破損的機率會很高。此外，在上述搬送裝置中，每當更改所搬送之晶圓的直徑時，也會有必須進行更換保持部等大規模的作業之問題。 As long as the bent wafer is corrected to be flat, the above-described transfer device can properly attract and hold the wafer. However, since the rigidity of the wafer is lowered by the reforming layer, when the force is locally applied to the suction port in order to correct the wafer, the probability of breakage of the wafer is high. Further, in the above-described conveying apparatus, whenever the diameter of the conveyed wafer is changed, there is a problem that it is necessary to perform a large-scale operation such as replacing the holding portion.

本發明是有鑑於所述問題點而作成的發明，其目的是提供一種可恰當地吸引保持已彎曲的晶圓，且對直徑不同之晶圓也可容易地因應處理的搬送裝置。 The present invention has been made in view of the above problems, and an object of the invention is to provide a conveying apparatus which can appropriately suck and hold a bent wafer and can easily handle a wafer having a different diameter.

根據本發明所提供之搬送裝置，為將收容於片匣之晶圓從該片匣搬出，或將該晶圓朝該片匣搬入的搬送裝置，其特徵在於包含吸引保持該晶圓之保持部，與使該保持部移動之驅動部，該保持部具備保持部本體、開口於該保持部本體之表面且相互間隔之複數個吸引口、連接於吸引源以將負壓傳達至該吸引口之負壓傳達通路，及配置於該吸引口之由彈性材所製成之吸附墊，該複數個吸引口是在該晶圓的徑向上以相間隔的形式設置，且該吸附墊是選擇性地配置於所期望的該吸引口上。 According to the transport apparatus of the present invention, a transport apparatus for carrying a wafer accommodated in a cassette from the cassette or carrying the wafer into the cassette is characterized in that the holding unit for sucking and holding the wafer is included And a driving unit that moves the holding portion, the holding portion includes a holding portion body, a plurality of suction ports that are spaced apart from each other on a surface of the holding portion body, and are connected to the suction source to transmit the negative pressure to the suction port a negative pressure conveying passage, and an adsorption pad made of an elastic material disposed at the suction port, the plurality of suction ports are disposed in a spaced relationship in a radial direction of the wafer, and the adsorption pad is selectively Disposed on the desired suction port.

由於本發明之搬送裝置是利用包含配置於吸引口之由彈性材所製成之吸附墊的保持部來吸引保持晶圓，因此可讓吸附墊因應晶圓的形狀而撓曲，即使是已彎曲的晶圓也可以恰當地予以吸引保持。 Since the conveying apparatus of the present invention sucks and holds the wafer by the holding portion including the adsorption pad made of the elastic material disposed at the suction port, the adsorption pad can be flexed in response to the shape of the wafer, even if it is bent The wafer can also be properly attracted and maintained.

又，由於複數個吸引口是在晶圓的徑向上以相間隔的形式設置，且可將吸附墊選擇性地配置於所期望的吸引口上，因此只要變更配置吸附墊之吸引口，則即使是對直徑不同的晶圓也可容易地對應處理。像這樣，依據本發明可以提供一種可恰當地吸引保持已彎曲的晶圓，且對直徑不同之晶圓也可容易地對應處理的搬送裝置。 Further, since the plurality of suction ports are provided at intervals in the radial direction of the wafer, and the adsorption pad can be selectively disposed on the desired suction port, even if the suction port of the adsorption pad is changed, even Wafers of different diameters can also be easily handled correspondingly. As described above, according to the present invention, it is possible to provide a transfer apparatus which can appropriately suck and hold a bent wafer and can easily handle the wafers having different diameters.

10‧‧‧校準機構 10‧‧‧ Calibration agency

11‧‧‧晶圓 11‧‧‧ wafer

12‧‧‧暫置台 12‧‧‧Premium

13‧‧‧保護構件 13‧‧‧Protection components

14‧‧‧搬入機構 14‧‧‧ Moving into the institution

16‧‧‧轉台 16‧‧‧ turntable

18‧‧‧工作夾台 18‧‧‧Working table

2‧‧‧磨削裝置 2‧‧‧grinding device

20‧‧‧支撐構造 20‧‧‧Support structure

22‧‧‧Z軸移動機構 22‧‧‧Z-axis moving mechanism

24‧‧‧Z軸移動板 24‧‧‧Z-axis moving board

26‧‧‧Z軸導軌 26‧‧‧Z-axis guide

28‧‧‧Z軸滾珠螺桿 28‧‧‧Z-axis ball screw

30‧‧‧Z軸脈衝馬達 30‧‧‧Z-axis pulse motor

32‧‧‧磨削機構 32‧‧‧grinding mechanism

34‧‧‧主軸殼體 34‧‧‧ spindle housing

36‧‧‧磨削輪 36‧‧‧ grinding wheel

38‧‧‧搬出機構 38‧‧‧ Moving out of the agency

4‧‧‧基台 4‧‧‧Abutment

4a‧‧‧開口 4a‧‧‧ Opening

40‧‧‧洗淨機構 40‧‧‧ Washing agency

42‧‧‧保持部 42‧‧‧ Keeping Department

44‧‧‧驅動部 44‧‧‧ Drive Department

46‧‧‧保持部本體 46‧‧‧ Keeping the body

46a‧‧‧基部 46a‧‧‧ base

46b‧‧‧枝部 46b‧‧‧ branches

46c‧‧‧表面 46c‧‧‧ surface

46d‧‧‧背面 46d‧‧‧back

48a、48b‧‧‧吸引口 48a, 48b‧‧‧ attracting mouth

50‧‧‧負壓傳達通路 50‧‧‧Negative pressure communication path

52‧‧‧吸引源 52‧‧‧Attraction source

54‧‧‧吸附墊 54‧‧‧Adsorption pad

54a‧‧‧貫穿孔 54a‧‧‧through holes

56‧‧‧密封構件 56‧‧‧ Sealing members

6‧‧‧搬送裝置 6‧‧‧Transporting device

8a、8b‧‧‧片匣 8a, 8b‧‧‧ piece

X、Y、Z‧‧‧方向 X, Y, Z‧‧ Direction

圖1為模式地顯示已將搬送裝置組入之磨削裝置的立體圖。 Fig. 1 is a perspective view schematically showing a grinding device into which a conveying device has been incorporated.

圖2為模式地顯示搬送裝置之圖。 Fig. 2 is a view schematically showing a conveying device.

圖3(A)為模式地顯示搬送裝置的剖面圖，圖3(B)為模式地顯示已吸引保持晶圓之狀態的搬送裝置的剖面圖。 3(A) is a cross-sectional view schematically showing the conveying device, and FIG. 3(B) is a cross-sectional view schematically showing the conveying device in a state in which the holding wafer is sucked.

用以實施發明之形態 Form for implementing the invention

參照附加圖式，對本發明之實施形態進行說明。首先，說明已將本實施形態之搬送裝置組入的磨削裝置。圖1為模式地顯示已將本實施形態之搬送裝置組入之磨削裝置的立體圖。再者，在本實施形態中，雖然顯示了已將搬送裝置組入磨削裝置之例，但是搬送裝置也可以單獨地使用，也可以組入切削裝置等其他的加工裝置中。 Embodiments of the present invention will be described with reference to the accompanying drawings. First, a grinding device in which the conveying device of the embodiment is incorporated will be described. Fig. 1 is a perspective view schematically showing a grinding device in which a conveying device of the embodiment is incorporated. Further, in the present embodiment, an example has been described in which the conveying device has been incorporated into the grinding device. However, the conveying device may be used alone or in another processing device such as a cutting device.

如圖1所示，磨削裝置2具備有支撐各構成之基台4。在基台4的上表面前端側上形成有開口4a，在此開口4a內設置有搬送圓盤狀之晶圓11(參照圖2、圖3(B)等)之搬送裝置6。且，在開口4a的更前方的區域上，載置有可收容複數個晶圓11之片匣8a、8b。 As shown in FIG. 1, the grinding apparatus 2 is provided with the base 4 which supports each structure. An opening 4a is formed on the front end side of the upper surface of the base 4, and a transfer device 6 for transporting a disk-shaped wafer 11 (see Figs. 2, 3(B) and the like) is provided in the opening 4a. Further, on the front side of the opening 4a, the cassettes 8a and 8b capable of accommodating the plurality of wafers 11 are placed.

在載置片匣8a之載置區域及開口4a之後方設置有校準機構10。此校準機構10包含暫置晶圓11之暫置台12，且用以檢測例如以搬送裝置6從片匣8a被搬送(搬出)而被載置於暫置台12上之晶圓11的中心位置。 The calibration mechanism 10 is provided after the placement area of the sheet cassette 8a and the opening 4a. The calibration mechanism 10 includes a temporary stage 12 for temporarily placing the wafer 11, and detects a center position of the wafer 11 placed on the temporary stage 12 by, for example, the conveyance device 6 being conveyed (lifted) from the cassette 8a.

在與校準機構10相鄰的位置上，配置有將晶圓11吸引保持而旋繞之搬入機構14。此搬入機構14具備吸引晶圓11之整個上表面側的吸附墊，且將已用校準機構10檢測出中心位置的晶圓11搬送至後方。 At a position adjacent to the calibration mechanism 10, a loading mechanism 14 that sucks and holds the wafer 11 and is wound is disposed. The loading mechanism 14 includes an adsorption pad that sucks the entire upper surface side of the wafer 11, and transports the wafer 11 that has been detected by the calibration mechanism 10 to the center.

在搬入機構14的後方，配置有可繞著在鉛直方向上延伸之旋轉軸旋轉的轉台(turntable)16。轉台16的上表面設置有3個吸引保持晶圓11的工作夾台18。再者，配置於轉台16上之工作夾台18的數量，並不一定限定為3個。 A turntable 16 that is rotatable about a rotation axis extending in the vertical direction is disposed behind the loading mechanism 14. The upper surface of the turntable 16 is provided with three work chucks 18 for sucking and holding the wafer 11. Furthermore, the number of the work chucks 18 disposed on the turntable 16 is not necessarily limited to three.

以吸附墊吸引保持有晶圓11的搬送機構14，是以將晶圓11的中心對齊於各工作夾台18的中心的方式，將晶圓11搬入至各工作夾台18中。各工作夾台18是與馬達等的旋轉機構(圖未示)連結，而繞著延伸於鉛直方向上的旋轉軸旋轉。 The transport mechanism 14 that sucks and holds the wafer 11 by the adsorption pad transfers the wafer 11 to each of the work chucks 18 so that the center of the wafer 11 is aligned with the center of each of the work chucks 18. Each of the work clamps 18 is coupled to a rotation mechanism (not shown) such as a motor, and is rotated about a rotation axis extending in the vertical direction.

各工作夾台18的上表面為吸引保持晶圓11的保持面。此保持面是通過形成於工作夾台18內部之流路(圖未示)而與吸引源(圖未示)連接。已被搬入至工作夾台18的晶圓11，會因作用於保持面之吸引源的負壓而使下表面側被吸引。 The upper surface of each of the work chucks 18 is a holding surface for sucking and holding the wafer 11. This holding surface is connected to a suction source (not shown) through a flow path (not shown) formed inside the working chuck 18. The wafer 11 that has been carried into the work chuck 18 is attracted to the lower surface side by the negative pressure acting on the suction source of the holding surface.

在轉台16的後方設置有向上方延伸的2條支撐構造20。各支撐構造20的前面透過Z軸移動機構22而設置有Z軸移動板24。各Z軸移動機構22具備有一對平行於Z軸方向的Z軸導軌26，且在Z軸導軌26上設置有可滑動之Z軸移動板24。 Two support structures 20 extending upward are provided at the rear of the turntable 16. The front surface of each support structure 20 is provided with a Z-axis moving plate 24 through the Z-axis moving mechanism 22. Each of the Z-axis moving mechanisms 22 is provided with a pair of Z-axis guide rails 26 that are parallel to the Z-axis direction, and a Z-axis moving plate 24 that is slidable is provided on the Z-axis guide rails 26.

在各Z軸移動板24的後面側(背面側)上設置有螺帽部(圖未示)，且在此螺帽部中螺合有與Z軸導軌26平行之Z軸滾珠螺桿28。在Z軸滾珠螺桿28的一端部連結有Z軸脈衝馬達30。當以Z軸脈衝馬達30使Z軸螺桿28旋轉時，Z軸移動板24會沿著Z軸導軌26在Z軸方向上移動。 A nut portion (not shown) is provided on the rear side (back side) of each of the Z-axis moving plates 24, and a Z-axis ball screw 28 parallel to the Z-axis guide 26 is screwed into the nut portion. A Z-axis pulse motor 30 is coupled to one end of the Z-axis ball screw 28. When the Z-axis screw 28 is rotated by the Z-axis pulse motor 30, the Z-axis moving plate 24 is moved in the Z-axis direction along the Z-axis guide 26.

在各Z軸移動板24的前面(表面)設置有磨削機構32。各磨削機構32具備有固定於Z軸移動板24之主軸殼體34。在各主軸殼體34上，構成旋轉軸的主軸(圖未示)是被支撐成可旋轉。 A grinding mechanism 32 is provided on the front surface (surface) of each of the Z-axis moving plates 24. Each of the grinding mechanisms 32 includes a spindle housing 34 that is fixed to the Z-axis moving plate 24. On each spindle housing 34, a main shaft (not shown) constituting a rotating shaft is supported to be rotatable.

在各主軸的下端部裝設有磨削輪36。各磨削輪36包含以鋁、不銹鋼等金屬材料所形成之圓筒狀的輪基台，與複數個在輪基台的下表面配置成環狀的磨石。 A grinding wheel 36 is attached to the lower end of each spindle. Each of the grinding wheels 36 includes a cylindrical wheel base formed of a metal material such as aluminum or stainless steel, and a plurality of grindstones arranged in a ring shape on the lower surface of the wheel base.

當將晶圓11保持於工作夾台18上時，轉台16會旋轉而將晶圓11定位於磨削機構32的下方。之後，在使工作夾台18及磨削輪36相互地旋轉的狀態下，使磨削機構32下降，並使磨削輪36的磨石接觸於晶圓11的上表面，藉此可以磨削晶圓11。 When the wafer 11 is held on the work chuck 18, the turntable 16 will rotate to position the wafer 11 below the grinding mechanism 32. Thereafter, in a state where the work chuck 18 and the grinding wheel 36 are rotated relative to each other, the grinding mechanism 32 is lowered, and the grindstone of the grinding wheel 36 is brought into contact with the upper surface of the wafer 11, whereby the grinding can be performed. Wafer 11.

在與搬入機構14相鄰的位置上，設置有將磨削後之晶圓11吸引保持而旋繞之搬出機構38。在搬出機構38的前方且開口4a的後方處，配置有洗淨機構40，用以洗淨以搬出機構38所搬出之磨削後的晶圓11。已用洗淨機構40洗淨之晶圓11是利用搬送機構6而被搬送(搬入)，且被收容於片匣8b中。 At a position adjacent to the loading mechanism 14, a carry-out mechanism 38 that sucks and holds the ground wafer 11 and winds it is provided. A cleaning mechanism 40 is disposed in front of the unloading mechanism 38 and behind the opening 4a to clean the ground wafer 11 that has been carried out by the carry-out mechanism 38. The wafer 11 that has been cleaned by the cleaning mechanism 40 is transported (loaded) by the transport mechanism 6, and is accommodated in the cassette 8b.

接著，說明上述搬送裝置6之詳細內容。圖2為模式地顯示搬送裝置6之圖，圖3(A)為模式地顯示搬送裝置6之剖面圖。再者，在圖2中是將已收容有晶圓11之狀態的片匣8a的剖面合併來顯示。 Next, the details of the above-described conveying device 6 will be described. FIG. 2 is a view schematically showing the conveying device 6, and FIG. 3(A) is a cross-sectional view schematically showing the conveying device 6. In addition, in FIG. 2, the cross section of the sheet cassette 8a in which the wafer 11 has been accommodated is merged and displayed.

如圖2所示，搬送裝置6具備有吸引保持晶圓的保持部42。保持部42的基端側連結於驅動部44，且保持部42 是藉由此驅動部44，而在片匣8a、8b、暫置台12，及洗淨機構40之間移動。又，保持部42是藉由驅動部44而繞著在水平方向上延伸之轉動軸轉動。 As shown in FIG. 2, the conveyance device 6 is provided with the holding part 42 which sucks and holds a wafer. The proximal end side of the holding portion 42 is coupled to the driving portion 44, and the holding portion 42 The drive unit 44 is moved between the cassettes 8a and 8b, the temporary stage 12, and the cleaning mechanism 40. Further, the holding portion 42 is rotated about a rotation axis extending in the horizontal direction by the driving portion 44.

保持部42具備有預定大小(例如可插入片匣8a、8b之大小)的保持部本體46。保持部本體46具有從將基端側連結於驅動部44之基部46a的前端使5條枝部46b放射狀地延伸之形狀，且具備有大致平坦的表面46c及背面46d。 The holding portion 42 is provided with a holding portion body 46 having a predetermined size (for example, a size that can be inserted into the sheets 8a, 8b). The holder main body 46 has a shape in which five branch portions 46b are radially extended from the distal end of the base portion 46a that is coupled to the drive portion 44 at the proximal end side, and has a substantially flat surface 46c and a back surface 46d.

在各枝部46b上形成有對應晶圓11之半徑的長度(例如，比半徑稍短的長度)，且將基部46a形成為比各枝部46b還長。但，保持部本體的大小、形狀等並不因此而受到限定。例如，將保持部本體形成為圓盤狀亦可。 A length corresponding to the radius of the wafer 11 (for example, a length slightly shorter than the radius) is formed on each of the branch portions 46b, and the base portion 46a is formed to be longer than each of the branch portions 46b. However, the size, shape, and the like of the holder body are not limited thereby. For example, the holding portion body may be formed in a disk shape.

如圖3(A)所示，相互間隔之複數個吸引口48a、48b(在本實施形態中為各6個吸引口48a、48b)開口於保持部本體46的表面46c上。各吸引口48a，48b是連接於形成在保持部本體46內部之負壓傳達通路50。 As shown in FIG. 3(A), a plurality of suction ports 48a and 48b (in the present embodiment, six suction ports 48a and 48b) are opened on the surface 46c of the holder main body 46. Each of the suction ports 48a, 48b is connected to a negative pressure transmission passage 50 formed inside the holding portion body 46.

如圖2所示，負壓傳達通路50是在基部46a側與吸引源52連接，且使吸引源52所產生之負壓通過負壓傳達通路50傳達至各吸引口48a、48b。 As shown in FIG. 2, the negative pressure transmission passage 50 is connected to the suction source 52 on the side of the base portion 46a, and the negative pressure generated by the suction source 52 is transmitted to the respective suction ports 48a and 48b through the negative pressure transmission passage 50.

在基部46a及各個枝部46b上，分別配置有吸引口48a及吸引口48b。具體來說，是在每個基部46a之驅動部44側及各枝部46b的前端側上，分別配置有1個吸引口48a。又，在基部46a的前端側及各枝部46b的基端側上，分別配置有1個吸引口48b。 A suction port 48a and a suction port 48b are disposed on the base portion 46a and each of the branch portions 46b. Specifically, one suction port 48a is disposed on the drive unit 44 side of each base portion 46a and the front end side of each branch portion 46b. Further, one suction port 48b is disposed on the distal end side of the base portion 46a and the proximal end side of each branch portion 46b.

像這樣，藉由在基部46a及各枝部46b的長邊方向 (晶圓11的徑向)上分開的2個地方上，分別配置吸引口48a及吸引口48b，搬送裝置6就可以將至少2種(2種以上)直徑不同的晶圓11吸引保持而搬送。但是，吸引口的配置及數量並不受限於此。例如，也可以在比吸引口48b更靠近保持部本體46之中央的位置上，進一步配置複數個吸引口。 In this way, by the longitudinal direction of the base portion 46a and each branch portion 46b The suction port 48a and the suction port 48b are disposed in two places (the radial direction of the wafer 11), and the transfer device 6 can hold and transport at least two (two or more) wafers 11 having different diameters. . However, the configuration and number of suction ports are not limited to this. For example, a plurality of suction ports may be further disposed at a position closer to the center of the holding portion body 46 than the suction port 48b.

如圖2所示，在保持部42的3個吸引口48a上，安裝有由橡膠等彈性材所製成之吸附墊54。在此，彈性材是指具有會因晶圓11本身的重量而順應晶圓之表面形狀產生彈性變形之程度的彈性係數及彈性限度的原料。 As shown in Fig. 2, an adsorption pad 54 made of an elastic material such as rubber is attached to the three suction ports 48a of the holding portion 42. Here, the elastic material refers to a material having an elastic modulus and an elastic limit which are elastically deformed in conformity with the surface shape of the wafer due to the weight of the wafer 11 itself.

此吸附墊54是從保持部本體46的表面46c突出於上方，且在其中央形成有上下貫通之貫通孔54a。藉此，使由吸引源52所傳達之負壓作用在與晶圓11抵接之吸附墊54的上表面上。 The suction pad 54 protrudes upward from the front surface 46c of the holding portion main body 46, and has a through hole 54a penetrating therethrough at the center thereof. Thereby, the negative pressure transmitted by the suction source 52 acts on the upper surface of the adsorption pad 54 that abuts on the wafer 11.

在剩餘之3個吸引口48a及6個吸引口48b上，安裝有防止空氣的洩漏之密封構件56。再者，在本實施形態中，雖然是在不相鄰之3個吸引口48a上安裝吸附墊54，且在剩餘之吸引口48a及吸引口48b上安裝密封構件56，但是吸附墊54及密封構件56的配置不受限於此。 A sealing member 56 that prevents leakage of air is attached to the remaining three suction ports 48a and the six suction ports 48b. Further, in the present embodiment, the suction pad 54 is attached to the three suction ports 48a which are not adjacent, and the sealing member 56 is attached to the remaining suction port 48a and the suction port 48b, but the suction pad 54 and the sealing are provided. The configuration of the member 56 is not limited to this.

像這樣所構成之搬送裝置6的保持部42是例如，如圖2所示，藉由驅動部44而被插入於片匣8a中，以使吸附墊54的上表面抵接於晶圓11的下表面側。當在吸附墊54的上表面已抵接於晶圓11之下表面側的狀態下，使吸引源52的負壓作用時，就能利用保持部42吸引保持晶圓11。 The holding portion 42 of the transport device 6 configured as described above is inserted into the cassette 8a by the driving unit 44 as shown in FIG. 2, for example, so that the upper surface of the adsorption pad 54 abuts against the wafer 11. Lower surface side. When the negative pressure of the suction source 52 is applied in a state where the upper surface of the adsorption pad 54 has abutted against the lower surface side of the wafer 11, the wafer 11 can be sucked and held by the holding portion 42.

圖3(B)為模式地顯示已吸引保持有晶圓11之狀 態的搬送裝置6的剖面圖。如圖3(B)所示，該晶圓11是以向下凸的狀態彎曲，且在上表面側貼附有保護構件13。 FIG. 3(B) is a view schematically showing that the wafer 11 has been attracted and held. A cross-sectional view of the conveying device 6 of the state. As shown in FIG. 3(B), the wafer 11 is bent in a downward convex state, and a protective member 13 is attached to the upper surface side.

如上所述，由於吸附墊54是由彈性材所構成，因此當利用保持部42支撐晶圓11時，吸附墊54就會因應晶圓11的形狀而稍微變形。藉此，在晶圓11與保持部42間的間隙就變得不會有空氣的洩漏，而可將晶圓11恰當地吸引保持而從片匣8a搬出。 As described above, since the adsorption pad 54 is made of an elastic material, when the wafer 11 is supported by the holding portion 42, the adsorption pad 54 is slightly deformed in accordance with the shape of the wafer 11. Thereby, the gap between the wafer 11 and the holding portion 42 is prevented from leaking, and the wafer 11 can be appropriately sucked and held and carried out from the sheet bundle 8a.

從片匣8a搬出晶圓11後，是例如，在使保持部42以繞著旋動軸的形式轉動而使其上下反轉後，將晶圓11載置於暫置台12上。已藉校準機構10對位後之晶圓11是利用搬入機構14而被搬入至工作夾台18上。 After the wafer 11 is carried out from the wafer 8a, for example, the wafer 11 is placed on the temporary stage 12 after the holding portion 42 is rotated about the rotation axis to be vertically inverted. The wafer 11 that has been aligned by the calibration mechanism 10 is carried into the work chuck 18 by the loading mechanism 14.

再者，由於搬入機構14是一邊將晶圓11的整個表面吸引而矯正成平坦一邊保持，因此因局部的作用力而導致晶圓11破損的可能性會較低。另一方面，在像是將晶圓11從片匣8a搬出的用途上，在保持部的大小上存有限制而無法吸引保持晶圓11之整個表面的情況等中，本實施形態的搬送裝置6特別有效。 Further, since the loading mechanism 14 is held while the entire surface of the wafer 11 is sucked and corrected to be flat, the possibility of damage of the wafer 11 due to a local urging force is low. On the other hand, in the case where the wafer 11 is carried out from the cassette 8a, the transfer unit of the present embodiment is not limited in the size of the holding portion, and the entire surface of the wafer 11 cannot be sucked. 6 is particularly effective.

如以上所述，本實施形態之搬送裝置6因為是利用包含配置於吸引口48a、48b的彈性材所製成之吸附墊54的保持部42來吸引保持晶圓11，因此可因應晶圓11的形狀使吸附墊54撓曲，即使是已彎曲的晶圓11也可恰當地予以吸引保持。 As described above, the transfer device 6 of the present embodiment can suck and hold the wafer 11 by the holding portion 42 including the adsorption pad 54 made of the elastic material disposed in the suction ports 48a and 48b. The shape causes the adsorption pad 54 to flex, and even the bent wafer 11 can be properly attracted and held.

又，因為吸引口48a、48b是在晶圓11的徑向上以相間隔的形式設置，且吸附墊54是選擇性地配置於所期望 的吸引口48a、48b上，因此只要變更配置吸附墊54之吸引口48a，48b，則即使是對直徑不同的晶圓11也可容易地對應處理。 Further, since the suction ports 48a, 48b are arranged in the radial direction of the wafer 11, the adsorption pad 54 is selectively disposed in a desired manner. Since the suction ports 48a and 48b of the adsorption pad 54 are changed by the suction ports 48a and 48b, the wafers 11 having different diameters can be easily handled.

再者，上述實施形態之構成、方法等，只要在不脫離本發明目的之範圍內，皆可適當變更而實施。 Further, the configuration, the method, and the like of the above-described embodiments can be appropriately modified and implemented without departing from the scope of the invention.

Claims (1)

一種搬送裝置，為將收容於片匣之晶圓從該片匣搬出，或將該晶圓朝該片匣搬入的搬送裝置，其特徵在於包含吸引保持該晶圓之保持部，與使該保持部移動之驅動部，其中，該保持部具備：保持部本體；複數個吸引口，開口於該保持部本體的表面且相互間隔；負壓傳達通路，連接於吸引源以將負壓傳達至該吸引口；以及吸附墊，配置於該吸引口，在開始吸引保持該晶圓時抵接於該晶圓的下表面，該複數個吸引口是在該晶圓之徑向上以相間隔的形式設置，且該吸附墊是以因該晶圓本身的重量而順應晶圓之形狀變形的彈性材所製成，且是選擇性地配置於所期望的該吸引口上。 A transfer device for transporting a wafer accommodated in a wafer from the sheet or transporting the wafer toward the sheet, comprising a holding portion for sucking and holding the wafer, and maintaining the holding portion a driving unit for moving the portion, wherein the holding portion includes: a holding portion main body; a plurality of suction ports opening on the surface of the holding portion main body; and a negative pressure transmitting passage connected to the suction source to transmit the negative pressure to the driving portion a suction port disposed at the suction port and abutting against a lower surface of the wafer when the wafer is initially attracted and held, the plurality of suction ports being arranged in a radial interval in the radial direction of the wafer And the adsorption pad is made of an elastic material that conforms to the shape of the wafer due to the weight of the wafer itself, and is selectively disposed on the desired suction port.
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