JP2006013088A - Substrate sucking and carrying device and marking device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate sucking and carrying device capable of individually setting a suction area even for substrates of various sizes or different types, and maintaining the suction status and recording grade of the substrate high. <P>SOLUTION: The suction holes 23 of a sucking plate 18 are formed so as to be independently openable and closable by a suction hole opening/closing member 24 disposed on the positions corresponding to the suction holes 23 and provided so as to be lifted/lowered from a base plate 19. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate suction transfer device and a marking device for sucking and transporting a substrate to a marking portion in order to perform marking on a substrate substrate after inspection, for example.

  A substrate substrate on which a semiconductor chip is mounted is subjected to a good / bad determination by an automatic inspection machine, and then an identification mark is given to the defective product. Even in the case of a substrate substrate that is determined to be defective by this inspection, in order to improve the yield of the product, the operator performs a marking operation after confirming again by visual inspection and determining whether the product is defective. In general, when a sheet material such as recording paper or a card is transported to a recording unit without being limited to a substrate, the sheet material is attracted and transported to a plate surface or a belt surface in order to transport the sheet material while maintaining flatness at a recording position. The suction hole is connected to a vacuum generator through a suction path, and switching between suction start / suction release is performed by turning the vacuum generator ON / OFF.

  When the sheet material is sucked and conveyed immediately below the recording position, the entire surface of the sheet material is often sucked from the suction holes provided uniformly on the suction surface corresponding to the size of the sheet material. Along with the change in sheet size, a suction area corresponding to the sheet size of the suction surface is formed in advance, and the suction path is switched by opening and closing a valve provided in the suction path for each suction area. Corresponding to the change in size, the suction area is adjusted by covering the suction hole with a shielding member.

  However, as long as the sheet material is flat without irregularities or holes (for example, recording paper, cards, etc.), the sheet size may be changed as described above, but the sheet material may be a substrate or substrate for manufacturing a semiconductor device. In the case of a board, slit holes and various irregularities due to wiring patterns are often formed on the board surface, and air suction leaks from such parts, causing insufficient suction of the board, Since air is sucked from the ink, ink droplets ejected from the recording head (inkjet head) may be scattered around.

  The object of the present invention is to solve the above-mentioned problems, and even if the substrates have various sizes and varieties, the adsorption area can be individually set, and the substrate adsorption state and recording quality can be maintained at a high level. An object of the present invention is to provide a suction conveyance device and a marking device.

In order to achieve the above object, the present invention comprises the following arrangement.
In the substrate suction transfer device, a suction plate having a plurality of suction holes for sucking a substrate and a space portion provided between the suction plate and supported by the suction plate are connected to the vacuum generator from the space portion. A substrate transport unit including a base plate to which the suction unit is connected; and a substrate driving unit that reciprocates the substrate transport unit to the marking unit. The suction hole of the suction plate is located at a position corresponding to the suction hole. It is characterized in that it can be opened and closed individually by a suction hole opening and closing member that is disposed and provided so as to be able to move up and down from the base plate surface.
The suction hole opening / closing member is a valve screw that is screwed into a screw hole provided in the base plate, and a tool is inserted from the suction surface side of the suction plate through the suction hole and is rotated in conjunction with the screw head. Thus, the suction head is opened and closed by raising and lowering the screw head.
The suction hole opening / closing member is a valve screw that is screwed into a screw hole penetrating the base plate, and the screw head is moved up and down by rotating an operation unit connected to a screw shaft extending from the lower surface side of the base plate. And opening and closing the suction hole.
A suction hole opening / closing member corresponding to the second suction hole, the first suction hole constantly sucking the substrate placed on the suction plate; and a second suction hole capable of opening and closing the suction path. Is provided.
Further, the first suction hole is formed along each side forming the corner portion of the rectangular suction plate, and the second suction hole is provided in a scattered manner on the suction surface. To do.
The marking device is characterized in that marking is performed on the substrate by ejecting ink droplets from an inkjet head arranged so that the transport direction of the substrate suction transport device described above intersects with the longitudinal direction of the head.

If the above-described substrate suction / conveying device is used, the suction holes of the suction plate can be individually opened and closed by suction hole opening / closing members provided so as to be able to be lifted and lowered from the base plate surface corresponding to the suction holes. Even if the substrate has various sizes and holes on the suction surface, the suction holes facing the uneven portions and holes can be individually closed by the suction hole opening and closing member, so the suction part in the suction area can be set. It can be performed individually and the adsorption state according to the substrate size and product type can be maintained at a high level.
The suction hole opening / closing member is a valve screw that is screwed into the screw hole of the base plate. By inserting a tool such as a screwdriver through the suction hole from the suction surface side of the suction plate and rotating it in conjunction with the screw head. As the screw head is raised and lowered to open and close the suction hole, workability is good, and when the screw head is lifted and lowered to open and close the suction hole by rotating the operation part linked to the screw shaft from the lower surface side of the base plate No tools are required and operability is good.
A first suction hole for constantly sucking the substrate placed on the suction plate and a second suction hole capable of opening and closing the suction path are provided, and a suction hole opening / closing member is provided corresponding to the second suction hole. By setting the first suction hole on the suction plate with reference to the first suction hole, the second suction hole can be opened and closed according to the area of the substrate and the holes drilled in the substrate. Just adjusting is enough.
In addition, when the first suction holes are formed along each side forming the corner portion of the rectangular suction plate, and the second suction holes are provided in the form of dots on the suction surface, Because the suction area and non-suction area can be assumed in advance based on the corner, by opening and closing the second suction hole in advance, only the minimum required suction holes can be adjusted when changing the size or product type of the substrate. This is sufficient and workability is good.
Further, in the marking device provided with the above-described substrate suction conveyance device, the air suction from the substrate suction surface does not act at the recording position, so that the ink droplets ejected from the inkjet head are not scattered around and the recording quality is high. Can be maintained well.

  Hereinafter, the best embodiment of the marking device according to the present invention will be described in detail with reference to the accompanying drawings. The marking device of the present embodiment is widely applicable to marking devices that perform marking by ejecting ink droplets from nozzles to corresponding defective portions of a substrate based on recording data. In this example, a marking device for a defective portion of a substrate substrate for manufacturing a semiconductor device will be described.

A schematic configuration of the marking apparatus will be described with reference to FIG.
A bitmap file is converted into a data structure for printing based on driver software by a personal computer (not shown), and the recording data (nozzle data) is transmitted to the marking device through a communication cable (USB code). The marking device performs marking by ejecting ink droplets from the nozzles of the inkjet head to corresponding defective pieces among the pieces constituting the substrate based on the recording data (nozzle data).

  1A, 1B, and 1C, a marking device 1 includes a substrate suction / conveyance device 2 that reciprocates to a recording position while the substrate is attracted and held, and the transport direction and longitudinal direction of the substrate suction / conveyance device 2 are the same. A line-type inkjet head 3 (marking unit) that is arranged so as to intersect and ejects ink onto a corresponding defective piece of the substrate, and a UV dryer 4 that irradiates and drys the sheet on which the ink has been ejected with UV light. is doing. The substrate conveying unit 2 conveys the sheet to the recording position while holding the sheet, the ink is ejected from the inkjet head 3, and the operation of conveying the ink to the UV dryer 4 and drying the ink is repeated. Each time this recording operation is performed, marking is performed by moving the ink jet head 3 by a predetermined pitch in the longitudinal direction and recording ink droplets of a necessary number of dots on the sheet. Ink is supplied to the inkjet head 3 through the ink tube 6 from the ink supply unit 5. The ink supply unit 5 is provided with an ink bottle for storing UV curable ink, a pump for sending the ink to the inkjet head 3, and the like.

Next, the configuration of the substrate suction transfer device 2 will be described with reference to FIG.
First, the configuration of the substrate transfer unit will be described. The slide plate 7 reciprocates while adsorbing and holding the substrate 8. A plurality of suction holes, which will be described later, are provided on the surface of the slide plate 7 to adsorb the substrate 8. The slide plate 7 is integrally supported by a support portion 10 provided upright on the moving base portion 9. The movement base part 9 is connected so as to be movable along the slide shaft 11. The slide shaft 11 is provided with an origin sensor 12 that defines the origin of the movement base unit 9 and a limit sensor 13 that defines the end of movement. The movement base unit 9 reciprocates within a range detected by the origin sensor 12 and the limit sensor 13.

  Next, the configuration of the substrate drive unit that reciprocates the substrate transport unit will be described. A part of the support portion 10 is connected to an endless timing belt 14. The timing belt 14 is stretched between a motor pulley of the step motor 15 provided on the movement origin side and a pulley provided on the movement end side. A tension roller 16 abuts the timing belt 14 at two locations to maintain a constant tension. In addition, an encoder 39 that detects the amount of movement of the slide plate 7 is coaxially provided on the pulley provided on the movement end side. By driving the step motor 15 to rotate forward and backward, the sheet 30 moves back and forth between the suction holding position of the sheet 30, the recording position, and the drying position.

  Next, the marking operation of the marking device 1 will be described with reference to FIGS. FIG. 2 shows a state in which the slide plate 7 is at the origin position. The moving base unit 9 is detected by the origin sensor 12 and the step motor 15 is stopped. In this state, the substrate 8 is sucked and held on the slide plate 7.

  Next, when the step motor 15 is activated in FIG. 3, the moving base portion 9 moves along the slide shaft 11, and the slide plate 7 is conveyed to a recording position facing the inkjet head 3. At this time, ink droplets (one dot) are ejected from the inkjet head 3 to a defective piece of the substrate 8 based on recording data transmitted from a personal computer (not shown). When ink droplets are ejected, the inkjet head 8 is moved by one pitch in the longitudinal direction by a head moving mechanism (not shown).

  Next, in FIG. 4, the step motor 15 is further driven to rotate, and when the slide plate 7 passes the drying position of the UV dryer 4, UV light is irradiated to the ink droplets for one dot to dry the ink. . When the movement base unit 7 is detected by the limit sensor 13, the rotation drive of the step motor 15 is stopped. Next, the movement base unit 9 is driven to rotate the step motor 15 in the reverse direction from the movement end position, the movement base unit 9 moves along the slide shaft 11, and the slide plate 7 is conveyed to the recording position facing the inkjet head 3. . At this time, ink droplets (one dot) are ejected from the inkjet head 3 to a defective piece of the substrate 8 based on recording data transmitted from a personal computer (not shown). When the ink droplets are ejected, a head moving mechanism (not shown) is operated to move the inkjet head 3 by one pitch in the longitudinal direction.

  Once the slide plate 7 is returned to the origin position (position shown in FIG. 2) detected by the origin sensor 12 by the moving base unit 9, the step motor 15 is driven to rotate forward again so that the slide plate 7 faces the inkjet head 3. Transported to position. At this time, ink droplets (for one dot) are further ejected from the inkjet head 3 to the defective piece of the substrate 8 based on recording data transmitted from a personal computer (not shown). When the ink droplets are ejected, a head moving mechanism (not shown) is operated to move the inkjet head 3 by one pitch in the longitudinal direction.

  When the slide plate 7 passes through the drying position of the UV dryer 4, UV ink is irradiated to the ink droplets for two reciprocating dots to dry the ink. When the movement base unit 9 is detected by the limit sensor 13, the rotation drive of the step motor 15 is stopped. Thereafter, the same operation is repeated to eject ink droplets when the slide plate 7 reciprocates the recording position, drying is performed, and a necessary dot ink image is marked on the defective piece.

  Ink jet head 8 is air blown before starting marking in order to prevent clogging of nozzles, but an ink pad portion capable of absorbing ink droplets is provided below the recording position. Further, the recovery process may be performed by discharging ink droplets to the ink pad portion. A single inkjet head 8 may be provided, but a plurality of inkjet heads may be provided in parallel. In this case, since the necessary number of dots can be obtained by passing the substrate just under the inkjet head 8 once, printing can be performed efficiently. The inkjet head 8 is not limited to being arranged orthogonal to the substrate transport direction, and may be arranged obliquely.

Here, a detailed configuration of the substrate suction transfer device 2 will be described with reference to FIGS.
5A, 5 </ b> B, and 5 </ b> C, the slide plate 7 includes a suction plate 18 that sucks the substrate 8 and a base plate 19 that supports the suction plate 18.
A space portion 20 is formed between the suction plate 18 and the base plate 19, and a suction hose (suction portion) 21 connected to a vacuum generator such as a vacuum pump (not shown) is connected from the space portion 20. .

  In FIG. 5A, the suction plate 18 is opened and closed in accordance with the area of the substrate 8 and the hole formed in the substrate 8 and the first suction hole 22 that constantly sucks the substrate 8 placed on the suction plate 18. A possible second suction hole 23 is provided. The first suction holes 22 are formed along the respective edge portions R1 and R2 that form one corner portion of the rectangular suction plate 18, and the second suction holes 23 are scattered on the suction surface. Is provided.

  6 (a) and 6 (b), the base plate 19 is provided with valve screws 24 (suction hole opening / closing members) corresponding to the positions of the second suction holes 23 drilled in the suction plate 18. The valve screw 24 is disposed in the space portion 20 and is provided so as to be able to move up and down by screwing into a screw hole 25 provided in the base plate surface. In FIG. 6A, the valve screw 24 is moved up and down by inserting a tool (precision screwdriver) 26 from the second suction hole 23, fitting it into the screw head 27, and rotating to thereby move the second suction hole. 23 can be opened and closed individually. Specifically, in FIG. 6B, the screw head 27 is brought into close contact with the back surface side of the suction plate 18 to close the second suction hole 23 (suction OFF), and the screw head 27 is moved from the suction plate 18. When they are separated from each other, they are opened (adsorption ON).

  6A and 6B, a protection sheet 28 such as a rubber material or a resin material may be laid on the suction surface (upper surface) of the suction plate 18 that holds the substrate 8 by suction. A sealing sheet 29 such as a resin material may be laid on the back surface (lower surface) of the suction plate 18 with which the portion 27 abuts. FIG. 7 shows a state in which the screw head 27 is in close contact with the seal sheet 29 (adsorption OFF). In this case, since the adhesiveness between the screw head 27 and the seal sheet 29 is increased, suction leakage can be reliably prevented.

  An example of the substrate 8 is shown in FIG. In the case of a substrate substrate 8 for manufacturing a semiconductor device, since it is usual to take a large number of products from one substrate 8, slit holes 8a may be provided in consideration of manufacturing convenience and cutting ability. Many. In particular, in the case of a lead frame, since the slit hole, the pilot hole, and the like are provided by being partitioned by a dam bar, a section bar or the like between the leads, the adhesion is likely to be lowered.

  FIG. 8B shows a state where the substrate 8 is sucked and held on the suction plate 18 with reference to the corner portion R (side R1 and side R2). When the substrate size is a specified size, the non-adsorption area Q is known by dividing it into a substrate adsorption area P and a non-adsorption area Q (shaded area in the figure). Therefore, the tool 26 is inserted into the second suction hole 23 existing in the non-suction area Q from the upper surface side of the suction plate 18 and the valve screw 24 is rotated. Block it. The second suction hole 23 communicating with the slit hole 8a of the substrate 8 mounted in the suction area P is also closed by rotating the valve screw 24. Accordingly, the substrate 8 can be reliably sucked and held by the first suction hole 22 and the second suction hole 23 (broken line holes in FIG. 8B) capable of sucking the substrate 8. Further, since the suction holes 22 and 23 do not communicate with the recording surface side by the ink jet head 3, scattering of ink droplets can be prevented.

  In addition, once the second suction hole 23 is set to open and close, the substrates 8 of the same size and the same type can be repeatedly sucked and held, so that workability is good. Further, even if the substrate 8 is out of the specified size, the tool 26 is inserted into the second suction hole 23 from the upper surface side of the suction plate 18 by mounting the substrate 8 on the suction plate 18 with reference to the corner portion R. Since the open / closed state of the valve screw 24 can be individually adjusted, it can be applied not only to mass-produced products but also to various types and low-production types of substrates 8, and versatility is improved. Further, since the substrate 8 is sucked and held with reference to the corner portion R of the suction plate 18, it is not necessary to adjust the valve screw 24 that can be used in an open / closed state even if the substrate size changes, and the minimum necessary range. Therefore, it is only necessary to adjust the valve screw 24, so that workability is good.

  Next, another structure of the suction hole opening / closing member will be described with reference to FIG. In FIG. 9, a valve screw 31 is screwed into a screw hole 30 penetrating the base plate 19. A knob portion 33 (operation portion) is linked to a screw shaft 32 extending to the lower surface side of the base plate 19 of the valve screw 31. You may make it open / close the 2nd suction hole 23 by raising / lowering the screw head 27 by rotating this knob part 33. FIG. In this case, it is necessary to put a hand on the back side of the base plate 19, but the tool 26 is not necessary.

  The substrate 8 is not limited to a substrate substrate for manufacturing a semiconductor device (IC chip), but may be a resin substrate, a film substrate, a glass substrate, or the like for manufacturing other electronic components. The suction hole opening / closing member is not limited to a screw type, and other methods such as a cam or a spring may be used as long as the sealing performance of the suction hole is maintained and the operation is simple.

They are a top view, a front view, and a right side view of the marking device. It is a state figure showing marking operation of a marking device. It is a state figure showing marking operation of a marking device. It is a state figure showing marking operation of a marking device. It is the top view and vertical / horizontal cross-sectional view which show the principal part structure of a board | substrate adsorption | suction conveyance apparatus. It is explanatory drawing which shows the structure of a suction hole opening / closing member, and the opening / closing operation | work of a suction hole. It is explanatory drawing of the state which closed the suction hole. It is a top view of a board | substrate and a board | substrate adsorption | suction conveyance apparatus. It is explanatory drawing of the suction hole opening / closing member which concerns on another example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Marking apparatus 2 Board | substrate adsorption | suction conveyance apparatus 3 Inkjet head 4 UV dryer 5 Ink supply part 6 Ink tube 7 Slide plate 8 Substrate 9 Movement base part 10 Support part 11 Slide shaft 12 Origin sensor 13 Limit sensor 14 Timing belt 15 Step motor 16 Tension roller 17 Encoder 18 Suction plate 19 Base plate 20 Space portion 21 Suction hose 22 First suction hole 23 Second suction hole 24, 31 Valve screw 25, 30 Screw hole 26 Tool 27 Screw head 28 Protection sheet 29 Seal sheet 32 Screw shaft 33 Knob

Claims (6)

In the substrate suction transport device that sucks and holds the substrate on the suction plate and transports it to the marking unit,
A suction plate having a plurality of suction holes for sucking the substrate;
A substrate transport unit including a base plate to which a suction part connected to a vacuum generator is connected from the space part by providing a space part between and supporting the suction plate;
A substrate driving unit that reciprocates the substrate transport unit to the marking unit;
A substrate suction / conveying apparatus, wherein suction holes of the suction plate are individually opened and closed by a suction hole opening / closing member provided at a position corresponding to the suction hole and capable of being lifted and lowered from a base plate surface.   The suction hole opening / closing member is a valve screw that is screwed into a screw hole provided in the base plate. A screw is inserted by rotating a tool through the suction hole from the suction surface side of the suction plate and rotating in conjunction with the screw head. 2. The substrate suction transfer device according to claim 1, wherein the suction hole is opened and closed by moving the head up and down.   The suction hole opening / closing member is a valve screw that is screwed into a screw hole penetrating the base plate, and the screw head is moved up and down by rotating an operation unit connected to a screw shaft extending from the lower surface side of the base plate. The substrate suction transfer device according to claim 1, wherein the suction hole is opened and closed.   A first suction hole for constantly sucking the substrate placed on the suction plate and a second suction hole capable of opening and closing the suction path are provided, and a suction hole opening / closing member is provided corresponding to the second suction hole. The substrate suction transfer device according to claim 1, wherein the substrate suction transfer device is provided.   The first suction hole is formed along each side forming the corner portion of the rectangular suction plate, and the second suction hole is provided in a dotted pattern on the suction surface. Item 5. The substrate suction conveyance device according to Item 4.   6. The substrate is marked by ejecting ink droplets from an ink jet head arranged so that the transport direction of the substrate suction transport device according to claim 1 and the longitudinal direction of the head intersect. Marking device.

Images