JPH07205918A - Chip part loading apparatus - Google Patents

Abstract

PURPOSE:To securely load a chip part into each loading hole on a loading tape and prevent a failure from occurring in a subsequent process. CONSTITUTION:Loading guides 1, 2 are provided on a loading tape T which runs intermittently. A supply path 5 is formed on the loading guides 1, 2 perpendicularly to a running direction of the loading tape T. A guide face 6 which is gradient so that it gradually comes close to an upper face of the loading tape as it comes deep above a passed position of a loading hole t1 on the supply path 5. A suction hole 9 for sucking a chip part R to the loading guide 1 and loading it into the loading hole t1 along the guide face 6 is formed. With a large chip part R, air is ejected from an air ejection hole 11 formed on the loading guide 1 to correct the chip part R into a horizontal state. With a small chip part R, air is ejected from an air ejection hole 12 formed on the loading guide 2 to prevent the chip part R from dropping off the loading hole t1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component loading device used to load various chip components such as a rectangular plate type chip fixed resistor and a chip type capacitor onto a loading tape when taping.

[0002]

2. Description of the Related Art A chip component such as a rectangular plate type chip fixed resistor is mounted on a printed circuit board or the like by a mounting machine. In order to easily supply the chip component to the mounting machine, the chip component is mounted. Are taping.

A taping tape used for taping a chip component is composed of a loading tape and a cover tape. As an example, as shown in FIGS. 4 and 5, the loading tape T includes a chip component R on a paper tape body T1.
A loading hole t1 and a feeding hole t2 (see FIGS. 1 and 2).
Bottoms of the bottom tape T2 so as not to block the feed holes t2 on the back surface of the tape body T1.
Are bonded to close the bottom side of the loading hole t1. The chip component R is placed in the loading hole t1 of the loading tape T.
Are sequentially loaded and a cover tape (not shown) is adhered to the surface of the tape body T1 so as not to close the feed hole t2, and taping of the chip component R is completed.

Conventionally, in order to load the chip component R into the loading hole t1 of the loading tape T, generally, the loading tape T is intermittently run, and the chip component R transferred by the supply device is sucked by a suction means. After sucking and holding and moving the loading tape T to a position above the loading hole t1 of the loading tape T that has been stopped, it is lowered to release the attraction force of the chip component R, and the chip component R is loaded into the loading hole as shown in FIG. It is dropped at t1.

[0005]

However, in the prior art as described above, especially in the case of a small chip component R, the size from the suction release position to the bottom of the loading hole t1 is large, so that the chip component R is small. As shown in FIG. 5, the loading hole t
There is a risk of standing within 1. Also, chip parts R
A disk having a large number of storage recesses on the outer periphery is generally used as the supply device for the chip component R due to the positional deviation between the width of the storage recess and the loading hole t1 of the loading tape T. Poor loading may occur. Further, when the suction hole of the suction means is clogged, it cannot be loaded. When the loading failure occurs in this way, there are problems that the cover tape cannot be adhered and that the chip component R is hindered when it is mounted on the printed circuit board by the mounting machine. Accurate loading at t1 is required.

The present invention solves the above-mentioned conventional problems, and the chip components can be reliably loaded into the respective loading holes of the loading tape, thus impeding the subsequent work. It is an object of the present invention to provide a chip component loading device capable of preventing the above.

[0007]

Means for Solving the Problems The technical means of the present invention for achieving the above object is provided on a loading tape that intermittently runs in the direction in which the loading holes for chip parts are arranged. A loading guide which is formed in a direction perpendicular to the running direction of the tape, and which has a supply path serving as a guide surface which is inclined so that the upper part of the passing position of the loading hole reaches the inner side and gradually approaches the upper surface of the loading tape. A suction means for sucking the chip component into the supply path from the back side of the supply path and loading the chip part in the loading hole by the guide of the guide surface; And a correcting means for correcting the posture of the chip component by the ejection and loading the chip component into the loading hole.

The loading guide has an auxiliary guide surface continuous with the guide surface on the downstream side in the traveling direction of the loading tape in the same inclined state as the guide surface of the feeding path, and the loading tape is fed from the supply path. Has a relief groove on the downstream side in the traveling direction of the loading hole that recedes from the edge on the chip component supply side of the loading hole, and the suction means is configured to suck the chip component from the guide surface along substantially the entire length of the auxiliary guide surface. can do.

Further, when a relatively large chip component is loaded, the correction means blows air so as to push the chip component supplied from the supply path horizontally from above toward the loading hole. can do.

Further, when a relatively small chip component is loaded, the correction means may be constructed so as to eject air from the downstream side in the running direction of the loading tape along the upper surface of the loading tape. it can.

The loading guide is divided into first and second loading guides along the running direction of the loading tape, and
The second loading guide is rotatably supported by the horizontal axis in the vertical direction with respect to the loading guide, and the loading hole portion of the loading tape is opened by rotating the second loading guide upward. Can be configured to obtain.

[0012]

According to the present invention having the above-described structure, the sucked chip component is sucked by the suction means into the supply path provided in the direction perpendicular to the running direction of the loading tape, thereby guiding the sucked chip component. The chip component can be surely loaded into the loading hole of the loading tape by guiding it by the surface and correcting the attitude of the chip component by the correction means.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 to 3 show a chip component loading apparatus according to an embodiment of the present invention, FIG. 1 is a perspective view, FIG. 2 is a plan view, and FIG. 3 is a sectional view taken along the line AA of FIG.

As shown in FIGS. 1 to 3, the first loading guide 1 and the second loading guide 2 are placed so as to be positioned on the loading tape T which is intermittently run by a running device (not shown). It is provided. The first loading guide 1 is fixed to a machine frame (not shown), and the second loading guide 2 is at the upstream side position in the traveling direction of the loading tape T.
On the other hand, it is supported by a horizontal shaft 3 so as to be vertically rotatable. The loading tape T is provided on the second loading guide 2.
The operation projection 4 is provided on the upstream side in the traveling direction of
By operating the operation protrusion 4, it can be rotated in the vertical direction.

The second loading guide 2 and the first loading guide 1
A supply path 5 for the chip component R is formed in the intermediate portion of the above from the side of the second loading guide 2 in the direction perpendicular to the running direction of the loading tape T. The supply path 5 has a guide surface 6 that is inclined so as to gradually approach the upper surface of the loading tape T as the upper portion of the position where the loading hole t1 passes in the loading tape T reaches the inner side in the supply direction of the chip component R. Has been formed. The rear end of the guide surface 6 is set to a position slightly advanced to the chip component supply side from the edge of the loading hole t1 on the side opposite to the chip component supply side. The guide surface 6 is formed on the first loading guide 1 side. In the first loading guide 1, an auxiliary guide surface 7 continuous with the guide surface 6 is formed on the downstream side in the traveling direction of the loading tape T in the same inclined state as the guide surface 6 of the supply path 5. In the second loading guide 2, a groove 18 is formed on the downstream side of the feeding path 5 in the traveling direction of the loading tape T so as to escape from the edge of the loading hole t1 on the chip component feeding side.

The first loading guide 1 is provided with suction means for sucking the chip component R into the supply path 5 from the back side of the supply path 5. That is, a vertical suction hole 9 is formed in the supply path 5 ahead of the supply direction of the chip component R,
The suction hole 9 is set to be opened to a part of the passing loading hole t1 on the side opposite to the chip component supply side. A suction groove 10 is formed so as to communicate with the lower end of the suction hole 9 so as to extend from the guide surface 6 to substantially the entire length of the auxiliary guide surface 7, and the upper portion of the suction hole 9 is communicated with a vacuum pump (not shown). Therefore, by driving the vacuum pump, the chip component R can be sucked into the supply path 5 through the suction hole 9 and can be loaded into the loading hole t1 of the loading tape T along the guide surface 6.
Even after loading, the suction state can be maintained via the suction groove 10.

The first loading guide 1 is provided with a correction means for correcting the posture of the chip component R when the chip component R is sucked from the suction hole 9 and loaded into the loading hole t1 as described above. That is, a vertical air ejection hole 11 is formed at an intermediate portion of the guide surface 6 in the supply direction of the chip component R, and an upper portion of the air ejection hole 11 is communicated with a compressor (not shown). Therefore, when the compressor is driven to eject air downward through the air ejection hole 11, and when the air is sucked and loaded into the loading hole t1 as described above, the chip component R is pushed from above so as to be in a horizontal state. I am supposed to correct my posture. This correction means performs an intermittent operation of ejecting air when the chip component R is loaded into the loading hole t1, and is particularly useful when the chip component R is large.

The second loading guide 2 is provided with a correction means for correcting the posture of the chip component R when the chip component R is sucked from the suction hole 9 and loaded into the loading hole t1 as described above. That is, in the middle portion of the second loading guide 2 in the running direction of the loading tape T, the air ejection hole 1
2 is formed. The air ejection hole 12 is formed vertically downward from the upper surface, and is directed toward the loading hole t1 side on the supply path 5 with respect to the inclined surface of the recess 13 formed in the groove 8 from the lower end in the vertical direction. It is open diagonally downward. The upper portion of the air ejection hole 12 communicates with a compressor (not shown). Therefore, air is driven by the compressor through the air ejection holes 12 along the upper surface of the loading tape T, and the loading holes t1 on the supply path 5 are loaded.
To the loading hole t.
The chip component R loaded in 1 is pushed to the upstream side in the running direction of the loading tape in the supply path 5 to correct the posture in the horizontal direction. This correcting means performs a continuous operation of continuously ejecting air, and is particularly useful when the chip component R is small.

As an example of the device for supplying the chip component R, a rotary disk 15 is rotatably supported on a fixed disk 14, and a large number of storage recesses 16 are formed by cutting out the rotary disk 15 at equal intervals. Are formed. Rotating disk 15
A guide 17 for guiding the chip component R supplied to the storage recess 16 by a linear feeder (not shown) or the like so as not to be separated from the storage recess 16 as the rotating disk 15 rotates is provided on the outer periphery of the. The guide 17 is fixed to the machine frame. The guide 17 is formed with a supply passage 18 that coincides with the supply passage 5. Then, the rotary disk 15 is intermittently rotated, so that the storage recess 16 causes the supply passage 18,
5, the chip parts R housed in the housing recess 16 are arranged so as to sequentially correspond to the positions of the supply paths 18, 5. The chip component R is
For example, it is also possible to supply to the position of the supply path 5 by a linear feeder.

The operation of the above arrangement will be described below. When the chip component R is relatively large, the traveling of the loading tape T is stopped, and when the chip component R is supplied by the supply device so as to correspond to the positions of the supply paths 18 and 5 as described above, the suction hole is formed. The chip component R is sucked into the supply path 5 via 9 and guided by the guide surface 6, and
As described above, air can be jetted downward from the air jet holes 11 to correct the posture of the chip component R to a horizontal state, and the chip component R can be reliably loaded into the loading hole t1.

If the chip component R is relatively small,
When the loading tape T stops running and the chip component R is supplied by the supply device so as to correspond to the positions of the supply paths 18 and 5 as described above, the chip component R is supplied through the suction holes 9. The chip component R is sucked into the passage 5 and guided by the guide surface 6, and air is ejected from the air ejection hole 12 as described above to correct the horizontal posture of the chip component R as necessary, and the chip component R is loaded into the loading hole. It can be reliably loaded at t1.

Further, in the case of the relatively large chip component R and the relatively small chip component R, air can be jetted from both the air jet holes 11 and 12.

Even if the chip component R cannot be loaded into the loading hole 8 at the supply path 5, the chip component R is escaped by the auxiliary guide surface 7 and the groove 8. During this time, the suction groove 10 is also formed in the auxiliary guide surface 7 portion. Since the chip component R is sucked through the chip component R, the chip component R can be loaded into the loading hole t1. In this way, the chip components R can be sequentially loaded into the loading holes t1 of the loading tape that travel intermittently.

In the unlikely event that a trouble occurs in loading the chip component R, the second loading guide 2 is placed with respect to the first loading guide 1 on the downstream side in the running direction of the loading tape T about the shaft 3. By rotating the loading tape T so that the loading hole t1 of the loading tape T is opened, the chip component R causing the loading trouble can be removed. After that, the loading operation of the chip component R can be restarted by returning the second loading guide 2 to the original position.

The first and second loading guides 1 and 2 may be integrated. Further, the auxiliary guide surface 7 and the groove 8 for escape may be omitted. In addition, the present invention is
Various design changes can be made without departing from the basic technical idea.

[0026]

As described above, according to the present invention, the sucked chip component is sucked by the suction means to the supply path provided in the direction perpendicular to the running direction of the loading tape, so that the sucked chip component is guided. And the posture of the chip component is corrected by the correction means so that the chip component can be reliably loaded into the loading hole of the loading tape. Therefore, it is possible to prevent the subsequent work from being disturbed.

Further, the loading guide has an auxiliary guide surface continuous with the guide surface on the downstream side in the traveling direction of the loading tape in the same inclined state as the guide surface of the feeding path, and the loading tape is fed from the feeding path. On the downstream side in the traveling direction, there is a groove for retreating from the edge of the loading hole on the chip component supply side, so that the suction means sucks the chip component from the guide surface along substantially the entire length of the auxiliary guide surface. With this configuration, even if the chip component cannot be loaded in the loading hole in the supply path portion, the chip component can be loaded in the loading hole during the subsequent running of the loading tape.

Further, the loading guide is divided into first and second loading guides along the running direction of the loading tape, and the second loading guide is vertically moved with respect to the first loading guide by a horizontal axis. When the loading trouble occurs, the loading hole of the loading tape can be opened by rotating the second loading guide upward so as to cause the loading trouble. The chip component can be easily removed and the loading operation can be restarted.

[Brief description of drawings]

FIG. 1 is a perspective view showing a chip component loading device according to an embodiment of the present invention.

FIG. 2 is a plan view showing the chip component loading device.

3 is a sectional view taken along the line AA of FIG. 2, showing the same chip component loading device.

FIG. 4 is a partial cross-sectional view showing a state in which a chip component is normally loaded in a loading hole of a loading tape.

FIG. 5 is a partial cross-sectional view showing a state in which a chip component is erected and loaded in a loading hole of a loading tape.

[Explanation of symbols]

 1 1st loading guide 2 2nd loading guide 5 Supply path 6 Guide surface 7 Auxiliary guide surface 8 Escape groove 9 Suction hole 10 Suction groove 11 Air ejection hole 12 Air ejection hole T Loading tape t1 Loading hole

Claims (5)

[Claims] 1. A loading tape provided on a loading tape intermittently running in a row direction of loading holes for chip parts, formed in a direction perpendicular to a running direction of the loading tape, and above a passing position of the loading hole. As it reaches the back side, a loading guide having a supply path serving as a guide surface inclined so as to gradually approach the loading tape upper surface, and a chip component is sucked into the supply path from the back side of the supply path, Suction means for loading the loading hole by the guide of the guide surface, and a straightening for loading the loading hole by correcting the posture of the chip component by jetting air when sucking the chip component by the suction means. And a chip component loading device. 2. The loading guide has an auxiliary guide surface continuous with the guide surface on the downstream side in the running direction of the loading tape in the same inclined state as the guide surface of the feeding path, and the loading tape is moved from the feeding path to the loading tape. A groove for retreating from the edge of the loading hole on the chip component supply side is provided on the downstream side in the traveling direction, and the suction means sucks the chip component from the guide surface along substantially the entire length of the auxiliary guide surface. The chip component loading device according to claim 1, which is configured. 3. The straightening means is configured to eject air so as to push a chip component supplied from a supply path horizontally from above toward a loading hole when a relatively large chip component is loaded. The chip component loading device according to claim 1 or 2. 4. The straightening means is configured to eject air from the downstream side in the running direction of the loading tape along the upper surface of the loading tape when loading a relatively small chip component. 4. The chip component loading device according to any one of 1 to 3. 5. The loading guide is divided into a first loading guide and a second loading guide along the running direction of the loading tape, and the second loading guide is vertically moved with respect to the first loading guide by a horizontal axis. 5. The chip according to claim 1, which is rotatably supported in a direction, and is configured to be capable of opening the loading hole portion of the loading tape by rotating the second loading guide upward. Parts loading device.