JP2011171419A - Component mounting apparatus and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting apparatus and a method that can simply detect a component position when using a carrier tape having a plurality of component storage pockets in one pitch of a feed hole as a target. <P>SOLUTION: In a tape feeder is mounted to a component supply part of the component mounting apparatus, a pressing member 23 for covering a carrier tape 14 from the upper-surface side has an opening 23a in a range including the position of a feed hole 15a used when intermittently feeding the carrier tape 14 in order to locate a component storage pocket 15b in a component suction position 5a, a feed hole 15a in the stop state of the intermittent feeding is imaged by a single recognition means several times in component supply operation so as to recognize the position of the feed hole 15a in each stop state, and the component suction position by a suction nozzle 9a is corrected on the basis of the recognition result and relative-position data of the feed hole 15a and the component storage pocket 15b. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting a component on a substrate.

  In the component mounting apparatus, a mounting operation of picking up a component from a tape feeder arranged in a component supply unit by a suction nozzle mounted on a mounting head, and transferring and mounting the component on a substrate is repeatedly performed. During pick-up operation, it is necessary to accurately position the suction nozzle with respect to the component held by the tape feeder. Therefore, generally, a method for obtaining an appropriate component suction position by optical position recognition is often used. In this position recognition, it is difficult to directly recognize the part itself depending on the combination of the carrier tape and the part. In such a case, a part other than the part, for example, a feed hole provided in the carrier tape or The sprocket feed teeth and the like that fit into the feed holes are used as recognition targets (see, for example, Patent Document 1).

  In the prior art disclosed in this patent document, the position of the component storage pocket is indirectly detected by imaging the sprocket feed teeth engaged with the feed holes of the carrier tape with a camera. Accordingly, it is possible to correct the misalignment caused by the unique machine difference of each tape feeder or the misalignment error at the time of mounting, and to correctly align the suction nozzle with the component.

JP 2004-1111797 A

  However, the above-described prior art has the following inconveniences due to the sprocket being the position detection target. First, in order to perform position detection with high accuracy, it is necessary to process a target to be recognized, such as a position detection recess, at the tip of the sprocket feed dog, which increases the equipment cost of the tape feeder. In addition, when detecting the position of the tip of the feed dog, it is necessary to align the sprocket so that the feed dog faces directly above. The tact time required for taking out was delayed.

  Furthermore, in the micro-embossed package whose demand has been increasing in recent years, since a plurality of component storage pockets are provided within one pitch of the feed holes, the feed holes are arranged at a plurality of positions within one pitch in the pitch feed of the carrier tape. It is necessary to stop at. For this reason, the stop position of the feed hole does not coincide with the imaging center of the camera, as in the case of a normal carrier tape in which the pitch of the feed hole matches the pitch of the component storage pocket. In some cases, it is necessary to change to a camera having a larger imaging field. As described above, the conventional prior art has a problem that it is difficult to easily detect the position of a component when a carrier tape having a plurality of component storage pockets within one pitch of a feed hole is targeted. It was.

  Therefore, the present invention provides a component mounting apparatus and a component mounting method that can easily detect a component position when targeting a carrier tape having a plurality of component storage pockets within one pitch of a feed hole. Objective.

  In the component mounting apparatus of the present invention, a component which is intermittently fed by a tape feeder arranged in parallel to a component supply unit and held on a carrier tape having N component storage pockets for one pitch of a feed hole is attached to a suction nozzle of a mounting head. A component mounting apparatus that picks up and mounts on a substrate by intermittently rotating a sprocket provided in the tape feeder and engaged with the feed hole, so that the carrier tape is 1/1 pitch of the pitch on the tape running path. A tape feeding mechanism that intermittently feeds at a pitch of N and supplies a component housed in the component storage pocket to a component suction position by the suction nozzle; and includes a vicinity of the component suction position, and the carrier tape A pressing member that covers from the side and presses against the tape running path, and the tape feeding mechanism / N pitch intermittent feeds each corresponding to the position of the feed hole in the stopped state, the opening provided in the pressing member, and the feed hole in the stopped state through the opening is a single A feed hole recognition unit that picks up an image by the imaging means and recognizes the position of each feed hole, the relative position data of the feed hole and the component storage pocket in the carrier tape stored in advance, and the feed hole by the feed hole recognition unit And a controller that corrects the component suction position by the suction nozzle based on the position recognition result.

  In the component mounting method of the present invention, a component held by a carrier tape having N component storage pockets for one pitch of a feed hole is intermittently fed by a tape feeder arranged in parallel with a component supply unit. A component mounting method for picking up and mounting on a board by intermittently rotating a sprocket provided in the tape feeder and engaged with the feed hole, thereby causing the carrier tape to be 1/1 of the pitch on the tape travel path. A tape feeding step of intermittently feeding at a pitch of N and supplying a component housed in the component storage pocket to a component suction position by the suction nozzle; and a vicinity of the component suction position. The above-mentioned 1 by the tape feeding mechanism to the pressing member that covers from the side and presses against the tape traveling path. The feed holes in the stopped state are imaged by a single recognizing means through the openings provided corresponding to the positions of the feed holes in the stopped state of the intermittent feed of N pitches. Based on the feed hole recognition process for recognizing the position of the hole, the relative position data of the feed hole and the component storage pocket in the carrier tape stored in advance and the position recognition result of the feed hole obtained in the feed hole recognition process And a component suction position correction step of correcting the component suction position by the suction nozzle.

  According to the present invention, the feed hole in the stopped state is provided in the holding member that covers the carrier tape from the upper surface side through the opening provided corresponding to the position of the feed hole in the stopped state of the intermittent feed by the tape feed mechanism. Is recognized by a single recognition means to recognize the position of each feed hole, and based on the pre-stored relative position data of the feed hole and the component storage pocket and the result of the feed hole position recognition, the component by the suction nozzle By correcting the suction position, the component position can be easily detected when a carrier tape having a plurality of component storage pockets within one pitch of the feed holes is targeted.

The top view of the component mounting apparatus of one embodiment of this invention The fragmentary sectional view of the component mounting apparatus of one embodiment of the present invention The perspective view of the carrier tape for component supply used for the component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the tape feeder used for the component mounting apparatus of one embodiment of this invention Explanatory drawing of the component position detection in the component mounting method of one embodiment of this invention Explanatory drawing of the component position detection in the component mounting method of one embodiment of this invention Explanatory drawing of the relative position data of the feed hole and component storage pocket used for component position detection in the component mounting method of one embodiment of the present invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the structure of the component mounting apparatus 1 will be described with reference to FIGS. FIG. 2 partially shows the AA cross section in FIG. In FIG. 1, two rows of substrate transport mechanisms 2 are arranged in the X direction (substrate transport direction) in the center of the base 1a. The substrate transport mechanism 2 transports the substrate 3 supplied from the upstream device and subjected to component mounting work by the device in the X direction and positions it at the component mounting work position. Component supply units 4 are arranged on both sides of the substrate transport mechanism 2, and a plurality of tape feeders 5 are arranged in parallel in each component supply unit 4. The tape feeder 5 has a function of supplying a component to a component suction position by a suction nozzle of a mounting head described below by pitch-feeding a carrier tape holding the component.

  A Y-axis movement table 7 having a linear drive mechanism is disposed at one end in the X direction on the upper surface of the base 1a. The Y-movement axis table 7 is similarly provided with a linear drive mechanism. Two X-axis moving tables 8 are coupled so as to be movable in the Y direction. A mounting head 9 is mounted on each of the two X-axis moving tables 8 so as to be movable in the X direction. The mounting head 9 is a multiple-type head having a plurality of holding heads. At the lower end of each holding head, as shown in FIG. Is installed.

  The Y-axis moving table 7 and the X-axis moving table 8 constitute a head moving mechanism 29 (see FIG. 4). By driving the head moving mechanism 29, the mounting head 9 moves in the X direction and the Y direction. As a result, the two mounting heads 9 take out the component P (see FIGS. 5 and 6) from the tape feeder 5 of the corresponding component supply unit 4 by the suction nozzle 9a, and place it on the substrate 3 positioned by the substrate transport mechanism 2. Mount on transport. The Y-axis moving table 7, the X-axis moving table 8 and the mounting head 9 constitute a component mounting mechanism for transferring and mounting the component P onto the substrate 3 by moving the mounting head 9 holding the component P by the head moving mechanism 29. To do.

  A component recognition device 6 is disposed between the component supply unit 4 and the corresponding substrate transport mechanism 2. When the mounting head 9 that has taken out a component from the component supply unit 4 moves above the component recognition device 6, the component recognition device 6 captures and recognizes the component held by the mounting head 9. Mounted on the mounting head 9 are substrate recognition cameras 10 that are positioned on the lower surface side of the X-axis moving table 8 and move together with the mounting head 9. As the mounting head 9 moves, the substrate recognition camera 10 moves above the substrate 3 positioned by the substrate transport mechanism 2 and images and recognizes the substrate 3. In the component mounting operation on the substrate 3 by the mounting head 9, the mounting position correction is performed in consideration of the component recognition result by the component recognition device 6 and the substrate recognition result by the substrate recognition camera 10.

  The configuration of the component supply unit 4 will be described. As shown in FIG. 2, a carriage 11 in which a plurality of tape feeders 5 are previously mounted on a feeder base 11 a is set in the component supply unit 4. The position of the carriage 11 is fixed in the component supply unit 4 by clamping the feeder base 11a with the clamp mechanism 12 with respect to the fixed base 1b provided on the base 1a. The carriage 11 holds a tape reel 13 that stores a carrier tape 14 holding components in a wound state. The carrier tape 14 drawn out from the tape reel 13 is pitch-fed by the tape feeder 5 to the component suction position 5a by the suction nozzle 9a.

  Here, the carrier tape 14 to be supplied in the present embodiment will be described. As shown in FIG. 3 (a), the carrier tape 14 is an embossed package, and the base tape 15 has a concave part storage pocket 15b together with a feed hole 15a for intermittently feeding the carrier tape 14 by the tape feeder 5. It protrudes on the lower surface side. A component P (see FIG. 5) is held in the component storage pocket 15 b, and the upper surface of the component storage pocket 15 b after storing the component P is covered with the cover tape 16.

  The component P supplied by the carrier tape 14 shown in the present embodiment is a micro component, and a plurality (N) of component storage pockets 15b are provided for one pitch p of the feed holes 15a. That is, the component mounting apparatus 1 shown in the present embodiment is intermittently fed by the tape feeder 5 arranged in parallel with the component supply unit 4 and is applied to the carry tape 14 having N component storage pockets 15b for one pitch of the feed holes 15a. The held component is picked up by the suction nozzle 9 a of the mounting head 9 and mounted on the substrate 3. In the present embodiment, an example in which two component storage pockets 15b are provided for one pitch of the feed holes 15a (that is, N = 2) is illustrated. It becomes a target.

  Next, the function of the tape feeder 5 will be described with reference to FIG. As shown in FIG. 4, the tape feeder 5 includes a main body portion 17 and a mounting portion 18, and the mounting portion 18 is fitted to the rear end portion of the feeder base 11 a with the main body portion 17 being along the upper surface of the feeder base 11 a. It is attached by combining. The main body portion 17 is provided with a tape traveling path 5b through which the carrier tape 14 travels. The carrier tape 14 drawn from the tape reel 13 (see FIG. 2) is introduced from the tail of the main body section 17 and is introduced into the tape traveling path. It is sent to the downstream side (the right side in FIG. 4) along the upper surface of 5b.

  A tape feed mechanism 20 including a sprocket 21 and a rotation drive mechanism 22 is provided at the upper portion of the downstream end of the main body portion 17. The sprocket 21 is provided with a feed pin 21a (see FIG. 5) that fits into a feed hole 15a (see FIG. 3) provided in the base tape 15 at a constant pitch. The sprocket 21 is driven to rotate by the rotation drive mechanism 22. As a result, the sprocket 21 is rotated, whereby the carrier tape 14 is fed in the downstream direction. The front side of the sprocket 21 is a component suction position 5a where the component P in the component storage pocket 15b is sucked and picked up by the suction nozzle 9a of the mounting head 9.

  The tape feeder 5 includes a feeder control unit 24 that controls the tape feeding operation. The feeder control unit 24 is connected to the control unit 27 of the component mounting apparatus 1 main body via a connector 25 provided at a fitting portion between the mounting unit 18 and the feeder base 11a. The storage unit 28 associated with the control unit 27 stores carrier tape information about the target carrier tape 14, that is, stored component type, feed hole 15a, pitch data of the component storage pocket 15b, and the like. The control unit 27 transmits an operation command to the feeder control unit 24 based on the carrier tape information, and further controls the rotation drive mechanism 22 by the feeder control unit 24, so that the carrier tape 14 is housed in the tape running path 5b. It is possible to intermittently feed at intervals of the pockets 15b, that is, at a pitch of 1 / N (1/2 in the embodiment) of one pitch p of the feed holes 15a.

  As a result, the component P stored in the component storage pocket 15b is intermittently supplied to the component suction position 5a by the suction nozzle 9a. That is, the tape feed mechanism 20 including the sprocket 21 and the rotation drive mechanism 22 intermittently rotates the sprocket 21 engaged with the feed hole 15a, thereby causing the carrier tape 14 to be fed at a pitch p of the feed hole 15a on the tape running path 5b. It has a function of intermittently feeding at a pitch of 1 / N and supplying the component P stored in the component storage pocket 15b to the component suction position 5a by the suction nozzle 9a.

  A pressing member 23 is provided on the upper surface of the main body 17 including the vicinity of the component suction position 5a. The pressing member 23 has a function of covering the carrier tape 14 sent along the tape traveling path 5b from the upper surface side, pressing the carrier tape 14 against the tape traveling path 5b, and guiding the tape feeding operation of the carrier tape 14 from the upper surface side. Have. By moving the mounting head 9 and positioning the board recognition camera 10 above the pressing member 23, the board recognition camera 10 can image the vicinity of the component suction position 5a.

  Image data picked up by the board recognition camera 10 is sent to the recognition processing unit 26, where the image data is subjected to recognition processing so that the position of the feed hole 15a for component position detection described below can be recognized. ing. The position recognition result is sent to the control unit 27, and the control unit 27 controls the head moving mechanism 29 based on the position recognition result, whereby the suction nozzle 9a can be aligned with the component P. As a result, even if it is difficult to directly recognize the position of the minute component P to be taken out due to factors such as the size and surface properties, the component P is attracted to the component P sent to the component suction position 5a. The nozzle 9a can be correctly aligned.

  Next, the opening 23a provided in the pressing member 23 will be described with reference to FIG. As shown in FIG. 5, in a predetermined range including the component suction position 5 a in the pressing member 23, an opening 23 a that is partially cut away and opened upward is provided. The opening 23a functions as a component extraction opening for extracting the component P from the component storage pocket 15b located at the component suction position 5a by the suction nozzle 9a, and images the feed hole 15a by the board recognition camera 10 as described above. It also functions as an imaging aperture for this purpose. A relief opening 23b is provided on the downstream side of the opening 23a to prevent interference with the tip of the feed pin 21a.

  The carrier tape 14 sent on the tape running path 5b is guided on the upper surface by the pressing member 23 and reaches the component suction position 5a. Here, only the cover tape 16 adhered and covering the component storage pocket 15b in the carrier tape 14 is sent in a direction opposite to the tape feeding direction, bypassing the edge of the opening 23a, so that the cover tape 16 becomes the base tape 15 And is stored in a collection container provided in the main body portion 17. Thus, the upper surface of the component storage pocket 15b is exposed, and the component P stored in the component storage pocket 15b is caused by performing a pickup operation for raising and lowering the suction nozzle 9a relative to the component storage pocket 15b in this state. Is taken out by vacuum suction by the suction nozzle 9a.

  Here, the opening range of the opening 23a and the position of the feed hole 15a in the opening 23a will be described. In the present embodiment, the position of the component storage pocket 15b is indirectly detected by recognizing the position of the feed hole 15a during component extraction by the suction nozzle 9a. Accordingly, in the vicinity of the component suction position 5a, the feed hole 15a in the vicinity of the component storage pocket 15b to be taken out needs to be exposed upward for position recognition.

  For this reason, as shown in the plan view of the pressing member 23 in FIG. 5, the opening range of the opening 23a is not limited to the position of the component storage pocket 15b that has reached the component suction position 5a, but the opening range for the feed hole recognition. Have been added. That is, in the intermittent feeding of the carrier tape 14, the position of the feed hole 15a and the component storage pocket 15b in the state where the component storage pocket 15b is positioned at the component suction position 5a, and the carrier tape 14 is intermittently fed by p / 2, The opening range is set so as to include the position of the feed hole 15a in a state where the component storage pocket 15b is positioned at the component suction position 5a. In other words, in the feeding operation in which the carrier tape 14 is intermittently fed by p / 2, one of the plurality of feed holes 15a provided with the component storage pocket 15b and the pitch p to be picked up is always in the opening 23a. It is located and exposed upwards. Thereby, one of the plurality of feed holes 15a can be imaged by the substrate recognition camera 10 through the opening 23a.

  In the example shown in FIG. 5, the opening shape of the opening 23 a is a continuous single opening shape including the position of the feed hole 15 a in each stop state of the carrier tape 14 in the intermittent feed described above. Openings may be individually provided only in the range of the feed hole 15a and the component storage pocket 15b that are to be exposed. In other words, in the present embodiment, the opening 23a is provided in the pressing member 23 corresponding to the position of the feed hole 15a in each stop state of intermittent feed of p / 2 pitch by the tape feed mechanism 20.

  In the above configuration, the substrate recognition camera 10 that is a single imaging unit images the feed hole 15a in a state where the carrier tape 14 is stopped by intermittent feeding through the opening 23a. And the recognition processing part 26 (refer FIG. 2) recognizes this imaging result, and the position of the feed hole 15a in each stop state by intermittent feed is recognized. In other words, the substrate recognition camera 10 and the recognition processing unit 26 recognize the position of each feed hole 15a by imaging the feed hole 15a when the carrier tape 14 is stopped through the opening 23a with a single imaging unit. The feed hole recognition unit is configured.

  Here, in order to improve the position recognition accuracy of the feed hole 15a, the contrast between the upper surface of the tape running path 5b and the upper surface of the base tape 15 in the range of the opening 23a becomes clear, and both are improved in image recognition. It is desirable to select the material used for the upper surface of the tape running path 5b so that it can be identified with accuracy. For example, when a resin having a high gloss is used as the material of the base tape 15, a material having a dark color surface treatment is selected as the upper surface of the tape running path 5b.

  FIG. 6 shows relative position data used for detecting the position of the component P to be mounted based on the position of the feed hole 15a recognized in this way. In other words, the storage unit 28 (see FIG. 2) stores in advance data indicating the relative position between the feed hole 15a to be recognized and the component storage pocket 15b positioned at the component suction position 5a. FIG. 6A shows relative position data used when the feed hole 15a that has reached the component suction position 5a is to be recognized, and the position separated by ΔX in the X direction from the recognized feed hole 15a. The center position of the component storage pocket 15b is detected. In the present embodiment, since the reference position in the Y direction of the feed hole 15a and the component storage pocket 15b in the base tape 15 is the same, the position detection of the component storage pocket 15b is detected in the Y direction. There is no need to do it. On the other hand, when the reference position in the Y direction of the feed hole 15a and the component storage pocket 15b does not match, a given Y-direction offset amount ΔY1 given by the carrier tape information is stored as relative position data. .

  FIG. 6B shows relative position data used when the feed hole 15a fed by p / 2 from the component suction position 5a is a recognition target. In this case as well, a position separated by ΔX in the X direction and by p / 2 in the Y direction from the recognized feed hole 15a is detected as the center position of the component storage pocket 15b. If the reference position in the Y direction of the feed hole 15a and the component storage pocket 15b in the base tape 15 does not match, ΔY2 is obtained by adding p / 2 to a given Y direction offset amount given by the carrier tape information. Is stored as relative position data.

  In the component mounting operation, the position of the feed hole 15a is recognized by the board recognition camera 10 every time the component P is picked up by the suction nozzle 9a, and the control unit 27 (see FIG. 2) determines the head moving mechanism based on the position recognition result. By controlling 29, the component suction position by the suction nozzle 9a is corrected. That is, the control unit 27 performs suction based on the relative position data of the feed hole 15a and the component storage pocket 15b in the carrier tape 14 stored in advance and the position recognition result of the feed hole 15a by the feed hole recognition unit. The component suction position by the nozzle 9a is corrected.

  Next, the component mounting method executed by the component mounting apparatus 1 configured as described above for the component P held by the carry tape 14 having two (N) component storage pockets 15b for one pitch of the feed holes 15a. Will be described with reference to FIG. First, the carrier tape 14 drawn out from the tape reel 13 is intermittently fed by the tape feeder 5 to supply the component P to the component suction position 5a (tape feeding step). That is, by intermittently rotating the sprocket 21 engaged with the feed hole 15a, the carrier tape 14 is intermittently fed at p / 2 on the tape running path 5b, and the component P stored in the component storage pocket 15b is moved to the suction nozzle. It supplies to the component adsorption | suction position 5a by 9a.

  Next, the position of the feed hole 15a is recognized for positioning the suction nozzle 9a (feed hole recognition step). Here, as shown in FIG. 7A, first, the recognition visual field 10a of the board recognition camera 10 is aligned with the feed hole 15a that has reached the component suction position 5a in the opening 23a, and the feed hole 15a is sent as a target. Perform hole recognition. That is, each of the p / 2 intermittent feeds by the tape feed mechanism 20 is provided to the holding member 23 that is provided including the vicinity of the component suction position 5a and covers the carrier tape 14 from the upper surface side and presses against the tape running path 5b. Through the opening 23a provided corresponding to the position of the feed hole 15a in the stopped state, the feed hole 15a in the stopped state is imaged by the single substrate recognition camera 10, and the position of the feed hole 15a is recognized. 26.

  Then, based on the position recognition result of the feed hole 15a obtained in the feed hole recognition step, the component suction position by the suction nozzle 9a is corrected (component suction position correction step). That is, it is separated from the position of the feed hole 15a by a positional deviation amount (see FIG. 6A) given by the relative position data of the feed hole 15a and the component storage pocket 15b in the carrier tape 14 stored in advance in the storage unit 28. This position is taken as the position of the component storage pocket 15b. Then, the component P is taken out by moving the suction nozzle 9a up and down with respect to the component storage pocket 15b whose position is thus obtained.

  Thereafter, intermittent feeding of the carrier tape 14 is performed, and the feed hole 15a is fed by p / 2 as shown in FIG. 7B. As a result, a new component storage pocket 15b from which the component P has not been taken out reaches the component suction position 5a. In order to detect the position of the component storage pocket 15b, a feed hole recognition process for re-imaging the feed hole 15a fed by p / 2 and recognizing the position is performed in the same manner as in the above example, and the suction nozzle 9a. The component suction position correcting step is executed. Here, the position recognition result obtained in the feed hole recognition step is separated from the positional deviation amount (see FIG. 6A) given by the relative position data between the feed hole 15a and the component storage pocket 15b. The position is the position of the component storage pocket 15b. Then, the component P is taken out by moving the suction nozzle 9a up and down with respect to the component storage pocket 15b whose position is thus obtained.

  That is, in the above-described example, in the feed hole recognition step, the feed hole 15a in each stop state of the intermittent feed operation is imaged a plurality of times for each intermittent feed operation of the carrier tape 14 by the substrate recognition camera 10 which is a single imaging means. Like to do. As a result, even when the imaging field is small and the position of the feed hole 15a protrudes from the imaging field by intermittent feeding of the carrier tape 14, it is possible to reliably image the feed hole 15a and perform position recognition. It has become.

  As described above, in the supply of components by the tape feeder in the component mounting shown in the present embodiment, the intermittent feeding by the tape feeding mechanism 20 to the holding member 23 that covers the carrier tape 14 from the upper surface side is stopped in each stopped state. The feed hole 15a in the stopped state is imaged by the substrate recognition camera 10 which is an existing single recognition means provided for substrate recognition through the opening 23a provided corresponding to the position of the hole 15a. The position of each feed hole is recognized, and the component suction position by the suction nozzle is corrected based on the previously stored relative position data between the feed hole 15a and the component storage pocket 15b and the position recognition result of the feed hole. Yes.

  Thus, even when the carrier tape 14 having a plurality of component storage pockets 15b within one pitch of the feed holes 15a is targeted for supplying a fine embossed package, the single board recognition camera 10 is provided. By using a conventional component mounting apparatus, the component position can be easily detected.

  The component mounting apparatus and the component mounting method of the present invention have an effect that the component position can be easily detected when a carrier tape having a plurality of component storage pockets within one pitch of the feed holes is targeted. It is useful in the field of mounting a component taken out from the tape feeder of the component supply unit on a substrate by a mounting head.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Substrate 4 Component supply part 5 Tape feeder 5a Component adsorption position 9 Mounting head 9a Adsorption nozzle 10 Substrate recognition camera 14 Carrier tape 15 Base tape 15a Feed hole 15b Component storage pocket 16 Cover tape 20 Tape feed mechanism 21 Sprocket 23 Holding member 23a Opening 24 Feeder control unit

Claims (4)

A component that is intermittently fed by a tape feeder arranged in parallel to the component supply unit and held on a carrier tape having N component storage pockets for one pitch of the feed holes is picked up by a suction nozzle of a mounting head and mounted on a substrate. A component mounting apparatus,
By intermittently rotating a sprocket provided on the tape feeder and engaged with the feed hole, the carrier tape is intermittently fed on the tape running path at a pitch of 1 / N of the one pitch and stored in the component storage pocket. A tape feed mechanism for supplying the parts to the part suction position by the suction nozzle;
A pressing member that includes the vicinity of the component suction position, covers the carrier tape from the upper surface side, and presses the tape against the tape running path;
An opening provided in the pressing member corresponding to the position of the feed hole in each stop state of intermittent feed of the 1 / N pitch by the tape feed mechanism;
A feed hole recognition unit that recognizes the position of each feed hole by imaging the feed hole in the stopped state through the opening by a single imaging unit;
A control unit for correcting the component suction position by the suction nozzle based on the relative position data of the feed hole and the component storage pocket in the carrier tape stored in advance and the position recognition result of the feed hole by the feed hole recognition unit; A component mounting apparatus comprising: The opening has a continuous single opening shape that includes the position of the feed hole in each of the stopped states;
2. The component mounting apparatus according to claim 1, wherein the feed hole recognizing unit images the feed hole in the respective stopped states a plurality of times for each intermittent feed operation by the single imaging unit. A component that is intermittently fed by a tape feeder arranged in parallel to the component supply unit and held on a carrier tape having N component storage pockets for one pitch of the feed holes is picked up by a suction nozzle of a mounting head and mounted on a substrate. A component mounting method,
By intermittently rotating a sprocket provided on the tape feeder and engaged with the feed hole, the carrier tape is intermittently fed on the tape running path at a pitch of 1 / N of the one pitch and stored in the component storage pocket. A tape feeding process for supplying the parts to the part suction position by the suction nozzle;
Each stop of the intermittent feed of the 1 / N pitch by the tape feed mechanism to a pressing member which covers the carrier tape from the upper surface side and covers the carrier tape from the upper surface side. A feed hole recognition step for recognizing the position of each feed hole by imaging the feed hole in the stopped state by a single recognition means through an opening provided corresponding to the position of the feed hole in the state When,
A component that corrects the component suction position by the suction nozzle based on the relative position data of the feed hole and the component storage pocket in the carrier tape stored in advance and the position recognition result of the feed hole obtained in the feed hole recognition step A component mounting method comprising: a suction position correction step. The opening has a continuous single opening shape that includes the position of the feed hole in each of the stopped states;
2. The component mounting method according to claim 1, wherein, in the feed hole recognition step, the feed hole in each stopped state is imaged a plurality of times for each intermittent feed operation by the single imaging means.

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