JP6373068B2 - Transport method - Google Patents
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- JP6373068B2 JP6373068B2 JP2014112991A JP2014112991A JP6373068B2 JP 6373068 B2 JP6373068 B2 JP 6373068B2 JP 2014112991 A JP2014112991 A JP 2014112991A JP 2014112991 A JP2014112991 A JP 2014112991A JP 6373068 B2 JP6373068 B2 JP 6373068B2
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- 238000000034 method Methods 0.000 title claims description 40
- 230000002093 peripheral effect Effects 0.000 claims description 22
- 238000001179 sorption measurement Methods 0.000 claims description 17
- 230000007246 mechanism Effects 0.000 description 32
- 239000004065 semiconductor Substances 0.000 description 21
- 230000007723 transport mechanism Effects 0.000 description 10
- 230000032258 transport Effects 0.000 description 8
- 238000003825 pressing Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本発明は、半導体ウェーハ等の板状物をチャックテーブルへと搬送する搬送方法に関する。 The present invention relates to a transport method for transporting a plate-like object such as a semiconductor wafer to a chuck table.
携帯電話に代表される小型軽量な電子機器では、IC、LSI等の電子回路を備えた半導体チップが必須の構成となっている。半導体チップは、例えば、シリコン等の材料でなる半導体ウェーハの表面をストリートと呼ばれる複数の分割予定ラインで区画し、各領域に電子回路を形成した後、ストリートに沿って半導体ウェーハを切断することで製造される。 In a small and light electronic device typified by a mobile phone, a semiconductor chip including an electronic circuit such as an IC or an LSI has an essential configuration. For example, a semiconductor chip is formed by dividing the surface of a semiconductor wafer made of a material such as silicon by a plurality of division lines called streets, forming an electronic circuit in each region, and then cutting the semiconductor wafer along the streets. Manufactured.
近年では、半導体チップの小型化、軽量化等を目的として、研削等の方法で半導体ウェーハを薄く加工する機会が増えている。しかしながら、半導体ウェーハを薄く加工すると、内部の応力が顕在化して半導体ウェーハは反り易くなる。この傾向は、大口径化された半導体ウェーハで特に顕著である。 In recent years, for the purpose of reducing the size and weight of semiconductor chips, there are increasing opportunities to process a semiconductor wafer thinly by a method such as grinding. However, when a semiconductor wafer is thinly processed, internal stress becomes obvious and the semiconductor wafer is likely to warp. This tendency is particularly remarkable in a semiconductor wafer having a large diameter.
半導体ウェーハの反りが大きくなると、加工装置内のチャックテーブルで半導体ウェーハを適切に吸着できなくなり、後の工程に差し障る。例えば、外周部が上方に反った半導体ウェーハでは、チャックテーブルと外周部とに隙間ができて、十分な吸着力を半導体ウェーハに作用させることができない。 When the warpage of the semiconductor wafer becomes large, the semiconductor wafer cannot be properly adsorbed by the chuck table in the processing apparatus, which hinders subsequent processes. For example, in a semiconductor wafer having an outer peripheral portion warped upward, a gap is formed between the chuck table and the outer peripheral portion, and a sufficient adsorption force cannot be applied to the semiconductor wafer.
そこで、半導体ウェーハの中央部を吸着する吸着パッドと、半導体ウェーハの外周部をチャックテーブルに押し付ける押圧ピン(押圧板)と、を備えた搬送機構が提案されている(例えば、特許文献1、特許文献2参照)。この搬送機構を用いれば、半導体ウェーハの外周部をチャックテーブルに密着させて、十分な吸着力を作用させることができる。 Therefore, a transport mechanism including a suction pad that sucks the central portion of the semiconductor wafer and a pressing pin (pressing plate) that presses the outer peripheral portion of the semiconductor wafer against the chuck table has been proposed (for example, Patent Document 1, Patent). Reference 2). If this transport mechanism is used, the outer peripheral portion of the semiconductor wafer can be brought into close contact with the chuck table and a sufficient suction force can be applied.
ところで、上述した搬送機構では、吸着パッドとともに押圧ピンを下降させることで、半導体ウェーハの外周部に下向きの力を作用させている。しかしながら、この構成では、外周部をチャックテーブルに密着させるために、押圧ピンを強力なモータ等で下降させなくてはならないので、搬送機構を含む加工装置の価格が高くなってしまう。 By the way, in the transport mechanism described above, a downward force is applied to the outer peripheral portion of the semiconductor wafer by lowering the pressing pin together with the suction pad. However, in this configuration, since the pressing pin must be lowered by a powerful motor or the like in order to bring the outer peripheral portion into close contact with the chuck table, the price of the processing apparatus including the transport mechanism increases.
また、押圧ピンで半導体ウェーハの外周部に下向きの力を作用させると、半導体ウェーハの外周部から押圧ピンに加わる反作用の力で、搬送機構の各部が歪んでしまう。歪みによる故障等の不具合を防ぐには、歪みの発生し易い部分を補強すれば良いが、この場合にも加工装置の価格は高くなる。 Further, when a downward force is applied to the outer peripheral portion of the semiconductor wafer with the pressing pin, each part of the transport mechanism is distorted by a reaction force applied to the pressing pin from the outer peripheral portion of the semiconductor wafer. In order to prevent problems such as a failure due to distortion, it is sufficient to reinforce a portion where distortion is likely to occur, but in this case as well, the price of the processing apparatus increases.
本発明はかかる問題点に鑑みてなされたものであり、その目的とするところは、加工装置を高価格化することなく、被加工物をチャックテーブルで適切に吸引できる搬送方法を提供することである。 The present invention has been made in view of such problems, and an object of the present invention is to provide a transport method that can appropriately suck a workpiece with a chuck table without increasing the cost of a processing apparatus. is there.
本発明によれば、板状の被加工物を仮置きする仮置きテーブルと、被加工物を吸引して保持する保持面を有するチャックテーブルと、該チャックテーブルに保持された被加工物に所定の加工を施す加工手段と、該仮置きテーブルから該チャックテーブルまで被加工物を搬送する搬送手段とを少なくとも備え、該搬送手段は、被加工物よりも大きい直径を有するとともに平坦な吸着面を有する吸着パッドを備えている加工装置において、外周部が中心付近に比べて上方に反った状態の被加工物を該仮置きテーブルから該チャックテーブルに搬送し、該チャックテーブルに保持させる搬送方法であって、外周部が中心付近に比べて上方に反った状態の被加工物を該仮置きテーブルに載置する載置工程と、該搬送手段の該吸着パッドを被加工物に向けて下降させて、被加工物における外周部の全周を該吸着パッドに密着させるが被加工物の中心付近を該吸着パッドに密着させない吸着パッド下降工程と、該吸着パッド下降工程を実施した後に、該吸着パッドで被加工物を吸引して大気圧による力で被加工物を該吸着パッドの吸着面に押し付け、該吸着面に沿って被加工物を平坦に矯正する吸着工程と、該吸着パッドに吸引された状態の被加工物を該搬送手段で搬送して該チャックテーブルに載置し、被加工物が該チャックテーブルの保持面に密着した状態で、該チャックテーブルで被加工物を吸引するとともに該搬送手段の吸着パッドによる被加工物の吸引を停止する被加工物移し換え工程と、を備えたことを特徴とする搬送方法が提供される。 According to the present invention, a temporary placement table for temporarily placing a plate-like workpiece, a chuck table having a holding surface for sucking and holding the workpiece, and a workpiece held on the chuck table are predetermined. And at least a conveying means for conveying the workpiece from the temporary placement table to the chuck table, the conveying means having a diameter larger than the workpiece and a flat suction surface. In a processing apparatus provided with a suction pad having a transporting method in which a workpiece whose outer peripheral portion is warped upward compared to the vicinity of the center is transported from the temporary placement table to the chuck table and is held on the chuck table. And placing the work piece whose outer peripheral part is warped upward relative to the vicinity of the center on the temporary placement table, and applying the suction pad of the conveying means to the work piece. Is lowered Te, and suction pads lowering step is to the entire outer peripheral portion is adhered to the adsorption pad is not near the center of the workpiece is brought into close contact with the adsorption pad in the workpiece, after performing the adsorption pad lowering step , by aspiration workpiece in the adsorption pad pressed against a workpiece by the force due to atmospheric pressure to the suction surface of the suction pad, the adsorption step of flat straightening a workpiece along the adsorption surface, adsorption The workpiece sucked by the pad is conveyed by the conveying means and placed on the chuck table, and the workpiece is adhered to the holding surface of the chuck table while the workpiece is adhered to the chuck table. And a workpiece transfer step of sucking and stopping suction of the workpiece by the suction pad of the conveying means.
本発明の搬送方法は、被加工物よりも大径の吸着パッドを下降させて、上方に反った状態の被加工物の外周部を吸着パッドに密着させる吸着パッド下降工程と、この吸着パッドで被加工物を吸引し、吸着パッドの吸着面に沿って被加工物を平坦に矯正する吸着工程と、を備えるので、上方に反った状態の被加工物を吸着パッドで吸引するだけで、被加工物を平坦に矯正できる。 The conveyance method of the present invention includes a suction pad lowering step in which a suction pad having a diameter larger than that of the workpiece is lowered and the outer periphery of the workpiece warped upward is brought into close contact with the suction pad, A suction step for sucking the workpiece and correcting the workpiece flat along the suction surface of the suction pad, so that the workpiece that is warped upward is simply sucked by the suction pad. Work piece can be straightened.
そのため、後の被加工物移し換え工程において、吸着パッドで吸引された状態の被加工物をチャックテーブルに載置し、チャックテーブルで被加工物を吸引するとともに吸着パッドによる吸引を停止することで、被加工物をチャックテーブルで適切に吸引できる。このように、本発明の搬送方法によれば、上方に反った状態の被加工物を吸着パッドで吸引して平坦に矯正するので、加工装置を高価格化することなく、被加工物をチャックテーブルで適切に吸引できる。 Therefore, in the subsequent workpiece transfer step, the workpiece sucked by the suction pad is placed on the chuck table, the workpiece is sucked by the chuck table and suction by the suction pad is stopped. The workpiece can be properly sucked by the chuck table. As described above, according to the conveying method of the present invention, since the workpiece warped upward is sucked with the suction pad and corrected to be flat, the workpiece can be chucked without increasing the cost of the processing apparatus. It can be sucked properly at the table.
添付図面を参照して、本発明の実施形態について説明する。本実施形態に係る搬送方法は、載置工程(図3(A)参照)、吸着パッド下降工程(図3(A)、及び図3(B)参照)、吸着工程(図3(C)参照)、及び被加工物移し換え工程(図4(A)、図4(B)、及び図4(C)参照)を含む。 Embodiments of the present invention will be described with reference to the accompanying drawings. The transport method according to the present embodiment includes a placement process (see FIG. 3A), a suction pad lowering process (see FIGS. 3A and 3B), and a suction process (see FIG. 3C). ) And a workpiece transfer step (see FIGS. 4A, 4B, and 4C).
載置工程では、上方に反った状態の被加工物を加工装置の仮置きテーブルに載置する。吸着パッド下降工程では、被加工物よりも大径の吸着パッドを下降させて、少なくとも被加工物の外周部を吸着パッドに密着させる。 In the placing step, the workpiece warped upward is placed on a temporary placement table of the processing apparatus. In the suction pad lowering step, the suction pad having a diameter larger than that of the workpiece is lowered, and at least the outer peripheral portion of the workpiece is brought into close contact with the suction pad.
吸着工程では、吸着パッドで被加工物を吸引することで、被加工物を吸着パッドの吸着面に沿って平坦に矯正する。被加工物移し換え工程では、吸着パッドに吸引された状態の被加工物をチャックテーブルに載置し、チャックテーブルで被加工物を吸引するとともに吸着パッドによる吸引を停止する。以下、本実施形態に係る搬送方法について詳述する。 In the suction process, the workpiece is sucked with the suction pad, so that the workpiece is straightened along the suction surface of the suction pad. In the workpiece transfer step, the workpiece sucked by the suction pad is placed on the chuck table, the workpiece is sucked by the chuck table, and suction by the suction pad is stopped. Hereinafter, the conveyance method according to the present embodiment will be described in detail.
まず、本実施形態に係る搬送方法を用いる加工装置の構成例について説明する。図1は、本実施形態に係る搬送方法を用いる研削装置の構成例を模式的に示す斜視図である。なお、本実施形態に係る搬送方法は、切削装置等の他の加工装置で用いられても良い。 First, a configuration example of a processing apparatus that uses the transport method according to the present embodiment will be described. FIG. 1 is a perspective view schematically showing a configuration example of a grinding apparatus using the conveying method according to the present embodiment. Note that the conveyance method according to the present embodiment may be used in other processing apparatuses such as a cutting apparatus.
図1に示すように、研削装置(加工装置)2は、各構成を支持する基台4を備えている。基台4の上面前端側には、開口4aが形成されており、この開口4a内には、円盤状の被加工物11(図2参照)を搬送する搬送機構6が設けられている。また、開口4aのさらに前方の領域には、被加工物11を収容可能なカセット8a,8bが載置されている。 As shown in FIG. 1, the grinding device (processing device) 2 includes a base 4 that supports each component. An opening 4 a is formed on the front end side of the upper surface of the base 4, and a transport mechanism 6 for transporting the disk-shaped workpiece 11 (see FIG. 2) is provided in the opening 4 a. Further, cassettes 8a and 8b capable of accommodating the workpiece 11 are placed in a region further forward of the opening 4a.
図2(A)は、本実施形態に係る搬送方法で搬送される被加工物11の例を模式的に示す斜視図であり、図2(B)は、被加工物11の例を模式的に示す断面図である。図2(A)に示すように、被加工物11は、例えば、シリコン等の半導体材料で形成された略円形の板状物であり、外周縁には、結晶方位を示すノッチ11aが形成されている。図2(B)に示すように、この被加工物11は、下に凸の状態で反っており、中央部(中心付近)11bに比べて外周部11cが高くなっている。 FIG. 2A is a perspective view schematically showing an example of the workpiece 11 conveyed by the conveying method according to the present embodiment, and FIG. 2B is a schematic example of the workpiece 11. FIG. As shown in FIG. 2A, the workpiece 11 is a substantially circular plate-like object made of a semiconductor material such as silicon, and a notch 11a indicating a crystal orientation is formed on the outer peripheral edge. ing. As shown in FIG. 2B, the workpiece 11 is warped in a downwardly convex state, and the outer peripheral portion 11c is higher than the central portion (near the center) 11b.
カセット8aが載置される載置領域及び開口4aの後方には、被加工物11の位置合わせを行うアライメント機構10が設けられている。このアライメント機構10は、被加工物11が仮置きされる仮置きテーブル12を含み、例えば、カセット8aから搬送機構6で搬送され、仮置きテーブル12に仮置きされた被加工物11の中心を位置合わせする。 An alignment mechanism 10 for aligning the workpiece 11 is provided behind the placement area on which the cassette 8a is placed and the opening 4a. The alignment mechanism 10 includes a temporary placement table 12 on which the workpiece 11 is temporarily placed. For example, the alignment mechanism 10 is transported by the transport mechanism 6 from the cassette 8a and is centered on the workpiece 11 temporarily placed on the temporary placement table 12. Align.
アライメント機構10と隣接する位置には、被加工物11を吸引保持して旋回する搬入機構(搬送手段)14が配置されている。この搬入機構14は、被加工物11の上面側全体を吸引する吸着パッド14b(図3(A)等参照)を備え、アライメント機構10で位置合わせされた被加工物11を後方に搬送する。 At a position adjacent to the alignment mechanism 10, a carry-in mechanism (conveying means) 14 that rotates while sucking and holding the workpiece 11 is disposed. The carry-in mechanism 14 includes a suction pad 14b (see FIG. 3A) that sucks the entire upper surface side of the workpiece 11, and transports the workpiece 11 aligned by the alignment mechanism 10 backward.
搬入機構14の後方には、鉛直方向に延びる回転軸の周りに回転可能なターンテーブル16が配置されている。ターンテーブル16の上面には、被加工物11を吸引保持する3個のチャックテーブル18が設けられている。なお、ターンテーブル16上に配置されるチャックテーブル18の数は、必ずしも3個に限定されない。 A turntable 16 that is rotatable around a rotation axis extending in the vertical direction is disposed behind the carry-in mechanism 14. Three chuck tables 18 for sucking and holding the workpiece 11 are provided on the upper surface of the turntable 16. Note that the number of chuck tables 18 arranged on the turntable 16 is not necessarily limited to three.
搬入機構14の吸着パッド14bで吸引保持された被加工物11は、各チャックテーブル18に搬入される。各チャックテーブル18は、モータ等の回転機構(不図示)と連結されており、鉛直方向に延びる回転軸の周りに回転する。 The workpiece 11 sucked and held by the suction pad 14 b of the carry-in mechanism 14 is carried into each chuck table 18. Each chuck table 18 is connected to a rotation mechanism (not shown) such as a motor, and rotates around a rotation axis extending in the vertical direction.
各チャックテーブル18の上面は、被加工物11を吸引保持する保持面18c(図4(B)等参照)となっている。この保持面18cは、チャックテーブル18の内部に形成された流路18d(図4(B)等参照)を通じて吸引源(不図示)と接続されている。チャックテーブル18に搬入された被加工物11は、保持面18cに作用する吸引源の負圧で下面側を吸引される。 The upper surface of each chuck table 18 is a holding surface 18c (see FIG. 4B, etc.) that holds the workpiece 11 by suction. The holding surface 18c is connected to a suction source (not shown) through a flow path 18d (see FIG. 4B and the like) formed inside the chuck table 18. The workpiece 11 carried into the chuck table 18 is sucked on the lower surface side by the negative pressure of the suction source acting on the holding surface 18c.
ターンテーブル16の後方には、上方に伸びる2本の支持構造20が設けられている。各支持構造20の前面には、Z軸移動機構22を介してZ軸移動テーブル24が設けられている。各Z軸移動機構22は、Z軸方向に平行な一対のZ軸ガイドレール26を備えており、Z軸ガイドレール26には、Z軸移動テーブル24がスライド可能に設置されている。 Two support structures 20 extending upward are provided behind the turntable 16. A Z-axis movement table 24 is provided on the front surface of each support structure 20 via a Z-axis movement mechanism 22. Each Z-axis moving mechanism 22 includes a pair of Z-axis guide rails 26 parallel to the Z-axis direction, and a Z-axis moving table 24 is slidably installed on the Z-axis guide rails 26.
各Z軸移動テーブル24の後面側(裏面側)には、ナット部(不図示)が固定されており、このナット部には、Z軸ガイドレール26と平行なZ軸ボールネジ28が螺合されている。各Z軸ボールネジ28の一端部には、Z軸パルスモータ30が連結されている。Z軸パルスモータ30でZ軸ボールネジ28を回転させれば、Z軸移動テーブル24はZ軸ガイドレール26に沿ってZ軸方向に移動する。 A nut portion (not shown) is fixed to the rear surface side (back surface side) of each Z-axis moving table 24, and a Z-axis ball screw 28 parallel to the Z-axis guide rail 26 is screwed to the nut portion. ing. A Z-axis pulse motor 30 is connected to one end of each Z-axis ball screw 28. When the Z-axis ball screw 28 is rotated by the Z-axis pulse motor 30, the Z-axis moving table 24 moves in the Z-axis direction along the Z-axis guide rail 26.
各Z軸移動テーブル24の前面(表面)には、研削機構(加工手段)32が設けられている。各研削機構32は、Z軸移動テーブル24に固定されたスピンドルハウジング34を備えている。各スピンドルハウジング34には、スピンドル(不図示)が回転可能に支持されている。 A grinding mechanism (processing means) 32 is provided on the front surface (surface) of each Z-axis moving table 24. Each grinding mechanism 32 includes a spindle housing 34 fixed to the Z-axis moving table 24. A spindle (not shown) is rotatably supported on each spindle housing 34.
各スピンドルの下端部には、研削ホイール36が装着されている。各研削ホイール36は、アルミニウム、ステンレス等の金属材料で形成された円筒状のホイール基台と、ホイール基台の下面において環状に配置された複数の砥石とを含む。 A grinding wheel 36 is attached to the lower end of each spindle. Each grinding wheel 36 includes a cylindrical wheel base formed of a metal material such as aluminum or stainless steel, and a plurality of grindstones arranged in an annular shape on the lower surface of the wheel base.
被加工物11がチャックテーブル18に吸引保持されると、ターンテーブル16は回転して被加工物11を研削機構32の下方に位置付ける。その後、チャックテーブル18及び研削ホイール36を回転させた状態で研削機構32を下降させ、研削ホイール36を被加工物11の上面に接触させることで、被加工物11を研削できる。 When the workpiece 11 is sucked and held by the chuck table 18, the turntable 16 rotates to position the workpiece 11 below the grinding mechanism 32. Thereafter, the workpiece 11 can be ground by lowering the grinding mechanism 32 while rotating the chuck table 18 and the grinding wheel 36 and bringing the grinding wheel 36 into contact with the upper surface of the workpiece 11.
搬入機構14と隣接する位置には、研削後の被加工物11を吸引保持して旋回する搬出機構38が設けられている。搬出機構38の前方、且つ開口4aの後方には、搬出機構38で搬出された研削後の被加工物11を洗浄する洗浄機構40が配置されている。洗浄機構40で洗浄された被加工物11は、搬送機構6で搬送され、カセット8bに収容される。 At a position adjacent to the carry-in mechanism 14, a carry-out mechanism 38 that rotates while sucking and holding the workpiece 11 after grinding is provided. In front of the unloading mechanism 38 and behind the opening 4a, a cleaning mechanism 40 for cleaning the workpiece 11 after being unloaded by the unloading mechanism 38 is disposed. The workpiece 11 cleaned by the cleaning mechanism 40 is transported by the transport mechanism 6 and stored in the cassette 8b.
次に、上述した研削装置2で実施される本実施形態の搬送方法を説明する。本実施形態の搬送方法では、まず、上方に反った状態の被加工物11を研削装置2の仮置きテーブル12に載置する載置工程を実施する。図3(A)は、載置工程、及び吸着パッド下降工程を模式的に示す断面図である。 Next, the conveyance method of this embodiment implemented with the grinding apparatus 2 mentioned above is demonstrated. In the transport method according to the present embodiment, first, a placing step of placing the workpiece 11 warped upward on the temporary placement table 12 of the grinding apparatus 2 is performed. FIG. 3A is a cross-sectional view schematically showing a placement process and a suction pad lowering process.
図3(A)に示すように、仮置きテーブル12は、支持台12aに固定されたテーブル本体12bを含む。テーブル本体12bは、被加工物11より小径の円盤状に形成されており、上面に凹部を有している。テーブル本体12bの凹部には、多孔質材料でなる円盤状の吸着部材12cが嵌合されている。 As shown in FIG. 3A, the temporary placement table 12 includes a table body 12b fixed to the support base 12a. The table main body 12b is formed in a disk shape having a smaller diameter than the workpiece 11, and has a recess on the upper surface. A disc-shaped adsorption member 12c made of a porous material is fitted into the recess of the table body 12b.
吸着部材12cの上面は、被加工物11を吸引保持する保持面となっている。この保持面は、支持台12a及びテーブル本体12bの内部に形成された流路12dを通じて吸引源(不図示)と接続されている。 The upper surface of the adsorption member 12c is a holding surface that holds the workpiece 11 by suction. The holding surface is connected to a suction source (not shown) through a flow path 12d formed inside the support base 12a and the table body 12b.
載置工程では、カセット8a内の被加工物11を搬送機構6で搬送して仮置きテーブル12に載置した後、保持面に吸引源の負圧を作用させる。具体的には、被加工物11を上方に反った状態で仮置きテーブル12に載置する。 In the placing step, the workpiece 11 in the cassette 8a is transported by the transport mechanism 6 and placed on the temporary placement table 12, and then the negative pressure of the suction source is applied to the holding surface. Specifically, the workpiece 11 is placed on the temporary placement table 12 with the workpiece 11 warped upward.
その結果、被加工物11は、保持面に作用する負圧で下面側を吸引保持される。なお、仮置きテーブル12は、被加工物11より小径に形成されており、中央部11bの下面側のみを吸引するので、上方に反った状態の被加工物11でも適切に吸引保持できる。 As a result, the workpiece 11 is sucked and held on the lower surface side by a negative pressure acting on the holding surface. The temporary placement table 12 is formed with a smaller diameter than the workpiece 11 and sucks only the lower surface side of the central portion 11b, so that even the workpiece 11 warped upward can be appropriately sucked and held.
載置工程を実施した後には、搬入機構14の吸着パッド14bを下降させて、被加工物11の外周部11cを吸着パッド14bに密着させる吸着パッド下降工程を実施する。図3(B)は、吸着パッド下降工程を模式的に示す断面図である。 After performing the placing process, the suction pad lowering process is performed in which the suction pad 14b of the loading mechanism 14 is lowered to bring the outer peripheral portion 11c of the workpiece 11 into close contact with the suction pad 14b. FIG. 3B is a cross-sectional view schematically showing the suction pad lowering step.
図3(A)及び図3(B)に示すように、搬入機構14は、支持アーム14aに連結された吸着パッド14bを含む。吸着パッド14bは、被加工物11より大径の円盤状に形成されており、下面に凹部を有している。吸着パッド14bの凹部には、多孔質材料でなる円盤状の吸着部材14cが嵌合されている。 As shown in FIGS. 3A and 3B, the carry-in mechanism 14 includes a suction pad 14b connected to the support arm 14a. The suction pad 14b is formed in a disk shape having a larger diameter than the workpiece 11, and has a recess on the lower surface. A disc-shaped suction member 14c made of a porous material is fitted in the recess of the suction pad 14b.
吸着部材14cの下面は、被加工物11を吸引保持する吸着面となっている。この吸着面は、支持アーム14a及び吸着パッド14bの内部に形成された流路14dを通じて吸引源(不図示)と接続されている。 The lower surface of the suction member 14c is a suction surface that holds the workpiece 11 by suction. The suction surface is connected to a suction source (not shown) through a flow path 14d formed inside the support arm 14a and the suction pad 14b.
吸着パッド下降工程では、搬入機構14の支持アーム14aを旋回させて、図3(A)に示すように、仮置きテーブル12の上方に吸着パッド14bを位置付ける。次に、吸着パッド14bを被加工物11に向けて下降させて、図3(B)に示すように、外周部11cを全周にわたって吸着パッド14bに密着させる。 In the suction pad lowering step, the support arm 14a of the carry-in mechanism 14 is turned to position the suction pad 14b above the temporary table 12 as shown in FIG. Next, the suction pad 14b is lowered toward the workpiece 11, and the outer peripheral portion 11c is brought into close contact with the suction pad 14b over the entire circumference as shown in FIG.
吸着パッド下降工程を実施した後には、吸着パッド14bで被加工物11を吸引して、被加工物11を吸着部材14c(吸着パッド14b)の吸着面に沿って平坦に矯正する吸着工程を実施する。図3(C)は、吸着工程を模式的に示す断面図である。 After performing the suction pad lowering step, the suction step is performed in which the workpiece 11 is sucked by the suction pad 14b and the workpiece 11 is flattened along the suction surface of the suction member 14c (suction pad 14b). To do. FIG. 3C is a cross-sectional view schematically showing the adsorption process.
吸着工程では、被加工物11の外周部11cを吸着パッド14bに密着させた状態で、吸着部材14c(吸着パッド14b)の吸着面に吸引源の負圧を作用させる。その結果、被加工物11は、大気圧による上向きの力で吸着部材14c(吸着パッド14b)の吸着面に押し付けられる。 In the suction step, the negative pressure of the suction source is applied to the suction surface of the suction member 14c (suction pad 14b) while the outer peripheral portion 11c of the workpiece 11 is in close contact with the suction pad 14b. As a result, the workpiece 11 is pressed against the suction surface of the suction member 14c (suction pad 14b) with an upward force due to atmospheric pressure.
これにより、被加工物11を吸着部材14c(吸着パッド14b)の吸着面に沿って平坦に矯正できる。なお、この吸着工程では、被加工物11の吸引に合わせて搬入機構14の吸着パッド14bを僅かに下降させると良い。これにより、被加工物11の上面を吸着部材14c(吸着パッド14b)の吸着面全体に密着できる。同様の理由で、仮置きテーブル12による被加工物11の吸引を停止させても良い。 Thereby, the workpiece 11 can be corrected flatly along the suction surface of the suction member 14c (suction pad 14b). In this suction step, the suction pad 14b of the carry-in mechanism 14 may be slightly lowered in accordance with the suction of the workpiece 11. Thereby, the upper surface of the workpiece 11 can be adhered to the entire suction surface of the suction member 14c (suction pad 14b). For the same reason, the suction of the workpiece 11 by the temporary placement table 12 may be stopped.
吸着工程を実施した後には、吸着パッド14bに吸引された状態の被加工物11をチャックテーブル18に載置し、チャックテーブル18で被加工物11を吸引するとともに吸着パッド14bによる吸引を停止する被加工物移し換え工程を実施する。図4(A)、図4(B)、及び図4(C)は、被加工物移し換え工程を模式的に示す断面図である。 After performing the suction process, the workpiece 11 sucked by the suction pad 14b is placed on the chuck table 18, and the workpiece 11 is sucked by the chuck table 18 and suction by the suction pad 14b is stopped. Perform the workpiece transfer process. FIG. 4A, FIG. 4B, and FIG. 4C are cross-sectional views schematically showing a workpiece transfer process.
図4(B)及び図4(C)に示すように、チャックテーブル18は、支持台18aに連結されたテーブル本体18bを含む。テーブル本体18bの上面は、被加工物11を吸引保持する保持面18cとなっている。保持面18cは、支持台18a及びテーブル本体18bの内部に形成された流路18dを通じて吸引源(不図示)と接続されている。 As shown in FIGS. 4B and 4C, the chuck table 18 includes a table body 18b connected to the support base 18a. The upper surface of the table body 18b is a holding surface 18c that holds the workpiece 11 by suction. The holding surface 18c is connected to a suction source (not shown) through a flow path 18d formed inside the support base 18a and the table body 18b.
図4(A)及び図4(B)に示すように、被加工物移し換え工程では、まず、仮置きテーブル12による被加工物11の吸引を停止させる。そして、吸着パッド14bで吸引保持した被加工物11を搬送し、チャックテーブル18の保持面18cに載置する。 As shown in FIGS. 4A and 4B, in the workpiece transfer step, first, the suction of the workpiece 11 by the temporary placement table 12 is stopped. Then, the workpiece 11 sucked and held by the suction pad 14 b is transported and placed on the holding surface 18 c of the chuck table 18.
その後、図4(B)に示すように、被加工物11の下面がチャックテーブル18の保持面18cに密着した状態で、この保持面18cに吸引源の負圧を作用させる。吸着パッド14bによって被加工物11は平坦に矯正されているので、被加工物11の下面全体をチャックテーブル18で適切に吸引保持できる。 Thereafter, as shown in FIG. 4B, with the lower surface of the workpiece 11 in close contact with the holding surface 18c of the chuck table 18, a negative pressure of a suction source is applied to the holding surface 18c. Since the workpiece 11 is corrected to be flat by the suction pad 14b, the entire lower surface of the workpiece 11 can be appropriately sucked and held by the chuck table 18.
さらに、吸着パッド14bによる被加工物11の吸引を停止して、図4(C)に示すように、チャックテーブル18で吸引保持された被加工物11の上面から吸着パッド14bを分離させる。 Further, the suction of the workpiece 11 by the suction pad 14b is stopped, and the suction pad 14b is separated from the upper surface of the workpiece 11 sucked and held by the chuck table 18, as shown in FIG.
以上のように、本実施形態の搬送方法は、被加工物11よりも大径の吸着パッド14bを下降させて、上方に反った状態の被加工物11の外周部11cを吸着パッド14bに密着させる吸着パッド下降工程と、この吸着パッド14bで被加工物11を吸引し、吸着パッド14b(吸着部材14c)の吸着面に沿って被加工物11を平坦に矯正する吸着工程と、を備えるので、上方に反った状態の被加工物11を吸着パッド14bで吸引するだけで、被加工物11を平坦に矯正できる。 As described above, in the conveyance method of the present embodiment, the suction pad 14b having a diameter larger than that of the workpiece 11 is lowered, and the outer peripheral portion 11c of the workpiece 11 that is warped upward is brought into close contact with the suction pad 14b. A suction pad lowering step, and a suction step of sucking the workpiece 11 with the suction pad 14b and correcting the workpiece 11 flat along the suction surface of the suction pad 14b (suction member 14c). The workpiece 11 can be flattened simply by sucking the workpiece 11 warped upward with the suction pad 14b.
そのため、後の被加工物移し換え工程において、吸着パッド14bで吸引された状態の被加工物11をチャックテーブル18に載置し、チャックテーブル18で被加工物11を吸引するとともに吸着パッド14bによる吸引を停止することで、被加工物11をチャックテーブル18で適切に吸引できる。このように、本実施形態の搬送方法によれば、上方に反った状態の被加工物11を吸着パッド14bで吸引して平坦に矯正するので、研削装置(加工装置)2を高価格化することなく、被加工物11をチャックテーブル18で適切に吸引できる。 Therefore, in the subsequent workpiece transfer step, the workpiece 11 sucked by the suction pad 14b is placed on the chuck table 18, the workpiece 11 is sucked by the chuck table 18, and the suction pad 14b is used. By stopping the suction, the workpiece 11 can be appropriately sucked by the chuck table 18. As described above, according to the transport method of the present embodiment, the workpiece 11 that is warped upward is sucked by the suction pad 14b to be flattened, so that the price of the grinding device (processing device) 2 is increased. The workpiece 11 can be appropriately sucked by the chuck table 18 without any problem.
なお、上記実施形態に係る構成、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。 Note that the configurations, methods, and the like according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention.
11 被加工物
11a ノッチ
11b 中央部(中心付近)
11c 外周部
2 研削装置(加工装置)
4 基台
4a 開口
6 搬送機構
8a,8b カセット
10 アライメント機構
12 仮置きテーブル
12a 支持台
12b テーブル本体
12c 吸着部材
12d 流路
14 搬入機構(搬送手段)
14a 支持アーム
14b 吸着パッド
14c 吸着部材
14d 流路
16 ターンテーブル
18 チャックテーブル
18a 支持台
18b テーブル本体
18c 保持面
18d 流路
20 支持構造
22 Z軸移動機構
24 Z軸移動テーブル
26 Z軸ガイドレール
28 Z軸ボールネジ
30 Z軸パルスモータ
32 研削機構(加工手段)
34 スピンドルハウジング
36 研削ホイール
38 搬出機構
40 洗浄機構
11 Workpiece 11a Notch 11b Center part (near the center)
11c Outer peripheral part 2 Grinding device (processing device)
4 Base 4a Opening 6 Transport mechanism 8a, 8b Cassette 10 Alignment mechanism 12 Temporary placement table 12a Support base 12b Table body 12c Adsorption member 12d Flow path 14 Carry-in mechanism (transport means)
14a Support arm 14b Suction pad 14c Suction member 14d Channel 16 Turntable 18 Chuck table 18a Support base 18b Table body 18c Holding surface 18d Channel 20 Support structure 22 Z-axis moving mechanism 24 Z-axis moving table 26 Z-axis guide rail 28 Z Axis ball screw 30 Z-axis pulse motor 32 Grinding mechanism (processing means)
34 Spindle housing 36 Grinding wheel 38 Unloading mechanism 40 Cleaning mechanism
Claims (1)
外周部が中心付近に比べて上方に反った状態の被加工物を該仮置きテーブルに載置する載置工程と、
該搬送手段の該吸着パッドを被加工物に向けて下降させて、被加工物における外周部の全周を該吸着パッドに密着させるが被加工物の中心付近を該吸着パッドに密着させない吸着パッド下降工程と、
該吸着パッド下降工程を実施した後に、該吸着パッドで被加工物を吸引して大気圧による力で被加工物を該吸着パッドの吸着面に押し付け、該吸着面に沿って被加工物を平坦に矯正する吸着工程と、
該吸着パッドに吸引された状態の被加工物を該搬送手段で搬送して該チャックテーブルに載置し、被加工物が該チャックテーブルの保持面に密着した状態で、該チャックテーブルで被加工物を吸引するとともに該搬送手段の吸着パッドによる被加工物の吸引を停止する被加工物移し換え工程と、を備えたことを特徴とする搬送方法。 Temporary placing table for temporarily placing a plate-like workpiece, a chuck table having a holding surface for sucking and holding the workpiece, and processing means for performing predetermined processing on the workpiece held on the chuck table And a conveying means for conveying a workpiece from the temporary placement table to the chuck table, the conveying means comprising a suction pad having a larger diameter than the workpiece and having a flat suction surface In the processing apparatus, the workpiece is transferred from the temporary table to the chuck table and held on the chuck table with the outer peripheral portion being warped upward compared to the vicinity of the center.
A placing step of placing the work piece in a state in which the outer peripheral portion is warped upward compared to the vicinity of the center on the temporary placement table;
The suction pad of the conveying means is lowered toward the workpiece, and the entire circumference of the outer peripheral portion of the workpiece is brought into close contact with the suction pad, but the vicinity of the center of the workpiece is not brought into close contact with the suction pad A descent process;
After performing the adsorption pad lowering step, by sucking a workpiece in the adsorption pad pressed against a workpiece by the force due to atmospheric pressure to the suction surface of the suction pad, flat workpiece along the adsorption surface An adsorption process to correct
The workpiece sucked by the suction pad is transferred by the transfer means and placed on the chuck table, and the workpiece is processed by the chuck table in a state where the workpiece is in close contact with the holding surface of the chuck table. And a workpiece transfer step of sucking the workpiece and stopping the suction of the workpiece by the suction pad of the conveying means.
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